CN100439528C - New type alloy material - Google Patents
New type alloy material Download PDFInfo
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- CN100439528C CN100439528C CNB2005100110924A CN200510011092A CN100439528C CN 100439528 C CN100439528 C CN 100439528C CN B2005100110924 A CNB2005100110924 A CN B2005100110924A CN 200510011092 A CN200510011092 A CN 200510011092A CN 100439528 C CN100439528 C CN 100439528C
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- alloy material
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Abstract
The present invention provides a novel alloy material for precise contacts, which comprises 1 to 3% (mass percent) of Pd, 0.2 to 0.6% (mass percent) of Gd, and Au with the left percent. The material has the functions that the mechanical properties of Au are enhanced; the temperature coefficient of resistance is lowered; the recrystallization temperature is raised and the creep resistance is enhanced; the electrical erosion resistance and the wear resistance are enhanced, so good chemical stability of pure Au is kept, and the electrical contact performance of pure Au is improved. The material can solve the problems of poor gold elasticity, low yield point, easy fluctuation welding and spine generation under the action of low current.
Description
Technical field
The present invention relates to accurate contact new type alloy material.
Background technology
The chemical stability of gold is best, can not generate oxide compound, sulfide, can not generate " brown powder " with the organic vapor effect, and contact resistance is low and stable, and electroconductibility and thermal conductivity are good.The accurate contact that voltage is low for contact pressure is little, especially at electric current 1～10 μ A, under the condition of voltage 1～50mv, gold is a desirable material comparatively, but poor flexibility, the yield-point of gold are very low, and the welding that easily rises and falls can form spine under little galvanic action.
Summary of the invention
The object of the invention provides a kind of accurate contact new type alloy material.Poor flexibility, the yield-point that can solve gold are very low, the welding that easily rises and falls, and meeting forms the problem of spine under little galvanic action.
Realize new type alloy material of the present invention, it is characterized in that containing mass percent and be 1%～3% Pd, 0.2%～0.6% Gd, all the other are Au.Described material purity is: Pd 〉=99.95%, Gd 〉=99.95%, Au 〉=99.99%.Described new type alloy material is used for accurate contact.The material purity that is used for accurate contact new type alloy material is: Pd 〉=99.95%, Gd 〉=99.95%, Au 〉=99.99%.
In Au, add a small amount of Pd and micro-Gd, improved the mechanical property of Au, reduce temperature coefficient of resistance, improved recrystallization temperature and creep resistance, and anti-erosion property and wear resistance, reach the pure Au excellent chemical stability of maintenance, improve the electrical contact performance of pure Au, it is very low finally to have solved golden poor flexibility, yield-point, the welding that easily rises and falls, and meeting forms the problem of spine under little galvanic action.But the interpolation of micro-Gd can not exceed certain limit, otherwise is difficult to produce above-mentioned effect and can causes the processing characteristics of new type alloy material to degenerate.
The material purity that the present invention uses: Pd 〉=99.95%, Gd 〉=99.95%, Au 〉=99.99%.
The foreign matter content (mass ratio) that the present invention allows: Fe≤0.002%, Pd≤0.002%, Sb≤0.002%, Bi≤0.002%.
Adopt following prepared new type alloy material.
(%): Pd 1～3 by mass percentage; Gd 0.2～0.6; surplus Au preparation raw material, vacuum or 700 ℃/3h of argon shield melting → ingot casting (hour) all should change processing → cold rolling → 550～600 ℃/0.5h (hour) intermediate heat treatment → finish rolling obtains new type alloy material.
Table 1 is a new type alloy material performance of the present invention.
Table 1 new type alloy material performance
Embodiment
Adopt following prepared new type alloy material.
(%): Pd 1～3 by mass percentage, Gd0.2～0.6, surplus Au preparation raw material, vacuum or 700 ℃/3h of argon shield melting → ingot casting all should change processing → cold rolling → 550～600 ℃/0.5h intermediate heat treatment → finish rolling and obtain new type alloy material.
Claims (4)
1. alloy material is characterized in that containing mass percent and is 1%～3% Pd, 0.2%～0.6% Gd, and all the other are Au.
2. alloy material according to claim 1 is characterized in that described material purity is: Pd 〉=99.95%, Gd 〉=99.95%, Au 〉=99.99%.
3. alloy material as claimed in claim 1 is characterized in that being used for accurate contact.
4. alloy material according to claim 3 is characterized in that described material purity is: Pd 〉=99.95%, Gd 〉=99.95%, Au 〉=99.99%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100110924A CN100439528C (en) | 2005-10-28 | 2005-10-28 | New type alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100110924A CN100439528C (en) | 2005-10-28 | 2005-10-28 | New type alloy material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1760391A CN1760391A (en) | 2006-04-19 |
| CN100439528C true CN100439528C (en) | 2008-12-03 |
Family
ID=36706611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100110924A Expired - Fee Related CN100439528C (en) | 2005-10-28 | 2005-10-28 | New type alloy material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100439528C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100439527C (en) * | 2006-11-29 | 2008-12-03 | 昆明贵金属研究所 | Gold- silver lead based alloy material containing yttrium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0831253A (en) * | 1994-05-11 | 1996-02-02 | Tanaka Kikinzoku Kogyo Kk | Electric contact material |
| JPH10172998A (en) * | 1996-12-11 | 1998-06-26 | Sumitomo Metal Mining Co Ltd | Gold bonding wire |
| JPH10275820A (en) * | 1997-03-28 | 1998-10-13 | Tanaka Denshi Kogyo Kk | Gold alloy wire for bonding semiconductor device |
| CN1227878A (en) * | 1998-03-04 | 1999-09-08 | 昆明贵金属研究所 | Contact material gold-base alloy |
-
2005
- 2005-10-28 CN CNB2005100110924A patent/CN100439528C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0831253A (en) * | 1994-05-11 | 1996-02-02 | Tanaka Kikinzoku Kogyo Kk | Electric contact material |
| JPH10172998A (en) * | 1996-12-11 | 1998-06-26 | Sumitomo Metal Mining Co Ltd | Gold bonding wire |
| JPH10275820A (en) * | 1997-03-28 | 1998-10-13 | Tanaka Denshi Kogyo Kk | Gold alloy wire for bonding semiconductor device |
| CN1227878A (en) * | 1998-03-04 | 1999-09-08 | 昆明贵金属研究所 | Contact material gold-base alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1760391A (en) | 2006-04-19 |
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Granted publication date: 20081203 Termination date: 20141028 |
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