Lm2596 Simple Switcher Power Converter 150-Khz 3-A Step-Down Voltage Regulator
Lm2596 Simple Switcher Power Converter 150-Khz 3-A Step-Down Voltage Regulator
Lm2596 Simple Switcher Power Converter 150-Khz 3-A Step-Down Voltage Regulator
LM2596
SNVS124E – NOVEMBER 1999 – REVISED FEBRUARY 2020
Typical Application
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2596
SNVS124E – NOVEMBER 1999 – REVISED FEBRUARY 2020 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.2 Functional Block Diagram ....................................... 11
2 Applications ........................................................... 1 8.3 Feature Description................................................. 11
3 Description ............................................................. 1 8.4 Device Functional Modes........................................ 15
4 Revision History..................................................... 2 9 Application and Implementation ........................ 16
9.1 Application Information............................................ 16
5 Description (continued)......................................... 3
9.2 Typical Applications ................................................ 23
6 Pin Configuration and Functions ......................... 4
10 Power Supply Recommendations ..................... 32
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ..................................... 5 11 Layout................................................................... 32
11.1 Layout Guidelines ................................................. 32
7.2 ESD Ratings.............................................................. 5
11.2 Layout Examples................................................... 32
7.3 Operating Conditions ................................................ 5
11.3 Thermal Considerations ........................................ 34
7.4 Thermal Information .................................................. 5
7.5 Electrical Characteristics – 3.3-V Version................. 6 12 Device and Documentation Support ................. 36
7.6 Electrical Characteristics – 5-V Version.................... 6 12.1 Device Support...................................................... 36
7.7 Electrical Characteristics – 12-V Version.................. 6 12.2 Receiving Notification of Documentation Updates 36
7.8 Electrical Characteristics – Adjustable Voltage 12.3 Support Resources ............................................... 36
Version ....................................................................... 6 12.4 Trademarks ........................................................... 36
7.9 Electrical Characteristics – All Output Voltage 12.5 Electrostatic Discharge Caution ............................ 36
Versions ..................................................................... 7 12.6 Glossary ................................................................ 36
7.10 Typical Characteristics ............................................ 8 13 Mechanical, Packaging, and Orderable
8 Detailed Description ............................................ 11 Information ........................................................... 36
8.1 Overview ................................................................. 11
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
• Removed all references to design software Switchers Made Simple .................................................................................... 1
5 Description (continued)
A standard series of inductors are available from several different manufacturers optimized for use with the
LM2596 series. This feature greatly simplifies the design of switch-mode power supplies.
Other features include a ±4% tolerance on output voltage under specified input voltage and output load
conditions, and ±15% on the oscillator frequency. External shutdown is included, featuring typically 80 μA
standby current. Self-protection features include a two stage frequency reducing current limit for the output
switch and an overtemperature shutdown for complete protection under fault conditions.
NDH Package
5-Pin TO-220 KTT Package
Top View 5-Pin TO-263
Top View
Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
This is the positive input supply for the IC switching regulator. A suitable input bypass
1 VIN I capacitor must be present at this pin to minimize voltage transients and to supply the
switching currents required by the regulator.
Internal switch. The voltage at this pin switches between approximately (+VIN − VSAT) and
2 Output O approximately −0.5 V, with a duty cycle of VOUT / VIN. To minimize coupling to sensitive
circuitry, the PCB copper area connected to this pin must be kept to a minimum.
3 Ground — Circuit ground
4 Feedback I Senses the regulated output voltage to complete the feedback loop.
Allows the switching regulator circuit to be shut down using logic signals thus dropping the
total input supply current to approximately 80 µA. Pulling this pin below a threshold voltage
of approximately 1.3 V turns the regulator on, and pulling this pin above 1.3 V (up to a
5 ON/OFF I
maximum of 25 V) shuts the regulator down. If this shutdown feature is not required, the
ON/OFF pin can be wired to the ground pin or it can be left open. In either case, the
regulator will be in the ON condition.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
Maximum supply voltage (VIN) 45 V
(3)
SD/SS pin input voltage 6 V
Delay pin voltage (3) 1.5 V
Flag pin voltage –0.3 45 V
Feedback pin voltage –0.3 25 V
Output voltage to ground, steady-state –1 V
Power dissipation Internally limited
Vapor phase (60 s) 215
KTW package
Lead temperature Infrared (10 s) 245 °C
NDZ package, soldering (10 s) 260
Maximum junction temperature 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Voltage internally clamped. If clamp voltage is exceeded, limit current to a maximum of 1 mA.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) The package thermal impedance is calculated in accordance to JESD 51-7.
(3) Thermal Resistances were simulated on a 4-layer, JEDEC board.
(4) Junction to ambient thermal resistance (no external heat sink) for the package mounted TO-220 package mounted vertically, with the
leads soldered to a printed circuit board with (1 oz.) copper area of approximately 1 in2.
(5) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit board with 0.5 in2 of 1-oz
copper area.
(6) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit board with 2.5 in2 of 1-oz
copper area.
(7) Junction to ambient thermal resistance with the TO-263 package tab soldered to a double sided printed circuit board with 3 in2 of 1-oz
copper area on the LM2596S side of the board, and approximately 16 in2 of copper on the other side of the PCB.
(1) All room temperature limits are 100% production tested. All limits at temperature extremes are specified via correlation using standard
Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) External components such as the catch diode, inductor, input and output capacitors can affect switching regulator system performance.
When the LM2596 is used as shown in Figure 35, system performance is shown in the test conditions column.
(1) All room temperature limits are 100% production tested. All limits at temperature extremes are specified via correlation using standard
Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) External components such as the catch diode, inductor, input and output capacitors can affect switching regulator system performance.
When the LM2596 is used as shown in Figure 35, system performance is shown in the test conditions column.
(1) All room temperature limits are 100% production tested. All limits at temperature extremes are specified via correlation using standard
Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) External components such as the catch diode, inductor, input and output capacitors can affect switching regulator system performance.
When the LM2596 is used as shown in Figure 35, system performance is shown in the test conditions column.
(1) All room temperature limits are 100% production tested. All limits at temperature extremes are specified via correlation using standard
Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) External components such as the catch diode, inductor, input and output capacitors can affect switching regulator system performance.
When the LM2596 is used as shown in Figure 35, system performance is shown in the test conditions column.
(1) All room temperature limits are 100% production tested. All limits at temperature extremes are specified via correlation using standard
Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) The switching frequency is reduced when the second stage current limit is activated. The amount of reduction is determined by the
severity of current overload.
(4) No diode, inductor, or capacitor connected to output pin.
(5) Feedback pin removed from output and connected to 0 V to force the output transistor switch ON.
(6) Feedback pin removed from output and connected to 12 V for the 3.3-V, 5-V, and the adjustable versions, and 15 V for the 12-V
version, to force the output transistor switch OFF.
(7) VIN = 40 V.
Figure 9. Minimum Operating Supply Voltage Figure 10. ON/OFF Threshold Voltage
Figure 11. ON/OFF Pin Current (Sinking) Figure 12. Switching Frequency
8 Detailed Description
8.1 Overview
The LM2596 SIMPLE SWITCHER® regulator is an easy-to-use, nonsynchronous, step-down DC-DC converter
with a wide input voltage range up to 40 V. The regulator is capable of delivering up to 3-A DC load current with
excellent line and load regulation. These devices are available in fixed output voltages of 3.3-V, 5-V, 12-V, and
an adjustable output version. The family requires few external components, and the pin arrangement was
designed for simple, optimum PCB layout.
Because of differences in the operation of the inverting regulator, the standard design procedure is not used to
select the inductor value. In the majority of designs, a 33-μH, 3.5-A inductor is the best choice. Capacitor
selection can also be narrowed down to just a few values. Using the values shown in Figure 18 will provide good
results in the majority of inverting designs.
This type of inverting regulator can require relatively large amounts of input current when starting up, even with
light loads. Input currents as high as the LM2596 current limit (approximately 4.5 A) are required for at least 2 ms
or more, until the output reaches its nominal output voltage. The actual time depends on the output voltage and
the size of the output capacitor. Input power sources that are current limited or sources that can not deliver these
currents without getting loaded down, may not work correctly. Because of the relatively high start-up currents
required by the inverting topology, the delayed start-up feature (C1, R1, and R2) shown in Figure 18 is
recommended. By delaying the regulator start-up, the input capacitor is allowed to charge up to a higher voltage
before the switcher begins operating. A portion of the high input current required for start-up is now supplied by
the input capacitor (CIN). For severe start-up conditions, the input capacitor can be made much larger than
normal.
Figure 21. Inverting Regulator Ground Referenced Shutdown Using Opto Device
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
NOTE
For adjustable output voltage version only.
A feedforward capacitor, shown across R2 in Table 6, is used when the output voltage is greater than 10 V or
when COUT has a very low ESR. This capacitor adds lead compensation to the feedback loop and increases the
phase margin for better loop stability. For CFF selection, see the Detailed Design Procedure section.
Figure 23. RMS Current Ratings for Low ESR Electrolytic Capacitors (Typical)
Figure 24. Capacitor ESR versus Capacitor Voltage Rating (Typical Low-ESR Electrolytic Capacitor)
By allowing the percentage of inductor ripple current to increase for low load currents, the inductor value and size
can be kept relatively low.
When operating in the continuous mode, the inductor current waveform ranges from a triangular to a sawtooth
type of waveform (depending on the input voltage), with the average value of this current waveform equal to the
DC output load current.
Inductors are available in different styles such as pot core, toroid, E-core, bobbin core, and so forth, as well as
different core materials, such as ferrites and powdered iron. The least expensive, the bobbin, rod or stick core,
consists of wire wound on a ferrite bobbin. This type of construction makes for an inexpensive inductor, but
because the magnetic flux is not completely contained within the core, it generates more Electro-Magnetic
Interference (EMl). This magnetic flux can induce voltages into nearby printed-circuit traces, thus causing
problems with both the switching regulator operation and nearby sensitive circuitry, and can give incorrect scope
readings because of induced voltages in the scope probe (see Open-Core Inductors).
When multiple switching regulators are located on the same PCB, open-core magnetics can cause interference
between two or more of the regulator circuits, especially at high currents. A torroid or E-core inductor (closed
magnetic structure) should be used in these situations.
The inductors listed in the selection chart include ferrite E-core construction for Schottky, ferrite bobbin core for
Renco and Coilcraft, and powdered iron toroid for Pulse Engineering.
Exceeding the maximum current rating of the inductor can cause the inductor to overheat because of the copper
wire losses, or the core may saturate. If the inductor begins to saturate, the inductance decreases rapidly and the
inductor begins to look mainly resistive (the DC resistance of the winding). This can cause the switch current to
rise very rapidly and force the switch into a cycle-by-cycle current limit, thus reducing the DC output load current.
This can also result in overheating of the inductor or the LM2596. Different inductor types have different
saturation characteristics, so consider this when selecting an inductor.
The inductor manufacturer's data sheets include current and energy limits to avoid inductor saturation.
For continuous mode operation, see the inductor selection graphs in Figure 27 through Figure 30.
In a switching regulator design, knowing the value of the peak-to-peak inductor ripple current (ΔIIND) can be
useful for determining a number of other circuit parameters. Parameters such as peak inductor or peak switch
current, minimum load current before the circuit becomes discontinuous, output ripple voltage, and output
capacitor ESR can all be calculated from the peak-to-peak ΔIIND. When the inductor nomographs in Figure 27
through Figure 30 are used to select an inductor value, the peak-to-peak inductor ripple current can immediately
be determined. Figure 31 shows the range of (ΔIIND) that can be expected for different load currents. Figure 31
also shows how the peak-to-peak inductor ripple current (ΔIIND) changes as you go from the lower border to the
upper border (for a given load current) within an inductance region. The upper border represents a higher input
voltage, while the lower border represents a lower input voltage.
These curves are only correct for continuous mode operation, and only if the inductor selection guides are used
to select the inductor value.
Consider the following example:
VOUT = 5 V, maximum load current of 2.5 A
VIN = 12 V, nominal, varying between 10 V and 16 V.
The selection guide in Figure 28 shows that the vertical line for a 2.5-A load current and the horizontal line for the
12-V input voltage intersect approximately midway between the upper and lower borders of the 33-μH inductance
region. A 33-μH inductor allows a peak-to-peak inductor current (ΔIIND), which is a percentage of the maximum
load current, to flow. In Figure 31, follow the 2.5-A line approximately midway into the inductance region, and
read the peak-to-peak inductor ripple current (ΔIIND) on the left hand axis (approximately 620 mAp-p).
As the input voltage increases to 16 V, approaching the upper border of the inductance region, the inductor ripple
current increases. Figure 31 shows that for a load current of 2.5 A, the peak-to-peak inductor ripple current
(ΔIIND) is 620 mA with 12 VIN, and can range from 740 mA at the upper border (16 VIN) to 500 mA at the lower
border (10 VIN).
Once the ΔIIND value is known, use these equations to calculate additional information about the switching
regulator circuit.
NOTE
For additional information, see section on output capacitors in Table 3.
2. To simplify the capacitor selection procedure, see Table 3 for quick design component selection. This table
contains different input voltages, output voltages, and load currents, and lists various inductors and output
capacitors that will provide the best design solutions.
From Table 3, locate the 5-V output voltage section. In the load current column, choose the load current line
that is closest to the current required for the application; for this example, use the 3-A line. In the maximum
input voltage column, select the line that covers the input voltage required for the application; in this
example, use the 15-V line. The rest of the line shows recommended inductors and capacitors that will
provide the best overall performance.
The capacitor list contains both through-hole electrolytic and surface-mount tantalum capacitors from four
different capacitor manufacturers. TI recommends that both the manufacturers and the manufacturer's series
that are listed in Table 3.
In this example aluminum electrolytic capacitors from several different manufacturers are available with the
range of ESR numbers required.
– 330-μF, 35-V Panasonic HFQ Series
– 330-μF, 35-V Nichicon PL Series
3. The capacitor voltage rating for electrolytic capacitors should be at least 1.5 times greater than the output
voltage, and often require much higher voltage ratings to satisfy the low ESR requirements for low output
ripple voltage.
For a 5-V output, a capacitor voltage rating of at least 7.5 V is required. But even a low ESR, switching
grade, 220-μF, 10-V aluminum electrolytic capacitor would exhibit approximately 225 mΩ of ESR (see
Figure 24 for the ESR versus voltage rating). This amount of ESR would result in relatively high output ripple
voltage. To reduce the ripple to 1% or less of the output voltage, a capacitor with a higher value or with a
higher voltage rating (lower ESR) must be selected. A 16-V or 25-V capacitor will reduce the ripple voltage
by approximately half.
2. The reverse voltage rating of the diode must be at least 1.25 times the maximum input voltage.
3. This diode must be fast (short reverse recovery time) and must be placed close to the LM2596 using short
leads and short-printed circuit traces. Because of their fast switching speed and low forward voltage drop,
Schottky diodes provide the best performance and efficiency, and must be the first choice, especially in low
output voltage applications. Ultra-fast recovery, or high-efficiency rectifiers also provide good results. Ultra-
fast recovery diodes typically have reverse recovery times of 50 ns or less. Rectifiers such as the 1N5400
series must not be used because they are too slow.
Continuous Mode Switching Waveforms VIN = 20 V, VOUT = 5 V, Load Transient Response for Continuous Mode VIN = 20 V, VOUT =
ILOAD = 2 A, L = 32 μH, COUT = 220 μF, COUT ESR = 50 mΩ 5 V, ILOAD = 500 mA to 2 A, L = 32 μH, COUT = 220 μF, COUT ESR =
A: Output Pin Voltage, 10 V/div. 50 mΩ
B: Inductor Current 1 A/div. A: Output Voltage, 100 mV/div. (AC)
C: Output Ripple Voltage, 50 mV/div. B: 500-mA to 2-A Load Pulse
Figure 33. Horizontal Time Base: 2 μs/div Figure 34. Horizontal Time Base: 100 μs/div
(1)
Select a value for R1 between 240 Ω and 1.5 kΩ. The lower resistor values minimize noise pickup in the sensitive
feedback pin. (For the lowest temperature coefficient and the best stability with time, use 1% metal film
resistors.). Calculate R2 with Equation 2.
(2)
Select R1 to be 1 kΩ, 1%. Solve for R2 in Equation 3.
(3)
R2 = 1 k (16.26 − 1) = 15.26 k, closest 1% value is 15.4 kΩ.
R2 = 15.4 kΩ.
where
• VSAT = internal switch saturation voltage = 1.16 V
• VD = diode forward voltage drop = 0.5 V (4)
Calculate the inductor Volt • microsecond constant
(E × T),
(5)
2. Use the E × T value from the previous formula and match it with the E × T number on the vertical axis of the
Inductor Value Selection Guide shown in Figure 30.
E × T = 34.2 (V × μs)
3. On the horizontal axis, select the maximum load current.
ILOAD(max) = 3 A
4. Identify the inductance region intersected by the E × T value and the maximum load current value. Each
region is identified by an inductance value and an inductor code (LXX). From the inductor value selection
guide shown in Figure 30, the inductance region intersected by the 34 (V • μs) horizontal line and the 3-A
NOTE
For additional information, see section on output capacitors in Output Capacitor (COUT)
section.
2. To simplify the capacitor selection procedure, see Table 6 for a quick design guide. This table contains
different output voltages, and lists various output capacitors that will provide the best design solutions.
From Table 6, locate the output voltage column. From that column, locate the output voltage closest to the
output voltage in your application. In this example, select the 24-V line. Under the Output Capacitor (COUT)
section, select a capacitor from the list of through-hole electrolytic or surface-mount tantalum types from four
different capacitor manufacturers. TI recommends that both the manufacturers and the manufacturers' series
that are listed in Table 6 be used.
In this example, through hole aluminum electrolytic capacitors from several different manufacturers are
available.
– 220-μF, 35-V Panasonic HFQ Series
– 150-μF, 35-V Nichicon PL Series
3. The capacitor voltage rating must be at least 1.5 times greater than the output voltage, and often much
higher voltage ratings are required to satisfy the low ESR requirements required for low output ripple voltage.
For a 20-V output, a capacitor rating of at least 30 V is required. In this example, either a 35-V or 50-V
capacitor would work. A 35-V rating was chosen, although a 50-V rating could also be used if a lower output
ripple voltage is required.
Other manufacturers or other types of capacitors may also be used, provided the capacitor specifications
(especially the 100-kHz ESR) closely match the types listed in Table 6. Refer to the capacitor manufacturers
data sheet for this information.
(6)
This capacitor type can be ceramic, plastic, silver mica, and so forth. Because of the unstable characteristics of
ceramic capacitors made with Z5U material, they are not recommended.
Table 6 contains feedforward capacitor values for various output voltages. In this example, a 560-pF capacitor is
required.
For surface mount designs, solid tantalum capacitors can be used, but exercise caution with regard to the
capacitor surge current rating (see Input Capacitor (CIN) in this data sheet). The TPS series available from AVX,
and the 593D series from Sprague are both surge current tested.
Figure 36. Horizontal Time Base: 2 μs/div Figure 37. Horizontal Time Base: 200 μs/div
11 Layout
Figure 38. Typical Through-Hole PCB Layout, Fixed Output (1x Size), Double-Sided
Figure 39. Typical Through-Hole PCB Layout, Adjustable Output (1x Size), Double-Sided
12.4 Trademarks
E2E is a trademark of Texas Instruments.
SIMPLE SWITCHER, WEBENCH are registered trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 13-Feb-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 13-Feb-2020
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 13-Feb-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Feb-2020
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Feb-2020
Pack Materials-Page 2
MECHANICAL DATA
NEB0005E
www.ti.com
MECHANICAL DATA
NDH0005D
www.ti.com
MECHANICAL DATA
KTT0005B
TS5B (Rev D)
www.ti.com
MECHANICAL DATA
NEB0005B
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated