KR102206141B1 - Exposure method, method for manufacturing flat-panel display, and method for manufacturing device - Google Patents

Abstract

In the exposure method, the upper surface of the mask M having the mask pattern is opposed to the lower surface of the mask air guide 40, the mask M is suspended and supported by the mask air guide 40 in a non-contact manner, and the mask The mask M suspended by the air guide 40 is held by the mask holding device 60, and the mask M is moved in the scanning direction with respect to the exposure illumination light using the mask holding device 60. Together, it includes driving the substrate, which is an object to be exposed, in the scanning direction with respect to the illumination light for exposure, and transferring the mask pattern to the substrate.

Description

An exposure method, a manufacturing method of a flat panel display, and a device manufacturing method TECHNICAL FIELD [EXPOSURE METHOD, METHOD FOR MANUFACTURING FLAT-PANEL DISPLAY, AND METHOD FOR MANUFACTURING DEVICE]

The present invention relates to an exposure method, a manufacturing method of a flat panel display, and a device manufacturing method, and more particularly, an exposure method in which a pattern holder is moved relative to an energy beam in a scanning direction, and a flat panel using the exposure method. It relates to a method for manufacturing a panel display, and a device manufacturing method using the exposure method.

Conventionally, in the lithography process of manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements (integrated circuits), masks (photomasks) or reticles (hereinafter, collectively referred to as ``masks''), glass plates, or Step-and-scan exposure apparatus for transferring a pattern formed on a mask onto a substrate using an energy beam while synchronously moving a wafer (hereinafter, referred to as a ``substrate'') along a predetermined scanning direction (scan direction) (The so-called scanning stepper (also called a scanner)) is used.

In this type of exposure apparatus, a mask stage apparatus that controls the position of the mask by performing position control of a frame-shaped member (referred to as a mask holder or the like) that attracts and holds the end of the mask has been used ( For example, see Patent Document 1).

Here, with the recent increase in the size of the substrate, the mask also tends to increase in size. As a result, there is a possibility that the exposure accuracy of warpage (or vibration) caused by the self-weight of the mask may be affected.

US Patent Application Publication No. 2008/0030702 Specification

The present invention was made under the circumstances described above, and from a first point of view, the upper surface of the pattern holder having a predetermined pattern and the pattern holder being suspended from the upper side in the gravitational direction from the upper side of the support member capable of supporting Opposing the lower surface, non-contacting suspension of the pattern holder to the support member, holding the pattern holder suspended by the support member to a holding member capable of holding the pattern holder, Using the holding member, the pattern holder is moved in the scanning direction in at least a predetermined two-dimensional plane with respect to the energy beam, and the object to be exposed is driven in the scanning direction with respect to the energy beam to expose the pattern. Transfer to a target object and release of the holding of the pattern holding body by the holding member while the suspension support of the pattern holding body by the support member is maintained, and release of holding by the holding member It is an exposure method comprising separating an upper surface of the pattern holder and a lower surface of the support member.

According to this, when the pattern holder moves relative to the energy beam, the upper surface thereof is suspended and supported by the support member in a non-contact manner, so that warping (or vibration) is suppressed. In addition, in a state in which the pattern holder is suspended and supported by the support member, the holding of the pattern holder by the holding member and the holding thereof are released, for example, when the pattern holder is directly transferred to the holding member, and Compared to the case where the pattern holder is directly recovered from the member, the replacement operation of the pattern holder is simplified.

In the second aspect, the present invention provides a method for manufacturing a flat panel display including exposing the object to be exposed using the exposure method according to the first aspect of the present invention and developing the exposed object to be exposed. to be.

The present invention is a device manufacturing method comprising exposing the exposed object using the exposure method according to the first aspect of the present invention and developing the exposed object to be exposed from a third viewpoint.

1 is a diagram schematically showing a configuration of a liquid crystal exposure apparatus according to a first embodiment.
2 is a side view (partial cross section) of the liquid crystal exposure apparatus.
3 is a front view of a mask stage device included in the liquid crystal exposure device of FIG. 1.
FIG. 4 is a view (a view of the mask stage device viewed from above) taken along the line AA in FIG. 3.
Fig. 5 is a view (a view of the mask stage device viewed from below) taken along the line BB in Fig. 3;
6(A) and 6(B) are diagrams (Parts 1 and 2) for explaining the operation of the mask loader device at the time of carrying in the mask.
7(A) to 7(C) are diagrams (Parts 1 to 3) for explaining the operation of the mask stage device at the time of carrying in the mask.
8(A) and 8(B) are diagrams (Parts 1 and 2) for explaining the operation of carrying in a mask using the mask loader device according to the second embodiment.
9(A) and 9(B) are diagrams (Parts 3 and 4) for explaining the operation of carrying in a mask using the mask loader device according to the second embodiment.
10(A) and 10(B) are diagrams (Parts 5 and 6) for explaining the operation of carrying in a mask using the mask loader device according to the second embodiment.

<< first embodiment >>

Hereinafter, a first embodiment will be described based on Figs. 1 to 7(C).

In Fig. 1, a configuration of a liquid crystal exposure apparatus 10 according to a first embodiment is schematically shown. The liquid crystal exposure apparatus 10 is, for example, a step of making a rectangular (rectangular) glass substrate P (hereinafter simply referred to as a substrate P) used in a liquid crystal display device (flat panel display) as an object to be exposed. It is an and-scan type projection exposure apparatus, a so-called scanner.

The liquid crystal exposure device 10 includes an illumination system 12, a mask stage device 14 holding a light-transmitting mask M, a projection optical system 16, a device main body 18, and a surface (+Z side in FIG. 1 ). A substrate stage device 20 holding a substrate P coated with a resist (sensitizer) on the surface facing toward ), a mask loader device 90 (not shown in Fig. 1; see Fig. 2), and a control system thereof, etc. Has. Hereinafter, the direction in which the mask M and the substrate P are respectively scanned relative to the projection optical system 16 at the time of exposure is the X axis direction, and the direction perpendicular to the X axis in the horizontal plane is the Y axis direction and the X axis. And the direction orthogonal to the Y-axis as the Z-axis direction, and the rotational directions around the X-axis, Y-axis, and Z-axis as θx, θy, and θz directions, respectively. In addition, the X-axis, Y-axis, and Z-axis directions are described as X-position, Y-position, and Z-position, respectively.

The illumination system 12 is configured in the same manner as the illumination system disclosed, for example, in US Patent No. 5,729,331 specification. The illumination system 12 transmits light emitted from a light source (for example, a mercury lamp) not shown through a reflector, a dichroic mirror, a shutter, a wavelength selection filter, various lenses, etc., respectively, to obtain illumination light for exposure ( Illumination light) It irradiates to the mask M as IL. As illumination light (IL), for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm) (or synthetic light of the i-line, g-line, and h-line) Is used.

The illumination system 12 (an illumination system unit including the above various lenses, etc.) is supported by the illumination system frame 30 installed on the floor 11 of the clean room. The illumination system frame 30 has a plurality of leg portions 32 (in FIG. 1 overlapping in the direction of the inside of the paper), and an illumination system support portion 34 supported by the plurality of leg portions 32.

The mask stage device 14 drives the mask M with respect to the illumination system 12 (illumination light IL) in the X-axis direction (scan direction) with a predetermined long stroke, and the Y-axis direction, And an element for fine driving in the θz direction. The mask M is made of, for example, a planar view of a rectangular plate-like member formed of quartz glass, and a predetermined circuit pattern (mask pattern) is formed on the surface (lower surface) facing the -Z side in FIG. 1. Is formed. On the lower surface of the mask M, as shown in FIG. 3, in order to protect the mask pattern, a dustproof film called a pellicle Pe is attached. Here, at both ends of the lower surface of the mask M in the width direction (Y-axis direction), regions in which the mask pattern is not formed (hereinafter referred to as a blank region) are formed. For this reason, the width direction dimension of the pellicle Pe is set shorter than the width direction dimension of the mask M. The detailed configuration of the mask stage device 14 will be described later.

Returning to FIG. 1, the projection optical system 16 is disposed below the mask stage device 14. The projection optical system 16 is a so-called multi-lens projection optical system having the same configuration as the projection optical system disclosed in, for example, U.S. Patent No. 6,552,775, and is, for example, a two-sided telecentric equal magnification system. ) Is provided with a plurality of projection optical systems.

In the liquid crystal exposure apparatus 10, when the illumination region on the mask M is illuminated by the illumination light IL from the illumination system 12, the illumination light passing through the mask M causes the illumination light to pass through the projection optical system 16. A projection image (partial erect image) of the circuit pattern of the mask M in the illumination region is formed in the irradiation region (exposure region) of illumination light conjugated to the illumination region on the substrate P. Then, the mask M moves relative to the illumination region (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure region (illumination light IL) in the scanning direction, so that the substrate ( One shot region on P) is subjected to scanning exposure, and the pattern formed on the mask M is transferred to the shot region.

The apparatus main body 18 supports the projection optical system 16 and is provided on the floor 11 via a plurality of vibration isolating devices 19. The apparatus main body 18 is configured in the same manner as the apparatus main body disclosed in, for example, U.S. Patent Application Publication No. 2008/0030702, and includes an upper mount portion 18a, a lower mount portion 18b, and And a pair of middle mount portions 18c. The apparatus main body 18 is arranged vibratingly separated from the illumination system frame 30. Thus, the projection optical system 16 and the illumination system 12 are vibratingly separated.

The substrate stage device 20 includes a base 22, an XY coarse motion stage 24, and a fine motion stage 26. The base 22 is made of a rectangular plate-like member in plan view (viewed from the +Z side), and is integrally mounted on the lower mount portion 18b. The XY coarse motion stage 24 is a so-called gantry type that combines, for example, an X coarse motion stage movable with a predetermined long stroke in the X-axis direction and a Y coarse motion stage movable with a predetermined long stroke in the Y-axis direction. It is a two-axis stage device (X and Y coarse motion stages are not shown).

The fine moving stage 26 is made of a rectangular plate (or box-shaped) member in plan view, and includes a substrate holder for adsorbing and holding the lower surface of the substrate P. The fine moving stage 26 is mounted on the base 22 via a weight canceling device (not shown in Fig. 1) disclosed in, for example, US Patent Application Publication No. 2010/0018950. The fine moving stage 26 is guided (guided) to the XY coarse moving stage 24, so that the projection optical system 16 (illumination light IL) is in the X-axis direction and/or the Y-axis direction with a predetermined long stroke. Move.

The positional information of the fine moving stage 26 in the Y-axis direction is obtained by a Y laser interferometer 28y fixed to the apparatus body 18 using a Y bar mirror 27y fixed to the fine moving stage 26, The Y position control of the substrate P is performed based on the output of the Y laser interferometer 28y. In addition, as shown in FIG. 2, the positional information of the fine moving stage 26 in the X-axis direction uses the X-bar mirror 27x fixed to the fine moving stage 26, and is an interferometer column which is a part of the apparatus main body 18. It is calculated|required by the X laser interferometer 28x fixed to (18d), and X position control of the board|substrate P is implemented based on the output of the X laser interferometer 28x. A plurality of Y laser interferometer 28y and X laser interferometer 28x are formed, respectively, and information on the amount of rotation of the substrate P in the θz direction can be obtained. Further, if the substrate P can be driven with a predetermined long stroke at least in the X-axis (scan) direction so as to synchronize with the mask M held by the mask stage device 14, the configuration of the substrate stage device 20 Silver is not particularly limited.

The mask loader device 90 is installed on the floor 11 on the -X side of the device main body 18 as shown in FIG. 2. The mask loader device 90 includes a mask stocker 92 that stores a plurality of masks M, and a mask transfer device 94 that transfers the mask M from the mask stocker 92 to the mask stage device 14 It is equipped with. The mask stocker 92 holds a plurality of masks M at predetermined intervals in the vertical direction. In addition, although illustration is omitted in FIG. 2, the pellicle Pe (refer FIG. 3) is attached to each of the plurality of masks M stored in the mask stocker 92 in advance. The mask conveying device 94 transfers the mask M between the conveying table 94a, the lifting device 94b for vertically moving the conveying table 94a, the conveying table 94a, and the mask stocker 92. It is provided with a pair of slide members 94c (only one is shown in FIG. 2) to implement.

The conveyance table 94a is made of a rectangular plate-like member when viewed from a plan view, which has an external shape set slightly larger than that of the mask M. The lifting device 94b has, for example, a uniaxial actuator such as an air cylinder, and moves the mask M supported by the transfer table 94a up and down. As shown in FIG. 7(A), the pair of slide members 94c are arranged so as to be spaced apart in the Y-axis direction, and one is on the +Y side end vicinity of the transfer table 94a, and the other is the transfer table. Each of them is mounted on the vicinity of the end portion on the -Y side of 94a via a mechanical X linear guide device 94d disclosed in, for example, US Patent No. 6,761,482. Each of the pair of slide members 94c is made of a member extending in the X-axis direction of an L-shaped YZ cross section, and is arranged symmetrically on the surface of each other. The pair of slide members 94c are in the Y-axis direction so as to be able to support the vicinity of each end portion (margin area) on the +Y side and -Y side of the mask M from below without contacting the pellicle Pe. The interval is set. Each of the pair of slide members 94c is synchronously driven with a predetermined stroke in the X-axis direction with respect to the transfer table 94a by an X actuator (not shown).

When carrying in the mask M, in the mask conveying device 94, as shown in FIG. 2, it conveys so that a pair of slide members 94c can be inserted under the desired (transport target) mask M. The position of the Z position of the table 94a is determined, and in that state, a pair of slide members 94c are inserted under the desired mask M, and the mask M is a slide member from the mask stocker 92 It is transferred to (94c). When returning the mask M from the mask conveying device 94 to the mask stocker 92, an operation opposite to the above is performed. The transfer operation of the mask M between the mask loader device 90 and the mask stage device 14 will be described later. In addition, the configuration of the device for storing the plurality of masks M and the configuration of the device for conveying the mask M are not limited to this, and can be appropriately changed. For example, the mask conveying device is a multi-joint It may be a robot arm or the like. Moreover, the mask loader device 90 may be formed outside the liquid crystal exposure device 10.

Next, the configuration of the mask stage device 14 will be described. As shown in FIG. 3, the mask stage device 14 includes a mask air guide 40, a pair of base plates 50, and a pair of mask holding devices 60.

The mask air guide 40 is suspended and supported by the mask air guide support frame 18e. The mask air guide support frame 18e is supported by the upper mount portion 18a via a plurality of leg portions 18f. Therefore, the mask air guide 40 is vibratingly separated from the illumination system 12 (not shown in Fig. 3, see Fig. 1).

The mask air guide 40 has a body portion 42 consisting of a thin box-shaped member extending in the X-axis direction and a porous member 44 formed in a plate shape extending in the X-axis direction. The porous member 44 is fitted into a recess formed in the lower surface of the main body 42. The mask M is disposed so that its upper surface (the surface opposite to the pattern surface) faces the lower surface of the porous member 44. The dimension in the longitudinal direction of the porous member 44 is set longer than the dimension in the longitudinal direction (X axis direction) of the mask M, and in the exposure operation, the upper surface of the mask M is always a porous member ( 44) It faces the lower side of.

On the lower surface of the porous member 44, a plurality of minute holes are formed over almost the entire surface. The mask air guide 40 is connected to a pressurized gas supply device (not shown) provided outside the mask stage device 14 and a vacuum device. The mask air guide 40 sucks the gas between the lower surface of the porous member 44 and the upper surface of the mask M through a part of the plurality of holes of the porous member 44 to cause a levitation force on the mask M. While applying (force in the +Z direction), pressurized gas is blown onto the upper surface of the mask M through the other portions of the plurality of holes, so that between the lower surface of the porous member 44 and the upper surface of the mask M A minute clearance (for example, 5 to 10 µm) is formed. That is, the mask air guide 40 functions as a so-called vacuum preload air bearing. Further, the mask air guide 40 may always eject and suck gas from the entire surface, or may partially eject and suck the gas only in a region facing the upper surface of the mask M.

In addition, as shown in FIG. 2, in the position immediately below the illumination system 12 in the mask air guide 40, an opening 46 opening to each of the upper and lower surfaces of the mask air guide 40 is provided. Is formed. As shown in Fig. 5, the opening 46 is formed in a rectangular shape when viewed in a plane with the Y-axis direction as the longitudinal direction, and the illumination light IL emitted from the illumination system 12 (respectively omitted in Fig. 5). 1) passes through the openings 46 and is irradiated to the mask M. Moreover, the shape of the opening part 46 is not specifically limited, For example, it can change suitably according to the shape of the illumination area on the mask M (for example, it may be circular).

Here, as shown in FIG. 2, in the mask air guide 40, the opening 46 is formed slightly on the +X side than the central portion in the X-axis direction. And in the mask air guide 40, a region on the +X side of the opening 46 and a partial region on the -X side of the opening 46 guide the mask M during the exposure operation (hereinafter, these The region is referred to as an exposure region), and the region on the -X side of the exposure region (in Fig. 2, the region protruding toward the -X side from the interferometer column 18d) is used only during the operation of exchanging the mask M. (Hereinafter referred to as a mask exchange area). The lifting device 94b of the mask loader device 90 described above is disposed immediately below the mask exchange area.

The pair of base plates 50 is made of a plate-like member arranged parallel to the XY plane and extending in the X-axis direction, and as shown in FIG. 4, one side is +Y of the mask air guide 40 in a plan view. It is disposed on the side, and the other is disposed on the -Y side of the mask air guide 40 in plan view. Each of the pair of base plates 50 is supported by a mask stage support frame 36 fixed to a plurality of leg portions 32 of the illumination system frame 30 as shown in FIG. 1 (see FIG. 2 ). ), the device body 18, and the substrate stage device 20 are separated from each other by vibrating. In addition, in the present embodiment, the pair of base plates 50 are supported by the illumination system frame 30, but are vibratingly separated from each other with respect to the apparatus main body 18 and the substrate stage apparatus 20 It may be mounted on another mount provided on the furnace floor 11.

On the upper surface of the base plate 50, as shown in FIG. 4, a plurality of (in this embodiment, for example, two) X linear guides 52a are fixed at predetermined intervals in the Y-axis direction. In addition, as the upper surface of the base plate 50, in a region between, for example, two X linear guides 52a, an X magnet unit 54a including a plurality of permanent magnets arranged in the X axis direction is fixed. .

The pair of mask holding apparatuses 60 are mounted on a base plate 50 on the +Y side and the other on a base plate 50 on the -Y side, respectively. Since the pair of mask holding devices 60 are of the same configuration, except that one is rotated 180° around the Z axis with respect to the other, except for a case specifically described below, + The mask holding device 60 on the Y side will be described. As shown in FIG. 3, the mask holding device 60 is, as shown in FIG. 3, the inside of the ground of the X table 62, the X voice coil motor 64X, and the Y voice coil motor 64Y (in FIG. 3, the X voice coil motor 64X). (Refer to the mask holding device 60 on the -Y side), an adsorption holding part 66, and an air cylinder 68a.

The X table 62 is made of a rectangular plate-like member as viewed from a plane arranged parallel to the XY plane. On the lower surface of the X table 62, two X slide members 52b (overlapping in the paper-inward direction in Fig. 3) are fixed to one X linear guide 52a. The X slide member 52b is formed in a YZ cross-sectional inverse U shape, and together with the corresponding X linear guide 52a, a mechanical X linear guide device 52 disclosed in, for example, U.S. Patent No. 6,761,482 It constitutes. Further, on the lower surface of the X table 62, an X coil unit 54b is fixed to the X magnet unit 54a to face each other through a predetermined clearance. The X coil unit 54b together with the X magnet unit 54a constitutes the X linear motor 54 disclosed in, for example, US Patent No. 8,030,804.

The X table 62 is driven linearly on the base plate 50 in the X-axis direction via an X table drive system including an X linear motor 54. Further, the type of the X actuator for driving the X table 62 in the X axis direction is not particularly limited, and includes, for example, a screw portion fixed to the base plate 50 and a nut portion fixed to the X table 62 A transfer screw device, a belt (or rope, etc.) drive device or the like can be used. The X position information of the X table 62 is obtained by a linear encoder system (or optical interferometer system) not shown.

X voice coil motor 64X (in Fig. 3, the X voice coil motor 64X of the mask holding device 60 on the -Y side is hidden inside the ground of the Y voice coil motor 64Y. See Fig. 4) ) Includes a stator part 64a fixed to the upper surface of the X table 62 via a mounting plate 63, and a movable part 64b fixed to the slide member 66b of the suction holding part 66 do. The mover portion 64b is formed in a U-shaped YZ cross section, and a stator portion 64a is inserted between a pair of opposed surfaces. The mover part 64b has a magnet unit on a pair of opposing surfaces, for example, and the stator part 64a has a coil unit, for example. The direction and magnitude of the current supplied to the coil unit are controlled by a main control device, not shown. The mask holding device 60 uses the Lorentz force in the X-axis direction acting between the magnet unit of the X voice coil motor 64X and the coil unit, so that the slide member 66b of the suction holding unit 66 is moved to the X table ( 62) can be driven with a small stroke in the X-axis direction. Further, the mask holding device 60 can guide the suction holding portion 66 so as to move in the X-axis direction integrally with the X table 62 by using the Lorentz force.

Y voice coil motor 64Y (in Fig. 3, the Y voice coil motor 64Y of the mask holding device 60 on the +Y side is hidden inside the ground of the X voice coil motor 64X. See Fig. 4) ) Is the same configuration as that of the X voice coil motor 64X, except that the direction of the driving force (thrust) to be generated is different, so the description is omitted. The mask holding device 60 uses the Lorentz force in the Y-axis direction acting between the magnet unit of the Y voice coil motor 64Y and the coil unit, so that the slide member 66b of the suction holding unit 66 is moved to the X table ( 62) can be driven with a small stroke in the Y-axis direction. Further, in this embodiment, although the X voice coil motor 64X and the Y voice coil motor 64Y are arranged separately, the Lorentz force in the X-axis direction and/or the Y-axis direction can be arbitrarily generated. A two-degree of freedom voice coil motor may be used.

The adsorption holding part 66 has an adsorption pad 66a, a slide member 66b, and a tube bearing 66c. In this embodiment, two suction pads 66a are formed, for example, at predetermined intervals in the X-axis direction with respect to one mask holding device 60 as shown in FIG. 4. The number of (66a) is not limited to this, for example, it can be appropriately changed according to the size of the mask M. Returning to FIG. 3, the adsorption pad 66a is made of an approximately L-shaped member in the YZ cross section, and one end is disposed to protrude toward the mask M side from the base plate 50. In the mask M, the above-described blank region (region in which the mask pattern is not formed) is supported from below by the suction pad 66a. A vacuum device disposed outside the mask stage device 14 is connected to the suction pad 66a, and the mask M can be sucked and held using the vacuum suction force supplied from the vacuum device.

The slide member 66b is made of a plate-like member having a T-shape (refer to FIG. 4) when viewed from a plane extending in the X-axis direction, and is disposed above the X table 62. To one end of the slide member 66b, the vicinity of the other end of the suction pad 66a is integrally connected. Further, to the other end of the slide member 66b, the X voice coil motor 64X and the mover portion 64b of the Y voice coil motor 64Y are fixed.

The tube bearing 66c is made of a normal member having a rectangular XZ cross section, and the slide member 66b is provided in a through hole of a rectangular XZ cross section defined by the inner wall surface. It is inserted through the clearance. The tube bearing 66c is connected to a pressurized gas supply device (not shown) arranged outside the mask stage device 14, and from a plurality of minute holes formed in the upper and lower surfaces of the inner wall surface, the slide member 66b ) Pressurized gas is ejected from the top and bottom of the screen. The slide member 66b is non-contact supported by the tube bearing 66c by the static pressure of the pressurized gas. Here, with respect to the X-axis direction, between the inner wall surface of the tube bearing 66c and the slide member 66b, there is a clearance of a degree to which the relative movement of the small stroke of the slide member 66b with respect to the tube bearing 66c is allowed. Is formed (for this the Z position is constrained).

The tube bearing 66c is supported by a bearing plate 66d fixed to the X table 62 so that it can freely tilt at a predetermined angle in the θx direction through the shaft 66e. The Z position of the shaft 66e is the slide member 66b (and the pad of the adsorption pad 66a) while the mask M adsorbed and held by the adsorption pad 66a is suspended and supported by the mask air guide 40. Plane) is set to be almost parallel to the XY plane. On the other hand, the central position in the Y-axis direction of the system in which the suction pad 66a and the slide member 66b are aligned is set to be closer to the mask M than the axis 66e, for example When the mask M is carried in, carried out, etc., in the state in which the adsorption pad 66a does not adsorb and hold the mask M, as shown in Fig. 7(B), the tube bearing 66c and the slide member 66b and the adsorption pad 66a are integrally tilted (rotated) by their own weight, and the adsorption pad 66a is in a state in which one end side (pad surface side) descends downward compared to the other end side. However, the mover portions 64b of each of the X voice coil motor 64X and the Y voice coil motor 64Y are inserted between a pair of stopper plates 65 fixed to the mounting plate 63, and X In the voice coil motor 64X and the Y voice coil motor 64Y, contact between the stator portion 64a and the mover portion 64b is prevented.

The air cylinder 68a is used to limit the relative movement of the X table 62 and the slide member 66b in the X-axis and Y-axis directions. The air cylinder 68a is in the vicinity of an end portion on the -Y side on the upper surface of the X table 62 on the +Y side, and an end portion on the +Y side on the upper surface of the X table 62 on the -Y side Each of the vicinity is separated in the X-axis direction, and, for example, two are formed (in Fig. 3, they overlap in the direction of the inside of the paper (see Fig. 5)). A ball 68b is fixed to the rod tip of the air cylinder 68a. Further, as the lower surface of the slide member 66b, at a position corresponding to the air cylinder 68a, a concave portion 68c defined by a tapered surface extending toward the lower surface is formed (see Fig. 4).

In the state where the ball 68b shown in FIG. 3 is separated from the corresponding concave portion 68c, relative movement of the X table 62 and the slide member 66b in the X-axis and Y-axis directions is allowed (X table In the state where the ball 68b is inserted (fitted) into the corresponding concave portion 68c, the slide member 66b can be slightly driven with respect to 62), the X table 62 and the slide member 66b ) Relative movement in the X and Y axis directions is restricted. Further, while the ball 68b is inserted into the corresponding concave portion 68c, by moving the ball 68b up and down, the slide member 66b (that is, the suction pad 66a) is tilted around the shaft 66e. You can (rotate) it.

In addition, the air cylinder 68a is also used during the initializing operation of the mask stage device 14. The initializing operation of the mask stage device 14 includes an operation of positioning the X table 62, the slide member 66b, and the like at the measurement origin position of the mask position measuring system. At this time, since the ball 68b is fitted into the concave portion 68c defined by the tapered surface, the X table 62 and the slide member 66b can be positioned with good reproducibility.

Position information in the XY plane of the mask M driven by the mask stage device 14 (including the rotation amount information in the θz direction) is a plurality of the mask air guides 40, as shown in FIG. It is obtained by using the two-dimensional grating 72 formed on the upper surface of the mask M by the encoder head 70. The two-dimensional grating 72 is formed in the shape of a band extending in the X-axis direction, and is near the ends of the +Y side and the -Y side of the mask M, and does not overlap with the mask pattern (illumination light IL) (see FIG. 1 ) Does not interfere with the optical path of). The two-dimensional grating 72 includes an X diffraction grating (X scale) with an X-axis direction as a periodic direction and a Y diffraction grating (Y scale) with a Y-axis direction as a periodic direction. As shown in FIG. 5, at least one of the encoder head 70 is always 2 in the vicinity of the end portions of the mask air guide 40 on the +Y side and the -Y side, regardless of the X position of the mask M. They are arranged at intervals that can be opposed to the dimensional grating 72. In addition, the configuration of the mask position measuring system is not limited to this, for example, an optical interferometer system, a combination of an encoder system and an optical interferometer system may be used, or position information of the mask M is determined based on the output of the image sensor. You can get it.

In the liquid crystal exposure apparatus 10 (refer to FIG. 2) configured as described above, under the management of the main control apparatus (not shown), the mask M to the mask stage apparatus 14 is While loading is performed, the substrate P is loaded onto the substrate stage device 20 by a substrate loader (not shown). Thereafter, the main control device performs alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, a sequential step-and-scan method in a plurality of shot regions set on the substrate P The exposure operation of is performed.

Here, in the liquid crystal exposure apparatus 10, the exchange of the mask M is appropriately performed according to the mask pattern formed on the substrate P. Hereinafter, the operation of the mask M held in the mask stage device 14 is included, and the operations of the mask loader device 90 and the mask stage device 14 are described in Figs. 6(A) to 7(C). ) To explain.

In FIG. 6A, the liquid crystal exposure apparatus 10 in which the mask M is not held in the mask stage apparatus 14 is shown. The mask holding device 60 is waiting on the +X side slightly from the mask exchange area. In addition, in the mask loader device 90, the mask M is taken out from the mask stocker 92 by the mask conveying device 94.

After the mask M is completely taken out from the mask stocker 92, as shown in FIG. 6(B), the mask loader device 90 uses the lifting device 94b to +Z the transfer table 94a. Drive in the direction Thereby, the mask M approaches the mask air guide 40 to a position where the mask air guide 40 can hold the mask M suspended. Also at this time, the mask holding device 60 waits on the +X side slightly from the mask exchange area. In the above-described standby state, in the mask holding device 60, as shown in Fig. 7A, the balls of the air cylinder 68a are driven downward, and the suction pad 66a is in a tilted state.

In FIG. 7B, a state in which the mask M is suspended and held in contact with the mask air guide 40 is shown. At this time, so that the mask M does not move along the lower surface of the mask air guide 40 in a direction parallel to the XY plane, for example, by a flow stop device formed in the mask air guide 40 (not shown), You may limit the relative movement of the mask M with respect to the mask air guide 40. Further, this flow stop device may have a function as a Z stopper preventing the mask M from falling. After transferring the mask M to the mask air guide 40, in the mask loader device 90, the conveyance table 94a is driven in the -Z direction.

After that, each of the pair of mask holding devices 60 is driven in the -X direction, and the suction pad 66a is inserted under the mask M. And, as shown in FIG. 7(C), the ball 68b is driven upward using the air cylinder 68a, and the suction pad 66a is pushed up by the ball 68b. Thereby, the pad surface of the suction pad 66a and the lower surface of the mask M face each other. The mask holding device 60 adsorbs and holds the mask M using the adsorption pad 66a. At this time, in the case of using the above-described flow stop device, the flow stop device is controlled to retract from the mask M after the mask M is adsorbed and held.

In the state where the mask M is adsorbed and held by the adsorption pad 66a, since the mask M and the plurality of adsorption pads 66a can be regarded as an integral body, from the state shown in Fig. 7(C) Even if the ball 68b is driven downward to be in the state shown in FIG. 3, the suction pad 66a does not tilt. In addition, at this time, since the force pulled downward in the gravitational direction by the self-weight of the suction pad 66a acts on the mask M, at least the X voice coil motor 64X and the Y voice coil motor 64Y One side is a two-degree-of-freedom motor that can generate a force in the Z direction, and the two-degree-of-freedom motor is controlled so that the mask (M) is pressed from the bottom to the top (the voice coil motor generates a force in the -Z direction. So that it can be controlled). In addition, since the operation at the time of carrying out the mask M from the mask stage device 14 is the opposite to the operation at the time of carrying in the above, a description is omitted.

According to the mask stage device 14 described above, almost the entire surface of the upper surface of the mask M (excluding the portion in which the opening 46 is formed) is supported by non-contact suspension from above by the mask air guide 40 Therefore, the warpage (deformation) of the mask M can be suppressed. Thereby, defocus is suppressed, and the mask pattern can be transferred to the substrate P with higher precision.

In addition, since almost the entire surface of the upper surface of the mask M is supported, for example, in the case of using a mask stage apparatus (hereinafter referred to as a mask stage apparatus according to a comparative example) having a structure supporting only the end of the mask M In contrast, the resonant frequency of the mask M is increased. Accordingly, the precise positioning controllability of the mask M in the exposure operation is improved, and occurrence of non-uniformity in the pattern transferred to the substrate P is suppressed.

In addition, since the mask stage device 14 directly drives the mask M using a pair of mask holding devices 60, for example, a frame-shaped member (mask holder) holding the mask M is used. Compared to the mask stage apparatus according to the above comparative example to be driven, the object to be driven is lighter, and the position of the mask M can be controlled more accurately. In addition, cost reduction is also possible.

In addition, even if the supply of pressurized gas (or supply of vacuum suction force) to the mask air guide 40 (or the mask holding device 60) is stopped, the tilting of the suction pad 66a is caused by the stopper plate 65 Due to the restriction, the state in which the mask M is supported by the suction pad 66a from below is maintained. Therefore, there is no fear that the mask M will fall downward.

Moreover, when carrying in the mask M, the mask loader device 90 drives the mask M in the +Z direction to transfer it to the mask air guide 40, and when carrying the mask M in, the mask Since (M) is driven in the -Z direction and received from the mask air guide 40, the configuration can be made simple and compact.

<< 2nd embodiment >>

Next, a liquid crystal exposure apparatus 110 according to the second embodiment will be described using Figs. 8A to 10B. Since the configuration of the liquid crystal exposure device 110 according to the second embodiment is the same as the liquid crystal exposure device 10 (see Fig. 1) of the first embodiment, except for the configuration of the mask loader device 190 , Hereinafter, only the differences will be described, and elements having the same configuration and function as in the first embodiment are denoted by the same reference numerals as in the first embodiment, and the description thereof will be omitted.

The mask loader device 190 includes a mask stocker 192 and a mask conveying device 194. The mask stocker 192 holds a plurality of masks M at predetermined intervals in the vertical direction, as in the first embodiment, but an arbitrary mask M is moved horizontally toward the mask conveying device 194. It has an extrusion device (not shown. See the white arrow in Fig. 8A) for extruding. The mask conveying device 194 has the same conveying table 94a and the lifting device 94b as the said 1st embodiment.

In this second embodiment, instead of the pair of slide members 94c (refer to Figs. 2, 7A, etc.) of the first embodiment, the transfer table 94a includes a plurality of movable pieces 94e. I have. The movable pieces 94e are in the vicinity of the +Y side and -Y side of the transfer table 94a, respectively, at predetermined intervals in the X-axis direction (in Figs. 8(A) to 10(B), an example) For example, 3. However, the number is not limited to this). The plurality of movable pieces 94e are each independently movable in the vertical direction (Z-axis direction) with respect to the transfer table 94a, and via a Z actuator, not shown, by a main control device not shown. Z position is controlled. The spacing between the plurality of movable pieces 94e on the +Y side and the plurality of movable pieces 94e on the -Y side does not contact the pellicle Pe (see Fig. 3) as in the first embodiment. It is set so as to be able to support the vicinity of each end portion (blank region) on the +Y side and -Y side of the mask M from below.

In the mask loader device 190, a desired mask M is extruded from the mask stocker 192 and placed on a plurality of movable pieces 94e of the mask conveying device 194, as shown in FIG. 8(A). . Next, as shown in FIG. 8(B), the mask conveyance device 194 drives the mask M upwardly using the lifting device 94b, and the mask M is moved to the mask air guide 40. Modest. When the mask M is suspended and supported by the mask air guide 40 in a non-contact manner, the mask holding device 60 is driven in the -X direction to support the mask M from below, as shown in Fig. 9(A). .

Here, in the first embodiment, as shown in Fig. 7B, so that the mask holding device 60 can support the mask M from below (the adsorption pad 66a is provided with the slide member 94c). So as not to contact), the transfer table 94a was previously driven downward, but in the second embodiment, as shown in Fig. 9(A), the transfer table 94a does not move, and only the movable piece 94e is It is driven. That is, in the mask loader device 190, the movable piece 94e does not contact the suction pad 66a according to the X position of the suction pad 66a when the mask holding device 60 slides in the -X direction. It is driven downward so as not to (retreat from the moving path of the adsorption pad 66a). Moreover, as shown in FIG. 9(B), the movable piece 94e is driven upward after passage of the adsorption pad 66a, and supports the mask M from below. Thereby, the mask M is always supported by the at least one movable piece 94e from below, regardless of the X position of the suction pad 66a. In Fig. 9(A), only the movable piece 94e on the most +X side is retracted from the movement path of the suction pad 66a, and in Fig. 9(B), only the movable piece 94e at the center is the suction pad 66a. ) You are evading from the path of movement.

After the mask holding device 60 holds the mask M, as shown in Fig. 10(A), the transfer table 94a is driven downward, and the mask holding device 60 holding the mask M 10(B), the mask M is driven downward of the illumination system 12 for exposure operation. According to the second embodiment, even if the supply of pressurized gas to the mask air guide 40 is stopped while the mask M is suspended and supported, the mask M falls on the transfer table 94a. Is prevented.

In addition, the configurations of the first and second embodiments described above can be appropriately changed. For example, in the first and second embodiments, when performing the operation of exchanging the mask M, the position in which the carrying out operation of the mask M and the carrying-in operation of the mask M are the same (mask exchanging position) However, the mask loading position (loading position) and the mask loading position (unloading position) may be separate, for example, the unloading position relative to the opening 46 on one side in the X-axis direction (for example, -X Side), and the loading position with respect to the opening 46 on the other side in the X-axis direction (for example, on the +X side). In this case, since the carrying out operation of the mask M and the carrying-in operation of another mask M can be partially performed in parallel, the efficiency is good.

Further, in the first and second embodiments, the mask air guide 40 ejects pressurized gas between the lower surface of the mask air guide 40 and the upper surface of the mask M at high speed (mask air guide By making (40) function as a so-called Bernoulli chuck) (without performing suction of the gas), the mask M may be suspended and held.

Further, in the above embodiment, the mask M is adsorbed and held in the vicinity of the end portions of the +Y side and the -Y side by the adsorption pads 66a of each of the pair of mask holding devices 60. The number of pads 66a and the suction holding position of the mask M are not limited thereto, and more points (including the end portion in the X-axis direction) may be suction-held. In this case, for example, a frame-shaped member may be used to surround the entire outer periphery of the mask M.

Further, the illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). In addition, as illumination light, for example, an infrared or visible single wavelength laser light oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). Then, a harmonic obtained by converting the wavelength into ultraviolet light using a nonlinear optical crystal may be used. Further, a solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

In addition, although the case where the projection optical system 16 is a multi-lens type projection optical system including a plurality of optical systems has been described, the number of projection optical systems is not limited to this, and one or more may be sufficient. Moreover, it is not limited to the projection optical system of a multi-lens system, and a projection optical system etc. using a large opener type mirror may be sufficient. Moreover, the projection optical system 16 may be an enlargement system or a reduction system.

In addition, as a mask stage device, for example, the two types of masks disclosed in the specification of U.S. Patent No. 8,159,649 are moved appropriately in the Y-axis direction by stepping the masks on which the two types of mask patterns are formed. A mask stage device capable of selectively transferring a pattern to a substrate may be used. In this case, the width of the mask air guide 40 according to the first to fourth embodiments may be formed to be wider than in the above embodiments.

In addition, the use of the exposure device is not limited to an exposure device for liquid crystal that transfers a liquid crystal display element pattern to a prismatic glass plate, for example, an exposure device for manufacturing an organic EL (Electro-Luminescence) panel, and an exposure device for semiconductor manufacturing. It can also be widely applied to exposure devices for manufacturing devices, thin film magnetic heads, micromachines, and DNA chips. In addition, in order to manufacture a mask or reticle used in not only microdevices such as semiconductor devices, but also optical exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, and electron beam exposure apparatuses, circuit patterns are transferred to glass substrates or silicon wafers. It can also be applied to an exposure apparatus.

In addition, the object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. In addition, when the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and, for example, a film (a sheet-like member having flexibility) is included. In addition, the exposure apparatus of the present embodiment is particularly effective when a substrate having a length of one side or a diagonal length of 500 mm or more is an object to be exposed.

For electronic devices such as a liquid crystal display device (or semiconductor device), a step of designing the function and performance of the device, a step of manufacturing a mask (or reticle) based on this design step, a step of manufacturing a glass substrate (or wafer) , The exposure apparatus of each of the above-described embodiments, and the lithography step of transferring the pattern of the mask (reticle) to the glass substrate by the exposure method, the developing step of developing the exposed glass substrate, other than the portion where the resist remains It is manufactured through an etching step of removing the exposed member of the part by etching, a resist removal step of removing unnecessary resist after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, since the above-described exposure method is carried out using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate, a device having a high degree of integration can be manufactured with good productivity.

In addition, the disclosures of all US patent application publication specifications and US patent specifications related to exposure apparatuses and the like cited in the description so far are incorporated into a part of the description of this specification.

Industrial availability

As described above, the exposure method of the present invention is suitable for moving the pattern holder relative to the energy beam. Moreover, the manufacturing method of a flat panel display of this invention is suitable for manufacturing a flat panel display. Further, the device manufacturing method of the present invention is suitable for the production of microdevices.

10: liquid crystal exposure device
14: mask stage device
40: mask air guide
46: opening
60: mask holding device
IL: illumination light
M: mask
P: substrate

Claims (28)

A first area in which a predetermined pattern is formed and a second surface of the pattern holder formed on the first surface of the second area other than the first area, which is a surface opposite to the first surface, is supported in a non-contact manner. Facing the support surface of the support member as much as possible, and
Non-contact support of at least a partial region of the region of the second surface corresponding to the position of the first region on the first surface by facing the support surface,
Supporting the second region of the pattern holding body supported by the support member by a holding member,
In a state supported by the support member, the pattern holder is moved in the scanning direction in at least a predetermined two-dimensional plane with respect to the energy beam, and the object to be exposed is driven in the scanning direction with respect to the energy beam, so that the pattern Transfer to the exposure target object,
Releasing the support of the pattern holding body by the support member while the support of the pattern holding body by the support member is maintained,
And separating the second surface of the pattern holder from which support by the support member has been released and the support surface of the support member. The method of claim 1,
In the above supporting, an exposure method in which a plurality of locations on the second surface of the pattern holder are supported in a non-contact manner so that the pattern holder does not bend. The method according to claim 1 or 2,
In the transferring, the energy beam is passed through an opening formed in the support member. The method of claim 3,
In the opposing and releasing of the support, the pattern holder is opposed to the first region of the support surface of the support member,
In the transferring, the pattern holder is moved from the first region of the support surface of the support member to a second region in which the opening is formed. The method according to claim 1 or 2,
In the opposing and separating, the pattern holder is moved in a direction crossing the two-dimensional plane with respect to the support member. The method according to claim 1 or 2,
The exposure method in which a common conveying device is used in the opposing and separating. The method according to claim 1 or 2,
In the support, the holding member is disposed under the pattern holder by sliding the holding member from one side in the scanning direction to the other side on the first surface side of the pattern holder,
In releasing the holding, the holding member is retracted from the lower side of the pattern holding member by sliding the holding member from the other side in the scanning direction to one side on the lower surface side of the pattern holding member. The method of claim 7,
In the facing and spacing, a movable member formed to be movable between a first position supporting the first surface of the pattern holder and a second position spaced apart from the first surface of the pattern holder A pattern holder conveying device having a plurality along the scanning direction is used,
In the supporting and releasing of the support, the plurality of movable members are retracted from the first position to the second position according to a position of the holding member along the scanning direction. The method according to claim 1 or 2,
In the transferring, the pattern holder is finely driven in the two-dimensional plane with respect to the energy beam in a direction orthogonal to the scanning direction and around an axis orthogonal to the two-dimensional plane. The method according to claim 1 or 2,
In the supporting, gas is supplied between the second surface of the pattern holder and the support surface of the support member,
The exposure method, wherein a gas between the support surface of the support member and the second surface of the pattern holder is sucked into the support member. The method according to claim 1 or 2,
In the supporting, an exposure method in which a gas is passed at high speed between the support surface of the support member and the second surface of the pattern holder. The method according to claim 1 or 2,
The exposure method, wherein the object to be exposed is a substrate used in a flat panel display device. The method of claim 12,
The substrate, at least one side length or diagonal length of 500 mm or more, exposure method. Exposing the object to be exposed using the exposure method according to claim 12,
A method of manufacturing a flat panel display, comprising developing the exposed object to be exposed. Exposing the object to be exposed using the exposure method according to claim 1 or 2,
A device manufacturing method comprising developing the exposed object to be exposed. A first area in which a predetermined pattern is formed and a second surface of the pattern holder formed on the first surface of the second area other than the first area, which is a surface opposite to the first surface, is supported in a non-contact manner. A support member having a support surface of the possible support member,
The second surface of the pattern holder and the support surface of the support member face each other, and at least a partial region of the region of the second surface corresponding to the position of the first region on the first surface, A holding member for holding the second region of the pattern holding body while being supported in a non-contact manner on the support surface,
The pattern holder is moved in the scanning direction in at least a predetermined two-dimensional plane with respect to the energy beam in a state held by the holding member, and the object to be exposed is driven in the scanning direction with respect to the energy beam. A pattern forming unit for transferring a pattern to the object to be exposed,
In a state in which the support of the pattern holder by the support member is maintained, the support of the pattern holder by the holding member is released, and the first of the pattern holder whose support by the holding member is released. An exposure apparatus comprising a control system that separates two surfaces and the support surface of the support member. The method of claim 16,
The exposure apparatus, wherein the support member non-contactly supports a plurality of locations on the second surface of the pattern holder so that the pattern holder does not bend. The method of claim 16 or 17,
The exposure apparatus, wherein the pattern forming part passes the energy beam through an opening formed in the support member. The method of claim 18,
When the second surface of the pattern holder and the support surface of the support member face each other, and when the holding member releases the support of the pattern holder, the pattern holder comprises the support surface of the support member Facing the first area of,
The pattern forming unit, when the pattern is transferred to the object to be exposed, moves the pattern holder from the first region of the support surface of the support member to a second region in which the opening is formed. The method of claim 16 or 17,
The pattern holder may include when the second surface of the pattern holder and the support surface of the support member face each other, and when the second surface of the pattern holder and the support surface of the support member are spaced apart, An exposure apparatus that moves in a direction crossing the two-dimensional plane with respect to the support member. The method of claim 16 or 17,
A common transfer device is added to make the second surface of the pattern holder and the support surface of the support member face each other, and to separate the second surface of the pattern holder and the support surface of the support member. An exposure apparatus provided with. The method of claim 16 or 17,
The holding member is disposed below the pattern holder by sliding from one side in the scanning direction to the other side on the first surface side of the pattern holder,
An exposure apparatus for retracting from the lower side of the pattern holder by sliding from the other side in the scanning direction to one side from the first surface side of the pattern holder while the holding of the pattern holder is released. The method of claim 22,
Further provided with a pattern holder transfer device having a plurality of movable members along the scanning direction,
The pattern holder transfer device,
When the second surface of the pattern holder and the support surface of the support member face each other, and when the second surface of the pattern holder and the support surface of the support member are spaced apart, the movable member, Moved between a first position supporting the first surface of the pattern holder and a second position spaced apart from the first surface of the pattern holder,
An exposure apparatus for retracting a plurality of the movable members from the first position to the second position according to a position of the holding member along the scanning direction when the holding member supports and releases the pattern holding member. The method of claim 16 or 17,
The pattern forming unit, when transferring the pattern to the object to be exposed, moves the pattern holder in a direction orthogonal to the scanning direction in the two-dimensional plane with respect to the energy beam and an axis orthogonal to the two-dimensional plane. The exposure apparatus to be driven in a smile. The method of claim 16 or 17,
When the supporting member supports the pattern holding member, a gas is supplied between the second surface of the pattern holding member from the supporting surface of the supporting member,
An exposure apparatus for sucking gas between the support surface of the support member and the second surface of the pattern holder. The method of claim 16 or 17,
When the support member supports the pattern holding member, the exposure apparatus allows a gas to pass at high speed between the support surface of the support member and the second surface of the pattern holder. The method of claim 16 or 17,
The exposure target object is a substrate used for a flat panel display device. The method of claim 27,
The exposure apparatus, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more.

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