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DE602008003955D1 - Lichtemittierende Vorrichtung - Google Patents

Lichtemittierende Vorrichtung

Info

Publication number
DE602008003955D1
DE602008003955D1 DE602008003955T DE602008003955T DE602008003955D1 DE 602008003955 D1 DE602008003955 D1 DE 602008003955D1 DE 602008003955 T DE602008003955 T DE 602008003955T DE 602008003955 T DE602008003955 T DE 602008003955T DE 602008003955 D1 DE602008003955 D1 DE 602008003955D1
Authority
DE
Germany
Prior art keywords
light
emitting device
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008003955T
Other languages
English (en)
Inventor
Hisayoshi Daicho
Takeshi Iwasaki
Kiminori Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Publication of DE602008003955D1 publication Critical patent/DE602008003955D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
DE602008003955T 2007-07-12 2008-07-10 Lichtemittierende Vorrichtung Active DE602008003955D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007183062 2007-07-12
JP2008159817A JP4999783B2 (ja) 2007-07-12 2008-06-19 発光装置

Publications (1)

Publication Number Publication Date
DE602008003955D1 true DE602008003955D1 (de) 2011-01-27

Family

ID=40247223

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008003955T Active DE602008003955D1 (de) 2007-07-12 2008-07-10 Lichtemittierende Vorrichtung

Country Status (4)

Country Link
JP (2) JP4999783B2 (de)
KR (1) KR101021210B1 (de)
CN (1) CN101345282B (de)
DE (1) DE602008003955D1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4999783B2 (ja) * 2007-07-12 2012-08-15 株式会社小糸製作所 発光装置
WO2010025876A1 (de) * 2008-09-04 2010-03-11 Bayer Materialscience Ag Lichtemittierende vorrichtung und verfahren zu deren herstellung
JP2010251686A (ja) * 2009-03-26 2010-11-04 Harison Toshiba Lighting Corp 発光装置及びその製造方法
WO2010150459A1 (ja) * 2009-06-23 2010-12-29 株式会社小糸製作所 発光モジュール
JP5530128B2 (ja) * 2009-07-31 2014-06-25 株式会社小糸製作所 蛍光体および発光装置
JP5368913B2 (ja) * 2009-09-02 2013-12-18 スタンレー電気株式会社 発光装置およびその製造方法
JP5532769B2 (ja) * 2009-09-07 2014-06-25 日亜化学工業株式会社 蛍光体及びそれを用いた発光装置並びに蛍光体の製造方法
KR100986336B1 (ko) * 2009-10-22 2010-10-08 엘지이노텍 주식회사 발광소자, 발광소자 제조방법 및 발광소자 패키지
WO2011077637A1 (ja) 2009-12-21 2011-06-30 株式会社小糸製作所 蛍光体および発光装置
JPWO2011092798A1 (ja) * 2010-01-27 2013-05-30 株式会社小糸製作所 蛍光体および発光装置
JP2011181793A (ja) * 2010-03-03 2011-09-15 Koito Mfg Co Ltd 発光装置
WO2011129320A1 (ja) * 2010-04-13 2011-10-20 コニカミノルタオプト株式会社 発光装置及びその製造方法
JP5566263B2 (ja) * 2010-11-08 2014-08-06 株式会社小糸製作所 発光モジュール
JP2012114333A (ja) * 2010-11-26 2012-06-14 Koito Mfg Co Ltd 発光モジュール
EP2677017A4 (de) 2011-02-14 2015-08-19 Koito Mfg Co Ltd Verfahren zur herstellung einer fluoreszierenden substanz
JP2012190744A (ja) * 2011-03-14 2012-10-04 Koito Mfg Co Ltd 蛍光灯型ｌｅｄ灯具
JP2013042079A (ja) * 2011-08-19 2013-02-28 Sharp Corp 半導体発光装置
JP5794473B2 (ja) * 2011-09-08 2015-10-14 東芝ライテック株式会社 照明装置
KR101284796B1 (ko) 2011-10-05 2013-07-10 (주)포인트엔지니어링 캔 패지키 타입의 광 디바이스 제조 방법 및 이에 의해 제조된 광 디바이스
CN102386310A (zh) * 2011-11-07 2012-03-21 山西光宇半导体照明有限公司 一种led芯片支架
JP6215525B2 (ja) * 2012-10-23 2017-10-18 スタンレー電気株式会社 半導体発光装置
JPWO2014103330A1 (ja) * 2012-12-27 2017-01-12 コニカミノルタ株式会社 蛍光体分散液、ｌｅｄ装置およびその製造方法
CN103219449B (zh) * 2013-04-18 2016-12-28 东莞帝光电子科技实业有限公司 Led封装结构及led封装方法
CN104576883B (zh) 2013-10-29 2018-11-16 普因特工程有限公司 芯片安装用阵列基板及其制造方法
JP6195117B2 (ja) * 2013-12-03 2017-09-13 パナソニックＩｐマネジメント株式会社 酸塩化物蛍光体、発光装置、照明装置、及び車両
JP6331389B2 (ja) * 2013-12-27 2018-05-30 日亜化学工業株式会社 発光装置
JP6282485B2 (ja) * 2014-02-24 2018-02-21 スタンレー電気株式会社 半導体発光素子
JP6378595B2 (ja) 2014-09-19 2018-08-22 東京エレクトロン株式会社 基板搬送装置
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
CN105642376B (zh) * 2015-12-29 2018-07-10 南京邮电大学 一种生物荧光微全分析系统芯片及其制备方法
WO2017130596A1 (ja) * 2016-01-28 2017-08-03 ソニー株式会社 半導体発光装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501100B1 (en) * 2000-05-15 2002-12-31 General Electric Company White light emitting phosphor blend for LED devices
JP3985486B2 (ja) * 2001-10-01 2007-10-03 松下電器産業株式会社 半導体発光素子とこれを用いた発光装置
JP4032173B2 (ja) * 2002-05-31 2008-01-16 東ソー株式会社 蛍光体及び発光素子
JP4363194B2 (ja) * 2004-01-16 2009-11-11 三菱化学株式会社 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置
JP4890017B2 (ja) * 2005-01-26 2012-03-07 株式会社小糸製作所 青色発光蛍光体およびそれを用いた発光モジュール
JP2007145958A (ja) * 2005-11-25 2007-06-14 Matsushita Electric Works Ltd 蛍光体及び発光装置
US20070145879A1 (en) * 2005-12-22 2007-06-28 Abramov Vladimir S Light emitting halogen-silicate photophosphor compositions and systems
CN100590172C (zh) * 2006-07-26 2010-02-17 北京有色金属研究总院 一种含硅的led荧光粉及其制造方法和所制成的发光器件
JP5222600B2 (ja) * 2007-04-05 2013-06-26 株式会社小糸製作所 蛍光体
DE102008017039A1 (de) * 2007-04-05 2008-10-09 Koito Manufacturing Co., Ltd. Leuchtstoff
JP4999783B2 (ja) * 2007-07-12 2012-08-15 株式会社小糸製作所 発光装置

Also Published As

Publication number Publication date
CN101345282A (zh) 2009-01-14
KR101021210B1 (ko) 2011-03-11
JP2009038348A (ja) 2009-02-19
KR20090006790A (ko) 2009-01-15
CN101345282B (zh) 2011-07-06
JP2012186494A (ja) 2012-09-27
JP4999783B2 (ja) 2012-08-15

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