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DE202012102788U1 - Kühlkörper-Abstrahlungsrippen und Basisblock aufweisender Montageaufbau - Google Patents

Kühlkörper-Abstrahlungsrippen und Basisblock aufweisender Montageaufbau Download PDF

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Publication number
DE202012102788U1
DE202012102788U1 DE202012102788U DE202012102788U DE202012102788U1 DE 202012102788 U1 DE202012102788 U1 DE 202012102788U1 DE 202012102788 U DE202012102788 U DE 202012102788U DE 202012102788 U DE202012102788 U DE 202012102788U DE 202012102788 U1 DE202012102788 U1 DE 202012102788U1
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DE
Germany
Prior art keywords
base block
radiating fins
heat sink
grooves
mounting assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE202012102788U
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German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE202012102788U1 publication Critical patent/DE202012102788U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/10—Fastening; Joining by force joining
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE202012102788U 2012-04-10 2012-07-25 Kühlkörper-Abstrahlungsrippen und Basisblock aufweisender Montageaufbau Expired - Lifetime DE202012102788U1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2012201480110U CN202562351U (zh) 2012-04-10 2012-04-10 散热鳍片与底座的组合结构
CN201220148011.0 2012-04-10

Publications (1)

Publication Number Publication Date
DE202012102788U1 true DE202012102788U1 (de) 2012-10-29

Family

ID=47211999

Family Applications (1)

Application Number Title Priority Date Filing Date
DE202012102788U Expired - Lifetime DE202012102788U1 (de) 2012-04-10 2012-07-25 Kühlkörper-Abstrahlungsrippen und Basisblock aufweisender Montageaufbau

Country Status (6)

Country Link
US (1) US20130264043A1 (zh)
JP (1) JP3178702U (zh)
KR (1) KR200473615Y1 (zh)
CN (1) CN202562351U (zh)
DE (1) DE202012102788U1 (zh)
TW (2) TWI570382B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102636069B (zh) * 2012-04-10 2013-12-18 东莞汉旭五金塑胶科技有限公司 散热鳍片与底座的组合结构
CN105627206A (zh) * 2015-12-30 2016-06-01 深圳市超频三科技股份有限公司 一种高棚灯及其灯具组件
CN106288310A (zh) * 2016-08-31 2017-01-04 安徽天祥空调科技有限公司 一种空调散热片及其生产工艺
TWM565467U (zh) * 2018-02-13 2018-08-11 昇業科技股份有限公司 手持通訊裝置及其薄型散熱結構
US10612863B2 (en) * 2018-05-06 2020-04-07 Chaun-Choung Technology Corp. Pressing method of heat conductive base and finished product thereof
JP1642782S (zh) 2018-12-28 2021-09-27

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014776A (en) 1988-04-27 1991-05-14 Joachim Hess Heat emitting unit in form of a heater or cooler
US6758262B2 (en) 2000-10-25 2004-07-06 The Furukawa Electric Co., Ltd. Heat sink, method for manufacturing same, and pressing jig

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
KR200191128Y1 (ko) * 2000-03-10 2000-08-16 주식회사흥창 방열 구조체
US6754078B1 (en) * 2003-03-03 2004-06-22 Shyh-Ming Chen Heat dissipating device with slanting engaged heat dissipating sheets and bottom plate
KR200396968Y1 (ko) * 2005-07-05 2005-09-28 리더썸(주) 전기,전자제품용 히트싱크 결합구조
US20070029068A1 (en) * 2005-08-03 2007-02-08 Ming-Jen Cheng Heat sink
CN1959967A (zh) * 2005-11-04 2007-05-09 鸿富锦精密工业（深圳）有限公司 散热装置及其制备方法
CN200947004Y (zh) * 2006-08-21 2007-09-12 黄崇贤 散热器鳍片与底座的组合改良
US7600558B2 (en) * 2006-08-22 2009-10-13 Shyh-Ming Chen Cooler
US20080060793A1 (en) * 2006-09-08 2008-03-13 Tsung-Hsien Huang Cooler device
KR100846832B1 (ko) * 2007-06-07 2008-07-17 주식회사 써모랩 히트파이프가 구비된 히트싱크 및 그 제조방법
JP3141510U (ja) * 2008-02-22 2008-05-08 國格金屬科技股▲ふん▼有限公司 ヒートシンクフィン組み込み構造
TWM363192U (en) * 2009-04-17 2009-08-11 chong-xian Huang Heat dissipating device
JP5323612B2 (ja) * 2009-08-27 2013-10-23 古河スカイ株式会社 ヒートシンク
JP5089668B2 (ja) * 2009-10-14 2012-12-05 古河電気工業株式会社 ヒートシンク

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014776A (en) 1988-04-27 1991-05-14 Joachim Hess Heat emitting unit in form of a heater or cooler
US6758262B2 (en) 2000-10-25 2004-07-06 The Furukawa Electric Co., Ltd. Heat sink, method for manufacturing same, and pressing jig

Also Published As

Publication number Publication date
TW201341750A (zh) 2013-10-16
JP3178702U (ja) 2012-09-27
KR200473615Y1 (ko) 2014-07-11
TWM445162U (zh) 2013-01-11
TWI570382B (zh) 2017-02-11
US20130264043A1 (en) 2013-10-10
CN202562351U (zh) 2012-11-28
KR20130006069U (ko) 2013-10-21

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20121220

R150 Utility model maintained after payment of first maintenance fee after three years
R151 Utility model maintained after payment of second maintenance fee after six years
R158 Lapse of ip right after 8 years