JP4530352B2 - Substrate mounting device - Google Patents

Description

  The present invention relates to a substrate mounting apparatus for mounting a substrate on a stage, and more particularly to a substrate mounting apparatus used in an apparatus for applying an organic EL (electroluminescence) material or the like to a substrate.

  Conventionally, various apparatuses have been developed that place a substrate on a stage and perform predetermined processing on the substrate. For example, in an apparatus for manufacturing an organic EL display device, an organic EL material is applied to the main surface of a substrate such as a glass substrate placed on a stage. In general, the step of applying a predetermined process to the substrate and the step of loading / unloading the substrate onto / from the stage are often at different positions. In this case, the stage is configured to be movable. Then, the substrate is placed on the stage in the carry-in process, and the substrate placed on the stage in the carry-out process is delivered.

Here, when a substrate is placed on a stage using a transfer machine such as a robot or a substrate placed on the stage is removed, the substrate is temporarily lifted from the stage, and the transfer machine moves the lower surface of the substrate. It is necessary to make the side space accessible (for example, refer to Patent Document 1). In the method of delivering a photosensitive substrate in an exposure apparatus disclosed in Patent Document 1, a plurality of pins (spindle portions) that are loosely fitted to the opening of the stage are provided, and the pins protrude or retract from the stage surface on which the substrate is placed. Move the substrate on the stage up and down. The pin is supported by an expansion / contraction mechanism provided on the stage, and the pin protrudes / withdraws from the stage surface in accordance with the driving of the expansion / contraction mechanism. And when a stage moves to another process, it moves with the said pin and expansion-contraction mechanism provided in the said stage.
Japanese Patent Laid-Open No. 10-177942

  However, when an expansion / contraction mechanism for lifting the substrate on the stage is installed on the stage, wiring for supplying power to or controlling the expansion / contraction mechanism and piping for supplying air pressure are routed as the stage moves. Is required. Therefore, each time the stage moves, the wiring and piping are also subjected to stress such as pulling, so that the durability of the apparatus is lowered. Further, since the weight of the moving stage itself increases, the load on the moving mechanism for moving or rotating the stage increases, and the initial cost and running cost of the apparatus increase.

  In addition, the temperature of the stage itself may occur due to the treatment applied to the substrate. In this case, the temperature of the expansion / contraction mechanism installed on the stage also changes. However, in an expansion / contraction mechanism including a drive unit such as an air cylinder or a motor, a temperature limit is provided for the drive unit, and the processing on the substrate is limited by the limit.

  SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a substrate mounting apparatus that improves the durability of the apparatus and reduces the cost while achieving both the movement of the stage and the mechanism for lifting the substrate on the stage.

In order to achieve the above object, the present invention has the following features.
1st invention is a board | substrate mounting apparatus provided with a stage, a stage movement table, a turning part, a lift pin, a lift pin drive mechanism, a sensor, and a control part. The stage places the substrate on its upper surface and moves to a position where the substrate is unloaded or loaded . The stage moving table moves the stage horizontally. The turning unit rotates the stage with respect to the stage moving table. The lift pins are provided so as to be movable up and down with respect to the upper surface of the stage. Lift pin driving mechanism is fixed to a position for unloading or loading the substrate separately from the stage, when the stage is disposed at a position for unloading or loading the substrate, the lift pins is moved upward against the lift pins and those Project from the top of the stage. The sensor is provided in the lift pin drive mechanism, detects the position of the lift pin with respect to the lift pin drive mechanism, and detects that the lift pin is retracted downward from the upper surface of the stage . (A) When moving the stage to a position where the substrate is unloaded or loaded, the stage is moved to a position where the stage is unloaded or loaded by the stage moving table, and based on the detection result of the sensor, stage by rotating the stage by turning section such that in place of raising the lift pins to adjust the position of the stage, after which the stage is arranged at a predetermined position, to drive the lift pin driving mechanism Lift the lift pin . In addition, when the control unit (b) moves the stage from the position where the substrate is carried out or carried in , the stage is confirmed after confirming that the lift pins are retracted downward from the upper surface of the stage based on the detection result of the sensor. Is moved from the position where the substrate is unloaded or loaded .

  In a second aspect based on the first aspect, the substrate mounting apparatus further includes a stage moving table and a turning portion. The stage moving table moves the stage horizontally. The turning unit rotates the stage relative to the stage moving table. The control unit adjusts the position of the stage by controlling the operations of the stage moving table and the turning unit.

  In a third aspect based on the second aspect, the lift pin is provided on the lower surface of the stage. The lift pin drive mechanism is disposed in a space formed between the stage and the stage moving table when the stage is disposed at a predetermined position, and projects the lift pin from the upper surface of the stage by contacting the lowermost part of the lift pin. Let

  In a fourth aspect based on the first aspect, a plurality of lift pins are provided on the lower surface of the stage. The lift pin drive mechanism includes a vertical drive unit and a push-up plate. The vertical drive unit drives up and down according to the control of the control unit. The push-up plate is configured by a plate-like member having an area capable of coming into contact with all of the plurality of lift pins when the push-up plate is supported by the vertical drive unit and moves up and down.

  In a fifth aspect based on the first aspect, the lift pin is biased in a downward direction relative to the stage by a spring.

  In a sixth aspect based on the first aspect, the sensor detects the horizontal position of the lift pin relative to the lift pin drive mechanism and the position of the lift pin in the up-and-down direction.

  In a seventh aspect based on the first aspect, the stage has a heating mechanism for heating the substrate placed therein.

  According to the first aspect of the invention, the lift pin drive mechanism for driving the lift pins for lifting the substrate on the stage is configured separately from the stage on which the substrate is placed and moved, and the positional relationship between them is a sensor. Is detected by. Thereby, it is possible to fix and install wiring for supplying power to and controlling the lift pin drive mechanism and piping for supplying air pressure. Therefore, each time the stage moves, stress such as tension is not applied to the wiring and piping, and the durability of the apparatus is improved. Further, since the weight of the moving stage itself is reduced, the load on the moving mechanism for moving or rotating the stage is reduced, and the initial cost and running cost of the apparatus are reduced. Further, when the substrate is lifted from the stage by the lift pins, the position (direction) of the substrate in loading / unloading can be made the same because the position is adjusted using the output of the sensor.

  According to the second aspect, the stage on which the substrate is placed can be rotated as well as horizontally moved.

  According to the third aspect of the invention, the lift pins provided on the lower surface of the stage can be easily raised in the direction protruding from the stage without interfering with the mechanism for moving the stage.

  According to the fourth aspect, a plurality of lift pins can be moved up and down by one vertical drive unit. Further, the lift pin can be moved up and down by absorbing the shift in the positional relationship between the lift pin and the lift pin drive mechanism.

  According to the fifth aspect of the invention, since the lift pins are always urged in the direction of retreating from the upper surface of the stage, the lift pins can be prevented from protruding from the stage surface unless the lift pin drive mechanism raises the lift pins. In addition, the lift pins can be stably arranged even when the stage is moved away from the lift pin drive mechanism.

  According to the sixth aspect of the invention, since the position of the lift pin in the lifting / lowering direction can be detected, the abnormal lifting / lowering state of the lift pin can be detected, and the malfunction of the lift pin can be detected.

  According to the seventh aspect, the process of raising the temperature of the substrate placed on the stage of the substrate placing apparatus can be performed by the heating mechanism inside the stage. For example, a substrate coated with an organic EL material can be preheated on the stage surface when it is incorporated into a manufacturing apparatus for an organic EL display device. In such a case, the temperature of the stage itself rises and the temperature in the vicinity of the stage also rises, but since the lift pin drive mechanism is installed separately from the stage, the motor, air cylinder, etc. that make up the lift pin drive mechanism Even if a temperature restriction is provided, the temperature necessary for the heat treatment on the substrate is not restricted by the temperature restriction.

  Hereinafter, a substrate mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings. Typically, the substrate mounting apparatus is incorporated in an apparatus that places a substrate on the stage and performs a predetermined process on the substrate, but manufactures an organic EL display device to make the process specific. The following description will be given using an example incorporated in the apparatus. An apparatus for manufacturing an organic EL display device manufactures an organic EL display device by applying an organic EL material in a predetermined pattern shape on a glass substrate placed on a stage of the substrate placement device. FIG. 1 is a plan view and a front view showing a schematic configuration of a main part of a manufacturing apparatus of an organic EL display device in which the substrate mounting apparatus is incorporated.

  In FIG. 1, an organic EL display device manufacturing apparatus 1 generally includes a substrate mounting device 2 and an organic EL coating mechanism 5. The organic EL coating mechanism 5 includes a nozzle moving mechanism unit 51, a nozzle unit 52, and a liquid receiving unit 53. The nozzle moving mechanism 51 has a guide member 511 extending in the X-axis direction in the figure, and moves the nozzle unit 52 in the X-axis direction in the figure along the guide member 511. The nozzle unit 52 holds the nozzles 521 to 523 that discharge red, green, and blue organic EL materials in parallel. Red, green, and blue organic EL materials are supplied to the nozzles 521 to 523 from a supply unit (not shown).

  The substrate mounting device 2 includes a stage 21, a turning unit 22, a parallel movement table 23, a guide receiving unit 24, a guide member 25, and a pin mechanism 26. As will become apparent from the description below, the substrate mounting device 2 also includes a push-up plate 27 and a vertical drive unit 28 that are combined when moved to the loading / unloading process. The stage 21 places a substrate P such as a glass substrate to be coated on the upper surface of the stage. The lower part of the stage 21 is supported by the turning unit 22, and the stage 21 is configured to be rotatable in the θ direction shown in the figure by the turning operation of the turning unit 22. In addition, a heating mechanism is provided inside the stage 21 for preheating the substrate P coated with the organic EL material on the stage surface. The parallel movement table 23 corresponds to the stage movement table of the present invention. The stage 21 is provided with a plurality of pin mechanisms 26, and the detailed structure and operation will be described later.

  A guide member 25 is extended and fixed in the illustrated Y-axis direction perpendicular to the X-axis direction so as to pass under the organic EL coating mechanism 5. On the lower surface of the parallel movement table 23, a guide receiving portion 24 that is in contact with the guide member 25 and slides on the guide member 25 is fixed. In addition, the swivel unit 22 is fixed on the upper surface of the translation table 23. Accordingly, the parallel movement table 23 can be moved in the Y-axis direction along the guide member 25 by receiving a driving force from, for example, a linear motor (not shown), and the stage 21 supported by the turning unit 22 can be moved. Movement is also possible.

  When the substrate P is placed on the stage 21 and the parallel movement table 23 moves to the lower side of the organic EL coating mechanism 5, the substrates P apply nozzles 521 to 523 to apply red, green, and blue organic EL materials. It will be the position to receive from. Then, a control unit (not shown) controls the nozzle moving mechanism unit 51 so as to reciprocate the nozzle unit 52 in the X-axis direction, and performs parallel movement so that the stage 21 is moved by a predetermined amount in the Y-axis direction for each reciprocal movement. The table 23 is controlled to discharge a predetermined flow rate of the organic EL material from the nozzles 521 to 523. As a result, the organic EL material is applied in a stripe pattern to one main surface of the substrate P placed on the stage 21. It should be noted that at both X-axis direction discharge positions of the nozzles 521 to 523, in both side spaces deviating from the substrate P placed on the stage 21, a liquid receiving portion 53L that receives the organic EL material discharged out of the substrate P and 53R is installed.

  When the substrate placing apparatus 2 carries out the substrate P placed on the stage 21 or carries the substrate P onto the stage 21, the substrate placing apparatus 2 controls the control unit to the loading / unloading position along the guide member 25. Moving. Hereinafter, the substrate mounting device 2 and the pin mechanism 26 at the loading / unloading position will be described with reference to FIGS. FIG. 2A is a schematic front view showing the substrate mounting apparatus 2 in which the substrate P is mounted on the stage 21 at the loading / unloading position. FIG. 2B is a schematic front view showing the substrate platform 2 in which the substrate P is lifted from the stage 21 at the loading / unloading position. FIG. 3 is a schematic top view showing the substrate platform 2 in the carry-in / carry-out position. FIG. 4 is a schematic cross-sectional view showing the structure of the pin mechanism 26.

  2 and 3, a push-up plate 27 and a vertical drive unit 28 are installed at the loading / unloading position. When the substrate mounting device 2 moves to the carry-in / carry-out position, the push-up plate 27 is disposed in the lower space of the plurality of pin mechanisms 26.

  The vertical drive unit 28 includes an air cylinder, a motor, and the like, and is fixedly provided near the outside of the guide member 25 at the loading / unloading position (for example, two places on both sides) and supports the push-up plate 27. . And the vertical drive part 28 raises / lowers the thrust board 27 up and down according to the instruction | indication from the said control part. 2A shows a state in which the vertical drive unit 28 raises the push-up plate 27 to the uppermost position, and FIG. 2B shows a state in which the vertical drive unit 28 raises the push-up plate 27 to the lowermost position. It shows a lowered state. The vertical drive unit 28 and the push-up plate 27 correspond to the lift pin drive mechanism of the present invention.

  When the translation table 23 moves along the guide member 25 from another position to the loading / unloading position, the vertical drive unit 28 lowers the push-up plate 27 to the lowest position and stands by (FIG. 2A). . When the parallel movement table 23 moves to the carry-in / carry-out position at the lowest position, the push-up plate 27 is positioned in the lower space with respect to all the pin mechanisms 26 set at the lower part of the stage 21. It has a flat plate shape. For example, in the example shown in FIG. 3, the push-up plate 27 is disposed in the lower space of the six pin mechanisms 26 while avoiding contact with the swivel unit 22 when the translation table 23 moves to the loading / unloading position. It is formed with a U-shaped flat plate.

  The push-up plate 27 is provided with a pin confirmation sensor 271. The pin confirmation sensor 271 is a sensor that detects the position and state of the pin mechanism 26 when the pin mechanism 26 is disposed in the upper space of the push-up plate 27, and outputs the detection result to the control unit. For example, a plurality of pin confirmation sensors 271 are installed at positions corresponding to each of the plurality of pin mechanisms 26.

  After the parallel movement table 23 stops at the carry-in / carry-out position, each pin confirmation sensor 271 detects the position of the pin mechanism 26 with respect to the push-up plate 27, and the control unit performs a predetermined operation in which all the pin mechanisms 26 perform the ascending operation. It is determined whether or not it is placed at the position. When all the pin mechanisms 26 are arranged at predetermined positions, the control unit drives the vertical drive unit 28 to raise the push-up plate 27 (FIG. 2B).

  When the push-up plate 27 rises, it eventually comes into contact with the lower part of the pin mechanism 26. The pin mechanism 26 is applied with a force in a direction of being contracted by being pushed between the push-up plate 27 and the stage 21 by the driving force of the vertical drive unit 28. Due to this contraction force, the lower member 263 (see FIG. 4) of the pin mechanism 26 rises to the stage 21 side, and the pin 261 supported by the lower member 263 also rises and protrudes from the stage surface of the stage 21. When the pins 261 protrude from the stage surface of the stage 21 and rise, the substrate P placed on the stage 21 is lifted from the stage surface by the pins 261. When the substrate P is lifted from the stage 21, a space is formed between the substrate P and the stage 21, and a transfer machine (not shown) that removes the substrate P from the stage 21 accesses the space on the lower surface side of the substrate P. It becomes possible. In addition, when the transfer machine places the substrate P on the stage 21, the lower surface of the substrate P is temporarily brought into contact with the upper ends of the plurality of pins 261, so that the space on the lower surface side of the substrate P is reached. Can be evacuated.

  As shown in FIGS. 3 and 4, the stage 21 has openings 211 corresponding to the pins 261 of the plurality of pin mechanisms 26. The pin 261 of the pin mechanism 26 is loosely fitted in the opening 211.

  FIG. 4 shows the extended pin mechanism 26 and shows a cross-sectional view through the axis of the pin 261. The pin 261 corresponds to the lift pin of the present invention. The pin mechanism 26 includes a pin 261, a support member 262, a lower member 263, a compression spring 264, and a bush 265. The support member 262 has a vertical through hole formed at the center thereof, and is fixed to the lower surface of the stage 21 with the axes of the through hole and the opening 211 being aligned. A bush 265 is fixed to the through hole of the support member 262. The bush 265 has a pin 261 inserted through the sliding hole, and functions as a linear motion bearing for the pin 261. A lower member 263 is fixed to the lower end of the pin 261. A compression spring 264 is installed between the support member 262 and the lower member 263. The compression spring 264 always urges the lower member 263 downward with respect to the support member 262. Accordingly, when the pin mechanism 26 is in the extended state, the pin 261 is disposed at the lowest position, and the upper end of the pin 261 is retracted into the opening 211 of the stage 21.

  When the push-up plate 27 rises with a driving force equal to or greater than the urging force of the compression spring 264, the compression spring 264 contracts and is guided by the bush 265 to raise the pin 261. Then, the upper end of the pin 261 protrudes from the stage surface of the stage 21. When the push-up plate 27 is lowered from the state where the pin 261 protrudes from the stage surface, the pin 261 is lowered by the urging force of the compression spring 264. Then, the upper end of the pin 261 retracts into the opening 211 of the stage 21. In addition to the position of the pin mechanism 26, the pin confirmation sensor 271 detects such a state of the pin mechanism 26 (that is, whether or not the pin mechanism 26 is in an extended state) based on a distance from the lower member 263. be able to.

  Next, with reference to FIG. 5, operation | movement of the board | substrate mounting apparatus 2 at the time of mainly carrying in / carrying out the board | substrate P is demonstrated. FIG. 5 is a flowchart showing the operation of the substrate platform 2.

  In FIG. 5, the control unit determines whether the substrate P is carried into the organic EL display device manufacturing apparatus 1 or whether the substrate P is unloaded from the organic EL display device manufacturing apparatus 1 (step S <b> 81). And when carrying in or carrying out a board | substrate, a control part advances a process to following step S82. On the other hand, when neither carrying in nor carrying out the substrate, the control unit ends the processing according to the flowchart.

  In step S <b> 82, the control unit moves the parallel movement table 23 along the guide member 25 to the loading / unloading position. Then, the control unit waits for the pin mechanism 26 to be arranged at a predetermined position where the ascending operation is performed based on the output from the pin confirmation sensor 271 (step S83). In addition, after the board | substrate P is carried in on the stage 21, in order to adjust the direction which apply | coats organic EL material to the said board | substrate P, the rotation angle of the turning part 22 may be adjusted. In this case, since the angle of the stage 21 at the time of loading is different from the angle of the stage 21 at the time of unloading, it becomes difficult for the transfer machine to access the substrate P placed on the stage 21 as it is. In order to prevent such a problem, the substrate mounting apparatus 2 adjusts the position so that the angle θ and the position of the stage 21 during loading and unloading are the same. In step S <b> 83, the position confirmation for such loading / unloading and the position confirmation for pushing up the pin mechanism 26 are performed using the pin confirmation sensor 271. When the pin mechanism 26 is not disposed at the predetermined position even after the translation table 23 has moved to the carry-in / carry-out position, the control unit adjusts the rotation angle θ of the swivel unit 22 to adjust the pin mechanism 26 to the predetermined position. To be placed in.

  After the pin mechanism 26 is arranged at a predetermined position where the ascending operation is performed (Yes in Step S83), the control unit drives the vertical drive unit 28 in the ascending direction to raise the push-up plate 27 (Step S84). When the push-up plate 27 rises, it eventually comes into contact with the lower member 263 of the pin mechanism 26 (step S85). Then, the lower member 263 of the pin mechanism 26 rises to the stage 21 side, the pin 261 supported by the lower member 263 also rises, and the pin 261 protrudes from the stage surface of the stage 21 (step S86). At this time, since the push-up plate 27 pushes up the lower members 263 of all the pin mechanisms 26, when all the pins 261 protrude from the stage surface of the stage 21 and the substrate P is placed on the stage 21, The substrate P is lifted by a plurality of pins 261.

  Next, the control unit stops driving the vertical drive unit 28 and stops the raising of the push-up plate 27 (step S87). Then, the transfer machine accesses the space between the substrate P lifted by the pins 261 and the stage 21 and unloads the substrate P (step S88). In addition, this operation | movement is abbreviate | omitted when the apply | coated substrate P is not mounted in the substrate mounting apparatus 2. FIG. Next, the transfer machine newly carries the substrate P before coating into the manufacturing apparatus 1 of the organic EL display device, and the lower surface of the substrate P and the upper ends of the plurality of pins 261 protruding from the stage 21. The substrate P is delivered in a state where it is in contact (step S89). After completing the loading of the substrate P, the control unit drives the vertical drive unit 28 in the downward direction to lower the push-up plate 27. By this operation, all the pins 261 are retracted into the opening 211 of the stage 21, and the substrate P is placed on the stage 21 (step S90). At this time, the control unit confirms that all the pins 261 have been retracted from the stage surface based on the output from the pin confirmation sensor 271. Then, the control unit moves the parallel movement table 23 along the guide member 25 in order to move the stage 21 on which the substrate P is placed to another process (step S91), and ends the process according to the flowchart.

  As described above, the substrate mounting apparatus according to the present embodiment is configured such that the vertical drive unit for lifting the substrate on the stage is separate from the stage and the parallel movement table that place and move the substrate to another process. These positional relationships are detected by sensors. As a result, it is possible to fix and install wiring for supplying and controlling power to the vertical drive unit and piping for supplying air pressure. Therefore, each time the stage moves, stress such as tension is not applied to the wiring and piping, and the durability of the apparatus is improved. Further, since the weight of the moving stage itself is reduced, the load on the moving mechanism for moving or rotating the stage is reduced, and the initial cost and running cost of the apparatus are reduced. Further, when the substrate is lifted from the stage, the position (direction) of the substrate in loading / unloading can be made the same because the position adjustment is performed using the output of the sensor.

  In addition, when the substrate mounting device is incorporated in a manufacturing apparatus for an organic EL display device, there is a heating mechanism for preheating the substrate on which the organic EL material has been applied on the stage surface as described above. Provided. In such a case, the temperature of the stage itself increases and the temperature near the stage also increases. However, since the vertical drive unit is installed separately from the stage, even if a temperature limit is provided for the motor or air cylinder of the vertical drive unit, the temperature limit can be used to preheat the substrate. The required temperature is not limited.

  In the above description, the position where the substrate is loaded into the substrate platform and the position where the substrate is unloaded from the substrate platform are shared, and the unloading and loading are performed continuously. You can go in the position. In that case, the push-up plate and the vertical drive unit may be provided at each of the carry-out and carry-in positions, or the push-up plate and the vertical drive unit may be provided only at one of the positions where the substrate needs to be lifted from the stage. .

  In the above-described embodiment, the case where the substrate mounting device is incorporated into the manufacturing apparatus of the organic EL display device is described as an example. However, if the device is a device that performs processing on the substrate mounted on the stage, It goes without saying that the substrate mounting apparatus of the present invention can be incorporated into another apparatus.

  In the above description, an example in which a stage for placing a substrate is linearly moved in one direction (Y-axis direction) and rotated (θ) in one direction is used. However, the stage to which the present invention is applicable can be used. The movement is not limited to these. For example, the stage may be movable in two directions (that is, the X and Y axis directions), or may be configured to be rotatable in a plurality of directions.

  The substrate mounting apparatus according to the present invention is capable of fixing and installing a wiring for supplying and controlling power to a vertical driving unit for lifting a substrate on a stage and a pipe for supplying air pressure. It can also be applied to applications such as mounting in a device that places a substrate on a stage and performs predetermined processing on the substrate.

The top view and front view which show the principal part schematic structure of the manufacturing apparatus of the organic electroluminescent display apparatus with which the substrate mounting apparatus which concerns on one Embodiment of this invention was integrated. FIG. 1 is a schematic front view showing the substrate platform 2 in the loading / unloading position of FIG. FIG. 1 is a schematic top view showing the substrate platform 2 in the loading / unloading position of FIG. Schematic cross-sectional view showing the structure of the pin mechanism 26 of FIG. 1 is a flowchart showing the operation of the substrate mounting apparatus 2 of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Manufacturing apparatus 2 of organic EL display apparatus ... Substrate mounting apparatus 21 ... Stage 211 ... Opening part 22 ... Turning part 23 ... Parallel movement table 24 ... Guide receiving part 25, 511 ... Guide member 26 ... Pin mechanism 261 ... Pin 262 ... support member 263 ... lower member 264 ... compression spring 265 ... bush 27 ... push-up plate 271 ... pin confirmation sensor 28 ... vertical drive part 5 ... organic EL coating mechanism 51 ... nozzle moving mechanism part 52 ... nozzle units 521, 522, 523 ... Nozzle 53 ... Liquid receiver

Claims (7)

Placing the substrate on its upper surface, a stage for moving to a position for unloading or loading the substrate,
A stage moving table for horizontally moving the stage;
A revolving part for rotating the stage with respect to the stage moving table;
Lift pins provided to be movable up and down with respect to the upper surface of the stage;
Separately from the stage, it is fixed at a position where the substrate is carried out or carried in, and when the stage is arranged at a position where the substrate is carried out or carried in , the lift pin is brought into contact with the lift pin and raised. A lift pin drive mechanism that protrudes from the upper surface of the stage;
A sensor provided in the lift pin drive mechanism for detecting the position of the lift pin relative to the lift pin drive mechanism and detecting that the lift pin is retracted downward from the upper surface of the stage ;
(A) When the stage is moved to a position where the substrate is unloaded or loaded, the stage is moved to a position where the stage is unloaded or loaded by the stage moving table, and the detection result of the sensor is obtained. Based on this, the stage is adjusted by rotating the stage so that the stage is arranged at a predetermined position for raising the lift pin, and the stage is arranged at the predetermined position . Later, when the lift pin drive mechanism is driven to raise the lift pin , and (b) when the stage is moved from a position where the substrate is unloaded or loaded, the lift pin is retracted downward from the upper surface of the stage. the stage that is after confirming based on the detection result of the sensor Oh unloading the substrate There is a control unit that moves from a position for loading, substrate mounting device. The substrate mounting apparatus includes:
A stage moving table for horizontally moving the stage;
A swivel unit that rotates the stage with respect to the stage moving table;
The substrate mounting apparatus according to claim 1, wherein the control unit adjusts the position of the stage by controlling operations of the stage moving table and the turning unit. The lift pin is provided on the lower surface of the stage,
The lift pin driving mechanism is disposed in a space formed between the stage and the stage moving table when the stage is disposed at the predetermined position, and comes into contact with the lowermost part of the lift pin to thereby lift the lift pin. The substrate mounting apparatus according to claim 2, wherein the substrate is projected from an upper surface of the stage. A plurality of the lift pins are provided on the lower surface of the stage,
The lift pin drive mechanism is
A vertical drive unit that drives up and down according to the control of the control unit;
2. The substrate mounting according to claim 1, further comprising: a push-up plate configured by a plate-like member having an area that can be brought into contact with all of the plurality of lift pins when lifted up and down supported by the vertical drive unit. Device.   The substrate mounting apparatus according to claim 1, wherein the lift pin is biased in a downward direction with respect to the stage by a spring.   The substrate mounting apparatus according to claim 1, wherein the sensor detects a position of the lift pin in a horizontal direction with respect to the lift pin drive mechanism and a position of the lift pin in the up-and-down direction.   The substrate mounting apparatus according to claim 1, wherein the stage has a heating mechanism that heats a substrate placed therein.

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