JP5785018B2 - 製膜性が改善されたポリイミド樹脂及び光学フィルム - Google Patents
製膜性が改善されたポリイミド樹脂及び光学フィルム Download PDFInfo
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- JP5785018B2 JP5785018B2 JP2011164825A JP2011164825A JP5785018B2 JP 5785018 B2 JP5785018 B2 JP 5785018B2 JP 2011164825 A JP2011164825 A JP 2011164825A JP 2011164825 A JP2011164825 A JP 2011164825A JP 5785018 B2 JP5785018 B2 JP 5785018B2
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- optical film
- polyimide resin
- dianhydride
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- 230000015572 biosynthetic process Effects 0.000 description 19
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- 239000000047 product Substances 0.000 description 16
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- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 15
- -1 and in particular Polymers 0.000 description 15
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- 238000006116 polymerization reaction Methods 0.000 description 9
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- 239000004305 biphenyl Substances 0.000 description 5
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- 238000002834 transmittance Methods 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
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- 238000004458 analytical method Methods 0.000 description 2
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- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
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- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
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- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- HFBHOAHFRNLZGN-LURJTMIESA-N (2s)-2-formamido-4-methylpentanoic acid Chemical compound CC(C)C[C@@H](C(O)=O)NC=O HFBHOAHFRNLZGN-LURJTMIESA-N 0.000 description 1
- STIUJDCDGZSXGO-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=C1 STIUJDCDGZSXGO-UHFFFAOYSA-N 0.000 description 1
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 1
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- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
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- UVXIFYUJZWURAR-UHFFFAOYSA-N [3-(4-aminobenzoyl)phenyl]-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(C(=O)C=2C=CC(N)=CC=2)=C1 UVXIFYUJZWURAR-UHFFFAOYSA-N 0.000 description 1
- OTKFKCIRTBTDKK-UHFFFAOYSA-N [3-(aminomethyl)-5-bicyclo[2.2.1]heptanyl]methanamine Chemical compound C1C(CN)C2C(CN)CC1C2 OTKFKCIRTBTDKK-UHFFFAOYSA-N 0.000 description 1
- WYYLAHMAYZBJOI-UHFFFAOYSA-N [3-[4-(3-aminophenoxy)benzoyl]phenyl]-[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=C(C=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WYYLAHMAYZBJOI-UHFFFAOYSA-N 0.000 description 1
- QWCHFDRTENBRST-UHFFFAOYSA-N [3-[4-(4-aminophenoxy)benzoyl]phenyl]-[4-(4-aminophenoxy)phenyl]methanone Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(=O)C=2C=C(C=CC=2)C(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 QWCHFDRTENBRST-UHFFFAOYSA-N 0.000 description 1
- KJGPUSGHNHJCNO-UHFFFAOYSA-N [4-(3-aminobenzoyl)phenyl]-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=CC(=CC=2)C(=O)C=2C=C(N)C=CC=2)=C1 KJGPUSGHNHJCNO-UHFFFAOYSA-N 0.000 description 1
- JAGJCSPSIXPCAK-UHFFFAOYSA-N [4-[4-(3-aminophenoxy)benzoyl]phenyl]-[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 JAGJCSPSIXPCAK-UHFFFAOYSA-N 0.000 description 1
- HKWWRLBGQRLBRM-UHFFFAOYSA-N [4-[4-(4-aminophenoxy)benzoyl]phenyl]-[4-(4-aminophenoxy)phenyl]methanone Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(=O)C=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HKWWRLBGQRLBRM-UHFFFAOYSA-N 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- MRSWDOKCESOYBI-UHFFFAOYSA-N anthracene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C=C(C(C(=O)O)=C3)C(O)=O)C3=CC2=C1 MRSWDOKCESOYBI-UHFFFAOYSA-N 0.000 description 1
- GCAIEATUVJFSMC-UHFFFAOYSA-N benzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1C(O)=O GCAIEATUVJFSMC-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- SONDVQSYBUQGDH-UHFFFAOYSA-N bis(3-amino-4-phenoxyphenyl)methanone Chemical compound NC1=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=CC=C1OC1=CC=CC=C1 SONDVQSYBUQGDH-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- BBRLKRNNIMVXOD-UHFFFAOYSA-N bis[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 BBRLKRNNIMVXOD-UHFFFAOYSA-N 0.000 description 1
- LSDYQEILXDCDTR-UHFFFAOYSA-N bis[4-(4-aminophenoxy)phenyl]methanone Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 LSDYQEILXDCDTR-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- STZIXLPVKZUAMV-UHFFFAOYSA-N cyclopentane-1,1,2,2-tetracarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCC1(C(O)=O)C(O)=O STZIXLPVKZUAMV-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000006114 decarboxylation reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- IWBOPFCKHIJFMS-UHFFFAOYSA-N ethylene glycol bis(2-aminoethyl) ether Chemical compound NCCOCCOCCN IWBOPFCKHIJFMS-UHFFFAOYSA-N 0.000 description 1
- GBASTSRAHRGUAB-UHFFFAOYSA-N ethylenetetracarboxylic dianhydride Chemical compound O=C1OC(=O)C2=C1C(=O)OC2=O GBASTSRAHRGUAB-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- NJMOHBDCGXJLNJ-UHFFFAOYSA-N trimellitic anhydride chloride Chemical compound ClC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 NJMOHBDCGXJLNJ-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
- Optical Filters (AREA)
- Electroluminescent Light Sources (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
1.下記式(1)及び下記式(2)で表される繰り返し単位を含むポリイミド樹脂であり、下記式(1)で表されるポリイミドの繰返し単位がポリマー全体の50モル%以上95モル%以下、かつ、下記式(2)で表されるポリイミドの繰返し単位がポリマー全体の5モル%以上50モル%未満であることを特徴とするポリイミド樹脂。
3.2記載の光学フィルムからなることを特徴とする透明基板。
4.2記載の光学フィルムを含むことを特徴とする画像表示装置。
5.2記載の光学フィルムを含むことを特徴とする太陽電池。
本明細書中に記載の材料特性値等は以下の評価法によって得られたものである。
(1)ポリイミド樹脂の分子量
表1の条件にて重量平均分子量(Mw)を求めた。
樹脂0.7gに対し、ジメチルアセトアミド(以下、DMAc)9.3g(固形分濃度5%)をサンプル管に入れ、溶解の有無を確認した。室温にて完全に溶解したものを○、完全溶解に加温(80℃)が必要なものを△、加温(80℃)しても溶け残りがあるもの、又は不溶なものを×とした。
ポリイミド樹脂をDMAcに固形分として7wt%となるよう溶解し、0.7mm厚のガラス板上に最終膜厚として20μmとなるよう50mm×50mmのエリアに塗布した。室温にて溶解しないものについては80℃に加温して溶解し、加温状態のままガラス板上に塗布した。その後、23℃55%RHにて放置し、フィルム表面の白化現象を観察した。3分以上白化が認められない場合を○、1分以上3分未満で白化が認められる場合を△、1分未満で白化が認められる場合を×とした。
100〜200℃の線膨張係数の測定は、セイコー電子(株)社製TMA120Cを用いて(サンプルサイズ 幅3mm、長さ10mm)、荷重3gで10℃/minで10〜260℃まで一旦昇温させた後、10℃まで冷却し、さらに10℃/minで昇温させて2回目の昇温時の100℃および200℃における熱膨張率から平均値として計算した。
窒素雰囲気下、セイコー電子(株)社製TMA120Cを用いて(フィルムサンプルサイズ 幅3mm、長さ10mm)、荷重5gでの引張荷重法により、昇温速度10℃/分でフィルムサンプルを昇温し、得られた熱膨張曲線の変曲点をガラス転移温度とした。
日本電色工業製積分球式ヘイズメーター300Aにより、JIS K7105−1981記載の方法により測定した。
セイコー電子工業製示差走査熱量計DSC220CによりJIS K−7121に記載の方法にて測定した。
<アミド基含有テトラカルボン酸二無水物(TATFMB)の合成(下記式(3))>
<ポリイミド樹脂の合成>
50mlのスクリュー管にDMFを13.2gならびにジアミン成分としてTFMBを0.714g入れ、窒素雰囲気下、スターラーにて撹拌して溶解させた。その後、上記合成参考例で合成したTATFMBを1.12gならびにPMDAを0.097g加えて溶解させた。重合触媒として酢酸を1.467g添加し、室温にて5時間重合を行った。重合終了後、DMFを2.44g追加し、イミド化触媒としてピリジン0.352gと無水酢酸0.545gを追加して、100℃12時間撹拌した。その後、室温まで冷却した後、IPA40gへ重合溶液を滴下し、目的とする生成物を沈澱させた。その後、桐山ロートにより、吸引ろ過し、40gのIPAにて洗浄した。この洗浄を2回繰り返し、桐山ロートにより、吸引ろ過し100℃に設定した真空オーブンで一晩乾燥させることで、目的生成物を得た。
得られたポリイミド樹脂をDMAcに溶解し、ポリイミド樹脂が7重量%含有されているポリイミド樹脂溶液を作製し、ガラス板上に均一な膜厚を持ったポリイミド樹脂溶液膜として塗布した。その後60℃で10分間乾燥させ、さらに150℃で60分間乾燥させた。その後ガラス板からフィルムを剥がし、厚さ20μmの光学フィルムを得た。得られた光学フィルムの評価結果は表2に記載した。
<ポリイミド樹脂の合成>
実施例1において、TFMBを0.750g、TATFMBを1.096g、PMDAを0.153gとした以外は全て同様の操作を行い、目的生成物を得た。(PMDA:30モル%)
<光学フィルムの作製>
実施例1と同様の操作を行い、光学フィルムを作製した。また、得られた光学フィルムの評価結果を表2に記載した。
<ポリイミド樹脂の合成>
実施例1において、TFMBを0.792g、TATFMBを0.992g、PMDAを0.216gとした以外は全て同様の操作を行い、目的生成物を得た。(PMDA:40モル%)
<光学フィルムの作製>
実施例1と同様の操作を行い、光学フィルムを作製した。また、得られた光学フィルムの評価結果を表2に記載した。
<ポリイミド樹脂の合成>
実施例1において、TFMBを0.679g、TATFMBを1.275g、PMDAを0.046gとした以外は全て同様の操作を行い、目的生成物を得た。(PMDA:10モル%)
<光学フィルムの作製>
実施例1と同様の操作を行い、光学フィルムを作製した。また、得られた光学フィルムの評価結果を表2に記載した。
<ポリイミド樹脂の合成>
50mlのスクリュー管にDMFを13.2gならびにジアミン成分としてTFMBを0.648g入れ、窒素雰囲気下、スターラーにて撹拌して溶解させた。その後、上記合成参考例で合成したTATFMBを1.352g加えて溶解させた。重合触媒として酢酸を1.467g添加し、室温にて5時間重合を行った。重合終了後、DMFを2.44g追加し、イミド化触媒としてピリジン0.352gと無水酢酸0.545gを追加して、100℃12時間撹拌した。その後、室温まで冷却した後、イソプロピルアルコール(以下、IPAと略)40gへ重合溶液を滴下し、目的とする生成物を沈澱させた。その後、桐山ロートにより、吸引ろ過し、40gのIPAにて洗浄した。この洗浄を2回繰り返し、桐山ロートにより、吸引ろ過し100℃に設定した真空オーブンで一晩乾燥させることで、目的生成物を得た。
実施例1と同様の操作を行い、光学フィルムを作製した。また、得られた光学フィルムの評価結果を表2に記載した。
実施例1において、TFMBを0.839g、TATFMBを0.875g、PMDAを0.286gとした以外は全て同様の操作を行ったところ、イミド化触媒としてピリジン0.352gと無水酢酸0.545gを追加して、100℃にて撹拌中にゲル化した。評価結果を表2に記載した。
50mlのスクリュー管にDMFを13.2gならびにジアミン成分としてTFMBを0.701g加えて、窒素雰囲気下、スターラーにて撹拌して溶解させた。その後、上記合成参考例で合成したアミド基含有テトラカルボン酸二無水物(式(3))を1.17gならび3,3',4,4'−ビフェニルテトラカルボン酸二無水物(BPDA)に加えて溶解させた。重合触媒として酢酸を1.467g添加し、室温にて5時間重合を行った。重合終了後、DMFを2.44g追加し、イミド化触媒としてピリジン0.352gと無水酢酸0.545gを追加して、100℃12時間撹拌した。その後、室温まで冷却した後、IPA40gへ重合溶液を滴下し、目的とする生成物を沈澱させた。その後、桐山ロートにより、吸引ろ過し、40gのIPAにて洗浄した。この洗浄を2回繰り返し、桐山ロートにより、吸引ろ過し100℃に設定した真空オーブンで一晩乾燥させることで、目的生成物を得た。
実施例1と同様の操作を行い、光学フィルムを作製した。また、得られた光学フィルムの評価結果を表2に記載した。
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KR101951305B1 (ko) * | 2012-05-09 | 2019-02-25 | 삼성전자주식회사 | 신규 광학필름용 물질, 고분자, 상기 고분자를 사용하여 제조한 성형품 및 상기 성형품을 포함하는 디스플레이 장치 |
JP6308543B2 (ja) * | 2013-05-27 | 2018-04-11 | 新日鉄住金化学株式会社 | 有機el表示装置の製造方法 |
TWI658098B (zh) * | 2013-07-26 | 2019-05-01 | 日商日產化學工業股份有限公司 | 顯示基板用樹脂組成物、顯示基板用樹脂薄膜及顯示基板用樹脂薄膜的製造方法 |
WO2015125895A1 (ja) | 2014-02-21 | 2015-08-27 | 三菱化学株式会社 | ポリイミド前駆体及び/又はポリイミドを含む組成物、並びにポリイミドフィルム |
JP2015170502A (ja) * | 2014-03-07 | 2015-09-28 | 新日鉄住金化学株式会社 | 表示装置の製造方法 |
US9368750B1 (en) * | 2014-12-04 | 2016-06-14 | Panasonic Intellectual Property Management Co., Ltd. | Method for fabricating intermediate member of electronic element and method for fabricating electronic element |
KR102268338B1 (ko) * | 2015-03-23 | 2021-06-23 | 에스케이이노베이션 주식회사 | 폴리이미드 전구체, 이로부터 제조된 폴리이미드 및 이를 포함하는 폴리이미드 필름 |
JP7242166B2 (ja) * | 2016-09-30 | 2023-03-20 | 住友化学株式会社 | 光学フィルム及び光学フィルムの製造方法 |
JP6487125B1 (ja) * | 2017-06-27 | 2019-03-20 | 堺ディスプレイプロダクト株式会社 | フレキシブルディスプレイおよびその製造方法、ならびにフレキシブルディスプレイ用支持基板 |
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