JP4578299B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus and component mounting method for mounting components on a circuit board. More specifically, the present invention relates to a board recognition system that positions and recognizes a circuit board carried into a component mounting apparatus at a predetermined mounting position, and mounting control that controls a component mounting operation using the board recognition system. The present invention relates to a method, and a component mounting apparatus and a component mounting method using the system and method.

  An example of the component mounting apparatus is shown in FIG. In the figure, a component mounting apparatus 1 includes a component supply unit 2 that supplies components to be mounted, a mounting head 4 that takes out components from the component supply unit 2 using a suction nozzle 3 and mounts them on a circuit board 14, and a mounting head. A robot 5 that transports 4 to a predetermined position, a component recognition device 6 that captures an image of the component held by the suction nozzle 3 and recognizes a deviation in position and angle, and a substrate holding device 7 that carries in and holds the circuit board 14. And a control unit 9 for controlling the overall operation.

  During the operation of the component mounting apparatus 1 configured as described above, the mounting head 4 moves to a position facing the component supply apparatus 8 mounted on the component supply unit 2 by conveyance of the robot 5, and uses the suction nozzle 3. Then, the parts are taken out from the parts supply device 8. Thereafter, the suction nozzle 3 moves to a position facing the component recognition device 6 by the movement of the mounting head 4, and recognizes the holding state of the component including the position and angle deviation of the sucked component.

  During this time, the circuit board 14 is carried into the component mounting apparatus 1 and is held at a predetermined mounting position by the board holding apparatus 7. The mounting head 4 holding the components on the suction nozzle 3 moves to a position facing the circuit board 14 by the conveyance of the robot 5. The board recognition device 15 attached to the mounting head 4 captures an image of the circuit board 14, recognizes the position / angle shift, and transmits the recognition result to the control unit 9. The control unit 9 is loaded with NC data in which the mounting positions of the components mounted on the circuit board 14 are recorded in advance. Based on the state of the component input from the component recognition device 6 and the state of the circuit board 14 input from the substrate recognition device 15, the control unit 9 commands the necessary correction for the position and angle of the suction nozzle 3.

  The mounting head 4 corrects the position and angle of the component 13 based on the command, and mounts the component 13 at a predetermined mounting position on the circuit board 14 using the nozzle 3. The mounting head 4 that has finished mounting the component moves again to the position facing the component supply device 8 by the transport of the robot 5, and repeats the operation so far. The circuit board 14 that has finished mounting all the predetermined components is carried out of the component mounting apparatus 1 by the board holding device 7, and then the next circuit board 14 is carried in and the operation so far is repeated.

  In the case of component mounting on the circuit board 14 on which the cream solder layer has been printed in advance, the circuit board 14 is then transported to the reflow device, and the components are soldered to the circuit board 14 by melting and cooling the cream solder layer. Is done. Further, in the case of component mounting on the circuit board 14 to which the adhesive layer has been applied in advance, the circuit board 14 is then transported to a heating device, and the thermosetting adhesive is cured, whereby each component is placed on the circuit board 14. It is fixed.

  FIG. 7 shows the substrate holding device 7 that holds the circuit board 14 at the mounting position, and a part of the front side is cut in the drawing. In the figure, the circuit board 14 is held by a pair of rail units 21 extending in the X direction and facing each other. Each rail unit 21 is provided with a groove 22 in a direction facing each other, and a flat belt 23 is stretched along the groove 22 so as to be movable. The flat belt 23 drawn in two stages is connected to both ends of the X direction (not shown) to be endless, and is engaged with a drive source such as a motor. The circuit board 14 is fitted on a pair of flat belts 23 so that both edges thereof fit into a pair of opposed groove portions 22 and can be conveyed and moved in the X direction in the figure.

  One of the rail units 21 (for example, the right side in the figure) can move in a direction (Y direction) opposite to the other rail unit 21 (the same left side), and the circuit board 14 of various width dimensions can be moved by this movement. Can be transported and held. On the upper surface of each rail unit 21, a reference rail 24 having an L-shaped cross section is fixed to a main rail 25 by a fixing pin 26. The surface (lower surface) of the L-shaped reference rail 24 facing the circuit board 14 restricts the upward movement of the circuit board 14, and the Z-direction reference surface of the circuit board 14 during component mounting. Form.

  A support table 27 is positioned below the rail units 21, and a required number of support pins 28 corresponding to the size of the circuit board 14 are erected on the support table 27. The support pins 28 can support the circuit board 14 from the back side during component mounting by contacting the back surface of the circuit board 14 as will be described later.

  The operation of the substrate holding device 7 configured as described above is as follows. First, when the circuit board 14 is carried into the component mounting apparatus 1 by a loader (not shown), the endless flat belt 23 of the board holding device 7 that rotates in synchronization with the loader mounts the circuit board 14 to the mounting position. Transport toward. A retractable stopper 16 protrudes at a predetermined mounting position so as to block the path of the circuit board 14. When the conveyed circuit board 14 hits the stopper 16, the circuit board 14 is positioned at a predetermined position, and at the same time, the flat belt 23 is stopped.

  Next, the support table 27 is lifted by extension of a cylinder (not shown) located below the support table 27, and the circuit board 14 is pushed upward together with the holding rail 29 that houses the flat belt 23. As a result, the upper surface of the circuit board 14 comes into close contact with the reference surface, which is the lower surface of the reference rail 24, and the circuit board 14 is positioned in the Z direction. At the same time, a plurality of support pins 28 erected on the support table 27 abut against the back surface of the circuit board 14 to support it from the back side, and support the circuit board 14 to withstand loads and vibrations during component mounting.

  The operation of the board holding device 7 after the component mounting is completed is contrary to the above-described operation. When the support table 27 is lowered, the pressing force of the flat belt 23 on the circuit board 14 is released, and the support is simultaneously performed. The support from the back side of the circuit board 14 by the pins 28 is released. Next, the flat belt 23 is re-driven to move the circuit board 14 further to the back of the drawing, and is placed on an unloader (not shown) that is driven in synchronization and carried out of the component mounting apparatus 1. At the same time, the next circuit board 14 is mounted on the flat belt 23 and carried to a predetermined position. When the circuit board 14 is unloaded, the stopper 16 temporarily retracts downward to allow the circuit board 14 to move. After unloading, the stopper 16 faces the next circuit board 14 and protrudes toward the fixed position again.

  By the way, a problem arises in the conveyance of the circuit board 14 by the board holding device 7 according to the above configuration as the component mounting speed increases. As a part of speeding up, the transport speed of the circuit board 14 is naturally increased. As a result, the impact when the circuit board 14 collides with the stopper 16 is inevitably increased, causing a problem. That is, when a circuit board 14 that has already been partially mounted in the previous process is carried in, the component 13 that has not yet been soldered or bonded is displaced due to the impact at the time of collision, take off. Due to the recent downsizing and multi-functionalization of electronic devices, the component mounting density on the circuit board 14 has also increased, so even if a slight misalignment occurs in the component 13, it can be an obstacle to the mounting operation in the next process. Alternatively, the circuit board 14 may cause a functional failure by being bonded and fixed while soldering or bonding while components are displaced.

  Further, the circuit board 14 may be bounced back to the stopper 16 due to an impact at the time of the collision, and there is a possibility that the circuit board 14 itself that should stop at a predetermined position by the stopper may be displaced. In addition, the rear end portion of the circuit board 14 tends to tilt to the left or right in the transport direction due to inertia due to the impact at the time of collision. As described above, after the circuit board 14 is carried into the predetermined mounting position, the board recognition device 15 (see FIG. 6) attached to the mounting head 4 images the circuit board 14 and shifts its position and angle. It is recognized and used to control component mounting operations. This recognition operation is normally performed by capturing at least two of the identification marks provided at the four corners of the circuit board 14 with the board recognition device 15. However, when the displacement or inclination of the circuit board 14 due to the impact becomes extreme (for example, when the displacement exceeds 0.5 mm), the board recognition device 15 captures the identification mark on the circuit board 14 within the field of view. Inconvenience such as recognition failure or re-adjustment of the field of view.

Countermeasures for avoiding these disadvantages have been considered in the prior art. FIG. 8 shows an outline thereof, and the figure shows the circuit board 14 positioned and held by the board holding device 7 facing the nozzle 3 mounted on the mounting head 4 from the side. The right side of the figure shows a loader 11 that carries the circuit board 14 into the component mounting apparatus, and the left side shows the unloader 12 that also carries the circuit board 14 out. In the figure, a sensor 31 is provided immediately before the position where the circuit board 14 conveyed by the substrate holding device 7 abuts against the stopper 16. The circuit board 14 being conveyed is detected by the sensor 31, and the detection result is transmitted to the control unit 9. The control unit 9 issues a command to reduce the conveyance speed of the flat belt 23 that conveys the circuit board 14 simultaneously with the reception of this signal, thereby suppressing the speed immediately before the circuit board 14 hits the stopper 16 and reducing the impact at the time of collision. (For example, refer to Patent Documents 1 and 2).
JP 9-255214 A JP 2000-138498 A

  However, there is still a problem with the countermeasures according to the prior art that reduce the impact when the circuit board 14 hits the stopper 16 described above. In correspondence with these prior arts, although the conveyance speed of the circuit board 14 is reduced, the means for finally positioning the circuit board 14 at the mounting position relies on the contact with the stopper 16. For this reason, even if the impact at the time of impact is reduced, it cannot be made zero at all. Due to the increase in the mounting density and the miniaturization of the components as described above, the positional displacement of the components that hinders the mounting operation due to such a slight impact, and mounting failures due to this, are likely to occur. Furthermore, even if a slight impact is applied, the circuit board 14 may be rebounded or tilted, making it difficult for the board recognition device 15 to recognize the board. In order to avoid these problems, if the collision speed with respect to the stopper 16 is further reduced, the time for transporting the circuit board 14 increases, which hinders high-speed operation.

  In addition, the sensor 31 for detecting the carry-in of the circuit board 14 used in the prior art is mainly an optical sensor. When the circuit board 14 has a through hole or a notch, or the tip of the circuit board 14 is used. When the portion has a unique shape including a curve, it is difficult to detect the correct position of the circuit board 14 by the sensor 31 in this portion, and there is a problem that the conveyance speed immediately before the collision cannot be surely reduced. Obtained. In order to avoid this, the positions and shapes of through holes, notches, or curved portions are different for each circuit board 14, and the mounting position of the sensor 31 may be fixed. The response was difficult. Further, in the conventional optical sensor, a recognition failure may occur due to the color of the circuit board itself.

  As described above, the present invention solves the above-mentioned problems caused by the prior art and eliminates the impact when the positioning of the circuit board 14 is stopped, thereby causing a problem due to component displacement or dropout, or the positional deviation or inclination of the circuit board 14 itself. Substrate recognition system and mounting control method capable of preventing recognition mark recognition failure occurring and enabling stable transport and positioning and recognition operation of circuit board 14, and component mounting apparatus and component mounting method using the system and method The purpose is to provide.

  The present invention captures and stops the circuit board 14 conveyed by using a recognition device such as a CCD camera or a line sensor without using a stopper 16 for forcibly stopping and positioning the circuit board 14. Or by decelerating the conveyance speed for stopping, and by using the same recognition device to accurately identify the variation in stop position caused by this, and controlling the component mounting operation based on the result In order to solve the above-described problems, specifically, the following contents are included.

  That is, according to one aspect of the present invention, there is provided a board holding device that conveys a circuit board and holds the circuit board at a component mounting position, a first board recognition apparatus that recognizes a position and an inclination of the held circuit board, And a control unit that controls a recognition position of the circuit board by the first board recognition apparatus, wherein the second board recognition apparatus recognizes a circuit board that is transported and stopped by the board transportation apparatus. The controller further includes a substrate near a stop position, and the controller instructs the stop of the transport operation of the substrate transport device when the second substrate recognition device detects the circuit board at a predetermined position in the field of view. Then, the recognition position of the circuit board by the first board recognition device is controlled based on the recognition result of the second board recognition device recognizing the stop position of the circuit board that has stopped naturally. On plate recognition system.

  The second recognition device may be a CCD camera or a line sensor arranged along the conveyance direction of the circuit board. When using a CCD camera, the controller further recognizes the tilt of the circuit board that has stopped naturally, and the control unit controls the recognition position of the first board recognition device based on both the stop position and tilt recognition results of the circuit board. It becomes possible to do. Further, the control unit stores in advance information relating to the form of each circuit board, and based on the recognition result relating to the form of the circuit board by the CCD camera, whether or not the circuit board is a predetermined circuit board to be processed It becomes possible to make a judgment. The information related to the form may include a color of the circuit board, a through hole provided in the circuit board, a notch, a unique form, and the like.

  The second substrate recognition device can be movable in any one of a transport direction of the circuit board, a direction orthogonal to the transport direction, and a direction perpendicular to the plane of the circuit board. In addition, the second board recognition device can be arranged at any position directly below the circuit board or below in the lateral direction with respect to the transport direction of the circuit board.

  Another aspect of the present invention is a mounting control method for controlling a component mounting operation by recognizing the position and inclination of the held circuit board after stopping the circuit board after carrying it to a predetermined mounting position. The circuit board is naturally stopped near the mounting position by stopping the transport operation for transporting the circuit board, and the stop position of the circuit board is identified by recognizing the naturally stopped circuit board. The present invention relates to a mounting control method for controlling a recognition position for recognizing a position / tilt of the circuit board based on stop position information of the circuit board.

  The inclination of the naturally stopped circuit board can be specified together, and the recognition position for recognizing the position / inclination of the circuit board can be controlled by adding the specified inclination information of the circuit board. Furthermore, it is possible to specify the form of the circuit board that has stopped naturally, and to determine whether the circuit board is a predetermined circuit board based on the form of the specified circuit board.

  When stopping the transport operation for transporting the circuit board, the circuit board to be transported is caught by the recognition device, and the circuit board is transported when the circuit board reaches a predetermined position within the field of view of the recognition device. The conveyance operation can be stopped, or the deceleration to the stop can be performed.

  Still another aspect of the invention includes a component supply unit that continuously supplies components, a mounting head that takes out components from the component supply unit and mounts them on a circuit board, and a robot that transports the mounting head. A component mounting apparatus that takes out a component from the component supply unit using a nozzle mounted on the mounting head and mounts the component at a mounting position of a circuit board held by the board holding device. The present invention relates to a component mounting apparatus including the circuit board recognition system.

  Still another aspect according to the present invention is a component mounting method in which a component supplied to a component supply unit is taken out by a suction nozzle, and the component is transported and mounted at a mounting position on a circuit board. The present invention relates to a component mounting method characterized by using the mounting control method.

  By implementing the present invention, the circuit board reaches a predetermined mounting position and stops spontaneously without hitting the stoppers, and the mounted parts are displaced or dropped due to an impact, or the circuit board itself is displaced or tilted. Therefore, stable component mounting can be performed. In addition, even a circuit board including a through hole or a notch can be recognized without being affected by the specifications of each circuit board, and can be positioned as prescribed. As a result, the defect rate of the circuit board is reduced, the board recognition failure is eliminated, and the product quality is stabilized and the equipment operation rate is improved.

  A board recognition system according to a first embodiment of the present invention and a mounting control method using the board recognition system will be described with reference to the drawings. Note that the same reference numerals are used for the same components as those described in the prior art, and in the following description, differences from the prior art will be mainly referred to. FIG. 1 shows an outline of a substrate recognition system according to the present embodiment. In the figure, the substrate recognition system includes a substrate holding device 7 that conveys and holds a circuit board 14, a substrate recognition device 15 that is attached to the mounting head 4 to recognize the position and inclination of the circuit board 14, and a control unit. 9 and a line sensor 41 is newly provided.

  The line sensor 41 is a sensor for recognizing an object by arranging many pixels in one line along a certain direction. In the present embodiment, the longitudinal direction of the line sensor 41 conveys the circuit board 14 as shown in FIG. It arrange | positions so that it may become substantially parallel to a direction (X direction of a figure). The line sensor 41 can detect the movement of the object along the line arrangement direction, whereas the conventional optical sensor 31 basically has only an ON / OFF detection function. In addition, with the new installation of the line sensor 41, the kind of stoppers that are stopped at a predetermined position by abutting the circuit board 14 are completely abolished.

  The substrate positioning system of the present embodiment configured as described above operates as follows. The circuit board 14 is mounted on the flat belt 23 of the board holding device 7 from the loader 11 located on the right side of the figure, and is moved from right to left in the figure by driving the flat belt 23. Near the predetermined mounting position, the forward end of the circuit board 14 is detected by one end of the line sensor 41. This situation is shown in FIG. The upper diagram shows the detection status of the line sensor 41, and among the plurality of pixels indicated by circles, pixels that are painted black detect the circuit board 14. Pixels indicated by white circles have not yet detected the circuit board 14. The hatched portion shown in the lower diagram schematically shows the tip of the circuit board 14 that has advanced. The detection result of the circuit board 14 by the line sensor 41 is transmitted to the control unit 9.

  The control unit 9 recognizes the moving position of the circuit board 14 that moves forward by a signal from the line sensor 41. When the movement position of the circuit board 14 reaches a predetermined position (for example, a position at a distance a from one end shown in FIG. 2A), the control unit 9 performs a flat transfer of the circuit board 14. A stop command for stopping the conveying operation of the belt 23 is issued. More specifically, a command for stopping a driving source such as a motor for driving the belt 23 is issued. By this command, the flat belt 23 stops, and the circuit board 14 mounted at the same time also stops naturally. The state at that time is shown in FIG. Similarly, black circles are pixels that recognize the circuit board 14, and white circles are pixels that are not recognized.

  The movement distance (ba) from the position where the stop command is issued to the position where the circuit board 14 actually stops (the position at the distance b from one end shown in FIG. 2B) is the circuit board that has been transported so far. 14, the inertia of the flat belt 23 and its driving mechanism, and the frictional force between the circuit board 14 and the flat belt 23. Therefore, the control unit 9 issues a drive operation stop command in advance of the movement distance (ba) due to these factors in accordance with various conditions. Note that the stop command referred to here includes not only stopping the flat belt 23 instantaneously but also stopping the flat belt 23 while decelerating the conveying speed of the flat belt 23 linearly or curvedly. Further, in this specification, it is not stopped by abutting against the stopper 16 as in the prior art, but stopped by stopping the transporting operation of the flat belt 23 (or a transporting tool equivalent thereto) that transports the circuit board 14. This phenomenon is called “natural stop”.

  In the stop using the stopper 16 according to the prior art, the circuit board 14 is surely stopped at a certain position on one side. It is possible to make it. However, in the natural stop according to the present embodiment, in addition to the above-described various factors that affect the stop, a temporary or local surface state difference due to contamination of the flat belt 23 or the circuit board 14, or the working environment. Due to the influence of other factors such as humidity, temperature, vibration, etc. on the friction force, the displacement of the stop position of the circuit board 14 ranges from 0.5 mm to several mm. Although it is possible to increase the accuracy of the stop position by slowing down the deceleration, it becomes an obstacle to increasing the mounting speed.

  If such a large misalignment is left unattended, the recognition operation by the board recognition device 15 for recognizing the identification mark on the circuit board 14 and controlling the component mounting position will be hindered. Therefore, in the board recognition system according to the present embodiment, measures are taken to avoid an adverse effect due to variations in the stop position of the circuit board 14 that is naturally stopped in this way. As shown in FIG. 2B, the stopped circuit board 14 is recognized to identify an accurate stop position, and the control unit 9 controls the recognition position by the board recognition device 15 based on the information of the recognition result. It is supposed to be. More specifically, the control unit 9 corrects the moving direction and moving amount of the mounting head 4 to which the board recognition device 15 is attached based on the stop position specifying result of the circuit board 14, and affects the influence of the stop position variation. It is supposed to be excluded. Therefore, the line sensor 41 needs to be able to recognize from the generation of the stop command signal (distance a shown in FIG. 2A) to the stop position of the circuit board 14 (distance b shown in FIG. 2B). It must be a line sensor in which pixels of an appropriate length are arranged.

  Further, even if the circuit board 14 has a through hole, a notch, a curved shape, etc., it is possible to eliminate the recognition failure of the circuit board stop position by storing the information in the control unit 9 in advance. . This is because, unlike the ON-OFF detection method such as the optical sensor 31, it is possible to always detect the tip of the circuit board 14 that moves forward by using the line sensor 41.

  Thus, according to the board stop position detection system according to the present embodiment, the circuit board conveyed to the component mounting apparatus can be naturally stopped near the predetermined position without using a stopper. As a result, it is possible to eliminate various problems associated with the impact at the time of hitting the stopper. In addition, the variation of the stop position of the circuit board due to the natural stop can be eliminated by grasping the accurate stop position of the circuit board and using it for the movement control of the mounting head. As a result, all the problems caused by not using the stopper are eliminated, and the accurate stop position of the circuit board is used for control, so that the recognition operation can be performed more reliably.

  Next, a substrate recognition system according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 shows a substrate recognition system according to the present embodiment. Here, instead of the line sensor 41 in the previous embodiment, a circuit board that moves by providing a CCD camera 51 near the mounting position as a recognition device. 14 is detected. About another structure, it is the same as that of previous embodiment including that a stopper is unnecessary.

  The operation of the substrate recognition system according to this embodiment is basically the same as that of the previous embodiment. The circuit board 14 carried in from the right side of the drawing is placed on the flat belt 23 and conveyed to the left side in the X direction, and the circuit board 14 reaching the vicinity of a predetermined component mounting position is detected by the CCD camera 51. The detected image at that time is as shown in the lower diagram of FIG. When the circuit board reaches a predetermined position in the image (for example, distance a in the figure), the control unit 9 issues a stop command for the transport operation, and the circuit board 14 is, for example, the lower side of FIG. Naturally stops at the position (distance b) shown in the figure.

  After the stop command, the distance (ba) in which the circuit board 14 moves until it stops naturally is the same as that shown in the previous embodiment. In order to eliminate the adverse effect on the mounting accuracy due to this variation, in the present embodiment, the stop position is accurately determined from the recognition image of the stop state of the circuit board 14 captured by the CCD camera 51 shown in the lower diagram of FIG. And by recognizing the amount of movement of the mounting head 4 based on the specific information, the recognition position of the circuit board 14 by the board recognition device 15 can be accurately controlled.

  By replacing the line sensor 41 that captures a linear image with a CCD camera 51 that can also be called an area sensor that captures a planar image, the system according to the present embodiment further obtains the following additional advantages. Can do. First, as shown in FIG. 4A, the circuit board 14 may stop at an angle θ with respect to the original stop line indicated by a broken line. In the present invention, since the stopper is not used when the circuit board 14 is stopped, the inclination of the circuit board 14 due to an impact does not occur. However, such an inclination may occur due to vibration of the equipment or some other factor. By using the CCD camera 51, when such an inclination θ is detected, the control unit 9 can calculate the amount of deviation of the recognition position of the circuit board 14 associated therewith. Based on the result, the moving direction and moving amount of the mounting head 4 are controlled, and the position and inclination of the circuit board 14 can be accurately recognized by positioning the board recognition device 15 at an appropriate recognition position.

  Further, in the example shown in FIG. 4B, a unique through hole 32 and a notch 33 are provided in the circuit board 14 that has been carried in. By using the CCD camera 51, it is possible to eliminate the adverse effects on the stop position recognition due to these factors, and also to make more active use. That is, the control unit 9 stores in advance information on these unique forms unique to the circuit board 14 and captures the image of the circuit board 14 that has been transported, so that the circuit board 14 is initially planned. It is possible to determine whether or not by referring to images of these unique forms. In the unlikely event that the recognized image does not match that stored in advance, the occurrence of defective products can be prevented in advance by avoiding component mounting on the circuit board 14. A conventional optical sensor having only an ON-OFF identification function cannot expect such a result.

  In order to further improve the recognition function, in another aspect of the present embodiment, the field of view of the CCD camera 51 can be changed, or the installation position of the CCD camera 51 can be moved. Normally, the CCD camera 51 has a field of view of 32 mm square, but this field of view may be changed if necessary to improve the image recognition function described above. In general, since the visual field and the resolution are in a trade-off relationship, the visual field can be adjusted as long as this relationship is acceptable. The visual field can also be adjusted by adjusting the distance of the CCD camera 51 from the circuit board 14 in the vertical direction in the figure.

  In addition, it is possible to move the CCD camera in the left-right direction in FIG. 3 or in the direction perpendicular to the drawing by using a base that holds the CCD camera 51 as a slide type or a link type. According to the prior art, there is a limitation in freely moving the sensor 31 in order to maintain the positional relationship with the stopper 16. In the present embodiment, since the CCD camera 51 is provided alone (there is no restriction by the stopper 16), the degree of freedom is increased, an appropriate arrangement position according to the specifications of the circuit board 14, and further, an appropriate arrangement of the circuit board 14 is provided. A stop position can be selected.

  FIG. 5 shows one such correspondence. In the figure, the circuit board 14 is viewed from the front in the transport direction (X direction in FIG. 3). In the figure, the CCD camera 51 is disposed not at a position directly below the circuit board 14 but at a position retracted to the right side (or the left side) with respect to the conveyance direction of the circuit board 14.

  The substrate holding device 7 is provided with a large number of support pins 28 for supporting the circuit board 14 from below, and unlike the conventional optical sensor 31, a CCD camera 51 that requires a large space is mounted on the circuit board 14. In some cases, it may be difficult to dispose it immediately below the position. As shown in FIG. 5, the CCD camera 51 is arranged not laterally below the circuit board 14 but in a lateral direction with respect to the conveyance direction (direction perpendicular to the drawing) of the circuit board 14, thereby supporting the support pins 28 and the like. Interference is avoided, and storage becomes easy. This is particularly advantageous when the CCD camera 51 is installed on existing equipment. Distortion of the recognized image caused by imaging the circuit board 14 from an oblique position can be easily corrected by the control unit 9.

  When the CCD camera 51 according to the present embodiment is compared with the line sensor 41 shown in the first embodiment, since the line sensor 41 has an elongated shape, the circuit avoids interference with the support pin 28. It can be understood that it is easy to dispose directly under the substrate 14. However, even the line sensor 41 can of course be arranged at a position shifted laterally with respect to the loading direction of the circuit board 14 as in the CCD camera 51 shown in FIG. Further, as compared with the combination of the stopper 16 and the sensor 31 in the prior art, it is also easy to move the position of the line sensor 41 back and forth and from side to side with respect to the circuit board conveyance direction. This is the same as the CCD camera 51.

  As mentioned above, although the board | substrate recognition system of each embodiment concerning this invention was described, application of this invention is not limited to what was described so far. For example, the line sensor 41 and the CCD camera 51 for recognizing advance and stop positions of the circuit board 14 may be other devices (for example, laser displacement meters, super A sonic sensor or the like). In the above description, the circuit board 14 is carried into the component mounting apparatus 1 and positioned. However, for example, cream solder or cream solder application for printing an adhesive on the surface of the circuit board is performed. Even when the circuit board 14 is carried into the apparatus or the adhesive application device, the same can be applied.

  In the above description, the circuit board 14 is stopped naturally, and the board recognition system that detects the stop position and controls the recognition position of the board recognition device 15 has been described. It also includes a mounting control method to be used, a board mounting system, a component mounting apparatus that enables accurate and efficient component mounting using the mounting control method, and a component mounting method.

  A board recognition system, a mounting control method, a component mounting apparatus, and a component mounting method using the board recognition system according to the present invention are widely used in the industrial field of component mounting for mounting a component such as an electronic component on a circuit board. be able to.

It is a side view showing an outline of a substrate recognition system of an embodiment concerning the present invention. It is explanatory drawing which shows the stop position detection condition of the circuit board using the line sensor or CCD camera in the board | substrate recognition system of embodiment concerning this invention. It is a side view which shows the outline | summary of the board | substrate recognition system of other embodiment concerning this invention. It is explanatory drawing which shows the detection condition of the circuit board which uses the CCD camera in the board | substrate recognition system shown in FIG. It is a front view which shows the other aspect of the board | substrate recognition system shown in FIG. 1 is a perspective view of a component mounting apparatus to which a board stop position detection system according to the present invention is applicable. It is a perspective view which shows the detail of the board | substrate holding | maintenance apparatus contained in the component mounting apparatus shown in FIG. It is a side view which shows the outline | summary of the board | substrate recognition system by a prior art.

Explanation of symbols

1. 1. component mounting device; 2. parts supply unit; 3. Adsorption nozzle, 6. mounting head; 8. substrate holding device; 10. control unit Loader, 12. Unloader, 13. Parts, 14. Circuit board, 15. Board recognition device, 16. Stopper, 23. Flat belt, 27. Support table, 28. Support pins, 41. Line sensor, 51. CCD camera.

Claims (4)

A board holding device that conveys the circuit board and holds it at the component mounting position;
A first board recognition device for recognizing the position and inclination of the held circuit board;
A control unit for controlling a recognition position when the first substrate recognition device recognizes a circuit board;
In a component mounting apparatus comprising a second substrate recognition device arranged near the component mounting position for recognizing a circuit board conveyed by the substrate holding device,
The first board recognition device is attached to a mounting head for mounting a component on the held circuit board,
The second substrate recognition device is a CCD camera arranged at any position directly below the held circuit board or below in the lateral direction with respect to the transport direction of the circuit board,
The control unit commands the stop of the transport operation of the substrate holding device when the second substrate recognition device detects the circuit substrate at a predetermined position in the field of view, thereby A component mounting apparatus that controls a recognition position of a circuit board by the first substrate recognition device based on a recognition result of the second substrate recognition device recognizing a stop position and an inclination. The control unit stores in advance information related to the form of each circuit board,
The control unit further determines whether or not the circuit board is a predetermined circuit board to be processed based on a recognition result of the form of the circuit board by the CCD camera. The component mounting apparatus according to 1.   The component mounting apparatus according to claim 2, wherein the information according to the form is any one of a color of the circuit board, a through hole provided in the circuit board, a notch, and a unique form.   The second board recognition device is movable in one of a transport direction of the circuit board, a direction orthogonal to the transport direction, and a direction perpendicular to the plane of the circuit board. The component mounting apparatus described in 1.

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