WO2024135425A1

WO2024135425A1 - Light emission device, display device, and electronic equipment

Info

Publication number: WO2024135425A1
Application number: PCT/JP2023/044129
Authority: WO
Inventors: 一裕田村
Original assignee: ソニーセミコンダクタソリューションズ株式会社
Priority date: 2022-12-22
Filing date: 2023-12-11
Publication date: 2024-06-27

Abstract

A light emission device according to an embodiment of the present disclosure comprises a substrate, a wiring layer laminated on the substrate, an organic layer laminated on the wiring layer, a first electrode and a second electrode laminated so as to sandwich the organic layer, and a protective layer that is provided in the wiring layer and that prevents the ingress of moisture.

Description

Light-emitting device, display device and electronic device

This disclosure relates to light-emitting devices, display devices, and electronic devices.

Light-emitting devices and display devices equipped with light-emitting elements have been developed. For example, light-emitting elements using organic electroluminescence elements (organic EL elements) are known as light-emitting elements capable of emitting high-brightness light when driven by low-voltage direct current. Materials such as organic materials (e.g., organic compounds) are materials whose characteristics are easily deteriorated by moisture. To suppress this deterioration of characteristics due to moisture, technologies such as those disclosed in Patent Document 1 and Patent Document 2 have been proposed.

JP 2019-194970 A JP 2018-73760 A

However, in all of the above technologies, the intrusion of moisture from pads or the like into the organic layer is prevented by designing a protective film on the organic layer that contains the organic material, but this prevention effect may be insufficient, which may cause the properties of the organic material and other materials to deteriorate and the light-emitting properties to decrease. In addition, in all of the above technologies, the intrusion of moisture from the substrate side into the organic layer is not taken into consideration, which may cause the properties of the organic material and other materials to deteriorate and the light-emitting properties to decrease.

Therefore, this disclosure proposes a light-emitting device, a display device, and an electronic device that can suppress the deterioration of light-emitting characteristics.

A light-emitting device according to one embodiment of the present disclosure includes a substrate, a wiring layer laminated on the substrate, an organic layer laminated on the wiring layer, a first electrode and a second electrode laminated to sandwich the organic layer, and a protective layer provided in the wiring layer to prevent moisture from entering.

A display device according to one embodiment of the present disclosure includes a substrate, a wiring layer laminated on the substrate, an organic layer laminated on the wiring layer, a pixel portion including a first electrode and a second electrode laminated to sandwich the organic layer, and a protective layer provided in the wiring layer to prevent moisture from entering.

An electronic device according to one embodiment of the present disclosure includes a display device, the display device having a substrate, a wiring layer laminated on the substrate, an organic layer laminated on the wiring layer, a pixel portion including a first electrode and a second electrode laminated to sandwich the organic layer, and a protective layer provided in the wiring layer to prevent moisture from entering.

FIG. 1 is a plan view illustrating a configuration example of a display device according to an embodiment of the present disclosure. 1 is a cross-sectional view illustrating a configuration example of a display device according to an embodiment of the present disclosure. FIG. 11 is a cross-sectional view showing a configuration example of a display device according to a first modified example. FIG. 11 is a cross-sectional view showing a configuration example of a display device according to Modification 2. FIG. 11 is a plan view showing a configuration example of a display device according to Modification 3. FIG. 11 is a cross-sectional view showing a configuration example of a display device according to Modification 3. FIG. 11 is a cross-sectional view showing a configuration example of a display device according to Modification 4. FIG. 13 is a cross-sectional view showing a configuration example of a display device according to Modification 5. FIG. 13 is a cross-sectional view showing a configuration example of a display device according to Modification 6. FIG. 13 is a cross-sectional view showing a configuration example of a display device according to Modification 7. FIG. 13 is a cross-sectional view showing a configuration example of a display device according to Modification 8. FIG. 13 is a cross-sectional view showing a configuration example of a display device according to Modification 9. FIG. 23 is a cross-sectional view showing a configuration example of a display device according to a modified example 10. FIG. 23 is a cross-sectional view showing a configuration example of a display device according to Modification 11. FIG. 23 is a plan view showing a configuration example of a display device according to a twelfth modification. FIG. 23 is a plan view showing a configuration example of a display device according to a thirteenth modification. FIG. 23 is a plan view showing a configuration example of a display device according to Modification 14. 1A to 1C are diagrams for explaining a specific example 1 of a manufacturing method for a display device according to an embodiment of the present disclosure. 11A to 11C are diagrams for explaining specific example 2 of the manufacturing method for a display device according to an embodiment of the present disclosure. 11A to 11C are diagrams for explaining a specific example 3 of the manufacturing method for a display device according to an embodiment of the present disclosure. FIG. 1 is a diagram illustrating an example of the appearance of a smartphone. FIG. 1 is a diagram showing an example of the appearance of a digital still camera. FIG. 1 is a diagram showing an example of the appearance of a digital still camera. FIG. 1 is a diagram illustrating an example of the appearance of a head mounted display. FIG. 1 is a diagram showing an example of the appearance of a see-through head mounted display. FIG. 1 is a diagram illustrating an example of the appearance of a television device. FIG. 2 is a diagram showing an example of the internal configuration of a vehicle. FIG. 2 is a diagram showing an example of the internal configuration of a vehicle.

The following describes in detail the embodiments of the present disclosure with reference to the drawings. The embodiments include examples and modified examples. Note that the light-emitting devices, display devices, and electronic devices according to the present disclosure are not limited to the embodiments. In addition, in the following embodiments, the same reference numerals are used to designate the same parts, and redundant descriptions will be omitted.

The following one or more embodiments can be implemented independently. However, at least a portion of the following embodiments may be implemented in appropriate combination with at least a portion of the other embodiments. These embodiments may include novel features that are different from one another. Thus, each embodiment may contribute to solving a different purpose or problem, and may provide different effects.

The present disclosure will be described in the following order.
1. Embodiment 1-1. Configuration example of display device 1-2. Modified example of display device 1-3. Manufacturing method of display device 1-4. Function and effect 2. Other embodiments 3. Application example 4. Supplementary notes

1. Embodiment
<1-1. Configuration example of display device>
An example of the configuration of a display device 1 according to the present embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 and Fig. 2 are diagrams for explaining an example of a schematic configuration of the display device 1 according to the present embodiment.

(Plan view)
FIG. 1 is a plan view showing an example of the configuration of a display device 1 according to the present embodiment.

As shown in FIG. 1, the display device 1 according to this embodiment includes a pixel section 11, a horizontal drive circuit 12, a vertical drive circuit 13, and a pad section 14. In the example of FIG. 1, the pixel section 11 is disposed in an area substantially in the center of the display device 1, and the horizontal drive circuit 12, the vertical drive circuit 13, and the pad section 14 are disposed in the peripheral areas of the pixel section 11, but their arrangement is not limited thereto.

The pixel section 11 has a plurality of light-emitting elements 11a. The light-emitting elements 11a are arranged in a matrix of M x N elements in total, for example, M elements in the vertical direction (Y-axis direction in FIG. 1) and N elements in the horizontal direction (X-axis direction in FIG. 1). These light-emitting elements 11a function as pixels of the display device 1, and the pixel section 11 generates a pixel area. Each light-emitting element 11a is, for example, a light-emitting element that uses an organic EL element.

The horizontal drive circuit 12 and the vertical drive circuit 13 are drive circuits for driving the light-emitting elements 11a. A plurality of scanning lines 12m (m = 1 to M) are connected to the horizontal drive circuit 12. Each scanning line 12m is a line for scanning each light-emitting element 11a. A plurality of signal lines 13n (n = 1 to N) are connected to the vertical drive circuit 13. Each signal line 13n is a line for supplying various voltages to each light-emitting element 11a. The display device 1 also includes, for example, a power supply line (not shown) for supplying a drive voltage, etc. to each light-emitting element 11a.

The pad section 14 has a plurality of pads 14a. The pads 14a are arranged, for example, in a row in the horizontal direction (the X-axis direction in FIG. 1). In the example of FIG. 1, the number of pads 14a is five, but this is not limited to this. Also, each pad 14a is formed in a rectangular shape in a plan view, but this is not limited to this. Each pad 14a is made of, for example, copper foil with an exposed pattern for soldering.

Here, the display device 1 is an example of a light-emitting device (organic device) having a plurality of light-emitting elements 11a, and may be used alone or mounted in various devices, for example. Furthermore, the display device 1 may be a display device capable of color display, or a display device capable of displaying other than color.

(Cross-section view)
FIG. 2 is a cross-sectional view showing an example of the configuration of the display device 1 taken along the line A1-A1 in FIG.

As shown in FIG. 2, the display device 1 includes a substrate 10, a wiring layer 20, an anode layer 30, an organic layer 40, a cathode layer 50, and a protective layer 60. On the upper surface of the substrate 10, the wiring layer 20, the anode layer 30, the organic layer 40, the cathode layer 50, and the protective layer 60 are stacked in the order shown. The display device 1 may also include, for example, one or both of a color filter layer (e.g., color filters of red, green, and blue) and a lens layer (e.g., microlenses).

The substrate 10 is a support that supports various layers, namely the wiring layer 20, the anode layer 30, the organic layer 40, the cathode layer 50, and the protective layer 60. For example, various transistors that constitute a circuit may be provided on this substrate 10.

The wiring layer 20 is laminated on the upper surface of the substrate 10. This wiring layer 20 has a plurality of wires 21 and an insulating layer 22. The wiring layer 20 is, for example, a multi-layer wiring layer, and each wire 21 is arranged in a multi-layer manner via the insulating layer 22. A pad 14a is formed on the upper surface side of this wiring layer 20. An opening 20a is formed in the insulating layer 22 and the protective layer 60, and the upper surface of the pad 14a is exposed.

The wiring layer 20 also has multiple

protective layers

23, 24. These

protective layers

23, 24 are provided in the wiring layer 20 and are layers that suppress the intrusion of moisture. These

protective layers

23, 24 are layers that suppress the amount of moisture that passes through, that is, layers that have a lower moisture permeability than the wiring layer 20. The protective layer 23 corresponds to the first protective layer, and the protective layer 24 corresponds to the second protective layer.

The protective layer 23 is formed to prevent moisture from penetrating from the substrate 10 side to the organic layer 40 side. This protective layer 23 extends along a direction intersecting the stacking direction (Z-axis direction in FIG. 2). For example, the protective layer 23 extends in a direction perpendicular to the stacking direction (Y-axis direction in FIG. 2). The protective layer 23 is formed, for example, over the entire surface of the display device 1 (for example, the entire upper surface of the substrate 10). The stacking direction is the direction in which the substrate 10, wiring layer 20, anode layer 30, organic layer 40, cathode layer 50, protective layer 60, etc. are stacked and arranged.

The protective layer 23 is formed of, for example, an insulating material. Examples of insulating materials include, but are not limited to, nitride film (SiN), aluminum oxide (AlO), etc., and insulating materials having low moisture permeability that are generally used in semiconductor manufacturing are used. The moisture permeability is preferably, for example, 1×10 ⁻⁵ g/m ² ·day or less. The thickness of the protective layer 23 depends on the material, but is, for example, several nm to several tens of nm. The thickness of the protective layer 23 is the same in the entire region of the display device 1, but may be different depending on multiple regions (for example, pixel region, peripheral region). For example, the thickness of the protective layer 23 is set so that the pixel region is thicker than the peripheral region.

The protective layer 24 is formed to prevent moisture from penetrating from the pad 14a side to the organic layer 40 side. The pad 14a side is a region of the wiring layer 20 that includes the pad 14a, and the organic layer 40 side is a region of the wiring layer 20 below the organic layer 40. The protective layer 24 extends along the stacking direction (Z-axis direction in FIG. 2) and is located at least between the pad 14a side and the organic layer 40 side. For example, the protective layer 24 extends in the stacking direction from the upper surface of the wiring layer 20 downward, but it is sufficient that the protective layer 24 extends along the stacking direction, and it may extend obliquely with respect to the stacking direction. In the example of FIG. 1, the protective layer 24 is formed in a frame shape so as to surround the periphery of the pixel unit 11 (for example, the organic layer 40) in a plan view. This frame-shaped protective layer 24 is disposed so as to pass between the pixel unit 11 and the horizontal drive circuit 12 and between the pixel unit 11 and the vertical drive circuit 13.

The protective layer 24 may be formed of, for example, an insulating material, a metal material, or a combination of an insulating material and a metal material. The protective layer 24 is laid out so as to block moisture intrusion, regardless of the material. Examples of the insulating material include nitride film (SiN), aluminum oxide (AlO), and the like, and examples of the metal material include, but are not limited to, copper, aluminum, and tungsten, and insulating materials and metal materials with low moisture permeability that are generally used in semiconductor manufacturing are used. The moisture permeability is preferably, for example, 1×10 ⁻⁵ g/m ² ·day or less.

Here, protective layer 24 is located between protective layer 60 and protective layer 23, and is connected to both protective layer 60 and protective layer 23. More specifically, the upper end of protective layer 24 is connected to the lower surface of protective layer 60, and the lower end of protective layer 24 is connected to the upper surface of protective layer 23. In this manner, protective layer 23, protective layer 24, and protective layer 60 are connected, and organic layer 40 is surrounded by protective layer 23, protective layer 24, and protective layer 60. This prevents moisture from penetrating organic layer 40.

The anode layer 30 is laminated on the upper surface of the wiring layer 20. The anode layer 30 has a plurality of anode electrodes 31 and a separation layer 32. Each anode electrode 31 is provided on the upper surface of the wiring layer 20 for each light-emitting element 11a. These anode electrodes 31 are formed, for example, from a metal material and may reflect light. Each anode electrode 31 is connected to a wiring 21 such as a via wiring in the wiring layer 20. The separation layer 32 is laminated on the upper surface of the wiring layer 20 and electrically separates each anode electrode 31. The separation layer 32 is formed, for example, from an insulating material and may have a reflective layer that reflects light. The anode electrode 31 functions, for example, as a lower electrode and corresponds to a first electrode.

The organic layer 40 is laminated on the upper surface of the anode layer 30. This organic layer 40 includes at least a light-emitting layer, and is formed to emit, for example, white, red, green, or blue light. In the example of FIG. 2, the organic layer 40 is shown as a single layer excluding each anode electrode 31, but in reality, it is composed of multiple layers including, for example, a light-emitting layer.

The cathode layer 50 is laminated on the organic layer 40. The cathode layer 50 is formed, for example, from a material that is highly light-transmitting and conductive (for example, a transparent conductive material). The cathode layer 50 is a cathode electrode. The cathode electrode functions, for example, as an upper electrode, and corresponds to a second electrode.

Here, the light-emitting element 11a is configured by sequentially stacking an organic layer 40 and a cathode layer 50 on an anode electrode 31. Light emitted from the organic layer 40 is emitted from the surface of the organic layer 40 facing the cathode layer 50. The planar shape of the light-emitting surface of the light-emitting element 11a roughly follows the planar shape of the anode electrode 31.

The protective layer 60 is laminated on the upper surfaces of the cathode layer 50 and the wiring layer 20. The protective layer 60 is formed to cover the cathode layer 50 and the wiring layer 20, and to suppress the intrusion of moisture from the outside to the organic layer 40. The protective layer 60 is formed of, for example, an insulating material. Examples of the insulating material include, but are not limited to, nitride film (SiN) and aluminum oxide (AlO), and an insulating material with low moisture permeability that is generally used in semiconductor manufacturing is used. The moisture permeability is preferably, for example, 1×10 ⁻⁵ g/m ² ·day or less, similar to the other

protective layers

23 and 24. The protective layer 60 corresponds to a third protective layer.

In the display device 1 having such a configuration, the protective layer 23 is provided over the entire surface of the wiring layer 20. This prevents moisture from entering the organic layer 40 from the substrate 10 through the wiring layer 20. In addition, the protective layer 24 is provided between the pad 14a side and the organic layer 40 side in the wiring layer 20. This prevents moisture from entering the organic layer 40 from the pad 14a (e.g., the opening 20a) through the wiring layer 20 by the protective layer 24. In addition, the protective layer 60 is provided so as to cover the cathode layer 50, the organic layer 40, etc. This prevents moisture from entering the organic layer 40 from the outside by the protective layer 60. In this way, it is possible to prevent moisture from entering the organic layer 40, thereby suppressing the deterioration of the characteristics of the organic layer 40 due to moisture and suppressing the deterioration of the light-emitting characteristics.

<1-2. Modified Examples of Display Device>
Modifications 1 to 14 of the display device 1 according to the present embodiment will be described with reference to Fig. 3 to Fig. 17. Fig. 3 to Fig. 17 are diagrams for explaining an example of a schematic configuration of the display device 1 according to any one of Modifications 1 to 14, respectively.

(Variation 1)
Fig. 3 is a cross-sectional view showing a configuration example of the display device 1 according to Modification 1. Modification 1 is a modification of the display device 1 shown in Fig. 2 of the above-described embodiment, and therefore differences from the display device 1 shown in Fig. 2 will be described.

As shown in FIG. 3, in the display device 1 according to the first modification, the protective layer 23 is not present in the region below the pads 14a, but is formed so as to be present in the region below the organic layer 40 (e.g., the region facing the pixel region). In detail, the protective layer 23 is formed so as not to cover from below the pad portion 14 (see FIG. 1), which is part of the peripheral region, but to cover from below at least the pixel region of the pixel portion 11 (see FIG. 1). In the example of FIG. 3, the lower end of the protective layer 24 is connected to the end of the protective layer 23.

In this modified example 1, as in the above-described embodiment, the protective layer 23 can prevent moisture from penetrating from the substrate 10 through the wiring layer 20 into the organic layer 40, and the protective layer 24 can prevent moisture from penetrating from the pad 14a through the wiring layer 20 into the organic layer 40. This can suppress the deterioration of the characteristics of the organic layer 40 due to moisture, and suppress the deterioration of the light-emitting characteristics.

(Variation 2)
Fig. 4 is a cross-sectional view showing a configuration example of the display device 1 according to the modified example 2. Since the modified example 2 is a modified example of the display device 1 shown in Fig. 3 of the modified example 1, differences from the display device 1 shown in Fig. 3 will be described.

As shown in FIG. 4, in the display device 1 according to the second modification, the protective layer 23 is formed so as to be present in the region above the wiring 21 located on the same upper layer side as the pads 14a. For example, when moisture remains in the wiring layer 20, it is desirable to place the protective layer 23 as high up as possible in the wiring layer 20. As an example, it is desirable to place the protective layer 23 in a layer above the same layer as the pads 14a.

In this modified example 2, compared to modified example 1, it is possible to reliably prevent moisture from penetrating from the wiring layer 20 to the organic layer 40 by the protective layer 23. Also, as in modified example 1, it is possible to prevent moisture from penetrating from the pad 14a to the organic layer 40 via the wiring layer 20 by the protective layer 24. This makes it possible to suppress deterioration of the characteristics of the organic layer 40 due to moisture, and reliably suppress deterioration of the light-emitting characteristics.

(Variation 3)
Fig. 5 is a plan view showing a configuration example of the display device 1 according to Modification 3. Fig. 6 is a cross-sectional view showing a configuration example of the display device 1 cut along the line A2-A2 in Fig. 5. Modification 3 is a modification of the display device 1 shown in Fig. 1 of the above-mentioned embodiment, so differences from the display device 1 shown in Fig. 1 will be described.

As shown in FIG. 5, in the display device 1 according to the third modification, the protective layer 24 is formed in a frame shape so as to surround the periphery of each pad 14a in a plan view. Also, as shown in FIG. 6, the protective layer 23 is formed so as to exist only in the area below the pad 14a. In the example of FIG. 6, the pad 14a is surrounded by the protective layer 23 and the protective layer 24, and the side and bottom surfaces of the pad 14a are covered by the protective layer 23 and the protective layer 24 that face those surfaces.

In accordance with this modification 3, the protective layer 24 can reliably prevent moisture from penetrating from the pad 14a through the wiring layer 20 into the organic layer 40. This makes it possible to suppress the deterioration of the characteristics of the organic layer 40 caused by moisture, and to suppress the deterioration of the light-emitting characteristics.

(Variation 4)
Fig. 7 is a cross-sectional view showing a configuration example of the display device 1 according to Modification 4. Modification 4 is a modification of the display device 1 shown in Fig. 6 of Modification 3, and therefore differences from the display device 1 shown in Fig. 6 will be described.

As shown in FIG. 7, in the display device 1 according to the fourth modification, the protective layer 23 is formed so as to be present over the entire surface of the wiring layer 20. That is, the protective layer 23 is formed so as to be present in the region below the pad 14a and the region below the organic layer 40 (e.g., the region facing the pixel region).

In accordance with this fourth modification, the protective layer 24 can reliably prevent moisture from penetrating from the pad 14a through the wiring layer 20 into the organic layer 40, and the protective layer 23 can further prevent moisture from penetrating from the substrate 10 through the wiring layer 20 into the organic layer 40. This makes it possible to suppress the deterioration of the properties of the organic layer 40 due to moisture, and reliably suppress the deterioration of the light-emitting properties.

(Variation 5)
8 is a cross-sectional view showing a configuration example of the display device 1 according to Modification 5. Modification 5 is an example of a combination of Modification 2 (see FIG. 4) and Modification 3 (see FIG. 6).

As shown in FIG. 8, in the display device 1 according to the fifth modification, the protective layer 23 is formed so as to be present in the region above the wiring 21 located on the same upper layer side as the pads 14a, as in the second modification, and further, is formed so as to be present in the region below the pads 14a, as in the third modification. Note that the protective layer 24 is formed so as to surround the periphery of each pad 14a in a planar view, as in the third modification (see FIG. 5).

With this modification 5, the same effects as those of modification 2 and modification 3 can be obtained.

(Variation 6)
Fig. 9 is a cross-sectional view showing a configuration example of the display device 1 according to Modification 6. Modification 6 is a modification of the display device 1 shown in Fig. 2 of the above-mentioned embodiment, and therefore differences from the display device 1 shown in Fig. 2 will be described.

As shown in FIG. 9, in the display device 1 according to the sixth modification, the protective layer 23 is not present, but the protective layer 24 is present. The protective layer 24 penetrates the wiring layer 20 and extends through the wiring layer 20 from the top surface to the bottom surface. One end of the protective layer 24 is connected to the protective layer 60, and the other end of the protective layer 24 is connected to the substrate 10. The protective layer 24 is formed in a frame shape so as to surround the periphery of the pixel portion 11 (e.g., the organic layer 40) in a plan view (see FIG. 1).

In this manner, according to the sixth modification, the protective layer 24 can reliably prevent moisture from penetrating from the pad 14a through the wiring layer 20 into the organic layer 40, and furthermore, the protective layer 24 can reliably prevent moisture from penetrating into the organic layer 40 from a part of the wiring layer 20 located below the pad 14a. This makes it possible to suppress the deterioration of the characteristics of the organic layer 40 due to moisture, and suppress the deterioration of the light-emitting characteristics.

(Variation 7)
Fig. 10 is a cross-sectional view showing a configuration example of the display device 1 according to the modified example 7. Since the modified example 7 is a modified example of the display device 1 shown in Fig. 6 of the modified example 3, differences from the display device 1 shown in Fig. 6 will be described.

As shown in FIG. 10, in the display device 1 according to the seventh modification, the protective layer 23 is not present, but the protective layer 24 is present. The protective layer 24 penetrates the wiring layer 20 and extends through the wiring layer 20 from the top surface to the bottom surface. One end of the protective layer 24 is connected to the protective layer 60, and the other end of the protective layer 24 is connected to the substrate 10. The protective layer 24 is formed in a frame shape so as to surround the periphery of each pad 14a in a plan view (see FIG. 5).

In accordance with this modification 7, the protective layer 24 can reliably prevent moisture from penetrating from the pad 14a through the wiring layer 20 into the organic layer 40, and the protective layer 24 can reliably prevent moisture from penetrating from a part of the wiring layer 20 located below the pad 14a into the organic layer 40. This makes it possible to suppress deterioration of the characteristics of the organic layer 40 due to moisture, and reliably suppress deterioration of the light-emitting characteristics.

(Variation 8)
Fig. 11 is a cross-sectional view showing a configuration example of the display device 1 according to the modified example 8. Since the modified example 8 is a modified example of the display device 1 shown in Fig. 2 of the above-mentioned embodiment, differences from the display device 1 shown in Fig. 2 will be described.

As shown in FIG. 11, in the display device 1 according to the eighth modification, the protective layer 24 is not present, but the protective layer 23 is present. The protective layer 23 is present in the region above the wiring 21 located on the same upper layer side as the pad 14a, and is formed so as to connect to the pad 14a. For example, when moisture remains in the wiring layer 20, it is desirable to position the protective layer 23 as high as possible above the wiring layer 20.

In this modification 8, compared to the above-described embodiment, the protective layer 23 can reliably prevent moisture from penetrating from the wiring layer 20 into the organic layer 40. This makes it possible to suppress deterioration of the characteristics of the organic layer 40 due to moisture, and suppress deterioration of the light-emitting characteristics.

(Variation 9)
Fig. 12 is a cross-sectional view showing a configuration example of the display device 1 according to the modified example 9. Since the modified example 9 is a modified example of the display device 1 shown in Fig. 11 of the modified example 8, differences from the display device 1 shown in Fig. 11 will be described.

As shown in FIG. 12, in the display device 1 according to the ninth modification, the protective layer 23 is formed so as to be present on the upper surface of the wiring layer 20. This protective layer 23 extends up to above the pads 14a.

In accordance with this modification 9, the protective layer 23 can reliably prevent moisture from entering the organic layer 40 from the wiring layer 20 and from entering the organic layer 40 from the pad 14a via the wiring layer 20. This makes it possible to suppress deterioration of the characteristics of the organic layer 40 due to moisture, and reliably suppress deterioration of the light-emitting characteristics.

(Variation 10)
Fig. 13 is a cross-sectional view showing a configuration example of the display device 1 according to the modified example 10. Since the modified example 10 is a modified example of the display device 1 shown in Fig. 2 of the above-mentioned embodiment, differences from the display device 1 shown in Fig. 2 will be described.

As shown in FIG. 13, a display device 1 according to variant 10 has a plurality of protective layers 23. In the example of FIG. 13, the number of protective layers 23 is two, the protective layers 23 are arranged parallel to each other, and the thicknesses (lengths in the stacking direction) of the protective layers 23 are different, but this is not limited to this. In other words, the number of protective layers 23 is not particularly limited, the protective layers 23 do not have to be parallel to each other, and the thicknesses of the protective layers 23 may be different or the same. In the example of FIG. 13, the protective layers 23 are formed so that they are thicker the closer they are to the substrate 10, but conversely, they may be formed so that they are thicker the farther they are from the substrate 10.

In this modification 10, compared to the previously described embodiment, it is possible to reliably prevent moisture from penetrating from the substrate 10 through the wiring layer 20 into the organic layer 40 by using the multiple protective layers 23. Also, as in the previously described embodiment, it is possible to prevent moisture from penetrating from the pad 14a through the wiring layer 20 into the organic layer 40 by using the protective layer 24. This makes it possible to suppress deterioration of the characteristics of the organic layer 40 due to moisture, and reliably suppress deterioration of the light-emitting characteristics.

(Modification 11)
Fig. 14 is a cross-sectional view showing a configuration example of the display device 1 according to the modified example 11. Since the modified example 11 is a modified example of the display device 1 shown in Fig. 2 of the above-mentioned embodiment, differences from the display device 1 shown in Fig. 2 will be described.

As shown in FIG. 14, a display device 1 according to the eleventh modification has a plurality of protective layers 24. In the example of FIG. 14, the number of protective layers 24 is two, the protective layers 24 are arranged parallel to each other, and the widths (lengths in the direction perpendicular to the stacking direction) of the protective layers 24 are different, but this is not limited to this. In other words, the number of protective layers 24 is not particularly limited, the protective layers 24 do not have to be parallel to each other, and the widths of the protective layers 24 may be different or the same. In the example of FIG. 14, the protective layers 24 are formed so that the closer they are to the pads 14a, the wider they are, but conversely, they may be formed so that the farther they are from the pads 14a, the wider they are.

In this modification 11, compared to the previously described embodiment, it is possible to reliably prevent moisture from penetrating from the pad 14a through the wiring layer 20 into the organic layer 40 by using the multiple protective layers 24. Also, as in the previously described embodiment, it is possible to prevent moisture from penetrating from the substrate 10 through the wiring layer 20 into the organic layer 40 by using the protective layer 23. This makes it possible to suppress deterioration of the characteristics of the organic layer 40 due to moisture, and reliably suppress deterioration of the light-emitting characteristics.

(Variation 12)
Fig. 15 is a cross-sectional view showing a configuration example of the display device 1 according to the modified example 12. Since the modified example 12 is a modified example of the display device 1 shown in Fig. 1 of the above-mentioned embodiment, differences from the display device 1 shown in Fig. 1 will be described.

As shown in FIG. 15, in the display device 1 according to the modified example 12, the protective layer 24 is formed in a straight line in a plan view so as to be located between the pixel section 11 and the pad section 14.

In accordance with this modification 12, the protective layer 24 can prevent moisture from penetrating from the pad 14a through the wiring layer 20 into the organic layer 40. This can suppress the deterioration of the characteristics of the organic layer 40 due to moisture, and suppress the deterioration of the light-emitting characteristics. As in the previous embodiment (see FIG. 2), the protective layer 23 can prevent moisture from penetrating from the substrate 10 through the wiring layer 20 into the organic layer 40.

(Variation 13)
Fig. 16 is a cross-sectional view showing a configuration example of the display device 1 according to the modification 13. Since the modification 13 is a modification of the display device 1 shown in Fig. 5 of the modification 3, differences from the display device 1 shown in Fig. 5 will be described.

As shown in FIG. 16, in the display device 1 according to the modified example 13, the protective layer 24 is formed in a frame shape so as to surround the periphery of the pad portion 14 in a plan view.

In this modification 13, the protective layer 24 can prevent moisture from entering the organic layer 40 from the pad 14a via the wiring layer 20. This can suppress the deterioration of the characteristics of the organic layer 40 due to moisture, and suppress the deterioration of the light-emitting characteristics.

(Modification 14)
Fig. 17 is a cross-sectional view showing a configuration example of the display device 1 according to the modified example 14. Since the modified example 14 is a modified example of the display device 1 shown in Fig. 1 of the above-mentioned embodiment, differences from the display device 1 shown in Fig. 1 will be described.

As shown in FIG. 17, in the display device 1 according to the modification 14, the protective layer 24 is formed in a frame shape so as to surround the pixel section 11, the horizontal drive circuit 12, and the vertical drive circuit 13 in a plan view.

In accordance with this modification 14, the protective layer 24 can prevent moisture from penetrating from the pad 14a through the wiring layer 20 into the organic layer 40. This can suppress the deterioration of the characteristics of the organic layer 40 due to moisture, and reliably suppress the deterioration of the light-emitting characteristics. As in the previous embodiment (see FIG. 2), the protective layer 23 can prevent moisture from penetrating from the substrate 10 through the wiring layer 20 into the organic layer 40.

The above-mentioned modified examples 1 to 14 are merely examples, and each of the modified examples 1 to 14 may be partially modified, or any of the modified examples 1 to 14 may be selected and combined. Furthermore, when protective layer 23 and protective layer 24 are present, protective layer 24 does not have to be connected to protective layer 23, but in order to prevent moisture from penetrating into organic layer 40, it is desirable that protective layer 24 be connected to protective layer 23. Furthermore, protective layer 24 does not have to be connected to protective layer 60, but in order to prevent moisture from penetrating into organic layer 40, it is desirable that protective layer 24 be connected to protective layer 60.

<1-3. Manufacturing method of display device>
Specific examples 1 to 3 of the manufacturing method for the display device 1 according to the present embodiment will be described with reference to Fig. 18 to Fig. 20. Fig. 18 to Fig. 20 are diagrams for explaining any one of specific examples 1 to 3 of the manufacturing method for the display device 1, respectively.

(Specific Example of Manufacturing Method 1)
FIG. 18 is a diagram for explaining a specific example 1 of a manufacturing method for the display device 1. In FIG.

As shown in FIG. 18, a wiring layer 20 is laminated on the upper surface of the substrate 10. The wiring 21 and insulating layer 22 included in this wiring layer 20 are formed by normal semiconductor manufacturing techniques (e.g., lithography process). At this time, a protective layer 23 is also laminated and formed, and a pad 14a is also formed, and further, wiring 24a such as a via wiring is formed as the protective layer 24.

In addition, in order to form the protective layer 23, for example, a film formation process such as a contact stopper film may be provided in the wiring process. This is also the case in the following specific example 2 and specific example 3 of the manufacturing method.

Next, the anode layer 30, organic layer 40, cathode layer 50, and protective layer 60 are laminated in that order on the upper surface of the wiring layer 20. This forms each light-emitting element 11a. After that, an opening 20a is formed above the pad 14a by a lithography process/fabrication process, exposing the upper surface of the pad 14a.

In this manufacturing process, the protective layer 24 is formed using the wiring 24a, making it possible to eliminate the need for an additional process for forming the protective layer 24.

(Specific Example of Manufacturing Method 2)
FIG. 19 is a diagram for explaining a second specific example of the manufacturing method of the display device 1. In FIG.

As shown in FIG. 19, a wiring layer 20 is laminated on the upper surface of the substrate 10. The wiring 21 and insulating layer 22 included in this wiring layer 20 are formed by normal semiconductor manufacturing techniques (e.g., lithography process). At this time, a protective layer 23 is also laminated and formed, and the pad 14a is also formed.

Next, a groove M1 for forming the protective layer 24 is dug in the upper surface of the wiring layer 20 by a lithography process or a processing process. The position of this groove M1 is the desired position for forming the protective layer 24. Then, the groove M1 is filled with a material with low moisture permeability (e.g., nitride film, aluminum oxide, etc.), and the groove M1 is filled and planarized. In this way, the protective layer 24 is formed.

Next, the anode layer 30, the organic layer 40, the cathode layer 50, and the protective layer 60 are laminated in that order on the upper surface of the wiring layer 20. This forms each light-emitting element 11a. After that, an opening 20a is formed above the pad 14a by a lithography process or a processing process, and the upper surface of the pad 14a is exposed.

(Specific Example of Manufacturing Method 3)
FIG. 20 is a diagram for explaining a specific example 3 of the manufacturing method for the display device 1. In FIG.

As shown in FIG. 20, a wiring layer 20 is laminated on the upper surface of the substrate 10. The wiring 21 and insulating layer 22 included in this wiring layer 20 are formed by normal semiconductor manufacturing techniques (e.g., lithography process). At this time, a protective layer 23 is also laminated and formed, and a pad 14a is also formed. Next, an anode layer 30, an organic layer 40, a cathode layer 50, and a protective layer 60 are laminated in that order on the upper surface of the wiring layer 20.

Next, a groove M2 for forming the protective layer 24 is dug in the upper surface of the protective layer 60 by a lithography process or a processing process. The position of this groove M2 is the desired position for forming the protective layer 24. Then, a material with low moisture permeability (e.g., nitride film, aluminum oxide, etc.) is filled into the groove M2 to fill the groove M2. In this way, the protective layer 70 including the protective layer 24 is formed. Note that planarization or etch-back may be performed as necessary.

Then, an opening 20a is formed in the upper part of the pad 14a by a lithography process or a processing process, and the upper surface of the pad 14a is exposed.

The specific examples 1 to 3 of the manufacturing method of the display device 1 described above are merely examples, and the display device 1 may be manufactured by other manufacturing methods.

<1-4. Actions and Effects>
As described above, the display device 1 according to the present embodiment includes the substrate 10, the wiring layer 20 laminated on the substrate 10, the organic layer 40 laminated on the wiring layer 20, the first electrode and the second electrode (e.g., the anode electrode 31 and the cathode electrode (cathode layer 50)) laminated so as to sandwich the organic layer 40, and one or both of the protective layer 23 and the protective layer 24 provided in the wiring layer 20 to suppress the intrusion of moisture. This makes it possible to suppress the intrusion of moisture from the wiring layer 20 into the organic layer 40, thereby suppressing the deterioration of the characteristics of the organic layer 40 due to moisture and suppressing the deterioration of the light-emitting characteristics. For example, it is possible to prevent moisture from intruding into the organic layer 40 from the substrate 10 or the pad 14a through the wiring layer 20 by one or both of the protective layer 23 and the protective layer 24, and the deterioration of the light-emitting characteristics can be reliably suppressed.

Furthermore, one or both of

protective layers

23 and 24 may be layers having a lower moisture permeability than wiring layer 20. This can prevent moisture from penetrating from substrate 10 to organic layer 40, and reliably prevent the deterioration of the properties of organic layer 40 due to moisture.

The protective layer 23 may also be formed to prevent moisture from penetrating from the substrate 10 side to the organic layer 40 side. This prevents moisture from penetrating from the substrate 10 side to the organic layer 40 side, and reliably prevents the deterioration of the properties of the organic layer 40 due to moisture.

The protective layer 23 may also be stretched in a direction intersecting the stacking direction of the substrate 10, the wiring layer 20, and the organic layer 40. This can prevent moisture from penetrating from the substrate 10 side to the organic layer 40 side.

The display device 1 may further include a pad 14a formed on the wiring layer 20, and the protective layer 24 may be formed to prevent moisture from penetrating from the pad 14a side to the organic layer 40 side. This prevents moisture from penetrating from the pad 14a side to the organic layer 40 side, and reliably prevents degradation of the characteristics of the organic layer 40 due to moisture.

The protective layer 24 may also extend along the stacking direction of the substrate 10, the wiring layer 20, and the organic layer 40. This can prevent moisture from penetrating from the pad 14a side to the organic layer 40 side.

The protective layer 24 may also be formed so as to surround the organic layer 40 in plan view (see Figs. 1 and 17). This makes it possible to prevent moisture from penetrating from the pad 14a side to the organic layer 40 side.

The protective layer 24 may also be formed to surround the pad 14a in plan view (see Figs. 5 and 16). This can prevent moisture from penetrating from the pad 14a side to the organic layer 40 side.

The display device 1 may further include a pad 14a formed on the wiring layer 20, and the protective layer 23 and the protective layer 24 may be formed to suppress the intrusion of moisture from the substrate 10 side to the organic layer 40 side and from the pad 14a side to the organic layer 40 side. This suppresses the intrusion of moisture from the substrate 10 side to the organic layer 40 side and from the pad 14a side to the organic layer 40 side, and reliably suppresses the deterioration of the characteristics of the organic layer 40 due to moisture.

In addition, the protective layer 23 may extend along a direction intersecting the stacking direction of the substrate 10, the wiring layer 20, and the organic layer 40, and the protective layer 24 may extend along the stacking direction of the substrate 10, the wiring layer 20, and the organic layer 40. This can reliably prevent moisture from penetrating from the substrate 10 side to the organic layer 40 side and from the pad 14a side to the organic layer 40 side.

Even if both protective layer 23 and protective layer 24 are present, protective layer 24 may be formed to surround organic layer 40 in plan view. This can reliably prevent moisture from penetrating from pad 14a to organic layer 40.

Even if both protective layer 23 and protective layer 24 are present, protective layer 24 may be formed to surround pad 14a in plan view. This can reliably prevent moisture from penetrating from pad 14a to organic layer 40.

In addition, protective layer 24 may be connected to protective layer 23. This can reliably prevent moisture from penetrating from the substrate 10 side to the organic layer 40 side and from the pad 14a side to the organic layer 40 side.

Furthermore, one or both of the

protective layers

23 and 23 may be provided in multiples. This can reliably prevent moisture from penetrating from the substrate 10 side to the organic layer 40 side and/or moisture from the pad 14a side to the organic layer 40 side.

In addition, protective layer 23 may be formed from an insulating material, and protective layer 24 may be formed from one or both of an insulating material and a metallic material. This allows protective layer 23 and protective layer 24 to be easily formed using normal semiconductor manufacturing techniques.

The display device 1 may further include a protective layer 60 that is laminated to the second electrode (cathode electrode (cathode layer 50)) and prevents moisture from entering. This makes it possible to prevent moisture from entering the organic layer 40 from the outside, thereby preventing deterioration of the properties of the organic layer 40 due to moisture and reliably preventing deterioration of the light-emitting properties.

In addition, protective layer 24 may be connected to protective layer 23 and protective layer 60. This can reliably prevent moisture from penetrating from the pad 14a side to the organic layer 40 side.

The protective layer 24 may also be connected to the substrate 10 and the protective layer 60. This can reliably prevent moisture from penetrating from the pad 14a side to the organic layer 40 side.

2. Other embodiments
The configurations and processes according to the above-mentioned embodiments (examples, modifications) may be implemented in various different forms other than the above-mentioned embodiments. For example, the configurations and processes may be various forms, not limited to the above-mentioned examples. In addition, for example, the configurations, processing procedures, specific names, and information including various data and parameters shown in the above documents and drawings can be changed arbitrarily unless otherwise specified. In addition, the configurations and processes according to the above-mentioned embodiments (examples, modifications) may be appropriately combined. In addition, the effects described in this specification are merely examples and are not limited, and other effects may be present.

For example, the constituent material of the substrate 10 can be a semiconductor material, a glass material, a plastic material, or the like. When configuring the drive circuit using transistors formed on a semiconductor substrate, for example, a well region can be provided in a semiconductor substrate made of silicon, and the transistors can be formed in the well. On the other hand, when configuring the drive circuit using thin film transistors or the like, a substrate made of glass or plastic material can be used, and a semiconductor thin film can be formed on the substrate to form the drive circuit. The various wiring can have well-known configurations and structures.

The material constituting the light-emitting element 11a is appropriately selected from transparent organic materials and inorganic materials. The light-emitting element 11a is obtained, for example, by forming a resist on a transparent material layer and performing etching.

The light-emitting element 11a may also be configured to have a resonator structure that resonates light. By having the light-emitting element 11a have a resonator structure, the light-emitting color of the light-emitting element 11a can be set to a predetermined display color, so color filters are basically unnecessary. However, in order to further improve the color purity of light with a long wavelength, the display device 1 may also be configured to further include a color filter corresponding to the light-emitting element 11a for displaying red. Alternatively, in order to improve the color purity of the display colors in general, the display device 1 may also be configured to further include color filters corresponding to the light-emitting element 11a for displaying red, the light-emitting element 11a for displaying green, and the light-emitting element 11a for displaying blue.

The color filter may be configured to include color materials and/or particles that make up quantum dots. The color filter may be configured using a known resist material to which desired color materials and the like have been added. Well-known pigments and dyes may be used as color materials. The particles that make up the quantum dots are not particularly limited, and luminescent semiconductor nanoparticles may be used, for example. A color filter that includes color materials displays color by transmitting light in a desired wavelength range from the light from the light-emitting element 11a. A color filter that includes particles that make up quantum dots displays color by converting the wavelength of the light from the light-emitting element 11a.

Furthermore, as the color filter arrangement (color pattern), various patterns such as a Bayer arrangement (e.g., RGBG, GRGB, RGGB, etc.), an RGB arrangement, an RGB stripe arrangement, an RGB mosaic arrangement, etc., can be used, and in addition to the primary color filters of RGB, various complementary color filters can be used. Furthermore, the stacking position of each color filter (e.g., color filter layer) is not particularly limited as long as it is on the optical path of the light emitted from the light emitting element 11a.

Furthermore, in the display device 1, the configuration of the drive circuit that controls the light emission of the light-emitting element 11a is not particularly limited. The configuration of the transistors that make up the drive circuit is not particularly limited, and may be, for example, a p-channel type field effect transistor or an n-channel type field effect transistor.

In addition, in the display device 1, the light-emitting element 11a is configured as a so-called top-emitting type. For example, the light-emitting element 11a, which is an organic electroluminescence element, is configured by sandwiching an organic layer 40, which includes a hole transport layer, a light-emitting layer, an electron transport layer, etc., between a first electrode and a second electrode. When the cathode is shared, for example, the first electrode is the anode electrode 31, and the second electrode is the cathode electrode (cathode layer 50).

The first electrode may be formed of, for example, a single metal or alloy having a high work function, such as platinum (Pt), gold (Au), silver (Ag), chromium (Cr), tungsten (W), nickel (Ni), copper (Cu), iron (Fe), cobalt (Co), or tantalum (Ta). The first electrode may also be formed as a laminated electrode in which a transparent conductive material, such as indium zinc oxide (IZO) or indium tin oxide (ITO), is laminated on a dielectric multilayer film or a thin film having high light reflectivity, such as aluminum.

The second electrode may be formed of a metal or alloy with a low work function, such as aluminum (Al), silver (Ag), magnesium (Mg), calcium (Ca), sodium (Na), strontium (Sr), an alloy of an alkali metal and silver, an alloy of an alkaline earth metal and silver, an alloy of magnesium and calcium, or an alloy of aluminum and lithium. The second electrode may also be formed of a transparent conductive material such as indium zinc oxide (IZO) or indium tin oxide (ITO), and may be formed as a laminated electrode of a layer made of the above-mentioned low work function material and a layer made of a transparent conductive material such as indium zinc oxide (IZO) or indium tin oxide (ITO).

The organic layer 40 is formed by laminating a plurality of material layers, and is provided as a common continuous film over the entire surface including the first electrode. The organic layer 40 emits light when a voltage is applied between the first electrode and the second electrode. The organic layer 40 is formed, for example, in a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are laminated in this order from the first electrode side. The hole transport material, hole transport material, electron transport material, and organic light emitting material that constitute the organic layer 40 are not limited, and well-known materials can be used.

The organic layer 40 may also include a structure in which multiple light-emitting layers are stacked. For example, a light-emitting element 11a that emits white light can be configured by stacking red-, blue-, and green-emitting light-emitting layers, or by stacking blue- and yellow-emitting light-emitting layers. Also, the light-emitting layers can be painted differently for each light-emitting element 11a depending on the color to be displayed.

A pixel may be composed of one light-emitting element 11a or may be composed of multiple light-emitting elements 11a. For example, a pixel may be composed of multiple sub-pixels (light-emitting elements 11a). Specifically, one pixel may be composed of three types of sub-pixels: a red display sub-pixel, a green display sub-pixel, and a blue display sub-pixel. One pixel may also be composed of a set of these three types of sub-pixels plus one or more types of sub-pixels (for example, a set of a sub-pixel that emits white light to improve brightness, a set of a sub-pixel that emits a complementary color to expand the color reproduction range, a set of a sub-pixel that emits yellow to expand the color reproduction range, or a set of sub-pixels that emit yellow and cyan to expand the color reproduction range).

Also, there may be a partition wall that separates adjacent light-emitting elements 11a, and this partition wall may be formed using a material appropriately selected from known inorganic materials or organic materials. For example, the partition wall may be formed by a combination of a known film formation method, such as a physical vapor deposition method (PVD method) exemplified by a vacuum deposition method or a sputtering method, or various chemical vapor deposition methods (CVD methods), and a known patterning method, such as an etching method or a lift-off method.

The pixel may also be configured to have a shift structure that shifts any of the light-emitting portion, the lens member, and the wavelength selection portion (e.g., a color filter).

The pixel values of the display device 1 can be, for example, VGA (640,480), S-VGA (800,600), XGA (1024,768), APRC (1152,900), S-XGA (1280,1024), U-XGA (1600,1200), HD-TV (1920,1080), Q-XGA (2048,1536), as well as (1920,1035), (720,480), (1280,960), and other image display resolutions, but are not limited to these values.

<3. Application Examples>
The display device 1 according to the embodiment described above can be used as a display unit of electronic devices in various fields that displays a video signal input to the electronic device or a video signal generated within the electronic device as an image or video. For example, the display device 1 according to the embodiment can be used as a display unit of a mobile terminal device such as a smartphone or a mobile phone, a digital still camera, a head-mounted display, a see-through head-mounted display, a television device, a notebook personal computer, a video camera, an electronic book, a game device, etc.

The display device 1 according to the embodiment may include a sealed module. The display module may be provided with a circuit section or flexible printed circuit (FPC) for inputting and outputting signals from the outside to the light-emitting region.

Below, specific examples (application examples) of electronic devices using the display device 1 according to the embodiment are exemplified as a smartphone 400, a digital still camera 410, a head mounted display 420, a see-through head mounted display 430, a television device 440, and a vehicle 600. However, the specific examples exemplified here are merely examples, and the present invention is not limited to these.

(Specific Example 1)
Fig. 21 is a diagram showing an example of the appearance of a smartphone 400. As shown in Fig. 21, the smartphone 400 includes a display unit 401 that displays various information, and an operation unit 403 that includes buttons and the like that accept operation inputs by a user. The display unit 401 is configured by the display device 1 according to this embodiment.

(Specific Example 2)
Figures 22 and 23 are diagrams each showing an example of the external appearance of a digital still camera 410. Figure 22 shows a front view of the digital still camera 410, and Figure 23 shows a rear view of the digital still camera 410. As shown in Figures 22 and 23, the digital still camera 410 is, for example, a lens-interchangeable single-lens reflex type, and has an interchangeable photographing lens unit (interchangeable lens) 413 approximately in the center of the front of a camera main body (camera body) 411, and a grip part 415 for the photographer to hold on the left side of the front.

A monitor 417 is provided at a position shifted to the left from the center of the back of the camera body 411. An electronic viewfinder (eyepiece window) 419 is provided at the top of the monitor 417. By looking through the electronic viewfinder 419, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 413 and determine the composition. Either or both of the monitor 417 and the electronic viewfinder 419 are configured by the display device 1 according to the embodiment.

(Specific Example 3)
Fig. 24 is a diagram showing an example of the appearance of a head mounted display 420. As shown in Fig. 24, the head mounted display 420 has, for example, ear hooks 423 for wearing on the user's head on both sides of a glasses-shaped display unit 421. The display unit 421 is constituted by the display device 1 according to the embodiment.

(Specific Example 4)
Fig. 25 is a diagram showing an example of the appearance of the see-through head mounted display 430. As shown in Fig. 25, the see-through head mounted display 430 is composed of a main body 431, an arm 433, and a lens barrel 435. The main body 431 is connected to the arm 433 and glasses 437. Specifically, an end of the main body 431 in the long side direction is joined to the arm 433, and one side of the main body 431 is connected to the glasses 437 via a connecting member (not shown). The main body 431 may be directly attached to the head of the human body.

The main body 431 incorporates a control board and a display unit for controlling the operation of the see-through head mounted display 430. The arm 433 connects the main body 431 to the telescope tube 435 and supports the telescope tube 435. Specifically, the arm 433 is coupled to an end of the main body 431 and an end of the telescope tube 435, respectively, and fixes the telescope tube 435. The arm 433 also incorporates a signal line for communicating data related to images provided from the main body 431 to the telescope tube 435.

The lens barrel 435 projects image light provided from the main body 431 via the arm 433 through the lenses of the glasses 437 toward the eyes of the user wearing the see-through head mounted display 430. In this see-through head mounted display 430, the display unit of the main body 431 is configured by the display device 1 according to the embodiment.

(Specific Example 5)
Fig. 26 is a diagram showing an example of the external appearance of a television device 440. As shown in Fig. 26, the television device 440 has an image display screen unit 441. The image display screen unit 441 includes, for example, a front panel 443 and a filter glass 445. The image display screen unit 441 is configured by the display device 1 according to the embodiment.

(Specific Example 6)
Fig. 27 and Fig. 28 are diagrams showing an example of the internal configuration of the vehicle 600. Fig. 27 shows the interior of the vehicle 600 from the rear to the front, and Fig. 28 shows the interior of the vehicle 600 from the diagonally rear to the diagonally front.

As shown in Figures 27 and 28, the vehicle 600 has a center display 701 (701C, 701L, 701R), a console display 702, a head-up display 703, a digital rear mirror 704, a steering wheel display 705, and a rear entertainment display 706. Any or all of these displays 701 to 706 are configured by the display device 1 according to the embodiment.

The center display 701 is disposed on the dashboard 605 in a position facing the driver's seat 601 and the passenger seat 602. Although Figs. 27 and 28 show an example of a horizontally elongated center display 701 extending from the driver's seat 601 to the passenger seat 602, the screen size and location of the center display 701 are arbitrary. The center display 701 can display information detected by various sensors. As a specific example, the center display 701 can display an image captured by an image sensor, an image showing the distance to an obstacle in front of or beside the vehicle measured by a ToF sensor, and the body temperature of a passenger detected by an infrared sensor. The center display 701 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication/identification-related information, and entertainment-related information.

The safety-related information includes information such as detection of drowsiness, detection of distraction, detection of tampering by children in the vehicle, whether or not a seat belt is fastened, and detection of an occupant being left behind, and is information detected, for example, by a sensor arranged on the back side of the center display 701. The operation-related information is obtained by detecting gestures related to the operation of the occupant using a sensor. The detected gestures may include operations of various facilities in the vehicle 600. For example, operations of air conditioning equipment, navigation equipment, AV equipment, lighting equipment, etc. are detected. The life log includes the life log of all occupants. For example, the life log includes a record of the actions of each occupant while on board. By acquiring and saving the life log, it is possible to confirm the condition of the occupant at the time of the accident. The health-related information is obtained by detecting the body temperature of the occupant using a temperature sensor, and inferring the health condition of the occupant based on the detected body temperature. Alternatively, the face of the occupant may be captured using an image sensor, and the health condition of the occupant may be inferred from the facial expression captured in the image. Furthermore, the occupant may be spoken to by an automated voice and the occupant's health condition may be inferred based on the occupant's responses. Authentication/identification related information includes a keyless entry function that uses a sensor to perform face authentication, and a function for automatically adjusting seat height and position using face recognition. Entertainment related information includes a function for detecting operation information of an AV device by an occupant using a sensor, and a function for recognizing the occupant's face using a sensor and providing content suitable for the occupant via the AV device.

The console display 702 can be used to display life log information, for example. The console display 702 is disposed near the shift lever 608 on the center console 607 between the driver's seat 601 and the passenger seat 602. The console display 702 can also display information detected by various sensors. The console display 702 may also display an image of the surroundings of the vehicle captured by an image sensor, or an image showing the distance to obstacles around the vehicle.

The head-up display 703 is virtually displayed behind the windshield 604 in front of the driver's seat 601. The head-up display 703 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication/identification-related information, and entertainment-related information. Since the head-up display 703 is often virtually positioned in front of the driver's seat 601, it is suitable for displaying information directly related to the operation of the vehicle 600, such as the speed of the vehicle 600 and the remaining fuel (battery) level.

The digital rear-view mirror 704 can not only display the rear of the vehicle 600, but can also display the state of passengers in the back seats. Therefore, by placing a sensor on the back side of the digital rear-view mirror 704, it can be used to display life log information, for example.

The steering wheel display 705 is disposed near the center of the steering wheel 606 of the vehicle 600. The steering wheel display 705 can be used to display, for example, at least one of safety-related information, operation-related information, life log, health-related information, authentication/identification-related information, and entertainment-related information. In particular, since the steering wheel display 705 is located near the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, and for displaying information related to the operation of AV equipment, air conditioning equipment, etc.

The rear entertainment display 706 is attached to the back side of the driver's seat 601 and passenger seat 602, and is intended for viewing by rear seat passengers. The rear entertainment display 706 can be used to display at least one of safety-related information, operation-related information, life log, health-related information, authentication/identification-related information, and entertainment-related information, for example. In particular, since the rear entertainment display 706 is located in front of the rear seat passengers, information related to the rear seat passengers is displayed on the rear entertainment display 706. For example, the rear entertainment display 706 may display information related to the operation of AV equipment or air conditioning equipment, or may display the results of measuring the body temperature of the rear seat passengers using a temperature sensor.

As described above, by arranging a sensor on the back side of the display, it is possible to measure the distance to surrounding objects. Optical distance measurement methods are broadly divided into passive and active types. Passive types measure distance by receiving light from an object without projecting light from the sensor onto the object. Passive types include the lens focusing method, the stereo method, and the monocular vision method. Active types measure distance by projecting light onto an object and receiving reflected light from the object with a sensor. Active types include the optical radar method, the active stereo method, the photometric stereo method, the moire topography method, and the interference method. The display device 1 according to the embodiment can be applied to any of these distance measurement methods. By using a sensor arranged on the back side of the display device 1 according to the embodiment, it is possible to perform the above-mentioned passive or active distance measurement.

Note that the electronic devices to which the display device 1 according to each embodiment can be applied are not limited to the above examples. The display device 1 according to each embodiment can be applied to the display unit of electronic devices in any field that perform display based on an image signal input from the outside or an image signal generated internally. In other words, the technology according to the present disclosure can be applied to various products. For example, the display device 1 according to each embodiment may be realized as a display unit of any type of moving body such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, a robot, a construction machine, or an agricultural machine (tractor), such as the above-mentioned vehicle 600. In addition, for example, the display device 1 according to each embodiment may be applied to a display unit included in an endoscopic surgery system, a microsurgery system, or the like.

　Although each embodiment, each modified example, each application example, etc. of the present disclosure have been described in detail above with reference to the attached drawings, the technical scope of the present disclosure is not limited to such examples. It is clear that a person with ordinary knowledge in the technical field of the present disclosure can conceive of various modified or revised examples within the scope of the technical ideas described in the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure.

<4. Notes>
The present technology can also be configured as follows.
(1)
A substrate;
A wiring layer laminated on the substrate;
an organic layer laminated on the wiring layer;
a first electrode and a second electrode stacked on each side of the organic layer;
a protective layer provided in the wiring layer to prevent moisture from entering;
A light emitting device comprising:
(2)
The protective layer has a lower moisture permeability than the wiring layer.
The light emitting device according to (1) above.
(3)
the protective layer is formed so as to suppress the intrusion of moisture from the substrate side to the organic layer side;
The light emitting device according to (1) or (2) above.
(4)
the protective layer extends along a direction intersecting a stacking direction of the substrate, the wiring layer, and the organic layer;
The light emitting device according to (3) above.
(5)
A pad is further formed on the wiring layer.
the protective layer is formed so as to prevent moisture from penetrating from the pad side to the organic layer side.
The light emitting device according to any one of (1) to (4).
(6)
the protective layer extends along a stacking direction of the substrate, the wiring layer, and the organic layer;
The light emitting device according to (5) above.
(7)
The protective layer is formed so as to surround the organic layer in a plan view.
The light emitting device according to (6) above.
(8)
The protective layer is formed so as to surround the periphery of the pad in a plan view.
The light emitting device according to (6) or (7) above.
(9)
A pad is further formed on the wiring layer.
the protective layer is formed so as to suppress intrusion of moisture from the substrate side to the organic layer side and from the pad side to the organic layer side.
The light emitting device according to (1) above.
(10)
The protective layer is
a first protective layer extending in a direction intersecting a stacking direction of the substrate, the wiring layer, and the organic layer;
A second protective layer extending along the lamination direction;
having
The light emitting device according to (9) above.
(11)
the second protective layer is formed so as to surround the organic layer in a plan view;
The light emitting device according to (10) above.
(12)
The second protective layer is formed so as to surround the periphery of the pad in a plan view.
The light emitting device according to (10) or (11) above.
(13)
The second protective layer is connected to the first protective layer.
The light emitting device according to any one of (10) to (12).
(14)
One or both of the first protective layer and the second protective layer are provided in plurality.
The light emitting device according to any one of (10) to (13).
(15)
the first protective layer is formed of an insulating material,
The second protective layer is formed of one or both of an insulating material and a metallic material.
The light emitting device according to any one of (10) to (14).
(16)
Further comprising a third protective layer laminated on the second electrode to prevent moisture from entering.
The light emitting device according to any one of (10) to (15).
(17)
The second protective layer is connected to the first protective layer and the third protective layer.
The light emitting device according to (16) above.
(18)
the second protective layer is connected to the substrate and the third protective layer;
The light emitting device according to (16) or (17) above.
(19)
A substrate;
A wiring layer laminated on the substrate;
a pixel section including an organic layer laminated on the wiring layer, and a first electrode and a second electrode laminated to sandwich the organic layer;
a protective layer provided in the wiring layer to prevent moisture from entering;
A display device comprising:
(20)
A display device is provided,
The display device includes:
A substrate;
A wiring layer laminated on the substrate;
a pixel section including an organic layer laminated on the wiring layer, and a first electrode and a second electrode laminated to sandwich the organic layer;
a protective layer provided in the wiring layer to prevent moisture from entering;
An electronic device having
(21)
A display device comprising components of the light-emitting device according to any one of (1) to (18).
(22)
An electronic device comprising the display device according to (21).

REFERENCE SIGNS LIST 1 display device 10 substrate 11 pixel section 11a light emitting element 12 horizontal drive circuit 12m scanning line 13 vertical drive circuit 13n signal line 14 pad section 14a pad 20 wiring layer 20a opening 21 wiring 22 insulating layer 23 protective layer 24 protective layer 24a wiring 30 anode layer 31 anode electrode 32 separation layer 40 organic layer 50 cathode layer 60 protective layer 70 protective layer 400 smartphone 410 digital still camera 420 head mounted display 430 see-through head mounted display 440 television device 600 vehicle M1 groove M2 groove

Claims

A substrate;
A wiring layer laminated on the substrate;
an organic layer laminated on the wiring layer;
a first electrode and a second electrode stacked on each side of the organic layer;
a protective layer provided in the wiring layer to prevent moisture from entering;
A light emitting device comprising:
The protective layer has a lower moisture permeability than the wiring layer.
The light emitting device according to claim 1 .
the protective layer is formed so as to prevent moisture from penetrating from the substrate side to the organic layer side;
The light emitting device according to claim 1 .
the protective layer extends along a direction intersecting a stacking direction of the substrate, the wiring layer, and the organic layer;
The light emitting device according to claim 3 .
A pad is further formed on the wiring layer.
the protective layer is formed so as to suppress the intrusion of moisture from the pad side to the organic layer side;
The light emitting device according to claim 1 .
the protective layer extends along a stacking direction of the substrate, the wiring layer, and the organic layer;
The light emitting device according to claim 5 .
The protective layer is formed so as to surround the organic layer in a plan view.
The light emitting device according to claim 6.
The protective layer is formed so as to surround the periphery of the pad in a plan view.
The light emitting device according to claim 6.
A pad is further formed on the wiring layer.
the protective layer is formed so as to suppress intrusion of moisture from the substrate side to the organic layer side and from the pad side to the organic layer side.
The light emitting device according to claim 1 .
The protective layer is
a first protective layer extending in a direction intersecting a stacking direction of the substrate, the wiring layer, and the organic layer;
A second protective layer extending along the lamination direction;
having
10. The light emitting device according to claim 9.
the second protective layer is formed so as to surround the organic layer in a plan view;
11. The light emitting device according to claim 10.
The second protective layer is formed so as to surround the periphery of the pad in a plan view.
11. The light emitting device according to claim 10.
The second protective layer is connected to the first protective layer.
11. The light emitting device according to claim 10.
One or both of the first protective layer and the second protective layer are provided in plurality.
11. The light emitting device according to claim 10.
the first protective layer is formed of an insulating material;
The second protective layer is formed of one or both of an insulating material and a metallic material.
11. The light emitting device according to claim 10.
Further comprising a third protective layer laminated on the second electrode to prevent moisture from entering.
11. The light emitting device according to claim 10.
The second protective layer is connected to the first protective layer and the third protective layer.
17. The light emitting device of claim 16.
the second protective layer is connected to the substrate and the third protective layer;
17. The light emitting device of claim 16.
A substrate;
A wiring layer laminated on the substrate;
a pixel section including an organic layer laminated on the wiring layer, and a first electrode and a second electrode laminated to sandwich the organic layer;
a protective layer provided in the wiring layer to prevent moisture from entering;
A display device comprising:
A display device is provided,
The display device includes:
A substrate;
A wiring layer laminated on the substrate;
a pixel section including an organic layer laminated on the wiring layer, and a first electrode and a second electrode laminated to sandwich the organic layer;
a protective layer provided in the wiring layer to prevent moisture from entering;
An electronic device having