JPH03102755U - - Google Patents
Info
- Publication number
- JPH03102755U JPH03102755U JP1024590U JP1024590U JPH03102755U JP H03102755 U JPH03102755 U JP H03102755U JP 1024590 U JP1024590 U JP 1024590U JP 1024590 U JP1024590 U JP 1024590U JP H03102755 U JPH03102755 U JP H03102755U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- connection structure
- hole
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 239000006071 cream Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案における一実施例斜視図、第２
図は本考案における接続部説明図で、第２図イは
配線パターン平面図、第２図ロは断面図、第３図
は本考案における他の接続部説明図で、第３図イ
は配線パターン平面図、第３図ロは断面図、第４
図は本考案における大型印刷配線板と小型印刷配
線板との接続構造説明図、第５図は従来例におけ
る印刷配線板の接続構造説明図、第６図は従来例
における他の印刷配線板の接続構造説明図である
。
１……リジツド印刷配線板、２……フレキシブ
ル印刷配線板、３……リジツド印刷配線板の配線
パターン、３−１……電極部、４……フレキシブ
ル印刷配線板の配線パターン、４−１……電極部
、５……貫通孔、６……クリーム半田、７……欠
落部、１１……大型印刷配線板、１２……小型印
刷配線板、１３……フレキシブル印刷配線板、１
４……大型印刷配線板の配線パターン、１５……
小型印刷配線板の配線パターン。
Fig. 1 is a perspective view of one embodiment of the present invention;
The figure is an explanatory diagram of the connection part in the present invention, Figure 2A is a plan view of the wiring pattern, Figure 2B is a sectional view, Figure 3 is an explanatory diagram of another connection part in the invention, and Figure 3B is the wiring pattern. Pattern plan view, Figure 3 B is a sectional view, Figure 4
The figure is an explanatory diagram of a connection structure between a large printed wiring board and a small printed wiring board in the present invention, FIG. 5 is an explanatory diagram of a connection structure of a printed wiring board in a conventional example, and FIG. It is a connection structure explanatory diagram. DESCRIPTION OF SYMBOLS 1... Rigid printed wiring board, 2... Flexible printed wiring board, 3... Wiring pattern of rigid printed wiring board, 3-1... Electrode part, 4... Wiring pattern of flexible printed wiring board, 4-1... ... Electrode part, 5 ... Through hole, 6 ... Cream solder, 7 ... Missing part, 11 ... Large printed wiring board, 12 ... Small printed wiring board, 13 ... Flexible printed wiring board, 1
4... Wiring pattern of large printed wiring board, 15...
Wiring pattern for small printed wiring board.
Claims (1)
接続構造において、 一方の印刷配線板２上に形成された配線パター
ン４の内の複数個所に半田６が充填し得るように
設けられた貫通孔５と、 他方の印刷配線板１において、前記貫通孔５に
対応する位置に形成された配線パターン３とを備
え、 前記両印刷配線板１，２は、それぞれの配線パ
ターン３，４を前記貫通孔５に充填された半田６
によつて電気的および機械的に接続固定されるこ
とを特徴とする印刷配線板の接続構造。 (2) 前記配線パターン３，４の少なくとも一方
を電極部３−１，４−１で構成することを特徴と
する請求項(1)記載の印刷配線板の接続構造。 (3) 前記貫通孔５を有する電極部３−１，４−
１は、当該貫通孔５の周囲において、一部欠落部
７を有することを特徴とする請求項(2)記載の印
刷配線板の接続構造。[Claims for Utility Model Registration] (1) In a connection structure for connecting two printed wiring boards 1 and 2, solder is applied to multiple locations of the wiring pattern 4 formed on one printed wiring board 2. 6, and a wiring pattern 3 formed at a position corresponding to the through hole 5 in the other printed wiring board 1, The wiring patterns 3 and 4 are connected to the solder 6 filled in the through hole 5.
A connection structure for a printed wiring board, characterized in that it is electrically and mechanically connected and fixed by. (2) The connection structure for a printed wiring board according to claim (1), wherein at least one of the wiring patterns 3 and 4 is composed of electrode portions 3-1 and 4-1. (3) Electrode portions 3-1, 4- having the through holes 5
1 . The printed wiring board connection structure according to claim 2 , wherein the printed wiring board connection structure has a partially missing portion 7 around the through hole 5 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1024590U JPH03102755U (en) | 1990-02-06 | 1990-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1024590U JPH03102755U (en) | 1990-02-06 | 1990-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102755U true JPH03102755U (en) | 1991-10-25 |
Family
ID=31513827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1024590U Pending JPH03102755U (en) | 1990-02-06 | 1990-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102755U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848492A (en) * | 1981-09-16 | 1983-03-22 | 株式会社富士通ゼネラル | Flexible printed circuit board and solder connecting method |
-
1990
- 1990-02-06 JP JP1024590U patent/JPH03102755U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848492A (en) * | 1981-09-16 | 1983-03-22 | 株式会社富士通ゼネラル | Flexible printed circuit board and solder connecting method |