CN1227878A - Contact material gold-base alloy - Google Patents
Contact material gold-base alloy Download PDFInfo
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- CN1227878A CN1227878A CN 98105040 CN98105040A CN1227878A CN 1227878 A CN1227878 A CN 1227878A CN 98105040 CN98105040 CN 98105040 CN 98105040 A CN98105040 A CN 98105040A CN 1227878 A CN1227878 A CN 1227878A
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Abstract
A gold-base alloy as electric contact material contains Pt (5-20 wt.%), Pd (5-20 wt.%), Cu (5-20 wt.%), Rh (1-10 wt.%), Ni (1-10 wt.%) and Au (rest), and features high reliability and stability and long service life. It can replace existing Pd-base alloy as electric contact material.
Description
The present invention relates to a kind of gold-base alloy contact material.
The reliability of electronics, instrument operation, closely related with selected contact material to a great extent.As contact material, require it will have high reliability, persistence will be grown, the resistance to corrosion height, loss through volatilization is low, and requires the resistivity height to thermal shocking, and wear resistance is good.Precious metals pt, Pd, Au, Ag and alloy thereof have good electric property, anti-melting welding, and the anti-electric-arc scaling loss, anti-oxidant, be highly reliable contact material, be widely used in the precision instruments such as engine, micromotor, connector, rly., potentiometer.Pd base alloy is because its good performance often is proposed as weak current, long lifetime, low contact pressure (10-20g), and working current reaches the first-selected contact material that the rly. of 1A is used.But because intensity, the specific conductivity of Pd are lower, easily oxidation is more than 350 ℃, its surface can generate the oxide film of obfuscation, influence its use properties, and its anti stick is poor slightly, in addition, Pd and alloy thereof itself have katalysis, with organic steam effect in the surrounding environment, generate organometallic complex, promptly " brown powder " accumulates in the metallic surface, causes the contact resistance of contact to degenerate, the electrical property instability, thus the life-span and the reliability of its use influenced.Be used in a kind of palladium-base alloy Pd35Ag30Cu14Au10Pt10Zn1 alloy in the TO-5 rly. at present, in the rated life time, quiet the closing of normal appearance, the phenomenon that moving fashionable circuit is obstructed or resistance increases suddenly, this is unallowed in the high rly. of reliability requirement.And in use, the volatilization loss of this alloy is bigger, and metal transfer is serious, its chemical stability, and high-temperature oxidation resistant volatilization ability, the arc resisting erosional competency of anti-spark is relatively poor.
Along with the progress and development of electronic industry, electronic machine, equipment and equipment develop to the high reliability long life direction day by day, use the contact material with high reliability to seem particularly important and necessary.
The objective of the invention is to overcome the deficiency of Pd base alloy contact materials such as existing Pd35Ag30Cu14Au10Pt10Zn1 alloy, improve the high reliability of rly., proposed the better gold-base alloy of a kind of mechanical property, electric property and use properties with contact material.
The realization of technical scheme of the present invention is to add an amount of Pt, Pd, Rh, Cu, Ni in Au, to form a kind of new hexa-atomic gold-base alloy.The concrete composition (weight %) of this hexa-atomic alloy is: Pt5-20, and Pd 5-20, Cu 5-20, Rh1-10, Ni1-10, surplus is Au; Best form (weight %) is: Pt10-18, and Pd8-15, Cu10-15, Rh5-8, Ni3-6, surplus is Au.
In the element that adds, Cu, Pd, Ni and Au form face-centered cubic sosoloid, generate the alloy substrate phase, and Cu increases the electroconductibility of matrix, and Pd increases the anti-sulphur corrosion of alloy, and Ni increases the intensity of matrix.Rh and part A u, Cu, Ni and Pt form the Pt basal plane heart cube sosoloid, as alloy second mutually with timeliness mutually, be present in the matrix.As strengthening phase, the molten point of Pt and Rh is higher, and its existence has improved the recrystallization temperature of alloy, and has improved the anti-melting welding of alloy, anti-electric-arc scaling loss.The existence of Pt and Rh, also improved the resistance of oxidation of alloy, Rh, Ni second mutually in, also strengthened second phase, make alloy have wear resistance, and Au, the existence of Cu has increased the electroconductibility of second phase, because the special construction and the composition of this alloy, make alloy have high stability, in application, show low and stable contact resistance, mechanical life, normal temperature and high temperature load life-span height.In the contact opened and closed, metal volatilization loss was little, and metal transfer is few, shows excellent chemical stability, thereby had guaranteed its high reliability, long lifetime and high stability as contact material.Gold-base alloy of the present invention and above-mentioned PdAgCuAuPtZn alloy property and the comparison that is used for the result of use of contact material are that example is listed in table 2 and table 3 with embodiment.
Alloy of the present invention adopts conventional founding, processing, heat treating method preparation.Alloy can be processed into a material, band and various finished product as required and be used for contact material.
Embodiment:
Employing purity is 99.95% Au, Pt, Pd, Rh; purity is that 99.9% Cu, Ni are by the composition alloyage in the table 1; with the founding under protective atmosphere of high-quality crucible, homogenization annealing is heat-treated and cold working with traditional alloy working method; be prepared into a material: φ 0.3mm; band 0.7mm * 0.07mm, 0.10mm * 0.8mm is by the requirement again drawing of TO-5 rly. to the contact; after 350 ℃ of ageing treatment, be assemblied in the TO-5 rly..Table 1 embodiment alloying constituent (weight %)
| Numbering | Au | ?Pt | ??Pd | ??Cu | ???Rh | ???Ni |
| ?1 ?2 ?3 | Surplus surplus surplus | ?10 ?14 ?18 | ??10 ??10 ??12 | ???8 ??10 ??12 | ????8 ????6 ????5 | ????6 ????6 ????5 |
The performance of table 2, embodiment alloy relatively
| Performance | ????1 | ?2 | ?3 | ?pdAgCuAuPtZn | |
| Tensile strength (MPa) | Annealed state | ????705 | ?746 | ?787 | ????680 |
| Processing attitude (ε=60%) | ????1252 | ?1380 | ?1443 | ????1170 | |
| Aging state | ????1368 | ?1450 | ?1585 | ????- | |
| Hardness HV | Annealed state | ????196 | ?222 | ?254 | ????176 |
| Processing attitude (ε=60%) | ????282 | ?306 | ?366 | ????274 | |
| Aging state | ????311 | ?340 | ?398 | ????- | |
| Elastic modulus E (GPd) | ????108 | ?113 | ?121 | ????117 | |
| Contact resistance, processing attitude (m Ω) | ????15.0 | ?15.8 | ?15.4 | ????21.1 | |
| Resistivity (20 ℃, μ Ω .cm) | ????31 | ?30-32 | ?30.5 | ????31.6 | |
| Temperature coefficient of resistance α 0-100 * 10 4 | ????4.7 | ?4.9 | ?4.8 | ????3.0 | |
The result of use of table 3 alloy contact material of the present invention
| ??1 | ????????????2 | ?3 | ?PdAgCuAuPtZn | |||||
| Lower level contact resistance (m Ω) 50 μ A, 85 ℃ of 30mv, 10 6Inferior | Before the test | Quiet closing | ??63.6?57.6 | ????????????65.6?64.4 | ?65.8?87.6 | ?65.7,77.7,65.7,67.6 | ||
| Moving closing | ??65.7?59.6 | ????????????58.9?67.6 | ?66.8?65.7 | ?65.7,63.9,61.6,69.7 | ||||
| After the test | Quiet closing | ??54.5?57.2 | ????????????56.8?50.5 | ?56.6?52.5 | 57.6 94.6. obstructed 57.7 | |||
| Moving closing | ??49.6?48.1 | ????????????48.2?49.5 | ?58.6?50.1 | 60.5,62.5, obstructed 49.56 | ||||
| Normal temperature load (inferior) | ???0.5A,28VDC ???1A.28VDC | ???????10 6 | ??????????????????10 6 | ???????10 6 | ?10 5, wherein 1 sample is slipped up 9 times | |||
| ?????5×10 4 | ???????????????5×10 4 | ????5×10 4 | ?- | |||||
| The high temperature load life-span (inferior) | ???30mv,50μA,85℃ | ????10 6More than | ??????????????10 6More than | ???10 6More than | ?10 6, 2 inefficacies of 5 samples | |||
| ???28VDC,1A,125℃ | ?10 5, contact is intact | With a left side | With a left side | ?10 5, the metal transfer scaling loss is serious | ||||
| ???28VDC,0.5A,125℃ | ?10 6, contact is intact, surpasses specified | With a left side | With a left side | Reed and contact weldering are dead | ||||
| ???28VDC,100mA.125℃ | 5×10 4, meet U.S. army mark, MIL | With a left side | With a left side | ?9.6×10 5, it is serious to freeze, not to the rated life time | ||||
| Mechanical life (inferior) | 10 7, index is qualified | With a left side | With a left side | 85 ℃ of samples all lost efficacy | ||||
| Hot operation, 125 ℃, be incubated 1 hour, 3000 times 18 samples all do not have inefficacy | With a left side | With a left side | ||||||
| Cold operation, is incubated 1 hour, 3000 18 samples all do not have inefficacy by-55 ℃ | With a left side | With a left side | ||||||
Claims (2)
1, a kind of contact material auri contains gold, it is characterized in that the composition of this gold-base alloy and content (weight %) are: Pt5-20, and Pd5-20, Cu5-20, Rh1-10, Ni1-10, surplus is Au.
2, a kind of as right 1 described gold-base alloy, it is characterized in that the best composition and the content (weight %) of this alloy is: Pt10-18, Pd8-15, Cu10-15, Rh5-8, Ni3-6, surplus is Au.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98105040A CN1073637C (en) | 1998-03-04 | 1998-03-04 | Contact material gold-base alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98105040A CN1073637C (en) | 1998-03-04 | 1998-03-04 | Contact material gold-base alloy |
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| Publication Number | Publication Date |
|---|---|
| CN1227878A true CN1227878A (en) | 1999-09-08 |
| CN1073637C CN1073637C (en) | 2001-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN98105040A Expired - Fee Related CN1073637C (en) | 1998-03-04 | 1998-03-04 | Contact material gold-base alloy |
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| CN (1) | CN1073637C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100439528C (en) * | 2005-10-28 | 2008-12-03 | 贵研铂业股份有限公司 | New type alloy material |
| CN100457371C (en) * | 2007-03-12 | 2009-02-04 | 贵研铂业股份有限公司 | Mixed powder solder and its production process |
| CN102108478A (en) * | 2009-12-29 | 2011-06-29 | 北京有色金属与稀土应用研究所 | Method for carrying out heat treatment on and straightening gold-based electrical contact material for spacecraft and equipment used in same |
| CN101715559B (en) * | 2007-06-06 | 2012-09-26 | 田中贵金属工业株式会社 | Material for probe pin |
| CN103695693A (en) * | 2013-12-13 | 2014-04-02 | 昆明贵金属研究所 | Preparation method of gold-based alloy electric contact material |
| CN105970069A (en) * | 2016-05-16 | 2016-09-28 | 昆明贵金属研究所 | Novel multi-element equal-molar-ratio precious metal high-entropy alloy |
| RU2605724C1 (en) * | 2015-07-13 | 2016-12-27 | Открытое акционерное общество "Пермская научно-производственная приборостроительная компания" | Method of increasing serviceability of contact pair for electric low-current sliding contacts |
| CN110983093A (en) * | 2019-12-20 | 2020-04-10 | 有研亿金新材料有限公司 | Gold-based alloy electrical contact material and preparation method thereof |
| CN113235031A (en) * | 2021-04-26 | 2021-08-10 | 西安理工大学 | Deformation aging method for improving mechanical property of Au-20Ag-10Cu |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1027822C (en) * | 1991-12-12 | 1995-03-08 | 中国有色金属工业总公司昆明贵金属研究所 | Silver-based alloy electrical contact material |
-
1998
- 1998-03-04 CN CN98105040A patent/CN1073637C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100439528C (en) * | 2005-10-28 | 2008-12-03 | 贵研铂业股份有限公司 | New type alloy material |
| CN100457371C (en) * | 2007-03-12 | 2009-02-04 | 贵研铂业股份有限公司 | Mixed powder solder and its production process |
| CN101715559B (en) * | 2007-06-06 | 2012-09-26 | 田中贵金属工业株式会社 | Material for probe pin |
| CN102108478A (en) * | 2009-12-29 | 2011-06-29 | 北京有色金属与稀土应用研究所 | Method for carrying out heat treatment on and straightening gold-based electrical contact material for spacecraft and equipment used in same |
| CN102108478B (en) * | 2009-12-29 | 2014-03-19 | 北京有色金属与稀土应用研究所 | Method for carrying out heat treatment on and straightening gold-based electrical contact material for spacecraft and equipment used in same |
| CN103695693A (en) * | 2013-12-13 | 2014-04-02 | 昆明贵金属研究所 | Preparation method of gold-based alloy electric contact material |
| CN103695693B (en) * | 2013-12-13 | 2016-07-20 | 昆明贵金属研究所 | A kind of preparation method of gold-base alloy contact material |
| RU2605724C1 (en) * | 2015-07-13 | 2016-12-27 | Открытое акционерное общество "Пермская научно-производственная приборостроительная компания" | Method of increasing serviceability of contact pair for electric low-current sliding contacts |
| CN105970069A (en) * | 2016-05-16 | 2016-09-28 | 昆明贵金属研究所 | Novel multi-element equal-molar-ratio precious metal high-entropy alloy |
| CN110983093A (en) * | 2019-12-20 | 2020-04-10 | 有研亿金新材料有限公司 | Gold-based alloy electrical contact material and preparation method thereof |
| CN113235031A (en) * | 2021-04-26 | 2021-08-10 | 西安理工大学 | Deformation aging method for improving mechanical property of Au-20Ag-10Cu |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1073637C (en) | 2001-10-24 |
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