Nothing Special   »   [go: up one dir, main page]

JPS5283166A - Semiconductor device and its production - Google Patents

Semiconductor device and its production

Info

Publication number
JPS5283166A
JPS5283166A JP15960975A JP15960975A JPS5283166A JP S5283166 A JPS5283166 A JP S5283166A JP 15960975 A JP15960975 A JP 15960975A JP 15960975 A JP15960975 A JP 15960975A JP S5283166 A JPS5283166 A JP S5283166A
Authority
JP
Japan
Prior art keywords
semiconductor device
production
layer
semiconductor chip
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15960975A
Other languages
English (en)
Inventor
Yoshiharu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP15960975A priority Critical patent/JPS5283166A/ja
Publication of JPS5283166A publication Critical patent/JPS5283166A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Wire Bonding (AREA)
JP15960975A 1975-12-30 1975-12-30 Semiconductor device and its production Pending JPS5283166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15960975A JPS5283166A (en) 1975-12-30 1975-12-30 Semiconductor device and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15960975A JPS5283166A (en) 1975-12-30 1975-12-30 Semiconductor device and its production

Publications (1)

Publication Number Publication Date
JPS5283166A true JPS5283166A (en) 1977-07-11

Family

ID=15697440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15960975A Pending JPS5283166A (en) 1975-12-30 1975-12-30 Semiconductor device and its production

Country Status (1)

Country Link
JP (1) JPS5283166A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016133982A (ja) * 2015-01-19 2016-07-25 富士通フロンテック株式会社 Ｉｃチップの接合方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016133982A (ja) * 2015-01-19 2016-07-25 富士通フロンテック株式会社 Ｉｃチップの接合方法

Similar Documents

Publication Publication Date Title
JPS528785A (en) Semiconductor device electrode structure
JPS5239378A (en) Silicon-gated mos type semiconductor device
JPS5230184A (en) Semiconductor device
JPS5271177A (en) Semiconductor device
JPS5287983A (en) Production of semiconductor device
JPS5212575A (en) Production method of semi-conductor device
JPS5283166A (en) Semiconductor device and its production
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5412263A (en) Semiconductor element and production of the same
JPS5250167A (en) Semiconductor device
JPS5378768A (en) Wire bonding method of semiconductor element
JPS5356968A (en) High frequency semiconductor device
JPS5356969A (en) Production of tape for tape carrier
JPS527676A (en) Semiconductor integrated circuit
JPS5362471A (en) Semiconductor device
JPS52153383A (en) Preparation of semiconductor device
JPS5333057A (en) Bump type semiconductor device
JPS5368163A (en) Production of flip chip
JPS535571A (en) Circuit block and its manufacture
JPS5275979A (en) Semiconductor device
JPS5211772A (en) Semiconductor device
JPS5344172A (en) Semiconductor integrated circuit
JPS5397367A (en) Semiconductor device and its manufacture
JPS5356970A (en) Tape for tape carrier
JPS5375763A (en) Manufacture for semiconductor device