JP2016053732A - Exposure device, producing method for flat panel display and device producing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate stage with which exchange of substrate may be quickly carried out.SOLUTION: Since a substrate stage 20 comprises a substrate transporting device 70, transport of a substrate P may be quickly carried out. In addition, the substrate stage 20 comprises Y roughly moving stage 23y and X roughly moving stage 23x loaded on the Y roughly moving stage 23y. The substrate transporting device 70 is attached onto the Y roughly moving stage 23y. Therefore, although the substrate stage comprises the substrate transporting device 70, controlling of the X roughly moving stage 23x moving upon scanning exposure is not interrupted.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an exposure apparatus, a flat panel display manufacturing method, and a device manufacturing method. More specifically, the present invention relates to a scanning exposure apparatus that moves an object in a scanning direction with respect to an energy beam during exposure, and the exposure apparatus. The present invention relates to a method for manufacturing a flat panel display used, and a device manufacturing method using the exposure apparatus.

  Conventionally, in a lithography process for manufacturing an electronic device (microdevice) such as a liquid crystal display element, a semiconductor element (such as an integrated circuit), a mask or reticle (hereinafter collectively referred to as “mask”), a glass plate or a wafer (hereinafter referred to as “mask”). Step-and-scan exposure in which the pattern formed on the mask is transferred onto the substrate using an energy beam while the substrate is collectively moved along a predetermined scanning direction (scanning direction). An apparatus (a so-called scanning stepper (also called a scanner)) or the like is used.

  As this type of exposure apparatus, there is known an apparatus that carries a substrate to be exposed to and from a substrate stage using a substrate transport device (for example, see Patent Document 1).

  Here, in the exposure apparatus, when the exposure process on the substrate held on the substrate stage is completed, the substrate is unloaded from the substrate stage, and another substrate is transferred onto the substrate stage, thereby a plurality of substrates. Are continuously exposed. Therefore, it is preferable to quickly carry out the substrate from the substrate stage when performing the exposure process on a plurality of substrates continuously.

US Pat. No. 6,559,928

  The present invention has been made under the circumstances described above. From a first viewpoint, the present invention is a scanning exposure apparatus that moves an object in the scanning direction with respect to an energy beam during exposure, and is a predetermined two-dimensional plane. A first moving body movable in a first direction perpendicular to the scanning direction, and movable on the first moving body in a second direction parallel to the scanning direction and together with the first moving body, the first moving body. A second movable body that is movable in a direction, and is provided so as to be able to hold the object, disposed above the second movable body, and integrally with the object by the movement of the second movable body, the predetermined two-dimensional An exposure apparatus comprising: an object holding device that is guided in a direction parallel to a plane; and a carry-out device that is provided on the first moving body and drives the object in a predetermined carry-out direction with respect to the object holding device. .

  According to this, since the unloading device for unloading the object is provided in the first moving body that moves in the direction orthogonal to the scanning direction, the inertial mass of the second moving body that moves in the scanning direction does not increase. The position of the object can be controlled with high accuracy during scanning exposure.

  According to a second aspect of the present invention, there is provided a flat panel display comprising: exposing the object using the exposure apparatus according to the first aspect of the present invention; and developing the exposed object. It is a manufacturing method.

  According to a third aspect of the present invention, there is provided a device manufacturing method including: exposing the object using the exposure apparatus according to the first aspect of the present invention; and developing the exposed object. is there.

It is a figure which shows schematically the structure of the liquid-crystal exposure apparatus of 1st Embodiment. It is a top view of the substrate stage apparatus which the liquid crystal exposure apparatus of FIG. 1 has. It is the side view which looked at the substrate stage apparatus of FIG. 2 from the + Y side. FIG. 4 is a cross-sectional view taken along line AA of the substrate stage apparatus of FIG. 3. It is a top view of the port part which a liquid-crystal exposure apparatus has. 6A and 6B are views (No. 1 and No. 2) for explaining the substrate replacement operation. FIGS. 7A and 7B are views (No. 3 and No. 4) for explaining the substrate replacement operation. FIGS. 8A and 8B are views (No. 5 and No. 6) for explaining the substrate replacement operation. FIGS. 9A and 9B are views (No. 7 and No. 8) for explaining the substrate replacement operation. FIGS. 10A and 10B are views (No. 9 and No. 10) for explaining the substrate replacement operation. FIGS. 11A and 11B are views (Nos. 11 and 12) for explaining the substrate replacement operation. It is a top view of the substrate stage which concerns on 2nd Embodiment, Comprising: It is a figure which shows the state before board | substrate holding. It is sectional drawing of the substrate stage of FIG. It is a top view of the substrate stage which concerns on 2nd Embodiment, Comprising: It is a figure which shows the state after board | substrate holding. It is sectional drawing of the substrate stage of FIG. It is a figure which shows the board | substrate stage which concerns on the 1st modification of 1st Embodiment. It is a top view of the substrate holder which the substrate stage device concerning the 2nd modification of a 1st embodiment has. 18A is a cross-sectional view taken along the line BB in FIG. 17, FIG. 18B is a cross-sectional view taken along the line CC in FIG. 18A, and FIG. 18C is a second modified example. It is a figure for demonstrating operation | movement of the board | substrate lift apparatus which concerns. 19A and 19B are views (No. 1 and No. 2) showing the internal structure of the substrate lift apparatus. FIGS. 20A to 20D are views (No. 1 to No. 4) for explaining the loading and unloading operations of the substrate in the substrate stage according to the second modification. FIGS. 21A and 21B are views (No. 1 and No. 2) showing a modification of the substrate lift apparatus according to the second modification. It is a figure which shows the substrate stage apparatus which concerns on the 3rd modification of 1st Embodiment. It is a figure which shows the substrate stage apparatus which concerns on the 4th modification of 1st Embodiment.

<< First Embodiment >>
The first embodiment will be described below with reference to FIGS. 1 to 11B.

  FIG. 1 schematically shows the configuration of the liquid crystal exposure apparatus 10. The liquid crystal exposure apparatus 10 is a projection exposure apparatus that uses a rectangular (rectangular) glass substrate P (hereinafter simply referred to as a substrate P) used for, for example, a liquid crystal display device (flat panel display) as an exposure object.

  In the liquid crystal exposure apparatus 10, a resist (sensitive agent) is applied to the illumination system IOP, the mask stage MST that holds the mask M, the projection optical system PL, the apparatus main body 30, and the surface (the surface facing the + Z side in FIG. 1). A substrate stage device PST for holding the substrate P, a port section 60 (not shown in FIG. 1, refer to FIG. 5) for transferring the substrate to and from an external device (for example, a coater / developer device), a control system thereof, and the like have. Hereinafter, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system PL at the time of exposure is defined as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, X-axis, and Y-axis The description will be made assuming that the orthogonal direction is the Z-axis direction, and the rotation directions around the X-axis, Y-axis, and Z-axis are the θx, θy, and θz directions, respectively. Further, description will be made assuming that the positions in the X-axis, Y-axis, and Z-axis directions are the X position, the Y position, and the Z position, respectively.

  The illumination system IOP is configured similarly to the illumination system disclosed in, for example, US Pat. No. 6,552,775. That is, the illumination system IOP emits light emitted from a light source (not shown) (for example, a mercury lamp) through exposure mirrors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. Irradiation light) is applied to the mask M as IL. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.

  On the mask stage MST, a mask M on which a circuit pattern or the like is formed is held by suction, for example, by vacuum suction. The mask stage MST is mounted on a lens barrel base plate 31 that is a part of the apparatus main body 30 (body), and is predetermined in the scanning direction (X-axis direction) by a mask stage drive system (not shown) including, for example, a linear motor. While being driven by a long stroke, it is slightly driven as appropriate in the Y-axis direction and the θz direction. Position information (including rotation information in the θz direction) of the mask stage MST in the XY plane is measured by a mask interferometer system including a laser interferometer (not shown).

  Projection optical system PL is arranged below mask stage MST and supported by lens barrel surface plate 31. The projection optical system PL is configured similarly to the projection optical system disclosed in, for example, US Pat. No. 6,552,775. In other words, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection areas of the pattern image of the mask M are arranged in a staggered pattern, and is a rectangular single unit whose longitudinal direction is the Y-axis direction. Functions in the same way as a projection optical system having one image field. In the present embodiment, as each of the plurality of projection optical systems, for example, a bilateral telecentric equal magnification system that forms an erect image is used.

  For this reason, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL that has passed through the mask M causes the circuit of the mask M in the illumination area to pass through the projection optical system PL. A projected image (partial upright image) of the pattern is formed in the irradiation region (exposure region) of the illumination light IL conjugate to the illumination region on the substrate P. Then, by synchronous driving of the mask stage MST and the substrate stage apparatus PST, the mask M is moved relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P is moved relative to the exposure area (illumination light IL). By performing relative movement in the scanning direction, scanning exposure of one shot area on the substrate P is performed, and the pattern formed on the mask M is transferred to the shot area. That is, in this embodiment, the pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the pattern is formed on the substrate P by exposure of the sensitive layer (resist layer) on the substrate P by the illumination light IL. Is formed.

  The apparatus main body 30 includes a lens barrel surface plate 31, a pair of side columns 32, and a substrate stage mount 33. The lens barrel surface plate 31 is composed of a plate-like member arranged in parallel with the XY plane, and supports the projection optical system PL, the mask stage MST, and the like. The pair of side columns 32 are spaced apart from each other in the Y-axis direction, and support the vicinity of the + Y side end and the vicinity of the −Y side end of the lens barrel base plate 31 from below. The substrate stage base 33 is made of a member extending in the Y-axis direction, and as shown in FIGS. 2 and 3, for example, two substrate stage stands 33 are provided apart from each other in the X-axis direction. Returning to FIG. 1, the + Y side column 32 is, for example, near the end of the + Y side of the two substrate stage platforms 33, and the −Y side column 32 is, for example, the −Y side of the two substrate stage platforms 33. It is mounted on the vicinity of the end of each. The vicinity of the longitudinal end of the substrate stage frame 33 is supported from below by a vibration isolator 34 installed on the floor 11 of the clean room. As a result, the apparatus main body 30 (and projection optical system PL, mask stage MST, etc.) is vibrationally separated from the floor 11.

  As shown in FIG. 3, the substrate stage apparatus PST includes a pair of base frames 14, an auxiliary base frame 15, and a substrate stage 20.

  One base frame 14 is on the + X side of the + X side substrate stage frame 33, the other base frame 14 is on the −X side of the −X side substrate stage frame 33, and the auxiliary base frame 15 is a pair of substrate stages. Between the gantry 33, the substrate stage gantry 33 is arranged at a predetermined distance (in a non-contact state). The pair of base frames 14 and the auxiliary base frame 15 are each composed of a plate-like member parallel to the YZ plane extending in the Y-axis direction, and the height position (Z position) can be adjusted via a plurality of adjuster devices on the floor 11. Is installed. As shown in FIG. 2, a mechanical Y linear guide device (single-axis guide device) extending in the Y-axis direction is provided on the upper end surfaces (+ Z side end portions) of the pair of base frames 14 and the auxiliary base frame 15, respectively. The Y linear guide 16a, which is an element, is fixed.

  Returning to FIG. 1, the substrate stage 20 includes a Y coarse movement stage 23y, an X coarse movement stage 23x, a fine movement stage 21, a substrate holder 40, a plurality of substrate lift devices 45, a Y step surface plate 50, a weight cancellation device 54, and a substrate. A carry-out device 70 is provided.

  The Y coarse movement stage 23y is mounted on the pair of base frames 14 and the auxiliary base frame 15 as shown in FIG. The Y coarse movement stage 23y has a pair of X beams 25 as shown in FIG. Each of the pair of X beams 25 is formed of a member having a rectangular YZ section extending in the X-axis direction, and is arranged in parallel to each other at a predetermined interval in the Y-axis direction. The pair of X beams 25 are connected to each other by a Y carriage 26 in the vicinity of the + X side and −X side ends. The Y carriage 26 is composed of a plate-like member parallel to the XY plane extending in the Y-axis direction, and a pair of X beams 25 are mounted on the upper surface thereof. Further, as shown in FIG. 3, the pair of X beams 25 are connected at the center in the longitudinal direction by an auxiliary carriage 26a.

  As can be seen from FIGS. 1 and 3, a plurality of Y slide members 16b constituting the Y linear guide device 16 together with the Y linear guide 16a are provided on the lower surface of the Y carriage 26 and the lower surface of the auxiliary carriage 26a (FIG. 3). (It overlaps in the depth direction of the paper). The Y slide member 16b is slidably engaged with the corresponding Y linear guide 16a with low friction, and the Y coarse movement stage 23y has a low friction on the pair of base frames 14 and the auxiliary base frame 15 with the Y axis. It can move in a direction with a predetermined stroke. The Z position of the lower surface of the pair of X beams 25 is set to the + Z side from the upper surface of the pair of substrate stage mounts 33, and the Y coarse movement stage 23y is moved from the pair of substrate stage mounts 33 (that is, the apparatus main body 30). Vibrationally separated.

  As shown in FIG. 2, the Y coarse movement stage 23 y is driven in the Y-axis direction by a pair of Y feed screw devices 17. Each of the pair of Y feed screw devices 17 includes a screw shaft 17a that is rotationally driven by a motor attached to the outer surface of the base frame 14, and a nut having a plurality of circulating balls (not shown) attached to the Y carriage 26. 17b. The Y position information of the Y coarse movement stage 23y is obtained by a linear encoder system (not shown). Note that the type of Y actuator for driving the Y coarse movement stage 23y (the pair of X beams 25) in the Y-axis direction is not limited to the ball screw device, and may be, for example, a linear motor, a belt driving device, or the like. . Further, a Y actuator having the same configuration as (or different from) the Y feed screw device 17 may be disposed on the auxiliary base frame 15. Moreover, the Y feed screw device 17 may be one.

  As shown in FIG. 4, an X linear guide 27a, which is an element of a mechanical uniaxial guide device extending in the X-axis direction, is provided on each upper surface of the pair of X beams 25 at a predetermined interval in the Y-axis direction. For example, two beams 25 are fixed in parallel to each other. A magnet unit 28a (X stator) including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction in the upper surface of each of the pair of X beams 25 and in the region between the pair of X linear guides 27a. Is fixed.

  The X coarse movement stage 23x is made of a plate member having a rectangular shape in plan view, and an opening is formed at the center thereof. An X slide member 27b constituting the X linear guide device 27 together with the X linear guide 27a is fixed to the lower surface of the X coarse movement stage 23x. For example, four X slide members 27b are provided at a predetermined interval in the X-axis direction for each X linear guide 27a (see FIG. 3). The X slide member 27b is slidably engaged with the corresponding X linear guide 27a with low friction, and the X coarse movement stage 23x has a predetermined stroke in the X-axis direction with low friction on the pair of X beams 25. It is movable. Further, the lower surface of the X coarse movement stage 23x is opposed to each of the pair of magnet units 28a via a predetermined clearance, and the X coarse movement stage is driven together with the pair of magnet units 28a with a predetermined stroke in the X-axis direction. A pair of coil units 28b (X mover) constituting the pair of X linear motors 28 are fixed.

  The X coarse movement stage 23x is restricted in relative movement in the Y axis direction relative to the Y coarse movement stage 23y by the X linear guide device 27, and moves in the Y axis direction integrally with the Y coarse movement stage 23y. That is, the X coarse movement stage 23x and the Y coarse movement stage 23y constitute a gantry-type two-axis stage device. The Y position information of the Y coarse movement stage 23y and the X position information of the X coarse movement stage 23x are obtained by a linear encoder system (not shown).

  The fine movement stage 21 is made of a box-shaped member having a rectangular shape in plan view, and the substrate holder 40 is fixed on the upper surface thereof. The fine movement stage 21 is moved on the X coarse movement stage 23x by a fine movement stage drive system including a plurality of voice coil motors including a stator fixed to the X coarse movement stage 23x and a mover fixed to the fine movement stage 21. It is slightly driven in the direction of three degrees of freedom (X axis, Y axis, θz direction). The plurality of voice coil motors include a plurality of X voice coil motors 18x (see FIG. 3; however, they overlap in the depth direction in FIG. 3 and are not shown in FIG. 1), and a plurality of Y voice coil motors 18y (see FIG. 3). 1 is included, but overlaps in the depth direction in FIG. 1 (not shown in FIG. 3). The fine movement stage 21 is guided to the X coarse movement stage 23x by the thrust generated by the plurality of voice coil motors, so that the fine movement stage 21 and the X coarse movement stage 23x have a predetermined stroke in the X axis direction and / or the Y axis direction. Moving. The fine movement stage 21 is slightly driven in the three degrees of freedom direction with respect to the X coarse movement stage 23x by a plurality of voice coil motors.

  Further, as shown in FIG. 1, the fine movement stage drive system includes a plurality of Z voice coil motors 18z for finely driving the fine movement stage 21 in the three degrees of freedom in the θx, θy, and Z-axis directions. Yes. The plurality of Z voice coil motors 18z are arranged, for example, at locations corresponding to the four corners of fine movement stage 21 (in FIG. 1, only two of four Z voice coil motors 18z are shown, and the other two (Not shown, and not shown in FIG. 4). The configuration of the fine movement stage drive system including a plurality of voice coil motors is disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  Returning to FIG. 1, position information (including rotation amount information in the θz direction) of the fine movement stage 21 in the XY plane is transferred to the fine movement stage 21 by the substrate interferometer system including the laser interferometer 19 fixed to the apparatus main body 30. It is obtained using an X moving mirror 22x (not shown in FIG. 1, refer to FIG. 2) and a Y moving mirror 22y fixed through the mirror base 24, respectively. The laser interferometer 19 includes a plurality of X laser interferometers corresponding to the X moving mirror 22x and a plurality of Y laser interferometers corresponding to the Y moving mirror 22y, but one Y laser is representatively shown in FIG. Only the interferometer is shown. Further, the position information of the fine movement stage 21 in the θx, θy, and Z-axis directions is respectively measured by a plurality of Z sensors 56 fixed to the lower surface of the fine movement stage 21 as shown in FIG. It is calculated | required using the target 57 fixed to. The configuration of the position measurement system of the fine movement stage 21 is disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  As can be seen from FIGS. 1 and 2, the substrate holder 40 is made of a plate-like member having a rectangular shape in plan view parallel to the XY plane, and a small amount (not shown) for holding the substrate P by vacuum suction is held on the upper surface thereof. A plurality of holes are formed. Further, as shown in FIG. 2, a plurality of (for example, four) X grooves 41 extending in the X axis direction are formed on the upper surface of the substrate holder 40 at predetermined intervals in the Y axis direction. The dimensions of the substrate holder 40 in the X-axis and Y-axis directions are set somewhat shorter than the dimensions of the substrate P in the X-axis and Y-axis directions, respectively, and the substrate P is placed on the substrate holder 40. The end of the substrate P protrudes from the end of the substrate holder 40. This is for preventing the resist from adhering to the back surface of the substrate P and preventing the resist from adhering to the substrate holder 40.

  As shown in FIG. 4, each of a plurality (for example, 16 in this embodiment) of the substrate lift devices 45 is fixed to the upper surface of the X coarse movement stage 23 x and the Z actuator 46 and the + Z side end of the Z actuator 46. And an air levitation device 47 attached to the section. A plurality of (for example, four) through-holes 42 penetrating the substrate holder 40 in the vertical direction are formed on the bottom surface defining the plurality of X grooves 41 formed in the substrate holder 40 at predetermined intervals in the X-axis direction. The fine movement stage 21 has a plurality of through holes 21 a at positions corresponding to the plurality of through holes 42. A part of the Z actuator 46 is inserted through the through holes 21 a and 42. The fine movement stage 21 is slightly smaller than the X coarse movement stage 23x between the wall surface defining the X groove 41 and the air levitation device 47 and between the Z actuator 46 and the wall surfaces defining the through holes 21a and 42. A gap is set so as not to contact each other when driven. Although the kind of Z actuator 46 is not specifically limited, For example, an air cylinder apparatus, a feed screw apparatus, a cam apparatus etc. can be used.

  As shown in FIG. 2, a plurality of (for example, four) air levitation devices 47 are accommodated in one X groove 41 at a predetermined interval in the X-axis direction. Each of the plurality of air levitation devices 47 is composed of a plate-like member parallel to the XY plane, and an upper surface of the substrate holder 40 (substrate mounting) is supported by a corresponding Z actuator 46 (not shown in FIG. 2; see FIG. 4). Between the position protruding from the surface) to the + Z side and the position lowering (retracted) from the upper surface of the substrate holder 40 to the −Z side. A plurality of minute holes (not shown) are formed on the upper surface of the air levitation device 47, and pressurized gas (for example, air) is ejected from the holes, and the substrate P is supported to float through a minute clearance. Can be done. Further, at least a part of the plurality of air levitation devices 47 can suck and hold the substrate P by sucking the gas between it and the substrate P. In the air levitation device 47, the gas ejection hole and the gas suction hole may be the same or different from each other. Further, in the first embodiment, for example, four X grooves 41 are formed, but the number of X grooves 41 and the number and arrangement of air levitation devices 47 (substrate lift devices 45) are limited to this. However, it can be appropriately changed according to the size of the substrate P, for example.

  The Y-step surface plate 50 is composed of a member having a rectangular YZ section extending in the X-axis direction, and is inserted between the pair of X beams 25 in a state of being separated by a predetermined distance from each of the pair of X beams 25 (in a non-contact state). Yes. The dimension in the longitudinal direction of the Y step surface plate 50 is set somewhat longer than the movement stroke of the fine movement stage 21 in the X axis direction. The upper surface of the Y-step surface plate 50 is finished with very high flatness. As shown in FIG. 4, the Y step surface plate 50 includes a plurality of Y linear guides 35 a fixed to the upper surfaces of the pair of substrate stage mounts 33 and a plurality of Y step surface plates 50 fixed to the lower surface of the Y step surface plate 50. The plurality of Y linear guide devices 35 constituted by the slide members 35b are guided linearly with a predetermined stroke on the pair of substrate stage mounts 33 in the Y-axis direction.

  As shown in FIG. 2, the Y-step surface plate 50 is mechanically applied to a pair of X beams 25 via a pair of flexure devices 51 in the vicinity of the + X side and −X side ends. It is connected to. As a result, the Y-step surface plate 50 and the Y coarse movement stage 23y move integrally in the Y-axis direction. The flexure device 51 includes, for example, a thin strip-shaped steel plate arranged in parallel to the XY plane, and a smoothing device (for example, a ball joint or a hinge device) provided at both ends of the steel plate. Is installed between the Y-step surface plate 50 and the X-beam 25 via a sliding device. Accordingly, the flexure device 51 has lower rigidity in the other five degrees of freedom directions (X, Z, θx, θy, θz directions) compared to the rigidity in the Y-axis direction. The Y coarse movement stage 23y is vibrationally separated. The Y position of the Y step surface plate 50 may be controlled independently of the Y coarse movement stage 23y by an actuator such as a linear motor or a feed screw device.

  As shown in FIG. 4, the weight canceling device 54 is composed of a single columnar member extending in the Z-axis direction, and supports the fine movement stage 21 from below via a device called a leveling device 59 described later. Yes. The weight cancellation device 54 is inserted into an opening formed in the X coarse movement stage 23x. The weight cancellation device 54 of this embodiment is configured in the same manner as the weight cancellation device disclosed in, for example, US 2010/0018950. That is, the weight canceling device 54 has an air spring (not shown) and the like, and the weight (weight) of the system including the fine movement stage 21, the substrate holder 40, and the like by the upward force in the gravity direction (+ Z direction) generated by the air spring. The downward force (−Z direction force) due to acceleration is canceled out, thereby reducing the load on the plurality of voice coil motors constituting the fine movement stage drive system.

  The weight cancellation device 54 is mechanically connected to the X coarse movement stage 23x via a plurality of flexure devices 55, and moves in the X axis direction and / or the Y axis direction integrally with the X coarse movement stage 23x. . The configuration of the flexure device 55 is substantially the same as the configuration of the flexure device 51 that connects the Y-step surface plate 50 and the X beam 25 described above. The leveling device 59 includes a spherical bearing device (or a pseudo spherical bearing device as disclosed in, for example, US Patent Application Publication No. 2010/0018950), and swings (tilts) the fine movement stage 21 in the θx and θy directions. Support from below freely.

  Here, the weight cancellation device 54 is mounted in a non-contact state on the Y-step surface plate 50 via a plurality of air bearings 58 attached to the lower surface thereof. The weight cancellation device 54 moves on the Y-step surface plate 50 when moving in the X-axis direction integrally with the X coarse movement stage 23x. On the other hand, when the weight cancellation device 54 moves in the Y-axis direction integrally with the X coarse movement stage 23x, it moves in the Y-axis direction integrally with the Y coarse movement stage 23y and the Y step surface plate 50. As a result, the Y-step surface plate 50 does not fall off.

  The substrate carry-out device 70 directs the substrate P placed on the substrate holder 40 to the outside of the substrate stage device PST described later (in this embodiment, a substrate guide device 62 of the port unit 60 described later (see FIG. 5)). It is an apparatus to carry out, and is attached to the outer surface (surface facing the + Y side) of the + Y side X beam 25 of the pair of X beams 25. The substrate carry-out device 70 is a pair of X that linearly guides the suction pad 71 that sucks and holds the lower surface of the substrate P to be carried out, the support member 72 that supports the suction pad, and the support member 72 (and the suction pad 71) in the X-axis direction. An X linear motor 74 for driving the linear guide device 73 and the support member 72 (and the suction pad 71) in the X-axis direction is provided. 4 is a cross-sectional view taken along the line AA of FIG. 3, for the purpose of explaining the configuration of the substrate carry-out device 70, the suction pad 71 and the support member 72 are shown in a state where they are positioned at the stroke end on the −X side. Has been.

  As shown in FIG. 4, the suction pad 71 is made of a member having an inverted L-shaped YZ cross section, and a portion parallel to the XY plane is a plan view with the X-axis direction as the longitudinal direction, as shown in FIG. It consists of a rectangular plate-shaped member. The suction pad 71 is connected to a vacuum device (not shown) installed outside, and the upper surface of a portion parallel to the XY plane functions as a substrate suction surface portion. As shown in FIG. 3, the support member 72 is made of a plate-like member parallel to the XZ plane extending in the Z-axis direction, and a suction pad 71 is attached in the vicinity of the upper end portion (the end portion on the + Z side). . The support member 72 has a structure in which the rigidity in the X-axis direction is higher than the rigidity in the Y-axis direction. The support member 72 is formed such that a portion on the + Z side is slightly bent toward the + X side with respect to the central portion in the Z-axis direction, and the upper end portion is + X side from the lower end portion (−Z side end portion). (That is, protrudes to the port 60 (not shown in FIG. 3, refer to FIG. 5) side). Also, as shown in FIG. 4, the substrate holder 40 is positioned between the support member 72 and the substrate holder 40 with the support member 72 and the substrate holder 40 being adjacent to each other with respect to the X coarse movement stage 23x. The clearances are set so that they do not contact each other even if they are slightly driven in the direction and / or the θz direction.

  Here, the suction pad 71 is connected to the support member 72 in the vicinity of the + Y side end portion, so that the −Y side end (substrate holder 40) from the surface in which the −Y side end portion faces the −Y side of the support member 72. The Y position of the −Y side end is located on the −Y side from the + Y side end of the substrate holder 40. That is, when the substrate stage 20 is viewed from the + Z side, the suction pad 71 is positioned above the substrate holder 40 (overlaps in the Z-axis direction), depending on the X position of the substrate holder 40. Further, the suction pad 71 has a lower Z position that is higher than a Z position on the upper surface of the substrate holder 40 (the Z position of the substrate holder 40 changes within a very small range. The support member 72 supports the substrate holder 40 so as to be positioned higher than the Z position on the upper surface of the substrate holder 40 in a state where the substrate holder 40 is positioned at a neutral position in the direction. Thereby, the suction pad 71 can be inserted between the substrate P and the substrate holder 40 in a state where the substrate P is driven to be lifted (lifted) from the upper surface of the substrate holder 40 by the plurality of substrate lift devices 45. It is like that.

  One surface in the vicinity of the lower end of the support member 72 faces the outer surface of the X beam 25 on the + Y side. On the other hand, as shown in FIG. 3, for example, two (a pair) of X linear guides 73a extending in the X axis direction are fixed to the outer surface of the + Y side X beam 25 at a predetermined interval in the Z axis direction. ing. The length of the pair of X linear guides 73a (dimension in the X axis direction) is set to be almost half of the X beam 25 (or about the same as the length of the substrate P in the X axis direction). It is arranged in the region on the + X side (port portion 60 (not shown in FIG. 3; see FIG. 5) side) from the central portion. Further, one surface of the support member 72 (the surface facing the X beam 25) includes a rolling element (not shown) (for example, a circulating ball) and is mechanically slidably engaged with the X linear guide 73a. For example, two X sliders 73b are fixed to one X linear guide 73a at a predetermined interval in the X axis direction. An X linear guide device 73 for linearly guiding the support member 72 (and the suction pad 71) in the X-axis direction is configured by the X linear guide 73a and, for example, two X sliders 73b corresponding to the X linear guide 73a. Has been.

  A magnet unit 74a including a plurality of permanent magnets arranged at a predetermined interval in the X-axis direction is fixed between the pair of X linear guides 73a. On the other hand, a coil unit 74b including a coil is fixed to one surface of the support member 72 (the surface facing the X beam 25) so as to face the magnet unit 74a at a predetermined interval. An X linear motor 74 for driving the support member 72 (and the suction pad 71) in the X-axis direction by the magnet unit 74a (X stator) and the coil unit 74b (X mover) corresponding to the magnet unit 74a. Is configured. The actuator for driving the support member 72 (and the suction pad 71) in the X-axis direction is not limited to this. For example, a ball screw (feed screw) device, a traction device using a rope (or belt, etc.), etc. Other uniaxial actuators may be used. A stopper 75 that mechanically defines the movable range of the support member 72 is fixed to each of the outer surfaces of the X beam 25 on the + Y side and in the vicinity of both ends of the magnet unit 74a.

  In the substrate stage 20, when performing the unloading operation of the substrate P, the plurality of Z actuators 46 so that the upper surface of the air levitation device 47 of each of the plurality of substrate lift devices 45 is located on the + Z side with respect to the upper surface of the substrate holder 40. Is controlled. In the substrate carry-out device 70, the suction pad 71 sucks and holds the lower surface of the substrate P in the vicinity of the −X side and + Y side end portions (corner portions), and the support member 72 is driven by the X linear motor 74 in this state. As a result, the substrate P moves in the + X direction on the substrate holder 40 and is carried out to the port portion 60. At this time, from each of the plurality of air levitation devices 47, pressurized gas is ejected to the lower surface of the substrate P, and the substrate P is supported to be levitated. As a result, the substrate P moves on the substrate holder 40 with low friction.

  Here, in the substrate carry-out device 70, as shown in FIG. 3, the X position of the suction pad 71 when the support member 72 is positioned at the stroke end on the + X side is the stroke of the X coarse movement stage 23x on the + X side. The shape (bending amount) of the support member 72 is set so as to be closer to the + X side than the substrate holder 40 when positioned at the end. Thus, the suction pad 71 can be retracted outside the movable range of the X coarse movement stage 23x while the exposure processing or the like is performed on the substrate P. In the present embodiment, the intermediate portion of the support member 72 is bent, but if the suction pad 71 can be retracted outside the movable range in the X-axis direction of the substrate holder 40, The shape is not limited to this.

  As shown in FIG. 5, the port unit 60 includes a substrate carry-in device 61 that carries a substrate P carried from an external device (not shown) (for example, a coater / developer device) toward the substrate stage 20, and an exposed device. A substrate guide device 62 for receiving a substrate (not shown in FIG. 5) from the substrate stage 20. The substrate carry-in device 61 and the substrate guide device 62 are accommodated in a chamber (not shown) together with the device body 30 adjacent to the + X side of the device body 30 (not shown in FIG. 5, see FIG. 1). In FIG. 5, illustration of members of the substrate stage 20 excluding the substrate holder 40 and the substrate carry-out device 70 (the suction pad 71 and the support member 72) is omitted in order to avoid complication of the drawing. Further, in the substrate stage 20 shown in FIG. 5, the Y coarse movement stage 23y (not shown in FIG. 5, refer to FIG. 1) is at the center of the movable range, and the X coarse movement stage 23x (not shown in FIG. 5). 1) is located at the stroke end on the + X side. Hereinafter, the position of the substrate stage 20 shown in FIG. 5 will be referred to as a substrate replacement position.

  The substrate carry-in device 61 includes a fork hand 61a that supports and holds the substrate P to be loaded from below, and a pair of drive units 61b that drives the fork hand 61a in the X-axis direction. The substrate P placed thereon can be transported along the XY plane from above the substrate guide device 62 to above the substrate stage 20 positioned at the substrate replacement position. The substrate guide device 62 has a plurality of air levitation devices 63, and can float and support a substrate to be carried out (not shown in FIG. 5) from below. The plurality of air levitation devices 63 are synchronously driven with a predetermined stroke in the Z-axis direction by a Z actuator 64 as shown in FIG. The plurality of air levitation devices 63 are mounted on a base 65 that is driven with a predetermined stroke in the X-axis direction by an X actuator (not shown), and is not shown in the floor 11 (not shown in FIG. 6A). (Refer to Fig. 1) It is integrally driven in the X-axis direction on the gantry 66 installed above. Further, as shown in FIG. 5, a plurality of air levitation devices 63 are arranged on the −X side (substrate stage 20 side) more than the + X side, and the substrate defined by the plurality of air levitation devices 63. The guide surface has a trapezoidal shape whose bottom is longer than the width direction dimension of the substrate P in plan view.

  In the liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above, the mask M is loaded onto the mask stage MST by a mask loader (not shown) under the control of the main controller (not shown). At the same time, the substrate loading device 61 loads the substrate P onto the substrate holder 40. After that, alignment measurement is performed by the main controller using an alignment detection system (not shown), and after the alignment measurement, a step-and-scan exposure operation is sequentially performed on a plurality of shot areas set on the substrate. Is done. Since this exposure operation is the same as a conventional step-and-scan exposure operation, a detailed description thereof will be omitted. Then, the substrate after the exposure processing is carried out from the substrate holder 40 to the port unit 60 by the substrate carry-out device 70, and another substrate to be exposed next is carried to the substrate holder 40, whereby the substrate holder 40. The upper substrate is exchanged, and the exposure operation and the like are continuously performed on the plurality of substrates.

Hereinafter, the exchange operation of the substrate P on the substrate holder 40 in the liquid crystal exposure apparatus 10 (for convenience, a plurality of substrates P will be referred to as substrate P ₁ , substrate P ₂ , substrate P ₃ ) will be described with reference to FIGS. ). The following board replacement operation is performed under the control of a main controller (not shown). 6A to 11B, the substrate holder 40 is shown in a cross-sectional view and includes a plurality of voice coil motors, and a part thereof is omitted for easy understanding.

In FIG. 6A, the substrate P ₁ is held by the substrate holder 40 of the substrate stage 20. The fork hand 61a holds a substrate P ₂ (next substrate P ₂ ) to be held next by the substrate holder 40 after the substrate P ₁ is unloaded from the substrate holder 40. The substrate carry-in robot arm 68 and the substrate carry-out robot arm 69 are fork hands that can move between the outside of the liquid crystal exposure apparatus 10 (see FIG. 1) and the inside of the liquid crystal exposure apparatus 10 (substantially the same configuration as the fork hand 61a). have.

The main control unit, among the plurality of shot areas set on the substrate P _1, after exposure for the last shot area has been completed, as shown in FIG. 6 (B), the substrate stage from the exposure end position 20 To move to the substrate exchange position. During the exposure process, the support member 72 of the substrate carry-out device 70 is positioned at the + X side stroke end, and the suction pad 71 is retracted outside the movable range of the substrate P in the X-axis direction. ing. Therefore, for unloading the substrate P _1, X coarse movement stage 23x (and substrate holder 40) is also moved in the X-axis direction, not in contact with the substrate P ₁ and the suction pad 71. In parallel with this, the fork hand 61a is driven in the -X direction, thereby the substrate P ₂ is positioned above the substrate exchange position. Further, in the port portion 60, the substrate guide device 62 is driven in a direction approaching the substrate stage 20.

When the substrate stage 20 reaches the substrate exchange position, the main controller, as shown in FIG. 7 (A), together to release the suction holding of the substrate P ₁ by the substrate holder 40, controls a plurality of substrate lift device 45 Then, the air levitation device 47 is driven to rise. Thereby, a gap is formed between the lower surface of the substrate P _{1 and} the upper surface of the substrate holder 40. Next, as shown in FIG. 7B, the support member 72 of the substrate carry-out device 70 is driven in the −X direction, whereby the suction pad 71 is placed between the lower surface of the substrate P _{1 and} the upper surface of the substrate holder 40. passes through the gap, the end of the -X side and + Y side of the substrate P ₁ (corner) is located below the vicinity. Thereafter, the plurality of air levitation devices 47 are driven downward, and the lower surface of the substrate P ₁ is sucked and held by the suction pad 71. Further, a plurality of air floating device 47 floats supporting the substrate P ₁ by ejecting the pressurized gas to the lower surface of the substrate P _1. At this time, the plurality of air levitation devices 47 of the substrate stage 20 and the plurality of air levitation devices 63 of the port unit 60 are controlled so that the Z positions on the upper surfaces of the substrate stage 20 are substantially the same.

Thereafter, as shown in FIG. 8A, the support member 72 of the substrate carry-out device 70 is driven in the + X direction, whereby the substrate P ₁ sucked and held by the suction pad 71 is moved to the plurality of air floating devices 47. And moves in the + X direction along a plane (guide surface) parallel to the XY plane formed by the upper surfaces of the plurality of air levitation devices 63, and is carried out from the substrate holder 40 to the port unit 60. At this time, from the upper surface of the plurality of air floating device 63, pressurized gas is injected to the substrate P _1. This makes it possible to move the substrate P ₁ fast and with low dust generation.

When the substrate P ₁ is passed over a plurality of air floating device 63 from the substrate holder 40, as shown in FIG. 8 (B), together with the suction holding of the substrate P ₁ is released by the suction pads 71, a plurality The jet of pressurized gas from the air levitation device 63 is stopped. Accordingly, the substrate P ₁ is placed on a plurality of air floating device 63, and then the substrate guide device 62 which supports the substrate P ₁ is driven in the + X direction. Incidentally, if it is possible substrate carry-out device 70 for transporting the substrate P ₁ until on a substrate guide device 62 located in the position shown in FIG. 8 (B), by moving the substrate guide device 62 in advance in the substrate stage 20 side It is not necessary to leave (it may be immovable). In the substrate stage 20, the plurality of air levitation devices 47 are driven upward to press the lower surface of the substrate P ₂ from below. In fork hand 61a, the suction holding of the substrate _{P 2} is released, thereby, the substrate _{P 2} is separated from the fork hand 61a. Note that the fork hand 61 a may be lowered to deliver the substrate P ₂ to the plurality of air levitation devices 47.

When the substrate P ₂ and the fork hand 61a is separated, as shown in FIG. 9 (A), the fork hand 61a is driven in the + X direction, and retreated from above the substrate exchange position, the position of the upper substrate guide device 62 Return to. Further, in the port portion 60, the plurality of air levitation devices 63 are driven somewhat downward. Next, as shown in FIG. 9B, in the substrate stage 20, the plurality of air levitation devices 47 are driven down and the substrate P < _b > ₂ is placed on the substrate holder 40. Furthermore, the port portion 60, the substrate carry-out robot arm 69 is inserted into the lower substrate P _1.

Thereafter, 10 as shown (A), the substrate P ₂ is held by suction by the substrate holder 40, X coarse movement stage 23x port portion 60 in order to perform the alignment operation on that substrate P _2, the exposure operation or the like Driven in a direction away from Furthermore, the port portion 60, the substrate P ₁ is recovered from the port portion 60 by the substrate carry-out robot arm 69, it is conveyed to an external device (not shown). Further, the plurality of air levitation devices 63 are driven up. Substrate loading robot arm 68 holds the substrate P _3.

Thereafter, as shown in FIG. 10 (B), the substrate carry robot arm 68 conveys the substrate P ₃ above the plurality of air floating device 63, as shown in FIG. 11 (A), the substrate P ₃ Is delivered to a plurality of air levitation devices 63. Thereafter, as shown in FIG. 11 (B), a plurality of air floating device 63 is driven downward (return to the state shown in FIG. 6 (A)) substrate P ₃ is placed on the fork hand 61a . At this time, it may be performed aligned relative to the fork hand 61a in a state of being floated substrate P ₃ on the plurality of air floating devices 63 (alignment). The alignment is performed, for example, by pressing the substrate P ₃ at a plurality of positions on the end while detecting the end (edge) position of the substrate P ₃ with an edge sensor or a camera.

  As described above, according to the first embodiment, since the substrate carry-out device 70 is attached to the Y coarse movement stage 23y, which is stationary during the scanning operation, of the substrate stage 20, the X coarse movement The position control of the stage 23x is not affected, and the X position of the substrate P can be controlled with high accuracy during the scanning operation. The substrate stage 20 has a structure in which the X coarse movement stage 23x and the fine movement stage 21 are mounted on the Y coarse movement stage 23y having the substrate carry-out device 70 (the Y coarse movement stage 23y is the lowest structure). The maintenance of the substrate carry-out device 70 is also easy. Further, since the substrate carry-out device 70 only moves the suction pad 71 (and the support member 72) in the X-axis (one axis) direction, the configuration and control are simple, and the cost is lower than that of, for example, an articulated robot arm. is there. Further, since the substrate carry-out device 70 can retract the suction pad 71 to the outside of the movable range of the substrate P in the X-axis direction, the height position between the suction pad 71 and the substrate P (or the substrate holder 40) ( Even if the Z position is the same, it is possible to prevent contact with each other.

  Further, since the substrate stage 20 has the substrate carry-out device 70, only the substrate carry-in device 61 for carrying the substrate P to the substrate stage 20 may be disposed in the port unit 60. That is, in the first embodiment, only the fork hand 61a of the substrate carry-in device 61 is positioned above the substrate stage 20 located at the substrate replacement position during the replacement operation of the substrate held on the substrate stage 20. Compared with the case where a known substrate exchange device having a substrate carrying robot arm and a substrate carrying robot arm is provided in the port unit 60, as shown in FIG. 4, the substrate holder 40 and the lens barrel surface plate are used. Even if the space between the substrate 31 and the substrate 31 is narrow, the replacement operation of the substrate P can be easily performed.

  Further, since the substrate stage 20 includes the substrate carry-out device 70, the substrate carry-out operation from the substrate stage 20 can be performed regardless of the position (X position and / or Y position) of the substrate stage 20. Therefore, the substrate P unloading operation can be started after the exposure of the final shot area is completed and before the substrate stage 20 reaches the substrate exchange position (including during the movement of the substrate stage 20). Further, since the guide surface of the substrate P formed by the plurality of air levitation devices 63 is set wider than the substrate P in the port portion 60, the position of the substrate stage 20 with respect to the substrate guide device 62 in the Y-axis direction is set. There is no need to perform alignment precisely (the carry-out operation may be started while the substrate holder 40 is moving obliquely with respect to the X axis). Therefore, the cycle time for substrate replacement can be shortened.

  Further, in the substrate lift device 45, since the Z actuator 46 for moving the air levitation device 47 up and down is mounted on the X coarse movement stage 23x, the Z actuator is temporarily incorporated in the fine movement stage 21 (or the substrate holder 40). Compared to the case, the fine movement stage 21 can be reduced in thickness and weight, and a Z actuator having a long stroke in the Z-axis direction can be used. Therefore, the air levitation device 47 can be driven with a long stroke.

<< Second Embodiment >>
Next, a second embodiment will be described with reference to FIGS.

  The substrate stage 120 according to the second embodiment is different from the first embodiment in the configurations of a substrate holder 140, a substrate lift device 145 (not shown in FIG. 12, refer to FIG. 13), and a substrate carry-out device 170. Hereinafter, members having the same configurations and functions as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment (or common at the end), and description thereof is omitted.

  As shown in FIG. 12, a plurality of minute holes (not shown) are formed on the upper surface of the substrate holder 140 of the substrate stage 120 according to the second embodiment, and pressurized gas (for example, , Air), and the substrate P is levitated and supported through a minute clearance, and the substrate P can be sucked and held by sucking a gas between the substrate P and the substrate P. In the substrate holder 140, the gas ejection hole and the gas suction hole may be the same or different from each other.

  Further, as shown in FIG. 13, the substrate holder 140 is formed with a plurality of through holes 142 penetrating in the Z-axis direction at positions corresponding to the plurality of substrate lift devices 145. Each of the plurality (for example, 16 in the second embodiment) of the substrate lift devices 145 includes lift pins 147 that are driven in the vertical (Z-axis) direction by the Z actuator 46. The lift pin 147 is accommodated.

  The substrate stage 120 has a substrate slide device 80 for sliding the substrate P placed on the substrate holder 140 with respect to the substrate holder 140 in the Y-axis direction. As shown in FIG. 12, for example, two substrate slide devices 80 are arranged at predetermined intervals in the X-axis direction. However, the number and arrangement of the substrate slide devices 80 are not limited to this and can be changed as appropriate.

  As shown in FIG. 13, the substrate holder 140 has a notch 143 formed at a position corresponding to the substrate slide device 80. The notch 143 is formed to open on the upper surface side of the substrate holder 140 and the side surface side on the −Y side.

  The substrate slide device 80 includes a base 81, a Y linear guide 82, a Y slide member 83, and a pressing pin 84. The base 81 is made of a flat plate-like member having a rectangular shape in plan view extending in the Y-axis direction. The + Y side end side is inserted into the notch 143 and the −Y side end side is the substrate holder 140. It protrudes from the -Y side end to the -Y side (outside). The bottom surface of the base 81 is fixed to the substrate holder 140. The Y linear guide 82 is fixed to the upper surface of the base 81. The Y slide member 83 is mechanically engaged with the Y linear guide 82 so as to be slidable. The pressing pin 84 is formed of a columnar member extending in the Z-axis direction, and is fixed to the Y slide member 83. The Z position of the end portion on the + Z side of the pressing pin 84 is set on the + Z side with respect to the upper surface of the substrate holder 140. The substrate slide device 80 includes a Y actuator (not shown) for driving the pressing pin 84 in the Y-axis direction, and the pressing pin 84 contacts the substrate P outside the substrate holder 140 shown in FIG. It is driven between a position not to be operated and a position in which a part shown in FIG.

  As in the first embodiment, the substrate carry-out device 170 includes a support member 72 attached to the X beam 25 on the + Y side via a pair of X linear guide devices 73 in the X axis direction by an X linear motor 74. It is driven with a predetermined stroke. As shown in FIG. 4, the suction pad 71 of the first embodiment is formed in an inverted L-shaped YZ cross section, and the substrate suction surface portion protrudes from the −Y side surface of the support member 72 to the −Y side. While the Y position partially overlaps with the substrate holder 40, as can be seen from FIGS. 12 and 13, the substrate suction surface portion of the suction pad 171 of the second embodiment is placed on the substrate holder 140. Even if it moves in the X-axis direction in a state where P is placed, it is arranged on the outside (+ Y side) of the substrate holder 140 so as not to contact the substrate P. The Z position of the upper surface (suction surface) of the suction pad 171 is set somewhat on the −Z side (downward) from the upper surface (substrate mounting surface) of the substrate holder 140.

  Further, in the first embodiment, as shown in FIG. 2, during the exposure process for the substrate P, the suction pad 71 is outside the movable range in the X-axis direction of the substrate P (substrate holder 40) (specifically, In the second embodiment, the suction pad 171 moves the substrate holder 140 even during the exposure process for the substrate P, as shown in FIG. Arranged within the possible range. Even in this case, the substrate P and the suction pad 171 do not contact when the substrate P (and the substrate holder 140) moves in the X-axis direction (see FIG. 13). Further, the pressing pin 84 of the substrate slide device 80 is also positioned at the stroke end on the −Y side so as not to contact the substrate P.

  In the substrate stage 120, the substrate P is unloaded as shown in FIG. 15 in a state where the pressurized gas is ejected from the substrate holder 140 to the lower surface of the substrate P and the substrate P is floated. In the substrate stage 120, the pressing pin 84 of the substrate slide device 80 is driven to the + Y side, whereby the + Y side end of the substrate P protrudes from the + Y side end of the substrate holder 140 to the + Y side by a predetermined amount. Next, the fine movement stage 21 and the substrate holder 140 are lowered by the Z voice coil motor 18z (or by reducing the pressure in the air spring (not shown) of the weight cancellation device 54). As a result, the substrate P is lowered while floating on the substrate holder 140, and the vicinity of the + Y side and −X side end portions are sucked and held by the suction pad 171 previously positioned below the substrate P. In the second embodiment, the substrate lift device 145 is used only when receiving the substrate P from the substrate carry-in device 61 (not shown in FIG. 15, refer to FIG. 5), and is not used for carrying out the substrate P. .

  Thereafter, as shown in FIG. 14, the suction pad 171 is driven in the + X direction, so that the substrate P extends to the port portion 60 (not shown in FIG. 14, see FIG. 5) along the upper surface of the substrate holder 140. It is carried out.

  According to the second embodiment described above, the suction pad 171 does not need to be kept outside the movable range in the X-axis direction of the substrate P, so that the substrate P can be quickly carried out after the exposure process is completed. The operation can be started. Therefore, the cycle time for substrate replacement can be shortened. In the second embodiment, the case where the substrate holder 140 is driven downward to bring the substrate P and the suction pad 71 into contact with each other has been described. However, the present invention is not limited to this, and the suction pad 71 is moved up and down on the substrate carry-out device 170. A driving device that drives in the direction may be provided, and the suction pad 71 may be driven to bring the substrate P and the suction pad 71 into contact with each other. The substrate slide device 80 may be provided on the fine movement stage 21 or the X coarse movement stage 23x.

  The configuration of the liquid crystal exposure apparatus including the substrate stage apparatus is not limited to that described in the first and second embodiments, and can be changed as appropriate. For example, in the first embodiment, as shown in FIG. 4, the suction pad 71 of the substrate carry-out device 70 is previously removed from the support member 72 so that it can be inserted between the substrate P and the substrate holder 40. Although it protrudes and is arrange | positioned at the substrate holder 40 side, it is via the Y drive device 275 which drives the suction pad 271 to a Y-axis direction like the substrate stage 220 which concerns on the 1st modification shown by FIG. 16, for example. The suction pad 271 is retracted from the substrate P when mounted on the support member 72 to perform exposure processing or the like on the substrate P, and is inserted between the substrate P and the substrate holder 40 only when the substrate P is unloaded. Also good. In the first embodiment, when the substrate P is delivered to the port portion, as shown in FIG. 7B, after the substrate P is separated from the upper surface of the substrate holder 40, the suction pad 71 and the substrate P are separated. Although it is necessary to move the substrate P to a position where the substrate P can be adsorbed by passing between the substrate holder 40 and the substrate holder 40, the substrate P is placed on the substrate holder 40. The suction pad 271 can be moved to the position where the vicinity of the −X side and + Y side end of the substrate P can be sucked. Therefore, the time required for carrying out the substrate can be shortened.

  Further, the configuration of the substrate lift device 45 for lifting the substrate P from the substrate holder 40 is not limited to that of the first embodiment. For example, each of the plurality of substrate lift devices 340 included in the substrate stage 320 according to the second modification shown in FIG. 17 is made of a rod-shaped member extending in the X-axis direction and is accommodated in the X groove 41. A plurality of (for example, six) porous members 342 attached to the upper surface of the base member 341 at predetermined intervals in the X-axis direction, and a pair of Z actuators 343 that drive (vertically move) the base member 341 in the Z-axis direction (see FIG. 17 (not shown, see FIG. 18A). The longitudinal dimension of the base member 341 is set to be approximately the same as the longitudinal dimension of the substrate P (not shown in FIG. 17; see FIG. 20B) (somewhat shorter in the second modification).

  As shown in FIG. 18B, for example, five substrate lift devices 340 are provided at predetermined intervals in the Y-axis direction (intervals corresponding to the plurality of X grooves 41 formed in the substrate holder 40). . The substrate holder 40 of the second modified example is the first embodiment in that the number of X grooves 41 and the X grooves 41 are not opened at the + X side and −X side ends of the substrate holder 40. Although different from the form, the same reference numerals as those in the first embodiment are used for convenience.

  As shown in FIG. 18A, leg portions 344 extending in the Z-axis direction are fixed to the lower surface of the base member 341 and in the vicinity of both ends in the longitudinal direction of the base member 341. A pair of through holes 42 penetrating the substrate holder 40 in the vertical direction are formed on the bottom surface defining the X groove 41, and a leg portion 344 is inserted into each of the pair of through holes 42. The fine movement stage 21 is slightly driven with respect to the X coarse movement stage 23x between the wall surface defining the X groove 41 and the base member 341 and between the wall surface defining the through hole 42 and the leg portion 344, respectively. In this case, a gap that does not contact each other is set.

  The pair of Z actuators 343 are fixed to the upper surface of the X coarse movement stage 23x and corresponding to the pair of leg portions 344, respectively. An air cylinder or the like can be used as the Z actuator 343. A stay 345 made of an L-shaped member is fixed in the vicinity of the Z actuator 343 on the upper surface of the X coarse movement stage 23x. As shown in FIG. 18C, the base member 341 is operated by a Z linear guide device including a Z linear guide 346 fixed to the leg portion 344 and a Z slide member 347 attached to the stay 345. It is guided straight in the Z-axis direction (vertical direction) with respect to the X coarse movement stage 23x.

  Here, the base member 341 is formed hollow as shown in FIG. 19A, and a plurality of holes are formed on the upper surface. The porous member 342 (not shown in FIG. 19A, see FIG. 17) is attached so as to close the plurality of holes. Pressurized gas is supplied to the base member 341 from the outside of the substrate holder 40 (not shown in FIG. 19A, see FIG. 17) via the piping member 348, and the plurality of pores and the porous member are provided. Pressurized gas is jetted through the member 342 toward the lower surface of the substrate P (not shown in FIG. 19A, see FIG. 18D). In addition, as shown in FIG. 19A, the piping member 348 may be formed such that one leg 344 is formed hollow and communicated with the base member 341 and connected to the one leg 344. As shown in FIG. 19B, the base member 341 may be connected to one end in the longitudinal direction. Note that the porous member 342 may not be attached to the base member 341. That is, the surface of the base member does not form an air bearing using a porous throttle, but may be a surface diaphragm or orifice diaphragm formed by drilling holes or grooves, or an air bearing (integral molding process) combining these.

  In the substrate stage 320, as shown in FIG. 20A, the fork hand 61a of the substrate carry-in device 61 transports the substrate P above the substrate holder 40 while the base member 341 is driven upward (substrate P). , The base member 341 may be driven upward after being conveyed above the substrate holder 40), and then, as shown in FIG. 20B, the fork hand 61a is driven downward and the −X direction (substrate By driving in a direction away from the holder 40 (the base member 341 may be further lifted without driving the fork hand 61a downward), the substrate P is transferred to the substrate lift device 340. Thereafter, as shown in FIG. 20C, the base member 341 is driven downward, and the substrate P is placed on the upper surface of the substrate holder 40. Further, when the substrate P is unloaded, the base member 341 is driven up as shown in FIG. 20D, and the substrate P is separated from the upper surface of the substrate holder 40 to move from the porous member 342 to the lower surface of the substrate P. Pressurized gas is ejected. Thereafter, the substrate P is unloaded by the substrate unloading device 70 (not shown in FIG. 20D, see FIG. 3).

  According to the second modified example, since only one pressurized gas supply pipe needs to be connected to one base member 341, the configuration of the apparatus is simple (as opposed to the first embodiment described above). In the embodiment (see FIG. 4), it is necessary to individually connect a pressurized gas supply pipe to the air levitation device 47 of each of the plurality of substrate lift devices 45). In addition, since it is not necessary to form a through hole in fine movement stage 21, a decrease in rigidity of fine movement stage 21 can be suppressed. Further, even when the Z actuator 343 cannot be arranged below the fine movement stage 21 (for example, when the weight canceling device 54 is large), it can be suitably used. In the second modification, for example, two Z actuators 343 separated in the X-axis direction are provided for each base member 341. However, the present invention is not limited to this. For example, the two Z actuators 343 can A plurality of base members 341 may be driven together. Further, the substrate lift device 340 according to the second modification can be applied to a substrate stage device that does not have a substrate carry-out device (for example, when the substrate carry-out device is provided on the port side). It is.

  Further, in the second modified example, as shown in FIG. 21A, the tension coil spring 349 is located near both ends of the base member 341 and further outward (end side) than the leg 344. One end may be connected. The tension coil spring 349 has an intermediate portion inserted into a through hole 43 formed in the substrate holder 40 and the other end connected to a stay 345 (that is, the X coarse movement stage 23x). As a result, as shown in FIG. 21B, when the base member 341 is driven up, the vicinity of both ends of the base member 341 is centered around the connection portion between the base member 341 and the leg 344. As a result, a moment is applied such that the end of the base member 341 falls downward. Thereby, the bending by the dead weight of the center part of the longitudinal direction of the base member 341 is suppressed.

  Moreover, the structure of the board | substrate carrying-out apparatus 70 which carries out the board | substrate P from the board | substrate holder 40 can also be changed suitably. FIG. 22 shows a substrate stage 420 according to a third modification. In the substrate stage 420, the X beam 425 is formed with a narrower width (height direction dimension is longer than the width direction dimension) as compared with the first embodiment (see FIG. 1 and the like), and the X coarse movement stage 23x. A magnet unit 28 a constituting an X linear motor 28 for driving the X beam 425 is fixed to both side surfaces of the X beam 425. In addition, a pair of X carriages 29 corresponding to the pair of X beams 425 are fixed to the lower surface of the X coarse movement stage 23x. The X carriage 29 is made of a member having an inverted U-shaped YZ cross section, and a corresponding X beam 425 is inserted between a pair of opposing surfaces. A coil unit 28b is fixed to the pair of opposed surfaces of the X carriage 29 so as to face the magnet unit 28a.

  In the substrate carry-out device 470, a support member 72 that supports the suction pad 71 is fixed to a fixed portion 76a fixed to the Y coarse movement stage 23y and in the vicinity of the lower end portion of the support member 72 so as to face the fixed portion 76a. It is driven with a predetermined stroke in the X-axis direction by an X drive unit 76 including a movable portion 76b. In the substrate stage 420, the Y carriage 26 and the auxiliary carriage 26a (not shown in FIG. 22; see FIG. 3) that connect the vicinity of the + X side end portions of the pair of X beams 425 are connected to the + Y side X beam 425. It protrudes to the + Y side from the side surface on the + Y side. The fixed portion 76a is made of a member extending in the X-axis direction, and is erected on the vicinity of the + Y side ends of the Y carriage 26 and the auxiliary carriage 26a. Although not shown, the X drive unit 76 includes elements for driving the support member 72 with a predetermined stroke in the X-axis direction (for example, a stator and a movable element of an X linear motor, a guide member and a slide of an X linear guide device). Member). As a result, as in the first embodiment, the support member 72 is driven in the X-axis direction with a stroke equivalent to the length of the substrate P in the X-axis direction. 23, the fixed part 76b of the X drive unit 76 may be fixed to the X carriage 29 in the substrate carry-out device 570 like the substrate stage 520 according to the fourth modification shown in FIG.

  In the substrate stages 420 and 520, the substrate lift device for separating the substrate P from the substrate holder 40 is not shown in order to avoid complication of the drawings, but the substrate lift device according to the first embodiment is not shown. 45 (see FIG. 3), any of the substrate lift device 145 (see FIG. 13) according to the second embodiment and the substrate lift device 340 (see FIG. 18) according to the second modification may be used.

  In the first and second embodiments (including the first to fourth modifications described above, the same applies hereinafter), each of the substrate carry-out devices 70, 170, and 270 is provided on the outer surface of the X beam 25 on the + Y side ( The number and arrangement of the substrate carry-out devices 70, 170, 270 are not limited to this, but for example, on the outer surface of the X beam on the + Y side in the X-axis direction. A plurality of (for example, two) support members 72 and suction pads 71 may be arranged at predetermined intervals, and a plurality of different locations spaced apart in the X-axis direction of the substrate P may be held. Further, the substrate carry-out devices 70, 170, and 270 are additionally attached to the X beam 25 on the −Y side, and in the vicinity of the −Y side end (or on the −Y side) together with the vicinity of the + Y side end of the substrate P. It is also possible to hold only the vicinity of the end portion.

  In the first and second embodiments, the substrate P is unloaded to the port unit 60 using only the substrate unloading devices 70, 170, and 270 included in the substrate stages 20, 120, and 220. For example, At the same time, a substrate carry-out device is arranged in the port unit 60, and the substrate P is held in a state where the substrate P is carried out from the substrate holders 40 and 140 by a predetermined amount (for example, about half of the above and the second embodiment). P may be carried out. In this case, the stroke in the X-axis direction of the suction pads 71, 171 on the substrate stage 20, 120, 220 side can be shortened.

  Further, the transfer (loading and unloading) of the substrate P performed between each of the substrate stages 20, 120, and 220 and the port unit 60 is, for example, a substrate as disclosed in US Pat. No. 6,559,928. A substrate support member that supports P from below may be used. Even in this case, the substrate P can be unloaded from the substrate stages 20, 120, and 220 in the same manner as in the first and second embodiments by driving the substrate support member using the substrate unloading devices 70, 170, and 270. . Moreover, although the board | substrate carrying-out apparatus 70, 170, 270 of the said 1st and 2nd embodiment hold | maintained the board | substrate P by vacuum suction, it hold | maintains not only this but another holding | maintenance (for example, mechanical holding). You may do it.

  In the first embodiment, the plurality of substrate lift devices 45 are arranged on the X coarse movement stage 23x. However, the present invention is not limited to this, and may be built in the substrate holder 40 or the fine movement stage 21. . Similarly, in the second embodiment, a plurality of substrate lift devices 145 may be incorporated in the substrate holder 140 or the fine movement stage 21.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). As the illumination light, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). In addition, harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. A solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

  In the first and second embodiments, the case where the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical units has been described. Not limited to this, it may be one or more. The projection optical system is not limited to a multi-lens type projection optical system, and may be a projection optical system using an Offner type large mirror, for example. In the above-described embodiment, the case where the projection optical system PL has an equal magnification is described. However, the present invention is not limited to this, and the projection optical system may be either a reduction system or an enlargement system.

  In the first and second embodiments, a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive mask substrate is used. Instead, for example, as disclosed in US Pat. No. 6,778,257, an electronic mask (variable) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. For example, a variable shaping mask using a DMD (Digital Micro-mirror Device) which is a kind of non-light-emitting image display element (also called a spatial light modulator) may be used.

  As an exposure apparatus, an exposure apparatus that exposes a substrate having a size (including at least one of an outer diameter, a diagonal length, and one side) of 500 mm or more, for example, a large substrate for a flat panel display such as a liquid crystal display element. It is particularly effective to apply to this.

  The exposure apparatus can also be applied to a step-and-repeat type exposure apparatus and a step-and-stitch type exposure apparatus. In the exposure apparatus, the object carried out by the carry-out apparatus is not limited to the substrate that is the object to be exposed, and may be a pattern holder (original) such as a mask.

  Further, the use of the exposure apparatus is not limited to a liquid crystal exposure apparatus that transfers a liquid crystal display element pattern onto a square glass plate. For example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, and a DNA chip The present invention can also be widely applied to an exposure apparatus for manufacturing the above. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern. The object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or mask blanks. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member).

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

  As described above, the exposure apparatus of the present invention is suitable for scanning exposure of an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display. The device manufacturing method of the present invention is suitable for manufacturing micro devices.

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal exposure apparatus, 20 ... Substrate stage, 23x ... X coarse movement stage, 23y ... Y coarse movement stage, 30 ... Apparatus main body, 40 ... Substrate holder, 45 ... Substrate lift device, 50 ... Y step surface plate, 54 ... Weight canceling device, 60 ... port portion, 61 ... substrate loading device, 62 ... substrate guide device, 70 ... substrate unloading device, 71 ... suction pad, 72 ... support member, 73 ... X linear guide device, 74 ... X linear motor.

Claims (21)

A scanning exposure apparatus that moves an object in the scanning direction with respect to an energy beam during exposure,
A first moving body movable in a first direction orthogonal to the scanning direction within a predetermined two-dimensional plane;
A second moving body movable on the first moving body in a second direction parallel to the scanning direction and movable in the first direction together with the first moving body;
Object holding provided to hold the object, disposed above the second moving body, and guided in a direction parallel to the predetermined two-dimensional plane integrally with the object by the movement of the second moving body Equipment,
An exposure apparatus comprising: an unloading device provided on the first moving body and driving the object in a predetermined unloading direction with respect to the object holding device.   The exposure apparatus according to claim 1, wherein the carry-out direction is the second direction.   The exposure apparatus according to claim 2, wherein the carry-out apparatus includes a holding member that holds the object and a driving device that drives the holding member in the second direction.   The drive device drives the holding member between a position overlapping the movable range of the second movable body on the first movable body and a position outside the movable range with respect to the second direction. The exposure apparatus according to claim 3.   The exposure apparatus according to claim 4, wherein the holding member is positioned outside the movable range at least during exposure. An object driving device for driving the object in a direction away from the object holding device;
The exposure apparatus according to claim 5, wherein the holding member is inserted between the object driven by the object driving device and the object holding device.   The object driving device extends along the second direction and can support the object from below, a region on one side and the other side of the center portion of the object holding device with respect to the first direction. The exposure apparatus according to claim 5, further comprising: a plurality of second members that are respectively provided and drive the first member in a direction intersecting the two-dimensional plane. The object driving device supports the object in a non-contact manner from below in a state where the object is separated from the object holding device,
The exposure apparatus according to claim 6 or 7, wherein the carry-out device drives the object supported in a non-contact manner by the object driving device in the second direction.   The exposure apparatus according to claim 8, wherein the object driving device jets gas from a surface facing the object to float the object.   The exposure apparatus according to any one of claims 6 to 9, wherein the carry-out device further includes a holding member driving device that drives the holding member in a direction in which the holding member approaches or separates from the object holding device in the two-dimensional plane. . An object driving device for driving the object in a direction intersecting the second direction with respect to the object holding device;
The exposure apparatus according to claim 3, wherein the holding member holds a portion of the object that protrudes from the object holding device when driven by the object driving device.   The exposure apparatus according to claim 11, wherein the object holding device jets gas from a surface facing the object to float the object when the object is driven in a carry-out direction.   The exposure apparatus according to claim 3, wherein the holding member sucks and holds the object.   The exposure apparatus according to claim 1, further comprising a minute drive system that minutely drives the object holding device in a direction of six degrees of freedom with respect to the second moving body.   15. The apparatus according to claim 1, further comprising a support device that is provided integrally with the object holding device so as to be movable in parallel with the predetermined two-dimensional plane, and that supports a central portion of the object holding device from below without contact. An exposure apparatus according to claim 1. A guide member extending in the second direction, supporting the support device from below, and defining a guide surface when the support device moves in the second direction;
The exposure apparatus according to claim 15, wherein the guide member moves in the first direction together with the support device in a state where the support device is supported from below. The second moving body guides the object from the exposure end position toward the exchange position where the object and another object are exchanged after the exposure is completed,
The exposure apparatus according to any one of claims 1 to 16, wherein the carry-out apparatus starts an object carry-out operation before the object reaches the exchange position.   The exposure apparatus according to claim 1, wherein the object is a substrate used in a flat panel display device.   The exposure apparatus according to claim 18, wherein the substrate has a length of at least one side of 500 mm or more. Exposing the object using the exposure apparatus according to claim 18 or 19,
Developing the exposed object. A method of manufacturing a flat panel display. Exposing the object using the exposure apparatus according to any one of claims 1 to 17,
Developing the exposed object.

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