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JPS5356970A - Tape for tape carrier - Google Patents

Tape for tape carrier

Info

Publication number
JPS5356970A
JPS5356970A JP13201776A JP13201776A JPS5356970A JP S5356970 A JPS5356970 A JP S5356970A JP 13201776 A JP13201776 A JP 13201776A JP 13201776 A JP13201776 A JP 13201776A JP S5356970 A JPS5356970 A JP S5356970A
Authority
JP
Japan
Prior art keywords
tape
carrier
wiring
electrodes
conduct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13201776A
Other languages
Japanese (ja)
Inventor
Toshio Kano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP13201776A priority Critical patent/JPS5356970A/en
Publication of JPS5356970A publication Critical patent/JPS5356970A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To perform cross-under wiring and element bonding and connecting the tape to the outside by making bump electrodes which conduct to the wiring electrodes on one main surface of an insulation tape and protrude to the other surface by penetrating through the tape.
COPYRIGHT: (C)1978,JPO&Japio
JP13201776A 1976-11-02 1976-11-02 Tape for tape carrier Pending JPS5356970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13201776A JPS5356970A (en) 1976-11-02 1976-11-02 Tape for tape carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13201776A JPS5356970A (en) 1976-11-02 1976-11-02 Tape for tape carrier

Publications (1)

Publication Number Publication Date
JPS5356970A true JPS5356970A (en) 1978-05-23

Family

ID=15071572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13201776A Pending JPS5356970A (en) 1976-11-02 1976-11-02 Tape for tape carrier

Country Status (1)

Country Link
JP (1) JPS5356970A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141933A (en) * 1981-02-25 1982-09-02 Nec Corp Semiconductor device
JPH0479341A (en) * 1990-07-23 1992-03-12 Nippon Telegr & Teleph Corp <Ntt> Flexible wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141933A (en) * 1981-02-25 1982-09-02 Nec Corp Semiconductor device
JPH0479341A (en) * 1990-07-23 1992-03-12 Nippon Telegr & Teleph Corp <Ntt> Flexible wiring board

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