DE3678115D1 - Vorrichtung zum foerdern einer basisplatte wie zum beispiel einer leiterplatte. - Google Patents
Vorrichtung zum foerdern einer basisplatte wie zum beispiel einer leiterplatte.Info
- Publication number
- DE3678115D1 DE3678115D1 DE8686114571T DE3678115T DE3678115D1 DE 3678115 D1 DE3678115 D1 DE 3678115D1 DE 8686114571 T DE8686114571 T DE 8686114571T DE 3678115 T DE3678115 T DE 3678115T DE 3678115 D1 DE3678115 D1 DE 3678115D1
- Authority
- DE
- Germany
- Prior art keywords
- promoting
- circuit board
- board
- base board
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
- Y10T156/1322—Severing before bonding or assembling of parts
- Y10T156/1339—Delivering cut part in sequence to serially conveyed articles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1712—Indefinite or running length work
- Y10T156/1741—Progressive continuous bonding press [e.g., roll couples]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Feeding Of Workpieces (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60236863A JPS6299045A (ja) | 1985-10-22 | 1985-10-22 | 基板送り装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3678115D1 true DE3678115D1 (de) | 1991-04-18 |
Family
ID=17006913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686114571T Expired - Fee Related DE3678115D1 (de) | 1985-10-22 | 1986-10-21 | Vorrichtung zum foerdern einer basisplatte wie zum beispiel einer leiterplatte. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4828247A (de) |
EP (1) | EP0225992B1 (de) |
JP (1) | JPS6299045A (de) |
DE (1) | DE3678115D1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0659965B2 (ja) * | 1988-01-30 | 1994-08-10 | ソマール株式会社 | 薄膜の張付装置 |
IT1224722B (it) * | 1988-08-26 | 1990-10-18 | Morton Thiokol Inc Societa Del | Laminatore automatico ad elevata velocita' di laminazione per laproduzione di pannelli per circuiti stampati |
US4978401A (en) * | 1989-03-14 | 1990-12-18 | Bostec Systems, Inc. | Card assembly method |
US5080748A (en) * | 1989-03-14 | 1992-01-14 | Bostec Systems, Inc. | Card assembly apparatus |
JPH088432B2 (ja) * | 1990-06-01 | 1996-01-29 | ソマール株式会社 | 基板搬送装置 |
US5045144A (en) * | 1990-06-08 | 1991-09-03 | Bostec Systems, Inc. | Apparatus for applying strips to cards |
JPH0831710B2 (ja) * | 1990-10-17 | 1996-03-27 | ソマール株式会社 | 基板搬送装置 |
US5341240A (en) * | 1992-02-06 | 1994-08-23 | Linvatec Corporation | Disposable endoscope |
US5501442A (en) * | 1993-11-08 | 1996-03-26 | Xerox Corporation | Dual mode tamper/offsetter |
DE60218836T2 (de) * | 2001-05-16 | 2007-12-06 | Xyron, Inc., Scottsdale | Laminiervorrichtung mit einer verbesserten schneideinrichtung |
JP4862843B2 (ja) * | 2008-02-28 | 2012-01-25 | トヨタ自動車株式会社 | ベルト組付装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4025380A (en) * | 1975-07-24 | 1977-05-24 | International Business Machines Corporation | Variable resist laminator |
JPS5739138Y2 (de) * | 1976-10-25 | 1982-08-28 | ||
JPS546757A (en) * | 1977-06-17 | 1979-01-19 | Fuji Electric Co Ltd | Serial connection circuit for transistor |
US4659419A (en) * | 1983-05-11 | 1987-04-21 | Hakuto Co., Ltd. | Laminator for sticking film sheet on panel surface |
US4657239A (en) * | 1983-07-20 | 1987-04-14 | Ricoh Company, Ltd. | Sheet aligning device |
JPS6071229A (ja) * | 1983-09-29 | 1985-04-23 | Somar Corp | オ−トラミネ−タ |
CA1263125A (en) * | 1984-06-01 | 1989-11-21 | Hans-Guenter E. Kuehnert | Apparatus for the automatic feeding of a laminating station |
-
1985
- 1985-10-22 JP JP60236863A patent/JPS6299045A/ja active Granted
-
1986
- 1986-10-21 DE DE8686114571T patent/DE3678115D1/de not_active Expired - Fee Related
- 1986-10-21 EP EP86114571A patent/EP0225992B1/de not_active Expired - Lifetime
- 1986-10-22 US US06/921,512 patent/US4828247A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0327335B2 (de) | 1991-04-15 |
JPS6299045A (ja) | 1987-05-08 |
EP0225992B1 (de) | 1991-03-13 |
US4828247A (en) | 1989-05-09 |
EP0225992A1 (de) | 1987-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |