Lente Ms 16ns
Lente Ms 16ns
Lente Ms 16ns
LM2665
SNVS009H – NOVEMBER 1999 – REVISED MARCH 2016
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2665
SNVS009H – NOVEMBER 1999 – REVISED MARCH 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.2 Functional Block Diagram ......................................... 8
2 Applications ........................................................... 1 8.3 Feature Description................................................... 8
3 Description ............................................................. 1 8.4 Device Functional Modes.......................................... 8
4 Revision History..................................................... 2 9 Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
5 Pin Configuration and Functions ......................... 3
9.2 Typical Applications .................................................. 9
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4 10 Power Supply Recommendations ..................... 12
6.2 ESD Ratings.............................................................. 4 11 Layout................................................................... 13
6.3 Recommended Operating Conditions....................... 4 11.1 Layout Guidelines ................................................. 13
6.4 Thermal Information .................................................. 4 11.2 Layout Example .................................................... 13
6.5 Electrical Characteristics........................................... 5 12 Device and Documentation Support ................. 14
6.6 Typical Characteristics ............................................. 5 12.1 Community Resources.......................................... 14
7 Parameter Measurement Information .................. 7 12.2 Trademarks ........................................................... 14
7.1 Test Circuit ................................................................ 7 12.3 Electrostatic Discharge Caution ............................ 14
12.4 Glossary ................................................................ 14
8 Detailed Description .............................................. 8
8.1 Overview ................................................................... 8 13 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Pin Configuration and Functions section, ESD Rating table, Feature Description , Device Functional Modes,
Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sections ................................................................................................ 1
1 6
2 5
3 4
Pin Functions
PIN DESCRIPTION
TYPE
NO. NAME VOLTAGE DOUBLER VOLTAGE SPLIT
1 V+ Power Power supply positive voltage input Positive voltage output
2 GND Ground Power supply ground input Same as doubler
Connect this pin to the negative terminal of the
3 CAP− Power Same as doubler
charge-pump capacitor.
Shutdown control pin, tie this pin to ground in
4 SD Input Same as doubler
normal operation.
5 OUT Power Positive voltage output Power supply positive voltage input
Connect this pin to the positive terminal of the
6 CAP+ Power Same as doubler
charge-pump capacitor.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
V+ to GND voltage 5.8 V
OUT to GND voltage 11.6 V
OUT to V+ voltage 5.8 V
SD (GND − 0.3 V) (V+ + 0.3 V)
V+ and OUT continuous output current 50 mA
Output short-circuit duration to GND (3) 1 sec
Continuous power dissipation (TA = 25°C) (4) 600 mW
(4)
TJ-MAX 150 °C
Lead temperature (soldering, 10 sec.) 300 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and must be
avoided. Also, for temperatures above 85°C, OUT must not be shorted to GND or V+, or device may be damaged.
(4) The maximum allowable power dissipation is calculated by using PD-MAX = (TJ-MAX − TA)/RθJA, where TJ-MAX is the maximum junction
temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance of the specified package.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(1) In the test circuit, capacitors C1 and C2 are 3.3-µF, 0.3-Ω maximum ESR capacitors. Capacitors with higher ESR increase output
resistance, reduce output voltage and efficiency.
(2) Min. and Max. limits are ensured by design, test, or statistical analysis.
(3) Typical numbers are not ensured but represent the most likely norm.
(4) The minimum input high for the SD pin equals 40% of V+.
(5) The maximum input low for the SD pin equals 20% of V+.
(6) Specified output resistance includes internal switch resistance and capacitor ESR. See the details in Application and Implementation for
simple negative voltage converter.
(7) The output switches operate at one half of the oscillator frequency, ƒOSC = 2ƒSW.
Figure 3. Output Source Resistance vs Supply Voltage Figure 4. Output Source Resistance vs Temperature
Figure 5. Output Voltage Drop vs Load Current Figure 6. Oscillator Frequency vs Supply Voltage
1 V+ 5
VIN OUT VOUT
IL
LM2665
6 CAP+ SD 4 C2* ROUT
CIN* C1*
3 CAP- GND 2
8 Detailed Description
8.1 Overview
The LM2665 CMOS charge-pump voltage converter operates as a voltage doubler for an input voltage in the
range of 2.5 V to 5.5 V. Two low-cost capacitors and a diode (needed during start-up) are used in this circuit to
provide up to 40 mA of output current. The LM2665 can also work as a voltage divider to split a voltage in the
range of 1.8 V to 11 V in half.
LM2665
V+ OUT
CAP+
SD Switch Array
OSCILLATOR Switch Drivers
CAP-
GND
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers must
validate and test their design implementation to confirm system functionality.
where
• RSW is the sum of the ON resistance of the internal MOSFET switches shown in Figure 10. (1)
The peak-to-peak output voltage ripple is determined by the oscillator frequency, the capacitance and ESR of the
output capacitor C2:
+.
84+22.' = + 2 × +. × '54%2
&15% × %2 (2)
High capacitance, low-ESR capacitors can reduce both the output resistance and the voltage ripple.
The Schottky diode D1 is only needed for start-up. The internal oscillator circuit uses the OUT pin and the GND
pin. Voltage across OUT and GND must be larger than 1.8 V to insure the operation of the oscillator. During
start-up, D1 is used to charge up the voltage at the OUT pin to start the oscillator; also, it protects the device from
turning-on its own parasitic diode and potentially latching-up. Therefore, the Schottky diode D1 must have
enough current carrying capability to charge the output capacitor at start-up, as well as a low forward voltage to
prevent the internal parasitic diode from turning-on. A Schottky diode like 1N5817 can be used for most
applications. If the input voltage ramp is less than 10 V/ms, a smaller Schottky diode like MBR0520LT1 can be
used to reduce the circuit size.
where
• IQ(V+) is the quiescent power loss of the IC device; and
• IL2Rout is the conversion loss associated with the switch on-resistance, the two external capacitors and their
ESRs. (3)
The selection of capacitors is based on the specifications of the dropout voltage (which equals IOUT ROUT), the
output voltage ripple, and the converter efficiency. Low ESR capacitors are recommended to maximize efficiency,
reduce the output voltage drop and voltage ripple.
11 Layout
LM2665
V+ CAP+
GND OUT
CAP- SD
12.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 19-Sep-2023
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM2665M6 LIFEBUY SOT-23 DBV 6 1000 Non-RoHS Call TI Level-1-260C-UNLIM -40 to 85 S04A
& Green
LM2665M6/NOPB ACTIVE SOT-23 DBV 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 S04A Samples
LM2665M6X LIFEBUY SOT-23 DBV 6 3000 Non-RoHS Call TI Level-1-260C-UNLIM -40 to 85 S04A
& Green
LM2665M6X/NOPB ACTIVE SOT-23 DBV 6 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 S04A Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 19-Sep-2023
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
3.0 C
2.6
1.75 0.1 C
B A
1.45
PIN 1
INDEX AREA
1
6
2X 0.95
3.05
2.75
1.9 5
2
4
3
0.50
6X
0.25
0.15
0.2 C A B (1.1) TYP
0.00
1.45 MAX
0 -10
0.25
GAGE PLANE 0.22
TYP 0 -10
0.08
8
TYP 0.6
0 TYP SEATING PLANE
0.3
0 -10
-10 -10
4214840/D 09/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
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EXAMPLE BOARD LAYOUT
DBV0006A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2 5
2X (0.95)
3 4
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214840/D 09/2023
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
DBV0006A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2 5
2X(0.95)
3 4
(R0.05) TYP
(2.6)
4214840/D 09/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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