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WO2021227098A1 - 背光模组和显示面板 - Google Patents

背光模组和显示面板 Download PDF

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Publication number
WO2021227098A1
WO2021227098A1 PCT/CN2020/091151 CN2020091151W WO2021227098A1 WO 2021227098 A1 WO2021227098 A1 WO 2021227098A1 CN 2020091151 W CN2020091151 W CN 2020091151W WO 2021227098 A1 WO2021227098 A1 WO 2021227098A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting device
layer
backlight module
diode
Prior art date
Application number
PCT/CN2020/091151
Other languages
English (en)
French (fr)
Inventor
付琳琳
李德华
张鑫
Original Assignee
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tcl华星光电技术有限公司 filed Critical Tcl华星光电技术有限公司
Priority to US16/957,119 priority Critical patent/US11221518B2/en
Publication of WO2021227098A1 publication Critical patent/WO2021227098A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details

Definitions

  • This application relates to the field of display technology, and in particular to a backlight module and a display panel.
  • Mini-Light Emitting Diodes (Mini-Light Emitting Diode (MiniLED) backlight technology is a new type of backlight technology that can provide local light control in multiple partitions, greatly improving the dynamic contrast of the LCD panel, thereby enhancing the consumer experience.
  • one of the MINI LED backlight implementation solutions is the AM-Mini-LED backlight module, which realizes lighting by voltage driving. Because there is a certain resistance in the power line of the light board, and the driving current of all pixels is provided by the power supply VDD, the power supply voltage in the area close to the power supply VDD power supply position in the backplane is higher than the power supply voltage in the area far away from the power supply position. This phenomenon is called pressure drop (IR Drop). Since the voltage of the power supply VDD is related to the current, IR Drop will also cause current differences in different areas, which in turn will cause uneven brightness of the backlight module (mura).
  • the embodiments of the present application provide a backlight module and a display panel, which can solve the problem of uneven brightness of the backlight module.
  • an embodiment of the present application provides a backlight module, including:
  • a reflective layer, the reflective layer is provided on the substrate, and a via hole exposing the pad is provided on the reflective layer;
  • a light-emitting device layer is disposed on the reflective layer, the light-emitting device layer includes a plurality of light-emitting devices, and the light-emitting devices are electrically connected to the pads through the via holes.
  • the area is positively correlated with the brightness of the light-emitting device;
  • An encapsulation layer is disposed on the light-emitting device layer.
  • the substrate includes a power input side, and the area of the via hole close to the power input side is larger than the area of the via hole far away from the power input side.
  • the light-emitting device is a blue diode.
  • the backlight module further includes:
  • the optical film layer is arranged on the encapsulation layer.
  • the optical film layer includes a quantum dot film, a prism film, a diffusion film, and a brightness enhancement film that are sequentially stacked and arranged on the encapsulation layer.
  • the encapsulation layer is made of a transparent material.
  • the material of the reflective layer is white ink.
  • the light-emitting device includes a red light diode, a green light diode, and a blue light diode, and the red light diode, the green light diode, and the blue light diode are horizontally or vertically
  • a light emitting unit is formed side by side.
  • a plurality of the light-emitting units are arranged in an array.
  • a circuit board is provided on the substrate, and the circuit board is used to drive the light-emitting device to emit light.
  • an embodiment of the present application provides a display panel, including:
  • a reflective layer, the reflective layer is provided on the substrate, and a via hole exposing the pad is provided on the reflective layer;
  • a light-emitting device layer is disposed on the reflective layer, the light-emitting device layer includes a plurality of light-emitting devices, and the light-emitting devices are electrically connected to the pads through the via holes.
  • the area is positively correlated with the brightness of the light-emitting device;
  • An encapsulation layer is disposed on the light-emitting device layer.
  • the substrate includes a power input side, and the area of the via hole close to the power input side is larger than the area of the via hole far away from the power input side.
  • the light-emitting device is a blue diode.
  • the backlight module further includes:
  • the optical film layer is arranged on the encapsulation layer.
  • the optical film layer includes a quantum dot film, a prism film, a diffusion film, and a brightness enhancement film that are sequentially stacked on the encapsulation layer.
  • the encapsulation layer is made of a transparent material.
  • the material of the reflective layer is white ink.
  • the light-emitting device includes a red light diode, a green light diode, and a blue light diode. It constitutes a light-emitting unit.
  • a plurality of the light-emitting units are arranged in an array.
  • a circuit board is provided on the substrate, and the circuit board is used to drive the light emitting device to emit light.
  • the backlight module provided by the embodiment of the present application includes a substrate, a reflective layer, a light-emitting device layer, and an encapsulation layer; wherein a plurality of pads arranged in an array are provided on the substrate; the reflective layer is provided on the substrate, The reflective layer is provided with a via hole exposing the pad; the light-emitting device layer is provided on the reflective layer, the light-emitting device layer includes a plurality of light-emitting devices, and the light-emitting devices are connected to each other through the via holes.
  • the pad is electrically connected, and the area of the via hole is positively correlated with the brightness of the light-emitting device; the packaging layer is disposed on the light-emitting device layer.
  • FIG. 1 is a schematic structural diagram of a backlight module provided by an embodiment of the present application.
  • Fig. 2 is a top view of a substrate provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of the structure of a display panel provided by an embodiment of the present application.
  • the embodiments of the present application provide a backlight module and a display panel, which will be described in detail below.
  • FIG. 1 is a schematic structural diagram of a backlight module provided by an embodiment of the present application.
  • the backlight module 100 may include a substrate 10, a reflective layer 20, a light emitting device layer 30 and an encapsulation layer 40.
  • the substrate 10 may be provided with a plurality of pads 11 arranged in an array.
  • the reflective layer 20 is disposed on the substrate 10, and the reflective layer 20 may be provided with a via 21 exposing the pad 11.
  • the light emitting device layer 30 is disposed on the reflective layer 20, and the light emitting device layer 30 may include a plurality of light emitting devices 31, and the light emitting devices 31 may be electrically connected to the pad 11 through the via 21.
  • the area of the via hole 21 is positively correlated with the brightness of the light-emitting device 31.
  • the encapsulation layer 40 is disposed on the light emitting device layer 30.
  • the light-emitting device 31 in the embodiment of the present application is a mini-light emitting diode (Mini-Light Emitting Diode, Mini-LED).
  • a reflective layer 20 can be coated on the substrate 10 to increase the reflected light of the light-emitting device 31, thereby reducing the light-emitting device.
  • the brightness difference between the two sides of the layer 30 improves the backlight uniformity of the backlight module 100.
  • the substrate 10 is provided with a circuit board, such as a printed circuit board (Printed Circuit Board, PCB) etc.
  • the substrate 10 can be used to drive the light emitting device 31 to emit light.
  • the voltage on the power input side A close to the substrate 10 may be greater than the voltage on the power input side A far away. That is, the brightness of the light emitting device 31 close to the power input side A of the substrate 10 may be greater than the brightness of the light emitting device 31 far away from the power input side A. Therefore, although providing the reflective layer 20 on the substrate 10 can reduce the brightness difference between the two sides of the light-emitting device layer 30 to a certain extent, in fact, there are still differences in the brightness of the two sides of the light-emitting device layer 30.
  • a preset area including the pad 11 may not be coated.
  • the via 21 is formed.
  • the material of the reflective layer 20 is white ink.
  • the predetermined area where the reflective layer 20 is not coated is the area of the via hole 21. It should be noted that the area of the via 21 is the area of the via 21 parallel to the substrate 10.
  • the area of the via 21 close to the power input side A is larger than the area of the via 21 far away from the power input side A.
  • the area of the via hole 21 is positively correlated with the brightness of the light emitting device 31. That is, the size of the area of the via hole 21 depends on the brightness of the light emitting device 31.
  • the brightness of the first light-emitting device 31 is higher than that of the second light-emitting device 31 by N%
  • the area of the via hole 21 corresponding to the second light-emitting device 31 is larger than that of the first light-emitting device 31.
  • the area of the via 21 is smaller by N%.
  • the light-emitting device 31 emits light
  • the area of the via 21 corresponding to the light-emitting device 31 close to the power input side A is larger, the light reflected by the reflective layer 20 to the light-emitting device 31 can be reduced, thereby reducing the proximity to the power input.
  • the brightness of the light emitting device layer 30 on the side A is small, so the light reflected by the reflective layer 20 to the light emitting device 31 can be increased, thereby increasing the brightness of the light emitting device layer 30 far away from the power input side A.
  • the area of the via hole 21 is set to gradually decrease from close to the power input side A to far away from the power input side A, so that the brightness of the light-emitting device layer 30 close to the power input side A is reduced, and the area away from the power input side A is reduced.
  • the brightness of the light emitting device layer 30 on the side A is increased, so that the brightness of both sides of the light emitting device layer 30 is uniform, thereby increasing the backlight uniformity of the backlight module 100.
  • the light emitting device 31 may be a blue diode.
  • the light emitting device 31 may include a red light diode 31A, a green light diode 31B, and a blue light diode 31C.
  • a red light diode 31A, a green light diode 31B, and a blue light diode 31C can be arranged side by side in a horizontal or vertical direction to form a light-emitting unit 32.
  • the backlight module 100 when the backlight module 100 needs to emit monochromatic light, it can directly emit light by exciting one of the red light diode 31A, the green light diode 31B, and the blue light diode 31C of the light emitting device layer 30.
  • the red light diode 31A, the green light diode 31B, and the blue light diode 31C in the light emitting device layer 30 can be excited in different combinations and emit white light in the mixed light.
  • the light-emitting quantity of the light-emitting devices 31 in different light-emitting device layers 30 can also be controlled to achieve the effect of adjusting and switching the color saturation.
  • the light emitting device layer 30 may include a plurality of light emitting units 32, and the plurality of light emitting units 32 may be arranged in an array.
  • the light emitting device layer 30 in the embodiment of the present application can directly emit monochromatic light or multiple colors of light. Therefore, the encapsulation layer 40 in the embodiment of the present application does not need to add phosphors, and can be directly composed of transparent materials. Therefore, the stray light in the backlight emitted by the backlight module 100 is reduced, and the backlight color saturation of the backlight module 100 is improved.
  • the backlight module 100 may further include an optical film layer 50, and the optical film layer 50 may be disposed on the encapsulation layer 40.
  • the optical film layer 50 can brighten and diffuse the light emitted by the light emitting device layer 30. It is understandable that the optical film layer 50 may include a series of optical films such as a quantum dot film, a prism film, a diffusion film, a brightness enhancement film, etc., which are sequentially stacked on the encapsulation layer 40.
  • the backlight module 100 provided by the embodiment of the present application is provided with a reflective layer 20 on the substrate 10, and the area of the reflective layer 20 gradually decreases from close to the power-in side A to away from the power-in side A through holes 21, As a result, the brightness of the light emitting device layer 30 close to the power input side A is reduced, and the brightness of the light emitting device layer 30 far away from the power input side A is increased, so that the brightness on both sides of the light emitting device layer 30 is uniform, thereby increasing the backlight module 100 The uniformity of the backlight.
  • FIG. 3 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • the display panel 1000 may include a backlight module 100 and a display screen 200.
  • the backlight module 100 may include a substrate 10, a reflective layer 20, a light emitting device layer 30, and an encapsulation layer 40.
  • the substrate 10 may be provided with a plurality of pads 11 arranged in an array.
  • the reflective layer 20 is disposed on the substrate 10, and the reflective layer 20 may be provided with a via 21 exposing the pad 11.
  • the light-emitting device layer 30 is disposed on the reflective layer 20.
  • the light-emitting device layer 30 may include a plurality of light-emitting devices 31, and the light-emitting devices 31 may be electrically connected to the pad 11 through a via 21, wherein the area of the via 21 is equal to The brightness of the light emitting device 31 is positively correlated.
  • the encapsulation layer 40 is disposed on the light emitting device layer 30.
  • the display panel 200 provided by the embodiment of the present application is provided with a reflective layer 20 on the substrate 10, and the through holes 21 that gradually decrease from close to the power input side A to far away from the power input side A on the reflective layer 20, so that The brightness of the light emitting device layer 30 close to the power input side A decreases, and the brightness of the light emitting device layer 30 far away from the power input side A increases, so that the brightness on both sides of the light emitting device layer 30 is uniform, thereby increasing the display effect of the display panel 200 .
  • a backlight module and a display panel provided by the embodiments of the application are described in detail above. Specific examples are used in this article to illustrate the principles and implementations of the application. The descriptions of the above embodiments are only used to help understand the The applied technical solutions and their core ideas; those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or equivalently replace some of the technical features; and these modifications or replacements, The essence of the corresponding technical solutions does not deviate from the scope of the technical solutions of the embodiments of the present application.

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  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

本申请实施例提供了一种背光模组和显示面板，其中，该背光模组通过在基板上设置反射层，并在反射层上设置由靠近入电侧至远离入电侧逐渐减小的过孔，从而使得靠近入电侧的发光器件层的亮度减少，远离入电侧的发光器件层的亮度增加，从而使得发光器件层两侧的亮度均匀，从而增加了该背光模组的背光均匀性。

Description

背光模组和显示面板 技术领域
本申请涉及显示技术领域，尤其涉及一种背光模组和显示面板。
 背景技术
随着液晶显示面板技术发展，消费者对画质要求越来越高，小型发光二极管（Mini-Light Emitting Diode，MiniLED）背光技术是一种新型的背光技术，可提供多个分区的局部控光，极大提高液晶显示面板的动态对比度，从而提升消费者体验。
目前，MINI LED背光实现方案中，有一种为AM-Mini-LED背光模组中，其通过电压驱动的方式实现点灯。由于灯板电源线存在一定电阻，且所有像素的驱动电流都由电源VDD提供，因此在背板中靠近电源VDD供电位置区域的电源电压相比较离供电位置较远区域的电源电压要高，这种现象被称为压降（IR Drop）。由于电源VDD的电压与电流相关，IR Drop也会造成不同区域的电流差异，进而造成背光模组亮度不均(mura)。
 技术问题
由于电源VDD的电压与电流相关，IR Drop也会造成不同区域的电流差异，进而造成背光模组亮度不均。
 技术解决方案
本申请实施例提供了一种背光模组和显示面板，可以解决背光模组亮度不均的问题。
第一方面，本申请实施例提供了一种背光模组，包括：
基板，所述基板上设置有阵列排布的多个焊盘；
反射层，所述反射层设置于所述基板上，所述反射层上设置有暴露所述焊盘的过孔；
发光器件层，所述发光器件层设置于所述反射层上，所述发光器件层包括多个发光器件，所述发光器件通过所述过孔与所述焊盘电连接，所述过孔的面积与所述发光器件的亮度正相关；
封装层，所述封装层设置于所述发光器件层上。
在本申请实施例提供的背光模组中，所述基板包括入电侧，靠近所述入电侧的所述过孔的面积大于远离所述入电侧的所述过孔的面积。
在本申请实施例提供的背光模组中，所述发光器件为蓝光二极管。
在本申请实施例提供的背光模组中，所述背光模组还包括：
光学膜层，所述光学膜层设置于所述封装层上。
在本申请实施例提供的背光模组中，所述光学膜层包括依次层叠设置于所述封装层上的量子点膜、棱镜膜、扩散膜和增亮膜。
在本申请实施例提供的背光模组中，所述封装层由透明材料构成。
在本申请实施例提供的背光模组中，所述反射层的材料为白色油墨。
在本申请实施例提供的背光模组中，所述发光器件包括红光二极管、绿光二极管和蓝光二极管，一所述红光二极管、一所述绿光二极管和一所述蓝光二极管横向或纵向并排构成一发光单元。
在本申请实施例提供的背光模组中，多个所述发光单元呈阵列排布。
在本申请实施例提供的背光模组中，所述基板上设置有电路板，所述电路板用于驱动所述发光器件发光。
第二方面，本申请实施例提供了一种显示面板，包括：
基板，所述基板上设置有阵列排布的多个焊盘；
反射层，所述反射层设置于所述基板上，所述反射层上设置有暴露所述焊盘的过孔；
发光器件层，所述发光器件层设置于所述反射层上，所述发光器件层包括多个发光器件，所述发光器件通过所述过孔与所述焊盘电连接，所述过孔的面积与所述发光器件的亮度正相关；
封装层，所述封装层设置于所述发光器件层上。
在本申请实施例提供的显示面板中，所述基板包括入电侧，靠近所述入电侧的所述过孔的面积大于远离所述入电侧的所述过孔的面积。
在本申请实施例提供的显示面板中，所述发光器件为蓝光二极管。
在本申请实施例提供的显示面板中，所述背光模组还包括：
光学膜层，所述光学膜层设置于所述封装层上。
在本申请实施例提供的显示面板中，所述光学膜层包括依次层叠设置于所述封装层上的量子点膜、棱镜膜、扩散膜和增亮膜。
在本申请实施例提供的显示面板中，所述封装层由透明材料构成。
在本申请实施例提供的显示面板中，所述反射层的材料为白色油墨。
在本申请实施例提供的显示面板中，所述发光器件包括红光二极管、绿光二极管和蓝光二极管，一所述红光二极管、一所述绿光二极管和一所述蓝光二极管横向或纵向并排构成一发光单元。
在本申请实施例提供的显示面板中，多个所述发光单元呈阵列排布。
在本申请实施例提供的显示面板中，所述基板上设置有电路板，所述电路板用于驱动所述发光器件发光。
 有益效果
本申请实施例提供的背光模组包括基板、反射层、发光器件层和封装层；其中，所述基板上设置有阵列排布的多个焊盘；所述反射层设置于所述基板上，所述反射层上设置有暴露所述焊盘的过孔；所述发光器件层设置于所述反射层上，所述发光器件层包括多个发光器件，所述发光器件通过所述过孔与所述焊盘电连接，所述过孔的面积与所述发光器件的亮度正相关；所述封装层设置于所述发光器件层上。本方案可以解决背光模组亮度不均的问题。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的背光模组的结构示意图。
图2是本申请实施例提供的基板的俯视图。
图3是本申请实施例提供的显示面板的结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供了一种背光模组和显示面板，以下将分别进行详细说明。
请参阅图1，图1是本申请实施例提供的背光模组的结构示意图。该背光模组100可以包括基板10、反射层20、发光器件层30和封装层40。
其中，该基板10上可以设置有阵列排布的多个焊盘11。该反射层20设置于基板10上，该反射层20上可以设置有暴露焊盘11的过孔21。该发光器件层30设置于反射层20上，该发光器件层30可以包括多个发光器件31，该发光器件31可以通过过孔21与焊盘11电连接。其中，该过孔21的面积与发光器件31的亮度正相关。该封装层40设置于发光器件层30上。
需要说明的是，本申请实施例中的发光器件31为小型发光二极管（Mini-Light Emitting Diode，Mini-LED）。
需要说明的是，由于以玻璃为材料所形成的基板10本身对光没有反射作用，因此可以在该基板10上涂布一层反射层20，以增加发光器件31的反射光线，从而减少发光器件层30两侧的亮度差异，提高该背光模组100的背光均匀性。
可以理解的是，该基板10上设置有电路板，比如印制电路板 (Printed Circuit Board，PCB)等。该基板10可以用以驱动发光器件31发光。
需要说明的是，由于基板10的电流是通过单一方向输入的，随着走线距离的增加，电压的线损也会增加。因此，会导致靠近基板10的入电侧A的电压大于远离入电侧A的电压。即是，会导致靠近基板10的入电侧A的发光器件31的亮度大于远离该入电侧A的发光器件31的亮度。因此，在基板10上设置反射层20虽然可以在一定程度上减少发光器件层30两侧的亮度差异，但是实际上该发光器件层30的两侧的亮度还是存在着差异。
在一些实施例中，为了进一步提高该背光模组100的背光均匀性，可以在反射层20的涂布过程中，通过预留包括焊盘11在内的预设面积的位置不进行涂布，形成过孔21。其中，该反射层20的材料为白色油墨。
可以理解的是，没有涂布反射层20的预设面积即为过孔21的面积。需要说明的是，该过孔21的面积为过孔21平行于基板10的面积。
如图2所示，靠近入电侧A的过孔21的面积大于远离入电侧A的过孔21的面积。可以理解的是，该过孔21的面积与发光器件31的亮度正相关。即是，该过孔21的面积大小取决于发光器件31的亮度。在一些实施例中，第一发光器件31的亮度比第二发光器件31的亮度高N%，则第二发光器件31所对应位置的过孔21的面积比第一发光器件31所对应位置的过孔21的面积小N%。
此时，当发光器件31发光时，由于靠近入电侧A的发光器件31所对应的过孔21的面积较大，因此可以减少反射层20对发光器件31的反射光线，从而降低靠近入电侧A的发光器件层30的亮度。而远离入电侧A的发光器件31所对应的过孔21的面积较小，因此可以增加反射层20对发光器件31的反射光线，从而增加远离入电侧A的发光器件层30的亮度。
由上，本实施例通过将过孔21的面积设置为由靠近入电侧A至远离入电侧A逐渐减小，从而使得靠近入电侧A的发光器件层30的亮度减少，远离入电侧A的发光器件层30的亮度增加，从而使得发光器件层30两侧的亮度均匀，从而增加了该背光模组100的背光均匀性。
其中，该发光器件31可以为蓝光二极管。在一些实施例中，该发光器件31可以包括红光二极管31A、绿光二极管31B和蓝光二极管31C。一红光二极管31A、一绿光二极管31B和一蓝光二极管31C可以横向或纵向并排构成一发光单元32。
因此，在本申请实施例中，当背光模组100需要发出单色光时，可以直接通过激发发光器件层30的红光二极管31A、绿光二极管31B和蓝光二极管31C中的一种进行发光。当背光模组100需要发出多种色彩时，发光器件层30中的红光二极管31A、绿光二极管31B和蓝光二极管31C可以以不同形式的组合激发，并在混光中发出白光。另外，还可以通过控制不同发光器件层30中的发光器件31的发光数量，以达到调节切换色彩饱和度的效果。
可以理解的是，该发光器件层30可以包括多个发光单元32，多个该发光单元32可以呈阵列排布。此时，由于本申请实施例中的发光器件层30可以直接发出单色光或多种色彩光。因此，本申请实施例中的封装层40中无需添加荧光粉，可以直接由透明材料构成。从而减少该背光模组100所发出背光中的杂光，提高该背光模组100的背光色彩饱和度。
在一些实施例中，该背光模组100还可以包括光学膜层50，该光学膜层50可以设置于封装层40上。该光学膜层50可以对发光器件层30发出的光线进行增亮和扩散。可以理解的是，该光学膜层50可以包括依次层叠设置于封装层40上量子点膜、棱镜膜、扩散膜、增亮膜等一系列光学膜片。
由上，本申请实施例提供的背光模组100通过在基板10上设置反射层20，并在反射层20上面积由靠近入电侧A至远离入电侧A逐渐减小的过孔21，从而使得靠近入电侧A的发光器件层30的亮度减少，远离入电侧A的发光器件层30的亮度增加，从而使得发光器件层30两侧的亮度均匀，从而增加了该背光模组100的背光均匀性。
请参阅图3，图3是本申请实施例提供的显示面板的结构示意图。该显示面板1000可以包括背光模组100和显示屏200。
其中，该背光模组100可以包括基板10、反射层20、发光器件层30和封装层40。
其中，该基板10上可以设置有阵列排布的多个焊盘11。该反射层20设置于基板10上，该反射层20上可以设置有暴露焊盘11的过孔21。该发光器件层30设置于反射层20上，该发光器件层30可以包括多个发光器件31，该发光器件31可以通过过孔21与焊盘11电连接，其中，该过孔21的面积与发光器件31的亮度正相关。该封装层40设置于发光器件层30上。
由上，本申请实施例提供的显示面板200通过在基板10上设置反射层20，并在反射层20上由靠近入电侧A至远离入电侧A逐渐减小的过孔21，从而使得靠近入电侧A的发光器件层30的亮度减少，远离入电侧A的发光器件层30的亮度增加，从而使得发光器件层30两侧的亮度均匀，从而增加了该显示面板200的显示效果。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种背光模组和显示面板进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种背光模组，其包括：
    基板，所述基板上设置有阵列排布的多个焊盘；
    反射层，所述反射层设置于所述基板上，所述反射层上设置有暴露所述焊盘的过孔；
    发光器件层，所述发光器件层设置于所述反射层上，所述发光器件层包括多个发光器件，所述发光器件通过所述过孔与所述焊盘电连接，所述过孔的面积与所述发光器件的亮度正相关；
    封装层，所述封装层设置于所述发光器件层上。
  2. 如权利要求1所述的背光模组，其中，所述基板包括入电侧，靠近所述入电侧的所述过孔的面积大于远离所述入电侧的所述过孔的面积。
  3. 如权利要求1所述的背光模组，其中，所述发光器件为蓝光二极管。
  4. 如权利要求1所述背光模组，其中，所述背光模组还包括：
    光学膜层，所述光学膜层设置于所述封装层上。
  5. 如权利要求4所述的背光模组，其中，所述光学膜层包括依次层叠设置于所述封装层上的量子点膜、棱镜膜、扩散膜和增亮膜。
  6. 如权利要求1所述的背光模组，其中，所述封装层由透明材料构成。
  7. 如权利要求1所述的背光模组，其中，所述反射层的材料为白色油墨。
  8. 如权利要求1所述的背光模组，其中，所述发光器件包括红光二极管、绿光二极管和蓝光二极管，一所述红光二极管、一所述绿光二极管和一所述蓝光二极管横向或纵向并排构成一发光单元。
  9. 如权利要求8所述的背光模组，其中，多个所述发光单元呈阵列排布。
  10. 如权利要求1所述的背光模组，其中，所述基板上设置有电路板，所述电路板用于驱动所述发光器件发光。
  11. 一种显示面板，其包括：
    基板，所述基板上设置有阵列排布的多个焊盘；
    反射层，所述反射层设置于所述基板上，所述反射层上设置有暴露所述焊盘的过孔；
    发光器件层，所述发光器件层设置于所述反射层上，所述发光器件层包括多个发光器件，所述发光器件通过所述过孔与所述焊盘电连接，所述过孔的面积与所述发光器件的亮度正相关；
    封装层，所述封装层设置于所述发光器件层上。
  12. 如权利要求11所述的显示面板，其中，所述基板包括入电侧，靠近所述入电侧的所述过孔的面积大于远离所述入电侧的所述过孔的面积。
  13. 如权利要求11所述的显示面板，其中，所述发光器件为蓝光二极管。
  14. 如权利要求1所述的显示面板，其中，所述背光模组还包括：
    光学膜层，所述光学膜层设置于所述封装层上。
  15. 如权利要求14所述的显示面板，其中，所述光学膜层包括依次层叠设置于所述封装层上的量子点膜、棱镜膜、扩散膜和增亮膜。
  16. 如权利要求11所述的显示面板，其中，所述封装层由透明材料构成。
  17. 如权利要求11所述的背光模组，其中，所述反射层的材料为白色油墨。
  18. 如权利要求11所述的显示面板，其中，所述发光器件包括红光二极管、绿光二极管和蓝光二极管，一所述红光二极管、一所述绿光二极管和一所述蓝光二极管横向或纵向并排构成一发光单元。
  19. 如权利要求18所述的显示面板，其中，多个所述发光单元呈阵列排布。
  20. 如权利要求11所述的显示面板，其中，所述基板上设置有电路板，所述电路板用于驱动所述发光器件发光。
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