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WO2023142014A1 - 触控显示面板、触控显示装置、触控显示母板 - Google Patents

触控显示面板、触控显示装置、触控显示母板 Download PDF

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Publication number
WO2023142014A1
WO2023142014A1 PCT/CN2022/074879 CN2022074879W WO2023142014A1 WO 2023142014 A1 WO2023142014 A1 WO 2023142014A1 CN 2022074879 W CN2022074879 W CN 2022074879W WO 2023142014 A1 WO2023142014 A1 WO 2023142014A1
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WO
WIPO (PCT)
Prior art keywords
layer
area
touch
insulating layer
inorganic insulating
Prior art date
Application number
PCT/CN2022/074879
Other languages
English (en)
French (fr)
Inventor
张元其
张顺
张毅
罗昶
王裕
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202280000108.3A priority Critical patent/CN116897613A/zh
Priority to PCT/CN2022/074879 priority patent/WO2023142014A1/zh
Priority to US18/005,789 priority patent/US20240272755A1/en
Publication of WO2023142014A1 publication Critical patent/WO2023142014A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a touch display panel, a touch display device, and a touch display motherboard.
  • the display panel prepared by Organic Light-Emitting Display (OLED) technology has become the mainstream development direction in the field of display technology due to its advantages of self-illumination, high brightness, good image quality, and low energy consumption.
  • OLED Organic Light-Emitting Display
  • FMLOC Flexible Multi Layer On Cell
  • FMLOC film peeling
  • a touch display panel provided by an embodiment of the present disclosure includes:
  • the base substrate including: a display area and a peripheral area surrounding the display area;
  • the display function layer is located on one side of the base substrate, including: at least one organic insulating layer, and an encapsulation layer located on the side of the organic insulating layer away from the base substrate; the orthographic projection of the encapsulation layer on the base substrate covers the display area and part surrounding area;
  • the touch function layer is located on the side of the package layer away from the base substrate, including: a touch conductive layer, an inorganic insulating layer in contact with the touch conductive layer, and a protective layer;
  • the touch function layer includes: a first touch conductive layer , and the second touch conductive layer located on the side of the first touch conductive layer away from the display function layer;
  • the inorganic insulating layer at least includes: a first inorganic insulating layer located between the first touch conductive layer and the second touch conductive layer layer;
  • the protective layer is located on the side of the second touch conductive layer away from the first inorganic insulating layer; in at least part of the peripheral area not covered by the orthographic projection of the packaging layer on the base substrate, the organic insulating layer and the touch conductive layer or the protective layer direct contact.
  • the perimeter region includes: at least one fan-out region; the fan-out region includes: a bend region;
  • the touch function layer includes at least one inorganic insulating layer removal region
  • the inorganic insulation layer removal area covers the bending area in the orthographic projection of the base substrate.
  • the organic insulating layer has at least one groove running through its thickness; the groove is located at least between the bending area and the display area;
  • the inorganic insulating layer removal area covers the groove in the orthographic projection of the base substrate.
  • the inorganic insulating layer removal area covers the area between the groove and the bending area in the orthographic projection of the base substrate.
  • the groove is also located on the side of the bending area away from the display area;
  • the orthographic projection of the inorganic insulating layer on the base substrate covers the groove.
  • the groove is also located on the side of the bending area away from the display area;
  • the orthographic projection of the inorganic insulating layer removal area on the base substrate covers the groove.
  • the touch conductive layer further includes:
  • a plurality of first touch signal lines extending from the display area to the side of the bending area close to the display area;
  • the display function layer also includes: a first conductive layer located between the base substrate and the packaging layer, and a second conductive layer located between the first conductive layer and the packaging layer;
  • the first conductive layer or the second conductive layer includes:
  • a plurality of first connecting leads extend from between the bending area and the display area through the bending area to the side of the bending area away from the display area; between the bending area and the display area, one end of the first connecting lead is connected to the first touch signal line electrical connection;
  • the orthographic projection of the groove on the base substrate and the orthographic projection of the first touch signal line on the base substrate do not overlap each other.
  • the orthographic projection of the inorganic insulating layer removal region on the base substrate and the orthographic projection of the first touch signal line on the base substrate do not overlap each other.
  • the orthographic projection of the first connection lead on the base substrate penetrates through the inorganic insulating layer removal region.
  • the display function layer also includes:
  • planarization layer located between the second conductive layer and the encapsulation layer
  • a pixel definition layer located between the encapsulation layer and the planarization layer;
  • the pixel definition layer and/or the planarization layer has at least one groove extending through its thickness.
  • the distance between the edge of the inorganic insulating layer and the groove is greater than or equal to 5 microns and less than or equal to 40 microns.
  • the distance between the groove and the bending region is greater than or equal to 100 microns and less than or equal to 300 microns.
  • the perimeter area includes: at least one fan-out area; the fan-out area includes a bonding area;
  • the touch function layer includes at least one inorganic insulating layer removal region
  • the inorganic insulation layer removal area covers the bonding area in the orthographic projection of the base substrate.
  • the second touch conductive layer in the binding area, includes: a plurality of first binding electrodes;
  • the organic insulating layer includes a planarization layer; the first binding electrode is in contact with the planarization layer.
  • the display function layer further includes: a first conductive layer located between the planarization layer and the base substrate, a first insulating layer located between the first conductive layer and the planarization layer, and a first insulating layer located between the first insulating layer layer and a second conductive layer between the planarization layer;
  • the first conductive layer includes second binding electrodes corresponding to the first binding electrodes one-to-one, and the second conductive layer includes third binding electrodes corresponding to the second binding electrodes one-to-one; the third binding electrode
  • the fixed electrode is connected to the second binding electrode through the via hole penetrating the first insulating layer; the first binding electrode is connected to the third binding electrode through the via hole penetrating the planarization layer.
  • the touch function layer includes at least one inorganic insulating layer removal region and at least one first protective layer removal region;
  • the orthographic projection of the first protection layer removal area on the base substrate falls within the orthographic projection of the inorganic insulating layer removal area on the base substrate.
  • the inorganic insulating layer only includes the first inorganic insulating layer
  • the first touch conductive layer is in contact with the encapsulation layer.
  • the inorganic insulating layer further includes a second inorganic insulating layer located between the first touch conductive layer and the encapsulation layer.
  • An embodiment of the present disclosure provides a touch display device, and the touch display device includes the touch display panel provided by the embodiment of the present disclosure.
  • the touch display motherboard includes a plurality of touch display panel areas and a removal area surrounding the touch display panel areas;
  • the touch display panel area includes: the touch display panel provided by the embodiment of the present disclosure;
  • the packaging layer of the touch display panel does not overlap with the orthographic projection of the base substrate and the removal area; the organic insulating layer of the touch display panel and the touch function layer of the touch display panel extend to the removal area;
  • the film layer on the side of the inorganic insulating layer away from the base substrate is in direct contact with the organic insulating layer.
  • the removal area includes: a first cutting area located between adjacent touch display panel areas, a plurality of second cutting areas surrounding the touch display panel area and adjacent to the touch display panel area, located at a sub-removal zone between the first cutting zone and the second cutting zone;
  • the touch conductive layer includes: an alignment mark located in the sub-removal area, and the alignment mark is in contact with the organic insulating layer.
  • the organic insulating layer includes: a pixel definition layer
  • the second touch conductive layer includes a first alignment mark located in the sub-removal area; the first alignment mark is in contact with the pixel definition layer.
  • the orthographic projection of the inorganic insulating layer on the base substrate does not at least partially overlap with the removal region.
  • FIG. 1 is a schematic structural diagram of a touch display panel provided by an embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view of a display area of a touch display panel provided by an embodiment of the present disclosure
  • Fig. 3 is a sectional view along AA' in Fig. 1 provided by an embodiment of the present disclosure
  • FIG. 4 is a schematic structural diagram of another touch display panel provided by an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of another touch display panel provided by an embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of the binding of the driver chip and the touch display panel in the related art provided by the embodiment of the present disclosure
  • FIG. 7 is a schematic structural diagram of a fan-out area of a touch display panel provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram of another fan-out region of a touch display panel provided by an embodiment of the present disclosure.
  • Fig. 9 is a sectional view along DD' in Fig. 7 provided by an embodiment of the present disclosure.
  • FIG. 10 is a schematic structural diagram of another fan-out area of a touch display panel provided by an embodiment of the present disclosure.
  • FIG. 11 is a schematic structural diagram of another fan-out area of a touch display panel provided by an embodiment of the present disclosure.
  • FIG. 12 is a schematic structural diagram of a touch display motherboard provided by an embodiment of the present disclosure.
  • FIG. 13 is a schematic diagram of area B in FIG. 12 provided by an embodiment of the present disclosure.
  • Figure 14 is a sectional view along CC' in Figure 13 provided by an embodiment of the present disclosure.
  • FIG. 15 is a schematic diagram of a second alignment mark of a touch display motherboard provided by an embodiment of the present disclosure.
  • FIG. 16 is a schematic structural diagram of an alignment mark provided by an embodiment of the present disclosure.
  • the touch function layer includes a buffer layer, a first touch conductive layer, an inorganic film layer, and a second touch conductive layer.
  • the buffer layer is also an inorganic film layer.
  • the structure of the display function layer in the display area is relatively flat, and the inorganic film layer of the touch function layer is not easy to peel off; while in the peripheral area, due to the removal or retention of part of the film layer, it is easy to cause the structure of the display function layer There is a step difference, that is, in the peripheral area, which shows that the flatness of the functional layer structure is poor.
  • the contact between the inorganic film layer of the touch function layer and the organic film layer of the display function layer is likely to cause the film layer to warp and wrinkle, and the film layer is warped.
  • water vapor will invade from the cracks to the interface between the touch function layer and the display function layer, resulting in a large area of peeling between the two film layers.
  • the inorganic film layer is relatively brittle, it is prone to rupture when it receives an external force, forming a water and oxygen intrusion channel.
  • the inorganic film layer of the touch function layer is prone to cracks at the cutting and bending positions, forming water and oxygen intrusion channels, and affecting product yield.
  • an embodiment of the present disclosure provides a touch display panel.
  • the touch display panel includes:
  • the base substrate 1 includes: a display area 2 and a peripheral area 3 surrounding the display area 2;
  • the display function layer 6 is located on one side of the base substrate 1, including: at least one organic insulating layer 7, and an encapsulation layer 8 located on the side of the organic insulating layer 7 away from the base substrate 1; the encapsulation layer 8 is on the base substrate 1
  • the orthographic projection of covers the display area 2 and part of the surrounding area 3;
  • the touch function layer 9 is located on the side of the package layer 8 away from the base substrate 1, and includes: a touch conductive layer 10, an inorganic insulating layer 11 and a protective layer 16 in contact with the touch conductive layer 10;
  • the touch conductive layer 10 includes: The first touch conductive layer 12, and the second touch conductive layer 13 located on the side of the first touch conductive layer 12 away from the display function layer 6;
  • the inorganic insulating layer 11 at least includes: the first touch conductive layer 12 and the second touch conductive layer 13 The first inorganic insulating layer 14 between the two touch conductive layers 13;
  • the protection layer 16 is located on the side of the second touch conductive layer 13 away from the first inorganic insulating layer 14; Covering at least part of the peripheral region 3 , the organic insulating layer 7 is in direct contact with the touch conductive layer 10 or the protection layer 16 .
  • the film layer on the side of the inorganic insulating layer away from the substrate is in direct contact with the organic insulating layer, that is, at least part of the inorganic insulating layer in the peripheral area is removed.
  • the insulating layer is used to keep at least part of the inorganic insulating layer of the touch function layer in the peripheral area from contacting the organic insulating layer of the display function layer.
  • FIG. 2 is a cross-sectional view of the touch display substrate in the display area
  • FIG. 3 is a cross-sectional view of AA' in FIG. 1 .
  • the first touch conductive layer in the area where the organic insulating layer needs to be in contact with the touch conductive layer, the first touch conductive layer is in direct contact with the organic insulating layer or the second touch conductive layer It is in direct contact with the organic insulating layer, and in the area where the organic insulating layer needs to be in contact with the protective layer, the protective layer is in direct contact with the organic insulating layer. That is, when the organic insulating layer needs to be in contact with the touch function layer, the organic insulating layer is in direct contact with one of the first touch conductive layer, the second touch conductive layer, and the protective layer.
  • the organic insulating layer when the organic insulating layer needs to be in contact with the touch function layer, in the area where the first touch conductive layer is provided, the organic insulating layer is in direct contact with the first touch conductive layer; In the area with the second touch conductive layer, the organic insulating layer is in direct contact with the second touch conductive layer; in the area where the first touch conductive layer and the second touch conductive layer are not provided, the organic insulating layer is in direct contact with the protective layer .
  • the embodiment of the present disclosure adopts flexible multi-layer integrated touch technology (Flexible Multi Layer On Cell, FMLOC) to form a touch function layer on the packaging layer.
  • FMLOC Flexible Multi Layer On Cell
  • the inorganic insulating layer 11 further includes a second inorganic insulating layer 15 located between the first touch conductive layer 12 and the encapsulation layer 8.
  • the inorganic insulating layer of the touch function layer includes the first inorganic insulating layer and the second inorganic insulating layer
  • the inorganic insulating layer 11 only includes the first inorganic insulating layer 14 ; the first touch conductive layer 12 is in contact with the encapsulation layer 8 .
  • the second inorganic insulating layer between the first touch conductive layer and the packaging layer is removed, and the first touch conductive layer is directly formed on the packaging layer. It can avoid the contact between the second inorganic insulating layer and the organic insulating layer of the display function layer, so that there will be a weak area where the organic insulating layer contacts the inorganic insulating layer in the peripheral area with poor flatness, avoiding film layer lifting and wrinkles and large area Falling off can also prevent cracks from forming water and oxygen intrusion channels and improve product yield. In addition, the manufacturing process of the touch display panel can be reduced, the manufacturing efficiency of the touch display panel can be improved, and the cost can be saved.
  • the encapsulation layer 8 includes: a first inorganic encapsulation layer 17 , an organic encapsulation layer 18 , and a second inorganic encapsulation layer 19 arranged in a stack.
  • the touch function layer 9 is disposed on the side of the second inorganic encapsulation layer 19 away from the base substrate 1 .
  • the display function layer includes a plurality of sub-pixel units arranged in an array; the sub-pixel units include a light-emitting device and a pixel drive circuit electrically connected to the light-emitting device; the pixel drive circuit is used to drive the light-emitting device to emit light, and the pixel drive circuit Examples include thin film transistors and storage capacitors.
  • the display function layer 6 specifically further includes: an active layer 20 located between the base substrate 1 and the encapsulation layer 8 , a second active layer 20 located between the active layer 20 and the encapsulation layer 8 A gate insulating layer 23, a first conductive layer 21 located between the first gate insulating layer 23 and the encapsulation layer 8, a second gate insulating layer 32 located between the first conductive layer 21 and the encapsulation layer 8, and a second gate insulating layer 32 located between the first gate insulating layer 23 and the encapsulation layer 8
  • the third conductive layer (not shown) between the insulating layer 32 and the encapsulation layer 8, the interlayer insulating layer 24 between the third conductive layer and the encapsulation layer 8, the interlayer insulating layer 24 and the encapsulation layer 8
  • the active layer 20 includes the active layer of the thin film transistor; the first conductive layer 21 includes: the gate G of the thin film transistor and the first electrode of the storage capacitor, the third conductive layer includes the second electrode of the storage capacitor, and the second conductive layer 22 It includes a source S and a drain D of a thin film transistor; the light emitting device layer 31 includes an anode 28 , a light emitting functional layer 29 , and a cathode 30 stacked on the planarization layer 26 .
  • the light emitting device is, for example, an organic light emitting diode device or a quantum dot light emitting diode device.
  • the organic insulating layer 7 of the display function layer 6 includes a planarization layer 26 and a pixel definition layer 27 .
  • FIG. 2 illustrates an example in which the anode is in direct contact with the second conductive layer through a via hole penetrating the planarization layer and the passivation layer.
  • the anode and the second conductive layer may also be electrically connected through a connecting electrode.
  • the planarization layer 26 includes: a first planarization layer 61 and a second planarization layer 62; the display function layer 6 further includes: a fourth conductive layer 60; the first planarization layer 61 is located between the passivation layer 25 and the fourth conductive layer 60 , and the second planarization layer 62 is located between the fourth conductive layer 60 and the anode 28 .
  • the fourth conductive layer includes: the connection electrode electrically connected to the second electrode layer through the via hole penetrating the first planarization layer and the passivation layer; the anode is connected to the connection electrode through the via hole penetrating the second planarization layer electrical connection.
  • the peripheral area 3 includes: at least one fan-out area 4 ; the fan-out area 4 includes a bonding area 5 .
  • the peripheral area 3 includes: at least one fan-out area 4 ; the fan-out area 4 includes a binding area 5 .
  • the touch display panel further includes: a touch signal line 44 , and a binding electrode 45 electrically connected to the touch signal line 44 .
  • the binding electrode 45 is located in the binding area 3 .
  • each binding electrode includes: a first binding electrode 36, a third binding electrode 35, and a second binding electrode 34; the first binding electrode 36 and the third binding electrode The fixed electrode 35 is electrically connected, and the third binding electrode 35 is electrically connected to the second binding electrode 34.
  • the second touch conductive layer 13 in the binding area, includes: a plurality of first binding electrodes 36 .
  • the touch function layer includes at least one inorganic insulating layer removal region.
  • the inorganic insulating layer removal area refers to the area where the inorganic insulating layer in the touch function layer is removed.
  • the inorganic insulating layer removal region needs to remove the first inorganic insulating layer and the second inorganic insulating layer.
  • the inorganic insulating layer removal region needs to remove the first inorganic insulating layer.
  • the fan-out area 4 further includes: a bending area 46 located between the binding area 5 and the display area;
  • the inorganic insulating layer removal region 47 covers the bending region 46 in the orthographic projection of the base substrate.
  • the inorganic insulating layer in the bending area is removed.
  • the orthographic projection of the inorganic insulating layer on the base substrate does not overlap with the bending area.
  • the touch display panel provided by the embodiments of the present disclosure may, for example, adopt a process of binding the binding electrodes of the touch display panel to the driving chip (Integrated Circuit, IC).
  • This process is called COP (Chip On Pi). ) process.
  • the fan-out region is bent along the bend axis so that the bonding region is bent to the backside of the base substrate. Therefore, the size of the peripheral area can be reduced, which is beneficial to realize a narrow frame.
  • FIG. 7 only shows a part of the fan-out area, and the fan-out area is in an unbent state.
  • the inorganic insulating layer is prone to cracks under the action of external force.
  • the orthographic projection of the inorganic insulating layer removal area on the base substrate covers the bending area, that is, the inorganic insulating layer in the touch function layer in the bending area is removed, so that the bending area can be avoided.
  • the stress generated by bending causes cracks in the inorganic insulating layer to avoid the formation of water vapor intrusion channels, thereby avoiding the peeling and falling off of the film layer caused by water vapor intrusion, and improving the product yield.
  • both the first inorganic insulating layer and the second inorganic insulating layer need to be removed in the bending area.
  • the inorganic insulating layer only includes the first inorganic insulating layer, the first inorganic insulating layer is removed in the bending area.
  • the base substrate is a flexible base substrate.
  • the material of the flexible substrate is, for example, polyimide (PI).
  • the organic insulating layer has at least one groove 48 running through its thickness; the groove 48 is at least located between the bending region 46 and the display region;
  • the inorganic insulating layer removal area 47 covers the groove 48 in the orthographic projection of the base substrate.
  • the inorganic insulating layer is removed in the area where the groove is provided between the bending area and the display area. Between the bending area and the display area, the orthographic projection of the inorganic insulating layer on the base substrate does not overlap with the groove.
  • a groove is provided through the thickness of the organic insulating layer, so that the bending stress can be released in the groove area when the bending area is bent, preventing Cracks caused by bending of the organic insulating layer.
  • removing the inorganic insulating layer in the area where the groove is set between the bending area and the display area can avoid a large film layer step difference under the inorganic insulating layer in the area where the groove is set between the bending area and the display area, which will cause
  • the inorganic insulating layer is warped, wrinkled, and cracked, which can prevent water vapor from entering the organic insulating layer along the cracks, and prevent the folds and cracks from continuing to extend to the area next to the touch signal line, resulting in poor touch signal line disconnection.
  • the organic insulating layer of the display function layer includes the pixel definition layer and the planarization layer
  • the pixel definition layer and/or the planarization layer has at least one groove extending through its thickness.
  • the inorganic insulating layer removal area covers the area between the groove and the bending area in the orthographic projection of the base substrate.
  • the orthographic projection of the inorganic insulating layer removal area on the base substrate covers the bending area, the groove between the bending area and the display area, and the area between the groove and the bending area.
  • the inorganic insulating layer of the touch function layer is removed in the bending area, the groove between the bending area and the display area, and the area between the groove and the bending area, whereby, it can be avoided that there is a large film layer difference below the inorganic insulating layer, which will cause the inorganic insulating layer to warp, wrinkle, and crack, and it can prevent water vapor from entering the organic insulating layer along the crack, and prevent wrinkles and cracks from continuing to extend to the side contacts.
  • the area of the control signal line leads to a broken touch signal line.
  • the inorganic insulating layer includes a first inorganic insulating layer and a second inorganic insulating layer
  • the first inorganic insulating layer is placed in the bending area, the groove between the bending area and the display area, and the area between the groove and the bending area. remove.
  • the distance h1 between the edge of the inorganic insulating layer and the groove 48 is greater than or equal to 5 microns and less than or equal to 40 microns. That is, the distance between the edge of the inorganic insulating layer and the groove is greater than zero, thereby avoiding that there is a large layer difference under the inorganic insulating layer, which will cause the inorganic insulating layer to warp, wrinkle, and crack, and avoid the formation of water vapor intrusion channels, thereby Avoid water vapor intrusion to cause peeling and falling off of the film layer, and improve product yield.
  • the distance h2 between the groove 48 and the bending region 46 is greater than or equal to 100 microns and less than or equal to 300 microns. In this way, it can avoid that the distance between the groove and the bending area is too large to release the bending stress in the groove area, and it can also avoid that the distance between the groove and the bending area is too small to cause cracks in the groove area .
  • the groove 48 is also located on the side of the bending area 46 away from the display area. Therefore, when the bending area is bent, the bending stress can also be released in the groove area on the side of the bending area away from the display area, further preventing cracks caused by bending of the organic insulating layer.
  • the distance between the groove and the bending area may also be greater than or equal to 100 microns and less than or equal to 300 microns.
  • the orthographic projection of the inorganic insulating layer removal area 47 on the base substrate and the orthographic projection of the groove 48 on the base substrate do not intersect each other. stack. That is, on the side of the bending area away from the display area, the orthographic projection of the inorganic insulating layer on the base substrate covers the groove.
  • the film layer structure on the side of the bending area close to the display area is more complex than that of the film layer on the side away from the display area in the bending area.
  • the flatness of the film layer on the side of the folding area away from the display area is poor.
  • On the side of the bending area close to the display area when the inorganic insulating layer covers the groove, it is more likely to cause the inorganic insulating layer to warp, wrinkle, and crack. Therefore, it may be considered to remove the inorganic insulating layer only in the groove area on the side of the bending area close to the display area, so as to simplify the design difficulty of the touch display panel.
  • the orthographic projection of the inorganic insulating layer removal region 47 on the base substrate covers the groove 48 .
  • the inorganic insulating layer is removed from the area where the grooves are arranged on both sides of the bending area, which can avoid the large film step difference under the inorganic insulating layer in the area of any groove, which will cause the inorganic
  • the insulating layer is warped, wrinkled, and cracked, which can prevent water vapor from entering the organic insulating layer along the cracks, and prevent the folds and cracks from continuing to extend to the area next to the touch signal line, leading to poor disconnection of the touch signal line.
  • the orthographic projection of the inorganic insulating layer removal region 47 on the base substrate also covers the area between the groove 48 and the bending region 46 .
  • the distance between the edge of the inorganic insulating layer and the groove is greater than or equal to 5 microns and less than or equal to 40 microns.
  • each touch signal line 44 includes a first touch signal line 49 and a first connection lead 50 electrically connected to the first touch signal line 49 .
  • Fig. 9 is a cross-sectional view along DD' in Fig. 7 .
  • the touch conductive layer includes a plurality of first touch signal lines, and the first conductive layer or the second conductive layer includes a plurality of first connection leads.
  • the second touch conductive layer 13 includes the first touch signal line 49 and the second conductive layer 22 includes the first connection lead 50 as an example for illustration.
  • the touch signal lines in the bending area are located on the first conductive layer or the second conductive layer, so that the touch signal lines in the bending area are closer to the substrate, that is, the bending area
  • the touch signal line is closer to the bending neutral plane, so that when the bending area is bent, the touch signal line can avoid a large bending stress and the risk of disconnection, which can improve the yield of the touch display panel.
  • the first touch signal line 49 extends from the display area to the side of the bending area 46 close to the display area; the first connection lead 50 is close to the display area from the bending area 46 One side extends through the bending area 46 to between the bonding area 5 and the bending area 46; one end of the first connection lead 50 is electrically connected to the first touch signal line 49, and the other end of the first connection lead 50 is electrically connected to the first touch signal line 49.
  • a bonding electrode 36 is electrically connected.
  • the first touch signal line 49 is electrically connected to the first connection lead 50 through the via hole penetrating the pixel definition layer 27 and the planarization layer 26, and the first binding electrode 36 is electrically connected to the first connecting lead 50 through the via hole penetrating the pixel
  • the via holes defining the layer 27 and the planarization layer 26 are electrically connected to the first connection lead 50 .
  • the orthographic projection of the groove 48 on the base substrate and the orthographic projection of the first touch signal line 49 on the base substrate do not overlap each other.
  • grooves are provided in areas other than the touch signal lines, so as to avoid the risk of disconnection of the touch signal lines due to step differences in the areas where the touch signal lines pass.
  • the orthographic projection of the inorganic insulating layer removal region 47 on the base substrate and the orthographic projection of the first touch signal line 49 on the base substrate do not overlap each other.
  • the first touch signal line is insulated from other conductive layers through the inorganic insulating layer.
  • the orthographic projection of the first connection lead 50 on the base substrate penetrates through the inorganic insulating layer removal region 47 .
  • the touch function layer further includes a protective layer removal area.
  • the protective layer removal area includes at least one first protective layer removal area 63;
  • the orthographic projection of the first protection layer removal region 63 on the base substrate falls into the orthographic projection of the inorganic insulating layer removal region 47 on the base substrate.
  • the orthographic projection of the first protective layer removal region 63 on the base substrate falls into the bending region 46 .
  • the protective layer covers the edge of the inorganic insulating layer, thereby preventing the edge of the inorganic insulating layer from being damaged.
  • the protective layer removal area also includes a second protective layer removal area 64; the second protective layer removal area 64 covers the inorganic insulating layer on the substrate in the orthographic projection of the substrate Orthographic projection of the substrate.
  • the orthographic projection of the second protection layer removal region 64 on the base substrate falls into the binding region. That is, in the binding region, the protective layer needs to be removed to expose the first binding electrode.
  • the second touch conductive layer further includes a plurality of dummy touch signal lines 59 .
  • the dummy touch signal lines can serve as shielding lines.
  • FIG. 7 and FIG. 8 take an example in which the inorganic insulating layer removal region does not cover the bonding region for illustration.
  • the inorganic insulating layer removal region 47 covers the bonding region 5 in the orthographic projection of the base substrate.
  • FIGS. 7 to 10 take the COP process as an example for illustration.
  • the touch display panel may also adopt a Chip On Film (COF) process.
  • COF Chip On Film
  • the driver chip (Integrated Circuit, IC) is fixed on the flexible circuit board (Flexible Printed Circuit, FPC), and the FPC is bound to the binding electrode in the binding area, so that the IC can be connected to the contactor through the FPC.
  • FPC Flexible Printed Circuit
  • the inorganic insulating layer removal region 47 covers the bonding region 5 in the orthographic projection of the base substrate.
  • the inorganic insulating layer in the touch function layer can be removed in the bonding area.
  • the orthographic projection of the inorganic insulating layer on the base substrate 1 does not overlap with the bonding region 5 .
  • both the first inorganic insulating layer and the second inorganic insulating layer need to be removed in the bonding region.
  • the inorganic insulating layer only includes the first inorganic insulating layer, the first inorganic insulating layer is removed in the bonding area.
  • the defined first binding electrode 36 is electrically connected to the driving chip 37 through conductive particles 39 .
  • the bonding of the driving chip 37 and the first bonding electrode may cause cracks in the first inorganic insulating layer 14 , forming water and oxygen intrusion channels.
  • the binding of the FPC to the first binding electrode may cause cracks in the inorganic insulating layer, forming water and oxygen intrusion channels.
  • the orthographic projection of the inorganic insulating layer on the base substrate and the binding area do not overlap each other, that is, the inorganic insulating layer of the touch function layer is removed in the binding area to avoid the touch display panel
  • Binding with driver chips or flexible circuit boards will cause cracks in the inorganic insulating layer, avoiding the formation of water vapor intrusion channels, thereby avoiding the peeling and falling off of the film layer caused by water vapor intrusion, and improving product yield.
  • the organic insulating layer 7 includes a planarization layer 26 ; the first binding electrode 36 is in contact with the planarization layer 26 .
  • no inorganic insulating layer is provided between the first binding electrode and the planarization layer, which can avoid cracks in the inorganic insulating layer caused by the binding of the touch display panel and the driving chip or the flexible circuit board, and avoid the formation of water vapor intrusion channels.
  • the first binding electrode is a binding electrode bound to the driving chip.
  • the first binding electrode is a binding electrode bound to the FPC.
  • the second conductive layer 22 includes a third binding electrode 35 corresponding to the first binding electrode 36 one-to-one, and the first conductive layer 21 includes a third binding electrode 35 corresponding to the third binding electrode 35.
  • the first binding electrode 36 is electrically connected to the third binding electrode 35 through the via hole penetrating the planarization layer 26, and the third binding electrode 35 is electrically connected to the second binding electrode 34 through the via hole penetrating the first insulating layer 33. .
  • the inorganic insulating layer removal region covers the bonding region in the orthographic projection of the base substrate:
  • the protective layer removal region 47 when the inorganic insulating layer removal region 47 covers the bonding region 5 in the orthographic projection of the base substrate, the protective layer removal region also includes the first layer corresponding to the bonding region.
  • the protective layer removal region 47 when the inorganic insulating layer removal region 47 covers the bonding region 5 in the orthographic projection of the base substrate, the protective layer removal region includes the first corresponding to the bonding region.
  • Protective layer removal area 63 in the area corresponding to the binding area, the orthographic projection of the first protective layer removal area 63 on the base substrate falls into the orthographic projection of the inorganic insulating layer removal area 47 on the base substrate.
  • the orthographic projection of the first protective layer removal region 63 on the base substrate falls into the bonding region 5.
  • the touch conductive layer 10 includes a plurality of touch sensing electrodes RX and a plurality of touch driving electrodes TX crossing each other; each touch sensing electrode RX includes: a plurality of touch sensing electrodes RX Sensing sub-electrode 43, and connecting portion 42 connecting adjacent touch sensing sub-electrode 43; each touch driving electrode TX includes: a plurality of touch driving sub-electrodes 41, and a bridge connecting adjacent touch driving sub-electrodes 41 electrode 40.
  • the touch sensing sub-electrodes 43 and the connecting portion 42 are integrally connected, and the touch sensing sub-electrodes 43 , the connecting portion 42 and the touch driving sub-electrodes 41 are arranged on the same layer.
  • one layer of the first touch conductive layer or the second touch conductive layer includes: a touch sensing sub-electrode, a connection part, and a touch driving sub-electrode;
  • the other layer includes bridging electrodes.
  • the touch sensing electrodes RX extend along the first direction X
  • the touch driving electrodes TX extend along the second direction Y.
  • the first direction X intersects the second direction Y, for example, the first direction X is perpendicular to the second direction Y.
  • the positions of the touch sensing electrodes RX and the touch driving electrodes TX can be interchanged.
  • both the touch sensing electrodes RX and the touch driving electrodes TX need to be electrically connected to the touch signal lines 44 .
  • the touch signal line is used to provide a driving signal to the corresponding touch electrode or receive a sensing signal on the corresponding touch electrode. That is, the touch signal line electrically connected to the touch sensing electrode RX receives the sensing signal on the corresponding touch sensing electrode RX, and the touch signal line electrically connected to the touch driving electrode TX is used to send the corresponding touch driving electrode TX Provides a drive signal.
  • the touch sensing sub-electrodes and the touch driving sub-electrodes are diamond-shaped block electrodes as an example for illustration.
  • the touch sensing electrodes and the touch driving electrodes may be, for example, grid electrodes.
  • the mesh electrode includes a plurality of holes.
  • the orthographic projections of the holes on the substrate correspond one-to-one to the orthographic projections of the sub-pixels on the base.
  • the orthographic projection of the hole on the substrate corresponds to the orthographic projection of the plurality of sub-pixels on the base.
  • the orthographic projection of the light-emitting area of the sub-pixel on the substrate falls within the orthographic projection of the hole on the substrate. In this way, it is possible to prevent the touch driving electrodes and the touch sensing electrodes from affecting the light emission of the sub-pixels, and avoid affecting the normal display of the touch display panel.
  • the material of the first touch conductive layer and the second touch conductive layer is, for example, titanium/aluminum/titanium stack or indium tin oxide/silver/indium tin oxide stack;
  • the inorganic insulating layer includes, for example, nitride Silicon;
  • the material of the protective layer includes, for example, PI.
  • An embodiment of the present disclosure provides a touch display device, and the touch display device includes the touch display panel provided by the embodiment of the present disclosure.
  • the touch display device provided by the embodiments of the present disclosure is any product or component with a touch display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, and a navigator.
  • a touch display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, and a navigator.
  • Other essential components of the touch display device should be understood by those of ordinary skill in the art, and will not be repeated here, nor should they be used as limitations on the present disclosure.
  • the touch display device further includes a driving chip; the driving chip is bound to the binding electrodes in the binding area.
  • the touch display device further includes a driving chip and an FPC; the driving chip is bound to the FPC, and the FPC is bound to the binding electrodes in the binding area.
  • the touch display motherboard includes a plurality of touch display panel areas 51 and a removal area 52 surrounding the touch display panel areas 51 ;
  • the touch display panel area 51 includes: the touch display panel provided by the embodiment of the present disclosure;
  • the packaging layer of the touch display panel does not overlap with the removal area 52 in the orthographic projection of the base substrate; the organic insulating layer of the touch display panel and the touch function layer of the touch display panel extend to the removal area 52;
  • the film layer on the side of the inorganic insulating layer away from the base substrate is in direct contact with the organic insulating layer.
  • the film layer on the side of the inorganic insulating layer facing away from the base substrate in at least part of the removal area is in direct contact with the organic insulating layer, that is, at least part of the inorganic insulating layer in the removal area is removed, so that at least part The inorganic insulating layer of the touch function layer in the removal area is not in contact with the organic insulating layer of the display function layer.
  • it can avoid the weak area where the organic insulating layer contacts the inorganic insulating layer in the removal area with poor flatness, avoid the film layer from lifting, wrinkling and large-scale shedding, and can also avoid cracks forming water and oxygen intrusion channels, and improve the product quality. yield.
  • the removal area 52 includes: a first cutting area 55 located between adjacent touch display panel areas 51 , a plurality of cutting areas 55 surrounding the touch display panel area 51 and connected to the touch display panel
  • the second cutting area 53 adjacent to the area 51 is the sub-removal area 54 located between the first cutting area 55 and the second cutting area 53 .
  • the touch display motherboard is roughly cut along the cutting line located in the first cutting area, and the touch display motherboard is cut into multiple pieces. Afterwards, each piece is cut along the cutting line located in the second cutting area to obtain a touch display panel.
  • the touch conductive layer includes: an alignment mark 56 located in the sub-removal region 54 , and the alignment mark 56 is in contact with the organic insulating layer 7 .
  • the alignment marks 56 include a first alignment mark 57 .
  • Fig. 13 is an enlarged schematic view of area B in Fig. 12, and Fig. 14 is a cross-sectional view of CC' in Fig. 13 .
  • the second touch conductive layer 13 includes a first alignment mark 57 located in the sub-removal area
  • the first alignment mark 57 is in contact with the pixel definition layer 27 .
  • the alignment marks formed on the touch function layer are in direct contact with the organic insulating layer.
  • the alignment mark for patterning the first touch conductive layer is located on the display function layer, which is generally the second conductive layer or the anode layer; while other film layers in the touch function layer use the first touch conductive layer as the base The film layer is aligned.
  • the second alignment mark included in the first touch conductive layer is located on the second inorganic insulating layer. Since the alignment mark is located in the sub-cutting area between the first cutting area and the second cutting area, and usually there is a level difference between the first cutting area and the second cutting area and the sub-cutting area, it is easy to cause the inorganic insulating layer to fall off. When the second inorganic insulating layer falls off, the second alignment mark will fall off, and the subsequent alignment cannot be performed, resulting in scrapping of the entire display motherboard.
  • the second alignment mark is made on the film layer after the patterning process is performed on the first touch conductive layer, as shown in FIG. 15 , the second alignment mark 58 In contact with the pixel definition layer 27 .
  • the second inorganic insulating layer can be avoided from falling off, thereby preventing the second alignment mark from falling off, ensuring the smooth progress of the subsequent alignment, and improving the production yield of the touch display motherboard.
  • the second alignment mark will also be etched, so it is necessary to make the first alignment mark on the second touch conductive layer as a patterning process of the protective layer alignment marks.
  • the contact between the first alignment mark and the pixel definition layer can prevent the inorganic insulating layer from falling off, thereby avoiding the first alignment mark from falling off, ensuring the smooth progress of the subsequent alignment, and improving the Production yield of touch display motherboards.
  • FIG. 13 only shows one of the possible patterns of the alignment marks.
  • the pattern of the alignment mark can be set according to actual needs, for example, the pattern of the alignment mark 56 can also be as shown in FIG. 16 .
  • the alignment mark 56 includes a strip pattern extending along the second direction Y and a strip pattern extending along the first direction X, and the length of the strip pattern extending along the second direction Y in the second direction Y is, for example, 170 microns ( ⁇ m ) to 210 ⁇ m, the length of the stripe pattern extending along the second direction Y in the first direction X is, for example, 20 ⁇ m to 30 ⁇ m.
  • the length of the striped pattern extending along the first direction X in the first direction X is, for example, 130 ⁇ m, and the length of the striped pattern extending along the first direction X in the second direction Y is, for example, 20 ⁇ m ⁇ 30 ⁇ m.
  • the orthographic projection of the inorganic insulating layer on the base substrate does not at least partially overlap with the removal region.
  • the orthographic projection of the inorganic insulating layer on the base substrate and the removal area do not overlap each other. That is, the removal area does not include the inorganic insulating layer of the touch function layer.
  • the inorganic insulating layer of the touch function layer is removed in the first cutting area, the second cutting area, and the sub-removal area, which can avoid the problem of film layer peeling caused by cutting. It can also avoid the formation of water and oxygen intrusion channels caused by cracks in the inorganic insulating layer when cutting in the first cutting area and the second cutting area, thereby improving the product yield.
  • the removal area of the first protective layer included in the touch function layer also corresponds to the removal area.
  • the orthographic projection of the inorganic insulating layer on the base substrate does not overlap with the removal area
  • the orthographic projection of the first protection layer removal area corresponding to the removal area on the base substrate falls within the removal area. That is, the orthographic projection of the protective layer on the base substrate overlaps with the removal area, so that the protective layer covers the edge of the inorganic insulating layer to avoid damage to the inorganic insulating layer.
  • the embodiments of the present disclosure provide a touch display panel, a touch display device, and a touch display motherboard.
  • the film layer on the side of the inorganic insulating layer away from the base substrate is in direct contact with the organic insulating layer, that is, the inorganic insulating layer in at least part of the area is removed, so that the touch function layer in at least part of the area
  • the inorganic insulating layer is not in contact with the organic insulating layer of the display function layer.

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Abstract

触控显示面板，触控显示装置以及触控显示母板。触控显示面板包括：衬底基板(1)，包括显示区(2)以及周边区(3)；显示功能层(6)，包括：至少一层有机绝缘层(7)，以及封装层(8)；封装层(8)在衬底基板(1)的正投影覆盖显示区(2)以及部分周边区(3)；触控功能层(9)，位于封装层(8)背离衬底基板(1)的一侧，包括：触控导电层(10)，无机绝缘层(11)以及保护层(16)；触控功能层(9)包括：第一触控导电层(12)，以及位于第一触控导电层(12)背离显示功能层(6)一侧的第二触控导电层(13)；无机绝缘层(11)至少包括：位于第一触控导电层(12)和第二触控导电层(13)之间的第一无机绝缘层(14)；保护层(16)位于第二触控导电层(13)背离第一无机绝缘层(14)的一侧；在封装层(8)在衬底基板(1)的正投影未覆盖的至少部分周边区(3)，有机绝缘层(7)与触控导电层(10)或保护层(16)直接接触。

Description

触控显示面板、触控显示装置、触控显示母板 技术领域
本公开涉及显示技术领域，尤其涉及触控显示面板、触控显示装置、触控显示母板。
背景技术
有机发光二极管显示(Organic Light-Emitting Display，OLED)技术制备的显示面板，由于其具有自发光、亮度高、画质好、能耗低等优点，已经成为显示技术领域的主流发展方向。对于这种新型发展的技术，可以做更多的设计去满足人们的需求，其中柔性多层一体化集成触控技术(Flexible Multi Layer On Cell，FMLOC)已经是该行业发展的方向，但采用FMLOC存在膜层剥离(Peeling)的问题。如果在生产过程中发生大量的Peeling会污染设备，同时脱落的膜层掉到其他区域引起污染和不良，这会造成整个母板报废；并且，在显示产品中发生膜层脱落，会造成信号的断线，引起不良发生。
发明内容
本公开实施例提供的一种触控显示面板，触控显示面板包括：
衬底基板，包括：显示区以及包围显示区的周边区；
显示功能层，位于衬底基板的一侧，包括：至少一层有机绝缘层，以及位于有机绝缘层背离衬底基板一侧的封装层；封装层在衬底基板的正投影覆盖显示区以及部分周边区；
触控功能层，位于封装层背离衬底基板的一侧，包括：触控导电层、与触控导电层接触的无机绝缘层、以及保护层；触控功能层包括：第一触控导电层，以及位于第一触控导电层背离显示功能层一侧的第二触控导电层；无机绝缘层至少包括：位于第一触控导电层和第二触控导电层之间的第一无机绝缘层；保护层位于第二触控导电层背离第一无机绝缘层的一侧；在封装层 在衬底基板的正投影未覆盖的至少部分周边区，有机绝缘层与触控导电层或保护层直接接触。
在一些实施例中，周边区包括：至少一个扇出区；扇出区包括：弯折区；
触控功能层包括至少一个无机绝缘层去除区；
无机绝缘层去除区在衬底基板的正投影覆盖弯折区。
在一些实施例中，有机绝缘层具有至少一个贯穿其厚度的凹槽；凹槽至少位于弯折区和显示区之间；
在弯折区和显示区之间，无机绝缘层去除区在衬底基板的正投影覆盖凹槽。
在一些实施例中，在弯折区和显示区之间，无机绝缘层去除区在衬底基板的正投影覆盖凹槽和弯折区之间的区域。
在一些实施例中，凹槽还位于弯折区背离显示区一侧；
在弯折区背离显示区一侧，无机绝缘层在衬底基板的正投影覆盖凹槽。
在一些实施例中，凹槽还位于弯折区背离显示区一侧；
在弯折区背离显示区一侧，无机绝缘层去除区在衬底基板的正投影覆盖凹槽。
在一些实施例中，触控导电层还包括：
多条第一触控信号线，从显示区延伸到弯折区靠近显示区一侧；
显示功能层还包括：位于衬底基板和封装层之间的第一导电层，位于第一导电层和封装层之间的第二导电层；
第一导电层或第二导电层包括：
多条第一连接引线，从弯折区和显示区之间穿过弯折区延伸至弯折区背离显示区一侧；在弯折区和显示区之间第一连接引线的一端与第一触控信号线电连接；
凹槽在衬底基板的正投影与第一触控信号线在衬底基板的正投影互不交叠。
在一些实施例中，无机绝缘层去除区在衬底基板的正投影与第一触控信 号线在衬底基板的正投影互不交叠。
在一些实施例中，第一连接引线在衬底基板的正投影贯穿无机绝缘层去除区。
在一些实施例中，显示功能层还包括：
平坦化层，位于第二导电层和封装层之间；
像素定义层，位于封装层和平坦化层之间；
像素定义层和/或平坦化层具有至少一个贯穿其厚度的凹槽。
在一些实施例中，在显示区与所述弯折区之间，无机绝缘层的边缘与凹槽之间的距离大于等于5微米且小于等于40微米。
在一些实施例中，凹槽与弯折区之间的距离大于等于100微米且小于等于300微米。
在一些实施例中，周边区包括：至少一个扇出区；扇出区包括绑定区；
触控功能层包括至少一个无机绝缘层去除区；
无机绝缘层去除区在衬底基板的正投影覆盖绑定区。
在一些实施例中，在绑定区，第二触控导电层包括：多个第一绑定电极；
有机绝缘层包括平坦化层；第一绑定电极与平坦化层接触。
在一些实施例中，显示功能层还包括：位于平坦化层和衬底基板之间的第一导电层，位于第一导电层和平坦化层之间的第一绝缘层，以及位于第一绝缘层和平坦化层之间的第二导电层；
在绑定区，第一导电层包括与第一绑定电极一一对应的第二绑定电极，第二导电层包括与第二绑定电极一一对应的第三绑定电极；第三绑定电极通过贯穿第一绝缘层的过孔与第二绑定电极连接；第一绑定电极通过贯穿平坦化层的过孔与第三绑定电极连接。
在一些实施例中，触控功能层包括至少一个无机绝缘层去除区以及至少一个第一保护层去除区；
第一保护层去除区在衬底基板的正投影落入无机绝缘层去除区在衬底基板的正投影内。
在一些实施例中，无机绝缘层仅包括第一无机绝缘层；
第一触控导电层与封装层接触。
在一些实施例中，无机绝缘层还包括位于第一触控导电层和封装层之间的第二无机绝缘层。
本公开实施例提供的一种触控显示装置，触控显示装置包括本公开实施例提供的触控显示面板。
本公开实施例提供的一种触控显示母板，触控显示母板包括多个触控显示面板区以及包围触控显示面板区的去除区；
触控显示面板区包括：本公开实施例提供的触控显示面板；
触控显示面板的封装层在衬底基板的正投影与去除区互不交叠；触控显示面板的有机绝缘层以及触控显示面板的触控功能层延伸至去除区；
在至少部分去除区，无机绝缘层背离衬底基板一侧的膜层与有机绝缘层直接接触。
在一些实施例中，去除区包括：位于相邻触控显示面板区之间的第一切割区，多个包围触控显示面板区且与触控显示面板区相邻的第二切割区，位于第一切割区和第二切割区之间的子去除区；
触控导电层包括：位于子去除区的对位标记，对位标记与有机绝缘层接触。
在一些实施例中，有机绝缘层包括：像素定义层；
第二触控导电层包括位于子去除区的第一对位标记；第一对位标记与像素定义层接触。
在一些实施例中，无机绝缘层在衬底基板的正投影与去除区至少部分不交叠。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简要介绍，显而易见地，下面描述中的附图仅仅是本公 开的一些实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开实施例提供的一种触控显示面板的结构示意图；
图2为本公开实施例提供的一种触控显示面板的显示区的截面图；
图3为本公开实施例提供的沿图1中AA’的截面图；
图4为本公开实施例提供的另一种触控显示面板的结构示意图；
图5为本公开实施例提供的又一种触控显示面板的结构示意图；
图6为本公开实施例提供的相关技术中驱动芯片与触控显示面板绑定的示意图；
图7为本公开实施例提供的一种触控显示面板的扇出区的结构示意图；
图8为本公开实施例提供的另一种触控显示面板的扇出区的结构示意图；
图9为本公开实施例提供的沿图7中DD’的截面图；
图10为本公开实施例提供的又一种触控显示面板的扇出区的结构示意图；
图11为本公开实施例提供的又一种触控显示面板的扇出区的结构示意图；
图12为本公开实施例提供的一种触控显示母板的结构示意图；
图13为本公开实施例提供的图12中B区域的示意图；
图14为本公开实施例提供的沿图13中CC’的截面图；
图15为本公开实施例提供的一种触控显示母板的第二对位标记的示意图；
图16为本公开实施例提供的一种对位标记的结构示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。并且在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互组合。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。
需要注意的是，附图中各图形的尺寸和形状不反映真实比例，目的只是示意说明本公开内容。并且自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。
相关技术中，触控功能层包括缓冲层、第一触控导电层、无机膜层、第二触控导电层。其中，缓冲层也为无机膜层。对于触控显示产品，在显示区显示功能层结构比较平坦，触控功能层的无机膜层不易发生膜层剥离；而在周边区，由于部分膜层去除或保留，容易引起显示功能层的结构出现段差，即在周边区，显示功能层结构平坦性差。由于无机膜层与有机膜层的结合力较差，在平坦性差的周边区，触控功能层的无机膜层与显示功能层的有机膜层接触容易导致膜层翘起和褶皱，膜层翘起和褶皱引起较大的裂纹发生时，水汽会从裂纹侵入到触控功能层与显示功能层的界面，从而发生两膜层之间的大面积脱落。同时，由于无机膜层比较脆，在收到外力作用时容易发生破裂，形成水氧入侵通道。同时，由于无机膜层比较脆，触控功能层的无机膜层在切割位置和弯折位置容易发生裂纹，形成水氧入侵通道，影响产品良率。
基于相关技术存在的上述问题，本公开实施例提供了一种触控显示面板，如图1、图2、图3所示，触控显示面板包括：
衬底基板1，包括：显示区2以及包围显示区2的周边区3；
显示功能层6，位于衬底基板1的一侧，包括：至少一层有机绝缘层7，以及位于有机绝缘层7背离衬底基板1一侧的封装层8；封装层8在衬底基板1的正投影覆盖显示区2以及部分周边区3；
触控功能层9，位于封装层8背离衬底基板1的一侧，包括：触控导电层10、与触控导电层10接触的无机绝缘层11保护层16；触控导电层10包括：第一触控导电层12，以及位于第一触控导电层12背离显示功能层6一侧的第二触控导电层13；无机绝缘层11至少包括：位于第一触控导电层12和第二触控导电层13之间的第一无机绝缘层14；保护层16位于第二触控导电层13背离第一无机绝缘层14一侧；在封装层8在衬底基板1的正投影未覆盖的至少部分周边区3，有机绝缘层7与触控导电层10或保护层16直接接触。
本公开实施例提供的触控显示面板，在未被封装层覆盖的至少部分周边区，无机绝缘层背离衬底基板一侧的膜层与有机绝缘层直接接触，即去除至少部分周边区的无机绝缘层，使至少部分周边区触控功能层的无机绝缘层与显示功能层的有机绝缘层不接触。从而可以避免在平坦性较差的周边区出现有机绝缘层与无机绝缘层接触的薄弱区域，避免出现膜层翘起和褶皱以及大面积脱落，还可以避免出现裂纹形成水氧入侵通道，提高产品良率。
需要说明的是，图2为显示区的触控显示基板的截面图，图3为图1中AA’的截面图。
需要说明的是，在封装层未覆盖的至少部分周边区，在有机绝缘层需要与触控导电层接触的区域，则第一触控导电层与有机绝缘层直接接触或第二触控导电层与有机绝缘层直接接触，在有机绝缘层需要与保护层接触的区域，则保护层与有机绝缘层直接接触。即当有机绝缘层需要与触控功能层接触时，有机绝缘层与第一触控导电层、第二触控导电层、保护层中的一种直接接触。即当有机绝缘层需要与触控功能层接触时，在设置有第一触控导电层的区域，有机绝缘层与第一触控导电层直接接触；在未设置第一触控导电层但设置有第二触控导电层的区域，有机绝缘层与第二触控导电层直接接触；在未设置第一触控导电层以及第二触控导电层的区域，有机绝缘层与保护层直接接触。
在具体实施时，本公开实施例采用柔性多层一体化集成触控技术(Flexible Multi Layer On Cell，FMLOC)在封装层上形成触控功能层。
在一些实施例中，如图2所示，无机绝缘层11还包括位于第一触控导电 层12和封装层8之间的第二无机绝缘层15。
在具体实施时，当触控功能层的无机绝缘层包括第一无机绝缘层和第二无机绝缘时，在平坦性较差的至少部分周边区，且在容易出现膜层翘起和褶皱以及大面积脱落的区域，第一无机绝缘层和第二无机绝缘均需要去除。
或者，在一些实施例中，如图4所示，无机绝缘层11仅包括第一无机绝缘层14；第一触控导电层12与封装层8接触。
即本公开实施例提供的触控显示面板，将第一触控导电层与封装层之间的第二无机绝缘层去除，直接在封装层上制作第一触控导电层。可以避免第二无机绝缘层与显示功能层的有机绝缘层接触，从而在平坦性较差的周边区出现有机绝缘层与无机绝缘层接触的薄弱区域，避免出现膜层翘起和褶皱以及大面积脱落，还可以避免出现裂纹形成水氧入侵通道，提高产品良率。并且还可以减少触控显示面板的制备工艺流程、提高触控显示面板制备效率，节省成本。
在一些实施例中，如图2、图3所示，封装层8包括：堆叠设置的第一无机封装层17、有机封装层18、第二无机封装层19。触控功能层9在第二无机封装层19背离衬底基板1一侧设置。
在一些实施例中，显示功能层包括多个阵列排布的子像素单元；子像素单元包括发光器件以及与发光器件电连接的像素驱动电路；像素驱动电路用于驱动发光器件发光，像素驱动电路例如包括薄膜晶体管以及存储电容。
在一些实施例中，如图2所示，显示功能层6具体还包括：位于衬底基板1和封装层8之间的有源层20、位于有源层20和封装层8之间的第一栅绝缘层23、位于第一栅绝缘层23和封装层8之间的第一导电层21、位于第一导电层21和封装层8之间的第二栅绝缘层32，位于第二栅绝缘层32和封装层8之间的第三导电层(未示出)，位于第三导电层和封装层8之间的层间绝缘层24、位于层间绝缘层24和封装层8之间的第二导电层22、位于第二导电层22和封装层8之间的钝化层25，位于钝化层25和封装层8之间的平坦化层26，位于平坦化层26和封装层8之间的像素定义层27和发光器件31。 有源层20包括薄膜晶体管的有源层；第一导电层21包括：薄膜晶体管的栅极G以及存储电容的第一电极，第三导电层包括存储电容的第二电极，第二导电层22包括薄膜晶体管的源极S和漏极D；发光器件层31包括在平坦化层26上堆叠设置的阳极28、发光功能层29、阴极30。
在具体实施时，发光器件例如为有机发光二极管器件或量子点发光二极管器件。
在具体实施时，显示功能层6的有机绝缘层7包括平坦化层26以及像素定义层27。
需要说明的是，图2以阳极通过贯穿平坦化层、钝化层的过孔与第二导电层直接接触为例进行举例说明。当然，阳极与第二导电层之间还可以通过连接电极电连接。在一些实施例中，如图5所示，平坦化层26包括：第一平坦化层61和第二平坦化层62；显示功能层6还包括：第四导电层60；第一平坦化层61位于钝化层25和第四导电层60之间，第二平坦化层62位于第四导电层60和阳极28之间。在具体实施时，第四导电层包括：通过贯穿第一平坦化层、钝化层的过孔与第二电极层电连接的连接电极；阳极通过贯穿第二平坦化层的过孔与连接电极电连接。
在一些实施例中，如图1所示，周边区3包括：至少一个扇出区4；扇出区4包括绑定区5。
在一些实施例中，如图1、图7所示，周边区3包括：至少一个扇出区4；扇出区4包括绑定区5。
在一些实施例中，如图1、图7所示，触控显示面板还包括：触控信号线44，以及与触控信号线44电连接的绑定电极45。绑定电极45位于绑定区3。
在一些实施例中，如图3所示，每一绑定电极包括：第一绑定电极36、第三绑定电极35以及第二绑定电极34；第一绑定电极36与第三绑定电极35电连接，第三绑定电极35与第二绑定电极34电连接。
在一些实施例中，如图3所示，在绑定区，第二触控导电层13包括：多个第一绑定电极36。
在一些实施例中，触控功能层包括至少一个无机绝缘层去除区。需要说明的是，无机绝缘层去除区即去除触控功能层中的无机绝缘层的区域。当无机绝缘层包括第一无机绝缘层和第二无机绝缘层时，无机绝缘层去除区需要去除第一无机绝缘层和第二无机绝缘层。当无机绝缘层仅包括第一无机绝缘层时，无机绝缘层去除区需要去除第一无机绝缘层。
在一些实施例中，如图7所示，扇出区4还包括：位于绑定区5和显示区之间的弯折区46；
无机绝缘层去除区47在衬底基板的正投影覆盖弯折区46。
即去除弯折区的无机绝缘层。无机绝缘层在衬底基板的正投影与弯折区互不交叠。
需要说明的是，本公开实施例提供的触控显示面板，例如可以采用触控显示面板的绑定电极与驱动芯片(Integrated Circuit，IC)绑定的工艺，该工艺称为COP(Chip On Pi)工艺。对于COP工艺，扇出区沿弯折轴弯折，以使绑定区弯折至衬底基板的背面。从而可以减小周边区尺寸，有利于实现窄边框。图7中仅示出部分扇出区，且扇出区为未弯折的状态。
需要说明的是，无机绝缘层在外力作用下容易产生裂纹。本公开实施例提供的触控显示面板，无机绝缘层去除区在衬底基板的正投影覆盖弯折区，即去除弯折区的触控功能层中的无机绝缘层，从而可以避免弯折区弯折产生的应力导致无机绝缘层产生裂纹，避免形成水汽入侵通道，从而避免水汽入侵导致膜层剥离、脱落，提高产品良率。
需要说明的是，对于无机绝缘层包括第一无机绝缘层和第二无机绝缘层的情况，在弯折区需要将第一无机绝缘层和第二无机绝缘层均去除。对于无机绝缘层仅包括第一无机绝缘层的情况，则在弯折区将第一无机绝缘层去除。
在具体实施时，对于COP工艺的触控显示面板，衬底基板为柔性衬底基板。柔性衬底基板的材料例如为聚酰亚胺(Polyimide，PI)。
在一些实施例中，如图7所示，有机绝缘层具有至少一个贯穿其厚度的凹槽48；凹槽48至少位于弯折区46和显示区之间；
在弯折区46和显示区之间，无机绝缘层去除区47在衬底基板的正投影覆盖凹槽48。
即在弯折区和显示区之间设置凹槽的区域去除无机绝缘层。在弯折区和显示区之间，无机绝缘层在衬底基板的正投影与凹槽互不交叠。
本公开实施例提供的触控显示面板，至少在弯折区靠近显示区一侧设置贯穿有机绝缘层厚度的凹槽，从而在弯折区弯折时可以在凹槽区域释放弯折应力，防止有机绝缘层出现弯折导致的裂纹。并且，在弯折区和显示区之间设置凹槽的区域去除无机绝缘层，可以避免在弯折区和显示区之间设置凹槽的区域无机绝缘层下方有较大的膜层段差将导致无机绝缘层发生翘起、褶皱、裂纹，可以避免水汽沿着裂纹进入到有机绝缘层中，以及避免褶皱和裂纹继续延伸到旁边触控信号线的区域导触控信号线断线不良。
在一些实施例中，当显示功能层的有机绝缘层包括像素定义层和平坦化层时，像素定义层和/或平坦化层具有至少一个贯穿其厚度的凹槽。
在一些实施例中，在弯折区和显示区之间，无机绝缘层去除区在衬底基板的正投影覆盖凹槽和弯折区之间的区域。
即无机绝缘层去除区在衬底基板的正投影覆盖弯折区、在弯折区和显示区之间的凹槽以及该凹槽和弯折区之间的区域。
本公开实施例提供的触控显示面板，在弯折区、在弯折区和显示区之间的凹槽以及该凹槽和弯折区之间的区域去除触控功能层的无机绝缘层，从而可以避免无机绝缘层下方有较大的膜层段差将导致无机绝缘层发生翘起、褶皱、裂纹，可以避免水汽沿着裂纹进入到有机绝缘层中，以及避免褶皱和裂纹继续延伸到旁边触控信号线的区域导触控信号线断线不良。
需要说明的是，对于无机绝缘层包括第一无机绝缘层和第二无机绝缘层的情况，在弯折区、在弯折区和显示区之间的凹槽以及该凹槽和弯折区之间的区域需要将第一无机绝缘层和第二无机绝缘层均去除。对于无机绝缘层仅包括第一无机绝缘层的情况，则在弯折区、在弯折区和显示区之间的凹槽以及该凹槽和弯折区之间的区域将第一无机绝缘层去除。
在一些实施例中，如图7所示，在显示区与弯折区46之间，无机绝缘层的边缘与凹槽48之间的距离h1大于等于5微米且小于等于40微米。即无机绝缘层的边缘与凹槽之间的距离大于零，从而可以避免无机绝缘层下方有较大的膜层段差将导致无机绝缘层发生翘起、褶皱、裂纹，避免形成水汽入侵通道，从而避免水汽入侵导致膜层剥离、脱落，提高产品良率。
在一些实施例中，凹槽48与弯折区46之间的距离h2大于等于100微米且小于等于300微米。从而可以避免凹槽与弯折区之间的距离过大无法在凹槽区域释放弯折应力，还可以避免凹槽与弯折区之间的距离过小导致凹槽区域随之弯折出现裂纹。
在一些实施例中，如图7、图8所示，凹槽48还位于弯折区46背离显示区一侧。从而在弯折区弯折时，在弯折区背离显示区一侧也可以在凹槽区域释放弯折应力，进一步防止有机绝缘层出现弯折导致的裂纹。
在一些实施例中，在弯折区背离显示区一侧，凹槽与弯折区之间的距离也可以大于等于100微米且小于等于300微米。
在一些实施例中，如图7所示，在弯折区46背离显示区一侧，无机绝缘层去除区47在衬底基板的正投影与凹槽48在衬底基板的正投影互不交叠。即在弯折区背离显示区一侧，无机绝缘层在衬底基板的正投影覆盖凹槽。
需要说明的是，弯折区靠近显示区一侧的膜层结构比弯折区背离显示区一侧的膜层结构复杂，相应的，弯折区靠近显示区一侧的膜层平坦性比弯折区背离显示区一侧的膜层平坦性差。在弯折区靠近显示区一侧，无机绝缘层覆盖凹槽时更容易出现导致无机绝缘层发生翘起、褶皱、裂纹。因此可以考虑仅在弯折区靠近显示区一侧的凹槽区域去除无机绝缘层，以简化触控显示面板的设计难度。
或者，在一些实施例中，如图8所示，在弯折区46背离显示区一侧，无机绝缘层去除区47在衬底基板的正投影覆盖凹槽48。
即本公开实施例提供的触控显示面板，在弯折区两侧设置凹槽的区域均去除无机绝缘层，可以避免任意凹槽的区域无机绝缘层下方有较大的膜层段 差将导致无机绝缘层发生翘起、褶皱、裂纹，可以避免水汽沿着裂纹进入到有机绝缘层中，以及避免褶皱和裂纹继续延伸到旁边触控信号线的区域导触控信号线断线不良。
在一些实施例中，如图8所示，在弯折区46背离显示区一侧，无机绝缘层去除区47在衬底基板的正投影还覆盖凹槽48与弯折区46之间的区域。
在一些实施例中，在弯折区背离显示区一侧，无机绝缘层的边缘与凹槽之间的距离大于等于5微米且小于等于40微米。
在一些实施例中，如图7、图9所示，每一触控信号线44包括第一触控信号线49以及与第一触控信号线49电连接的第一连接引线50。
需要说明的是，图9为沿图7中DD’的截面图。
在具体实施时，触控导电层包括多条第一触控信号线，第一导电层或第二导电层包括多条第一连接引线。图7、图9中，以第二触控导电层13包括第一触控信号线49、第二导电层22包括第一连接引线50为例进行举例说明。
本公开实施例提供的触控显示面板，在弯折区的触控信号线位于第一导电层或第二导电层，以使弯折区触控信号线更靠近衬底基板，即弯折区触控信号线更靠近弯折中性面，这样弯折区弯折时可以避免触控信号线产生较大的弯折应力而存在断线风险，可以提高触控显示面板良率。
在一些实施例中，如图7、图9所示，第一触控信号线49从显示区延伸到弯折区46靠近显示区一侧；第一连接引线50从弯折区46靠近显示区一侧穿过弯折区46延伸至绑定区5与弯折区46之间；第一连接引线50的一端与第一触控信号线49电连接，第一连接引线50的另一端与第一绑定电极36电连接。在具体实施时，如图9所示，第一触控信号线49通过贯穿像素定义层27、平坦化层26的过孔与第一连接引线50电连接，第一绑定电极36通过贯穿像素定义层27、平坦化层26的过孔与第一连接引线50电连接。
在一些实施例中，如图7、图8所示，凹槽48在衬底基板的正投影与第一触控信号线49在衬底基板的正投影互不交叠。
即本公开实施例提供的触控显示面板，在触控信号线之外的区域设置凹 槽，从而可以避免触控信号线经过的区域产生段差造成触控信号线断线的风险。
在一些实施例中，如图7、图8所示，无机绝缘层去除区47在衬底基板的正投影与第一触控信号线49在衬底基板的正投影互不交叠。
即在第一触控信号线设置的区域，通过无机绝缘层使得第一触控信号线与其他导电层相互绝缘。
在一些实施例中，如图7、图8所示，第一连接引线50在衬底基板的正投影贯穿无机绝缘层去除区47。
在一些实施例中，触控功能层还包括保护层去除区。
在一些实施例中，如图7、图8所示，保护层去除区包括至少一个第一保护层去除区63；
第一保护层去除区63在衬底基板的正投影落入无机绝缘层去除区47在衬底基板的正投影。
在一些实施例中，如图7、图8所示，第一保护层去除区63在衬底基板的正投影落入弯折区46内。
即在去除无机绝缘层的区域，保护层覆盖无机绝缘层的边缘，从而避免无机绝缘层的边缘受损。
在一些实施例中，如图7、图8所示，保护层去除区还包括第二保护层去除区64；第二保护层去除区64在衬底基板的正投影覆盖无机绝缘层在衬底基板的正投影。
在一些实施例中，如图7、图8所示，第二保护层去除区64在衬底基板的正投影落入绑定区内。即在绑定区，需要去除保护层，以露出第一绑定电极。
在一些实施例中，如图7、图8所示，第二触控导电层还包括多条虚设触控信号线59。虚设触控信号线可以作为屏蔽线。
需要说明的是，图7、图8以无机绝缘层去除区未覆盖绑定区为例进行举例说明。
当然，在一些实施例中，对于COP工艺，如图10所示，无机绝缘层去除区47在衬底基板的正投影覆盖绑定区5。
需要说明的是，图7～图10以COP工艺为例进行举例说明。当然在具体实施时，触控显示面板也可以采用覆晶薄膜(Chip On Film，COF)工艺。
具体的，对于COF工艺，将驱动芯片(Integrated Circuit，IC)等固定于柔性电路板(Flexible Printed Circuit，FPC)上，FPC与绑定区的绑定电极绑定，以使IC通过FPC与触控显示面板之间进行信号传输。需要说明的是，COF工艺，无需在绑定区与显示区之间设置弯折区。
对于COF工艺，如图11所示，无机绝缘层去除区47在衬底基板的正投影覆盖绑定区5。
在具体实施时，无论对于何种工艺的触控显示面板，均可以在绑定区去除触控功能层中的无机绝缘层。
在具体实施时，如图3所示，无机绝缘层在衬底基板1的正投影与绑定区5互不交叠。
需要说明的是，对于无机绝缘层包括第一无机绝缘层和第二无机绝缘层的情况，在绑定区需要将第一无机绝缘层和第二无机绝缘层均去除。对于无机绝缘层仅包括第一无机绝缘层的情况，则在绑定区将第一无机绝缘层去除。
接下来以触控显示面板与驱动芯片绑定为例进行说明，如图6所示，驱动芯片37需要通过包括导电粒子39的异方性导电胶(Anisotropic Conductive Film，ACF)38绑定，绑定区的第一绑定电极36通过导电粒子39与驱动芯片37电连接。当触控功能层中的第一无机绝缘层14延伸至绑定区时，驱动芯片37与第一绑定电极绑定可能会造成第一无机绝缘层14出现裂纹，形成水氧入侵通道。同理，对于COF工艺，当触控功能层中的无机绝缘层延伸至绑定区时，FPC与第一绑定电极绑定可能会造成无机绝缘层出现裂纹，形成水氧入侵通道。
本公开实施例提供的触控显示面板，无机绝缘层在衬底基板的正投影与绑定区互不交叠，即在绑定区去除触控功能层的无机绝缘层，避免触控显示 面板与驱动芯片或柔性电路板绑定导致无机绝缘层出现裂纹，避免形成水汽入侵通道，从而避免水汽入侵导致膜层剥离、脱落，提高产品良率。
在一些实施例中，如图3所示，有机绝缘层7包括平坦化层26；第一绑定电极36与平坦化层26接触。
即第一绑定电极与平坦化层之间未设置无机绝缘层，可以避免触控显示面板与驱动芯片或柔性电路板绑定导致无机绝缘层出现裂纹，避免形成水汽入侵通道。
需要说明的是，对于COP工艺，第一绑定电极为与驱动芯片绑定的绑定电极。对于COF工艺，第一绑定电极为与FPC绑定的绑定电极。
在一些实施例中，如图3所示，第二导电层22包括与第一绑定电极36一一对应的第三绑定电极35，第一导电层21包括与第三绑定电极35一一对应的第二绑定电极34；在绑定区，第一导电层21与第二导电层22之间包括第一绝缘层33；例如，第一绝缘层33包括：层间绝缘层24以及第二栅绝缘层32；
第一绑定电极36通过贯穿平坦化层26的过孔与第三绑定电极35电连接，第三绑定电极35通过贯穿第一绝缘层33的过孔与第二绑定电极34电连接。
在一些实施例中，当无机绝缘层去除区在衬底基板的正投影覆盖绑定区时：
在一些实施例中，如图10所示，对于COP工艺，当无机绝缘层去除区47在衬底基板的正投影覆盖绑定区5时，保护层去除区还包括与绑定区对应的第一保护层去除区63；在绑定区对应的区域，第一保护层去除区63在衬底基板的正投影落入无机绝缘层去除区47在衬底基板的正投影。
在一些实施例中，如图11所示，对于COF工艺，当无机绝缘层去除区47在衬底基板的正投影覆盖绑定区5时，保护层去除区包括与绑定区对应的第一保护层去除区63；在绑定区对应的区域，第一保护层去除区63在衬底基板的正投影落入无机绝缘层去除区47在衬底基板的正投影。
在一些实施例中，如图10、图11所示，第一保护层去除区63在衬底基 板的正投影落入绑定区5内。
在一些实施例中，如图1所示，触控导电层10包括相互交叉的多个触控感应电极RX和多个触控驱动电极TX；每一触控感应电极RX包括：多个触控感应子电极43，以及连接相邻触控感应子电极43的连接部42；每一触控驱动电极TX包括：多个触控驱动子电极41，以及连接相邻触控驱动子电极41的桥接电极40。在具体实施时，触控感应子电极43以及连接部42一体连接，且触控感应子电极43、连接部42以及触控驱动子电极41同层设置。例如，第一触控导电层或第二触控导电层中的一层包括：触控感应子电极、连接部以及触控驱动子电极；第一触控导电层或第二触控导电层中的另一层包括桥接电极。图1中，触控感应电极RX沿第一方向X延伸，触控驱动电极TX沿第二方向Y延伸，第一方向X与第二方向Y相交，例如第一方向X与第二方向Y垂直。当然，在具体实施时，触控感应电极RX与触控驱动电极TX的位置可以互换。
在具体实施时，如图1所示，触控感应电极RX和触控驱动电极TX均需要与触控信号线44电连接。
在具体实施时，触控信号线用于向对应的触控电极提供驱动信号或者接收对应的触控电极上的感应信号。即与触控感应电极RX电连接的触控信号线接收对应的触控感应电极RX上的感应信号，与触控驱动电极TX电连接的触控信号线用于向对应的触控驱动电极TX提供驱动信号。
需要说明的是，图1中以触控感应子电极和触控驱动子电极为菱形块电极为例进行举例说明。
在具体实施时，触控感应电极以及触控驱动电极例如可以是网格状电极。网格状电极包括多个孔洞。孔洞在衬底基板的正投影与子像素在基底的正投影一一对应。或者，孔洞在衬底基板的正投影对应多个子像素在基底的正投影。.在一些实施例中，子像素发光区在衬底基板的正投影落入孔洞在衬底基板的正投影内。如此，可以避免触控驱动电极、触控感应电极对子像素的出光产生影响，避免影响触控显示面板的正常显示。
在一些实施例中，第一触控导电层、第二触控导电层的材料例如为钛/铝/钛叠层或氧化铟锡/银/氧化铟锡叠层；无机绝缘层例如包括氮化硅；保护层的材料例如包括PI。
本公开实施例提供的一种触控显示装置，触控显示装置包括本公开实施例提供的触控显示面板。
本公开实施例提供的触控显示装置为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有触控显示功能的产品或部件。对于该触控显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不做赘述，也不应作为对本公开的限制。该触控显示装置的实施可以参见上述触控显示面板的实施例，重复之处不再赘述。
在一些实施例中，触控显示装置还包括驱动芯片；驱动芯片在绑定区与绑定电极绑定。
或者，在一些实施例中，触控显示装置还包括驱动芯片以及FPC；驱动芯片与FPC绑定，FPC在绑定区与绑定电极绑定。
本公开实施例提供的一种触控显示母板，如图12所示，触控显示母板包括多个触控显示面板区51以及包围触控显示面板区51的去除区52；
触控显示面板区51包括：本公开实施例提供的触控显示面板；
触控显示面板的封装层在衬底基板的正投影与去除区52互不交叠；触控显示面板的有机绝缘层以及触控显示面板的触控功能层延伸至去除区52；
在至少部分去除区52，无机绝缘层背离衬底基板一侧的膜层与有机绝缘层直接接触。
本公开实施例提供的触控显示母板，在至少部分去除区无机绝缘层背离衬底基板一侧的膜层与有机绝缘层直接接触，即去除至少部分去除区的无机绝缘层，使至少部分去除区触控功能层的无机绝缘层与显示功能层的有机绝缘层不接触。从而可以避免在平坦性较差的去除区出现有机绝缘层与无机绝缘层接触的薄弱区域，避免出现膜层翘起和褶皱以及大面积脱落，还可以避免出现裂纹形成水氧入侵通道，提高产品良率。
在一些实施例中，如图12所示，去除区52包括：位于相邻触控显示面板区51之间的第一切割区55，多个包围触控显示面板区51且与触控显示面板区51相邻的第二切割区53，位于第一切割区55和第二切割区53之间的子去除区54。
在具体实施时，首先沿位于第一切割区的切割线对触控显示母板进行粗切割，将触控显示母板切割成多块。之后再对每一块沿位于第二切割区的切割线切割获得触控显示面板。
在一些实施例中，如图13、图14所示，触控导电层包括：位于子去除区54的对位标记56，对位标记56与有机绝缘层7接触。对位标记56包括第一对位标记57。
需要说明的是，图13为图12中B区域的放大示意图，图14为图13中CC’的截面图。
在具体实施时，如图14所示，第二触控导电层13包括位于子去除区的第一对位标记57；
第一对位标记57与像素定义层27接触。
需要说明的是，本公开实施例提供的显示母板，在制备过程中，在触控功能层形成的对位标记均与有机绝缘层直接接触。
需要说明的是，对于FMLOC触控显示产品，在制作时需要进行曝光、显影、刻蚀、去除光刻胶等图形化工艺。图形化工艺需要通过对位标记进行对位。其中，第一触控导电层进行图形化的对位标记位于显示功能层，一般为第二导电层或阳极层；而触控功能层中的其他膜层则以第一触控导电层作为基底膜层进行对位。
相关技术中，第一触控导电层包括的第二对位标记位于第二无机绝缘层上。由于对位标记位于第一切割区和第二切割区之间的子切割区，且通常第一切割区和第二切割区与子切割区存在段差，容易导致无机绝缘层脱落。当第二无机绝缘层脱落，则会导致第二对位标记随之脱落，无法进行后续对位，导致整个显示母板报废。
本公开实施例提供的触控显示母板，在对第一触控导电层进行图形化工艺后便在该膜层制得第二对位标记，如图15所示，第二对位标记58与像素定义层27接触。这样，在显示母板的制备过程中，可以避免出现第二无机绝缘层脱落，从而避免第二对位标记脱落，保证后续对位顺利进行，提高触控显示母板的制备良率。需要说明的是，进行第二触控导电层的图形化工艺时，第二对位标记也会被刻蚀，因此需要在第二触控导电层制作第一对位标记作为保护层图形化工艺的对位标记。
本公开实施例提供的触控显示母板，第一对位标记与像素定义层之间接触，可以避免出现无机绝缘层脱落，从而避免第一对位标记脱落，保证后续对位顺利进行，提高触控显示母板的制备良率。
需要说明的是，图13中仅是示意出对位标记其中一种可以设置的图案。在具体实施时，对位标记的图案可以根据实际需要进行设置，例如，对位标记56的图案也可以是如图16所示。对位标记56包括沿第二方向Y延伸的条状图案和沿第一方向X延伸的条状图案，沿第二方向Y延伸的条状图案在第二方向Y的长度例如为170微米(μm)～210μm，沿第二方向Y延伸的条状图案在第一方向X的长度例如为20μm～30μm。沿第一方向X延伸的条状图案在第一方向X的长度例如为130μm，沿第一方向X延伸的条状图案在第二方向Y的长度例如为20μm～30μm。
在一些实施例中，无机绝缘层在衬底基板的正投影与去除区至少部分不交叠。
在一些实施例中，无机绝缘层在衬底基板的正投影与去除区互不交叠。即去除区不包括触控功能层的无机绝缘层。
本公开实施例提供的触控显示母板，在第一切割区、第二切割区以及子去除区去除触控功能层的无机绝缘层，可以避免切割导致的膜层剥离的问题。还可以避免在第一切割区、第二切割区进行切割时无机绝缘层发生裂纹形成水氧入侵通道，提高产品良率。
在一些实施例中，触控功能层包括的第一保护层去除区还与去除区对应。 当无机绝缘层在衬底基板的正投影与去除区互不交叠时，去除区对应的第一保护层去除区在衬底基板的正投影落入去除区内。即保护层在衬底基板的正投影与去除区具有交叠，以使保护层覆盖无机绝缘层的边缘，避免无机绝缘层受损。
综上所述，本公开实施例提供的触控显示面板、触控显示装置以及触控显示母板。在未被封装层覆盖的至少部分区域，无机绝缘层背离衬底基板一侧的膜层与有机绝缘层直接接触，即去除至少部分区域的无机绝缘层，使至少部分区域的触控功能层的无机绝缘层与显示功能层的有机绝缘层不接触。从而可以避免在平坦性较差的区域出现有机绝缘层与无机绝缘层接触的薄弱区域，避免出现膜层翘起和褶皱以及大面积脱落，还可以避免出现裂纹形成水氧入侵通道，提高产品良率。
尽管已描述了本发明的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本发明范围的所有变更和修改。
显然，本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明实施例的精神和范围。这样，倘若本发明实施例的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (23)

  1. 一种触控显示面板，其中，所述触控显示面板包括：
    衬底基板，包括：显示区以及包围所述显示区的周边区；
    显示功能层，位于所述衬底基板的一侧，包括：至少一层有机绝缘层，以及位于所述有机绝缘层背离所述衬底基板一侧的封装层；所述封装层在所述衬底基板的正投影覆盖所述显示区以及部分所述周边区；
    触控功能层，位于所述封装层背离所述衬底基板的一侧，包括：触控导电层、与所述触控导电层接触的无机绝缘层、以及保护层；所述触控功能层包括：第一触控导电层，以及位于所述第一触控导电层背离所述显示功能层一侧的第二触控导电层；所述无机绝缘层至少包括：位于所述第一触控导电层和所述第二触控导电层之间的第一无机绝缘层；所述保护层位于所述第二触控导电层背离所述第一无机绝缘层的一侧；在所述封装层在所述衬底基板的正投影未覆盖的至少部分所述周边区，所述有机绝缘层与所述触控导电层或所述保护层直接接触。
  2. 根据权利要求1所述的触控显示面板，其中，所述周边区包括：至少一个扇出区；所述扇出区包括：弯折区；
    所述触控功能层包括至少一个无机绝缘层去除区；
    所述无机绝缘层去除区在所述衬底基板的正投影覆盖所述弯折区。
  3. 根据权利要求2所述的触控显示面板，其中，所述有机绝缘层具有至少一个贯穿其厚度的凹槽；所述凹槽至少位于所述弯折区和所述显示区之间；
    在所述弯折区和所述显示区之间，所述无机绝缘层去除区在所述衬底基板的正投影覆盖所述凹槽。
  4. 根据权利要求3所述的触控显示面板，其中，在所述弯折区和所述显示区之间，所述无机绝缘层去除区在所述衬底基板的正投影覆盖所述凹槽和所述弯折区之间的区域。
  5. 根据权利要求3或4所述的触控显示面板，其中，所述凹槽还位于所 述弯折区背离所述显示区一侧；
    在所述弯折区背离所述显示区一侧，所述无机绝缘层在所述衬底基板的正投影覆盖所述凹槽。
  6. 根据权利要求3或4所述的触控显示面板，其中，所述凹槽还位于所述弯折区背离所述显示区一侧；
    在所述弯折区背离所述显示区一侧，所述无机绝缘层去除区在所述衬底基板的正投影覆盖所述凹槽。
  7. 根据权利要求3～6任一项所述的触控显示面板，其中，所述触控导电层还包括：
    多条第一触控信号线，从所述显示区延伸到所述弯折区靠近所述显示区一侧；
    所述显示功能层还包括：位于所述衬底基板和所述封装层之间的第一导电层，位于所述第一导电层和所述封装层之间的第二导电层；
    所述第一导电层或所述第二导电层包括：
    多条第一连接引线，从所述弯折区和所述显示区之间穿过所述弯折区延伸至所述弯折区背离所述显示区一侧；在所述弯折区和所述显示区之间所述第一连接引线的一端与所述第一触控信号线电连接；
    所述凹槽在衬底基板的正投影与所述第一触控信号线在所述衬底基板的正投影互不交叠。
  8. 根据权利要求7所述的触控显示面板，其中，所述无机绝缘层去除区在所述衬底基板的正投影与所述第一触控信号线在所述衬底基板的正投影互不交叠。
  9. 根据权利要求7或8所述的触控显示面板，其中，所述第一连接引线在所述衬底基板的正投影贯穿所述无机绝缘层去除区。
  10. 根据权利要求3～9任一项所述的触控显示面板，其中，所述显示功能层还包括：
    平坦化层，位于所述第二导电层和所述封装层之间；
    像素定义层，位于所述封装层和所述平坦化层之间；
    所述像素定义层和/或所述平坦化层具有至少一个贯穿其厚度的凹槽。
  11. 根据权利要求3～5任一项所述的触控显示面板，其中，在所述显示区与所述弯折区之间，所述无机绝缘层的边缘与所述凹槽之间的距离大于等于5微米且小于等于40微米。
  12. 根据权利要求3～6任一项所述的触控显示面板，其中，所述凹槽与所述弯折区之间的距离大于等于100微米且小于等于300微米。
  13. 根据权利要求1所述的触控显示面板，其中，所述周边区包括：至少一个扇出区；所述扇出区包括：绑定区；
    所述触控功能层包括至少一个无机绝缘层去除区；
    所述无机绝缘层去除区在所述衬底基板的正投影覆盖所述绑定区。
  14. 根据权利要求13所述的触控显示面板，其中，在所述绑定区，所述第二触控导电层包括：多个第一绑定电极；
    所述有机绝缘层包括平坦化层；所述第一绑定电极与所述平坦化层接触。
  15. 根据权利要求14所述的触控显示面板，其中，所述显示功能层还包括：位于所述平坦化层和所述衬底基板之间的第一导电层，位于所述第一导电层和所述平坦化层之间的第一绝缘层，以及位于所述第一绝缘层和所述平坦化层之间的第二导电层；
    在所述绑定区，所述第一导电层包括与所述第一绑定电极一一对应的第二绑定电极，所述第二导电层包括与所述第二绑定电极一一对应的第三绑定电极；所述第三绑定电极通过贯穿所述第一绝缘层的过孔与所述第二绑定电极连接；所述第一绑定电极通过贯穿所述平坦化层的过孔与所述第三绑定电极连接。
  16. 根据权利要求1～15任一项所述的触控显示面板，其中，所述触控功能层包括至少一个无机绝缘层去除区以及至少一个第一保护层去除区；
    所述第一保护层去除区在所述衬底基板的正投影落入所述无机绝缘层去除区在所述衬底基板的正投影内。
  17. 根据权利要求1～16任一项所述的触控显示面板，其中，所述无机绝缘层仅包括所述第一无机绝缘层；
    所述第一触控导电层与所述封装层接触。
  18. 根据权利要求1～16任一项所述的触控显示面板，其中，所述无机绝缘层还包括位于所述第一触控导电层和所述封装层之间的第二无机绝缘层。
  19. 一种触控显示装置，其中，所述触控显示装置包括根据权利要求1～18任一项所述的触控显示面板。
  20. 一种触控显示母板，其中，所述触控显示母板包括多个触控显示面板区以及包围所述触控显示面板区的去除区；
    所述触控显示面板区包括：根据权利要求1～18任一项所述的触控显示面板；
    所述触控显示面板的封装层在所述衬底基板的正投影与所述去除区互不交叠；所述触控显示面板的有机绝缘层以及所述触控显示面板的触控功能层延伸至所述去除区；
    在至少部分所述去除区，所述无机绝缘层背离所述衬底基板一侧的膜层与所述有机绝缘层直接接触。
  21. 根据权利要求20所述的触控显示母板，其中，所述去除区包括：位于相邻所述触控显示面板区之间的第一切割区，多个包围所述触控显示面板区且与所述触控显示面板区相邻的第二切割区，位于所述第一切割区和所述第二切割区之间的子去除区；
    所述触控导电层包括：位于所述子去除区的对位标记，所述对位标记与所述有机绝缘层接触。
  22. 根据权利要求21所述的触控显示母板，其中，所述有机绝缘层包括：像素定义层；
    所述第二触控导电层包括位于所述子去除区的第一对位标记；所述第一对位标记与所述像素定义层接触。
  23. 根据权利要求20～22任一项所述的触控显示母板，其中，所述无机 绝缘层在所述衬底基板的正投影与所述去除区至少部分不交叠。
PCT/CN2022/074879 2022-01-29 2022-01-29 触控显示面板、触控显示装置、触控显示母板 WO2023142014A1 (zh)

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