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WO2020216259A1 - 显示面板、显示装置及制造方法 - Google Patents

显示面板、显示装置及制造方法 Download PDF

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Publication number
WO2020216259A1
WO2020216259A1 PCT/CN2020/086199 CN2020086199W WO2020216259A1 WO 2020216259 A1 WO2020216259 A1 WO 2020216259A1 CN 2020086199 W CN2020086199 W CN 2020086199W WO 2020216259 A1 WO2020216259 A1 WO 2020216259A1
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WO
WIPO (PCT)
Prior art keywords
display
hole
display panel
layer
conductive structure
Prior art date
Application number
PCT/CN2020/086199
Other languages
English (en)
French (fr)
Inventor
王纯阳
田宏伟
李栋
李良坚
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/256,192 priority Critical patent/US11960180B2/en
Publication of WO2020216259A1 publication Critical patent/WO2020216259A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • G—PHYSICS
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    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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    • H10K59/131—Interconnections, e.g. wiring lines or terminals
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    • H—ELECTRICITY
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    • H10K59/10—OLED displays
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    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs

Definitions

  • This application relates to the field of display technology, in particular to a display panel, a display device and a manufacturing method.
  • a control integrated circuit (English: integrated circuit; abbreviation: IC) is usually arranged on the back of the display panel, and then the control circuit inside the display panel is routed to the back to correspond to the control IC. connection.
  • IC integrated circuit
  • a display panel selects a flexible base substrate and bends the flexible base substrate to the back of the display panel, and the control circuit of the display panel is connected to the control IC on the back through the bent part.
  • the embodiments of the present application provide a display panel, a display device, and a manufacturing method.
  • the technical solution is as follows:
  • a display panel including:
  • a base substrate having a first through hole
  • a conductive structure the conductive structure is located on the base substrate, and the conductive structure at least partially covers the first through hole;
  • a display structure the display structure includes a first display structure, a control circuit, and a second display structure on the side where the conductive structure of the base substrate is stacked, the first display structure having a second through hole, the The control circuit is electrically connected to the conductive structure through the second through hole.
  • the display panel includes a fingerprint recognition component, and the fingerprint recognition component includes a perforated light shielding layer and a fingerprint recognition sensor;
  • the conductive structure and the perforated light shielding layer are in the same layer structure, and the fingerprint recognition sensor is located on the side of the perforated light shielding layer away from the display structure.
  • the display panel includes a substrate layer, and the substrate layer is located between the conductive structure and the first display structure,
  • the substrate layer has a third through hole communicating with the second through hole of the first display structure, and the control circuit is electrically connected to the conductive structure through the second through hole and the third through hole .
  • both the base layer and the base substrate include a polyimide structure layer and a barrier layer laminated in a direction close to the display structure.
  • the material of the barrier layer includes silicon oxide.
  • the material of the conductive structure and the light shielding layer with holes includes metal.
  • the conductive structure is located in the display area of the display panel.
  • the first display structure includes a buffer layer and an active layer.
  • the material of the buffer layer includes silicon nitride or silicon oxide.
  • the second display structure includes a driving circuit layer, an organic light-emitting layer, and an encapsulation layer that are sequentially arranged in a direction away from the first display structure.
  • the second display structure includes a liquid crystal layer and a color filter substrate arranged in sequence along a direction away from the first display structure.
  • the fingerprint recognition sensor is located on a side of the base substrate away from the display structure.
  • the first through hole and the second through hole are coaxial.
  • the first through hole is located in an area where the orthographic projection of the conductive structure on the base substrate is located.
  • the display panel includes a fingerprint recognition component, and the fingerprint recognition component includes a perforated light shielding layer and a fingerprint recognition sensor;
  • the conductive structure and the perforated light shielding layer are in the same layer structure, the fingerprint recognition sensor is located on the side of the perforated light shielding layer away from the display structure, and the conductive structure is located in the display area of the display panel ;
  • the display panel includes a substrate layer located between the conductive structure and the first display structure,
  • the substrate layer has a third through hole communicating with the second through hole of the first display structure, and the control circuit is electrically connected to the conductive structure through the second through hole and the third through hole
  • the first display structure includes a buffer layer and an active layer
  • the second display structure includes a driving circuit layer, an organic light emitting layer, and an encapsulation layer that are sequentially arranged in a direction away from the first display structure;
  • the first through hole is coaxial with the second through hole, and the first through hole is located in an area where the orthographic projection of the conductive structure on the base substrate is located.
  • a method for manufacturing a display panel includes:
  • a display structure is formed on a base substrate on which the conductive structure is formed, and the display structure includes a first display structure, a control circuit, and a second display structure on the side where the conductive structure of the base substrate is stacked, so The first display structure has a second through hole, and the control circuit is electrically connected to the conductive structure through the second through hole;
  • a first through hole is formed on the base substrate, and the conductive structure at least partially covers the first through hole.
  • the forming a conductive structure on the base substrate includes;
  • the conductive structure and the light-shielding layer with holes are formed on the base substrate by one patterning process, the display panel includes a fingerprint recognition component, and the fingerprint recognition component includes the light-shielding layer with holes and a fingerprint recognition sensor.
  • the fingerprint recognition sensor is located on the side of the perforated light shielding layer away from the display assembly.
  • the forming a first through hole on the base substrate includes:
  • the first through hole is formed on the base substrate through a laser drilling process.
  • a display device in another aspect, includes a control integrated circuit and a display panel, the display panel includes a base substrate; a conductive structure, the conductive structure is located on the base substrate, the substrate The substrate has a first through hole, the conductive structure at least partially covers the first through hole; a display structure, the display structure includes a first display structure on the side where the conductive structure of the base substrate is stacked, and a control A circuit and a second display structure, the first display structure has a second through hole, and the control circuit is electrically connected to the conductive structure through the second through hole;
  • the control integrated circuit is electrically connected to the conductive structure through the first through hole.
  • the display device includes a flexible substrate, and the control integrated circuit is located on the flexible substrate and is electrically connected to the conductive structure through the flexible substrate.
  • control integrated circuit is electrically connected to the conductive silver glue.
  • Fig. 1 is a schematic structural diagram of a display device
  • FIG. 2 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • FIG. 4 is a plan view of a structure such as a perforated light shielding layer and a conductive structure in the display panel shown in FIG. 3;
  • FIG. 5 is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a base substrate in the embodiment shown in FIG. 5;
  • FIG. 7 is a schematic structural diagram of another base substrate in the embodiment shown in FIG. 5;
  • FIG. 8 is a schematic structural view of another base substrate in the embodiment shown in FIG. 5;
  • FIG. 9 is a flowchart of a method for manufacturing a display device according to an embodiment of the present application.
  • Fig. 10 is a flow chart of controlling the electrical connection between the integrated circuit and the conductive structure in the embodiment shown in Fig. 9;
  • FIG. 11 is a schematic structural diagram of a display device in the embodiment shown in FIG. 9.
  • the display device includes a display panel and a control IC-13
  • the display panel includes a base substrate 11 and a control circuit 12 arranged on the base substrate 11
  • the control IC-13 is located on a flexible base On 14
  • the flexible base 14 is located on the base substrate 11, and the flexible base 14 and the IC-13 located on it can be collectively referred to as a chip on film (English: Chip On Film; abbreviated as COF).
  • the flexible substrate 14 may include a flexible layer (which may be composed of polyimide) and conductive lines on the flexible layer.
  • the base substrate 11 of the display panel is made of a flexible material, so that the flexible base 14 and IC-13 can be bent to the back of the display panel (the back of the display panel is the side of the display panel that does not display images) to reduce the frame of the display panel.
  • the control circuit 12 is electrically connected to the control IC-13 through the bent part and the flexible substrate 14.
  • the method shown in Figure 1 can reduce the frame of the display panel to a certain extent (the part of the display panel except the display area can be called the frame of the display panel), the curved part w will still increase the frame of the display panel.
  • bending may also cause various defects in the display panel (for example, various circuits may be broken due to bending).
  • punch holes directly on the back of the display panel so that the control IC on the back can be electrically connected to the control circuit inside the display panel.
  • the depth of the holes required is too deep (a penetrating hole is formed directly from the back of the display panel).
  • the depth of the hole in the layer where the control circuit is located is relatively deep, and the technical difficulty of drilling too deep is more difficult, which may cause serious problems such as damage to the display panel), which is difficult to implement.
  • the thickness of the bent part is even greater than twice the thickness of the display panel, which is very unfavorable to the development trend of thinner and lighter display panels.
  • FIG. 2 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • the display panel 20 may include:
  • the conductive structure 22, the conductive structure 22 is located on the base substrate 21, the base substrate 21 has a first through hole 21a, and the conductive structure 22 at least partially covers the first through hole 21a, that is, the conductive structure 22 is not provided on the base substrate 21 On one side, the conductive structure 22 is exposed at the first through hole 21a.
  • the display structure 23 includes a first display structure 231, a control circuit 232, and a second display structure 233 stacked on the side of the conductive structure 22 of the base substrate 21.
  • the first display structure 231 has a second through hole ( 2), the control circuit 232 is electrically connected to the conductive structure 22 through the second through hole.
  • a display panel provided by an embodiment of the present application is provided with a conductive structure between the display structure and the base substrate, and the first display structure on one side of the conductive structure and the base substrate on the other side Through holes are respectively provided, the conductive structure and the control circuit are electrically connected through the through holes between the conductive structure and the control circuit, and the conductive structure can be electrically connected to the control integrated circuit on the back of the display panel through the through hole on the base substrate.
  • the control integrated circuit on the back of the display panel can be electrically connected with the control circuit inside the display panel. Since there is no need to bend the base substrate, the width of the frame increased by the bent portion can be reduced. The problem that the width of the border of the display panel is wider in the related art is solved. The effect of reducing the frame of the display panel is achieved.
  • FIG. 3 shows a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • the display panel is adjusted based on the display panel shown in FIG. 2.
  • the display panel 20 includes a fingerprint recognition component 24, and the fingerprint recognition component 24 includes a perforated light shielding layer 241 and a fingerprint recognition sensor 242.
  • the fingerprint recognition sensor 24 is located on the side of the perforated light shielding layer 241 away from the display structure 23.
  • the display component can emit light (the light can be the light used for display, or it can be the light used for fingerprint recognition).
  • the perforated light shielding layer 241 may have a plurality of openings for allowing light emitted from the display structure and reflected by the touch body to pass through the perforated light shielding layer 241 and be sensed by the fingerprint recognition sensor 242.
  • the conductive structure 22 and the apertured light shielding layer 241 are the same layer structure formed by the same patterning process. That is, the conductive structure 22 and the perforated light-shielding layer 241 can be formed in one patterning process through the same mask (English: MASK), which is convenient and quick, not only saves the manufacturing cost, but also simplifies the structure of the display panel.
  • FIG. 3 shows a situation where the fingerprint recognition sensor 242 is located on the side of the base substrate 21 away from the display structure 23.
  • This arrangement can avoid the fingerprint recognition sensor 242 being disposed on the side of the base substrate 21 close to the display structure 23.
  • the display structure 23 influences each other.
  • the fingerprint recognition sensor 242 may also be located in other positions, for example, may also be located on the side of the base substrate 21 close to the display structure 23, which is not limited in the embodiment of the present application.
  • the first through hole 21a is coaxial with the second through hole.
  • the axes of the first through hole 21a and the second through hole are both z, so that the area occupied by the first through hole and the second through hole on the display panel can be reduced, and the structure is less effective for display The influence of the panel border.
  • the first through hole and the second through hole may both be round holes, and the two round holes may be arranged directly opposite.
  • the first through hole 21a is located in an area where the orthographic projection of the conductive structure 22 on the base substrate is located. That is, the conductive structure 22 can completely cover the first through hole 21a, so that the contact area between the conductive structure 22 and the touch IC can be increased, and the electrical connection performance can be improved.
  • FIG. 4 it is a top view of the structure of the perforated light shielding layer 241 and the conductive structure 22 in the display panel shown in FIG.
  • the perforated light shielding layer 241 has a plurality of openings, and the light emitted by the display structure and reflected by the touch body can pass through the plurality of openings and be sensed by the fingerprint recognition sensor 242.
  • the conductive structure 22 includes a plurality of block structures to facilitate connection with a plurality of contacts on the control IC (or called bonding (English: bonding)).
  • the fingerprint identification component in the display panel provided by the embodiment of the application and the perforated light shielding layer 241 therein can be used to realize the function of fingerprint identification under the screen through the principle of small hole imaging.
  • the perforated light shielding layer 241 may be formed by a plasma chemical vapor deposition (English: Plasma Enhanced Chemical Vapor Deposition; abbreviated as: PECVD) process (or other vapor deposition process).
  • the material of the conductive structure 22 and the holed light shielding layer 241 includes metal.
  • the conductive performance and light shielding performance of the metal material are generally strong, which can meet the requirements of the conductive structure 22 for the conductive performance and meet the requirements for the light shielding performance of the apertured light shielding layer 241.
  • the display panel 20 includes a substrate layer 25, and the substrate layer 25 is located between the conductive structure 22 and the first display structure 231.
  • the substrate layer 25 has a third through hole (not marked in FIG. 3) communicating with the second through hole (not marked in FIG. 3) of the first display structure 231, and a control line 232 (the control line may include VSS (common connection) Lines) and VDD (working voltage connection lines) are electrically connected to the conductive structure 22 through the second through holes and the third through holes.
  • the substrate structure of the display panel 20 may be composed of the substrate layer 25 and the substrate substrate 21 together, and the conductive structure 22 and the light shielding layer 241 with holes may be located between the substrate layer 25 and the substrate substrate 21.
  • both the second through hole and the third through hole can be formed by a patterning process.
  • the involved patterning process may include forming a photoresist, exposing and developing the photoresist, etching the underlying film using the developed photoresist as a mask, and stripping the photoresist Wait.
  • the perforated light-shielding layer is usually located above the entire substrate structure. Since the active layer and other structures will be formed on the perforated light-shielding layer 241 later, in order to avoid the perforated light-shielding layer in the process of forming the active layer 241 causes damage (for example, laser annealing and other processes will seriously affect the apertured light shielding layer 241), a protective layer will be formed on the apertured light shielding layer 241 first (for example, a lower power chemical vapor deposition process is used to form a silicon oxide layer as the protective layer ) To protect the perforated light shielding layer 241.
  • a protective layer will be formed on the apertured light shielding layer 241 first (for example, a lower power chemical vapor deposition process is used to form a silicon oxide layer as the protective layer ) To protect the perforated light shielding layer 241.
  • this not only makes the structure of the display panel more complicated, but also increases the manufacturing cost and manufacturing time.
  • the perforated light shielding layer 241 and the conductive structure 22 are arranged between the base layer 25 and the base substrate 21, and the perforated light shielding layer 241 and the conductive structure 22 are protected by the base layer 25, and no protection is required.
  • the layer simplifies the structure and manufacturing process of the display panel, and reduces the manufacturing cost.
  • the substrate layer can be used as a flat layer, and the perforated light shielding layer is far from the active layer, which will not affect the flatness of the active layer, thereby making the crystal grains in the active layer after laser annealing more uniform and improving The display effect of the display panel.
  • both the base layer 25 and the base substrate 21 include a polyimide (English: Polyimide; abbreviation: PI) structure layer 211 and a barrier (English: BARRIER) layer 212 stacked in a direction close to the display structure 23.
  • the material of the barrier layer 212 may include silicon oxide.
  • the laminated PI structure layer 211 and the barrier layer 212 can form a substrate structure with better performance, and the PI structure layer 211 can be located on the side of the barrier layer 211 away from the conductive structure.
  • the PI structure layer 211 may also be located on the side of the barrier layer 211 close to the conductive structure, which is not limited in the embodiment of the present application.
  • the conductive structure 22 is located in a display area (not shown in FIG. 3) of the display panel. Since the conductive structure 22 is located in the substrate structure formed by the substrate layer 25 and the substrate substrate 21, it will not block the display structure, and thus will not affect the normal display of the display panel. Therefore, the conductive structure 22 may be located in the display area of the display panel, which can reduce the width of the frame of the display panel. In addition, the conductive structure 22 may also be located in a peripheral area outside the display area of the display panel, which is not limited in the embodiment of the present application.
  • the first display structure 231 includes a buffer (English: Buffer) layer 231a and an active layer 231b.
  • the material of the buffer layer 231a may include silicon nitride or silicon oxide.
  • the active layer 231b may be made of polysilicon, and the polysilicon may be obtained from amorphous silicon after an annealing process (such as an Excimer Laser Anneal (English: Excimer Laser Anneal; abbreviation: ELA) process).
  • the second display structure 233 may include different devices.
  • the second display structure 233 may include a driving circuit layer 233a, an organic light emitting layer 233b, an encapsulation layer 233c, etc., which are sequentially arranged in a direction away from the first display structure 231.
  • the driving circuit layer 233a may include structures such as pixel circuits for driving the organic light-emitting layer and control leads
  • the organic light-emitting layer 233b may include structures such as an anode, an electroluminescent (English: electroluminescent; abbreviation: EL) layer, and a cathode that are sequentially stacked.
  • the encapsulation layer 233c may be an encapsulation layer formed by thin film encapsulation technology or other related technologies.
  • the encapsulation layer 233c may be a glass glue encapsulation layer.
  • the second display structure 233 may include structures such as a liquid crystal layer and a color filter substrate.
  • the first through hole 21a may be formed by a laser drilling process. After the other structures of the display panel are manufactured, a hole can be punched from the back of the display panel through a laser drilling process until the conductive structure 22 is exposed. The first through hole 21a can be used to enable the conductive structure 22 to be electrically connected to the control IC on the back of the display panel.
  • the display panel provided by the embodiment of the present application does not need to bend the edge area, it will not increase the overall thickness due to the bending, thereby making the overall display panel thinner, which is conducive to the development trend of lighter and thinner display panels.
  • a display panel provided by an embodiment of the present application is provided with a conductive structure between the display structure and the base substrate, and the first display structure on one side of the conductive structure and the base substrate on the other side Through holes are respectively provided, the conductive structure and the control circuit are electrically connected through the through holes between the conductive structure and the control circuit, and the conductive structure can be electrically connected to the control integrated circuit on the back of the display panel through the through hole on the base substrate.
  • the control integrated circuit on the back of the display panel can be electrically connected with the control circuit inside the display panel. Since there is no need to bend the base substrate, the width of the frame increased by the bent portion can be reduced. The problem that the width of the border of the display panel is wider in the related art is solved. The effect of reducing the frame of the display panel is achieved.
  • FIG. 5 is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present application, and the method includes:
  • Step 501 Provide a base substrate.
  • the base substrate may be a multilayer structure including a polyimide structure layer and a barrier layer.
  • a polyimide structure layer may be a multilayer structure including a polyimide structure layer and a barrier layer.
  • a barrier layer may be a multilayer structure including a polyimide structure layer and a barrier layer.
  • Step 502 forming a conductive structure on the base substrate.
  • the light shielding layer with holes can also be formed in the same patterning process.
  • the perforated light-shielding layer is a structure in the fingerprint identification component, and the fingerprint identification component also includes a fingerprint recognition sensor.
  • the perforated light-shielding layer is used to pass the light emitted by the display structure and reflected by the touch body, so as to be passed by the fingerprint Recognition sensor sensing.
  • FIG. 6 it is a schematic diagram of the structure of the base substrate at the end of step 502.
  • the perforated light shielding layer 241 and the conductive structure 22 are formed on the base substrate 21.
  • the base substrate 21 includes a polyimide structure layer 211 and a barrier layer 212 stacked in a direction close to the display structure 23.
  • the structure of the perforated light-shielding layer 241 and the conductive structure 22 can be described with reference to FIG. 4 and the corresponding text, and details are not described in the embodiment of the present application.
  • Step 503 forming a base layer on the base substrate on which the conductive structure is formed.
  • the structure of the base layer may be similar to that of the base substrate, and it is also a multilayer structure including a polyimide structure layer and a barrier layer.
  • Step 504 forming a display structure on the base substrate on which the base layer is formed.
  • the display structure includes a first display structure, a control circuit, and a second display structure that are sequentially formed on the side of the conductive structure of the base substrate.
  • the first display structure has a second through hole (the second through hole can be formed by a patterning process). ), the control circuit is electrically connected to the conductive structure through the second through hole.
  • the first display structure, control circuit, and second display structure reference may be made to the first display structure 231, the control circuit 232, and the second display structure 233 in the display panel shown in FIG. 3, which will not be repeated in this embodiment of the application.
  • FIG. 7 it is a schematic diagram of the structure of the base substrate at the end of step 503.
  • the control circuit 232 is electrically connected to the conductive structure 22 through the first display structure 231 and the through hole on the substrate layer 25.
  • the meanings of other marks in Fig. 7 can be referred to Fig. 3, which will not be repeated here.
  • step 503 in the embodiment of the present application is an optional step, that is, after step 502 is completed, the substrate layer is not formed, and step 504 is performed, correspondingly on the substrate substrate with conductive structure Form the display structure.
  • Step 505 forming a first through hole on the base substrate, and the conductive structure at least partially covers the first through hole.
  • a through hole may be formed on the base substrate through a laser drilling process from the side of the base substrate where the conductive structure is not provided, until the conductive structure is exposed at the through hole, and the conductive structure may at least partially cover the first through hole. Since only the base substrate is punched, the depth of the first through hole is shallow, and the difficulty of punching is lower.
  • FIG. 8 it is a schematic diagram of the structure of the base substrate at the end of step 505.
  • the conductive structure 22 is exposed at the first through hole 21a, and the conductive structure 22 can be electrically connected to the control IC through the through hole, and the control IC can be electrically connected to the control circuit 232 inside the display panel through the conductive structure 22.
  • the control IC located on the back of the display panel can be electrically connected with the control circuit inside the display panel, which not only avoids various defects of the display panel that may be caused by bending, but also realizes the reduction of the display panel frame Effect.
  • an embodiment of the present application provides a method for manufacturing a display panel.
  • a conductive structure is formed between the display structure and the base substrate, and the first display structure on one side of the conductive structure and the other
  • the base substrate is provided with through holes, and the conductive structure and the control circuit are electrically connected through the through holes between the conductive structure and the control circuit, and the conductive structure can be electrically connected to the control integrated circuit on the back of the display panel through the through hole on the base substrate.
  • the control integrated circuit on the back of the display panel can be electrically connected with the control circuit inside the display panel. Since there is no need to bend the base substrate, the width of the frame increased by the bent portion can be reduced. The problem that the width of the border of the display panel is wider in the related art is solved. The effect of reducing the frame of the display panel is achieved.
  • FIG. 9 is a flowchart of a method for manufacturing a display device according to an embodiment of the present application, and the method includes:
  • Step 901 Provide a display panel.
  • the display panel may be the display panel shown in FIG. 3.
  • Step 902 Provide a control integrated circuit.
  • the control integrated circuit may be a device for controlling the display function of the display panel.
  • Step 903 Electrically connect the control integrated circuit and the conductive structure through the first through hole.
  • the control integrated circuit can be arranged on the side of the base substrate away from the conductive structure, that is, on the back of the display panel. Such arrangement can reduce the frame width of the display panel.
  • the control integrated circuit on the back of the display panel may be electrically connected to the conductive structure through the first through hole.
  • step 903 may include the following two sub-steps:
  • a conductive silver paste is arranged in the first through hole.
  • Conductive silver glue (English: Conductive Adhesive) is an adhesive with conductive properties.
  • a conductive silver glue can be provided in the first through hole, and the conductive silver glue can be electrically connected to the conductive structure exposed in the first through hole.
  • Sub-step 9032 electrically connect the control integrated circuit and the conductive silver glue.
  • control integrated circuit After the control integrated circuit is electrically connected to the conductive silver glue, the control integrated circuit can be electrically connected to the conductive structure through the conductive silver glue, and then to the control circuit inside the display panel.
  • control integrated circuit and the conductive structure in other ways, such as through nano-silver wires, which are not limited in the embodiment of the present application.
  • FIG. 11 it is a schematic diagram of the structure of the display device at the end of step 903.
  • the control integrated circuit 32 can be located on the flexible substrate 31, and the conductive silver glue 33 can be electrically connected to the control integrated circuit 32 through the flexible substrate 31 (the flexible substrate 31 can have traces that can connect the conductive silver glue 33 with the control integrated circuit 32 electrical connections).
  • the meanings of other signs in FIG. 11 can be referred to FIG. 3, which will not be repeated here.
  • a conductive structure is formed between the display structure and the base substrate, and the first display structure on one side of the conductive structure and the base substrate on the other side Through holes are provided respectively, the conductive structure and the control circuit are electrically connected through the through holes between the conductive structure and the control circuit, and the conductive structure can be electrically connected to the control integrated circuit on the back of the display panel through the through hole on the base substrate.
  • the control integrated circuit on the back of the display panel can be electrically connected with the control circuit inside the display panel. Since there is no need to bend the base substrate, the width of the frame increased by the bent portion can be reduced. The problem that the width of the border of the display panel is wider in the related art is solved. The effect of reducing the frame of the display panel is achieved.
  • the present application also provides a display device.
  • the display device includes a control integrated circuit 32 and a display panel.
  • the display panel includes a base substrate 21.
  • the base substrate 21 has a first through hole (not shown in FIG. 11).
  • Conductive structure 22, the conductive structure 22 is provided on the base substrate 21, the conductive structure 22 at least partially covers the first through hole;
  • the display structure 23, the display structure 23 is located on the base substrate 21 provided with the conductive structure 22, the display structure 23 It includes a first display structure 231, a control circuit 232, and a second display structure 233 on the side where the conductive structure 22 of the base substrate 21 is stacked.
  • the first display structure 231 has a second through hole (not shown in FIG. 11), and the control The line 232 is electrically connected to the conductive structure 22 through the second through hole.
  • the control integrated circuit 32 is electrically connected to the conductive structure 22 through the first through hole.
  • the display device includes a flexible substrate 31, the flexible substrate 31 is electrically connected to the conductive structure 22, and the control integrated circuit 32 is located on the flexible substrate 31.
  • a conductive silver glue 33 is provided in the first through hole, and the control integrated circuit 32 is electrically connected to the conductive silver glue 33.

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Abstract

公开了一种显示面板、显示装置及制造方法，属于显示技术领域。所述显示面板(20)包括：衬底基板(21)，衬底基板(21)具有第一通孔(21a)；导电结构(22)，位于衬底基板(21)上，导电结构(22)至少部分覆盖第一通孔(21a)；显示结构(23)，包括第一显示结构(231)、控制线路(232)以及第二显示结构(233)，第一显示结构(231)具有第二通孔，控制线路(232)通过第二通孔与导电结构(22)电连接。本申请通过在第一显示结构(231)以及衬底基板(21)分别设置通孔，通过衬底基板(21)上的通孔可以将导电结构(22)与控制集成电路电连接。能够达到缩小显示面板的边框的效果。

Description

显示面板、显示装置及制造方法
本申请要求于2019年4月26日提交的申请号为201910345749.2、申请名称为“显示面板、显示装置及制造方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，特别涉及一种显示面板、显示装置及制造方法。
背景技术
目前，为了缩小显示面板的边框的宽度，通常会将控制集成电路(英文：integrated circuit；简称：IC)设置在显示面板的背部，再将显示面板内部的控制线路绕到该背部与控制IC相连接。
一种显示面板，选用了具有柔性的衬底基板，并将该柔性的衬底基板弯折到显示面板的背部，显示面板的控制线路经过该弯折部分与背部的控制IC相连。
发明内容
本申请实施例提供了一种显示面板、显示装置及制造方法。所述技术方案如下：
根据本申请的一方面，提供了一种显示面板，所述显示面板包括：
衬底基板，所述衬底基板具有第一通孔；
导电结构，所述导电结构位于所述衬底基板上，所述导电结构至少部分覆盖所述第一通孔；
显示结构，所述显示结构包括层叠设置所述衬底基板的所述导电结构所在侧的第一显示结构、控制线路以及第二显示结构，所述第一显示结构具有第二通孔，所述控制线路通过所述第二通孔与所述导电结构电连接。
可选地，所述显示面板包括指纹识别组件，所述指纹识别组件包括带孔遮光层和指纹识别传感器；
所述导电结构与所述带孔遮光层为同层结构，所述指纹识别传感器位于所述带孔遮光层远离所述显示结构的一侧。
可选地，所述显示面板包括衬底层，所述衬底层位于所述导电结构和所述第一显示结构之间，
所述衬底层上具有与所述第一显示结构的第二通孔连通的第三通孔，所述控制线路通过所述第二通孔以及所述第三通孔与所述导电结构电连接。
可选地，所述衬底层和所述衬底基板均包括沿靠近所述显示结构的方向层叠着的聚酰亚胺结构层和屏障层。
可选地，所述屏障层的材料包括氧化硅。
可选地，所述导电结构和所述带孔遮光层的材料包括金属。
可选地，所述导电结构位于所述显示面板的显示区域中。
可选地，所述第一显示结构包括缓冲层和有源层。
可选地，所述缓冲层的材料包括氮化硅或氧化硅。
可选地，所述第二显示结构包括沿远离所述第一显示结构方向依次设置的驱动电路层、有机发光层和封装层。
可选地，所述第二显示结构包括沿远离所述第一显示结构方向依次设置的液晶层和彩膜基板。
可选地，所述指纹识别传感器位于所述衬底基板远离所述显示结构的一侧。
可选地，所述第一通孔与所述第二通孔共轴线。
可选地，所述第一通孔位于所述导电结构在所述衬底基板上的正投影所在区域中。
可选地，所述显示面板包括指纹识别组件，所述指纹识别组件包括带孔遮光层和指纹识别传感器；
所述导电结构与所述带孔遮光层为同层结构，所述指纹识别传感器位于所述带孔遮光层远离所述显示结构的一侧，所述导电结构位于所述显示面板的显示区域中；
所述显示面板包括衬底层，所述衬底层位于所述导电结构和所述第一显示结构之间，
所述衬底层上具有与所述第一显示结构的第二通孔连通的第三通孔，所述控制线路通过所述第二通孔以及所述第三通孔与所述导电结构电连接
所述第一显示结构包括缓冲层和有源层，所述第二显示结构包括沿远离所述第一显示结构方向依次设置的驱动电路层、有机发光层和封装层；
所述第一通孔与所述第二通孔共轴线，所述第一通孔位于所述导电结构在 所述衬底基板上的正投影所在区域中。
另一方面，提供一种显示面板的制造方法，所述方法包括：
提供衬底基板；
在所述衬底基板上形成导电结构；
在形成有所述导电结构的衬底基板上形成显示结构，所述显示结构包括层叠设置所述衬底基板的所述导电结构所在侧的第一显示结构、控制线路以及第二显示结构，所述第一显示结构上具有第二通孔，所述控制线路通过所述第二通孔与所述导电结构电连接；
在所述衬底基板上形成第一通孔，所述导电结构至少部分覆盖所述第一通孔。
可选地，所述在所述衬底基板上形成导电结构，包括；
通过一次构图工艺在所述衬底基板上形成所述导电结构和带孔遮光层，所述显示面板包括指纹识别组件，所述指纹识别组件包括所述带孔遮光层和指纹识别传感器，所述指纹识别传感器位于所述带孔遮光层远离所述显示组件的一侧。
可选地，所述在所述衬底基板上形成第一通孔，包括：
通过激光打孔工艺在所述衬底基板上形成所述第一通孔。
另一方面，提供一种显示装置，所述显示装置包括控制集成电路和显示面板，所述显示面板包括衬底基板；导电结构，所述导电结构位于所述衬底基板上，所述衬底基板具有第一通孔，所述导电结构至少部分覆盖所述第一通孔；显示结构，所述显示结构包括层叠设置所述衬底基板的所述导电结构所在侧的第一显示结构、控制线路以及第二显示结构，所述第一显示结构具有第二通孔，所述控制线路通过所述第二通孔与所述导电结构电连接；
所述控制集成电路通过所述第一通孔与所述导电结构电连接。
可选地，所述显示装置包括柔性基底，所述控制集成电路位于所述柔性基底上，并通过所述柔性基底与所述导电结构电连接。
可选地，所述第一通孔中具有导电银胶，所述控制集成电路与所述导电银胶电连接。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所 需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是一种显示装置的结构示意图；
图2是本申请实施例提供的一种显示面板的结构示意图；
图3是本申请实施例提供的另一种显示面板的结构示意图；
图4是图3所示的显示面板中带孔遮光层和导电结构等结构的俯视图；
图5是本申请实施例提供的一种显示面板的制造方法的流程图；
图6是图5所示实施例中一种衬底基板的结构示意图；
图7是图5所示实施例中另一种衬底基板的结构示意图；
图8是图5所示实施例中另一种衬底基板的结构示意图；
图9是本申请实施例提供的一种显示装置的制造方法的流程图；
图10是图9所示实施例中一种控制集成电路与导电结构电连接的流程图；
图11是图9所示实施例中一种显示装置的结构示意图。
通过上述附图，已示出本申请明确的实施例，后文中将有更详细的描述。这些附图和文字描述并不是为了通过任何方式限制本申请构思的范围，而是通过参考特定实施例为本领域技术人员说明本申请的概念。
具体实施方式
下面将结合附图对本申请实施方式进行描述。
图1是一种显示装置的结构示意图，该显示装置包括显示面板以及控制IC-13，显示面板包括衬底基板11以及设置在衬底基板11上的控制线路12，控制IC-13位于柔性基底14上，柔性基底14位于衬底基板11上，柔性基底14以及位于其上的IC-13可以共同称为覆晶薄膜(英文：Chip On Film；简称：COF)。其中，柔性基底14可以包括柔性层(可以由聚酰亚胺构成)以及位于柔性层上的导电线路等。
该显示面板的衬底基板11由柔性材料构成，使柔性基底14以及IC-13能够弯曲至显示面板的背部(显示面板的背部即显示面板不进行图像显示的一面)以缩小显示面板的边框。控制线路12通过弯曲的部分以及柔性基底14与控制IC-13电连接。
图1所示的方式虽然能够在一定程度上缩小显示面板的边框(显示面板除显示区域外的部分均可以称为显示面板的边框)，但是其弯曲部分w仍会增大显示面板的边框，且弯折还可能导致显示面板发生各种不良(例如各种线路可能因为弯折而断裂)。
另外，直接在显示面板的背部打孔，以使背部的控制IC能够与显示面板内部的控制线路电连接的方式，也由于所需打孔的深度过深(直接从显示面板背部形成一个贯穿至控制线路所在层的孔的深度较深，而打孔过深的技术难度较大，可能引起显示面板的损坏等严重问题)的原因，而难以实施。
此外，图1所示的方式由于对显示面板进行了弯折，因而其弯折部分的厚度甚至会大于两倍的显示面板的厚度，这非常不利于显示面板的轻薄化的发展趋势。
图2是本申请实施例提供的一种显示面板的结构示意图。该显示面板20可以包括：
衬底基板21。
导电结构22，导电结构22位于衬底基板21上，衬底基板21具有第一通孔21a，导电结构22至少部分覆盖第一通孔21a，也即是在衬底基板21未设置导电结构22的一侧，导电结构22在第一通孔21a处露出。
显示结构23，显示结构23包括层叠设置在衬底基板21的导电结构22所在侧的第一显示结构231、控制线路232以及第二显示结构233，第一显示结构231上具有第二通孔(图2中未标出)，控制线路232通过第二通孔与导电结构22电连接。
综上所述，本申请实施例提供的一种显示面板，通过在显示结构和衬底基板之间设置导电结构，并在该导电结构一侧的第一显示结构以及另一侧的衬底基板分别设置通孔，通过导电结构与控制线路之间的通孔将导电结构与控制线路电连接，再通过衬底基板上的通孔可以将导电结构与显示面板背部的控制集成电路电连接，如此便可以将显示面板背部的控制集成电路与显示面板内部的控制线路电连接。由于无需弯折衬底基板，因而能够减小弯折部分所增加的边框的宽度。解决了相关技术中显示面板的边框的宽度较宽的问题。达到了缩小显示面板的边框的效果。
请参考图3，其示出了本申请实施例提供的另一种显示面板的结构示意图，该显示面板在图2所示的显示面板的基础上进行了一些调整。
可选地，显示面板20包括指纹识别组件24，指纹识别组件24包括带孔遮光层241和指纹识别传感器242。指纹识别传感器24位于带孔遮光层241远离显示结构23的一侧。显示组件可以发出光线(该光线可以为用于显示的光线，也可以为用于指纹识别的光线)，该光线射出显示面板后，可以被触摸主体(触摸主体可以包括手指、手掌和触控笔等)反射，带孔遮光层241可以具有多个开孔，用于使该显示结构发出并经触摸主体反射后的光能够通过该带孔遮光层241，并被指纹识别传感器242感测。导电结构22与带孔遮光层241为通过同一次构图工艺形成的同层结构。也即是通过同一张掩膜(英文：MASK)在一次构图工艺中即可形成导电结构22与带孔遮光层241，方便快捷，不但节省制造成本，还简化了显示面板的结构。
图3示出的是指纹识别传感器242位于衬底基板21远离显示结构23的一侧的情况，如此设置方式可以避免将指纹识别传感器242设置在衬底基板21靠近显示结构23的一侧时，对显示结构23互相造成影响。但是，本申请实施例提供的显示面板中，指纹识别传感器242还可以位于其他位置，例如还可以位于衬底基板21靠近显示结构23的一侧，本申请实施例不进行限制。
可选地，第一通孔21a与第二通孔共轴线。如图3所示，第一通孔21a与第二通孔的轴线均为z，如此可以缩小第一通孔以及第二通孔在显示面板上所占用的区域的面积，缩小该结构对显示面板边框的影响。示例性的，第一通孔与第二通孔可以均为圆孔，这两个圆孔可以正对设置。
可选地，第一通孔21a位于导电结构22在衬底基板上的正投影所在区域中。也即是导电结构22可以完全覆盖第一通孔21a，如此可以提高导电结构22和触控IC的接触面积，提高电连接的性能。
如图4所示，其为图3所示的显示面板中，带孔遮光层241和导电结构22等结构的俯视图。带孔遮光层241上具有多个开孔，显示结构发出并经触摸主体反射后的光能够通过这多个开孔，并被指纹识别传感器242感测。导电结构22包括多个块状结构，以便于与控制IC上的多个接点进行连接(或称为邦定(英文：bonding))。
本申请实施例提供的显示面板中的指纹识别组件以及其中的带孔遮光层241可以用于通过小孔成像原理实现屏下指纹识别的功能。带孔遮光层241可以 通过等离子化学气相沉积(英文：Plasma Enhanced Chemical Vapor Deposition；简称：PECVD)工艺(或其它气相沉积工艺)来形成。
可选地，导电结构22和带孔遮光层241的材料包括金属。金属材料的导电性能和遮光性能通常较强，可以满足导电结构22对于导电性能的要求，并满足带孔遮光层241对于遮光性能的要求。
如图3所示，显示面板20包括衬底层25，衬底层25位于导电结构22和第一显示结构231之间。衬底层25具有与第一显示结构231的第二通孔(图3中未标出)连通的第三通孔(图3中未标出)，控制线路232(控制线路可以包括VSS(公共连接线)和VDD(工作电压连接线)等线路)通过第二通孔以及第三通孔与导电结构22电连接。也即是显示面板20的衬底结构可以由衬底层25以及衬底基板21共同构成，而导电结构22以及带孔遮光层241可以位于衬底层25和衬底基板21之间。其中，第二通孔和第三通孔均可以通过构图工艺来形成。
在本申请实施例中，涉及的构图工艺可以包括形成光刻胶，对光刻胶进行曝光和显影，以显影后的光刻胶为掩膜对其下方膜层进行刻蚀以及剥离光刻胶等。
一种显示面板中，带孔遮光层通常位于整个衬底结构的上方，由于后续会在带孔遮光层241上方形成有源层等结构，为了避免形成有源层的过程中对带孔遮光层241造成损坏(例如激光退火等工艺会严重影响带孔遮光层241)，会先在带孔遮光层241上方形成保护层(比如以较低功率的化学气相沉积工艺形成氧化硅层来作为保护层)以保护带孔遮光层241。但这样不但使显示面板的结构较为复杂，而且增加了制造成本和制造时长。此外，带孔遮光层上的孔洞还会影响上方有源层的平整度，对激光退火造成影响，导致有源层中晶粒结晶不均匀，进而影响显示面板的显示效果。
而本申请实施例中，将带孔遮光层241和导电结构22设置在衬底层25和衬底基板21之间，由衬底层25来保护带孔遮光层241和导电结构22，无需再形成保护层，简化了显示面板的结构和制造工艺，降低了制造成本。另外，衬底层可以作为平坦层，且带孔遮光层距离有源层较远，不会对有源层的平整度造成影响，进而使得激光退火后的有源层中晶粒结晶较为均匀，提高了显示面板的显示效果。
可选地，衬底层25和衬底基板21均包括沿靠近显示结构23的方向层叠着 的聚酰亚胺(英文：Polyimide；简称：PI)结构层211和屏障(英文：BARRIER)层212。屏障层的212的材料可以包括氧化硅。层叠着的PI结构层211和屏障层212可以构成一种性能较好的衬底结构，PI结构层211可以位于屏障层211远离导电结构的一侧。此外，PI结构层211也可以位于屏障层211靠近导电结构的一侧，本申请实施例对此不进行限制。
可选地，导电结构22位于显示面板的显示区域(图3中未示出)中。由于导电结构22位于衬底层25以及衬底基板21共同构成的衬底结构中，不会对显示结构造成遮挡，进而也不会对显示面板的正常显示造成影响。因此，导电结构22可以位于显示面板的显示区域中，如此能够缩小显示面板的边框的宽度。此外，导电结构22也可以位于显示面板显示区域外的周边区域，本申请实施例对此不进行限制。
可选地，第一显示结构231包括缓冲(英文：Buffer)层231a和有源层231b。缓冲层231a的材料可以包括氮化硅或氧化硅。有源层231b可以由多晶硅构成，该多晶硅可以由非晶硅经退火工艺(如准分子激光退火(英文：Excimer Laser Anneal；简称：ELA)工艺)后得到。
可选地，根据显示面板的显示原理的不同，第二显示结构233可以包括不同的器件。示例性的，当显示面板为有机发光二级光显示面板时，第二显示结构233可以包括沿远离第一显示结构231方向依次设置的驱动电路层233a、有机发光层233b和封装层233c等。其中，驱动电路层233a可以包括驱动有机发光层的像素电路和控制引线等结构，有机发光层233b可以包括依次层叠的阳极、电致发光(英文：electroluminescent；简称：EL)层和阴极等结构。封装层233c可以是由薄膜封装技术或其它相关技术形成的封装层，例如，封装层233c可以是玻璃胶封装层。
另外，当显示面板为液晶显示面板时，第二显示结构233可以包括液晶层以及彩膜基板等结构。
可选地，第一通孔21a可以由激光打孔工艺形成。可以在显示面板的其它结构制造完成后，通过激光打孔工艺从显示面板的背部打孔，直至导电结构22露出。该第一通孔21a可以用于使导电结构22能够与显示面板背部的控制IC电连接。
本申请实施例提供的显示面板，由于无需弯折边缘区域，因而其也不会由于弯折而增加整体的厚度，进而使得显示面板整体较薄，有利于显示面板的轻 薄化的发展趋势。
综上所述，本申请实施例提供的一种显示面板，通过在显示结构和衬底基板之间设置导电结构，并在该导电结构一侧的第一显示结构以及另一侧的衬底基板分别设置通孔，通过导电结构与控制线路之间的通孔将导电结构与控制线路电连接，再通过衬底基板上的通孔可以将导电结构与显示面板背部的控制集成电路电连接，如此便可以将显示面板背部的控制集成电路与显示面板内部的控制线路电连接。由于无需弯折衬底基板，因而能够减小弯折部分所增加的边框的宽度。解决了相关技术中显示面板的边框的宽度较宽的问题。达到了缩小显示面板的边框的效果。
图5是本申请实施例提供的一种显示面板的制造方法的流程图，该方法包括：
步骤501、提供衬底基板。
该衬底基板可以为包括聚酰亚胺结构层和屏障层的多层结构。示例性的，该衬底基板的结构可以参考图3所示显示面板中的衬底基板21以及对应的文字描述，本申请实施例在此不再赘述。
步骤502、在衬底基板上形成导电结构。
在形成导电结构时，还可以在同一次构图工艺中形成带孔遮光层。该带孔遮光层为指纹识别组件中的结构，指纹识别组件还包括指纹识别传感器，带孔遮光层用于将所述显示结构发出并经触摸主体反射后的光进行通过，以被所述指纹识别传感器感测。
如图6所示，其为步骤502结束时，衬底基板的结构示意图。带孔遮光层241和导电结构22形成于衬底基板21上。衬底基板21包括沿靠近显示结构23的方向层叠着的聚酰亚胺结构层211和屏障层212。带孔遮光层241和导电结构22的结构可以参考图4以及对应的文字描述，本申请实施例在此不再赘述。
步骤503、在形成有导电结构的衬底基板上形成衬底层。
该衬底层的结构可以与衬底基板类似，也为包括聚酰亚胺结构层和屏障层的多层结构。
步骤504、在形成有衬底层的衬底基板上形成显示结构。
其中，显示结构包括依次形成在衬底基板的导电结构所在侧的第一显示结构、控制线路以及第二显示结构，第一显示结构上具有第二通孔(第二通孔可 以由构图工艺形成)，控制线路通过第二通孔与导电结构电连接。第一显示结构、控制线路以及第二显示结构可以参考图3所示显示面板中的第一显示结构231、控制线路232以及第二显示结构233，本申请实施例在此不再赘述。
如图7所示，其为步骤503结束时，衬底基板的结构示意图。控制线路232通过第一显示结构231以及衬底层25上的通孔与导电结构22电连接。图7中其他标记的含义可以参考图3，在此不再赘述。
需要说明的是，本申请实施例中的步骤503为可选的步骤，也即是可以在步骤502结束后，不形成衬底层，而执行步骤504，相应的在形成有导电结构的衬底基板上形成显示结构。
步骤505、在衬底基板上形成第一通孔，导电结构至少部分覆盖第一通孔。
可以从衬底基板未设置导电结构的一侧，通过激光打孔工艺在衬底基板上形成通孔，直至导电结构在该通孔处露出，导电结构可以至少部分覆盖第一通孔。由于仅打穿衬底基板，因而第一通孔的深度较浅，打孔难度较低。
如图8所示，其为步骤505结束时，衬底基板的结构示意图。导电结构22在第一通孔21a处露出，后续可以通过该通孔将导电结构22与控制IC电连接，进而该控制IC可以通过导电结构22与显示面板内部的控制线路232电连接。如此便无需弯折显示面板，即可以将位于显示面板背面的控制IC与显示面板内部的控制线路电连接，不但避免了弯折可能导致的显示面板的各种不良，还实现了缩小显示面板边框的效果。
图8中其他标记的含义可以参考图3，在此不再赘述。
综上所述，本申请实施例提供的一种显示面板的制造方法，通过在显示结构和衬底基板之间形成导电结构，并在该导电结构一侧的第一显示结构以及另一侧的衬底基板分别设置通孔，通过导电结构与控制线路之间的通孔将导电结构与控制线路电连接，再通过衬底基板上的通孔可以将导电结构与显示面板背部的控制集成电路电连接，如此便可以将显示面板背部的控制集成电路与显示面板内部的控制线路电连接。由于无需弯折衬底基板，因而能够减小弯折部分所增加的边框的宽度。解决了相关技术中显示面板的边框的宽度较宽的问题。达到了缩小显示面板的边框的效果。
图9是本申请实施例提供的一种显示装置的制造方法的流程图，该方法包括：
步骤901、提供显示面板。
该显示面板可以为图3所示的显示面板。
步骤902、提供控制集成电路。
该控制集成电路可以为用于对显示面板的显示功能进行控制的器件。
步骤903、通过第一通孔将控制集成电路与导电结构电连接。
控制集成电路可以设置在衬底基板远离导电结构的一侧，也即是显示面板的背部，如此设置可以缩小显示面板的边框宽度。本申请实施例中，可以将显示面板的背部的控制集成电路通过第一通孔与导电结构电连接。
如图10所示，步骤903可以包括下面两个子步骤：
子步骤9031、在第一通孔中设置导电银胶。
导电银胶(英文：Conductive Adhesive)是一种具有导电性能的胶黏剂，可以在第一通孔中设置导电银胶，该导电银胶可以与第一通孔中露出的导电结构电连接。
子步骤9032、将控制集成电路与导电银胶电连接。
将控制集成电路与导电银胶电连接后，控制集成电路即可通过导电银胶与导电结构电连接，进而与显示面板内部的控制线路电连接。
另外，还可以通过其他方式来将控制集成电路与导电结构电连接，如通过纳米银线等，本申请实施例不进行限制。
如图11所示，其为步骤903结束时，显示装置的结构示意图。控制集成电路32可以位于柔性基底31上，导电银胶33可以通过柔性基底31与控制集成电路32电连接(柔性基底31上可以具有走线，该走线可以将导电银胶33与控制集成电路32电连接)。图11中其他标记的含义可以参考图3，在此不再赘述。
综上所述，本申请实施例提供的一种显示装置，通过在显示结构和衬底基板之间形成导电结构，并在该导电结构一侧的第一显示结构以及另一侧的衬底基板分别设置通孔，通过导电结构与控制线路之间的通孔将导电结构与控制线路电连接，通过衬底基板上的通孔可以将导电结构与显示面板背部的控制集成电路电连接，如此便可以将显示面板背部的控制集成电路与显示面板内部的控制线路电连接。由于无需弯折衬底基板，因而能够减小弯折部分所增加的边框的宽度。解决了相关技术中显示面板的边框的宽度较宽的问题。达到了缩小显示面板的边框的效果。
如图11所示，本申请还提供一种显示装置，显示装置包括控制集成电路32和显示面板，显示面板包括衬底基板21，衬底基板21具有第一通孔(图11未标出)；导电结构22，导电结构22设置在衬底基板21上，导电结构22至少部分覆盖第一通孔；显示结构23，显示结构23位于设置有导电结构22的衬底基板21上，显示结构23包括层叠设置衬底基板21的导电结构22所在侧的第一显示结构231、控制线路232以及第二显示结构233，第一显示结构231上具有第二通孔(图11未标出)，控制线路232通过第二通孔与导电结构22电连接。
控制集成电路32通过第一通孔与导电结构22电连接。
可选地，显示装置包括柔性基底31，柔性基底31与导电结构22电连接，控制集成电路32位于柔性基底31上。
可选地，第一通孔中设置有导电银胶33，控制集成电路32与导电银胶33电连接。
需要指出的是，在附图中，为了图示的清晰可能夸大了层和区域的尺寸。而且可以理解，当元件或层被称为在另一元件或层“上”时，它可以直接在其他元件上，或者可以存在中间的层。另外，可以理解，当元件或层被称为在另一元件或层“下”时，它可以直接在其他元件下，或者可以存在一个以上的中间的层或元件。另外，还可以理解，当层或元件被称为在两层或两个元件“之间”时，它可以为两层或两个元件之间惟一的层，或还可以存在一个以上的中间层或元件。通篇相似的参考标记指示相似的元件。
在本申请中，术语“第一”和“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。术语“多个”指两个或两个以上，除非另有明确的限定。
本领域普通技术人员可以理解实现上述实施例的全部或部分步骤可以通过硬件来完成，也可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，上述提到的存储介质可以是只读存储器，磁盘或光盘等。
以上所述仅为本申请的可选实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (19)

  1. 一种显示面板，所述显示面板包括：
    衬底基板，所述衬底基板具有第一通孔；
    导电结构，所述导电结构位于所述衬底基板上，所述导电结构至少部分覆盖所述第一通孔；
    显示结构，所述显示结构包括层叠设置在所述衬底基板的所述导电结构所在侧的第一显示结构、控制线路以及第二显示结构，所述第一显示结构具有第二通孔，所述控制线路通过所述第二通孔与所述导电结构电连接。
  2. 根据权利要求1所述的显示面板，所述显示面板包括指纹识别组件，所述指纹识别组件包括带孔遮光层和指纹识别传感器；
    所述导电结构与所述带孔遮光层为同层结构，所述指纹识别传感器位于所述带孔遮光层远离所述显示结构的一侧。
  3. 根据权利要求1或2所述的显示面板，所述显示面板包括衬底层，所述衬底层位于所述导电结构和所述第一显示结构之间，
    所述衬底层具有与所述第一显示结构的第二通孔连通的第三通孔，所述控制线路通过所述第二通孔以及所述第三通孔与所述导电结构电连接。
  4. 根据权利要求3所述的显示面板，所述衬底层和所述衬底基板均包括沿靠近所述显示结构的方向层叠着的聚酰亚胺结构层和屏障层。
  5. 根据权利要求4所述的显示面板，所述屏障层的材料包括氧化硅。
  6. 根据权利要求2所述的显示面板，所述导电结构和所述带孔遮光层的材料包括金属。
  7. 根据权利要求1-6任一所述的显示面板，所述导电结构位于所述显示面板的显示区域中。
  8. 根据权利要求1-6任一所述的显示面板，所述第一显示结构包括缓冲层和有源层。
  9. 根据权利要求8所述的显示面板，所述缓冲层的材料包括氮化硅或氧化硅。
  10. 根据权利要求1-6任一所述的显示面板，所述第二显示结构包括沿远离所述第一显示结构方向依次设置的驱动电路层、有机发光层和封装层。
  11. 根据权利要求1-6任一所述的显示面板，所述第一通孔与所述第二通孔共轴线。
  12. 根据权利要求1-6任一所述的显示面板，所述第一通孔位于所述导电结构在所述衬底基板上的正投影所在区域中。
  13. 根据权利要求1-6任一所述的显示面板，所述显示面板包括指纹识别组件24，所述指纹识别组件包括带孔遮光层和指纹识别传感器；
    所述导电结构与所述带孔遮光层为同层结构，所述指纹识别传感器位于所述带孔遮光层远离所述显示结构的一侧，所述导电结构位于所述显示面板的显示区域中；
    所述显示面板包括衬底层，所述衬底层位于所述导电结构和所述第一显示结构之间，
    所述衬底层具有与所述第一显示结构的第二通孔连通的第三通孔，所述控制线路通过所述第二通孔以及所述第三通孔与所述导电结构电连接；
    所述第一显示结构包括缓冲层和有源层，所述第二显示结构包括沿远离所述第一显示结构方向依次设置的驱动电路层、有机发光层和封装层；
    所述第一通孔与所述第二通孔共轴线，所述第一通孔位于所述导电结构在所述衬底基板上的正投影所在区域中。
  14. 一种显示面板的制造方法，所述方法包括：
    提供衬底基板；
    在所述衬底基板上形成导电结构；
    在形成有所述导电结构的衬底基板上形成显示结构，所述显示结构包括依次设置在所述衬底基板的所述导电结构所在侧的第一显示结构、控制线路以及第二显示结构，所述第一显示结构上具有第二通孔，所述控制线路通过所述第二通孔与所述导电结构电连接；
    在所述衬底基板上形成第一通孔，所述导电结构至少部分覆盖所述第一通孔。
  15. 根据权利要求14所述的方法，所述在所述衬底基板上形成导电结构，包括；
    通过一次构图工艺在所述衬底基板上形成所述导电结构和带孔遮光层，所述显示面板包括指纹识别组件，所述指纹识别组件包括所述带孔遮光层和指纹识别传感器，所述指纹识别传感器位于所述带孔遮光层远离所述显示结构的一侧。
  16. 根据权利要求14或15所述的方法，所述在所述衬底基板上形成第一通孔，包括：
    通过激光打孔工艺在所述衬底基板上形成所述第一通孔。
  17. 一种显示装置，所述显示装置包括控制集成电路和显示面板，所述显示面板包括衬底基板；导电结构，所述导电结构位于所述衬底基板上，所述衬底基板具有第一通孔，所述导电结构至少部分覆盖所述第一通孔；显示结构，所述显示结构包括层叠设置在所述衬底基板的所述导电结构所在侧的第一显示结构、控制线路以及第二显示结构，所述第一显示结构上具有第二通孔，所述控制线路通过所述第二通孔与所述导电结构电连接；
    所述控制集成电路通过所述第一通孔与所述导电结构电连接。
  18. 根据权利要求17所述的显示装置，所述显示装置包括柔性基底，所述控制集成电路位于所述柔性基底上，并通过所述柔性基底与所述导电结构电连 接。
  19. 根据权利要求17所述的显示装置，所述第一通孔中具有导电银胶，所述控制集成电路与所述导电银胶电连接。
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