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ABaT-FS

Published: 01 September 2016 Publication History

Abstract

Traditional memory design aims to improve bandwidth and reduce power by trading off memory width and frequency scaling (FS). In this context, we propose A B a T - F S, a hardware scheduling mechanism that, for the first time, performs FS on ranks in scalable memory systems which employ Double Data Rate (DDR) synchronous dynamic random access memories (SDRAM). A B a T - F S is able to utilize different rank frequencies via controlling FS intensity - defined as the ratio between the amount of time FS is applied and the total selected scheduled cycle. We propose a design space exploration of A B a T - F S with different FS intensities aiming to determine the behavior of system implications such as bandwidth, rank temperature, and power utilization. Our findings show that for 100% of FS intensity, bandwidth increases proportionally while rank temperature is increased of about +23.7°C%, and energy-per-bit magnitude is decreased in up to 67%.

References

[1]
Memory rank, Accessed date: 08/28/2014; http://en.wikipedia.org/wiki/Memory_rank.
[2]
Micron manufactures DRAM components and modules and NAND Flash, Accessed date: 02/28/2014; http://www.micron.com/.
[3]
LPDDR4 Moves Mobile, Mobile Forum 2013, presented by Daniel Skinner, Accessed date: 02/03/2014; http://www.jedec.org/sites/.../D_Skinner_Mobile_Forum_May_2013_0.pdf.
[4]
DDR3 Thermals, Accessed date: 03/28/2014; http://www.micron.com/~/media/Documents/.../ddr3_thermals_nonNDA.pdf.
[5]
A. Hadke, Design and evaluation of an optical CPU-DRAM interconnect, University of California, Department of Computer Science, University of California at Davis, USA, 2009.
[6]
M.D. Marino, RFiop: RF-Memory path to address on-package I/O pad and memory controller scalability, IEEE, 2012.
[7]
M.D. Marino, RFiof: an RF approach to the I/O-pin and memory controller scalability for off-chip memories, ACM, 2013.
[8]
K.e.a. Therdsteerasukdi, The dimm tree architecture: a high bandwidth and scalable memory system, IEEE, 2011.
[9]
M.D Marino, K.C Li, Implications of shallower memory controller transaction queues in scalable memory systems, J. Supercomput. (2015).
[10]
M.D Marino, K.C Li, Insights on memory controller scaling in multi-core embedded systems, Int. J. Embedded Syst., 6 (2014).
[11]
S.-W. Tam, RF-Interconnect for future network-on-chip, Elsevier, 2011.
[12]
M.C.F. Chang, Advanced RF/Baseband Interconnect Schemes for Inter- and Intra-ULSI Communications, IEEE Transactions of Electron Devices, 52 (2005) 1271-1285.
[13]
David, Memory Power Management via Dynamic Voltage/Frequency Scaling, ACM, New York, NY, USA, 2011.
[14]
AMD Reveals Details About Bulldozer Microprocessors, 2011,. Accessed date: 07/01/2014 - http://www.xbitlabs.com/news/cpu/display/20100824154814_AMD_Unveils_Details_About_Bulldozer_Microprocessors.html.
[15]
The Intel Xeon Processor E7 v2 Family, Accessed date: 03/10/2014; http://www.intel.com/content/www/us/en/processors/xeon/xeon-processor-e7-family.html?wapkw=intel+xeon+e7.
[16]
Calculating Memory System Power for DDR3 Introduction, Accessed date: 01/28/2014; http://www.micron.com/.
[17]
D. Vantrease, Corona: system implications of emerging nanophotonic technology, IEEE, DC, USA, 2008.
[18]
NAS Parallel Benchmarks, Accessed date: 03/11/2013; http://www.nas.nasa.gov/Resources/Software/npb.html/.
[19]
M.D. Marino, On-package scalability of RF and inductive memory controllers, IEEE, 2012.
[20]
N.L. Binkert, The M5 simulator: modeling networked systems, IEEE Micro, 26 (2006) 52-60.
[21]
D. Wang, et al., DRAMsim: a memory system simulator, SIGARCH Comput. Archit. News, 33 (2005) 100-107.
[22]
CACTI 5.1, Accessed Date: 05/16/2014; http://www.hpl.hp.com/techreports/2008/HPL200820.html.
[23]
G.H. Loh, 3D-stacked memory architectures for multi-core processors, IEEE, DC, USA, 2008.
[24]
J. Tuck, Scalable cache miss handling for high memory-level parallelism, IEEE, DC, USA, 2006.
[25]
M.F. Chang, CMP network-on-chip overlaid with multi-band RF-interconnect, 2008.
[26]
M.C.F. Chang, Power reduction of CMP communication networks via RF-interconnects, IEEE, Washington, USA, 2008.
[27]
K. Sudan, et al., Micro-pages: Increasing dram efficiency with locality-aware data placement, ACM, New York, NY, USA, 2010.
[28]
G. Byun, An 8.4Gb/s 2.5pJ/b mobile memory I/O interface using bi-directional and simultaneous dual (Base+RF)-band signaling, IEEE, 2011.
[29]
ITRS HOME, Accessed date: 09/12/2012; http://www.itrs.net/.
[30]
J.D. McCalpin, Memory bandwidth and machine balance in current high performance computers, IEEE TCCA Newslett. (1995) 19-25.
[31]
The pChase Memory Benchmark Page, Accessed date: 09/12/2013; http://pchase.org/.
[32]
J.D.C. Little, A proof for the queuing formula: l = w, Oper. Res., 9 (1961) 383-387.
[33]
Malladi, Towards energy-proportional datacenter memory with mobile DRAM, IEEE Computer Society, Washington, DC, USA, 2012.
[34]
Hybrid Memory Cube Specification 1.0, Accessed date: 04/08/2014; http://www.hybridmemorycube.org/.
[35]
S. Liu, S.O. Memik, Y. Zhang, G. Memik, A power and temperature aware DRAM architecture, 2008.
[36]
A.N. Udip, University of Utah, School of Computing, Utah, USA, 2012.
[37]
Q. Deng, Memscale: active low-power modes for main memory, ACM, New York, NY, USA, 2011.
[38]
J. Lin, H. Zheng, Z. Zhu, E. Gorbatov, H. David, Z. Zhang, Software thermal management of dram memory for multicore systems, 2008.
[39]
M.D Marino, L2-Cache hierarchical organizations for multi-core architectures, Springer, 2006.
[40]
M.D. Marino, 32-core CMP with Multi-sliced L2: 2 and 4 Cores Sharing a L2 Slice, SBAC-PAD '06, IEEE Computer Society, Washington, DC, USA, 2006.
[41]
M.D Marino, K.C Li, Last level cache size heterogeneity in embedded systems, J. Supercomput., 72 (2016) 503-544.

Cited By

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  • (2018)Exploiting dynamic transaction queue size in scalable memory systemsSoft Computing - A Fusion of Foundations, Methodologies and Applications10.5555/3197793.319780922:6(2065-2077)Online publication date: 1-Mar-2018
  • (2017)System implications of LLC MSHRs in scalable memory systemsMicroprocessors & Microsystems10.1016/j.micpro.2016.12.00752:C(355-364)Online publication date: 1-Jul-2017

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Information & Contributors

Information

Published In

cover image Microprocessors & Microsystems
Microprocessors & Microsystems  Volume 45, Issue PB
September 2016
137 pages

Publisher

Elsevier Science Publishers B. V.

Netherlands

Publication History

Published: 01 September 2016

Author Tags

  1. Frequency
  2. Memory
  3. Scaling
  4. Scheduling
  5. Temperature

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View all
  • (2018)Exploiting dynamic transaction queue size in scalable memory systemsSoft Computing - A Fusion of Foundations, Methodologies and Applications10.5555/3197793.319780922:6(2065-2077)Online publication date: 1-Mar-2018
  • (2017)System implications of LLC MSHRs in scalable memory systemsMicroprocessors & Microsystems10.1016/j.micpro.2016.12.00752:C(355-364)Online publication date: 1-Jul-2017

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