Nothing Special   »   [go: up one dir, main page]

WO2024000638A1 - 发光基板及显示装置 - Google Patents

发光基板及显示装置 Download PDF

Info

Publication number
WO2024000638A1
WO2024000638A1 PCT/CN2022/104968 CN2022104968W WO2024000638A1 WO 2024000638 A1 WO2024000638 A1 WO 2024000638A1 CN 2022104968 W CN2022104968 W CN 2022104968W WO 2024000638 A1 WO2024000638 A1 WO 2024000638A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
low
reflective
opening
emitting
Prior art date
Application number
PCT/CN2022/104968
Other languages
English (en)
French (fr)
Inventor
陈璐
刘琼
李君杰
曹丹
Original Assignee
苏州华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州华星光电技术有限公司 filed Critical 苏州华星光电技术有限公司
Priority to US17/793,748 priority Critical patent/US20240222549A1/en
Publication of WO2024000638A1 publication Critical patent/WO2024000638A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present application relates to the field of display, and in particular to a light-emitting substrate and a display device.
  • Mini Light Emitting Diode (Mini LED) as a display light-emitting device has attracted widespread attention.
  • the Mini LED light-emitting substrate mainly includes a light panel, a light guide film layer such as a diffusion plate, and a support between the light panel and the diffusion plate.
  • a light panel mainly includes a light panel, a light guide film layer such as a diffusion plate, and a support between the light panel and the diffusion plate.
  • the LED emits light, due to the influence of light reflection between the reflective film layer on the lamp board and the support, light converges near the support, resulting in uneven brightness and darkness of the Mini LED light-emitting substrate.
  • the purpose of this application is to provide a light-emitting substrate and a display device to solve the technical problem of uneven light emission from the light-emitting substrate.
  • this application provides a light-emitting substrate, including:
  • a driving substrate with a plurality of light-emitting devices provided on the driving substrate;
  • a plurality of support pillars arranged at intervals on the driving substrate and between each of the light-emitting devices;
  • a light guide functional layer is provided on the side of each support pillar away from the driving substrate;
  • a reflective layer disposed on the driving substrate and located between each of the light-emitting devices
  • the reflective layer includes a reflective body and a plurality of low-reflective units, one of the low-reflective units is arranged around a support column, and the reflectivity of the reflective layer at the position of the reflective body is greater than that of the reflective layer at the position of the reflective body.
  • the reflectivity of the low-reflection unit location is not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to the reflective layer.
  • the low-reflection unit includes an opening located in the reflective layer, and the depth of the opening is equal to the thickness of the reflective layer.
  • the low-reflective unit includes an opening located in the reflective layer and a low-reflective part located in the opening, and the depth of the opening is less than or equal to the thickness of the reflective layer. , the reflectivity of the reflective body is greater than the reflectivity of the low-reflective part.
  • the depth of the opening is zero.
  • the opening is arranged in an annular shape around the support column.
  • the opening includes a plurality of sub-openings arranged around the support column.
  • the opening width of the sub-openings gradually decreases in a direction away from the support pillar.
  • the material of the low-reflective part is ink.
  • the reflective layer includes a plurality of through holes, and one end of the support pillar away from the light guide functional layer passes through one of the through holes and is connected to the driving substrate;
  • the low-reflection unit is spaced apart from the through-hole, and the distance between the low-reflection unit and the through-hole is greater than or equal to 1.5 mm.
  • the distance between the low-reflection unit and the support pillar is smaller than the distance between the low-reflection unit and any one of the low-reflection units. The spacing between light-emitting units.
  • the distance between the driving substrate and the light guide functional layer is 2 mm to 10 mm.
  • This application also provides a display device, including a light-emitting substrate and a display panel disposed on the light-emitting side of the light-emitting substrate; the light-emitting substrate includes:
  • a driving substrate with a plurality of light-emitting devices provided on the driving substrate;
  • a plurality of support pillars arranged at intervals on the driving substrate and between each of the light-emitting devices;
  • a light guide functional layer is provided on the side of each support pillar away from the driving substrate;
  • a reflective layer is provided on the driving substrate and located between each of the light-emitting devices;
  • the reflective layer includes a reflective body and a plurality of low-reflective units, one of the low-reflective units is arranged around a support column, and the reflectivity of the reflective layer at the position of the reflective body is greater than that of the reflective layer at the position of the reflective body.
  • the reflectivity of the low-reflection unit location is not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to the reflective layer.
  • the low-reflection unit includes an opening located in the reflective layer, and the depth of the opening is equal to the thickness of the reflective layer.
  • the low-reflective unit includes an opening located in the reflective layer and a low-reflective part located in the opening, and the depth of the opening is less than or equal to the thickness of the reflective layer. , the reflectivity of the reflective body is greater than the reflectivity of the low-reflective part.
  • the depth of the opening is zero.
  • the opening is arranged in an annular shape around the support column.
  • the opening includes a plurality of sub-openings arranged around the support column.
  • the opening width of the sub-openings gradually decreases in a direction away from the support pillar.
  • the reflective layer includes a plurality of through holes, and an end of the support pillar away from the light guide functional layer passes through one of the through holes and is connected to the driving substrate;
  • the low-reflection unit is spaced apart from the through-hole, and the distance between the low-reflection unit and the through-hole is greater than or equal to 1.5 mm.
  • the distance between the low-reflection unit and the support pillar is smaller than the distance between the low-reflection unit and any one of the low-reflection units.
  • the spacing between light-emitting units is smaller than the distance between the low-reflection unit and any one of the low-reflection units.
  • the reflective layer by dividing the reflective layer into a reflective body and a plurality of low-reflective units, one of the low-reflective units is arranged around a support column, and the reflectivity of the reflective layer at the position of the reflective body is greater than
  • the reflectivity of the reflective layer at the position of the low-reflection unit can thereby reduce the reflectivity of the reflective layer at the position of the support column, avoid light accumulation at the position of the support column and cause uneven light emission of the luminescent substrate, and ensure that the luminescent substrate Uniformity of light output.
  • Figure 1 is a schematic diagram of the first film layer structure of the light-emitting substrate in the embodiment of the present application.
  • Figure 2 is a schematic diagram of the second film layer structure of the light-emitting substrate in the embodiment of the present application.
  • Figure 3 is a schematic diagram of the third film layer structure of the light-emitting substrate in the embodiment of the present application.
  • Figure 4 is a first top view of the light-emitting substrate in the embodiment of the present application.
  • Figure 5 is a second top view of the light-emitting substrate in the embodiment of the present application.
  • Figure 6 is a third top view of the light-emitting substrate in the embodiment of the present application.
  • first and second are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, features defined as “first” and “second” may explicitly or implicitly include one or more of the described features. In the description of this application, “plurality” means two or more than two, unless otherwise explicitly and specifically limited.
  • connection should be understood in a broad sense.
  • connection or integral connection; it can be mechanical connection, electrical connection or mutual communication; it can be direct connection, or indirect connection through an intermediary, it can be internal connection of two elements or interaction of two elements relation.
  • the light-emitting substrate includes:
  • Driving substrate 100 with a plurality of light-emitting devices 200 provided on the driving substrate 100;
  • a plurality of support pillars 300 are spaced apart on the driving substrate 100 and located between each of the light-emitting devices 200;
  • the light guide functional layer 400 is provided on the side of each support pillar 300 away from the driving substrate 100;
  • the reflective layer 500 is provided on the driving substrate 100 and is located between each of the light-emitting devices 200;
  • the reflective layer 500 includes a reflective main body 510 and a plurality of low-reflective units 520.
  • One of the low-reflective units 520 is arranged around one of the support pillars 300, and the reflective layer 500 is at the position of the reflective main body 510.
  • the reflectivity is greater than the reflectivity of the reflective layer 500 at the position of the low-reflective unit 520 .
  • the comparison of the reflectivity at the position of the reflective body 510 and the reflectivity at the position of the low-reflection unit 520 is based on the fact that the wavelength and incident angle of the incident light incident on the position of the reflective body 510 and the position of the low-reflection unit 520 are the same. .
  • the Mini LED light-emitting substrate mainly includes a light panel, a light guide film layer such as a diffusion plate, and a support member located between the light panel and the diffusion plate.
  • a light guide film layer such as a diffusion plate
  • a support member located between the light panel and the diffusion plate.
  • the LED emits light
  • the reflective layer 500 is divided into a reflective body 510 and a plurality of low-reflective units 520.
  • One of the low-reflective units 520 is arranged around one of the support pillars 300, and The reflectivity of the reflective layer 500 at the position of the reflective body 510 is greater than the reflectivity of the reflective layer 500 at the position of the low-reflection unit 520 , thereby reducing the reflectivity of the reflective layer 500 near the support column 300 and preventing the support from being damaged.
  • Light aggregation occurs at the position of the pillar 300, resulting in uneven light emission from the light-emitting substrate, thereby ensuring the uniformity of light emission from the light-emitting substrate.
  • the light guide functional layer 400 may include a diffusion plate, and the distance between the driving substrate and the light guide functional layer may be adjusted according to actual needs to avoid the light emitting substrate from Light aggregation occurs at the position of the support pillar 300, resulting in uneven light emission, ensuring the uniformity of light emission from the light-emitting substrate.
  • the distance between the driving substrate and the light guide functional layer is 2 mm to 10 mm, so that the light emitting The brightness difference between the light emitted by the substrate at the position of the support pillar 300 and the light emitted at other positions is the smallest, so that the light emitting substrate has the highest uniformity of light.
  • the low-reflection unit 520 includes an opening 521 located in the reflective layer 500 , and the depth of the opening 521 is equal to the thickness of the reflective layer 500 .
  • the low-reflection unit 520 includes an opening 521 located in the reflective layer 500. Under the condition that the depth of the opening 521 is equal to the thickness of the reflective layer 500, the driving substrate 100 is in the opening 521. The position of 521 is exposed. Obviously, the reflectivity of the reflective body 510 is greater than the reflectivity of the driving substrate 100, so that the reflectivity of the reflective layer 500 at the position of the reflective body 510 is greater than that of the reflective layer 500. The reflectivity at the position of the low-reflection unit 520 is used to avoid the problem of uneven light emission from the light-emitting substrate caused by light accumulation at the position of the support pillar 300 .
  • the low-reflective unit 520 includes an opening 521 located in the reflective layer 500 and a low-reflective portion 522 located in the opening 521, so The depth of the opening 521 is less than or equal to the thickness of the reflective layer 500 , and the reflectivity of the reflective body 510 is greater than the reflectivity of the low-reflective part 522 .
  • the low-reflective unit 520 includes an opening 521 located in the reflective layer 500 and a low-reflective part 522 located in the opening 521 , and the reflectivity of the reflective body 510 is greater than the low-reflective part 522
  • the reflectivity of the reflective layer 500 is greater than the reflectivity of the reflective layer 500 at the position of the reflective body 510 by filling the opening 521 with the low-reflective portion 522 whose reflectivity is lower than that of the reflective body 510 .
  • the reflectivity of the layer 500 at the position of the low-reflection unit 520 avoids the problem of uneven light emission from the light-emitting substrate caused by light accumulation at the position of the support pillar 300; in this embodiment, the depth of the opening 521 can be less than
  • the thickness of the reflective layer 500 may be equal to the thickness of the reflective layer 500 .
  • the low-reflective part 522 can fill the opening 521 , and the low-reflective part 522 is away from the side of the driving substrate 100
  • the surface may be coplanar with the surface on the side of the reflective body 510 away from the driving substrate 100 , thereby ensuring the flatness of the reflective layer 500 .
  • the material of the low-reflective part 522 is ink.
  • the reflectivity of the ink selected in this embodiment is lower than the reflectivity of the reflective body 510, and during specific production, it can be
  • the position of the opening 521 is coated with ink to form the low-reflective part 522, which not only ensures the flatness of the reflective layer 500, but also reduces the production cost of the low-reflective part 522.
  • the low-reflective part 522 is The material of the reverse part 522 can be made of different colors of ink according to specific needs.
  • the material of the low-reflective part 522 can be gray ink, brown ink, black ink, etc.
  • the structure of the light-emitting substrate is substantially the same as that of the light-emitting substrate shown in FIG. 3 , except that the depth of the opening 521 is zero. That is to say, the low-reflection unit 520 directly covers the reflective layer 500 There is no opening 521 at the position where the low-reflective unit 520 covers the reflective layer 500; the low-reflective unit 520 can be a coating, and the material of the coating can be ink with a reflectivity lower than that of the reflective body 510. .
  • the opening 521 is arranged in an annular shape around the support column 300 .
  • the opening 521 can be arranged in an annular shape around the support column 300, so that the reflectivity of the reflective layer 500 around the support column 300 can be reduced from various angles, so that the surrounding area of the support column 300 can be reduced. The overall brightness is reduced more evenly, and the problem of inconsistent brightness reduction around the support column 300 can also be avoided.
  • the shape of the annular opening 521 can be consistent with the shape of the support column 300 Matches any position described.
  • the opening 521 includes a plurality of sub-openings 5211 arranged around the support column 300 .
  • the opening 521 includes a plurality of sub-openings 5211 arranged around the support column 300.
  • the plurality of sub-openings 5211 are evenly arranged around the support column 300. Any two adjacent sub-openings 5211 are arranged around the support column 300. 5211 are all equally spaced, so that the overall brightness around the support column 300 is reduced more uniformly.
  • by arranging the opening 521 to include a plurality of sub-openings 5211 arranged around the support column 300 in this embodiment When the depth of the opening 521 is equal to the depth of the reflective layer 500 , the opening 521 is prevented from being annular and dividing the reflective layer 500 into multiple separate parts, thus ensuring the integrity of the reflective layer 500 .
  • the area of the sub-openings 5211 gradually decreases in the direction away from the support column 300 .
  • dividing the opening 521 into a plurality of sub-openings 5211 arranged around the support column 300 facilitates the adjustment of the shape of each sub-opening 5211 according to actual light brightness requirements.
  • the opening width of the sub-openings 5211 gradually decreases in the direction away from the support column 300.
  • the width of the sub-openings 5211 gradually decreases in the direction away from the support column 300.
  • the light that converges around the support column 300 gradually decreases, and by gradually reducing the opening width of the sub-opening 5211 in the direction away from the support column 300, the light-emitting substrate can be On the basis of reducing the light emission brightness at the position of the support pillar 300, the uniformity of the overall light emission of the light-emitting substrate is ensured.
  • the reflective layer 500 includes a plurality of through holes 530 , and one end of the support pillar 300 away from the light guide functional layer 400 passes through one of the through holes 530 . Connected to the driving substrate 100;
  • the low reflection unit 520 is spaced apart from the through hole 530 , and the distance between the low reflection unit 520 and the through hole 530 is greater than or equal to 1.5 mm.
  • the reflective layer 500 includes a plurality of through holes 530, and one end of the support pillar 300 away from the light guide functional layer 400 passes through the through hole 530 and is connected to the driving substrate 100.
  • the diameter of the through hole 530 is larger than the diameter of the support pillar 300, and the low reflection unit 520 is spaced apart from the through hole 530, that is, The opening 521 of the low-reflection unit 520 is spaced apart from the through hole 530.
  • the opening 521 is spaced from the through hole 530, and the opening 521 of the low-reflection unit 520 and the through hole 530 are spaced apart.
  • the distance is greater than or equal to 1.5 mm to avoid the opening 521 and the through hole 530 being close to each other and increasing the process difficulty of manufacturing the opening 521 and the through hole 530 on the reflective layer 500 .
  • the distance between the low-reflection unit 520 and the support pillar 300 is smaller than the distance between the low-reflection unit 520 and the support pillar 300 .
  • the distance between the low-reflection unit 520 and the support pillar 300 is smaller than that between the low-reflection unit 520 and any of the light-emitting units.
  • each of the light-emitting devices 200 prevents the light-emitting substrate from light gathering at the position of the support column 300 resulting in uneven light emission of the light-emitting substrate, and at the same time minimizes the impact on the light-emitting substrate.
  • the position of each light-emitting device 200 affects the brightness of the light.
  • the present application also provides a display device, including the light-emitting substrate as described in any one of the previous embodiments, and a display panel disposed on the light-emitting side of the light-emitting substrate.
  • the specific structure of the light-emitting substrate can be found in the previous embodiments and will not be discussed here.
  • the light-emitting substrate can be used for display alone, or can be used as a backlight module of a display device.
  • the display panel is a liquid crystal display panel, and the light-emitting substrate serves as a backlight module.
  • the group is arranged on the light incident side of the display panel.
  • the present application provides a light-emitting substrate by dividing the reflective layer 500 into a reflective body 510 and a plurality of low-reflective units 520.
  • One of the low-reflective units 520 is arranged around one of the support pillars 300, and the reflective layer 500 is in the
  • the reflectivity of the reflective body 510 is greater than the reflectivity of the reflective layer 500 at the low-reflective unit 520 , thereby reducing the reflectivity of the reflective layer 500 near the support column 300 and avoiding light accumulation at the support column 300 .
  • the light emission from the light-emitting substrate is uneven, ensuring the uniformity of the light emission from the light-emitting substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Planar Illumination Modules (AREA)

Abstract

本申请提供一种发光基板及显示装置，该发光基板包括驱动基板、导光功能层和反射层，驱动基板上设有多个发光器件和多个支撑柱，反射层设置于驱动基板上且位于各发光器件之间，反射层包括反射主体和多个低反单元，一低反单元绕一支撑柱设置，且反射层在反射主体位置的反射率大于反射层在低反单元位置的反射率。

Description

发光基板及显示装置 技术领域
本申请涉及显示领域，特别涉及一种发光基板及显示装置。
 背景技术
随着显示技术的发展，采用迷你发光二极管（Mini Light Emitting Diode，Mini LED）作为显示发光器件的技术受到广泛关注。
目前，Mini LED发光基板主要包括灯板、诸如扩散板的导光膜层、以及位于灯板与扩散板之间的支撑件，在Mini LED发光时，由于受到灯板上的反射膜层和支撑件之间光线反射的影响而在支撑件附近出现光线聚集的现象，导致Mini LED发光基板的出光亮暗不均。
 技术问题
本申请的目的在于，提供一种发光基板及显示装置，用于解决发光基板出光亮暗不均的技术问题。
 技术解决方案
为了解决上述问题，本申请提供一种发光基板，包括：
驱动基板，所述驱动基板上设有多个发光器件；
多个支撑柱，间隔设置与所述驱动基板上，且位于各所述发光器件之间；
导光功能层，设置于各所述支撑柱远离所述驱动基板的一侧；
反射层，设置于所述驱动基板上，且位于各所述发光器件之间；
其中，所述反射层包括反射主体和多个低反单元，一所述低反单元绕一所述支撑柱设置，且所述反射层在所述反射主体位置的反射率大于所述反射层在所述低反单元位置的反射率。
在本申请实施例所提供的发光基板中，所述低反单元包括位于所述反射层的开口，所述开口的深度等于所述反射层的厚度。
在本申请实施例所提供的发光基板中，所述低反单元包括位于所述反射层的开口和位于所述开口内的低反部，所述开口的深度小于或等于所述反射层的厚度，所述反射主体的反射率大于所述低反部的反射率。
在本申请实施例所提供的发光基板中，所述开口的深度为零。
在本申请实施例所提供的发光基板中，所述开口呈环型绕所述支撑柱设置。
在本申请实施例所提供的发光基板中，所述开口包括绕所述支撑柱设置的多个子开口。
在本申请实施例所提供的发光基板中，一所述支撑柱与对应的多个所述子开口中，所述子开口的开口宽度在远离所述支撑柱的方向上逐渐减小。
在本申请实施例所提供的发光基板中，所述低反部的材料为油墨。
在本申请实施例所提供的发光基板中，所述反射层包括多个通孔，一所述支撑柱远离所述导光功能层的一端穿过一所述通孔与所述驱动基板连接；
所述低反单元与所述通孔间隔设置，且所述低反单元与所述通孔的距离大于或等于1.5mm。
在本申请实施例所提供的发光基板中，一所述支撑柱与对应的一所述低反单元中，所述低反单元与所述支撑柱间距小于所述低反单元与任一所述发光单元的间距。
在本申请实施例所提供的发光基板中，所述驱动基板与导光功能层之间的距离为2mm～10mm。
本申请还提供一种显示装置，包括发光基板、以及设置于所述发光基板出光侧的显示面板；所述发光基板包括：
驱动基板，所述驱动基板上设有多个发光器件；
多个支撑柱，间隔设置与所述驱动基板上，且位于各所述发光器件之间；
导光功能层，设置于各所述支撑柱远离所述驱动基板的一侧；
反射层，设置于所述驱动基板上，且位于各所述发光器件之间；
其中，所述反射层包括反射主体和多个低反单元，一所述低反单元绕一所述支撑柱设置，且所述反射层在所述反射主体位置的反射率大于所述反射层在所述低反单元位置的反射率。
在本申请实施例所提供的显示装置中，所述低反单元包括位于所述反射层的开口，所述开口的深度等于所述反射层的厚度。
在本申请实施例所提供的显示装置中，所述低反单元包括位于所述反射层的开口和位于所述开口内的低反部，所述开口的深度小于或等于所述反射层的厚度，所述反射主体的反射率大于所述低反部的反射率。
在本申请实施例所提供的显示装置中，所述开口的深度为零。
在本申请实施例所提供的显示装置中，所述开口呈环型绕所述支撑柱设置。
在本申请实施例所提供的显示装置中，所述开口包括绕所述支撑柱设置的多个子开口。
在本申请实施例所提供的显示装置中，一所述支撑柱与对应的多个所述子开口中，所述子开口的开口宽度在远离所述支撑柱的方向上逐渐减小。
在本申请实施例所提供的显示装置中，所述反射层包括多个通孔，一所述支撑柱远离所述导光功能层的一端穿过一所述通孔与所述驱动基板连接；
所述低反单元与所述通孔间隔设置，且所述低反单元与所述通孔的距离大于或等于1.5mm。
在本申请实施例所提供的显示装置中，一所述支撑柱与对应的一所述低反单元中，所述低反单元与所述支撑柱间距小于所述低反单元与任一所述发光单元的间距。
 有益效果
本申请的有益效果：通过将反射层划分为反射主体和多个低反单元，一所述低反单元绕一所述支撑柱设置，且所述反射层在所述反射主体位置的反射率大于所述反射层在所述低反单元位置的反射率，从而降低反射层在支撑柱附件的反射率，避免在支撑柱位置出现光线聚集而导致发光基板的出光亮暗不均，保证了发光基板出光的均匀性。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例中发光基板的第一种膜层结构示意图；
图2为本申请实施例中发光基板的第二种膜层结构示意图；
图3为本申请实施例中发光基板的第三种膜层结构示意图；
图4为本申请实施例中发光基板的第一种俯视图；
图5为本申请实施例中发光基板的第二种俯视图；
图6为本申请实施例中发光基板的第三种俯视图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
在本申请的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
现结合具体实施例对本申请的技术方案进行描述。
本申请提供一种发光基板，请参阅图1至图6，所述发光基板包括：
驱动基板100，所述驱动基板100上设有多个发光器件200；
多个支撑柱300，间隔设置与所述驱动基板100上，且位于各所述发光器件200之间；
导光功能层400，设置于各所述支撑柱300远离所述驱动基板100的一侧；
反射层500，设置于所述驱动基板100上，且位于各所述发光器件200之间；
其中，所述反射层500包括反射主体510和多个低反单元520，一所述低反单元520绕一所述支撑柱300设置，且所述反射层500在所述反射主体510位置的反射率大于所述反射层500在所述低反单元520位置的反射率。反射主体510位置的反射率和低反单元520位置的反射率的大小比对，是以入射在反射主体510位置和低反单元520位置的入射光波长和入射角度均相同的基础上进行比对。
可以理解的是，目前，Mini LED发光基板主要包括灯板、诸如扩散板的导光膜层、以及位于灯板与扩散板之间的支撑件，在Mini LED发光时，由于受到灯板上的反射膜层和支撑件之间光线反射的影响而在支撑件附近出现光线聚集的现象，导致Mini LED发光基板的出光亮暗不均，本实施例中，通过将反射层500划分为反射主体510和多个低反单元520，一所述低反单元520绕一所述支撑柱300设置，且所述反射层500在所述反射主体510位置的反射率大于所述反射层500在所述低反单元520位置的反射率，从而降低反射层500在支撑柱300附件的反射率，避免在支撑柱300位置出现光线聚集而导致发光基板的出光亮暗不均，保证了发光基板出光的均匀性。
需要说明的是，本实施例中，所述导光功能层400可以包括扩散板，所述驱动基板与导光功能层之间的间距可以根据实际需要调整，以避免所述发光基板在所述支撑柱300位置出现光线聚集而导致出光亮暗不均，保证所述发光基板出光的均匀性，具体的，所述驱动基板与导光功能层之间的距离为2mm～10mm，使得所述发光基板在所述支撑柱300位置出射的光线与在其它位置出射光线的亮度差最小，使得所述发光基板出光的均匀性最高。
在一实施例中，请参阅图1和图4，所述低反单元520包括位于所述反射层500的开口521，所述开口521的深度等于所述反射层500的厚度。
可以理解的是，所述低反单元520包括位于所述反射层500的开口521，在所述开口521的深度等于所述反射层500的厚度的条件下，所述驱动基板100在所述开口521的位置裸露，显然，所述反射主体510的反射率大于所述驱动基板100的反射率，从而使所述反射层500在所述反射主体510位置的反射率大于所述反射层500在所述低反单元520位置的反射率，避免在支撑柱300位置出现光线聚集而导致发光基板的出光亮暗不均的问题。
在一实施例中，请参阅图2、图3、图5和图6，所述低反单元520包括位于所述反射层500的开口521和位于所述开口521内的低反部522，所述开口521的深度小于或等于所述反射层500的厚度，所述反射主体510的反射率大于所述低反部522的反射率。
可以理解的是，所述低反单元520包括位于所述反射层500的开口521和位于所述开口521内的低反部522，且所述反射主体510的反射率大于所述低反部522的反射率，通过在所述开口521内填充反射率低于所述反射主体510的所述低反部522，从而使所述反射层500在所述反射主体510位置的反射率大于所述反射层500在所述低反单元520位置的反射率，避免在支撑柱300位置出现光线聚集而导致发光基板的出光亮暗不均的问题；本实施例中，所述开口521的深度既可以小于所述反射层500的厚度，又可以等于所述反射层500的厚度，通过所述低反部522可以将填充所述开口521，并且，所述低反部522远离所述驱动基板100一侧表面可以与所述反射主体510远离所述驱动基板100一侧表面共面，从而保证所述反射层500的平整性。
承上，本实施例中，所述低反部522的材料为油墨，显然，本实施例中选择的油墨的反射率低于所述反射主体510的反射率，并且在具体制作时，可以在所述开口521的位置涂布油墨以形成所述低反部522，在保证所述反射层500平整性的基础上，也降低了所述低反部522的制作成本，具体的，所述低反部522的材料可以根据具体需要选择不同颜色的油墨，所述低反部522的材料可以灰色油墨、褐色油墨、黑色油墨等。
在另一实施例中，发光基板与图3所示的发光基板的结构大体相同，所不同的在于，所述开口521的深度为零，也就是说，低反单元520直接覆盖在反射层500上，在低反单元520覆盖所述反射层500的位置处不再设有开口521；低反单元520可以为涂层，涂层的材料可为反射率低于反射主体510的反射率的油墨。
在一实施例中，请参阅图6，所述开口521呈环型绕所述支撑柱300设置。
可以理解的是，所述开口521可以呈环型绕所述支撑柱300设置，从而可以从各个角度降低所述反射层500在所述支撑柱300周围的反射率，使得所述支撑柱300周围整体亮度降低得更为均匀，也可以避免在所述支撑柱300周围出现亮度降低不一致的问题，本实施例中，呈环型的所述开口521的形状可以与所述支撑柱300的形状相匹配，在任意位置所述。
在一实施例中，请参阅图4和图5，所述开口521包括绕所述支撑柱300设置的多个子开口5211。
可以理解的是，所述开口521包括绕所述支撑柱300设置的多个子开口5211，多个所述子开口5211均匀排布在所述支撑柱300的周围，任意相邻两所述子开口5211的间距均相等，使得所述支撑柱300周围整体亮度降低得更为均匀，本实施例中，通过将所述开口521设置成包括绕所述支撑柱300设置的多个子开口5211，在所述开口521的深度等于所述反射层500深度时，避免所述开口521呈环型将所述反射层500分割呈多个单独的部分，很好的保证了所述反射层500的整体性。
承上，本实施例中，一所述支撑柱300与对应的多个所述子开口5211中，所述子开口5211的面积在远离所述支撑柱300的方向上逐渐减小。
可以理解的是，将所述开口521划分为绕所述支撑柱300设置的多个所述子开口5211，便于各所述子开口5211根据实际的光线亮度需要调整所述子开口5211的形状，本实施例中，一所述支撑柱300与对应的多个所述子开口5211中，所述子开口5211的开口宽度在远离所述支撑柱300的方向上逐渐减小，显然，在远离所述支撑柱300的方向上，汇聚在所述支撑柱300周围的光线逐渐减少，将所述子开口5211的开口宽度在远离所述支撑柱300的方向上逐渐减小，可以使所述发光基板在降低位于所述支撑柱300位置的出光亮度的基础上，保证所述发光基板整体出光的均匀性。
在一实施例中，请参阅图1至图6，所述反射层500包括多个通孔530，一所述支撑柱300远离所述导光功能层400的一端穿过一所述通孔530与所述驱动基板100连接；
所述低反单元520与所述通孔530间隔设置，且所述低反单元520与所述通孔530的距离大于或等于1.5mm。
可以理解的是，所述反射层500包括多个通孔530，一所述支撑柱300远离所述导光功能层400的一端穿过一所述通孔530与所述驱动基板100连接，一所述支撑柱300与对应的一所述通孔530中，所述通孔530的直径大于所述支撑柱300的直径，所述低反单元520与所述通孔530间隔设置，也即是所述低反单元520的所述开口521与所述通孔530间隔设置，显然，将所述开口521与所述通孔530间隔设置，且所述低反单元520与所述通孔530的距离大于或等于1.5mm，避免所述开口521和所述通孔530距离较近，增加在所述反射层500上制作所述开口521和所述通孔530的工艺难度。
在一实施例中，请参阅图1至图6，一所述支撑柱300与对应的一所述低反单元520中，所述低反单元520与所述支撑柱300间距小于所述低反单元520与任一所述发光单元的间距。
可以理解的是，一所述支撑柱300与对应的一所述低反单元520中，所述低反单元520与所述支撑柱300间距小于所述低反单元520与任一所述发光单元的间距，通过将所述低反单元520与所述支撑柱300间距设置成小于所述低反单元520与任一所述发光单元的间距，可以降低所述低反单元520对所述发光基板在各所述发光器件200位置的出光影响，使所述发光基板避免在支撑柱300位置出现光线聚集而导致发光基板的出光亮暗不均的同时，又最大化减小对所述发光基板在各所述发光器件200位置出光亮度的影响。
本申请还提供一种显示装置，包括如前实施例任一项所述的发光基板、以及设置于所述发光基板出光侧的显示面板，具体发光基板的结构可参见前述实施例，在此不再赘述，需要说明的是，所述发光基板可以进行单独用于显示，也可以作为显示装置的背光模组，本实施例中，所述显示面板为液晶显示面板，所述发光基板作为背光模组设置于所述显示面板的入光侧。
本申请提供一种发光基板通过将反射层500划分为反射主体510和多个低反单元520，一所述低反单元520绕一所述支撑柱300设置，且所述反射层500在所述反射主体510位置的反射率大于所述反射层500在所述低反单元520位置的反射率，从而降低反射层500在支撑柱300附件的反射率，避免在支撑柱300位置出现光线聚集而导致发光基板的出光亮暗不均，保证了发光基板出光的均匀性。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种发光基板，其中，包括：
    驱动基板，所述驱动基板上设有多个发光器件；
    多个支撑柱，间隔设置与所述驱动基板上，且位于各所述发光器件之间；
    导光功能层，设置于各所述支撑柱远离所述驱动基板的一侧；
    反射层，设置于所述驱动基板上，且位于各所述发光器件之间；
    其中，所述反射层包括反射主体和多个低反单元，一所述低反单元绕一所述支撑柱设置，且所述反射层在所述反射主体位置的反射率大于所述反射层在所述低反单元位置的反射率。
  2. 根据权利要求1所述的发光基板，其中，所述低反单元包括位于所述反射层的开口，所述开口的深度等于所述反射层的厚度。
  3. 根据权利要求1所述的发光基板，其中，所述低反单元包括位于所述反射层的开口和位于所述开口内的低反部，所述开口的深度小于或等于所述反射层的厚度，所述反射主体的反射率大于所述低反部的反射率。
  4. 根据权利要求3所述的发光基板，其中，所述开口的深度为零。
  5. 根据权利要求2所述的发光基板，其中，所述开口呈环型绕所述支撑柱设置。
  6. 根据权利要求2所述的发光基板，其中，所述开口包括绕所述支撑柱设置的多个子开口。
  7. 根据权利要求6所述的发光基板，其中，一所述支撑柱与对应的多个所述子开口中，所述子开口的开口宽度在远离所述支撑柱的方向上逐渐减小。
  8. 根据权利要求1所述的发光基板，其中，所述低反部的材料为油墨。
  9. 根据权利要求1所述的发光基板，其中，所述反射层包括多个通孔，一所述支撑柱远离所述导光功能层的一端穿过一所述通孔与所述驱动基板连接；
    所述低反单元与所述通孔间隔设置，且所述低反单元与所述通孔的距离大于或等于1.5mm。
  10. 根据权利要求1所述的发光基板，其中，一所述支撑柱与对应的一所述低反单元中，所述低反单元与所述支撑柱间距小于所述低反单元与任一所述发光单元的间距。
  11. 根据权利要求1所述的发光基板，其中，所述驱动基板与导光功能层之间的距离为2mm～10mm。
  12. 一种显示装置，其中，包括发光基板、以及设置于所述发光基板出光侧的显示面板；
    所述发光基板包括：
    驱动基板，所述驱动基板上设有多个发光器件；
    多个支撑柱，间隔设置与所述驱动基板上，且位于各所述发光器件之间；
    导光功能层，设置于各所述支撑柱远离所述驱动基板的一侧；
    反射层，设置于所述驱动基板上，且位于各所述发光器件之间；
    其中，所述反射层包括反射主体和多个低反单元，一所述低反单元绕一所述支撑柱设置，且所述反射层在所述反射主体位置的反射率大于所述反射层在所述低反单元位置的反射率。
  13. 根据权利要求12所述的显示装置，其中，所述低反单元包括位于所述反射层的开口，所述开口的深度等于所述反射层的厚度。
  14. 根据权利要求12所述的显示装置，其中，所述低反单元包括位于所述反射层的开口和位于所述开口内的低反部，所述开口的深度小于或等于所述反射层的厚度，所述反射主体的反射率大于所述低反部的反射率。
  15. 根据权利要求14所述的显示装置，其中，所述开口的深度为零。
  16. 根据权利要求13所述的显示装置，其中，所述开口呈环型绕所述支撑柱设置。
  17. 根据权利要求13所述的显示装置，其中，所述开口包括绕所述支撑柱设置的多个子开口。
  18. 根据权利要求17所述的显示装置，其中，一所述支撑柱与对应的多个所述子开口中，所述子开口的开口宽度在远离所述支撑柱的方向上逐渐减小。
  19. 根据权利要求12所述的显示装置，其中，所述反射层包括多个通孔，一所述支撑柱远离所述导光功能层的一端穿过一所述通孔与所述驱动基板连接；
    所述低反单元与所述通孔间隔设置，且所述低反单元与所述通孔的距离大于或等于1.5mm。
  20. 根据权利要求12所述的显示装置，其中，一所述支撑柱与对应的一所述低反单元中，所述低反单元与所述支撑柱间距小于所述低反单元与任一所述发光单元的间距。
PCT/CN2022/104968 2022-07-01 2022-07-11 发光基板及显示装置 WO2024000638A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/793,748 US20240222549A1 (en) 2022-07-01 2022-07-11 Light-emitting substrate and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210774756.6 2022-07-01
CN202210774756.6A CN115172348A (zh) 2022-07-01 2022-07-01 发光基板及显示装置

Publications (1)

Publication Number Publication Date
WO2024000638A1 true WO2024000638A1 (zh) 2024-01-04

Family

ID=83489923

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/104968 WO2024000638A1 (zh) 2022-07-01 2022-07-11 发光基板及显示装置

Country Status (3)

Country Link
US (1) US20240222549A1 (zh)
CN (1) CN115172348A (zh)
WO (1) WO2024000638A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117941086A (zh) * 2022-08-26 2024-04-26 京东方科技集团股份有限公司 基板、背光模组及显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN213399142U (zh) * 2020-11-30 2021-06-08 海信视像科技股份有限公司 一种显示装置
WO2021227098A1 (zh) * 2020-05-11 2021-11-18 Tcl华星光电技术有限公司 背光模组和显示面板
CN215117082U (zh) * 2021-04-27 2021-12-10 深圳创维－Rgb电子有限公司 一种支撑组件及背光模组
CN215680685U (zh) * 2021-04-30 2022-01-28 合肥京东方光电科技有限公司 发光基板及显示装置
CN114203879A (zh) * 2021-12-10 2022-03-18 Tcl华星光电技术有限公司 背光模组及背光模组的制备方法
CN114578618A (zh) * 2022-03-11 2022-06-03 Tcl华星光电技术有限公司 背光模组和显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021227098A1 (zh) * 2020-05-11 2021-11-18 Tcl华星光电技术有限公司 背光模组和显示面板
CN213399142U (zh) * 2020-11-30 2021-06-08 海信视像科技股份有限公司 一种显示装置
CN215117082U (zh) * 2021-04-27 2021-12-10 深圳创维－Rgb电子有限公司 一种支撑组件及背光模组
CN215680685U (zh) * 2021-04-30 2022-01-28 合肥京东方光电科技有限公司 发光基板及显示装置
CN114203879A (zh) * 2021-12-10 2022-03-18 Tcl华星光电技术有限公司 背光模组及背光模组的制备方法
CN114578618A (zh) * 2022-03-11 2022-06-03 Tcl华星光电技术有限公司 背光模组和显示装置

Also Published As

Publication number Publication date
CN115172348A (zh) 2022-10-11
US20240222549A1 (en) 2024-07-04

Similar Documents

Publication Publication Date Title
JP5660752B2 (ja) バックライトアセンブリ
US7510291B2 (en) Direct-lit LCD with reflective plate
US8355098B2 (en) Wavelength conversion member, light source assembly including the wavelength conversion member and liquid crystal display including the light source assembly
US8675149B2 (en) Backlight unit and display apparatus comprising the same
US20120218752A1 (en) Light source module and optical member
WO2020056912A1 (zh) 背光模组
KR20140106905A (ko) 액정표시장치
JP2013131499A (ja) ライトユニット及びそれを用いた照明システム
US9117379B2 (en) Backlight unit, display using the same and lighting system including the same
WO2020252964A1 (zh) 背光模组及显示装置
WO2024000638A1 (zh) 发光基板及显示装置
WO2020207102A1 (zh) 一种面光源器件及其制备方法、显示装置
KR101824037B1 (ko) 디스플레이 장치
KR20080038923A (ko) 도광판과 이를 구비하는 백라이트 어셈블리 및 액정 표시장치
WO2023206611A1 (zh) 驱动背板及其制作方法、发光基板及其制作方法
WO2023000419A1 (zh) 一种背光模组以及显示装置
KR20130070440A (ko) 광속 제어 부재 및 이를 포함하는 표시장치
US20150160514A1 (en) Backlight assembly and display device having the same
CN208737152U (zh) 背光模组
JP5455084B2 (ja) バックライトユニット及びそれを用いたディスプレイ装置
US20240162387A1 (en) Light-emitting module and display device
KR102582503B1 (ko) 액정 표시 장치
WO2020248422A1 (zh) 背光模组及显示装置
WO2024045287A1 (zh) 扩大外围反射面积的反射片、背光模组及显示装置
US11994771B1 (en) Drive backplate and display device

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 17793748

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22948734

Country of ref document: EP

Kind code of ref document: A1