JPH0238161U - - Google Patents
Info
- Publication number
- JPH0238161U JPH0238161U JP11216188U JP11216188U JPH0238161U JP H0238161 U JPH0238161 U JP H0238161U JP 11216188 U JP11216188 U JP 11216188U JP 11216188 U JP11216188 U JP 11216188U JP H0238161 U JPH0238161 U JP H0238161U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- mask
- solder
- approximately
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例にかかる半田マスク
の一部を拡大して示す平面図、第２図は本考案に
かかる半田マスクを用いて半田印刷が行なわれる
プリント配線板の一部を拡大して示す平面図、第
３図Ａ，Ｂ，Ｃ，Ｄは面実装の様子を段階的に示
すプリント配線板の平面図である。
１０……半田マスク、１２，１４……マスク孔
、２０……プリント配線板、２２，２４……電極
ランド。
FIG. 1 is an enlarged plan view of a portion of a solder mask according to an embodiment of the present invention, and FIG. 2 is a plan view showing a portion of a printed wiring board on which solder printing is performed using the solder mask according to the present invention. The enlarged plan view and FIGS. 3A, B, C, and D are plan views of the printed wiring board showing the state of surface mounting step by step. 10... Solder mask, 12, 14... Mask hole, 20... Printed wiring board, 22, 24... Electrode land.
Claims (1)
の所定箇所にマスク孔を通して半田印刷を行う半
田マスクにおいて、前記プリント配線板上に対峙
して形成された略々矩形状の電極ランドに対応す
るマスク孔形状を、この対峙する側に夫々開放部
を有する略々コ字形状としたことを特徴とする半
田マスク。 In a solder mask that is superimposed on a printed wiring board and performs solder printing through mask holes at predetermined locations on the printed wiring board, mask holes corresponding to approximately rectangular electrode lands formed facing each other on the printed wiring board are provided. A solder mask characterized in that the shape is approximately U-shaped with open portions on opposing sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11216188U JPH0238161U (en) | 1988-08-29 | 1988-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11216188U JPH0238161U (en) | 1988-08-29 | 1988-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238161U true JPH0238161U (en) | 1990-03-14 |
Family
ID=31350848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11216188U Pending JPH0238161U (en) | 1988-08-29 | 1988-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238161U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001293972A (en) * | 2000-04-17 | 2001-10-23 | Matsushita Electric Ind Co Ltd | Screen mask and screen process printing method |
| JP2005238594A (en) * | 2004-02-25 | 2005-09-08 | Murata Mfg Co Ltd | Printing pattern forming material and manufacturing method of electronic part employing the same |
| JP2007081086A (en) * | 2005-09-14 | 2007-03-29 | Seiko Instruments Inc | Metal mask and packaging method of electronic parts |
| JP2010056368A (en) * | 2008-08-29 | 2010-03-11 | Fuji Mach Mfg Co Ltd | Transfer device and transfer method |
| US8105644B2 (en) | 2007-03-08 | 2012-01-31 | Nitto Denko Corporation | Manufacturing method of printed circuit board |
| JP2014138040A (en) * | 2013-01-15 | 2014-07-28 | Shindengen Electric Mfg Co Ltd | Solder paste coating structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60260192A (en) * | 1984-06-06 | 1985-12-23 | 富士電機株式会社 | Method of producing hybrid integrated circuit |
-
1988
- 1988-08-29 JP JP11216188U patent/JPH0238161U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60260192A (en) * | 1984-06-06 | 1985-12-23 | 富士電機株式会社 | Method of producing hybrid integrated circuit |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001293972A (en) * | 2000-04-17 | 2001-10-23 | Matsushita Electric Ind Co Ltd | Screen mask and screen process printing method |
| JP4560880B2 (en) * | 2000-04-17 | 2010-10-13 | パナソニック株式会社 | Screen mask and screen printing method |
| JP2005238594A (en) * | 2004-02-25 | 2005-09-08 | Murata Mfg Co Ltd | Printing pattern forming material and manufacturing method of electronic part employing the same |
| JP4525107B2 (en) * | 2004-02-25 | 2010-08-18 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
| JP2007081086A (en) * | 2005-09-14 | 2007-03-29 | Seiko Instruments Inc | Metal mask and packaging method of electronic parts |
| US8105644B2 (en) | 2007-03-08 | 2012-01-31 | Nitto Denko Corporation | Manufacturing method of printed circuit board |
| JP2010056368A (en) * | 2008-08-29 | 2010-03-11 | Fuji Mach Mfg Co Ltd | Transfer device and transfer method |
| JP2014138040A (en) * | 2013-01-15 | 2014-07-28 | Shindengen Electric Mfg Co Ltd | Solder paste coating structure |