JP2000323819A - Mounting structure of surface mount part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a desired electric circuit surely by forming a coating between respective conductor electrodes such that grooves having widest interval to the bottom face of a surface mounting part are formed and ridge parts having narrowest interval to the surface mounting part are formed on the opposite sides of the groove wherein the narrowest part of the ridge part is substantially in parallel with the electrode. SOLUTION: A pair of electrodes 1a, 1b are formed at the left and right ends of a surface mounting part 1 and brought into contact with conductor pattern electrodes 2a, 2b through a conductive adhesive 3 so that respective parts are connected electrically through the conductor pattern electrodes 2a, 2b. Furthermore, a coating 10 having two ridge parts 10a and groove parts 10b is provided between the opposite conductor pattern electrodes 2a, 2b and the gap between the top of each ridge part 10a and the body part of the surface mounting part 1 is made narrowest so that the top of the ridge part 10a will be substantially parallel with the conductor pattern electrodes 2a, 2b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a mounting structure of a surface mount component mounted on a printed wiring board.

[0002]

2. Description of the Related Art A conventional mounting structure of a surface mount component is shown in FIG.
3 (a) is a plan view, and FIG.
FIG. 3B is a cross-sectional view taken along line CC of FIG.
Reference numeral 02 denotes a printed wiring board on which a plurality of components are mounted, and a conductor pattern electrode 04 is formed in a predetermined area on the surface. Reference numeral 01 denotes a surface mount component, and electrodes 07 are formed at left and right ends. The electrode 07 is in contact with the conductor pattern electrode 04 via the conductive adhesive 05, and makes electrical connection between components by the conductor pattern electrode 04 formed in a predetermined region. Reference numeral 06 denotes an electrode-side coating, which is provided to protect the conductor pattern electrode 04 on which the surface mount component 01 is not formed. 08 is a film provided between the opposing conductor pattern electrodes 07,
When the surface mount component 01 is mounted on the conductive adhesive 05, the surface mount component 01 is provided to form a step for preventing the left and right conductive adhesives 05 from being connected and bonded by the weight of the surface mount component 01. It is a coating. Next, a method of forming the surface mount component 01 will be described. First, a predetermined conductor pattern electrode 04 is formed on a printed wiring board 02 by printing. Next, the conductive adhesive 05
The electrode-side coating 06 and the coating 08 for protecting the conductive pattern electrode 04 are coated on the conductive pattern electrode 04 except for the portion where the conductive pattern electrode 04 is formed. Next, a conductive adhesive 05 is formed on the conductive pattern electrode 04 in a desired area by printing. Finally, the surface mount component 01 is mounted so that the electrode 07 adheres to the conductive adhesive 05, and the substrate on which the surface mount component 01 shown in FIG. 3 is mounted is completed.

[0003]

However, in the mounting structure of the conventional surface mount component, the coating 08 is provided to prevent the left and right conductive adhesives 05 from being connected at the time of mounting the surface mount component 01. However, when the gap between the coating film 08 and the surface-mounted component 01 has changed from a predetermined value due to the amount of the conductive adhesive 07 or a variation in individual thickness of the surface-mounted component 01, Due to the capillary phenomenon, the conductive adhesive 05 may be connected, and the left and right electrodes 07 may be electrically connected, so that a desired electric circuit may not be obtained. The present invention has been made in view of the above problems, and in the mounting structure of the surface mount component, even if the amount of the conductive adhesive or the thickness of the surface mount component varies, the electrodes are not electrically connected. It is an object of the present invention to provide a surface mounting component mounting structure capable of reliably obtaining the above electric circuit.

[0004]

In order to solve the above problems, according to the first aspect of the present invention, a printed wiring board, a plurality of conductor electrodes formed in a predetermined region on the printed wiring board, and In a mounting structure of a surface-mounted component including a surface-mounted component having electrodes connected to each conductive electrode via a conductive adhesive, and a coating formed between each of the conductive electrodes, the coating has a surface Along with having at least one groove where the distance from the bottom surface of the mounted component is the largest,
A ridge sandwiching the groove and having the smallest distance from the surface mount component is provided, and the narrowest portion of the ridge is formed so as to be substantially parallel to the electrode. Further, in the second aspect of the present invention, in the surface mounting component mounting structure according to the first aspect, the crest of the coating is such that the distance between the end and the electrode is closer than other parts. According to the third aspect of the present invention, in the surface mounting component mounting structure according to the first or second aspect, the space between the narrowest portion of one peak and the narrowest portion of the other peak is large. And narrow portions are alternately repeated.

[0005]

According to the first aspect of the present invention, the coating has at least one groove having the largest space between the film and the bottom surface of the surface-mounted component, sandwiches the groove, and is provided with the surface-mounted component. Are formed so as to be substantially parallel to the electrodes, and the following effects are obtained. When the surface-mounted component is mounted on the printed wiring board to which the conductive adhesive has been supplied, the conductive adhesive is crushed by the surface-mounted component and tends to protrude from the conductor electrode. At this time, the conductive adhesive that is to protrude inward is blocked by the step with the crest of the coating. After that, when the gap between the narrowest part between the surface mount component and the coating is reduced by releasing the force applied to the surface mount component or receiving heat during the manufacturing process, the capillary phenomenon The conductive adhesive attempts to proceed. At this time, since the narrowest part is formed so as to be substantially parallel to the electrode as described above,
It travels the narrowest part while keeping a certain distance from the electrode.
Therefore, the conductive adhesive does not reach the electrodes,
In addition, the conductive adhesives that advance to the electrodes do not adhere to each other, and thus electrical insulation can be reliably maintained. Therefore, even if the amount of the conductive adhesive or the thickness of the surface mount component varies, a desired electric circuit can be reliably obtained because the electrodes are not connected. According to the second aspect of the present invention, in the surface mount component mounting structure according to the first aspect, the peak of the coating is such that the distance between the end and the electrode is closer than other portions. As a result, the conductive adhesive that has proceeded comes to the electrode side at the end, and can be further prevented from proceeding to the other electrode. According to the third aspect of the present invention, in the surface mounting component mounting structure according to the first or second aspect, the distance between the narrowest portion of one peak and the narrowest portion of the other peak is: Since the wide area and the narrow area are formed so as to be alternately repeated, a part of the conductive adhesive that advances is left in a portion generated by the gap between the wide area and the narrow area. It is possible to reduce the amount of progress to the part itself. Therefore, the progress of the conductive adhesive to the other electrode can be further prevented.

[0006]

(Embodiment 1) Embodiment 1 of the present invention will be described with reference to FIG. FIG. 1A is a plan view showing a mounting structure of the surface mount component according to the first embodiment, and FIG. 1B is a cross-sectional view taken along line AA in FIG.
Reference numeral 2 denotes a printed wiring board on which a plurality of components are mounted, and conductor pattern electrodes 2a, 2
b is formed. Reference numeral 1 denotes a surface mount component, and electrodes 1a and 1b are formed at left and right ends. These electrodes 1
a and 1b are in contact with the conductor pattern electrodes 2a and 2b via the conductive adhesive 3, and are electrically connected between the components by the conductor pattern electrodes 2a and 2b formed in predetermined regions. Reference numeral 4 denotes an electrode-side coating, which is provided to protect the conductor pattern electrodes 2a and 2b in portions where the surface mount component 1 is not formed. Reference numeral 10 denotes a coating provided between the opposing conductor pattern electrodes 2a and 2b, and includes a peak 10a and a groove 10b. This coating 1
0 is formed such that there are two peaks 10a in the cross section, and the top of the peak 10a approaches the electrodes 1a and 1b at the upper end and the lower end as shown in FIG. It is curved. Note that 1c is referred to as the abdomen of the surface mount component 1.

Next, a method of mounting the surface mount component 1 will be described. First, predetermined conductor pattern electrodes 2a and 2b are formed on a printed wiring board 2 by printing.
Next, an electrode-side coating 4 for protecting the conductive pattern electrodes 2a and 2b and a coating 10 are coated on the conductive pattern electrodes 2a and 2b except for a portion where the conductive adhesive 3 is formed. Next, the conductor pattern electrodes 2a, 2
The conductive adhesive 3 is formed by printing on b. Next, the surface-mounted component 1 is mounted so that the electrodes 1a and 1b adhere to the conductive adhesive 3, and the substrate on which the surface-mounted component 1 shown in FIG. 1 is mounted is completed.

Next, the operation when mounting the surface mount component 101 will be described. When the surface-mounted component 1 is mounted on the printed wiring board 2 to which the conductive adhesive 3 has been supplied, the conductive adhesive 3 is crushed by the surface-mounted component 1,
Attempts to protrude from the conductor pattern electrodes 2a and 2b. At this time, the conductive adhesive 3 that protrudes outward is
It is blocked by a step created by the conductor pattern electrodes 2a, 2b and the electrode-side coating 4. On the other hand, the conductive adhesive 3 that tries to protrude inward is printed wiring board 2.
And the crest 10a of the coating 10 is blocked by the step, and it is attempted to proceed from one conductor pattern electrode 2a (or 2b) to the other conductor pattern electrode 2b (or 2a), that is, in the direction of the opposite electrode. Conductive adhesive 3
To block. Thereafter, the gap between the abdomen 1c of the surface-mounted component 1 and the crest 10a of the coating 10 is reduced by releasing the force applied to the surface-mounted component 1 or receiving heat during the manufacturing process. In this case, the conductive adhesive 3 tends to advance due to a capillary phenomenon. The capillary phenomenon is a phenomenon in which a place where the gap is narrowest is selected to proceed, and in the present embodiment, the gap between the abdomen 1c of the surface mount component 1 and the top of the crest 10a of the coating 10 is reduced. The top of the crest 10a is formed so as to be substantially parallel to the conductor pattern electrodes 2a and 2b, and the electrodes 1a and 1b are formed at the ends thereof.
It is formed to be curved to the side. Therefore,
The conductive adhesive 3 that has reached the top of the peak 10a keeps the top of the peak 10a in the vertical direction of the drawing at a certain distance from the other electrode, and finally moves away from the other electrode 1. Proceed to Therefore, the conductive adhesive 3 does not reach the other electrode, and the conductive adhesives that progress to the other electrode do not adhere to each other, and therefore, the electrical insulation is ensured. Can be kept. Therefore,
Even if the amount of the conductive adhesive 3 or the thickness of the surface mount component 1 varies, a desired electric circuit can be reliably obtained because the electrodes 1a and 1b are not connected.

(Embodiment 2) Next, Embodiment 2 of the present invention will be described with reference to FIG. FIG. 2A is a plan view showing a mounting structure of the surface mount component according to the second embodiment.
2B is a cross-sectional view of FIG. 2A taken along line BB. The present embodiment differs from the first embodiment in that the crests 10a of the coating 10 of the first embodiment are substantially parallel to each other in a plan view, but are formed in a scale-like shape. The other parts are the same as those in the first embodiment, and thus description thereof is omitted.

Next, the operation will be described. The step between the conductive adhesive 3 and the electrode-side coating 4 and the step between the conductive adhesive 3 and the crest 20a of the coating 20 block the progress of the adhesive 3. This is the same as in the first embodiment. Thereafter, the gap between the abdomen 1c of the surface-mounted component 1 and the crest 20a of the coating 20 was reduced by releasing the force applied to the surface-mounted component 1 or receiving heat in the manufacturing process. In this case, the conductive adhesive 3 tends to advance due to a capillary phenomenon. In the present embodiment, the narrowest gap where the capillary phenomenon occurs is the gap between the abdomen 1c of the surface mount component 1 and the top of the peak 20a of the coating 20, and the peak 2
The top of Oa is formed like a scale, that is, a plurality of substantially semicircles are connected. Therefore, the conductive adhesive 3 that has reached the top of the peak 20a travels in the vertical direction in the drawing so as to trace the top of the peak 20a. At this time, a portion of the conductive adhesive 3 that progresses remains in a gap between the semicircles. That is, in the portion where the semicircles are connected, the amount of the conductive adhesive 3 that advances is gradually reduced. Therefore, the conductive adhesive 3 does not reach the other electrode, and the conductive adhesives that progress to the other electrode do not adhere to each other, and therefore, the electrical insulation is ensured. Can be more reliably maintained. Therefore, even if the amount of the conductive adhesive 3 or the thickness of the surface mount component 1 varies, a desired electric circuit can be reliably obtained because the electrodes 2a and 2b are not connected.

[Brief description of the drawings]

FIG. 1 is a diagram showing a mounting structure of a surface mount component according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a mounting structure of a surface mount component according to a second embodiment.

FIG. 3 is a view showing a mounting structure of a conventional surface mount component.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 surface mount component 1a electrode 1b electrode 1c abdomen 2 printed wiring board 2a conductive pattern electrode 2b conductive pattern electrode 3 conductive adhesive 4 electrode side coating 10 coating 10a peak 10b groove 20 coating 20a peak 20b groove

Claims (3)

[Claims] 1. A surface mounting apparatus comprising: a printed wiring board; a plurality of conductive electrodes formed in predetermined regions on the printed wiring board; and electrodes connected to the respective conductive electrodes via a conductive adhesive. In a mounting structure of a surface-mounted component, comprising: a component; and a coating formed between the conductor electrodes, the coating has at least one groove portion in which a distance from a bottom surface of the surface-mounted component is the largest. A groove that sandwiches the groove, and has a narrowest gap with the surface-mounted component; and the narrowest part of the peak is formed so as to be substantially parallel to the electrode. The mounting structure of the surface mount component. 2. The surface mounting component according to claim 1, wherein the crest of the coating has a distance between an end and the electrode closer to each other than another portion. Component mounting structure. 3. The mounting structure for a surface mount component according to claim 1, wherein a distance between the narrowest portion of the one peak and the narrowest portion of the other peak alternates between a wide portion and a narrow portion. A surface mounting component mounting structure characterized by being formed so as to be repeated.