CN1073637C

CN1073637C - Contact material gold-base alloy

Info

Publication number: CN1073637C
Application number: CN98105040A
Authority: CN
Inventors: 宁远涛; 彭英; 戴红; 文飞
Original assignee: Sino Platinum Metals Co Ltd
Current assignee: Sino Platinum Metals Co Ltd
Priority date: 1998-03-04
Filing date: 1998-03-04
Publication date: 2001-10-24
Anticipated expiration: 2018-03-04
Also published as: CN1227878A

Abstract

The present invention relates to an alloy based on gold, which comprises 5 to 20% of Pt, 5 to 20% of Pd, 5 to 20% of Cu, 1 to 10% of Rh and 1 to 10% of Ni and Au as the rest. The alloy based on gold is used for an electric contact material, has the advantages of high reliability, high stability and long service life, and can replace the existing palladium base alloy used in the light current field to be used as the electric contact material.

Description

Contact material gold-base alloy

The present invention relates to a kind of gold-base alloy contact material.

The reliability of electronics, instrument operation, closely related with selected contact material to a great extent.As contact material, require it will have high reliability, persistence will be grown, the resistance to corrosion height, loss through volatilization is low, and requires the resistivity height to thermal shocking, and wear resistance is good.Precious metals pt, Pd, Au, Ag and alloy thereof have good electric property, anti-melting welding, and the anti-electric-arc scaling loss, anti-oxidant, be highly reliable contact material, be widely used in the precision instruments such as engine, micromotor, connector, rly., potentiometer.Pd base alloy is because its good performance often is proposed as weak current, long lifetime, low contact pressure (10-20g), and working current reaches the first-selected contact material that the rly. of 1A is used.But because intensity, the specific conductivity of Pd are lower, easily oxidation is more than 350 ℃, its surface can generate the oxide film of obfuscation, influence its use properties, and its anti stick is poor slightly, in addition, Pd and alloy thereof itself have katalysis, with organic steam effect in the surrounding environment, generate organometallic complex, promptly " brown powder " accumulates in the metallic surface, causes the contact resistance of contact to degenerate, the electrical property instability, thus the life-span and the reliability of its use influenced.Be used in a kind of palladium-base alloy Pd35 Ag30 Cu14 Au10 Pt10 Zn1 alloy in the TO-5 rly. at present, in the rated life time, quiet the closing of normal appearance, the phenomenon that moving fashionable circuit is obstructed or resistance increases suddenly, this is unallowed in the high rly. of reliability requirement.And in use, the volatilization loss of this alloy is bigger, and metal transfer is serious, its chemical stability, and high-temperature oxidation resistant volatilization ability, the arc resisting erosional competency of anti-spark is relatively poor.

Along with the progress and development of electronic industry, electronic machine, equipment and equipment develop to the high reliability long life direction day by day, use the contact material with high reliability to seem particularly important and necessary.

The objective of the invention is to overcome the deficiency of Pd base alloy contact materials such as existing Pd35 Ag30 Cu14 Au10 Pt10 Zn1 alloy, improve the high reliability of rly., proposed the better gold-base alloy of a kind of mechanical property, electric property and use properties with contact material.

The realization of technical scheme of the present invention is to add an amount of Pt, Pd, Rh, Cu, Ni in Au, to form a kind of new hexa-atomic gold-base alloy.The concrete composition (weight %) of this hexa-atomic alloy is: Pt 5-20, and Pd 5-20, Cu 5-20, Rh1-10, Ni1-10, surplus is Au; Best form (weight %) is: Pt10-18, and Pd8-15, Cu10-15, Rh 5-8, Ni 3-6, surplus is Au.

In the element that adds, Cu, Pd, Ni and Au form face-centered cubic sosoloid, generate the alloy substrate phase, and Cu increases the electroconductibility of matrix, and Pd increases the anti-sulphur corrosion of alloy, and Ni increases the intensity of matrix.Rh and part A u, Cu, Ni and Pt form the Pt basal plane heart cube sosoloid, as alloy second mutually with timeliness mutually, be present in the matrix.As strengthening phase, the molten point of Pt and Rh is higher, and its existence has improved the recrystallization temperature of alloy, and has improved the anti-melting welding of alloy, anti-electric-arc scaling loss.The existence of Pt and Rh, also improved the resistance of oxidation of alloy, Rh, Ni second mutually in, also strengthened second phase, make alloy have wear resistance, and Au, the existence of Cu has increased the electroconductibility of second phase, because the special construction and the composition of this alloy, make alloy have high stability, in application, show low and stable contact resistance, mechanical life, normal temperature and high temperature load life-span height.In the contact opened and closed, metal volatilization loss was little, and metal transfer is few, shows excellent chemical stability, thereby had guaranteed its high reliability, long lifetime and high stability as contact material.Gold-base alloy of the present invention and above-mentioned Pd Ag Cu Au Pt Zn alloy property and the comparison that is used for the result of use of contact material are that example is listed in table 2 and table 3 with embodiment.

Alloy of the present invention adopts conventional founding, processing, heat treating method preparation.Alloy can be processed into a material, band and various finished product as required and be used for contact material.

Embodiment:

Employing purity is 99.95% Au, Pt, Pd, Rh; purity is that 99.9% Cu, Ni are by the composition alloyage in the table 1; with the founding under protective atmosphere of high-quality crucible, homogenization annealing is heat-treated and cold working with traditional alloy working method; be prepared into a material: Φ 0.3mm; band 0.7mm * 0.07mm, 0.10mm * 0.8mm is by the requirement again drawing of TO-5 rly. to the contact; after 350 ℃ of ageing treatment, be assemblied in the TO-5 rly..

Table 1 embodiment alloying constituent (weight %)

Numbering	Au	Pt	Pd	Cu	Rh	Ni
Numbering	Au	Pt	Pd	Cu	Rh	Ni	1 2 3	Surplus surplus surplus	10 14 18	10 10 12	8 10 12	8 6 5	6 6 5

The performance of table 2, embodiment alloy relatively

Performance			2	3	pdAgCuAuPtZn
Performance			2	3	pdAgCuAuPtZn	Tensile strength (MPa)	Annealed state	705	746	787	680
Processing attitude (ε=60%)	1252	1380	1443	1170			Annealed state	705	746	787	680
Processing attitude (ε=60%)	1252	1380	1443	1170	Aging state		1368	1450	1585	-
Hardness HV	Annealed state	196	222	254	Aging state		1368	1450	1585	-	176
	Annealed state	196	222	254	Processing attitude (ε=60%)	282	306	366	274		176
	Aging state	311	340	398	Processing attitude (ε=60%)	282	306	366	274	-
	Aging state	311	340	398	Elastic modulus E (GPd)		108	113	121	-	117
Contact resistance, processing attitude (m Ω)		15.0	15.8	15.4	Elastic modulus E (GPd)		108	113	121	21.1	117
Contact resistance, processing attitude (m Ω)		15.0	15.8	15.4	Resistivity (20 ℃, μ Ω .cm)		31	30-32	30.5	21.1	31.6
Temperature coefficient of resistance α 0-100 * 10 ⁴		4.7	4.9	4.8	Resistivity (20 ℃, μ Ω .cm)		31	30-32	30.5	3.0	31.6

The result of use of table 3 alloy contact material of the present invention

			1		2		3	pdAgCuAuPtZn
			1		2		3	pdAgCuAuPtZn	Lower level contact resistance (m Ω) 50 μ A, 85 ℃ of 30mv, 10 ⁶Inferior	Before the test	Quiet closing	63.6 57.6		65.6 64.4		65.8 87.6	65.7,77.7,65.7,67.6
Moving closing	65.7 59.6		58.9 67.6		66.8 65.7	65.7,63.9,61.6,69.7					Quiet closing	63.6 57.6		65.6 64.4		65.8 87.6	65.7,77.7,65.7,67.6
Moving closing	65.7 59.6		58.9 67.6		66.8 65.7	65.7,63.9,61.6,69.7	After the test	Quiet closing			54.5 57.2		56.8 50.5		56.6 52.5	57.6,94.6, obstructed, 57.7
Moving closing	49.6 48.1		48.2 49.5		58.6 50.1	60.5,62.5, obstructed, 49.56		Quiet closing			54.5 57.2		56.8 50.5		56.6 52.5	57.6,94.6, obstructed, 57.7
Moving closing	49.6 48.1		48.2 49.5		58.6 50.1	60.5,62.5, obstructed, 49.56		Normal temperature load (inferior)		0.5A,28VDC 1A，28VDC		10 ⁶		10 ⁶		10 ⁶	10 ⁵, wherein 1 sample is slipped up 9 times
5×10 ⁴		5×10 ⁴		5×10 ⁴	--							10 ⁶		10 ⁶		10 ⁶	10 ⁵, wherein 1 sample is slipped up 9 times
5×10 ⁴		5×10 ⁴		5×10 ⁴	--	The high temperature load life-span (inferior)	30mv,50μA,85℃		10 ⁶More than			10 ⁶More than		10 ⁶More than	10 ⁶, 2 inefficacies of 5 samples
28VDC,1A,125℃		10 ⁵, contact is intact		With a left side			30mv,50μA,85℃		10 ⁶More than		With a left side	10 ⁶More than		10 ⁶More than	10 ⁶, 2 inefficacies of 5 samples	10 ⁵, metal transfer is burnt serious,
28VDC,1A,125℃		10 ⁵, contact is intact		With a left side			28VDC 0.5A,125℃		10 ⁶, contact is intact, surpasses specified			With a left side	With a left side	Reed and contact weldering are dead		10 ⁵, metal transfer is burnt serious,
28VDC,100mA,125℃			5×10 ⁴, meet U.S. army mark, MIL		With a left side		28VDC 0.5A,125℃		10 ⁶, contact is intact, surpasses specified			With a left side	With a left side	Reed and contact weldering are dead	With a left side	9.6×10 ⁵, it is serious to freeze, not to the rated life time
28VDC,100mA,125℃			5×10 ⁴, meet U.S. army mark, MIL		With a left side		Mechanical life (inferior)			10 ⁷, index is qualified			With a left side	With a left side	With a left side		85 ℃ of samples all lost efficacy
Hot operation, 125 ℃, be incubated 1 hour, 3000 times 18 samples all do not have inefficacy						With a left side	Mechanical life (inferior)			10 ⁷, index is qualified			With a left side	With a left side	With a left side		85 ℃ of samples all lost efficacy
						With a left side	Cold operation ,-55 ℃, be incubated 1 hour, 3000 times 18 samples all do not have inefficacy						With a left side	With a left side	With a left side

Claims

1, a kind of contact material gold-base alloy is characterized in that the composition of this gold-base alloy and content (weight %) are: Pt10-18, and Pd8-15, Cu10-15, Rh5-8, Ni3-6, surplus is Au.