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WO2021171370A1 - Substrate work machine - Google Patents

Substrate work machine Download PDF

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Publication number
WO2021171370A1
WO2021171370A1 PCT/JP2020/007492 JP2020007492W WO2021171370A1 WO 2021171370 A1 WO2021171370 A1 WO 2021171370A1 JP 2020007492 W JP2020007492 W JP 2020007492W WO 2021171370 A1 WO2021171370 A1 WO 2021171370A1
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WO
WIPO (PCT)
Prior art keywords
substrate
amount
drive
machine
detector
Prior art date
Application number
PCT/JP2020/007492
Other languages
French (fr)
Japanese (ja)
Inventor
郁雄 高津
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2022502372A priority Critical patent/JP7394955B2/en
Priority to PCT/JP2020/007492 priority patent/WO2021171370A1/en
Publication of WO2021171370A1 publication Critical patent/WO2021171370A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the technology disclosed in this specification relates to a substrate working machine.
  • a board working machine that executes a predetermined work on a board, the board is positioned at a predetermined position in the machine and the work on the board is executed.
  • the board working machine includes a positioning mechanism for positioning the board at a predetermined position in the machine and a driving device for driving the positioning mechanism.
  • a detector that detects the driving amount of the driving device may be installed in the driving device.
  • Japanese Patent Application Laid-Open No. 2003-40427 discloses an example of a component mounting machine for mounting electronic components on a substrate, which is a kind of substrate working machine. In the substrate working machine disclosed in Japanese Patent Application Laid-Open No.
  • the substrate is conveyed into the machine by a conveyor.
  • the conveyor is connected to the drive device, and when the motor body of the drive device rotates, the rotation is transmitted to the conveyor, and the rotation of the conveyor conveys the substrate.
  • the drive device is equipped with a detector that detects the rotation speed of the motor body. By detecting and controlling the rotation speed of the motor body (that is, the driving amount of the driving device) with a detector, the conveyor rotates by a predetermined rotation amount and the substrate is positioned at a predetermined position.
  • the motor body and the detector are housed in the same case.
  • This specification discloses a technique capable of detecting the relative position between the substrate and the working mechanism while realizing space saving of the substrate working machine.
  • the board working machine disclosed in this specification carries the board into the machine and executes the work on the board in the machine.
  • the board work machine is arranged in the machine, a work mechanism that executes work on the board, a positioning mechanism that is placed in the machine and positions the relative position between the board and the work mechanism, and is placed in the machine and moves.
  • a drive device for driving the members and a detector arranged in the machine for detecting the movement amount of at least one of the moving members and the driving members are provided.
  • the positioning mechanism includes a moving member that moves according to the relative positioning between the substrate and the working mechanism.
  • the drive device includes a drive source, a case accommodating the drive source, and a drive member located at least a part outside the case and moving by the drive force generated by the drive source to transmit the drive force to the moving member.
  • the moving amount of at least one of the moving member and the driving member is detected by the detector.
  • the moving member is located outside the case accommodating the drive source, and at least a part of the drive member is located outside the case accommodating the drive source. Therefore, the driving amount of the driving device can be detected outside the case accommodating the driving source of the driving device. Therefore, it is possible to detect the relative position between the substrate and the work mechanism while realizing space saving by downsizing the case.
  • FIG. The figure which shows the schematic structure of the component mounting machine which is an example of the board work machine which concerns on Example 1.
  • FIG. The figure which shows the schematic structure of the board transfer mechanism of a component mounting machine.
  • the block diagram which shows the function of the control device of a component mounting machine.
  • the flowchart which shows an example of the process which corrects the stop position of a circuit board based on the transport amount of a circuit board.
  • the figure which shows the schematic structure of the screen printing machine which is an example of the substrate working machine which concerns on Example 2.
  • FIG. The figure which shows the schematic structure of the positioning mechanism of a screen printing machine.
  • the positioning mechanism may be a substrate transport mechanism that transports the substrate in the transport direction.
  • the driving member may be an output shaft that is rotated by a driving force generated by the driving device.
  • the moving member may be a conveyor belt that conveys the substrate by rotating the output shaft, or a pulley that transmits the driving force transmitted to the output shaft to the conveyor belt.
  • the detector may detect the amount of rotation of the output shaft, pulley or conveyor belt. According to such a configuration, the detector detects the amount of rotation of the output shaft, pulley or conveyor belt of the drive device. Thereby, the relative position between the substrate and the working mechanism can be detected.
  • the detector may be installed on the pulley to detect the amount of rotation of the pulley. According to such a configuration, since there is an originally vacant space in the vicinity of the pulley, it is easy to install a detector for detecting the amount of rotation of the pulley in the space. Therefore, it is possible to detect the relative position between the substrate and the work mechanism while saving space.
  • the board working machine disclosed in this specification may be a component mounting machine for mounting electronic components on a board.
  • the substrate working machine disclosed in this specification may be a printing machine.
  • the working mechanism may include a screen mask.
  • the positioning mechanism may move the substrate or screen mask so as to position the substrate in a predetermined position with respect to the screen mask. According to such a configuration, the positioning mechanism for positioning the substrate with respect to the screen mask can also detect the relative position between the substrate and the screen mask without incorporating a detector in the case of the drive device.
  • the board working machine disclosed in the present specification may further include a control device for controlling the drive device.
  • the control device calculates the amount of deviation of the substrate from the target position with respect to the work mechanism based on the amount of movement detected by the detector, and based on the calculated amount of deviation, the drive device so as to position the substrate at the target position. May be controlled.
  • the substrate can be positioned at an appropriate position with respect to the work mechanism by calculating the amount of deviation of the substrate from the target position with respect to the work mechanism based on the detected movement amount.
  • the board working machine disclosed in the present specification may further include a notification unit for notifying the amount of deviation.
  • the notification unit can notify the operator of the amount of deviation.
  • the component mounting machine 10 is a device for mounting the electronic component 4 on the circuit board 2.
  • the component mounting machine 10 is also referred to as an electronic component mounting device or a chip mounter.
  • the component mounting machine 10 is installed side by side with other board working machines such as a printing machine and a board inspection machine to form a series of mounting lines.
  • the component mounting machine 10 includes a housing 10a, a plurality of component feeders 12 housed in the housing 10a, a feeder holding unit 14, a mounting head 16, a head moving device 18, an imaging device 26, and a substrate. It includes a transport mechanism 30, a control device 22, and a touch panel 24.
  • Each component feeder 12 accommodates a plurality of electronic components 4.
  • the component feeder 12 is detachably attached to the feeder holding portion 14, and supplies the electronic component 4 to the mounting head 16.
  • the specific configuration of the component feeder 12 is not particularly limited.
  • Each component feeder 12 is, for example, a tape-type feeder that accommodates a plurality of electronic components 4 on a winding tape, a tray-type feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. It may be any of the bulk type feeders that randomly accommodates the above. Further, the feeder holding portion 14 may be fixed in the component mounting machine 10 or may be detachable from the component mounting machine 10.
  • the mounting head 16 has a suction nozzle 6 that sucks the electronic component 4.
  • the suction nozzle 6 is detachably attached to the mounting head 16.
  • the mounting head 16 can move the suction nozzle 6 in the Z direction (here, the vertical direction), and causes the suction nozzle 6 to approach and separate from the component feeder 12 and the circuit board 2.
  • the mounting head 16 can suck the electronic component 4 from the component feeder 12 by the suction nozzle 6, and mount the electronic component 4 sucked on the suction nozzle 6 on the circuit board 2.
  • the mounting head 16 is not limited to the one having a single suction nozzle 6, and may have a plurality of suction nozzles 6.
  • the head moving device 18 moves the mounting head 16 between the component feeder 12 and the circuit board 2.
  • the head moving device 18 of this embodiment is an XY robot that moves the moving base 18a in the X and Y directions, and the mounting head 16 is fixed to the moving base 18a.
  • the mounting head 16 is not limited to the one fixed to the moving base 18a, and may be detachably attached to the moving base 18a.
  • the image pickup device 26 is fixed to the moving base 18a and moves integrally with the moving base 18a.
  • the image pickup apparatus 26 includes a camera, a light source for illumination (not shown), and a prism (not shown).
  • the camera is arranged downward and images the upper surface of the circuit board 2.
  • a CCD camera is used as the camera.
  • the illumination light source is composed of LEDs and illuminates the imaging surface (XY plane in this embodiment) of the circuit board 2.
  • the prism aligns the optical axis of the camera with the imaging target.
  • the upper surface of the circuit board 2 is illuminated by the illumination light source, and the reflected light is reflected by the prism and guided to the camera, so that the camera images the upper surface of the circuit board 2.
  • the image data of the image captured by the image pickup device 26 is stored in the memory of the control device 22.
  • the substrate transfer mechanism 30 will be described with reference to FIG. As shown in FIG. 2, the substrate transfer mechanism 30 includes a conveyor belt 32, a drive device 34, an output shaft 36, pulleys 38a and 38b, and a detector 40.
  • the conveyors (32, 32) convey the circuit board 2 in the X direction.
  • the conveyors (32, 32) are arranged at intervals in the Y direction and include a pair of conveyor belts 32 extending in parallel in the X direction.
  • the conveyors (32, 32) receive the circuit board 2 from a component mounting machine (or another board working machine such as a solder printing machine) adjacent to one side, and convey the circuit board 2 to a preset component mounting position. do.
  • the conveyors (32, 32) send the circuit board 2 to the component mounting machine (or another board working machine such as a board inspection machine) adjacent to the other side.
  • the drive device 34 is a drive device (for example, a motor) that drives the conveyor belt 32.
  • the drive device 34 includes a drive source (for example, a rotor and a stator), a case for accommodating the drive source, and an output shaft 36 that is rotationally driven by the drive source.
  • One end of the output shaft 36 is arranged inside the case accommodating the drive source, and the other end of the output shaft 36 is arranged outside the case accommodating the drive source.
  • a pulley 38a is connected to the other end of the output shaft 36, and the driving force of the drive source is transmitted to the conveyor belt 32 via the output shaft 36 and the pulley 38a.
  • the pulleys 38a and 38b are arranged at both ends of the conveyor belt 32.
  • the pulley 38a is arranged on the downstream side (+ X side) in the transport direction, and is connected to the drive device 34 via the output shaft 36.
  • the pulley 38a transmits the driving force of the driving device 34 transmitted via the output shaft 36 to the conveyor belt 32.
  • the conveyor belt 32 is driven by the rotation of the pulley 38a.
  • the pulley 38b is arranged on the upstream side ( ⁇ X side) in the transport direction, and rotates as the conveyor belt 32 is driven.
  • the drive device 34 is connected to each of the pair of conveyor belts 32, and each drive device 34 drives each of the pair of conveyor belts 32.
  • the detector 40 is installed on the pulley 38a and detects the amount of rotation of the pulley 38a. Specifically, the detector 40 is arranged between the pulley 38a and the drive device 34, and detects the amount of rotation of the drive shaft (not shown) of the pulley 38a.
  • the detector may be configured to directly detect the amount of rotation of the pulley. That is, the pulley may be configured as a magnetic ring, and the detector may detect the amount of rotation of the pulley by the magnetic ring.
  • the type of the detector 40 is not particularly limited, but in this embodiment, it is a magnetic encoder that detects the rotation angle of the rotating body by using a magnetic sensor.
  • the detector 40 By detecting the amount of rotation of the pulley 38a with the detector 40, the amount of movement (rotation amount) of the conveyor belt 32 driven via the pulley 38a can be detected. Thereby, the amount of transportation of the circuit board 2 by the conveyor belt 32 can be detected.
  • the detector 40 is connected to the control device 22 (see FIG. 3), and the signal output from the detector 40 is output to the control device 22.
  • the detector 40 is installed on the pulley 38a, the detector is not installed in the case of the drive device 34.
  • a driving device for example, a motor with an encoder
  • the detector is housed in the case of the driving device. Therefore, the size of the case and, by extension, the entire drive unit becomes large.
  • the drive device becomes large, the drive device cannot be installed when the space between the conveyor belt 32 and the housing 10a of the component mounting machine 10 is narrow.
  • a drive device that does not contain a detector is installed in the case to detect the drive amount of the drive device, or a drive device that houses the detector is installed in the case. Either of such a drive device was adopted to secure a space for the operation.
  • the detector 40 since the detector 40 is installed on the pulley 38a, it is possible to avoid a large drive device (specifically, a case for accommodating the drive source) for accommodating the detector. Further, since the pulley 38a and the drive device 34 are connected via the output shaft 36, there is an empty space in the vicinity of the pulley 38a, and the amount of rotation of the pulley 38a is detected in such a space. It is easy to install the detector 40 of. Therefore, in this embodiment, it is possible to detect the amount of transportation of the circuit board 2 by the drive device 34 while saving space in the component mounting machine 10.
  • the control device 22 is configured by using a computer including a memory and a CPU. As shown in FIG. 3, the control device 22 is connected to the image pickup device 26, controls the image pickup device 26, and acquires an image captured by the image pickup device 26. Further, the control device 22 is connected to the drive device 34 and controls the drive device 34. Further, the control device 22 is connected to the detector 40 and acquires the rotation amount of the pulley 38a detected by the detector 40.
  • the touch panel 24 is a display device that provides various information of the component mounting machine 10 to the operator, and is an input device that receives instructions and information from the operator.
  • the touch panel 24 is connected to the control device 22, and is determined based on the difference between the stop position and the target position of the circuit board 2 calculated from the rotation amount of the pulley 38a detected by the detector 40, and the difference.
  • the error to be displayed is displayed.
  • the touch panel 24 is an example of a "notifying unit".
  • the component mounting machine 10 drives the conveyor belt 32 to convey the circuit board 2 into the component mounting machine 10.
  • a mark for position detection (not shown) is provided on the upper surface (+ Z direction) of the circuit board 2, and when the circuit board 2 is conveyed into the component mounting machine 10, it is positioned at a preset imaging position. The mark is imaged by the image pickup device 26. Then, the position of the mark is detected from the captured image, and the deviation between the stop position of the circuit board 2 and the target position is calculated from the detected position of the mark. By adjusting the positioning position of the mounting head 16 based on the calculated deviation amount, the mounting head 16 can mount the component at a desired position on the circuit board 2.
  • the circuit board 2 may stop at a position where the mark is not imaged. Therefore, in this embodiment, the movement amount of the conveyor belt 32 (that is, the position of the circuit board 2) is detected from the rotation amount of the pulley 38a before the position detection mark is imaged, and the target position of the circuit board 2 is detected. The amount of deviation from the circuit board 2 is calculated and corrected so that the circuit board 2 is positioned at the target position.
  • the movement amount of the conveyor belt 32 that is, the position of the circuit board 2
  • the amount of deviation from the circuit board 2 is calculated and corrected so that the circuit board 2 is positioned at the target position.
  • the control device 22 drives the drive device 34 by a predetermined drive amount and acquires the rotation amount of the pulley 38a (S12).
  • the predetermined drive amount is a drive amount preset so as to drive the circuit board 2 to the target position.
  • the driving device 34 is driven by a predetermined driving amount, the driving force is transmitted to the conveyor belt 32 via the output shaft 36 and the pulley 38a, and the circuit board 2 is conveyed.
  • the control device 22 acquires a detection signal from the detector 40 while driving the drive device 34 by a predetermined drive amount in step S12. As a result, the amount of rotation of the pulley 38a while driving the drive device 34 by a predetermined amount in step S12 is detected.
  • the control device 22 calculates the amount of transport of the circuit board 2 based on the detection signal from the detector 40 acquired in step S12 (S14).
  • step S12 the amount of rotation of the pulley 38a while driving the drive device 34 by a predetermined amount of drive is detected.
  • the conveyor belt 32 rotates according to the rotation of the pulley 38a, and the circuit board 2 is conveyed. Therefore, the amount of rotation of the conveyor belt 32, that is, the amount of transportation of the circuit board 2, is calculated from the amount of rotation of the pulley 38a detected by the detector 40. Thereby, the actual stop position of the circuit board 2 can be specified.
  • control device 22 calculates the difference (deviation amount) between the stop position and the target position based on the transfer amount of the circuit board 2 calculated in step S14 (S16). Then, it is determined whether or not the difference between the stop position and the target position calculated in step S16 is within a predetermined range (S18). If the amount of deviation between the stop position and the target position is large, there is a high possibility that some problem has occurred in the substrate transfer mechanism 30. Examples of the malfunction of the substrate transport mechanism 30 include a failure of the drive device 34 and a breakage of the conveyor belt 32. In such a case, work by an operator is required.
  • the control device 22 displays an error on the touch panel 24 (S20), causing an abnormality in the operator. Notify that there is a possibility. Further, the control device 22 also displays the difference between the stop position and the target position calculated in step S16 on the touch panel 24 (S30), and ends the process.
  • the control device 22 sets the transport amount calculated in step S14 as the preset first transport amount. It is determined whether or not there is less (S22).
  • the first transport amount is the transport amount when the circuit board 2 is transported to the target position.
  • the control device 22 drives the drive device 34 so as to transport the circuit board 2 to the downstream side (+ X side) in the transport direction by the difference calculated in step S16 (S24). That is, the drive device 34 is driven in the same direction as when the circuit board 2 is carried in and out.
  • the difference between the stop position and the target position can be reduced, and the circuit board 2 can be positioned closer to the target position.
  • the control device 22 drives the drive device 34 so as to transport the circuit board 2 to the upstream side (-X side) in the transport direction by the difference calculated in step S16 (S28). That is, the drive device 34 is driven in the opposite direction (reverse rotation) to the case where the circuit board 2 is carried in and out. As a result, the difference between the stop position and the target position can be reduced, and the circuit board 2 can be positioned closer to the target position.
  • step S26 when the calculated transport amount matches the first transport amount (YES in step S26), the calculated transport amount is neither more nor less than the predetermined transport amount, and the deviation between the stop position and the target position. There is almost no. Therefore, the process proceeds to step S30 without transporting the circuit board 2.
  • control device 22 displays the difference between the stop position and the target position calculated in step S16 on the touch panel 24 (S30). Thereby, when the driving device 34 is driven by a predetermined driving amount, it is possible to notify the operator how much the circuit board 2 stops at a position deviated from the target position.
  • the detector 40 is installed on the pulley 38a, but the configuration is not limited to this. As long as the amount of transportation of the circuit board 2 by the drive device 34 can be detected, the detector may be installed on another member to which the drive force of the drive device 34 is transmitted. For example, the detector may be installed on the pulley 38b to detect the amount of rotation of the pulley 38b, may be installed on the output shaft 36 to detect the amount of rotation of the output shaft 36, or may be mounted on the conveyor belt 32. It may be installed and detect the amount of rotation of the conveyor belt 32.
  • the detector When the detector is installed so as to detect the amount of rotation of the pulleys 38a and 38b and the conveyor belt 32, for example, even if slippage occurs between the output shaft 36 and the pulley 38a, the circuit board 2 is conveyed. The amount can be detected accurately.
  • the detector 40 may be installed only on the pulley 38a (for example, the conveyor belt 32 on the upper side (+ Y side) of the paper surface in FIG. 2) connected to one of the pair of conveyor belts 32, or the pair. It may be installed on both of the conveyor belts 32 of the above. When the detector 40 is installed on both of the pair of conveyor belts 32, the driving amount of the two driving devices 34 can be detected, so that the conveyed amount of the circuit board 2 can be detected more accurately.
  • the detector 40 is installed in the board transfer mechanism 30 of the component mounting machine 10 so as to detect the transfer amount of the circuit board 2, but the present invention is not limited to such a configuration.
  • the configuration of this embodiment can be applied to any type of substrate working machine as long as it has a substrate conveying mechanism 30 that conveys the circuit board 2 into the machine.
  • the screen printing machine 60 which is a kind of board working machine
  • a detector is installed in the positioning mechanism between the screen mask and the circuit board 2.
  • the screen printing machine 60 will be described with reference to FIGS. 5 to 7.
  • the screen printing machine 60 is a device that receives the circuit board 2 from the upstream side of the mounting line, screen-prints the desired solder on the circuit board 2, and then sends the circuit board 2 to the downstream side of the mounting line.
  • the screen printing machine 60 includes a housing 60a, a screen mask 62 housed in the housing 60a, a squeegee device 64, a squeegee moving device 66, a substrate transport mechanism 70, and a substrate positioning mechanism 72.
  • the screen mask 62 is a metal plate-shaped member formed in a rectangular shape, and its four sides are supported by a support frame (not shown) whose position is fixed with respect to the base of the screen printing machine 60. ..
  • An opening is formed in the central portion of the screen mask 62 corresponding to the solder pattern (printing pattern) to be printed on the circuit board 2.
  • the squeegee device 64 can be moved in the Z direction (here, the vertical direction), and can be moved in the XY direction by the squeegee moving device 66.
  • the squeegee device 64 squeezes the solder supplied from the solder supply device (not shown) to the upper surface of the screen mask 62 on the print pattern.
  • the board transport mechanism 70 transports the circuit board 2 in the X direction.
  • the substrate transfer mechanism 70 carries the circuit board 2 into the screen printing machine 60, and carries out the circuit board 2 on which solder is printed on the upper surface to the outside of the screen printing machine 60. Since the substrate transfer mechanism 70 has substantially the same configuration as the substrate transfer mechanism 30 of the component mounting machine 10 of the first embodiment, detailed description thereof will be omitted. Further, although omitted in this embodiment, a detector similar to that of the substrate transport mechanism 30 of the first embodiment is attached to the substrate transport mechanism 70 (for example, an output shaft or a pulley connected to a drive device for driving a conveyor belt). It may be provided.
  • the substrate positioning mechanism 72 will be described with reference to FIGS. 6 and 7.
  • the substrate positioning mechanism 72 positions the circuit board 2 carried into the screen printing machine 60 by the substrate transport mechanism 70 at a predetermined position with respect to the screen mask 62.
  • the board positioning mechanism 72 includes an elevating mechanism 74, one X-axis feed screw mechanism 76, and two Y-axis feed screw mechanisms 78 and 80.
  • the elevating mechanism 74 supports the substrate transport mechanism 70, and the substrate transport mechanism 70 can be moved in the Z direction by driving an actuator (not shown) such as a motor.
  • the X-axis feed screw mechanism 76 moves the elevating mechanism 74 in the X direction (left-right direction in the figure) by the screw 76a which is rotationally driven by the drive device 134 (shown in FIG. 7).
  • the substrate transport mechanism 70 and the circuit board 2 supported by the elevating mechanism 74 also move in the X direction.
  • the two Y-axis feed screw mechanisms 78 and 80 rotate the screws 78a and 80a in the same direction by a drive device (not shown) provided for each, thereby moving the elevating mechanism 74 in the Y direction (vertical direction in the figure). Move.
  • the circuit board 2 supported by the elevating mechanism 74 also moves in the Y direction.
  • the two Y-axis feed screw mechanisms 78 and 80 rotate the elevating mechanism 74 by rotating the screws 78a and 80a in opposite directions.
  • the circuit board 2 supported by the elevating mechanism 74 also rotates.
  • the screw 76a of the X-axis feed screw mechanism 76 is connected to the output shaft 136 of the drive device 134 via the coupling 82. That is, the driving force of the driving device 134 is transmitted to the coupling 82 via the output shaft 136, and is transmitted from the coupling 82 to the screw 76a.
  • a detector 140 is installed in the coupling 82, and the detector 140 detects the amount of rotation of the coupling 82. By detecting the amount of rotation of the coupling 82 with the detector 140, the amount of rotation of the screw 76a driven via the coupling 82 can be detected. Thereby, the amount of movement of the circuit board 2 in the X direction with respect to the screen mask 62 can be detected.
  • connection between the Y-axis feed screw mechanisms 78 and 80 and the drive device has the same configuration as the connection between the X-axis feed screw mechanism 76 and the drive device 134, detailed description thereof will be omitted.
  • the detector 140 since the detector 140 is installed in the coupling 82, the movement amount of the circuit board 2 can be detected without installing the detector in the case of the drive device 134. Therefore, the amount of movement of the circuit board 2 by the drive device 134 can be detected while saving space in the screen printing machine 60.
  • the detector 140 is installed on the coupling 82.
  • the detector may be installed on the output shaft 136 to detect the amount of rotation of the output shaft 136.
  • the circuit board 2 is moved with respect to the screen mask 62, but for example, the screen mask 62 may be moved with respect to the circuit board 2. Also in this case, by installing the detector in the positioning mechanism of the screen mask 62 in the same manner as described above, the movement amount of the screen mask 62 can be detected without installing the detector in the case of the drive device.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

In the present invention, a substrate is loaded into a substrate work machine and work is performed on the substrate within the machine. The substrate work machine comprises: a work mechanism for performing work on the substrate, the work mechanism being disposed within the machine; a positioning mechanism for positioning the substrate and the work mechanism relative to each other, the positioning mechanism being disposed in the machine; a drive device for driving a moving member, the drive device being disposed in the machine; and a detector for detecting the movement amount of the moving member and/or a drive member, the detector being disposed in the machine. The positioning mechanism is provided with the moving member, which moves according to the relative positioning between the substrate and the work mechanism. The drive device is provided with: a drive source; a case for housing the drive source; and the drive member, which moves by the drive force generated by the drive source and transmits the drive force to the moving member, the drive member being at least partially positioned outside the case.

Description

基板作業機Board work machine
　本明細書に開示する技術は、基板作業機に関する。 The technology disclosed in this specification relates to a substrate working machine.
　基板に対して所定の作業を実行する基板作業機では、機内の所定の位置に基板が位置決めされ、基板への作業が実行される。基板作業機は、基板を機内の所定の位置に位置決めする位置決め機構と、位置決め機構を駆動する駆動装置を備えている。この種の基板作業機では、基板を精度よく所定の位置に位置決めするために、駆動装置内に駆動装置の駆動量を検出する検出器が設置されることがある。例えば、特開２００３－４０４２７号公報には、基板作業機の一種である、基板に電子部品を実装する部品実装機の一例が開示されている。特開２００３－４０４２７号公報に開示される基板作業機では、コンベアにより基板が機内に搬送される。コンベアは駆動装置に接続されており、駆動装置のモータ本体部が回転すると、その回転がコンベアに伝達され、コンベアが回転することで基板が搬送される。駆動装置には、モータ本体部の回転数を検出する検出器が設置されている。モータ本体部の回転数（すなわち、駆動装置の駆動量）を検出器で検出して制御することで、コンベアが所定の回転量だけ回転し、基板が所定の位置に位置決めされる。上記の基板作業気では、モータ本体部と検出器とが同一のケース内に収容されている。 In a board working machine that executes a predetermined work on a board, the board is positioned at a predetermined position in the machine and the work on the board is executed. The board working machine includes a positioning mechanism for positioning the board at a predetermined position in the machine and a driving device for driving the positioning mechanism. In this type of substrate working machine, in order to accurately position the substrate at a predetermined position, a detector that detects the driving amount of the driving device may be installed in the driving device. For example, Japanese Patent Application Laid-Open No. 2003-40427 discloses an example of a component mounting machine for mounting electronic components on a substrate, which is a kind of substrate working machine. In the substrate working machine disclosed in Japanese Patent Application Laid-Open No. 2003-40427, the substrate is conveyed into the machine by a conveyor. The conveyor is connected to the drive device, and when the motor body of the drive device rotates, the rotation is transmitted to the conveyor, and the rotation of the conveyor conveys the substrate. The drive device is equipped with a detector that detects the rotation speed of the motor body. By detecting and controlling the rotation speed of the motor body (that is, the driving amount of the driving device) with a detector, the conveyor rotates by a predetermined rotation amount and the substrate is positioned at a predetermined position. In the above-mentioned board work, the motor body and the detector are housed in the same case.
　上記の基板作業機では、駆動装置のケース内に、モータ本体部と検出器が収容されているため、駆動装置全体の大きさが大きくなる。このため、駆動装置の設置場所に十分なスペースが確保できない場合には、検出器が一体的に組み込まれている駆動装置を設置することができなかった。 In the above-mentioned board work machine, since the motor main body and the detector are housed in the case of the drive device, the size of the entire drive device becomes large. Therefore, if sufficient space cannot be secured for the installation location of the drive device, it is not possible to install the drive device in which the detector is integrally incorporated.
　本明細書は、基板作業機の省スペース化を実現しながら、基板と作業機構との相対的な位置を検出可能な技術を開示する。 This specification discloses a technique capable of detecting the relative position between the substrate and the working mechanism while realizing space saving of the substrate working machine.
　本明細書に開示する基板作業機は、機内に基板を搬入して、機内で基板に対して作業を実行する。基板作業機は、機内に配置され、基板に対して作業を実行する作業機構と、機内に配置され、基板と作業機構との相対的な位置を位置決めする位置決め機構と、機内に配置され、移動部材を駆動する駆動装置と、機内に配置され、移動部材及び駆動部材の少なくとも一方の移動量を検出する検出器と、を備える。位置決め機構は、基板と作業機構との相対的な位置決めに応じて移動する移動部材を備える。駆動装置は、駆動源と、駆動源を収容するケースと、ケース外に少なくとも一部が位置し、駆動源で発生する駆動力によって移動して駆動力を移動部材に伝達する駆動部材を備える。 The board working machine disclosed in this specification carries the board into the machine and executes the work on the board in the machine. The board work machine is arranged in the machine, a work mechanism that executes work on the board, a positioning mechanism that is placed in the machine and positions the relative position between the board and the work mechanism, and is placed in the machine and moves. A drive device for driving the members and a detector arranged in the machine for detecting the movement amount of at least one of the moving members and the driving members are provided. The positioning mechanism includes a moving member that moves according to the relative positioning between the substrate and the working mechanism. The drive device includes a drive source, a case accommodating the drive source, and a drive member located at least a part outside the case and moving by the drive force generated by the drive source to transmit the drive force to the moving member.
　上記の基板作業機では、検出器により移動部材及び駆動部材の少なくとも一方の移動量を検出する。移動部材は、駆動源を収容するケースの外部に位置し、また、駆動部材の少なくとも一部は、駆動源を収容するケースの外部に位置している。このため、駆動装置の駆動源を収容するケースの外部において、駆動装置の駆動量を検出することができる。このため、ケースの小型化による省スペース化を実現しながら基板と作業機構との相対的な位置を検出することができる。 In the above-mentioned board working machine, the moving amount of at least one of the moving member and the driving member is detected by the detector. The moving member is located outside the case accommodating the drive source, and at least a part of the drive member is located outside the case accommodating the drive source. Therefore, the driving amount of the driving device can be detected outside the case accommodating the driving source of the driving device. Therefore, it is possible to detect the relative position between the substrate and the work mechanism while realizing space saving by downsizing the case.
実施例１に係る基板作業機の一例である、部品実装機の概略構成を示す図。The figure which shows the schematic structure of the component mounting machine which is an example of the board work machine which concerns on Example 1. FIG. 部品実装機の基板搬送機構の概略構成を示す図。The figure which shows the schematic structure of the board transfer mechanism of a component mounting machine. 部品実装機の制御装置の機能を示すブロック図。The block diagram which shows the function of the control device of a component mounting machine. 回路基板の搬送量に基づいて、回路基板の停止位置を補正する処理の一例を示すフローチャート。The flowchart which shows an example of the process which corrects the stop position of a circuit board based on the transport amount of a circuit board. 実施例２に係る基板作業機の一例である、スクリーン印刷機の概略構成を示す図。The figure which shows the schematic structure of the screen printing machine which is an example of the substrate working machine which concerns on Example 2. FIG. スクリーン印刷機の位置決め機構の概略構成を示す図。The figure which shows the schematic structure of the positioning mechanism of a screen printing machine. Ｘ軸送りねじ機構と駆動装置の構成を示す図。The figure which shows the structure of the X-axis feed screw mechanism and the drive device.
　以下に説明する実施例の主要な特徴を列記しておく。なお、以下に記載する技術要素は、それぞれ独立した技術要素であって、単独であるいは各種の組合せによって技術的有用性を発揮するものであり、出願時の請求項に記載の組合せに限定されるものではない。 The main features of the examples described below are listed. The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are limited to the combinations described in the claims at the time of filing. It's not a thing.
　本明細書に開示する基板作業機では、位置決め機構は、基板を搬送方向に搬送する基板搬送機構であってもよい。駆動部材は、当該駆動装置が発生する駆動力によって回転する出力軸であってもよい。移動部材は、出力軸が回転することによって基板を搬送するコンベアベルト又は出力軸に伝達される駆動力をコンベアベルトに伝達するプーリであってもよい。検出器は、出力軸、プーリ又はコンベアベルトの回転量を検出してもよい。このような構成によると、検出器により駆動装置の出力軸、プーリ又はコンベアベルトの回転量を検出する。これにより、基板と作業機構との相対的な位置を検出することができる。 In the substrate working machine disclosed in the present specification, the positioning mechanism may be a substrate transport mechanism that transports the substrate in the transport direction. The driving member may be an output shaft that is rotated by a driving force generated by the driving device. The moving member may be a conveyor belt that conveys the substrate by rotating the output shaft, or a pulley that transmits the driving force transmitted to the output shaft to the conveyor belt. The detector may detect the amount of rotation of the output shaft, pulley or conveyor belt. According to such a configuration, the detector detects the amount of rotation of the output shaft, pulley or conveyor belt of the drive device. Thereby, the relative position between the substrate and the working mechanism can be detected.
　本明細書に開示する基板作業機では、検出器は、プーリに設置され、プーリの回転量を検出してもよい。このような構成によると、プーリ近傍には元々空いている空間が存在するため、その空間にプーリの回転量を検出するための検出器を設置しやすい。このため、省スペース化を実現しながら、基板と作業機構との相対的な位置を検出することができる。 In the substrate working machine disclosed in the present specification, the detector may be installed on the pulley to detect the amount of rotation of the pulley. According to such a configuration, since there is an originally vacant space in the vicinity of the pulley, it is easy to install a detector for detecting the amount of rotation of the pulley in the space. Therefore, it is possible to detect the relative position between the substrate and the work mechanism while saving space.
　本明細書に開示する基板作業機は、電子部品を基板に実装する部品実装機であってもよい。 The board working machine disclosed in this specification may be a component mounting machine for mounting electronic components on a board.
　本明細書に開示する基板作業機は、印刷機であってもよい。作業機構は、スクリーンマスクを備えていてもよい。位置決め機構は、スクリーンマスクに対して基板を所定の位置に位置決めするように基板又はスクリーンマスクを移動させてもよい。このような構成によると、基板をスクリーンマスクに対して位置決めする位置決め機構についても、駆動装置のケース内に検出器を組み込むことなく基板とスクリーンマスクとの相対的な位置を検出することができる。 The substrate working machine disclosed in this specification may be a printing machine. The working mechanism may include a screen mask. The positioning mechanism may move the substrate or screen mask so as to position the substrate in a predetermined position with respect to the screen mask. According to such a configuration, the positioning mechanism for positioning the substrate with respect to the screen mask can also detect the relative position between the substrate and the screen mask without incorporating a detector in the case of the drive device.
　本明細書に開示する基板作業機は、駆動装置を制御する制御装置をさらに備えていてもよい。制御装置は、検出器で検出された移動量に基づいて、作業機構に対する基板の目標位置からのずれ量を算出し、算出したずれ量に基づいて、基板を目標位置に位置決めするように駆動装置を制御してもよい。このような構成によると、検出された移動量に基づいて、作業機構に対する基板の目標位置からのずれ量を算出することにより、基板を作業機構に対して適切な位置に位置決めすることができる。 The board working machine disclosed in the present specification may further include a control device for controlling the drive device. The control device calculates the amount of deviation of the substrate from the target position with respect to the work mechanism based on the amount of movement detected by the detector, and based on the calculated amount of deviation, the drive device so as to position the substrate at the target position. May be controlled. According to such a configuration, the substrate can be positioned at an appropriate position with respect to the work mechanism by calculating the amount of deviation of the substrate from the target position with respect to the work mechanism based on the detected movement amount.
　本明細書に開示する基板作業機は、ずれ量を報知する報知部をさらに備えていてもよい。このような構成によると、報知部により作業者にずれ量を報知できる。 The board working machine disclosed in the present specification may further include a notification unit for notifying the amount of deviation. According to such a configuration, the notification unit can notify the operator of the amount of deviation.
（実施例１）
　以下、本実施例に係る基板作業機について説明する。ここで、図１～図３を参照して、基板作業機の一例として、部品実装機１０について説明する。部品実装機１０は、回路基板２に電子部品４を実装する装置である。部品実装機１０は、電子部品装着装置やチップマウンタとも称される。通常、部品実装機１０は、印刷機及び基板検査機といった他の基板作業機と共に併設され、一連の実装ラインを構成する。 (Example 1)
Hereinafter, the substrate working machine according to this embodiment will be described. Here, the component mounting machine 10 will be described as an example of the board working machine with reference to FIGS. 1 to 3. The component mounting machine 10 is a device for mounting the electronic component 4 on the circuit board 2. The component mounting machine 10 is also referred to as an electronic component mounting device or a chip mounter. Usually, the component mounting machine 10 is installed side by side with other board working machines such as a printing machine and a board inspection machine to form a series of mounting lines.
　図１に示すように、部品実装機１０は、筐体１０ａと、筐体１０ａに収容される複数の部品フィーダ１２、フィーダ保持部１４、装着ヘッド１６、ヘッド移動装置１８、撮像装置２６、基板搬送機構３０、制御装置２２及びタッチパネル２４を備える。各々の部品フィーダ１２は、複数の電子部品４を収容している。部品フィーダ１２は、フィーダ保持部１４に着脱可能に取り付けられ、装着ヘッド１６へ電子部品４を供給する。部品フィーダ１２の具体的な構成は特に限定されない。各々の部品フィーダ１２は、例えば、巻テープ上に複数の電子部品４を収容するテープ式フィーダ、トレイ上に複数の電子部品４を収容するトレイ式フィーダ、又は、容器内に複数の電子部品４をランダムに収容するバルク式フィーダのいずれであってもよい。また、フィーダ保持部１４は、部品実装機１０において固定されたものであってもよいし、部品実装機１０に対して着脱可能なものであってもよい。 As shown in FIG. 1, the component mounting machine 10 includes a housing 10a, a plurality of component feeders 12 housed in the housing 10a, a feeder holding unit 14, a mounting head 16, a head moving device 18, an imaging device 26, and a substrate. It includes a transport mechanism 30, a control device 22, and a touch panel 24. Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding portion 14, and supplies the electronic component 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 is, for example, a tape-type feeder that accommodates a plurality of electronic components 4 on a winding tape, a tray-type feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. It may be any of the bulk type feeders that randomly accommodates the above. Further, the feeder holding portion 14 may be fixed in the component mounting machine 10 or may be detachable from the component mounting machine 10.
　装着ヘッド１６は、電子部品４を吸着する吸着ノズル６を有する。吸着ノズル６は、装着ヘッド１６に着脱可能に取り付けられている。装着ヘッド１６は、吸着ノズル６をＺ方向（ここでは鉛直方向）に移動可能であり、部品フィーダ１２や回路基板２に対して、吸着ノズル６を接近及び離反させる。装着ヘッド１６は、部品フィーダ１２から電子部品４を吸着ノズル６によって吸着すると共に、吸着ノズル６に吸着された電子部品４を回路基板２上に装着することができる。なお、装着ヘッド１６は、単一の吸着ノズル６を有するものに限られず、複数の吸着ノズル６を有するものであってもよい。 The mounting head 16 has a suction nozzle 6 that sucks the electronic component 4. The suction nozzle 6 is detachably attached to the mounting head 16. The mounting head 16 can move the suction nozzle 6 in the Z direction (here, the vertical direction), and causes the suction nozzle 6 to approach and separate from the component feeder 12 and the circuit board 2. The mounting head 16 can suck the electronic component 4 from the component feeder 12 by the suction nozzle 6, and mount the electronic component 4 sucked on the suction nozzle 6 on the circuit board 2. The mounting head 16 is not limited to the one having a single suction nozzle 6, and may have a plurality of suction nozzles 6.
　ヘッド移動装置１８は、部品フィーダ１２と回路基板２との間で装着ヘッド１６を移動させる。一例ではあるが、本実施例のヘッド移動装置１８は、移動ベース１８ａをＸ方向及びＹ方向に移動させるＸＹロボットであり、移動ベース１８ａに対して装着ヘッド１６が固定されている。なお、装着ヘッド１６は、移動ベース１８ａに固定されるものに限られず、移動ベース１８ａに着脱可能に取り付けられるものであってもよい。 The head moving device 18 moves the mounting head 16 between the component feeder 12 and the circuit board 2. As an example, the head moving device 18 of this embodiment is an XY robot that moves the moving base 18a in the X and Y directions, and the mounting head 16 is fixed to the moving base 18a. The mounting head 16 is not limited to the one fixed to the moving base 18a, and may be detachably attached to the moving base 18a.
　撮像装置２６は、移動ベース１８ａに固定されており、移動ベース１８ａと一体的に移動する。撮像装置２６は、カメラと、照明用光源（図示省略）と、プリズム（図示省略）を備える。カメラは、下方に向かって配置されており、回路基板２の上面を撮像する。カメラには、例えばＣＣＤカメラが用いられる。照明用光源は、ＬＥＤにより構成されており、回路基板２の撮像面（本実施例ではＸＹ平面）を照らす。プリズムは、カメラの光軸を撮像対象に合わせる。照明用光源により回路基板２の上面が照らされ、その反射光がプリズムで反射してカメラに導かれることで、カメラは回路基板２の上面を撮像する。撮像装置２６によって撮像された画像の画像データは、制御装置２２のメモリに記憶される。 The image pickup device 26 is fixed to the moving base 18a and moves integrally with the moving base 18a. The image pickup apparatus 26 includes a camera, a light source for illumination (not shown), and a prism (not shown). The camera is arranged downward and images the upper surface of the circuit board 2. As the camera, for example, a CCD camera is used. The illumination light source is composed of LEDs and illuminates the imaging surface (XY plane in this embodiment) of the circuit board 2. The prism aligns the optical axis of the camera with the imaging target. The upper surface of the circuit board 2 is illuminated by the illumination light source, and the reflected light is reflected by the prism and guided to the camera, so that the camera images the upper surface of the circuit board 2. The image data of the image captured by the image pickup device 26 is stored in the memory of the control device 22.
　図２を参照して、基板搬送機構３０について説明する。図２に示すように、基板搬送機構３０は、コンベアベルト３２と、駆動装置３４と、出力軸３６と、プーリ３８ａ、３８ｂと、検出器４０を備えている。 The substrate transfer mechanism 30 will be described with reference to FIG. As shown in FIG. 2, the substrate transfer mechanism 30 includes a conveyor belt 32, a drive device 34, an output shaft 36, pulleys 38a and 38b, and a detector 40.
　コンベア（３２、３２）は、回路基板２をＸ方向へ搬送する。コンベア（３２、３２）は、Ｙ方向に間隔を空けて配置され、Ｘ方向に平行に伸びる一対のコンベアベルト３２を備えている。コンベア（３２、３２）は、一方側に隣接する部品実装機（又は、はんだ印刷機等の他の基板作業機）から回路基板２を受け取り、予め設定された部品実装位置まで回路基板２を搬送する。回路基板２に対する電子部品４の実装が完了すると、コンベア（３２、３２）は、他方側に隣接する部品実装機（又は、基板検査機等の他の基板作業機）へ回路基板２を送り出す。 The conveyors (32, 32) convey the circuit board 2 in the X direction. The conveyors (32, 32) are arranged at intervals in the Y direction and include a pair of conveyor belts 32 extending in parallel in the X direction. The conveyors (32, 32) receive the circuit board 2 from a component mounting machine (or another board working machine such as a solder printing machine) adjacent to one side, and convey the circuit board 2 to a preset component mounting position. do. When the mounting of the electronic component 4 on the circuit board 2 is completed, the conveyors (32, 32) send the circuit board 2 to the component mounting machine (or another board working machine such as a board inspection machine) adjacent to the other side.
　駆動装置３４は、コンベアベルト３２を駆動する駆動装置（例えば、モータ）である。駆動装置３４は、駆動源（例えば、ロータとステータ）と、駆動源を収容するケースと、駆動源によって回転駆動する出力軸３６を備えている。出力軸３６の一端は、駆動源を収容するケースの内部に配置され、出力軸３６の他端は、駆動源を収容するケースの外部に配置されている。出力軸３６の他端にはプーリ３８ａが接続されており、駆動源の駆動力は、出力軸３６及びプーリ３８ａを介してコンベアベルト３２に伝達される。プーリ３８ａ、３８ｂは、コンベアベルト３２の両端に配置されている。プーリ３８ａは、搬送方向の下流側（＋Ｘ側）に配置されており、出力軸３６を介して駆動装置３４に接続している。プーリ３８ａは、出力軸３６を介して伝達される駆動装置３４の駆動力をコンベアベルト３２に伝達する。プーリ３８ａが回転することにより、コンベアベルト３２が駆動される。プーリ３８ｂは、搬送方向の上流側（－Ｘ側）に配置されており、コンベアベルト３２の駆動に伴い回転する。駆動装置３４は、一対のコンベアベルト３２のそれぞれに接続されており、各駆動装置３４が一対のコンベアベルト３２をそれぞれ駆動する。 The drive device 34 is a drive device (for example, a motor) that drives the conveyor belt 32. The drive device 34 includes a drive source (for example, a rotor and a stator), a case for accommodating the drive source, and an output shaft 36 that is rotationally driven by the drive source. One end of the output shaft 36 is arranged inside the case accommodating the drive source, and the other end of the output shaft 36 is arranged outside the case accommodating the drive source. A pulley 38a is connected to the other end of the output shaft 36, and the driving force of the drive source is transmitted to the conveyor belt 32 via the output shaft 36 and the pulley 38a. The pulleys 38a and 38b are arranged at both ends of the conveyor belt 32. The pulley 38a is arranged on the downstream side (+ X side) in the transport direction, and is connected to the drive device 34 via the output shaft 36. The pulley 38a transmits the driving force of the driving device 34 transmitted via the output shaft 36 to the conveyor belt 32. The conveyor belt 32 is driven by the rotation of the pulley 38a. The pulley 38b is arranged on the upstream side (−X side) in the transport direction, and rotates as the conveyor belt 32 is driven. The drive device 34 is connected to each of the pair of conveyor belts 32, and each drive device 34 drives each of the pair of conveyor belts 32.
　検出器４０は、プーリ３８ａに設置され、プーリ３８ａの回転量を検出する。詳細には、検出器４０は、プーリ３８ａと駆動装置３４との間に配置され、プーリ３８ａの駆動軸（図示省略）の回転量を検出する。なお、検出器は、プーリの回転量を直接検出するように構成されていてもよい。すなわち、プーリを磁気リングとして構成し、検出器は、磁気リングによってプーリの回転量を検出してもよい。検出器４０の種類は特に限定されないが、本実施例では、磁気センサを利用して回転体の回転角を検出する磁気エンコーダである。検出器４０でプーリ３８ａの回転量を検出することによって、プーリ３８ａを介して駆動されたコンベアベルト３２の移動量（回転量）を検出することができる。これにより、コンベアベルト３２による回路基板２の搬送量を検出することができる。検出器４０は、制御装置２２に接続されており（図３参照）、検出器４０から出力される信号は、制御装置２２に出力される。 The detector 40 is installed on the pulley 38a and detects the amount of rotation of the pulley 38a. Specifically, the detector 40 is arranged between the pulley 38a and the drive device 34, and detects the amount of rotation of the drive shaft (not shown) of the pulley 38a. The detector may be configured to directly detect the amount of rotation of the pulley. That is, the pulley may be configured as a magnetic ring, and the detector may detect the amount of rotation of the pulley by the magnetic ring. The type of the detector 40 is not particularly limited, but in this embodiment, it is a magnetic encoder that detects the rotation angle of the rotating body by using a magnetic sensor. By detecting the amount of rotation of the pulley 38a with the detector 40, the amount of movement (rotation amount) of the conveyor belt 32 driven via the pulley 38a can be detected. Thereby, the amount of transportation of the circuit board 2 by the conveyor belt 32 can be detected. The detector 40 is connected to the control device 22 (see FIG. 3), and the signal output from the detector 40 is output to the control device 22.
　また、検出器４０はプーリ３８ａに設置されるため、駆動装置３４のケース内に検出器は設置されない。従来では、駆動装置の駆動量を検出するために、ケース内に検出器が組み込まれた駆動装置（例えば、エンコーダ付きモータ）を用いていたが、検出器が駆動装置のケース内に収容されるため、ケース、ひいては駆動装置全体の大きさが大きくなる。駆動装置が大きくなると、コンベアベルト３２と部品実装機１０の筐体１０ａとの間のスペースが狭いときに駆動装置を設置できなくなる。スペースが十分に確保できない場合、従来技術では、ケース内に検出器を収容していない駆動装置を設置して駆動装置の駆動量を検出しないか、ケース内に検出器を収容した駆動装置を設置するためのスペースを確保して、このような駆動装置を用いるかのいずれかが採用されていた。本実施例では、プーリ３８ａに検出器４０を設置しているため、検出器を収容するために駆動装置（詳細には、駆動源を収容するケース）が大きくなることを回避できる。また、プーリ３８ａと駆動装置３４は出力軸３６を介して接続されるため、プーリ３８ａの近傍には空いている空間が存在しており、そのような空間にプーリ３８ａの回転量を検出するための検出器４０を設置し易い。このため、本実施例では、部品実装機１０の省スペース化を実現しながら、駆動装置３４による回路基板２の搬送量を検出することができる。 Further, since the detector 40 is installed on the pulley 38a, the detector is not installed in the case of the drive device 34. Conventionally, in order to detect the driving amount of the driving device, a driving device (for example, a motor with an encoder) having a detector built in the case has been used, but the detector is housed in the case of the driving device. Therefore, the size of the case and, by extension, the entire drive unit becomes large. When the drive device becomes large, the drive device cannot be installed when the space between the conveyor belt 32 and the housing 10a of the component mounting machine 10 is narrow. If sufficient space cannot be secured, in the prior art, a drive device that does not contain a detector is installed in the case to detect the drive amount of the drive device, or a drive device that houses the detector is installed in the case. Either of such a drive device was adopted to secure a space for the operation. In this embodiment, since the detector 40 is installed on the pulley 38a, it is possible to avoid a large drive device (specifically, a case for accommodating the drive source) for accommodating the detector. Further, since the pulley 38a and the drive device 34 are connected via the output shaft 36, there is an empty space in the vicinity of the pulley 38a, and the amount of rotation of the pulley 38a is detected in such a space. It is easy to install the detector 40 of. Therefore, in this embodiment, it is possible to detect the amount of transportation of the circuit board 2 by the drive device 34 while saving space in the component mounting machine 10.
　制御装置２２は、メモリとＣＰＵを含むコンピュータを用いて構成されている。図３に示すように、制御装置２２は、撮像装置２６と接続しており、撮像装置２６を制御すると共に、撮像装置２６で撮像された画像を取得する。また、制御装置２２は、駆動装置３４と接続しており、駆動装置３４を制御している。また、制御装置２２は、検出器４０と接続しており、検出器４０で検出されたプーリ３８ａの回転量を取得する。 The control device 22 is configured by using a computer including a memory and a CPU. As shown in FIG. 3, the control device 22 is connected to the image pickup device 26, controls the image pickup device 26, and acquires an image captured by the image pickup device 26. Further, the control device 22 is connected to the drive device 34 and controls the drive device 34. Further, the control device 22 is connected to the detector 40 and acquires the rotation amount of the pulley 38a detected by the detector 40.
　タッチパネル２４は、作業者に部品実装機１０の各種の情報を提供する表示装置であると共に、作業者からの指示や情報を受け付ける入力装置である。タッチパネル２４は、制御装置２２に接続されており、検出器４０で検出されたプーリ３８ａの回転量から算出される回路基板２の停止位置と目標位置との間の差分や、差分に基づいて判定されるエラー等を表示させる。なお、タッチパネル２４は、「報知部」の一例である。 The touch panel 24 is a display device that provides various information of the component mounting machine 10 to the operator, and is an input device that receives instructions and information from the operator. The touch panel 24 is connected to the control device 22, and is determined based on the difference between the stop position and the target position of the circuit board 2 calculated from the rotation amount of the pulley 38a detected by the detector 40, and the difference. The error to be displayed is displayed. The touch panel 24 is an example of a "notifying unit".
　部品実装機１０は、コンベアベルト３２を駆動して回路基板２を部品実装機１０内に搬送する。回路基板２の上面（＋Ｚ方向）には位置検出用のマーク（図示省略）が設けられており、回路基板２が部品実装機１０内に搬送されると、予め設定された撮像位置に位置決めされた撮像装置２６によってマークを撮像する。そして、撮像した撮像画像からマークの位置を検出し、検出されたマークの位置から回路基板２の停止位置と目標位置とのずれを算出する。算出したずれ量に基づいて装着ヘッド１６の位置決め位置を調整することで、装着ヘッド１６は回路基板２の所望の位置に部品を実装することができる。しかしながら、停止位置と目標位置とのずれが大きいと、マークが撮像されない位置で回路基板２が停止することがある。このため、本実施例では、位置検出用のマークを撮像する前に、プーリ３８ａの回転量からコンベアベルト３２の移動量（すなわち、回路基板２の位置）を検出し、回路基板２の目標位置からのずれ量を算出して、回路基板２を目標位置に位置決めするように補正する。以下、回路基板２の搬送量に基づいて回路基板２の停止位置を補正する処理の一例について説明する。 The component mounting machine 10 drives the conveyor belt 32 to convey the circuit board 2 into the component mounting machine 10. A mark for position detection (not shown) is provided on the upper surface (+ Z direction) of the circuit board 2, and when the circuit board 2 is conveyed into the component mounting machine 10, it is positioned at a preset imaging position. The mark is imaged by the image pickup device 26. Then, the position of the mark is detected from the captured image, and the deviation between the stop position of the circuit board 2 and the target position is calculated from the detected position of the mark. By adjusting the positioning position of the mounting head 16 based on the calculated deviation amount, the mounting head 16 can mount the component at a desired position on the circuit board 2. However, if the deviation between the stop position and the target position is large, the circuit board 2 may stop at a position where the mark is not imaged. Therefore, in this embodiment, the movement amount of the conveyor belt 32 (that is, the position of the circuit board 2) is detected from the rotation amount of the pulley 38a before the position detection mark is imaged, and the target position of the circuit board 2 is detected. The amount of deviation from the circuit board 2 is calculated and corrected so that the circuit board 2 is positioned at the target position. Hereinafter, an example of a process of correcting the stop position of the circuit board 2 based on the amount of transportation of the circuit board 2 will be described.
　図４に示すように、まず、制御装置２２は、駆動装置３４を所定の駆動量だけ駆動すると共に、プーリ３８ａの回転量を取得する（Ｓ１２）。所定の駆動量は、回路基板２を目標位置まで駆動するように予め設定された駆動量である。駆動装置３４を所定の駆動量だけ駆動すると、出力軸３６及びプーリ３８ａを介してコンベアベルト３２に駆動力が伝達され、回路基板２が搬送される。また、制御装置２２は、ステップＳ１２において駆動装置３４を所定の駆動量だけ駆動している間、検出器４０からの検出信号を取得する。これにより、ステップＳ１２において駆動装置３４を所定の駆動量だけ駆動している間のプーリ３８ａの回転量が検出される。 As shown in FIG. 4, first, the control device 22 drives the drive device 34 by a predetermined drive amount and acquires the rotation amount of the pulley 38a (S12). The predetermined drive amount is a drive amount preset so as to drive the circuit board 2 to the target position. When the driving device 34 is driven by a predetermined driving amount, the driving force is transmitted to the conveyor belt 32 via the output shaft 36 and the pulley 38a, and the circuit board 2 is conveyed. Further, the control device 22 acquires a detection signal from the detector 40 while driving the drive device 34 by a predetermined drive amount in step S12. As a result, the amount of rotation of the pulley 38a while driving the drive device 34 by a predetermined amount in step S12 is detected.
　次に、制御装置２２は、ステップＳ１２において取得した検出器４０からの検出信号に基づいて、回路基板２の搬送量を算出する（Ｓ１４）。ステップＳ１２において、駆動装置３４を所定の駆動量だけ駆動している間のプーリ３８ａの回転量が検出されている。プーリ３８ａの回転に応じてコンベアベルト３２が回転し、回路基板２が搬送される。このため、検出器４０で検出されたプーリ３８ａの回転量から、コンベアベルト３２の回転量、すなわち、回路基板２の搬送量が算出される。これにより、回路基板２の実際の停止位置を特定できる。 Next, the control device 22 calculates the amount of transport of the circuit board 2 based on the detection signal from the detector 40 acquired in step S12 (S14). In step S12, the amount of rotation of the pulley 38a while driving the drive device 34 by a predetermined amount of drive is detected. The conveyor belt 32 rotates according to the rotation of the pulley 38a, and the circuit board 2 is conveyed. Therefore, the amount of rotation of the conveyor belt 32, that is, the amount of transportation of the circuit board 2, is calculated from the amount of rotation of the pulley 38a detected by the detector 40. Thereby, the actual stop position of the circuit board 2 can be specified.
　次に、制御装置２２は、ステップＳ１４で算出された回路基板２の搬送量に基づいて、停止位置と目標位置との間の差分（ずれ量）を算出する（Ｓ１６）。そして、ステップＳ１６で算出された停止位置と目標位置との間の差分が所定の範囲内であるか否かを判定する（Ｓ１８）。停止位置と目標位置との間のずれ量が大きい場合、基板搬送機構３０に何らかの不具合が生じている可能性が高い。基板搬送機構３０の不具合とは、例えば、駆動装置３４の故障、コンベアベルト３２の破損等を挙げることができる。このような場合には、作業者による作業が必要となる。このため、停止位置と目標位置との間の差分が所定の範囲内でない場合（ステップＳ１８でＮＯ）、制御装置２２は、タッチパネル２４にエラーを表示させ（Ｓ２０）、作業者に異常が生じている可能性があることを報知する。また、制御装置２２は、ステップＳ１６で算出された停止位置と目標位置との間の差分もタッチパネル２４に表示し（Ｓ３０）、処理を終了する。 Next, the control device 22 calculates the difference (deviation amount) between the stop position and the target position based on the transfer amount of the circuit board 2 calculated in step S14 (S16). Then, it is determined whether or not the difference between the stop position and the target position calculated in step S16 is within a predetermined range (S18). If the amount of deviation between the stop position and the target position is large, there is a high possibility that some problem has occurred in the substrate transfer mechanism 30. Examples of the malfunction of the substrate transport mechanism 30 include a failure of the drive device 34 and a breakage of the conveyor belt 32. In such a case, work by an operator is required. Therefore, when the difference between the stop position and the target position is not within the predetermined range (NO in step S18), the control device 22 displays an error on the touch panel 24 (S20), causing an abnormality in the operator. Notify that there is a possibility. Further, the control device 22 also displays the difference between the stop position and the target position calculated in step S16 on the touch panel 24 (S30), and ends the process.
　一方、停止位置と目標位置との間の差分が所定の範囲内である場合（ステップＳ１８でＹＥＳ）、制御装置２２は、ステップＳ１４で算出された搬送量が、予め設定された第１搬送量より少ないか否かを判定する（Ｓ２２）。第１搬送量とは、回路基板２を目標位置まで搬送したときの搬送量である。算出された搬送量が第１搬送量より少ない場合（ステップＳ２２でＹＥＳ）、回路基板２は、目標位置まで搬送されず、目標位置より上流側に停止していることになる。このため、制御装置２２は、ステップＳ１６で算出された差分だけ回路基板２を搬送方向の下流側（＋Ｘ側）に搬送するように、駆動装置３４を駆動させる（Ｓ２４）。すなわち、駆動装置３４を、回路基板２を搬入・搬出する場合と同一方向に駆動する。これにより、停止位置と目標位置との間の差分を小さくすることができ、回路基板２を目標位置のより近くに位置決めすることができる。 On the other hand, when the difference between the stop position and the target position is within a predetermined range (YES in step S18), the control device 22 sets the transport amount calculated in step S14 as the preset first transport amount. It is determined whether or not there is less (S22). The first transport amount is the transport amount when the circuit board 2 is transported to the target position. When the calculated transport amount is less than the first transport amount (YES in step S22), the circuit board 2 is not transported to the target position and is stopped upstream from the target position. Therefore, the control device 22 drives the drive device 34 so as to transport the circuit board 2 to the downstream side (+ X side) in the transport direction by the difference calculated in step S16 (S24). That is, the drive device 34 is driven in the same direction as when the circuit board 2 is carried in and out. As a result, the difference between the stop position and the target position can be reduced, and the circuit board 2 can be positioned closer to the target position.
　算出された搬送量が第１搬送量より多い場合（ステップＳ２２でＮＯ）、ステップＳ１４で算出された搬送量が第１搬送量と一致するか否かを判定する（Ｓ２６）。算出された搬送量が第１搬送量と一致しない場合（ステップＳ２６でＮＯ）、回路基板２は、目標位置を超えており、目標位置より下流側に停止していることになる。このため、制御装置２２は、ステップＳ１６で算出された差分だけ回路基板２を搬送方向の上流側（‐Ｘ側）に搬送するように、駆動装置３４を駆動する（Ｓ２８）。すなわち、駆動装置３４を、回路基板２を搬入・搬出する場合とは逆方向（逆回転）に駆動する。これにより、停止位置と目標位置との間の差分を小さくすることができ、回路基板２を目標位置のより近くに位置決めすることができる。 When the calculated transport amount is larger than the first transport amount (NO in step S22), it is determined whether or not the transport amount calculated in step S14 matches the first transport amount (S26). If the calculated transport amount does not match the first transport amount (NO in step S26), the circuit board 2 has exceeded the target position and has stopped downstream from the target position. Therefore, the control device 22 drives the drive device 34 so as to transport the circuit board 2 to the upstream side (-X side) in the transport direction by the difference calculated in step S16 (S28). That is, the drive device 34 is driven in the opposite direction (reverse rotation) to the case where the circuit board 2 is carried in and out. As a result, the difference between the stop position and the target position can be reduced, and the circuit board 2 can be positioned closer to the target position.
　一方、算出された搬送量が第１搬送量と一致する場合（ステップＳ２６でＹＥＳ）、算出された搬送量が所定の搬送量より多くも少なくもなく、停止位置と目標位置との間のずれがほぼない。このため、回路基板２を搬送せずにステップＳ３０に進む。 On the other hand, when the calculated transport amount matches the first transport amount (YES in step S26), the calculated transport amount is neither more nor less than the predetermined transport amount, and the deviation between the stop position and the target position. There is almost no. Therefore, the process proceeds to step S30 without transporting the circuit board 2.
　最後に、制御装置２２は、ステップＳ１６で算出された停止位置と目標位置との間の差分をタッチパネル２４に表示する（Ｓ３０）。これにより、駆動装置３４を所定の駆動量だけ駆動したときに、回路基板２が目標位置からどれだけずれた位置で停止するのかを、作業者に報知することができる。 Finally, the control device 22 displays the difference between the stop position and the target position calculated in step S16 on the touch panel 24 (S30). Thereby, when the driving device 34 is driven by a predetermined driving amount, it is possible to notify the operator how much the circuit board 2 stops at a position deviated from the target position.
　なお、本実施例では、プーリ３８ａに検出器４０を設置したが、このような構成に限定されない。駆動装置３４による回路基板２の搬送量を検出できればよく、駆動装置３４の駆動力が伝達される他の部材に検出器を設置してもよい。例えば、検出器は、プーリ３８ｂに設置されてプーリ３８ｂの回転量を検出してもよいし、出力軸３６に設置されて出力軸３６の回転量を検出してもよいし、コンベアベルト３２に設置されてコンベアベルト３２の回転量を検出してもよい。プーリ３８ａ、３８ｂやコンベアベルト３２の回転量を検出するように検出器を設置すると、例えば、出力軸３６とプーリ３８ａとの間で滑り等が生じた場合であっても、回路基板２の搬送量を正確に検出できる。 In this embodiment, the detector 40 is installed on the pulley 38a, but the configuration is not limited to this. As long as the amount of transportation of the circuit board 2 by the drive device 34 can be detected, the detector may be installed on another member to which the drive force of the drive device 34 is transmitted. For example, the detector may be installed on the pulley 38b to detect the amount of rotation of the pulley 38b, may be installed on the output shaft 36 to detect the amount of rotation of the output shaft 36, or may be mounted on the conveyor belt 32. It may be installed and detect the amount of rotation of the conveyor belt 32. When the detector is installed so as to detect the amount of rotation of the pulleys 38a and 38b and the conveyor belt 32, for example, even if slippage occurs between the output shaft 36 and the pulley 38a, the circuit board 2 is conveyed. The amount can be detected accurately.
　また、検出器４０は、一対のコンベアベルト３２のうちの一方に接続されるプーリ３８ａ（例えば、図２では紙面上側（＋Ｙ側）のコンベアベルト３２）のみに設置されていてもよいし、一対のコンベアベルト３２の両方にそれぞれ設置されていてもよい。検出器４０を一対のコンベアベルト３２の両方に設置すると、２つの駆動装置３４の駆動量を検出できるため、より正確に回路基板２の搬送量を検出することができる。 Further, the detector 40 may be installed only on the pulley 38a (for example, the conveyor belt 32 on the upper side (+ Y side) of the paper surface in FIG. 2) connected to one of the pair of conveyor belts 32, or the pair. It may be installed on both of the conveyor belts 32 of the above. When the detector 40 is installed on both of the pair of conveyor belts 32, the driving amount of the two driving devices 34 can be detected, so that the conveyed amount of the circuit board 2 can be detected more accurately.
　また、本実施例では、部品実装機１０の基板搬送機構３０において、回路基板２の搬送量を検出するように検出器４０を設置したが、このような構成に限定されない。機内に回路基板２を搬送する基板搬送機構３０を有する基板作業機であれば、どの種類の基板作業機に対しても本実施例の構成を適用することができる。 Further, in the present embodiment, the detector 40 is installed in the board transfer mechanism 30 of the component mounting machine 10 so as to detect the transfer amount of the circuit board 2, but the present invention is not limited to such a configuration. The configuration of this embodiment can be applied to any type of substrate working machine as long as it has a substrate conveying mechanism 30 that conveys the circuit board 2 into the machine.
（実施例２）
　実施例２では、基板作業機の一種であるスクリーン印刷機６０において、スクリーンマスクと回路基板２との間の位置決め機構に検出器が設置される。図５～図７を参照して、スクリーン印刷機６０について説明する。スクリーン印刷機６０は、実装ラインの上流側から回路基板２を受け入れ、回路基板２に所望のはんだをスクリーン印刷した後、回路基板２を実装ラインの下流側に送り出す装置である。図５に示すように、スクリーン印刷機６０は、筐体６０ａと、筐体６０ａに収容されるスクリーンマスク６２、スキージ装置６４、スキージ移動装置６６、基板搬送機構７０及び基板位置決め機構７２を備える。 (Example 2)
In the second embodiment, in the screen printing machine 60, which is a kind of board working machine, a detector is installed in the positioning mechanism between the screen mask and the circuit board 2. The screen printing machine 60 will be described with reference to FIGS. 5 to 7. The screen printing machine 60 is a device that receives the circuit board 2 from the upstream side of the mounting line, screen-prints the desired solder on the circuit board 2, and then sends the circuit board 2 to the downstream side of the mounting line. As shown in FIG. 5, the screen printing machine 60 includes a housing 60a, a screen mask 62 housed in the housing 60a, a squeegee device 64, a squeegee moving device 66, a substrate transport mechanism 70, and a substrate positioning mechanism 72.
　スクリーンマスク６２は、矩形状に形成された金属製の板状部材であって、スクリーン印刷機６０の基台に対して位置を固定された支持枠（図示省略）によって４辺を支持されている。スクリーンマスク６２の中央部には、回路基板２に印刷するはんだのパターン（印刷パターン）に対応して開口部が形成されている。スキージ装置６４は、Ｚ方向（ここでは鉛直方向）に移動可能であると共に、スキージ移動装置６６によりＸＹ方向に移動可能である。スキージ装置６４は、はんだ供給装置（図示省略）からスクリーンマスク６２の上面に供給されるはんだを印刷パターン上でスキージングする。 The screen mask 62 is a metal plate-shaped member formed in a rectangular shape, and its four sides are supported by a support frame (not shown) whose position is fixed with respect to the base of the screen printing machine 60. .. An opening is formed in the central portion of the screen mask 62 corresponding to the solder pattern (printing pattern) to be printed on the circuit board 2. The squeegee device 64 can be moved in the Z direction (here, the vertical direction), and can be moved in the XY direction by the squeegee moving device 66. The squeegee device 64 squeezes the solder supplied from the solder supply device (not shown) to the upper surface of the screen mask 62 on the print pattern.
　基板搬送機構７０は、回路基板２をＸ方向へ搬送する。基板搬送機構７０は、回路基板２をスクリーン印刷機６０内に搬入し、上面にはんだが印刷された回路基板２をスクリーン印刷機６０外に搬出する。なお、基板搬送機構７０は、実施例１の部品実装機１０の基板搬送機構３０と略同一の構成であるため、詳細な説明は省略する。また、本実施例では省略するが、基板搬送機構７０（例えば、コンベアベルトを駆動する駆動装置に接続される出力軸やプーリ等）に、実施例１の基板搬送機構３０と同様の検出器を設けてもよい。 The board transport mechanism 70 transports the circuit board 2 in the X direction. The substrate transfer mechanism 70 carries the circuit board 2 into the screen printing machine 60, and carries out the circuit board 2 on which solder is printed on the upper surface to the outside of the screen printing machine 60. Since the substrate transfer mechanism 70 has substantially the same configuration as the substrate transfer mechanism 30 of the component mounting machine 10 of the first embodiment, detailed description thereof will be omitted. Further, although omitted in this embodiment, a detector similar to that of the substrate transport mechanism 30 of the first embodiment is attached to the substrate transport mechanism 70 (for example, an output shaft or a pulley connected to a drive device for driving a conveyor belt). It may be provided.
　図６及び図７を参照して、基板位置決め機構７２について説明する。基板位置決め機構７２は、基板搬送機構７０によってスクリーン印刷機６０内に搬入された回路基板２を、スクリーンマスク６２に対して所定の位置に位置決めする。基板位置決め機構７２は、昇降機構７４と、１つのＸ軸送りねじ機構７６と、２つのＹ軸送りねじ機構７８、８０を備えている。 The substrate positioning mechanism 72 will be described with reference to FIGS. 6 and 7. The substrate positioning mechanism 72 positions the circuit board 2 carried into the screen printing machine 60 by the substrate transport mechanism 70 at a predetermined position with respect to the screen mask 62. The board positioning mechanism 72 includes an elevating mechanism 74, one X-axis feed screw mechanism 76, and two Y-axis feed screw mechanisms 78 and 80.
　昇降機構７４は、基板搬送機構７０を支持しており、モータ等のアクチュエータ（図示省略）の駆動により、基板搬送機構７０をＺ方向に移動可能である。Ｘ軸送りねじ機構７６は、駆動装置１３４（図７に図示）によって回転駆動するねじ７６ａにより、昇降機構７４をＸ方向（図では左右方向）に移動させる。これにより、昇降機構７４が支持する基板搬送機構７０及び回路基板２もＸ方向に移動する。２つのＹ軸送りねじ機構７８、８０は、それぞれに設けられた駆動装置（図示省略）によってねじ７８ａ、８０ａを同一方向に回転させることにより、昇降機構７４をＹ方向（図では上下方向）に移動させる。これにより、昇降機構７４が支持する回路基板２もＹ方向に移動する。また、２つのＹ軸送りねじ機構７８、８０は、それぞれのねじ７８ａ、８０ａを逆方向に回転させることにより、昇降機構７４を回転させる。これにより、昇降機構７４が支持する回路基板２も回転する。 The elevating mechanism 74 supports the substrate transport mechanism 70, and the substrate transport mechanism 70 can be moved in the Z direction by driving an actuator (not shown) such as a motor. The X-axis feed screw mechanism 76 moves the elevating mechanism 74 in the X direction (left-right direction in the figure) by the screw 76a which is rotationally driven by the drive device 134 (shown in FIG. 7). As a result, the substrate transport mechanism 70 and the circuit board 2 supported by the elevating mechanism 74 also move in the X direction. The two Y-axis feed screw mechanisms 78 and 80 rotate the screws 78a and 80a in the same direction by a drive device (not shown) provided for each, thereby moving the elevating mechanism 74 in the Y direction (vertical direction in the figure). Move. As a result, the circuit board 2 supported by the elevating mechanism 74 also moves in the Y direction. Further, the two Y-axis feed screw mechanisms 78 and 80 rotate the elevating mechanism 74 by rotating the screws 78a and 80a in opposite directions. As a result, the circuit board 2 supported by the elevating mechanism 74 also rotates.
　図７に示すように、Ｘ軸送りねじ機構７６のねじ７６ａは、カップリング８２を介して駆動装置１３４の出力軸１３６と接続している。すなわち、駆動装置１３４の駆動力は、出力軸１３６を介してカップリング８２に伝達され、カップリング８２からねじ７６ａに伝達される。カップリング８２には、検出器１４０が設置されており、検出器１４０は、カップリング８２の回転量を検出している。検出器１４０でカップリング８２の回転量を検出することによって、カップリング８２を介して駆動されたねじ７６ａの回転量を検出することができる。これにより、スクリーンマスク６２に対する回路基板２のＸ方向の移動量を検出することができる。なお、Ｙ軸送りねじ機構７８、８０と駆動装置との接続は、上記のＸ軸送りねじ機構７６と駆動装置１３４との接続と同様の構成であるため、詳細な説明は省略する。本実施例においても、検出器１４０をカップリング８２に設置するため、駆動装置１３４のケース内に検出器を設置することなく、回路基板２の移動量を検出できる。このため、スクリーン印刷機６０の省スペース化を実現しながら、駆動装置１３４による回路基板２の移動量を検出することができる。 As shown in FIG. 7, the screw 76a of the X-axis feed screw mechanism 76 is connected to the output shaft 136 of the drive device 134 via the coupling 82. That is, the driving force of the driving device 134 is transmitted to the coupling 82 via the output shaft 136, and is transmitted from the coupling 82 to the screw 76a. A detector 140 is installed in the coupling 82, and the detector 140 detects the amount of rotation of the coupling 82. By detecting the amount of rotation of the coupling 82 with the detector 140, the amount of rotation of the screw 76a driven via the coupling 82 can be detected. Thereby, the amount of movement of the circuit board 2 in the X direction with respect to the screen mask 62 can be detected. Since the connection between the Y-axis feed screw mechanisms 78 and 80 and the drive device has the same configuration as the connection between the X-axis feed screw mechanism 76 and the drive device 134, detailed description thereof will be omitted. In this embodiment as well, since the detector 140 is installed in the coupling 82, the movement amount of the circuit board 2 can be detected without installing the detector in the case of the drive device 134. Therefore, the amount of movement of the circuit board 2 by the drive device 134 can be detected while saving space in the screen printing machine 60.
　なお、本実施例では、カップリング８２に検出器１４０を設置したが、例えば、検出器を出力軸１３６に設置して、出力軸１３６の回転量を検出してもよい。また、本実施例では、回路基板２をスクリーンマスク６２に対して移動させたが、例えば、スクリーンマスク６２を回路基板２に対して移動させてもよい。この場合にも、スクリーンマスク６２の位置決め機構に上記と同様に検出器を設置することによって、駆動装置のケース内に検出器を設置することなく、スクリーンマスク６２の移動量を検出できる。 In this embodiment, the detector 140 is installed on the coupling 82. For example, the detector may be installed on the output shaft 136 to detect the amount of rotation of the output shaft 136. Further, in this embodiment, the circuit board 2 is moved with respect to the screen mask 62, but for example, the screen mask 62 may be moved with respect to the circuit board 2. Also in this case, by installing the detector in the positioning mechanism of the screen mask 62 in the same manner as described above, the movement amount of the screen mask 62 can be detected without installing the detector in the case of the drive device.
　以上、本明細書に開示の技術の具体例を詳細に説明したが、これらは例示にすぎず、請求の範囲を限定するものではない。請求の範囲に記載の技術には、以上に例示した具体例を様々に変形、変更したものが含まれる。また、本明細書または図面に説明した技術要素は、単独であるいは各種の組合せによって技術的有用性を発揮するものであり、出願時請求項記載の組合せに限定されるものではない。また、本明細書または図面に例示した技術は複数目的を同時に達成するものであり、そのうちの一つの目的を達成すること自体で技術的有用性を持つものである。 The specific examples of the disclosed technology have been described in detail in the present specification, but these are merely examples and do not limit the scope of claims. The techniques described in the claims include various modifications and modifications of the specific examples illustrated above. In addition, the technical elements described in the present specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the techniques illustrated in the present specification or drawings achieve a plurality of objectives at the same time, and achieving one of the objectives itself has technical usefulness.

Claims (8)

  1. 　機内に基板を搬入して、前記機内で前記基板に対して作業を実行する基板作業機であって、
    　前記機内に配置され、前記基板に対して作業を実行する作業機構と、
    　前記機内に配置され、前記基板と前記作業機構との相対的な位置を位置決めする位置決め機構であって、前記基板と前記作業機構との相対的な位置決めに応じて移動する移動部材を備える、位置決め機構と、
    　前記機内に配置され、前記移動部材を駆動する駆動装置であって、駆動源と、前記駆動源を収容するケースと、前記ケース外に少なくとも一部が位置し、前記駆動源で発生する駆動力によって移動して前記駆動力を前記移動部材に伝達する駆動部材と、を備える、駆動装置と、
    　前記機内に配置され、前記移動部材及び前記駆動部材の少なくとも一方の移動量を検出する検出器と、を備える、基板作業機。     A board working machine that carries a board into a machine and executes work on the board in the machine.
    A work mechanism that is placed inside the machine and executes work on the board,
    A positioning mechanism that is arranged in the machine and positions a relative position between the substrate and the working mechanism, and includes a moving member that moves according to the relative positioning between the substrate and the working mechanism. Mechanism and
    A drive device arranged in the machine to drive the moving member, the drive source, a case accommodating the drive source, and at least a part of the drive device located outside the case, and a driving force generated by the drive source. A drive device comprising a drive member that moves by means of and transmits the drive force to the moving member.
    A substrate working machine, which is arranged in the machine and includes a detector for detecting the amount of movement of at least one of the moving member and the driving member.
  2. 　前記位置決め機構は、前記基板を搬送方向に搬送する基板搬送機構であり、
    　前記駆動部材は、当該駆動装置が発生する駆動力によって回転する出力軸であり、
    　前記移動部材は、前記出力軸が回転することによって前記基板を搬送するコンベアベルト又は前記出力軸に伝達される前記駆動力を前記コンベアベルトに伝達するプーリであり、
    　前記検出器は、前記出力軸、前記プーリ又は前記コンベアベルトの回転量を検出する、請求項１に記載の基板作業機。     The positioning mechanism is a substrate transport mechanism that transports the substrate in the transport direction.
    The drive member is an output shaft that is rotated by a drive force generated by the drive device.
    The moving member is a conveyor belt that conveys the substrate by rotating the output shaft, or a pulley that transmits the driving force transmitted to the output shaft to the conveyor belt.
    The substrate working machine according to claim 1, wherein the detector detects the amount of rotation of the output shaft, the pulley, or the conveyor belt.
  3. 　前記検出器は、前記プーリに設置され、前記プーリの回転量を検出する、請求項２に記載の基板作業機。 The substrate working machine according to claim 2, wherein the detector is installed on the pulley and detects the amount of rotation of the pulley.
  4. 　前記検出器は、前記駆動源と前記プーリの間に設置され、前記プーリの回転量を検出する、請求項２に記載の基板作業機。 The substrate working machine according to claim 2, wherein the detector is installed between the drive source and the pulley and detects the amount of rotation of the pulley.
  5. 　前記基板作業機は、電子部品を前記基板に実装する部品実装機である、請求項２～４のいずれか一項に記載の基板作業機。 The board working machine according to any one of claims 2 to 4, wherein the board working machine is a component mounting machine for mounting electronic components on the board.
  6. 　前記基板作業機は、印刷機であり、
    　前記作業機構は、スクリーンマスクを備えており、
    　前記位置決め機構は、前記スクリーンマスクに対して前記基板を所定の位置に位置決めするように前記基板又は前記スクリーンマスクを移動させる、請求項１に記載の基板作業機。     The board working machine is a printing machine.
    The working mechanism is equipped with a screen mask.
    The substrate working machine according to claim 1, wherein the positioning mechanism moves the substrate or the screen mask so as to position the substrate at a predetermined position with respect to the screen mask.
  7. 　前記駆動装置を制御する制御装置をさらに備えており、
    　前記制御装置は、前記検出器で検出された移動量に基づいて、前記作業機構に対する前記基板の目標位置からのずれ量を算出し、算出した前記ずれ量に基づいて、前記基板を前記目標位置に位置決めするように前記駆動装置を制御する、請求項１～６のいずれか一項に記載の基板作業機。     Further, a control device for controlling the drive device is provided.
    The control device calculates the amount of deviation of the substrate from the target position with respect to the working mechanism based on the amount of movement detected by the detector, and based on the calculated amount of deviation, moves the substrate to the target position. The substrate working machine according to any one of claims 1 to 6, wherein the driving device is controlled so as to be positioned at.
  8. 　前記ずれ量を報知する報知部をさらに備えている、請求項７に記載の基板作業機。 The board working machine according to claim 7, further comprising a notification unit for notifying the amount of deviation.
PCT/JP2020/007492 2020-02-25 2020-02-25 Substrate work machine WO2021171370A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710356A (en) * 1993-06-29 1995-01-13 Ibiden Co Ltd Sheet depositing device
JP2002033598A (en) * 2001-05-29 2002-01-31 Fuji Mach Mfg Co Ltd Apparatus and method for mounting of electronic component
JP2004228326A (en) * 2003-01-22 2004-08-12 Fuji Mach Mfg Co Ltd Method and device for controlling substrate stop position

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59228798A (en) * 1983-06-09 1984-12-22 松下電器産業株式会社 Electronic part supplying device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710356A (en) * 1993-06-29 1995-01-13 Ibiden Co Ltd Sheet depositing device
JP2002033598A (en) * 2001-05-29 2002-01-31 Fuji Mach Mfg Co Ltd Apparatus and method for mounting of electronic component
JP2004228326A (en) * 2003-01-22 2004-08-12 Fuji Mach Mfg Co Ltd Method and device for controlling substrate stop position

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