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DE50313572D1 - Anode zur galvanisierung - Google Patents

Anode zur galvanisierung

Info

Publication number
DE50313572D1
DE50313572D1 DE50313572T DE50313572T DE50313572D1 DE 50313572 D1 DE50313572 D1 DE 50313572D1 DE 50313572 T DE50313572 T DE 50313572T DE 50313572 T DE50313572 T DE 50313572T DE 50313572 D1 DE50313572 D1 DE 50313572D1
Authority
DE
Germany
Prior art keywords
anode
galvanization
electroplating
shield
reduced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50313572T
Other languages
English (en)
Inventor
Joerg Wurm
Stephane Menard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metakem Gesellschaft fur Schichtchemie der Metalle mbH
Micropulse Plating Concepts SAS MPC
Original Assignee
Metakem Gesellschaft fur Schichtchemie der Metalle mbH
Micropulse Plating Concepts SAS MPC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metakem Gesellschaft fur Schichtchemie der Metalle mbH, Micropulse Plating Concepts SAS MPC filed Critical Metakem Gesellschaft fur Schichtchemie der Metalle mbH
Priority to DE50313572T priority Critical patent/DE50313572D1/de
Application granted granted Critical
Publication of DE50313572D1 publication Critical patent/DE50313572D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Magnetic Heads (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE50313572T 2002-12-23 2003-12-23 Anode zur galvanisierung Expired - Lifetime DE50313572D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50313572T DE50313572D1 (de) 2002-12-23 2003-12-23 Anode zur galvanisierung

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10261493A DE10261493A1 (de) 2002-12-23 2002-12-23 Anode zur Galvanisierung
DE50313572T DE50313572D1 (de) 2002-12-23 2003-12-23 Anode zur galvanisierung
PCT/EP2003/014785 WO2004059045A2 (de) 2002-12-23 2003-12-23 Anode zur galvanisierung

Publications (1)

Publication Number Publication Date
DE50313572D1 true DE50313572D1 (de) 2011-05-05

Family

ID=32478077

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10261493A Withdrawn DE10261493A1 (de) 2002-12-23 2002-12-23 Anode zur Galvanisierung
DE50313572T Expired - Lifetime DE50313572D1 (de) 2002-12-23 2003-12-23 Anode zur galvanisierung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10261493A Withdrawn DE10261493A1 (de) 2002-12-23 2002-12-23 Anode zur Galvanisierung

Country Status (10)

Country Link
US (1) US7943032B2 (de)
EP (1) EP1581673B1 (de)
JP (1) JP4346551B2 (de)
KR (1) KR101077000B1 (de)
CN (1) CN101027432B (de)
AT (1) ATE503043T1 (de)
AU (1) AU2003296716A1 (de)
DE (2) DE10261493A1 (de)
ES (1) ES2363278T3 (de)
WO (1) WO2004059045A2 (de)

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* Cited by examiner, † Cited by third party
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JP5156175B2 (ja) * 2004-10-29 2013-03-06 Ｆｄｋエナジー株式会社 ニッケル光沢メッキを施した電池
EP1712660A1 (de) 2005-04-12 2006-10-18 Enthone Inc. Unlösliche Anode
EP1717351A1 (de) 2005-04-27 2006-11-02 Enthone Inc. Galvanikbad
DE102005051632B4 (de) 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
US20090095927A1 (en) * 2005-11-04 2009-04-16 Mccarthy Matthew Thermally actuated valves, photovoltaic cells and arrays comprising same, and methods for producing same
EP2009147A1 (de) * 2007-06-20 2008-12-31 METAKEM Gesellschaft für Schichtchemie der Metalle GmbH Anodenanordnung zum Galvanisieren
TWI384094B (zh) * 2008-02-01 2013-02-01 Zhen Ding Technology Co Ltd 電鍍用陽極裝置及包括該陽極裝置之電鍍裝置
FR2927909B1 (fr) * 2008-02-26 2010-03-26 Serme Cache souple pour support galvanique, support et procede de mise en oeuvre
EP2123799B1 (de) * 2008-04-22 2015-04-22 Rohm and Haas Electronic Materials LLC Verfahren zum Nachfüllen von Indiumionen in Indium-Elektroplattierzusammensetzungen
DE202008006707U1 (de) 2008-05-16 2008-08-07 Saueressig Gmbh & Co. Vorrichtung zum Glavanisieren von Werkstücken
US8236163B2 (en) * 2009-09-18 2012-08-07 United Technologies Corporation Anode media for use in electroplating processes, and methods of cleaning thereof
TWI422714B (zh) * 2010-11-24 2014-01-11 Intech Electronics Co Ltd 電鍍裝置及其電鍍槽中的電極板結構
CN102477576A (zh) * 2010-11-30 2012-05-30 加贺开发科技有限公司 电镀装置及其电镀槽中的电极板结构
CN103820839A (zh) * 2014-01-14 2014-05-28 杭州三耐环保科技有限公司 一种高效抑制电积酸雾的阴阳极板结构及其实现方法
CN104073862A (zh) * 2014-07-11 2014-10-01 张钰 一种用于碱性锌镍合金电镀的不溶性阳极装置
US10428439B2 (en) * 2015-11-16 2019-10-01 Intel Corporation Predictive capability for electroplating shield design
PL3914757T4 (pl) 2019-01-24 2023-08-21 Atotech Deutschland GmbH & Co. KG Sposób elektrolitycznego osadzania stopu cynkowo-niklowego z zastosowaniem membranowego systemu anodowego
CN110029381B (zh) * 2019-04-25 2020-12-15 首钢集团有限公司 一种高镀锡量镀锡板的生产方法
CN113106527B (zh) * 2021-04-19 2024-09-10 深圳铱创科技有限公司 不溶性阳极及脉冲电镀设备

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JPS5213300Y2 (de) * 1971-02-01 1977-03-25
US3875041A (en) * 1974-02-25 1975-04-01 Kennecott Copper Corp Apparatus for the electrolytic recovery of metal employing improved electrolyte convection
US4075069A (en) * 1975-04-10 1978-02-21 Mitsui Mining & Smelting Co., Ltd. Processes for preventing the generation of a mist of electrolyte and for recovering generated gases in electrowinning metal recovery, and electrodes for use in said processes
JPS59226189A (ja) * 1983-06-06 1984-12-19 Nippon Steel Corp 鉄系電気メツキにおけるメツキ液の通電酸化抑制方法
GB8327300D0 (en) * 1983-10-12 1983-11-16 Deso Inc Acid mist reduction
JP2722259B2 (ja) * 1989-09-14 1998-03-04 ペルメレック電極株式会社 電極保護体
JPH0452296A (ja) * 1990-06-20 1992-02-20 Permelec Electrode Ltd 銅めっき方法
JPH08376Y2 (ja) * 1990-08-15 1996-01-10 株式会社アルメックス 不溶解性陽極を用いたメッキ装置
JPH086198B2 (ja) * 1990-08-15 1996-01-24 株式会社アルメックス 水平搬送型メッキ装置
JP3468545B2 (ja) * 1993-04-30 2003-11-17 ペルメレック電極株式会社 電解用電極
JPH07316861A (ja) 1994-05-24 1995-12-05 Permelec Electrode Ltd 電極構造体
JP3188361B2 (ja) * 1994-06-27 2001-07-16 ペルメレック電極株式会社 クロムめっき方法
DE19545231A1 (de) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
JP3523197B2 (ja) * 1998-02-12 2004-04-26 エーシーエム リサーチ，インコーポレイティド メッキ設備及び方法
DE19834353C2 (de) * 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkalisches Zink-Nickelbad
DE19845506A1 (de) 1998-10-02 2000-04-06 Wieland Edelmetalle Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil
US6120658A (en) * 1999-04-23 2000-09-19 Hatch Africa (Pty) Limited Electrode cover for preventing the generation of electrolyte mist
US6254742B1 (en) * 1999-07-12 2001-07-03 Semitool, Inc. Diffuser with spiral opening pattern for an electroplating reactor vessel
US6156169A (en) * 1999-10-06 2000-12-05 Jyu Lenq Enterprises Co., Ltd. Electroplating anode titanium basket
US6755960B1 (en) * 2000-06-15 2004-06-29 Taskem Inc. Zinc-nickel electroplating
WO2001096631A1 (en) 2000-06-15 2001-12-20 Taskem Inc. Zinc-nickel electroplating
US6402909B1 (en) * 2000-10-02 2002-06-11 Advanced Micro Devices, Inc. Plating system with shielded secondary anode for semiconductor manufacturing
US6425991B1 (en) * 2000-10-02 2002-07-30 Advanced Micro Devices, Inc. Plating system with secondary ring anode for a semiconductor wafer
US6391170B1 (en) * 2000-12-01 2002-05-21 Envirotech Pumpsystems, Inc. Anode box for electrometallurgical processes
US6852209B2 (en) * 2002-10-02 2005-02-08 Applied Materials, Inc. Insoluble electrode for electrochemical operations on substrates

Also Published As

Publication number Publication date
WO2004059045A2 (de) 2004-07-15
ES2363278T3 (es) 2011-07-28
US20060124454A1 (en) 2006-06-15
EP1581673A2 (de) 2005-10-05
JP2006511712A (ja) 2006-04-06
JP4346551B2 (ja) 2009-10-21
KR101077000B1 (ko) 2011-10-26
AU2003296716A1 (en) 2004-07-22
DE10261493A1 (de) 2004-07-08
EP1581673B1 (de) 2011-03-23
CN101027432A (zh) 2007-08-29
CN101027432B (zh) 2010-09-29
ATE503043T1 (de) 2011-04-15
US7943032B2 (en) 2011-05-17
WO2004059045A3 (de) 2005-02-24
AU2003296716A8 (en) 2004-07-22
KR20050085863A (ko) 2005-08-29

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