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DE3851118D1 - Leiterplatte. - Google Patents

Leiterplatte.

Info

Publication number
DE3851118D1
DE3851118D1 DE3851118T DE3851118T DE3851118D1 DE 3851118 D1 DE3851118 D1 DE 3851118D1 DE 3851118 T DE3851118 T DE 3851118T DE 3851118 T DE3851118 T DE 3851118T DE 3851118 D1 DE3851118 D1 DE 3851118D1
Authority
DE
Germany
Prior art keywords
circuit board
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3851118T
Other languages
English (en)
Inventor
Shin Kawakami
Satoshi Haruyama
Hirotaka Okonogi
Katsutomo Nikaido
Norito Mukai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Application granted granted Critical
Publication of DE3851118D1 publication Critical patent/DE3851118D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0039Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0715Shielding provided by an outer layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809Coaxial layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981Metallised walls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
DE3851118T 1987-09-19 1988-04-02 Leiterplatte. Expired - Lifetime DE3851118D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62235766A JPS6480094A (en) 1987-09-19 1987-09-19 Printed wiring board

Publications (1)

Publication Number Publication Date
DE3851118D1 true DE3851118D1 (de) 1994-09-22

Family

ID=16990918

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3851118T Expired - Lifetime DE3851118D1 (de) 1987-09-19 1988-04-02 Leiterplatte.

Country Status (4)

Country Link
US (1) US4885431A (de)
EP (1) EP0312682B1 (de)
JP (1) JPS6480094A (de)
DE (1) DE3851118D1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476970A (en) * 1984-02-16 1995-12-19 Velsicol Chemical Corporation Method for preparing aryl ketones
JPH01214100A (ja) * 1988-02-21 1989-08-28 Asahi Chem Res Lab Ltd 電磁波シールド回路及びその製造方法
ATE172837T1 (de) * 1993-02-02 1998-11-15 Ast Research Inc Leiterplattenanordnung mit abschirmungsgittern und herstellungsverfahren
US5334800A (en) * 1993-07-21 1994-08-02 Parlex Corporation Flexible shielded circuit board
US5473112A (en) * 1993-09-13 1995-12-05 Vlsi Technology, Inc. Security circuitry with select line and data line shielding
US5675299A (en) * 1996-03-25 1997-10-07 Ast Research, Inc. Bidirectional non-solid impedance controlled reference plane requiring no conductor to grid alignment
TW401724B (en) * 1998-01-27 2000-08-11 Hitachi Cable Wiring board, semiconductor, electronic device, and circuit board for electronic parts
SE516087C2 (sv) * 1999-02-02 2001-11-19 Ericsson Telefon Ab L M Anordning vid ledningsbärare och förfaranden för tillverkning av sådana ledningsbärare
JP2002094195A (ja) * 2000-09-12 2002-03-29 Sony Corp 信号配線基板及び信号配線基板の製造方法
US6542380B1 (en) * 2001-10-15 2003-04-01 Dell Products, L.P. Dielectric coupling of electromagnetic energy to an external current return path
US7186924B2 (en) * 2003-10-21 2007-03-06 International Business Machines Corporation Dielectric structure for printed circuit board traces
US8344819B2 (en) 2008-10-28 2013-01-01 Broadcom Corporation Conformal reference planes in substrates
JP2011010876A (ja) * 2009-07-02 2011-01-20 Niigataken Kosei Jigyo Kyodo Kosha:Kk タオルの殺菌方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US27089A (en) * 1860-02-07 thompson
US3391454A (en) * 1965-03-10 1968-07-09 Litton Systems Inc Shielded etched circuit conductor
US3461524A (en) * 1966-11-02 1969-08-19 Bell Telephone Labor Inc Method for making closely spaced conductive layers
US3837074A (en) * 1968-08-16 1974-09-24 Bunker Ramo Coaxial interconnections
US3613230A (en) * 1969-04-29 1971-10-19 Bunker Ramo Method of fabricating coaxial circuitry
JPS596861B2 (ja) * 1975-05-19 1984-02-15 オオツカセイヤク カブシキガイシヤ 5−〔(2−ハロゲノ−1−ヒドロキシ)アルキル〔カルボスチリル誘導体の製造法
JPS5577188A (en) * 1978-12-05 1980-06-10 Nippon Electric Co Hybrid integrated circuit
US4673904A (en) * 1984-11-14 1987-06-16 Itt Corporation Micro-coaxial substrate
US4707671A (en) * 1985-05-31 1987-11-17 Junkosha Co., Ltd. Electrical transmission line
US4725478A (en) * 1985-09-04 1988-02-16 W. R. Grace & Co. Heat-miniaturizable printed circuit board
JPH0644668B2 (ja) * 1985-09-05 1994-06-08 住友電気工業株式会社 シ−ルド付可撓性プリント回路基板
US4658334A (en) * 1986-03-19 1987-04-14 Rca Corporation RF signal shielding enclosure of electronic systems
JPH0627995Y2 (ja) * 1986-03-20 1994-07-27 株式会社東芝 シ−ルド構造
US4816616A (en) * 1987-12-10 1989-03-28 Microelectronics Center Of North Carolina Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes

Also Published As

Publication number Publication date
JPS6480094A (en) 1989-03-24
US4885431A (en) 1989-12-05
EP0312682B1 (de) 1994-08-17
EP0312682A2 (de) 1989-04-26
EP0312682A3 (de) 1991-01-02

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Legal Events

Date Code Title Description
8332 No legal effect for de