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JPS5230184A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5230184A
JPS5230184A JP50106688A JP10668875A JPS5230184A JP S5230184 A JPS5230184 A JP S5230184A JP 50106688 A JP50106688 A JP 50106688A JP 10668875 A JP10668875 A JP 10668875A JP S5230184 A JPS5230184 A JP S5230184A
Authority
JP
Japan
Prior art keywords
semiconductor device
bumps
chip
extentions
unsealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50106688A
Other languages
Japanese (ja)
Inventor
Masao Hayakawa
Masao Kumura
Takamichi Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP50106688A priority Critical patent/JPS5230184A/en
Publication of JPS5230184A publication Critical patent/JPS5230184A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To provide a semiconductor device wherein the semiconductor chip has the bumps connected to the extentions of the conductor patterns which are formed on flexible films and are sealed with resins, leaving the chip side without bumps unsealed in order to use the side for contacts.
COPYRIGHT: (C)1977,JPO&Japio
JP50106688A 1975-09-02 1975-09-02 Semiconductor device Pending JPS5230184A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50106688A JPS5230184A (en) 1975-09-02 1975-09-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50106688A JPS5230184A (en) 1975-09-02 1975-09-02 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5230184A true JPS5230184A (en) 1977-03-07

Family

ID=14439978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50106688A Pending JPS5230184A (en) 1975-09-02 1975-09-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5230184A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55130152A (en) * 1979-03-30 1980-10-08 Hitachi Ltd Resin sealed semiconductor device
JPS63125563A (en) * 1986-11-14 1988-05-28 Hitachi Ltd Liquid resin composition and resin-sealed semiconductor device
US4907061A (en) * 1986-10-08 1990-03-06 Mitsubishi Denki Kabushiki Kaisha Electronic device
US4931853A (en) * 1986-05-20 1990-06-05 Kabushiki Kaisha Toshiba IC card and method of manufacturing the same
US5519251A (en) * 1992-10-20 1996-05-21 Fujitsu Limited Semiconductor device and method of producing the same
US5621242A (en) * 1994-05-16 1997-04-15 Samsung Electronics Co., Ltd. Semiconductor package having support film formed on inner leads
US6084309A (en) * 1992-10-20 2000-07-04 Fujitsu Limited Semiconductor device and semiconductor device mounting structure
US6165819A (en) * 1992-10-20 2000-12-26 Fujitsu Limited Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933569A (en) * 1972-07-26 1974-03-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933569A (en) * 1972-07-26 1974-03-28

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55130152A (en) * 1979-03-30 1980-10-08 Hitachi Ltd Resin sealed semiconductor device
US4931853A (en) * 1986-05-20 1990-06-05 Kabushiki Kaisha Toshiba IC card and method of manufacturing the same
US4997791A (en) * 1986-05-20 1991-03-05 Kabushiki Kaisha Toshiba IC card and method of manufacturing the same
US4907061A (en) * 1986-10-08 1990-03-06 Mitsubishi Denki Kabushiki Kaisha Electronic device
JPS63125563A (en) * 1986-11-14 1988-05-28 Hitachi Ltd Liquid resin composition and resin-sealed semiconductor device
US5519251A (en) * 1992-10-20 1996-05-21 Fujitsu Limited Semiconductor device and method of producing the same
US5773313A (en) * 1992-10-20 1998-06-30 Fujitsu Limited Semiconductor device and method of producing the same
US6084309A (en) * 1992-10-20 2000-07-04 Fujitsu Limited Semiconductor device and semiconductor device mounting structure
US6165819A (en) * 1992-10-20 2000-12-26 Fujitsu Limited Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
US6462424B1 (en) 1992-10-20 2002-10-08 Fujitsu Limited Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
US5621242A (en) * 1994-05-16 1997-04-15 Samsung Electronics Co., Ltd. Semiconductor package having support film formed on inner leads

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