Kuan et al., 2012 - Google Patents
Micro-bump assignment for 3D ICs using order relationKuan et al., 2012
- Document ID
- 11469172126740768961
- Author
- Kuan T
- Chang Y
- Chen T
- Publication year
- Publication venue
- 17th Asia and South Pacific Design Automation Conference
External Links
Snippet
The routing quality on RDLs in 3D ICs is affected by the micro-bump location seriously. In this paper, we propose a micro-bump assignment method using order relation to minimize the crossing problem and reduce the detours in RDLs. Experimental results show that our …
- 239000000203 mixture 0 description 8
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/50—Computer-aided design
- G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
- G06F17/5077—Routing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/50—Computer-aided design
- G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
- G06F17/5072—Floorplanning, e.g. partitioning, placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/50—Computer-aided design
- G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
- G06F17/5081—Layout analysis, e.g. layout verification, design rule check
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/50—Computer-aided design
- G06F17/5009—Computer-aided design using simulation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F2217/00—Indexing scheme relating to computer aided design [CAD]
- G06F2217/12—Design for manufacturability
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F2217/00—Indexing scheme relating to computer aided design [CAD]
- G06F2217/02—Component-based CAD
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F2217/00—Indexing scheme relating to computer aided design [CAD]
- G06F2217/78—Power analysis and optimization
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
- G06T17/05—Geographic models
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