JP2009238825A - Electronic component and mounting structure of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component and a mounting structure of the electronic component, for achieving excellent bonding by conductive paste while suppressing the enlargement of the electronic component. <P>SOLUTION: For a common mode filter, a flange part 11 of a drum core constituted of a magnetic body such as ferrite or a non-magnetic body such as ceramic is provided with an electrode 40. When fitting the electrode 40 which is a roughly U-shaped metal fitting to the flange part 11, a gap for the conductive paste P to be interposed between a facing surface 41B and a facing surface 11H is formed. When mounting the common mode filter on the electrode pattern 2A of a circuit board 2, the conductive paste P bonds the common mode filter 1 and the circuit board 2 in the state with both interposed integrally from the part between the exposed region 11F of a mounting surface and the mounting surface 41A of the electrode 40 to the part between the facing surface 41B of the electrode 40 and the facing surface 11H of the flange part 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component and an electronic component mounting structure.

  2. Description of the Related Art Conventionally, there is known an electronic component in which a conductive paste is interposed between an electrode and an electrode pattern of a circuit board so as to be electrically connected to the electrode pattern of the circuit board and fixed and mounted on the circuit board. Yes. However, the bonding with the conductive paste has a problem that the bonding force is weaker than that in the case of using solder, resulting in poor bonding strength. In particular, when the circuit board is made of ceramic and the electrode is a metal fitting, there is a problem that the conductive paste and the metal fitting easily peel off due to the difference in thermal expansion coefficient between the circuit board and the metal fitting.

In order to solve the above problem, Patent Document 1 provides a bonding region with a conductive paste in a region other than the portion where the terminal electrode is provided in the electronic component body, thereby improving the bonding force by the conductive paste. The structure to be made is disclosed.
JP 2006-73742 A

  According to the configuration described in Patent Document 1 described above, the bonding force by the conductive paste is improved, but when the width of the electrode terminal is large, the electronic component main body is enlarged to secure a bonding region of the conductive paste. There is a problem that it is not possible to meet the demand for downsizing of electronic components.

  Accordingly, an object of the present invention is to provide an electronic component and a mounting structure for the electronic component that can achieve good bonding with a conductive paste while suppressing an increase in size of the electronic component.

  In order to achieve the above object, the present invention provides a component main body made of ceramic, a metal fitting supported on the component main body along one surface of the component main body and connected to the substrate, and a gap between the substrate and the metal fitting. And an electrically conductive paste interposed between the component main body and the metal fitting and in contact with the component main body, the metal fitting and the substrate.

  In general, when an electronic component using a metal paste as an electrode is mounted on a substrate such as a ceramic using a conductive paste, the metal fitting and the conductivity are caused by the difference in the coefficient of thermal expansion between the metal fitting and the substrate. Peeling easily occurs at the interface with the paste, and mounting strength is difficult to obtain. Therefore, in order to improve the mounting strength between the metal fitting and the board, it is conceivable to dispose the conductive paste on the component main body having a small difference in thermal expansion coefficient from that of the board to widen the arrangement area of the conductive paste. However, in order to widen the arrangement area of the conductive paste, if the area of the electrode is to be secured to a predetermined value or more, the mounting surface has to be widened, and the component body is enlarged, and the electronic component is required to be reduced in size. Cannot handle.

  On the other hand, according to the electronic component described above, since the conductive paste is interposed between the substrate and the metal fitting, and between the component main body and the metal fitting, the bonding area between the conductive paste and the component main body is enlarged. The board, the metal fitting, and the component main body can be integrally joined. Therefore, even when the width of the electrode is large, the bonding strength between the substrate, the metal fitting, and the component body can be obtained without increasing the size of the component body.

  In addition, the component main body is formed with a stepped portion that can be fitted into the metal fitting and includes the one surface, and the conductive paste is formed with the metal fitting and the stepped portion in a state where the metal fitting is fitted into the stepped portion. It is preferable to intervene between the parts.

  According to such an electronic component, since the conductive paste can be pushed and interposed between the metal fitting and the stepped portion, a joining region between the component main body and the conductive paste can be reliably formed.

  Further, it is preferable that the metal fitting has a substantially U shape having an opposing surface facing the one surface, and the conductive paste is interposed between the opposing surface and the one surface.

  Moreover, it is preferable that this metal fitting has an end surface which shows the plate | board thickness of this metal fitting, and this electroconductive paste is interposed between the end surface which shows this plate | board thickness, and this level | step-difference part.

  According to such an electronic component, the bonding strength between the component main body and the conductive paste is improved by interposing the conductive paste between the metal fitting and the stepped portion.

  Further, the step portion has a groove portion defined by a pair of side surfaces and a bottom surface, and the metal fitting is fitted to the step portion so that an end surface indicating the plate thickness faces the pair of side surfaces, It is preferable that the conductive paste is interposed between the end surface indicating the plate thickness and the side surface.

  According to such an electronic component, the conductive paste can be pressed and interposed along the side surface of the groove. Therefore, the joint strength between the component main body and the conductive paste is improved.

  The metal fitting has a mounting surface that is connected to the substrate and is opposite to the facing surface, and the one surface of the component main body is disposed to face the substrate and faces the substrate of the component main body. It is preferable that the surface excluding the one surface is flush with the mounting surface of the metal fitting.

  According to such an electronic component, the surface of the component main body that faces the substrate, except for one surface, and the mounting surface of the metal fitting are flush with each other, so that it is constant without hindering the inflow of the conductive paste. A conductive paste of thickness can be applied. Therefore, the joint strength of the component main body with respect to a board | substrate can be improved more.

  The conductive paste is interposed between the component main body and the metal fitting to form an interposition portion, and the conductive paste is the component main body on the surface not facing the metal fitting. It is preferable to extend integrally from the part.

  According to such an electronic component, in addition to the interposition part, the conductive paste extends integrally from the interposition part on the surface of the component main body that is not opposed to the metal fitting. The joint area with the component body can be enlarged. Therefore, joining of a component main body and an electrically conductive paste can be performed reliably.

  Further, the present invention includes a substrate made of ceramic, a component body made of ceramic, disposed on the substrate, and having one surface opposed to the substrate, and a mounting surface connected to the substrate, A metal fitting supported by the component main body along the one surface of the component main body, interposed between the substrate and the mounting surface, and between the component main body and the metal fitting, the component main body and the metal fitting. An electronic component mounting structure comprising: a conductive paste in contact with the substrate.

  In general, when an electronic component using a metal paste as an electrode is mounted on a substrate such as a ceramic using a conductive paste, the metal fitting and the conductivity are caused by the difference in the coefficient of thermal expansion between the metal fitting and the substrate. Peeling easily occurs at the interface with the paste, and mounting strength is difficult to obtain. Therefore, in order to improve the mounting strength between the metal fitting and the board, it is conceivable to dispose the conductive paste on the component main body having a small difference in thermal expansion coefficient from that of the board to widen the arrangement area of the conductive paste. However, in order to widen the arrangement area of the conductive paste, if the area of the electrode is to be secured to a predetermined value or more, the mounting surface has to be widened, and the component body is enlarged, and the electronic component is required to be reduced in size. Cannot handle.

  On the other hand, according to the electronic component mounting structure described above, the conductive paste is interposed between the substrate and the mounting surface of the metal fitting and between the component main body and the metal fitting. The joint area can be enlarged, and the substrate, the metal fitting, and the component main body can be integrally joined. Therefore, even when the width of the electrode is large, the bonding strength between the substrate, the metal fitting, and the component body can be obtained without increasing the size of the component body.

  As described above, it is possible to provide an electronic component and a mounting structure for the electronic component that can achieve good bonding with the conductive paste while suppressing an increase in size of the electronic component.

  A common mode filter having a connection structure for electronic components according to an embodiment of the present invention will be described with reference to FIGS. The common mode filter 1 that is an electronic component is used to reduce common mode noise that is superimposed on a power source or a signal in an electronic device or the like. As shown in FIG. 1, the common mode filter 1 is made of a conductive paste P made of Ag paste. It is mounted on the electrode pattern 2 </ b> A of the circuit board 2. The common mode filter 1 includes a drum core 10 made of a magnetic material such as ferrite or a non-magnetic material such as ceramic, a plate-shaped core 20, two conductive wires 30 and 30, and an electrode 40.

  The drum core 10 includes a pair of flange portions 11 and 11 and a core portion 12 that connects the pair of flange portions 11 and 11 to each other. The core portion 12 and the pair of flange portions 11 and 11 are integrated. It is structured. The winding core part 12 has a substantially quadrangular prism shape, and the pair of flange parts 11 and 11 have a substantially rectangular parallelepiped shape having the same shape. The two conducting wires 30 and 30 are insulation-coated conducting wires and are wound around the winding core portion 12 alternately.

  As shown in FIG. 3, the flange portions 11, 11 each have a substantially rectangular parallelepiped shape. The winding core portion 12 is connected to a substantially rectangular parallelepiped side surface 11D. The flange portion 11 has a connecting surface 11A and a plate-like core facing surface 11B corresponding to a substantially rectangular parallelepiped upper surface, and a mounting surface 11C corresponding to the bottom surface, and the connecting surface 11A and the plate-shaped core facing surface. 11B and the mounting surface 11C face each other. The direction connecting the connecting surface 11A and the mounting surface 11C (hereinafter referred to as “vertical direction”) is substantially perpendicular to the direction connecting the pair of flanges 11 and 11 (hereinafter referred to as “front-rear direction”). Each mounting surface 11C is disposed opposite to the electrode pattern 2A on the circuit board 2 via the conductive paste P.

  As shown in FIG. 3, stepped portions 11 </ b> G are formed at both end portions in a part of the flange portion 11 and perpendicular to the front-rear direction and the up-down direction (hereinafter referred to as “left-right direction”). Has been. The step portion 11G has a facing surface 11H, a regulating surface 11J, a side surface 11K, and an adhesive surface 11L, and the facing surface 11H, the regulating surface 11J, and the side surface 11K are rough surfaces having irregularities. The depth in the vertical direction of the recess defined by the facing surface 11H, the regulating surface 11J, and the side surface 11K in the stepped portion 11G is larger than the plate thickness of the mounting portion 41 of the electrode 40 made of a plate-shaped terminal fitting described later. Is the depth. In addition, the depth in the front-rear direction of the recess defined by the facing surface 11H, the regulating surface 11J, and the side surface 11K in the stepped portion 11G is the thickness of the mounting portion 41 of the electrode 40 made of a plate-shaped terminal fitting described later. The same depth. Thus, in the step portion 11G, when the connecting portion 43 of the electrode 40 is fitted and attached to the flange portion 11, the connecting portion 43 of the electrode 40 does not protrude outward from the outer contour of the flange portions 11 and 11. It is configured as follows.

  As shown in FIG. 3, the connecting surfaces 11 </ b> A of the flange portions 11 and 11 are located at both ends in the left-right direction of the common mode filter. In other words, a pair of connecting surfaces 11A and 11A are arranged on the left and right sides of the plate-like core facing surface 11B as the center. The connecting surface 11A has a recessed portion that is relatively recessed in the direction of the mounting surface 11C relative to the plate-like core facing surface 11B, and the connecting portion 42 of the electrode 40 is fitted into the recessed portion as will be described later. Thus, when mounted and mounted, the connecting portion 42 of the electrode 40 is configured not to protrude outward from the outer contour of the flange portions 11 and 11.

  In addition, the adhesive surface 11L and the connecting surface 11A of the flange portion 11 are connected to form a corner portion. A connecting portion between the connecting portion 43 of the electrode 40 and the mounting portion 41, which will be described later, is located at the corner portion.

  Two electrodes 40 are provided on each of the pair of flanges 11 and 11. The number of the electrodes 40, 40 corresponds to two, which is the number of the conducting wires 30, 30. Further, one electrode 40 is fixed to each of both ends in the left-right direction of the pair of flanges 11, 11. As shown in FIG. 3, the electrode 40 has a substantially rectangular U-shape by bending a substantially rectangular plate-shaped terminal fitting, and the substantially U-shaped is formed from the bottom surface, the side wall, and the top surface. The connection part 41 which is a part corresponding to the top surface when considered to be, the connecting part 42 which is a part corresponding to the bottom surface, and a part which corresponds to the side wall and which connects the mounting part 41 and the connecting part 42 Part 43.

  The mounting portion 41 has a mounting surface 41A connected to the electrode pattern 2A of the circuit board 2 via the conductive paste P, and a facing surface 41B facing the facing surface 11H of the stepped portion 11G.

  Further, the connecting portion 42 is placed on the connecting surface 11A of the flange portions 11 and 11. The connecting portion 42 is provided with connecting pieces 42 </ b> A for connecting the end portions of the conducting wires 30, 30 wound around the core portion 12. As shown in FIG. 3, the connecting piece 42 </ b> A is provided so as to protrude from the connecting portion 42, and each connecting piece 42 </ b> A is provided with both end portions of the conducting wires 30, 30 placed on the electrode 40. 3 is changed from a standing state as shown in FIG. 1 to a bent state as shown in FIG. 1, and both ends of the conducting wires 30, 30 are sandwiched so that the conducting wires 30, 30 are connected to each other. 42 is electrically connected and connected. Then, for example, by irradiating the end portions of the conducting wires 30 and 30 and the connecting pieces 42A with laser, the conducting wires 30 and 30 and the electrode 40 are melted and joined.

  The electrode 40 is formed such that the distance between the facing surface 41B of the mounting portion 41 and the fitting surface 42B of the connecting portion 42 is larger than the distance between the connecting surface 11A and the facing surface 11H. ing. In addition, the distance between the connecting surface 11A and the mounting surface 11C and the distance between the mounting surface 41A and the fitting surface 42B are formed to be equal. As a result, as shown in FIG. 2, when the electrode 40 is fitted to the flange 11, a gap is formed between the facing surface 41B and the facing surface 11H for the conductive paste P to intervene. In addition, the mounting surface 11C of the flange 11 and the mounting surface 41A of the electrode 40 are flush with each other. Further, the length of the mounting surface 41 in the front-rear direction is formed so as to be smaller than the distance between the side surface 11E and the regulating surface 11J. Thereby, when the electrode 40 is fitted to the flange portion 11, a gap for the conductive paste P to enter between the regulation surface 11 </ b> J of the flange portion 11 and the tip end portion of the mounting portion 41 of the electrode 40. Is formed.

  Further, the length of the mounting portion 41 and the length of the connecting portion 43 in the left-right direction are the same, and the width of the mounting portion 41 is not thinner than the width of the connecting portion 43. For this reason, the connection state of the connection part 43 of the electrode 40 and the mounting part 41 can be made the best.

  The electrode 40 is configured by applying Ni plating and Au plating in this order on a base made of a Ni alloy such as phosphor bronze or 42 alloy. Au plating is used in consideration of compatibility with an adhesive such as conductive paste P, and is used because it does not oxidize when conductive paste P is applied to Au plating.

  When 42 alloy is used as the substrate of the electrode 40, the difference in linear expansion from the conductive paste P made of Ag paste can be suppressed. Moreover, since Au plating is used, the mounting part 41 can ensure favorable electrical conductivity with the conductive paste P made of Ag paste.

  As shown in FIGS. 1 and 2, the electrode 40 is fixed to the flange portions 11 and 11 by disposing a fitting surface 42 </ b> B of the electrode 40 on the connecting surface 11 </ b> A of the flange portion 11. This is done by bonding the inner surface and the bonding surface 11L with an adhesive. The electrode 40 has a structure that is not fixed so as not to move completely with respect to the flanges 11 and 11. For this reason, even if there is a difference in thermal expansion / contraction due to a difference in linear expansion coefficient between the electrode 40 and the conductive paste P for fixing the flanges 11 and 11 to the electrode pattern 2A, the electrode 40 itself is the stepped portion 11G. It is possible to absorb the influence of the difference in thermal expansion and contraction by shifting in FIG. As a result, it is possible to prevent the circuit board 2 from being damaged such as generating a crack.

  Since the flange portions 11 and 11 of the drum core 10 are provided with a step portion 11G from which the base of the flange portion 11 is exposed, the conductive paste P is applied between the step portion 11G and the electrode 40 in addition to the mounting surface 11C. Can intervene. According to such a configuration, even when the width (length in the left-right direction) of the electrode 40 is large, the joining region between the conductive paste P and the drum core 10 is enlarged without increasing the size of the flange portion 11. can do. Therefore, the joint strength between the common mode filter 1 and the electrode 40 can be improved without increasing the size of the common mode filter 1.

  Further, the mounting surface 11 </ b> C is provided with an exposed region 11 </ b> F in which the electrode 40 is not provided, and the base material that is an uneven rough surface is exposed among the flange portions 11, 11 of the drum core 10. ing. As shown in FIGS. 2 and 3, the exposed region 11F is provided from one end to the other end in the extending direction of the groove 11c along the opening edge of the groove 11c, and further the core portion of the mounting surface 11C. In the edge part of 12 side, it is provided until it reaches to the both ends of the collar parts 11 and 11 in the left-right direction.

  Since a part of the mounting surface 11C forms an exposed region 11F where the base of the flanges 11 and 11 of the drum core 10 is exposed, a portion other than the mounting portion 41 of the electrode 40 on the mounting surface 11C serves as an exposed region 11F. A bonding region of the paste P can be secured. For this reason, it is possible to bond not only the mounting portion 41 of the electrode 40 but also the exposed region 11F to the electrode pattern 2A of the circuit board 2 using the conductive paste P.

  As shown in FIG. 4, when the electrode 40 is attached to the collar part 11, the electrode 40 is provided so as to face the surface of the exposed region 11 </ b> F of the collar part 11, that is, the electrode pattern 2 </ b> A of the circuit board 2. The surface of the portion of the mounting surface 11C that is not present and the mounting surface 41A of the electrode 40 that faces the electrode pattern 2A of the circuit board 2 are flush with each other. FIG. 4B is a diagram in which the regulation wall 11J is omitted.

  For this reason, the conductive paste P having a certain thickness can be applied to the surface of the mounting surface 11C portion of the flange portion 11 and the mounting surface 41A of the electrode 40, and the flange portion 11 with respect to the electrode pattern 2A of the circuit board 2 can be applied. , 11 can be further expanded. As a result, it is possible to obtain a higher bonding strength of the flanges 11 and 11 with respect to the electrode pattern 2A of the circuit board 2. Further, the common mode filter 1 and the electrode pattern 2A can be stably bonded.

  Since the surface of the electrode 40 is Au plated, the biting property (contact force) between the electrode 40 and the conductive paste P made of Ag paste is not so strong. However, since the exposed region 11F and the stepped portion 11G of the drum core 10 are rough surfaces with irregularities, when the conductive paste P is attached to the exposed region 11F and the stepped portion 11G of the drum core 10, the exposed region of the drum core 10 is exposed. The conductive paste P enters the concavities and convexities of 11F and the stepped portion 11G, and the biting property between the drum core 10 and the conductive paste P can be strengthened by the anchor effect.

  Specifically, first, the conductive paste P is applied onto the electrode pattern 2A of the circuit board 2, and the common mode filter 1 is mounted on the circuit board 2 from the upper side to the lower side of the electrode pattern 2A of FIG. The conductive paste P is pushed by the mounting surface 41A of the metal fitting 40 and is pushed out from the electrode pattern 2A. As shown in FIG. 4, the extruded conductive paste P is guided along the regulation wall 11J of the step portion 11G of the flange portion 11, and is formed between the facing surface 41B and the facing surface 11H of the electrode 40. And enters the gap formed between the facing surface 41B of the electrode 40 and the facing surface 11H, and contacts the electrode 40 and the flange portion 11. Further, a part of the conductive paste P on the electrode pattern 2A is in contact with the exposed region 11F.

  As described above, the common mode filter 1 is mounted on the electrode pattern 2A of the circuit board 2 by the conductive paste P. In this mounting, the conductive paste P is applied to the exposed region 11F on the mounting surface 11C and the electrode 40. It is attached to the mounting surface 41 </ b> A, and is interposed between the facing surface 41 </ b> B of the electrode 40 and the facing surface 11 </ b> H of the flange 11. That is, the conductive paste P is integrally interposed between the exposed area 11F on the mounting surface 11C and the mounting surface 41A of the electrode 40 and between the facing surface 41B of the electrode 40 and the stepped portion 11G of the flange portion 11. In this state, the common mode filter 1 and the circuit board 2 are bonded.

  For example, when providing an exposed region on the mounting surface, the exposed region may be provided from one end to the other end in the groove extending direction along the opening edge of the groove, and all other portions may be used as electrode mounting portions. Conceivable. However, in this case, if the exposure area is increased, the electrode becomes thinner and the area becomes smaller, and if it is attempted to secure the electrode area to a predetermined value or more, the mounting surface of the flange must be increased. Can not meet the demand for downsizing of the common mode filter.

  However, according to the common mode filter 1 described above, since a gap is formed between the facing surface 41B of the electrode 40 and the facing surface 11H of the flange portion 11, the width (length in the left-right direction) of the electrode 40 is large. Even if it is a case, the high joining strength of 41 A of mounting surfaces of the collar parts 11 and 11 and the electrode 40 with respect to the electrode pattern 2A of the circuit board 2 can be obtained, without enlarging the collar parts 11 and 11. FIG.

  The conductive paste P is cured at a sufficiently low temperature, for example, about 150 ° C., for example, about 30 minutes as compared to the bonding temperature by the solder, and the bonding is completed. For this reason, it is possible to avoid other components on the circuit board 2 from being destroyed or damaged by being affected by high-temperature heat.

  As shown in FIGS. 1 to 3, the plate-like core 20 has a substantially rectangular shape with a substantially plate shape, and one end portion and the other end portion in the longitudinal direction thereof are the flange portions 11 of the drum core 10. , 11 are fixed to the plate-like core facing surfaces 11B, 11B by an adhesive or the like. By providing the plate-like core 20 on the drum core 10, the common mode filter 1 has a closed magnetic circuit structure. Thereby, since the leakage magnetic flux of the common mode filter 1 is reduced, the impedance characteristics of the common mode filter 1 can be improved, and the generation of noise can be suppressed.

  The dimensions of each part are as follows. The common mode filter 1 is about 4.5 mm long × 3.2 mm wide × height 2.8 mm. The distance between the facing surface 41B of the electrode 40 and the facing surface 11H of the flange 11 when the electrode 40 is attached to the flange 11 is about 5 to 150 μm. Moreover, the thickness of the conductive paste P is about 100 to 150 μm.

  The common mode filter according to the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made within the scope described in the claims. For example, the shape of the mounting portion 41 of the electrode 40 and the stepped portion 11G of the flange portions 11 and 11 is not limited to the shape in the present embodiment. For example, as shown in FIG. 5, a structure having a groove portion 21G instead of the step portion 11G may be used. In the case of such a structure, the width (length in the left-right direction) of the mounting portion 41 is made smaller than the length in the left-right direction of the facing surface 11H of the flange portion 11, and a gap is formed between the end surface of the mounting portion 41 and the side surface 21K. The conductive paste P may be interposed in the gap. Of course, a gap may be formed between the end surface of the mounting portion 41 and the side surface 21K, and at the same time, a gap may be formed between the end surface of the mounting portion 41 and the regulating surface 11J. 5A is a diagram in which the side wall 21K is omitted, and FIG. 5B is a diagram in which the regulation wall 11J is omitted.

  Moreover, although the electrode 40 and the collar part 11 were fixed with the adhesive agent, an adhesive agent was not provided, but the connection surface 11A of the collar part 11 and the opposing surface 11H were provided with a recessed part or a convex part, You may fix by providing the fitting surface 42B and the opposing surface 41B by providing the protrusion or hollow which can be fitted with a recessed part or a convex part. In the case of such a configuration, the gap formed between the facing surface 41B of the electrode 40 and the facing surface 11H of the flange portion 11 can be adjusted by adjusting the height of the convex portion or the protrusion. In addition, you may use together such a structure and an adhesive agent.

  Moreover, although the common mode filter 1 was provided with the two conducting wires 30 and 30, it is not limited to this number. In this case, the electrodes may be provided in a number corresponding to the number of conductors in each of the pair of flanges, and one end of each conductor may be joined to one electrode.

  In the left-right direction, the width of the mounting portion 41 and the width of the connecting portion 43 are the same, but at least the width of the mounting portion on the side opposite to the winding core and the width of the connecting portion of the electrode are the same. What is necessary is just to have, and the part of the mounting part by the side of a core part may be thinner than the width | variety of a connection part.

  Moreover, although the plating of the electrode 40 is configured by performing Ni plating and Au plating in this order, the plating of the surface layer portion is not limited to Au plating. It only needs to be plated with a metal material that does not oxidize when the conductive paste P for electrically connecting the electrode and the electrode pattern is applied. For example, silver plating or silver palladium plating is used instead of Au plating. May be.

  Moreover, the dimension of each part is not limited to the value of the above-mentioned embodiment.

  The electronic component and the electronic component mounting structure of the present invention can be used for a common mode filter that requires high bonding strength to a circuit board.

The upper perspective view which shows the state by which the electronic component which concerns on embodiment of this invention was mounted on the board | substrate. The lower perspective view which shows the electronic component which concerns on embodiment of this invention. 1 is an exploded perspective view showing an electronic component according to an embodiment of the present invention. (A) The expanded side view seen from arrow IVa of FIG. 1, and the front view seen from arrow IVb of (b) (a). The electronic component by another embodiment of the present invention shows the state where it was mounted on the substrate. (A) Enlarged side view, (b) Front view seen from arrow Vb of (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,100 ... Common mode filter 2 ... Circuit board 2A ... Electrode pattern 10 ... Drum core 11 ... Gutter 11A ... Connection surface 11B ... Plate-shaped core opposing surface 11C ··· Mounting surface 11c ··· groove 11D ··· side surface 11E ··· side surface 11F ··· exposed region 11G ··· stepped portion 11H · · ..Adhesive surface 12 ... Core 20 ... Plate core 21G ... Groove 21K ... Side 30 ... Conductor 40 ... Electrode 41 ... Mount 41A ... Mount surface 41B ... Opposing surface 42 ... Connecting portion 42A ... Connecting piece 42B ... Fitting surface 43 ... Connecting portion P ... Conductive paste

Claims (8)

A component body made of ceramic;
A metal fitting supported by the component main body and connected to the substrate along one surface of the component main body;
An electronic component comprising a conductive paste interposed between the substrate and the metal fitting and between the component main body and the metal fitting and in contact with the component main body, the metal fitting and the substrate. In the component main body, a stepped portion including the one surface on which the metal fitting can be fitted is formed,
The electronic component according to claim 1, wherein the conductive paste is interposed between the metal fitting and the stepped portion in a state where the metal fitting is fitted to the stepped portion. The metal fitting has a substantially U shape having a facing surface facing the one surface,
The electronic component according to claim 2, wherein the conductive paste is interposed between the facing surface and the one surface. The metal fitting has an end surface indicating the thickness of the metal fitting,
The electronic component according to claim 2, wherein the conductive paste is interposed between an end surface indicating the plate thickness and the stepped portion.   The step portion has a groove portion defined by a pair of side surfaces and a bottom surface, and the metal fitting is fitted to the step portion so that an end surface indicating the plate thickness faces the pair of side surfaces, and the conductive portion The electronic component according to claim 4, wherein the conductive paste is interposed between an end surface indicating the plate thickness and the side surface. The metal fitting is connected to a substrate and has a mounting surface opposite to the opposing surface, and the one surface of the component main body is disposed to oppose the substrate,
4. The electronic component according to claim 3, wherein a surface of the component main body facing the substrate, excluding the one surface, is flush with the mounting surface of the metal fitting.   The conductive paste is interposed between the component main body and the metal fitting to form an interposed portion, and the conductive paste is formed on the surface of the component main body that is not opposed to the metal fitting from the intermediate portion. The electronic component according to claim 1, wherein the electronic component extends integrally. A substrate made of ceramic;
A component body made of ceramic, disposed on the substrate, and having a surface disposed opposite to the substrate;
A mounting surface connected to the substrate, and a metal fitting supported by the component body along the one surface of the component body;
Mounting of an electronic component comprising: a conductive paste interposed between the substrate and the mounting surface, and between the component main body and the metal fitting, and in contact with the component main body, the metal fitting, and the substrate. Construction.

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