DE202012102788U1 - Heat sink radiating fins and basic block having mounting structure - Google Patents
Heat sink radiating fins and basic block having mounting structure Download PDFInfo
- Publication number
- DE202012102788U1 DE202012102788U1 DE202012102788U DE202012102788U DE202012102788U1 DE 202012102788 U1 DE202012102788 U1 DE 202012102788U1 DE 202012102788 U DE202012102788 U DE 202012102788U DE 202012102788 U DE202012102788 U DE 202012102788U DE 202012102788 U1 DE202012102788 U1 DE 202012102788U1
- Authority
- DE
- Germany
- Prior art keywords
- base block
- radiating fins
- heat sink
- grooves
- mounting assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005855 radiation Effects 0.000 claims abstract description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 6
- 101100334009 Caenorhabditis elegans rib-2 gene Proteins 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/10—Fastening; Joining by force joining
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Kühlkörper-Abstrahlungsrippen und Basisblock aufweisender Montageaufbau, der einen Basisblock (1) mit mehreren Nuten (11) auf einer Seite davon und mehrere Abstrahlungsrippen (2) umfasst, die jeweils in den Nuten (11) des Basisblocks montiert sind, wobei jede Abstrahlungsrippe (2) einen davon gestanzten unteren Rand aufweist, um mehrere gefaltete Abschnitte (21) bereit zu stellen, und wobei die gefalteten Abschnitte der Abstrahlungsrippen in die Nuten (11) des Basisblocks eingesetzt und dann integral in dem Basisblock (1) eingebettet oder daran festgeklemmt sind.Heat sink radiation fins and mounting block comprising a base block, which comprises a base block (1) with a plurality of grooves (11) on one side thereof and a plurality of radiation fins (2), which are each mounted in the grooves (11) of the base block, each radiation fins (2 ) has a bottom edge stamped therefrom to provide a plurality of folded portions (21), and the folded portions of the radiation ribs are inserted into the grooves (11) of the base block and then integrally embedded or clamped in the base block (1).
Description
Die vorliegende Erfindung betrifft die Wärmesenken- bzw. Kühlkörpertechnik und spezieller einen Kühlkörper-Abstrahlungsrippen und Basisblock aufweisenden Montageaufbau, der einen Basisblock mit Nuten bzw. Rillen auf einer Seite und Abstrahlungsrippen mit gefalteten Abschnitten und Hakenabschnitten umfasst, die abwechselnd auf zwei gegenüberliegenden Seiten nahe des unteren Randes davon angeordnet und mit einer Gieß- oder Quetschtechnik an den Nuten des Basisblocks befestigt sind.The present invention relates to heat sink technology, and more particularly to a heatsink radiation fins and base block mounting structure comprising a base block having grooves on one side and radiation fins having folded portions and hook portions arranged alternately on two opposite sides near the bottom Arranged therefrom and attached by a casting or crushing technique to the grooves of the base block.
Herkömmliche Kühlkörper weisen im Allgemeinen einen Grund- bzw. Bodenblock und mehrere Abstrahlungsrippen auf. Bei einigen Kühlkörpern ist eine Reihe von Wärmerohren im unteren Block montiert. Bodenblock und Abstrahlungsrippen werden gewöhnlich durch Schweißen aneinander gefügt. Das Patent
Gemäß dem Patent
Ferner offenbart das Patent
Die vorliegende Erfindung wurde im Hinblick auf die betrachteten Umstände gemacht. Es ist daher die Hauptaufgabe der vorliegenden Erfindung, einen Kühlkörper-Abstrahlungsrippen und Basisblock aufweisenden Montageaufbau bereit zu stellen, das die Abstrahlungsrippen sicher am Basisblock auf bündige Weise befestigt hält, wobei Vibrationen oder Abfallen vermieden wird.The present invention has been made in view of the circumstances considered. It is therefore the primary object of the present invention to provide a heat sink radiating fin and base block mounting structure that securely secures the radiator fins to the base block in a flush manner while avoiding vibration or falling.
Zur Erzielung dieser und anderer Aufgaben der vorliegenden Erfindung umfasst ein Kühlkörper-Abstrahlungsrippen und Basisblock aufweisender Montageaufbau einen Basisblock, der mehrere Nuten auf einer Seite davon sowie mehrere Abstrahlungsrippen umfasst, die jeweils in den Nuten des Basisblocks montiert sind. Bei jeder Abstrahlungsrippe ist der untere Rand gestanzt, um mehrere gefaltete Abschnitte zu erzeugen. Die gefalteten Abschnitte jeder Abstrahlungsrippe sind gleichmäßig entlang dem unteren Rand der jeweiligen Abstrahlungsrippe beabstandet und stehen abwechselnd in zwei entgegengesetzten Richtungen vor. Ferner sind die gefalteten Abschnitte der Abstrahlungsrippen in die Nuten des Basisblocks eingelassen und werden dann im Basisblock eingebettet oder daran festgeklemmt.To achieve these and other objects of the present invention, a mounting structure comprising heat sink radiating fins and base block includes a base block including a plurality of grooves on one side thereof and a plurality of radiating fins respectively mounted in the grooves of the base block. For each radiating fin, the lower edge is stamped to create a plurality of folded sections. The folded portions of each radiating fin are equally spaced along the lower edge of the respective radiating fin and project alternately in two opposite directions. Further, the folded portions of the radiation fins are embedded in the grooves of the base block and are then embedded or clamped in the base block.
Jede Abstrahlungsrippe umfasst ferner mehrere Hakenabschnitte, die jeweils zwischen zwei benachbarten gefalteten Abschnitten der jeweiligen Abstrahlungsrippe angeordnet sind. Die Hakenabschnitte sind mit den jeweiligen gefalteten Abschnitten im Basisblock eingebettet oder sind mit den jeweiligen gefalteten Abschnitten am Basisblock festgeklemmt, wodurch die Verbindungsstabilität zwischen dem Basisblock und den Abstrahlungsrippen erhöht wird.Each radiating fin further includes a plurality of hook portions each disposed between two adjacent folded portions of the respective radiating fin. The hook portions are embedded with the respective folded portions in the base block or are clamped to the respective folded portions on the base block, whereby the connection stability between the base block and the radiation fins is increased.
Wie in den
Wie oben angegeben, sind die gefalteten Abschnitte
Gemäß den
Die Abstrahlungsrippen
Bei Anwendung einer Gießtechnik wird vorzugsweise flüssiges Aluminium zum Gießen mit der Verwendung einer passenden Form gewählt. Nach dem jeweiligen Einsetzen der Abstrahlungsrippen
Bei Einsatz der Quetschtechnik wird der Stempel einer Stanzpresse betätigt, um den Basisblock
Gemäß den
Ferner können die Wärmerohre
Zusammenfassend wird ein Kühlkörper-Abstrahlungsrippen und Basisblock aufweisender Montageaufbau offenbart, wobei ein Basisblock auf einer Seite mehrere Nuten aufweist und wobei bei mehreren Abstrahlungsrippen ein unterer Rand gestanzt ist, um mehrere gefaltete Abschnitte und Hakenabschnitte bereitzustellen, wobei die gefalteten Abschnitte und Hakenabschnitte der Abstrahlungsrippen in die Nuten des Basisblocks eingesetzt und dann in den Basisblock eingebettet oder daran festgeklemmt werden.In summary, a mounting structure incorporating heatsink radiation fins and base block is disclosed wherein a base block has a plurality of grooves on one side and a lower edge is punched on a plurality of radiation fins to provide a plurality of folded portions and hook portions, the folded portions and hook portions of the radiation fins into the fins Inserted grooves of the base block and then embedded in the base block or clamped to it.
Es wurden zu Illustrationszwecken zwar bestimmte Ausgestaltungen der Erfindung ausführlich beschrieben, aber es können verschiedene Modifikationen und Verbesserungen daran vorgenommen werden, ohne von Wesen und Umfang der Erfindung abzuweichen. Demgemäß ist die Erfindung lediglich durch die beiliegenden Ansprüche begrenzt.While certain embodiments of the invention have been described in detail for illustrative purposes, various modifications and improvements may be made thereto without departing from the spirit and scope of the invention. Accordingly, the invention is limited only by the appended claims.
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- US 5014776 [0002, 0003] US 5014776 [0002, 0003]
- US 6758262 [0004] US 6758262 [0004]
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012201480110U CN202562351U (en) | 2012-04-10 | 2012-04-10 | Combined structure of radiating fins and pedestal |
CN201220148011.0 | 2012-04-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202012102788U1 true DE202012102788U1 (en) | 2012-10-29 |
Family
ID=47211999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202012102788U Expired - Lifetime DE202012102788U1 (en) | 2012-04-10 | 2012-07-25 | Heat sink radiating fins and basic block having mounting structure |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130264043A1 (en) |
JP (1) | JP3178702U (en) |
KR (1) | KR200473615Y1 (en) |
CN (1) | CN202562351U (en) |
DE (1) | DE202012102788U1 (en) |
TW (2) | TWI570382B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102636069B (en) * | 2012-04-10 | 2013-12-18 | 东莞汉旭五金塑胶科技有限公司 | Radiating fin and base combination structure |
CN105627206A (en) * | 2015-12-30 | 2016-06-01 | 深圳市超频三科技股份有限公司 | Global illumination lamp and lamp assembly thereof |
CN106288310A (en) * | 2016-08-31 | 2017-01-04 | 安徽天祥空调科技有限公司 | A kind of heat sink of air conditioner and production technology thereof |
TWM565467U (en) * | 2018-02-13 | 2018-08-11 | 昇業科技股份有限公司 | Handheld communication device and thin heat-dissipation structure thereof |
US10612863B2 (en) * | 2018-05-06 | 2020-04-07 | Chaun-Choung Technology Corp. | Pressing method of heat conductive base and finished product thereof |
JP1642782S (en) | 2018-12-28 | 2021-09-27 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5014776A (en) | 1988-04-27 | 1991-05-14 | Joachim Hess | Heat emitting unit in form of a heater or cooler |
US6758262B2 (en) | 2000-10-25 | 2004-07-06 | The Furukawa Electric Co., Ltd. | Heat sink, method for manufacturing same, and pressing jig |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5542176A (en) * | 1992-09-21 | 1996-08-06 | Hideaki Serizawa | Radiation plate and method of producing the same |
KR200191128Y1 (en) * | 2000-03-10 | 2000-08-16 | 주식회사흥창 | Heat sink |
US6754078B1 (en) * | 2003-03-03 | 2004-06-22 | Shyh-Ming Chen | Heat dissipating device with slanting engaged heat dissipating sheets and bottom plate |
KR200396968Y1 (en) * | 2005-07-05 | 2005-09-28 | 리더썸(주) | heat sink structure for electric and electronic products |
US20070029068A1 (en) * | 2005-08-03 | 2007-02-08 | Ming-Jen Cheng | Heat sink |
CN1959967A (en) * | 2005-11-04 | 2007-05-09 | 鸿富锦精密工业(深圳)有限公司 | Heat sink and fabricating method |
CN200947004Y (en) * | 2006-08-21 | 2007-09-12 | 黄崇贤 | Combined improvement of radiator fin and pedestal |
US7600558B2 (en) * | 2006-08-22 | 2009-10-13 | Shyh-Ming Chen | Cooler |
US20080060793A1 (en) * | 2006-09-08 | 2008-03-13 | Tsung-Hsien Huang | Cooler device |
KR100846832B1 (en) * | 2007-06-07 | 2008-07-17 | 주식회사 써모랩 | Heat sink with heat pipe and method for assembling the same |
JP3141510U (en) * | 2008-02-22 | 2008-05-08 | 國格金屬科技股▲ふん▼有限公司 | Heat sink fin built-in structure |
TWM363192U (en) * | 2009-04-17 | 2009-08-11 | chong-xian Huang | Heat dissipating device |
JP5323612B2 (en) * | 2009-08-27 | 2013-10-23 | 古河スカイ株式会社 | heatsink |
JP5089668B2 (en) * | 2009-10-14 | 2012-12-05 | 古河電気工業株式会社 | heatsink |
-
2012
- 2012-04-10 CN CN2012201480110U patent/CN202562351U/en not_active Expired - Lifetime
- 2012-06-21 TW TW101122173A patent/TWI570382B/en active
- 2012-06-21 TW TW101211931U patent/TWM445162U/en unknown
- 2012-07-03 US US13/541,645 patent/US20130264043A1/en not_active Abandoned
- 2012-07-13 JP JP2012004307U patent/JP3178702U/en not_active Expired - Fee Related
- 2012-07-25 DE DE202012102788U patent/DE202012102788U1/en not_active Expired - Lifetime
- 2012-07-25 KR KR2020120006648U patent/KR200473615Y1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5014776A (en) | 1988-04-27 | 1991-05-14 | Joachim Hess | Heat emitting unit in form of a heater or cooler |
US6758262B2 (en) | 2000-10-25 | 2004-07-06 | The Furukawa Electric Co., Ltd. | Heat sink, method for manufacturing same, and pressing jig |
Also Published As
Publication number | Publication date |
---|---|
TW201341750A (en) | 2013-10-16 |
JP3178702U (en) | 2012-09-27 |
KR200473615Y1 (en) | 2014-07-11 |
TWM445162U (en) | 2013-01-11 |
TWI570382B (en) | 2017-02-11 |
US20130264043A1 (en) | 2013-10-10 |
CN202562351U (en) | 2012-11-28 |
KR20130006069U (en) | 2013-10-21 |
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Legal Events
Date | Code | Title | Description |
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R207 | Utility model specification |
Effective date: 20121220 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years | ||
R151 | Utility model maintained after payment of second maintenance fee after six years | ||
R158 | Lapse of ip right after 8 years |