WO2021005667A1

WO2021005667A1 - Component mounting device

Info

Publication number: WO2021005667A1
Application number: PCT/JP2019/026905
Authority: WO
Inventors: 寿明水野
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2019-07-05
Filing date: 2019-07-05
Publication date: 2021-01-14
Also published as: JPWO2021005667A1; JP7223136B2

Abstract

This component mounting device is provided with a head, a nozzle, a sensor, and a control unit. The control unit is configured to perform a calibration process and a mounting process. The control unit, during the calibration process, performs a first detecting operation for detecting a signal output from the sensor when the nozzle is moved to a predetermined position relative to the sensor, and a calibration operation for calibrating the height position of the nozzle on the basis of the signal output from the sensor. During the mounting process, the control unit performs a second detecting operation for detecting a signal output from the sensor when the nozzle is moved to a predetermined position relative to the sensor, and a mounting operation for mounting a component onto a substrate. During the first detecting operation and the second detecting operation, if it is determined that there is anomaly in the output of the sensor, the control unit outputs error information indicating anomaly in the sensor.

Description

Component mounting device

The technology disclosed in this specification relates to a component mounting device.

Patent Document 1 discloses a component mounting device for mounting components on a substrate. This component mounting device includes a head, a nozzle, and a jig base. One end of the nozzle is removable to the head, and the other end is configured to be able to attract parts. In this component mounting device, when the nozzle mounted on the head is replaced, the nozzle is pressed against the jig base to improve the slidability of the nozzle with respect to the head. As a result, fluctuations in the height position of the nozzle with respect to the head are suppressed before and after the nozzle replacement, and the components can be suitably mounted on the substrate.

JP-A-2017-92200

In this type of component mounting device, the height position of the nozzle with respect to the board may be calibrated before the component is actually mounted on the board (for example, before the mounting process performed immediately after the nozzle is replaced). In such a case, a sensor is used to detect the height position of the nozzle. The height position of the nozzle moves the nozzle to a predetermined position with respect to the sensor and is calibrated based on the output of the sensor at that time. After calibrating the height position of the nozzle, the operation of mounting the component on the board is performed.

In the conventional technology, the sensor is used to calibrate the height position of the nozzle, so once the process of actually mounting the component is started, the output of the sensor is not monitored until the next calibration process is performed. Therefore, at the time of mounting the component, it is not possible to grasp whether or not an abnormality has occurred in the sensor. Therefore, the abnormality of the sensor becomes clear only when the height position of the nozzle is calibrated again or when regular maintenance is performed. In this way, conventionally, since the sensor abnormality can be grasped for the first time at the above timing, extra time is required for calibration and maintenance of the nozzle height position in order to replace the sensor in which the abnormality has occurred. Was. Therefore, there is a problem that the production efficiency is lowered. The present specification provides a technique provided in a component mounting device and capable of early grasping an abnormality of a sensor used for calibrating the height position of a nozzle.

The component mounting device disclosed in this specification mounts components on a substrate. The component mounting device includes a head, a nozzle whose one end is detachably attached to and detachable from the head, and the other end which is configured to be able to attract the component, and a height position of the nozzle mounted on the head. It is equipped with a sensor for calibrating and a control unit. The control unit is configured to be able to perform a calibration process for calibrating the height position of the nozzle and a mounting process for mounting the component on the substrate. In the calibration process, the control unit performs a first detection operation of detecting the output of the sensor by moving the nozzle mounted on the head with respect to the sensor, and the nozzle based on the output of the sensor. A calibration operation for calibrating the height position of the sensor is executed, and in the mounting process, a second detection operation for detecting the output of the sensor by moving the nozzle mounted on the head with respect to the sensor. , The mounting operation of mounting the component attracted to the nozzle on the substrate is executed, and it is determined that an abnormality has occurred in the output of the sensor in the first detection operation and the second detection operation. In this case, error information indicating that an abnormality has occurred in the sensor is output.

In the above component mounting device, the control unit monitors the output of the sensor in both the calibration process and the mounting process. Then, when it is determined that an abnormality has occurred in the output of the sensor, the control unit outputs error information regardless of whether the processing being executed is the calibration processing or the mounting processing. Therefore, the user can grasp at an early stage that an abnormality has occurred in the sensor.

The side view which shows typically the structure of the component mounting apparatus which concerns on Example. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. A flowchart of the calibration process performed by the component mounting device. A flowchart of the mounting process executed by the component mounting device.

In one embodiment disclosed herein, the control unit may stop executing the calibration operation if it is determined that an abnormality has occurred in the output of the sensor in the first detection operation of the calibration process. Often, in the second detection operation of the mounting process, if it is determined that an abnormality has occurred in the output of the sensor, the execution of the mounting operation may be continued.

In the above configuration, if it is determined that an abnormality has occurred in the output of the sensor in the calibration process, the calibration operation cannot be executed properly, so the execution of the calibration operation is stopped. On the other hand, in the mounting process, even if an abnormality occurs in the output of the sensor, the abnormality hardly affects the accuracy of the mounting operation or the like. Therefore, even if it is determined that an abnormality has occurred in the output of the sensor in the mounting process, the time for stopping the operation of the component mounting device can be shortened by continuing the execution of the mounting operation. Therefore, the decrease in production efficiency can be further suppressed.

In one embodiment disclosed herein, a camera that captures a nozzle mounted on the head may be further provided. In the mounting process, the control unit may perform positioning in the height direction of the nozzle based on the image captured by the camera.

According to such a configuration, even if the position of the nozzle positioned in the calibration process in the height direction fluctuates due to, for example, repeated mounting operations, the position is set to an appropriate height position during execution of the mounting process. The nozzle can be repositioned.

In one embodiment disclosed herein, the sensor may be a contact sensor. In the first detection operation and the second detection operation, the control unit may press the nozzle against the contact sensor by moving the nozzle to a predetermined position with respect to the contact sensor. When the nozzle is pressed against the contact sensor, the contact sensor may output a signal indicating that the nozzle is pressed.

According to such a configuration, the height position of the nozzle can be easily grasped based on the binary value (for example, ON / OFF) output from the contact sensor. Therefore, the height position of the nozzle can be calibrated with a simple configuration.

(Example)
Hereinafter, the component mounting device 10 of the embodiment (hereinafter, simply referred to as the mounting device 10) will be described with reference to the drawings. The mounting device 10 is a device for mounting the electronic component 4 on the circuit board 2. The mounting device 10 is called a surface mounter or a chip mounter. Usually, the mounting device 10 is installed together with other board working machines such as a solder printing machine and a board inspection machine to form a series of mounting lines.

As shown in FIGS. 1 and 2, the mounting device 10 includes a plurality of component feeders 12, a feeder holding portion 14, a mounting head 16, a head moving mechanism 18, a conveyor 20, an imaging unit 21, and a nozzle. A unit 24, a nozzle holder 26, a sensor 28, a touch panel 30, and a control unit 32 are provided.

Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding portion 14, and supplies the electronic component 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited, and for example, a tape-type feeder that accommodates a plurality of electronic components 4 on a winding tape, a tray-type feeder that accommodates a plurality of electronic components 4 on a tray, or a container. It may be any of bulk feeders that randomly accommodate a plurality of electronic components 4 therein.

The feeder holding unit 14 has a plurality of slots, and the component feeder 12 is detachably installed in each of the plurality of slots. The feeder holding portion 14 may be fixed to the mounting device 10 or may be detachable from the mounting device 10.

The mounting head 16 is configured such that a suction nozzle 6 for sucking an electronic component 4 and a calibration nozzle 8 used in a calibration process described later can be attached to and detached from the holding portion 16a. The holding portion 16a is fixed to the moving base 17. The mounting head 16 includes an actuator (not shown) for moving the mounted

nozzles

6 and 8 in the Z direction (that is, in the vertical direction) with respect to the component feeder 12, the circuit board 2, or the sensor 28. The

nozzles

6 and 8 are brought close to each other and separated from each other. For example, the mounting head 16 can suck the electronic component 4 from the component feeder 12 by the suction nozzle 6, and can mount the electronic component 4 sucked on the suction nozzle 6 on the circuit board 2. The mounting head 16 is not limited to the one having a single holding portion 16a, and may have a plurality of holding portions 16a.

The head moving mechanism 18 is a robot that moves the moving base 17 in the X direction and the Y direction (that is, the horizontal direction). The head moving mechanism 18 is composed of a guide rail for guiding the moving base 17, an actuator for moving the moving base 17 along the guide rail, and the like. The head moving mechanism 18 is arranged above the component feeder 12 and the conveyor 20.

The conveyor 20 carries in, supports, and carries out the circuit board 2. In this embodiment, the conveyor 20 is composed of a pair of belt conveyors, a support device (not shown) that is attached to the belt conveyor and supports the circuit board 2 from below, and an actuator (not shown) that drives the belt conveyor. Will be done. The circuit board 2 is conveyed in the X direction.

The image pickup unit 21 is attached to the moving base 17. Therefore, when the mounting head 16 moves, the imaging unit 21 also moves together. The image pickup unit 21 includes a camera support portion 22 and a camera 23. The camera support portion 22 is attached to the moving base 17. A camera 23 is attached to the camera support portion 22. The camera 23 is arranged on the side of the suction nozzle 6 (in the Y-axis direction in the drawing). The camera 23 images a range including the entire suction nozzle 6 mounted on the mounting head 16 (that is, from the lower end of the holding portion 16a of the mounting head 16 to the lower end of the suction nozzle 6) from the horizontal direction. The image captured by the camera 23 is used to perform height positioning of the suction nozzle 6 when mounting the electronic component 4. As the camera 23, for example, a CCD camera is used.

The nozzle accommodating portion 24 is arranged between the component feeder 12 and the conveyor 20. The nozzle accommodating unit 24 can accommodate a plurality of suction nozzles 6 and calibration nozzles 8, and transfers the

nozzles

6 and 8 to and from the mounting head 16. Specifically, each of the

nozzles

6 and 8 is housed in a nozzle holder 26 attached to the nozzle housing unit 24. A plurality of types of

nozzles

6 and 8 can be accommodated in the nozzle holder 26. The nozzle holder 26 is removable from the nozzle accommodating portion 24, and is removed from the nozzle accommodating portion 24, for example, when an operator replaces the suction nozzle 6 of the nozzle holder 26.

As shown in FIG. 2, the sensor 28 is provided inside the pair of conveyors 20. In this embodiment, the sensor 28 is a contact sensor that detects the presence or absence of contact with an object. The sensor 28 outputs either a value of "ON" indicating that the object is in contact with the upper surface thereof and "OFF" indicating that the object is not in contact with the upper surface thereof. The output result of the sensor 28 is input to the control unit 32. The height position of the upper surface of the sensor 28 is substantially equal to the height position of the upper surface of the circuit board 2 conveyed by the conveyor 20. The sensor 28 is not limited to the contact sensor, and may be any sensor such as a touchdown sensor or a distance sensor that can detect the position of an object with respect to the sensor 28.

The touch panel 30 is a display device that provides various information to the operator, and is a user interface that receives instructions and information from the operator.

The control unit 32 is composed of a computer including a CPU, ROM, and RAM. The control unit 32 includes each component feeder 12, a feeder holding unit 14, a mounting head 16, a moving base 17, a head moving mechanism 18, a conveyor 20, an imaging unit 21, a nozzle accommodating unit 24, a nozzle holder 26, a sensor 28, and a touch panel 30. Is connected so that it can communicate with. By controlling each of the above units, the control unit 32 executes calibration of the height position of the suction nozzle 6, mounting of the electronic component 4 on the circuit board 2, transportation of the circuit board 2, display of various information, and the like.

Next, with reference to FIGS. 3 and 4, a process executed by the control unit 32 of the mounting device 10 will be described. The control unit 32 executes a calibration process for calibrating the height position of the calibration nozzle 8 mounted on the mounting head 16 and a mounting process for mounting the electronic component 4 on the circuit board 2.

(Calibration process)
First, the calibration process executed by the control unit 32 will be described with reference to FIG. The calibration process is executed at the start of production of the job or when the suction nozzle 6 to be mounted on the mounting head 16 is replaced. In S10, the control unit 32 moves the mounting head 16 above the nozzle holder 26 by the head moving mechanism 18, and mounts the calibration nozzle 8 on the mounting head 16 from the plurality of nozzles housed in the nozzle holder 26.

In S12, the control unit 32 moves the mounting head 16 above the sensor 28, then lowers the calibration nozzle 8 and presses the lower end of the calibration nozzle 8 against the upper surface of the sensor 28.

In S14, the control unit 32 determines whether or not the output of the sensor 28 has an abnormality. As described above, the sensor 28 outputs either a value of "ON" or "OFF". Therefore, under normal conditions, when the calibration nozzle 8 is moved downward and pressed against the sensor 28, the output of the sensor 28 changes from “OFF” to “ON”. However, for example, if the sensor 28 is out of order, an abnormality such as the sensor 28 constantly outputting an "ON" or "OFF" value occurs. In this way, when the operation of pressing the calibration nozzle 8 against the sensor 28 is executed but the output value corresponding to the operation is not detected, the control unit 32 causes an abnormality in the output of the sensor 28. It is determined that there is, and the process proceeds to S16.

In S16, the control unit 32 displays error information indicating that an abnormality has occurred in the output of the sensor 28 on the touch panel 30. As a result, the operator can recognize that the output of the sensor 28 is abnormal (for example, the sensor 28 is out of order). The output mode of the error information is not limited to the display of the image on the touch panel 30, and may be a mode of outputting by voice or the like, or a mode of outputting the error information to an external device (for example, a management server). It may be. Then, in S18, the control unit 32 stops the operation of calibrating the height position of the calibration nozzle 8.

On the other hand, when it is determined that no abnormality has occurred in the output of the sensor 28 (NO in S14), the control unit 32 executes the calibration operation in S20. As described above, the height position of the upper surface of the sensor 28 is set to substantially the same height as the height position of the upper surface of the circuit board 2 on which the electronic component 4 is mounted. Therefore, the control unit 32 has the height of the calibration nozzle 8 based on the fact that the height position at which the output of the sensor 28 changes from “OFF” to “ON” is substantially equal to the height position of the upper surface of the circuit board 2. Calibrate the position to the appropriate height position. That is, the position of the mounting head 16 in the height direction is adjusted, and the calibration nozzle 8 is calibrated so that the height position of the calibration nozzle 8 becomes an appropriate height position.

In S22, the control unit 32 determines whether or not the calibration operation is completed. The control unit 32 returns to S20 when the calibration operation is not completed (NO in S22), and ends a series of processes when the calibration operation is completed (YES in S22).

(Implementation process)
Next, the mounting process executed by the control unit 32 will be described with reference to FIG. The mounting process is executed following the calibration process described above. In S30, the control unit 32 moves the mounting head 16 above the nozzle holder 26 by the head moving mechanism 18, and mounts the suction nozzle 6 to be used for job production from the plurality of nozzles housed in the nozzle holder 26. It is attached to the head 16.

In S32, the control unit 32 moves the mounting head 16 above the sensor 28, then lowers the suction nozzle 6 and presses the lower end of the suction nozzle 6 against the upper surface of the sensor 28. As a result, the slidability of the suction nozzle 6 is improved or secured.

In S34, the control unit 32 determines whether or not an abnormality has occurred in the output of the sensor 28. The mode for determining whether or not the output of the sensor 28 is abnormal is the same as in S14 of FIG. The control unit 32 proceeds to S36 when it is determined that an abnormality has occurred in the output of the sensor 28 (YES in S34), and when it is determined that an abnormality has not occurred in the output of the sensor 28 (NO in S34). ) Proceed to S38.

In S36, the control unit 32 displays the error information on the touch panel 30. As a result, the operator can recognize that the output of the sensor 28 is abnormal. When the control unit 32 executes the process of S36, the control unit 32 proceeds to S38.

In S38, the control unit 32 acquires the captured image of the camera 23. That is, the control unit 32 acquires an image of the entire suction nozzle 6 captured by the camera 23. Then, in S40, the control unit 32 executes positioning of the suction nozzle 6 in the height direction based on the image captured by the camera 23 (the image of the entire suction nozzle 6). That is, the control unit 32 adjusts the length of the suction nozzle 6 mounted on the mounting head 16 in the Z direction. As a result, the suction nozzle 6 is positioned at an appropriate height position with respect to the component feeder 12 and the circuit board 2.

In S42, the control unit 32 executes the mounting operation. That is, the control unit 32 mounts a predetermined electronic component 4 on the circuit board 2 according to the job to be produced.

In S44, the control unit 32 determines whether or not the mounting operation is completed. The control unit 32 returns to S42 when the mounting operation is not completed (NO in S44), and ends a series of processes when the mounting operation is completed (YES in S44).

As described above, in the mounting device 10 of this embodiment, the output of the sensor 28 is monitored in both the calibration process and the mounting process. Then, when the control unit 32 determines that an abnormality has occurred in the output of the sensor 28 (YES in S14 of FIG. 3 and YES in S34 of FIG. 4), is the processing being executed a calibration process? Error information is output regardless of whether it is an implementation process (S16, S36). As described above, in the mounting device 10 of the present embodiment, the abnormality of the sensor 28 is output regardless of the processing content executed by the mounting device 10, so that the operator can promptly detect that the sensor 28 has an abnormality. Can be grasped.

Further, in the mounting process, the abnormality of the output of the sensor 28 has almost no effect on the accuracy of the mounting operation. That is, the calibration of the height position of the calibration nozzle 8 based on the output of the sensor 28 is performed for the positioning of the mounting head 16 in the height direction. Further, the suction nozzle 6 is positioned in the height direction by S40. Therefore, even if an abnormality occurs in the output of the sensor 28 during the mounting process, the accuracy of the mounting operation is hardly affected. Therefore, in the mounting device 10 of the present embodiment, when it is determined that an abnormality has occurred in the sensor 28 during the mounting process (YES in S34 of FIG. 4), error information is output (S36), but The mounting operation continues without interruption (S42). Therefore, it is possible to suppress a decrease in production efficiency.

Further, in the mounting device 10 of this embodiment, the operation of pressing the suction nozzle 6 against the sensor 28 is executed in the mounting process (S32). As a result, the slidability of the suction nozzle 6 with respect to the mounting head 16 is improved. As a result, it is possible to suppress fluctuations in the height position of the suction nozzle 6 with respect to the mounting head 16 before and after the suction of the electronic component 4 and the mounting of the electronic component 4 on the circuit board 2.

In the above-described embodiment, the mounting operation was executed even when an abnormality occurred in the output of the sensor 28 in the mounting process (NO in S34) (S42). However, if it is determined that an abnormality has occurred in the output of the sensor 28 in the mounting process, the mounting operation may be stopped. In this case, the processing after S38 can be omitted.

Further, in FIG. 4, the processes of S38 and S40 do not have to be executed. That is, the positioning process of the suction nozzle 6 in the height direction by the camera 23 can be omitted. Even with such a configuration, since the height position of the calibration nozzle 8 (that is, the height position of the mounting head 16) is calibrated in the calibration process, the electronic component 4 is appropriately referred to the circuit board 2. Can be implemented.

Further, in this embodiment, a mode in which the calibration process (FIG. 3) and the mounting process (FIG. 4) are performed in this order has been described. However, the order of performing the calibration process and the mounting process is not limited. Moreover, the calibration process and the mounting process may be performed independently.

The specific examples of the disclosed technology have been described in detail in the present specification, but these are merely examples and do not limit the scope of claims. The techniques described in the claims include various modifications and modifications of the specific examples illustrated above. In addition, the technical elements described in the present specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

2: Circuit board, 4: Electronic component, 6: Nozzle, 8: Calibration nozzle, 10: Component mounting device, 12: Component feeder, 14: Feeder holding part, 16: Mounting head, 16a: Holding part, 17: Moving Base, 18: Head movement mechanism, 20: Conveyor, 21: Imaging unit, 22: Camera support, 23: Camera, 24: Nozzle housing, 26: Nozzle holder, 28: Sensor, 30: Touch panel, 32: Control

Claims

A component mounting device that mounts components on a board.
With the head
A nozzle having one end detachable from the head and the other end capable of adsorbing the component.
A sensor for calibrating the height position of the nozzle mounted on the head, and
A calibration process for calibrating the height position of the nozzle and a mounting process for mounting the component on the substrate can be performed.
In the calibration process, a first detection operation for detecting a signal output from the sensor when the nozzle mounted on the head is moved to a predetermined position with respect to the sensor, and a signal output from the sensor. Perform a calibration operation, which calibrates the height position of the nozzle based on
In the mounting process, a second detection operation of detecting a signal output from the sensor when the nozzle mounted on the head is moved to the predetermined position with respect to the sensor, and a second detection operation of the nozzle being attracted to the nozzle. The mounting operation of mounting the component on the board is executed.
A control unit that outputs error information indicating that an abnormality has occurred in the sensor when it is determined that an abnormality has occurred in the output of the sensor in the first detection operation and the second detection operation. With,
Component mounting device.
The control unit
If it is determined that an abnormality has occurred in the output of the sensor in the first detection operation of the calibration process, the execution of the calibration operation is stopped.
The component mounting device according to claim 1, wherein when it is determined that an abnormality has occurred in the output of the sensor in the second detection operation of the mounting process, the execution of the mounting operation is continued.
It further includes a camera that captures the nozzle mounted on the head.
The component mounting device according to claim 1 or 2, wherein the control unit executes positioning in the height direction of the nozzle based on an image captured by the camera in the mounting process.
The sensor is a contact sensor and
In the first detection operation and the second detection operation, the control unit pushes the nozzle against the contact sensor by moving the nozzle to the predetermined position with respect to the contact sensor.
The component mounting device according to any one of claims 1 to 3, wherein when the nozzle is pressed against the contact sensor, the contact sensor outputs a signal indicating that the nozzle is pressed.