research-article

A modular 3d processor for flexible product design and technology migration

Author:

Gabriel H. LohAuthors Info & Claims

CF '08: Proceedings of the 5th conference on Computing frontiers

Pages 159 - 170

https://doi.org/10.1145/1366230.1366261

Published: 05 May 2008 Publication History

Abstract

The current methodology used in mass-market processor design is to create a single base microarchitecture (e.g., Intel's ``Core'' or AMD's ``K8'') that is used throughout all of the PC market segments from laptops to servers. To differentiate the products, manufacturers rely on speed binning, different cache sizes, and varying the number of cores. In this paper, we propose using 3D integration to provide a new, but complementary, approach to providing product differentiation. Past research on using 3D to improve performance has focused on the construction of "fully 3D" circuits where functional blocks are partitioned across two or more layers. This approach forces one of two undesirable situations: (1) all products must be implemented in, and therefore pay the cost of, 3D or (2) a 3D-implemented processor is designed for the high-end/high-performance markets and a separate 2D microarchitecture must be designed for the lower-cost markets thereby incurring significant additional design effort and engineering cost. We present a modular processor architecture where 3D can be used to enhance performance within a single unified design and also provides for a more gradual migration path toward fully 3D-integrated designs. To make this work, we describe a generic technique of using "phantom" components where the baseline processor may believe that 3D-stacked resources exist, but are currently unavailable. Simply using 3D to stack more L2 cache provides a 15.1% average performance benefit, but our proposal increases performance by 25.4%.

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Cited By

Zhang TCevrero ABeanato GAthanasopoulos PCoskun ALeblebici YMacii E(2013)3D-MMCProceedings of the Conference on Design, Automation and Test in Europe10.5555/2485288.2485586(1241-1246)Online publication date: 18-Mar-2013
https://dl.acm.org/doi/10.5555/2485288.2485586
Jang HChoi JYoon ILim SShin SChang NChung S(2013)Exploiting Application/System-Dependent Ambient Temperature for Accurate Microarchitectural SimulationIEEE Transactions on Computers10.1109/TC.2012.2462:4(705-715)Online publication date: 1-Apr-2013
https://dl.acm.org/doi/10.1109/TC.2012.24
Beanato GGiovannini PCevrero AAthanasopoulos PZervas MTemiz YLeblebici Y(2012)Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via TechnologyIEEE Journal on Emerging and Selected Topics in Circuits and Systems10.1109/JETCAS.2012.21938372:2(295-306)Online publication date: Jun-2012
https://doi.org/10.1109/JETCAS.2012.2193837
Show More Cited By

Index Terms

A modular 3d processor for flexible product design and technology migration
1. Computer systems organization
  1. Architectures

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cover image ACM Conferences

CF '08: Proceedings of the 5th conference on Computing frontiers

May 2008

334 pages

ISBN:9781605580777

DOI:10.1145/1366230

General Chair:
Alex Ramirez
UPC, Spain
,
Program Chairs:
Gianfranco Biliardi
University of Padova, Italy
,
Michael Gschwind
IBM TJ Watson Research Center, USA

Copyright © 2008 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 05 May 2008

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May 5 - 7, 2008

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Cited By

Zhang TCevrero ABeanato GAthanasopoulos PCoskun ALeblebici YMacii E(2013)3D-MMCProceedings of the Conference on Design, Automation and Test in Europe10.5555/2485288.2485586(1241-1246)Online publication date: 18-Mar-2013
https://dl.acm.org/doi/10.5555/2485288.2485586
Jang HChoi JYoon ILim SShin SChang NChung S(2013)Exploiting Application/System-Dependent Ambient Temperature for Accurate Microarchitectural SimulationIEEE Transactions on Computers10.1109/TC.2012.2462:4(705-715)Online publication date: 1-Apr-2013
https://dl.acm.org/doi/10.1109/TC.2012.24
Beanato GGiovannini PCevrero AAthanasopoulos PZervas MTemiz YLeblebici Y(2012)Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via TechnologyIEEE Journal on Emerging and Selected Topics in Circuits and Systems10.1109/JETCAS.2012.21938372:2(295-306)Online publication date: Jun-2012
https://doi.org/10.1109/JETCAS.2012.2193837
Lee JSkadron KChung S(2010)Predictive Temperature-Aware DVFSIEEE Transactions on Computers10.1109/TC.2009.13659:1(127-133)Online publication date: 1-Jan-2010
https://dl.acm.org/doi/10.1109/TC.2009.136
Jang HChoi JYoon ILim SShin SChang NChung S(2010)Exploiting application-dependent ambient temperature for accurate architectural simulation2010 IEEE International Conference on Computer Design10.1109/ICCD.2010.5647639(502-508)Online publication date: Oct-2010
https://doi.org/10.1109/ICCD.2010.5647639
Jang HYoon IKim CShin SChung S(2009)The impact of liquid cooling on 3D multi-core processors2009 IEEE International Conference on Computer Design10.1109/ICCD.2009.5413115(472-478)Online publication date: Oct-2009
https://doi.org/10.1109/ICCD.2009.5413115
Ma YLiu YKursun EReinman GCong J(2008)Investigating the effects of fine-grain three-dimensional integration on microarchitecture designACM Journal on Emerging Technologies in Computing Systems10.1145/1412587.14125904:4(1-30)Online publication date: 7-Nov-2008
https://dl.acm.org/doi/10.1145/1412587.1412590

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