DE3850626D1 - Leiterplatte. - Google Patents
Leiterplatte.Info
- Publication number
- DE3850626D1 DE3850626D1 DE3850626T DE3850626T DE3850626D1 DE 3850626 D1 DE3850626 D1 DE 3850626D1 DE 3850626 T DE3850626 T DE 3850626T DE 3850626 T DE3850626 T DE 3850626T DE 3850626 D1 DE3850626 D1 DE 3850626D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23576387A JPS6477987A (en) | 1987-09-19 | 1987-09-19 | Printed wiring board |
JP62235762A JPH0671128B2 (ja) | 1987-09-19 | 1987-09-19 | プリント配線板 |
JP23576487A JPS6480095A (en) | 1987-09-19 | 1987-09-19 | Printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3850626D1 true DE3850626D1 (de) | 1994-08-18 |
Family
ID=27332303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3850626T Expired - Lifetime DE3850626D1 (de) | 1987-09-19 | 1988-04-02 | Leiterplatte. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4859805A (de) |
EP (1) | EP0308576B1 (de) |
DE (1) | DE3850626D1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19616083A1 (de) * | 1996-04-23 | 1997-10-30 | Bosch Gmbh Robert | Baugruppenträger mit wenigstens einem wärmeerzeugenden Bauelement |
JP3185682B2 (ja) * | 1996-09-19 | 2001-07-11 | 株式会社村田製作所 | 放熱板付誘電体基板 |
US7044212B1 (en) | 2000-08-25 | 2006-05-16 | Net Nanofiltertechnik Gmbh | Refrigeration device and a method for producing the same |
DE10041829B4 (de) * | 2000-08-25 | 2004-11-04 | N F T Nanofiltertechnik Gmbh | Kühlvorrichtung |
DE10233736B3 (de) * | 2002-07-24 | 2004-04-15 | N F T Nanofiltertechnik Gmbh | Wärmetauschervorrichtung |
DE20316334U1 (de) * | 2003-10-22 | 2004-03-11 | Nft Nanofiltertechnik Gmbh | Wärmetauschervorrichtung |
US7804599B2 (en) * | 2008-07-24 | 2010-09-28 | MGM Instruments, Inc. | Fluid volume verification system |
US8113072B1 (en) | 2009-02-27 | 2012-02-14 | The United States Of America As Represented By The Secretary Of The Navy | Electromagnetic physical scale model modularization system |
US9113583B2 (en) * | 2012-07-31 | 2015-08-18 | General Electric Company | Electronic circuit board, assembly and a related method thereof |
US9764313B2 (en) | 2014-06-18 | 2017-09-19 | Basf Corporation | Molecular sieve catalyst compositions, catalyst composites, systems, and methods |
US10015876B2 (en) * | 2015-03-31 | 2018-07-03 | Tanazawa Hakkosha Co., Ltd. | Printed board and method for manufacturing same |
WO2024179957A1 (en) * | 2023-03-02 | 2024-09-06 | Signify Holding B.V. | Means to improve the thermal performance of a printed electronics led light source |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3530229A (en) * | 1968-09-03 | 1970-09-22 | Ibm | Transmission line cable or the like and terminal connection therefor |
US3841905A (en) * | 1970-11-19 | 1974-10-15 | Rbp Chem Corp | Method of preparing printed circuit boards with terminal tabs |
JPS5212463A (en) * | 1975-07-17 | 1977-01-31 | Matsushita Electric Ind Co Ltd | Printed circuit board |
DE2904921A1 (de) * | 1979-02-09 | 1980-08-14 | Blaupunkt Werke Gmbh | Gedruckte schaltungsplatte |
FR2480488A1 (fr) * | 1980-04-15 | 1981-10-16 | Eaton Manford | Liant thermiquement conducteur et isolant electriquement pour composants electriques et electroniques, et son procede de fabrication |
US4385202A (en) * | 1980-09-25 | 1983-05-24 | Texas Instruments Incorporated | Electronic circuit interconnection system |
US4472762A (en) * | 1980-09-25 | 1984-09-18 | Texas Instruments Incorporated | Electronic circuit interconnection system |
US4339303A (en) * | 1981-01-12 | 1982-07-13 | Kollmorgen Technologies Corporation | Radiation stress relieving of sulfone polymer articles |
US4481261A (en) * | 1982-12-01 | 1984-11-06 | Electro Materials Corp. Of America | Blister-resistant dielectric |
JPS59167096A (ja) * | 1983-03-11 | 1984-09-20 | 日本電気株式会社 | 回路基板 |
-
1988
- 1988-03-29 US US07/194,841 patent/US4859805A/en not_active Expired - Lifetime
- 1988-04-02 DE DE3850626T patent/DE3850626D1/de not_active Expired - Lifetime
- 1988-04-02 EP EP88105342A patent/EP0308576B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0308576B1 (de) | 1994-07-13 |
EP0308576A2 (de) | 1989-03-29 |
US4859805A (en) | 1989-08-22 |
EP0308576A3 (en) | 1989-10-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |