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JPS5283166A - Semiconductor device and its production - Google Patents

Semiconductor device and its production

Info

Publication number
JPS5283166A
JPS5283166A JP15960975A JP15960975A JPS5283166A JP S5283166 A JPS5283166 A JP S5283166A JP 15960975 A JP15960975 A JP 15960975A JP 15960975 A JP15960975 A JP 15960975A JP S5283166 A JPS5283166 A JP S5283166A
Authority
JP
Japan
Prior art keywords
semiconductor device
production
layer
semiconductor chip
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15960975A
Other languages
Japanese (ja)
Inventor
Yoshiharu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP15960975A priority Critical patent/JPS5283166A/en
Publication of JPS5283166A publication Critical patent/JPS5283166A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To improve the reliability of the semiconductor device to be face-down bonded by fixing metallic contact regions of a semiconductor chip composed of one layer of Al layer to the fixing parts of the semiconductor chip by means of conductive paste.
COPYRIGHT: (C)1977,JPO&Japio
JP15960975A 1975-12-30 1975-12-30 Semiconductor device and its production Pending JPS5283166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15960975A JPS5283166A (en) 1975-12-30 1975-12-30 Semiconductor device and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15960975A JPS5283166A (en) 1975-12-30 1975-12-30 Semiconductor device and its production

Publications (1)

Publication Number Publication Date
JPS5283166A true JPS5283166A (en) 1977-07-11

Family

ID=15697440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15960975A Pending JPS5283166A (en) 1975-12-30 1975-12-30 Semiconductor device and its production

Country Status (1)

Country Link
JP (1) JPS5283166A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016133982A (en) * 2015-01-19 2016-07-25 富士通フロンテック株式会社 Ic chip jointing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016133982A (en) * 2015-01-19 2016-07-25 富士通フロンテック株式会社 Ic chip jointing method

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