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WO2020119414A1 - 封装模组及终端设备 - Google Patents

封装模组及终端设备 Download PDF

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Publication number
WO2020119414A1
WO2020119414A1 PCT/CN2019/119913 CN2019119913W WO2020119414A1 WO 2020119414 A1 WO2020119414 A1 WO 2020119414A1 CN 2019119913 W CN2019119913 W CN 2019119913W WO 2020119414 A1 WO2020119414 A1 WO 2020119414A1
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WO
WIPO (PCT)
Prior art keywords
light
emitting element
packaging module
cover plate
terminal device
Prior art date
Application number
PCT/CN2019/119913
Other languages
English (en)
French (fr)
Inventor
雷乃策
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2020119414A1 publication Critical patent/WO2020119414A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • F21V33/0004—Personal or domestic articles
    • F21V33/0052—Audio or video equipment, e.g. televisions, telephones, cameras or computers; Remote control devices therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources

Definitions

  • the present disclosure relates to the field of communication technology, and particularly to a packaging module and terminal equipment.
  • terminal devices such as smart phones, such as infrared sensors for proximity detection schemes, and indicators for prompting short messages and incoming calls when the screen is off and in standby. Since both the infrared sensor and the indicator light need to interact with the outside world, corresponding light channels need to be opened on the cover of the terminal device, so that the infrared light emitted by the infrared sensor and the visible light emitted by the indicator light can be propagated through their corresponding light channels To achieve the corresponding function.
  • the infrared sensors and indicator lights need to occupy a large installation space inside the terminal device.
  • Embodiments of the present disclosure provide a packaging module and a terminal device to solve the problem that the infrared sensor and the indicator light in the related art occupy a large space.
  • An embodiment of the present disclosure provides a packaging module, which is applied to a terminal device including a cover plate.
  • the cover plate is provided with a light-transmitting structure.
  • the packaging module includes a first light-emitting element and a second light-emitting element. A light-emitting element and the second light-emitting element are located in the first groove structure of the packaging module, the position of the first groove structure in the packaging module and the light-transmitting structure in the cover The position on the board corresponds.
  • An embodiment of the present disclosure also provides a terminal device, including a cover plate and the above-mentioned packaging module, the packaging module is located inside the cover plate, and the cover plate is provided with a light-transmitting structure.
  • the position of the first groove-shaped structure in the packaging module corresponds to the position of the light-transmitting structure on the cover plate.
  • FIG. 1 is a schematic structural view of a packaging module provided by an embodiment of the present disclosure
  • FIG. 3 is a second structural schematic diagram of a terminal device provided by an embodiment of the present disclosure.
  • FIG. 4 is a third structural schematic diagram of a terminal device provided by an embodiment of the present disclosure.
  • FIG. 6 is a second circuit diagram of a package module provided by an embodiment of the present disclosure.
  • an embodiment of the present disclosure provides a packaging module 20 that is applied to a terminal device including a cover plate 10, and a light-transmitting structure 11 is provided on the cover plate 10, wherein the The packaging module 20 includes a first light-emitting element 21 and a second light-emitting element 22, and the first light-emitting element 21 and the second light-emitting element 22 are located in the first groove structure 23 of the packaging module 20;
  • the first light-emitting element 21 can emit infrared light
  • the second light-emitting element 22 can emit visible indicator light
  • the position of the first groove-shaped structure 23 in the packaging module 20 and the position of the light-transmitting structure 11 on the cover plate 10 Correspondingly, so that the infrared light emitted by the first light emitting element 21 and the visible indicator light emitted by the second light emitting element 22 can be conducted to the outside of the terminal device through the light transmitting structure 11.
  • the first light-emitting element 21 for emitting infrared light and the second light-emitting element 22 for emitting visible indicator light are separately provided on the main board (not shown) of the terminal device, which can reduce the installation space required for the first light emitting element 21 and the second light emitting element 22 in the terminal device;
  • the infrared light emitted by one light-emitting element 21 and the visible indicator light emitted by the second light-emitting element 22 share a light-transmitting structure 11, and two light-transmitting structures are provided on the cover plate 10 to conduct infrared light and visible indicator light, respectively.
  • the number of light-transmitting structures provided on the cover plate 10 can be reduced, the manufacturing process of the cover plate 10 is simplified, and the manufacturing cost of the cover plate 10 is reduced.
  • the packaging module 20 can be electrically connected to the main board (not shown) of the terminal device, and the main board can also be electrically connected to the processor (shown) of the terminal device, so that the packaging module 20 can receive the control issued by the processor
  • the instruction is used to control the working states of the first light-emitting element 21 and the second light-emitting element 22.
  • the first light emitting element 21 is controlled to emit infrared light, and the infrared light emitted by the first light emitting element 21 can be transmitted to the terminal device through the light transmitting structure 11 on the cover 10
  • the second light-emitting element 22 is controlled to emit visible indication light, and the second light-emitting element 22 emits visible light
  • the indication light can be conducted to the outside of the terminal device through the light-transmitting structure 11 on the cover plate 10, and an aperture is formed at the position where the light-transmitting structure 11 is provided on the cover plate 10 to remind the user.
  • the cover plate 10 since the cover plate 10 generally uses a glass cover plate, the black border area of the cover plate 10 is generally coated with an opaque ink layer to block the functional devices located inside the cover plate 10 to optimize the appearance of the terminal device .
  • the area on the cover plate 10 where the light emitting direction of the module 20 should be packaged can be removed, so that a light-transmitting structure 11 capable of transmitting light can be formed on the cover plate 10 to facilitate The light emitted from the group 20 can be conducted to the outside of the terminal device through the light-transmitting structure 11 to realize the function of the corresponding terminal device.
  • the light-transmitting structure 11 may also be an opening provided on the cover plate 10, so that the infrared light emitted by the first light-emitting element 21 and the visible indicator light emitted by the second light-emitting element 22 can be conducted to the terminal device through the opening outer.
  • the infrared light is invisible light
  • the infrared light and the visible indicator light share a light-transmitting structure 11, which does not affect the user's use.
  • the infrared light emitted by the first light-emitting element can be conducted to the outside of the terminal device through the light-transmitting structure 11 to realize the infrared detection function of the terminal device, such as ranging or detecting whether an object is approaching, etc.
  • the packaging module 20 further includes an infrared receiving tube 24 to receive infrared light.
  • the infrared receiving tube 24 is located in the second slot-shaped structure 25 of the packaging module 20, and the position of the second slot-shaped structure 25 in the packaging module 20 corresponds to the position of the light-transmitting structure 11 on the cover 10.
  • the infrared light emitted by the first light-emitting element 21 is conducted out from the light-transmitting structure 11, the infrared light is reflected by the object and returns to the infrared receiving tube 24 of the packaging module 20 along the light-transmitting structure 11, thereby realizing the terminal The infrared detection function of the device.
  • the orthographic projection of the first groove-shaped structure 23 on the first plane is located within the orthographic projection of the light-transmitting structure 11 on the first plane, and the orthographic projection of the second grooved structure 25 on the first plane is also located
  • the light-transmitting structure 11 is in an orthographic projection on the first plane; wherein, the first plane is the plane where the display surface of the terminal device is located.
  • the propagation path of the light emitted by the first light-emitting element 21 and the second light-emitting element 22 can be effectively shortened; and the infrared receiving tube 24 The propagation path of the received light; it can also reduce the energy loss of the light during the propagation process.
  • the space occupation of the first light emitting element 21, the second light emitting element 22 and the infrared receiving tube 24 on the terminal device can be effectively reduced, and more clearance area can be made for the antenna of the terminal device.
  • Terminal equipment has excellent signal transmission and reception capabilities.
  • the first light emitting element 21 for emitting infrared light may be a laser infrared lamp or an infrared light emitting diode; and the second light emitting element 22 for emitting visible indicator light may be an incandescent lamp or Visible light emitting diodes.
  • the packaging module 20 further includes at least one condenser 26 disposed in the exit direction of the light emitted by the first and second light emitting elements 21 and 22, and the condenser 26 covers the first light emitting element 21 And at least one of the second light emitting elements 22.
  • the condenser 26 since the visible indicator light emitted by the second light-emitting element 22 only serves as a reminder, the light intensity and the degree of concentration are lower, so the condenser 26 does not have to cover the second light-emitting element 22, which can simplify the packaging module
  • the processing design of 20 reduces the difficulty of aligning with the light-transmitting structure 11 on the cover 10.
  • the condenser lens 26 can achieve a longer distance to be transmitted with a smaller transmission power, which can reduce the power consumption of the terminal device when infrared detection is realized, and by setting the condenser lens 26, it can also reduce the reflection of a large-angle light source through the cover 10 To the infrared receiving tube 24, and avoid the problem of infrared interference during the detection process.
  • a partition 27 may be provided on the packaging module 20 to separate the first light-emitting element 21 and the second light-emitting element 22, so as to prevent the first light-emitting element 21 and the second light-emitting element from emitting light
  • the visible indicator light emitted by the second light emitting element 22 interferes with the infrared light emitted by the first light emitting element 21.
  • a first condenser 261 corresponding to the first light emitting element 21 and a second condenser mirror corresponding to the second light emitting element 22 may be provided on the packaging module 20, respectively 262.
  • control of the operating states of the first light-emitting element 21 and the second light-emitting element 22 includes various methods.
  • the second light-emitting element 22 may share a control circuit with the first light-emitting element 21 and the infrared receiving tube 24 for the infrared detection function; the second light-emitting element 21 may also be controlled independently.
  • the packaging module 20 further includes a first input voltage terminal 201, a first control circuit 202, a first analog-to-digital converter 203, a first data interface 204, and a first current slot 205, wherein:
  • the first end of the infrared receiving tube 24 is connected to the first input voltage terminal 201, the second end of the infrared receiving tube 24 is connected to the first end of the first analog-to-digital converter 203, and the second end of the first analog-to-digital converter 203 It is connected to the first end of the first control circuit 202, the second end of the first control circuit 202 is connected to the first end of the first data interface 204, and the third end of the first control circuit 202 is connected to the first current slot 205,
  • the second end of the first data interface 204 is connected to the first processor 30; the first end of the first light emitting element 21 is connected to the first input voltage terminal 201, and the second end of the first light emitting element 21 is connected to the first current slot 205
  • the first end of the second light-emitting element 22 is connected to the first input voltage terminal 201, the second end of the second light-emitting element 22 is connected to the first current slot 205, and the first current slot 205 is also connected to the
  • the first control signal sent by the first processor 30 is received through the first data interface 204 connected to the first processor 30, so that the first control circuit 202 controls the first light-emitting element 21 and/or the first control signal according to the first control signal
  • the working states of the two light-emitting elements 22 realize the control of the working states of the first light-emitting element 21 and the second light-emitting element 22.
  • the pins of the module 20 can be packaged, and the occupied space required for the package module 20 can be reduced.
  • the package module 20 further includes a second input voltage terminal 206, a second control circuit 207, a second analog-to-digital converter 208, a second data interface 209, a second current slot 2010, and a second light emitting element 22
  • the third data interface 2011 connected at one end, where:
  • the first end of the infrared receiving tube 24 is connected to the second input voltage terminal 206, the second end of the infrared receiving tube 24 is connected to the first end of the second analog-to-digital converter 208, and the second end of the second analog-to-digital converter 208 Connected to the first end of the second control circuit 207, the second end of the second control circuit 207 is connected to the first end of the second data interface 209, and the third end of the second control circuit 207 is connected to the second current slot 2010,
  • the second end of the second data interface 209 is connected to the second processor 40; the first end of the first light emitting element 21 is connected to the second input voltage terminal 206, and the second end of the first light emitting element 21 is connected to the second current sink 2010
  • the third data interface 2011 is connected to the second processor 40, receives the second control signal sent by the second processor 40 to control the working state of the second light emitting element 22, and the other end of the second light emitting element 22 is connected to Ground connection, wherein the second light-
  • the second control signal sent by the second processor 40 is received through the second data interface 209 connected to the second processor 40, so that the second control circuit 207 controls the working state of the first light emitting element 21 according to the second control signal, The control of the working state of the first light emitting element 21 is realized.
  • the first light-emitting element 21 and the second light-emitting element 22 are respectively controlled by two control signals, which can be controlled by using the existing voltage control interface of the terminal device, and the development difficulty of the packaging module 20 can also be reduced.
  • an embodiment of the present disclosure further provides a terminal device, which includes a cover plate 10 and the packaging module 20 in the foregoing embodiment.
  • the packaging module 20 is located inside the cover plate 10 and on the cover plate 10
  • the light-transmitting structure 11 is provided, and the position of the first groove structure 23 of the packaging module 20 in the packaging module 20 corresponds to the position of the light-transmitting structure 11 on the cover plate. In this way, the light emitted by the first light-emitting element 21 and the second light-emitting element 22 of the packaging module 20 can be conducted to the outside of the terminal device through the light-transmitting structure 11.
  • the light-transmitting structure 11 may be an opening provided in the cover plate 10 or a light-transmitting area formed in the black border area of the cover plate 10 as long as the first light-emitting element 21 and the second light-emitting element 22 can be made
  • the emitted light can be conducted to the outside of the terminal device through the light-transmitting structure 11, which is not specifically limited here.
  • packaging module embodiment is also applicable to the terminal device embodiment and can achieve the same technical effect, which will not be repeated here.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Communication System (AREA)
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Abstract

一种封装模组（20）及终端设备，该封装模组（20）应用于包括盖板（10）的终端设备，盖板（10）设置有透光结构（11），封装模组（20）包括第一发光元件（21）和第二发光元件（22），第一发光元件（21）和第二发光元件（22）位于封装模组（20）的第一槽型结构（23）中，第一槽型结构（23）在封装模组（20）中的位置与透光结构（11）在盖板（10）上的位置相对应。

Description

封装模组及终端设备
相关申请的交叉引用
本申请主张在2018年12月12日在中国提交的中国专利申请号No.201811517931.3的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通信技术领域，尤其涉及一种封装模组及终端设备。
背景技术
随着终端技术的发展进步，智能手机等终端设备上集成的功能越来越多，比如用于靠近检测方案的红外传感器，用于在灭屏待机时提示短信、来电的指示灯。由于红外传感器和指示灯都需要与外界交互，因此需要在终端设备的盖板上开设对应的光通道，以使红外传感器发出的红外光以及指示灯发出的可见光能够通过各自对应的光通道传播出去，以实现对应的功能。然而，通过在盖板上开设对应红外传感器和指示灯的光通道，不仅增加了盖板的加工工序，而且还会使得红外传感器和指示灯需要在终端设备内部占用较大的安装空间。
发明内容
本公开实施例提供一种封装模组及终端设备，以解决相关技术中的红外传感器和指示灯存在占用空间大的问题。
本公开实施例提供了一种封装模组，应用于包括盖板的终端设备，所述盖板设置有透光结构，所述封装模组包括第一发光元件和第二发光元件，所述第一发光元件和所述第二发光元件位于所述封装模组的第一槽型结构中，所述第一槽型结构在所述封装模组中的位置与所述透光结构在所述盖板上的位置相对应。
本公开实施例还提供一种终端设备，包括盖板及上述封装模组，所述封装模组位于所述盖板的内侧，且所述盖板设置有透光结构，所述封装模组的 第一槽型结构在所述封装模组中的位置与所述透光结构在所述盖板上的位置相对应。
这样，通过将第一发光元件和第二发光元件集成到一个封装模组上，能够降低第一发光元件和第二发光元件在终端设备上所需的安装空间，并减少盖板上的透光结构的数量。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本公开实施例提供的封装模组的结构示意图；
图2是本公开实施例提供的终端设备的结构示意图之一；
图3是本公开实施例提供的终端设备的结构示意图之二；
图4是本公开实施例提供的终端设备的结构示意图之三；
图5是本公开实施例提供的封装模组的电路结构图之一；
图6是本公开实施例提供的封装模组的电路结构图之二。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
如图1和图2所示，本公开实施例提供一种封装模组20，该封装模组20应用于包括盖板10的终端设备，且盖板10上设置有透光结构11，其中该封装模组20包括第一发光元件21和第二发光元件22，且第一发光元件21和第二发光元件22位于该封装模组20的第一槽型结构23内；
其中，第一发光元件21可以发射红外光，第二发光元件22可以发射可见指示光，且第一槽型结构23在封装模组20中的位置与透光结构11在盖板 10上的位置相对应，以使第一发光元件21发射的红外光和第二发光元件22发射的可见指示光能够通过透光结构11传导至终端设备外。
本实施方式中，通过将用于发射红外光的第一发光元件21和用于发射可见指示光的第二发光元件22集成到一个封装模组20的第一槽型结构23内，相对于在终端设备的主板(未图示)上单独设置第一发光元件21和第二发光元件22，能够降低第一发光元件21和第二发光元件22在终端设备所需的安装空间；而且通过将第一发光元件21发射的红外光和第二发光元件22发射的可见指示光共用一个透光结构11，相对于在盖板10上设置两个透光结构以分别传导红外光和传导可见指示光，可以减少设置在盖板10上透光结构的数量，简化了盖板10的制作工艺和降低了盖板10的制作成本。
其中，封装模组20可以与终端设备的主板(未图示)电连接，且主板还可以与终端设备的处理器(为图示)电连接，这样封装模组20可以接收处理器发出的控制指令，用于控制第一发光元件21和第二发光元件22的工作状态。比如，在终端设备需要实现红外检测功能的情况下，则控制第一发光元件21发出红外光，且第一发光元件21发出的红外光能够通过盖板10上的透光结构11传导至终端设备外，以便实现对目标物理的距离检测或者靠近检测的功能；或者，在终端设备需要发出提示信号的情况下，则控制第二发光元件22发出可见指示光，且第二发光元件22发出的可见指示光能够通过盖板10上的透光结构11传导至终端设备外，并在盖板10设置有透光结构11的位置形成光圈，以提示用户。
其中，由于盖板10一般采用玻璃盖板，而在盖板10的黑边区域，一般都会涂覆不透光的油墨层，以遮挡位于盖板10内侧的功能器件，以优化终端设备的外观。在本实施方式中，可以在盖板10上应封装模组20的发光方向的区域，去除多余的油墨层，以使盖板10上形成一个能够透光的透光结构11，以便从封装模组20中发射的光线能够通过透光结构11传导至终端设备外，以实现对应的终端设备的功能。其中，透光结构11还可以是设置于盖板10上的开孔，以便将第一发光元件21发射的红外光和第二发光元件22发射的可见指示光能够通过该开孔传导至终端设备外。
而且，由于红外光是不可见光，因此通过将红外光和可见指示光共用一 个透光结构11，不会影响用户使用。比如当第一发光元件21工作时，第一发光元件发射的红外光可以通过透光结构11传导至终端设备外，以实现终端设备的红外检测功能，比如测距或者检测是否有物体靠近等等。为实现终端设备的红外检测功能，封装模组20还包括红外接收管24，以接收红外光。其中，红外接收管24位于封装模组20的第二槽型结构25中，且第二槽型结构25在封装模组20中的位置与透光结构11在盖板10上的位置相对应。通过将第一发光元件21设置在第一槽型结构23内，将红外接收管24设置在第二槽型结构25内，可以降低第一发光元件21发射的红外光对红外接收管24接收到的红外光的干扰，提升终端设备的红外检测性能。
具体的，第一发光元件21发射的红外光自透光结构11传导出去后，红外光碰到物体发生反射，并沿透光结构11返回至封装模组20的红外接收管24，从而实现终端设备的红外检测功能。
可选的，第一槽型结构23在第一平面上的正投影位于透光结构11在第一平面上的正投影内，且第二槽型结构25在第一平面上的正投影也位于透光结构11在第一平面上的正投影内；其中，第一平面为终端设备的显示面所在的平面。这样通过将第一槽型结构23和第二槽型结构25均正对透光结构11设置，可以有效缩短第一发光元件21、第二发光元件22发射的光线的传播路径；以及红外接收管24接收到的光线的传播路径；还可以降低光线在传播过程中的能量损耗。
这样，通过将第一发光元件21、第二发光元件22及红外接收管24集成设置一个封装模组20内，相对于将第一发光元件21、第二发光元件22及红外接收管24单独设置在终端设备的主板上，可以有效降低第一发光元件21、第二发光元件22及红外接收管24在终端设备上的空间占用，还可以为终端设备的天线腾出更多的净空区，确定终端设备具有优良的信号发射接收能力。
需要说明的是，在本实施方式中，用于发射红外光的第一发光元件21可以是激光红外灯或者红外发光二极管；而用于发射可见指示光的第二发光元件22可以是白炽灯或者可见光发光二极管。
如图1至图4所示，封装模组20还包括设置在第一发光元件21和第二发光元件22发射的光线的出射方向上的至少一个聚光镜26，且聚光镜26覆 盖第一发光元件21和第二发光元件22中的至少一个。其中，由于第二发光元件22发射的可见指示光，只起到提示作用，对光线的强度及聚集程度要求较低，因此聚光镜26可以不用必须覆盖第二发光元件22，从而可以简化封装模组20的加工设计，并降低了与盖板10上的透光结构11的对位难度。
其中，由于第一发光元件21发射的红外光，需要用于实现终端设备的检测功能，对于光线的强度和聚焦程度的要求较高，通过在第一发光元件22的发射的红外光的出射方向设置聚光镜26，可以达到以较小的发射功率发射较远的距离，即可以降低终端设备在实现红外检测时的电量损耗，而且通过设置聚光镜26还可以减小大角度的光源通过盖板10反射到红外接收管24，并避免检测过程中出现红外干扰的问题。
进一步的，如图4所示，封装模组20上还可以设置隔板27，以即将第一发光元件21和第二发光元件22分隔出来，这样可以避免当第一发光元件21和第二发光元件22同时工作的情况下，第二发光元件22发出的可见指示光对第一发光元件21发出的红外光的干扰。而且，为降低第一发光元件21和第二发光元件22的工作功率，可以在封装模组20上设置分别对应第一发光元件21的第一聚光镜261和对应第二发光元件22的第二聚光镜262。
其中，在本实施方式中，对于第一发光元件21和第二发光元件22的工作状态的控制包括多种方式。比如，可以将第二发光元件22与用于红外检测功能的第一发光元件21及红外接收管24共用一个控制电路；也可以对第二发光元件21进行单独控制。
如图5所示，封装模组20还包括第一输入电压端201、第一控制电路202、第一模拟数字转换器203、第一数据接口204和第一电流槽205，其中：
红外接收管24的第一端与第一输入电压端201连接，红外接收管24的第二端与第一模拟数字转换器203的第一端连接，第一模拟数字转换器203的第二端与第一控制电路202的第一端连接，第一控制电路202的第二端与第一数据接口204的第一端连接，第一控制电路202的第三端连接至第一电流槽205，第一数据接口204的第二端连接第一处理器30；第一发光元件21的第一端与第一输入电压端201连接，第一发光元件21的第二端连接至第一电流槽205；第二发光元件22的第一端与第一输入电压端201连接，第二发 光元件22的第二端连接至第一电流槽205，且第一电流槽205还与地线连接。
这样，通过与第一处理器30连接的第一数据接口204接收第一处理器30发送的第一控制信号，使得第一控制电路202根据第一控制信号控制第一发光元件21和/或第二发光元件22的工作状态，实现对第一发光元件21和第二发光元件22的工作状态的控制。而且，通过集中控制第一发光元件21和第二发光元件22的工作状态，可以封装模组20的引脚，并降低封装模组20所需的占用空间。
如图6所示，封装模组20还包括第二输入电压端206、第二控制电路207、第二模拟数字转换器208、第二数据接口209、第二电流槽2010以及与第二发光元件22一端连接的第三数据接口2011，其中：
红外接收管24的第一端与第二输入电压端206连接，红外接收管24的第二端与第二模拟数字转换器208的第一端连接，第二模拟数字转换器208的第二端与第二控制电路207的第一端连接，第二控制电路207的第二端与第二数据接口209的第一端连接，第二控制电路207的第三端连接至第二电流槽2010，第二数据接口209的第二端连接第二处理器40；第一发光元件21的第一端与第二输入电压端206连接，第一发光元件21的第二端连接至第二电流槽2010；第三数据接口2011连接所述第二处理器40，接收第二处理器40发送的用于控制第二发光元件22的工作状态的第二控制信号，且第二发光元件22的另一端与地线连接，其中，第二发光元件22通过第二处理器40的电流槽进行供电，以供第二发光元件22发光。
其中，通过与第二处理器40连接的第二数据接口209接收第二处理器40发送的第二控制信号，以便第二控制电路207根据第二控制信号控制第一发光元件21的工作状态，实现对第一发光元件21的工作状态的控制。
这样，通过两路控制信号，分别控制第一发光元件21和第二发光元件22，可以利用终端设备现有的电压控制接口进行控制，还可以降低封装模组20的开发难度。
如图2至图4所示，本公开实施例还提供一种终端设备，包括盖板10和上述实施例中的封装模组20，封装模组20位于盖板10的内侧，盖板10上设置有透光结构11，且封装模组20的第一槽型结构23在封装模组20中的 位置与透光结构11在盖板上的位置相对应。这样可以使封装模组20的第一发光元件21和第二发光元件22发射光线能够通过透光结构11传导至终端设备外。
其中，透光结构11可以是设置在盖板10上的开孔，也可以是在盖板10的黑边区域所形成的透光区域，只要能够使第一发光元件21和第二发光元件22发射光线能够通过透光结构11传导至终端设备外即可，在此不做具体限定。
需要说明的是，上述封装模组实施例的实现方式同样适应于该终端设备的实施例中，并能达到相同的技术效果，在此不再赘述。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (9)

  1. 一种封装模组，应用于包括盖板的终端设备，所述盖板设置有透光结构，所述封装模组包括第一发光元件和第二发光元件，所述第一发光元件和所述第二发光元件位于所述封装模组的第一槽型结构中，所述第一槽型结构在所述封装模组中的位置与所述透光结构在所述盖板上的位置相对应。
  2. 根据权利要求1所述的封装模组，还包括红外接收管，所述红外接收管位于所述封装模组的第二槽型结构中，且所述第二槽型结构在所述封装模组中的位置与所述透光结构在所述盖板上的位置相对应。
  3. 根据权利要求2所述的封装模组，其中，所述第一槽型结构在第一平面上的正投影位于所述透光结构在所述第一平面上的正投影内，所述第二槽型结构在所述第一平面上的正投影位于所述透光结构在所述第一平面上的正投影内；其中，所述第一平面为所述终端设备的显示面所在的平面。
  4. 根据权利要求1所述的封装模组，还包括设置在所述第一发光元件和所述第二发光元件发射的光线的出射方向上的至少一个聚光镜，且所述聚光镜覆盖所述第一发光元件和所述第二发光元件中的至少一个。
  5. 根据权利要求1至4中任一项所述的封装模组，其中，所述第一槽型结构中还设置有将所述第一发光元件和所述第二发光元件分隔的隔板。
  6. 根据权利要求1至4中任一项所述的封装模组，还包括第一控制电路和第一数据接口，其中：
    所述第一数据接口的第一端连接第一处理器，接收所述第一处理器发送的第一控制信号，所述第一数据接口的第二端与所述第一控制电路连接；
    所述第一控制电路用于根据所述第一控制信号控制所述第一发光元件和/所述第二发光元件的工作状态。
  7. 根据权利要求1至4中任一项所述的封装模组，还包括第二控制电路、第二数据接口及与所述第二发光元件连接的第三数据接口，其中：
    所述第二数据接口的第一端连接第二处理器，接收所述第二处理器发送的第二控制信号，所述第二数据接口的第二端与所述第二控制电路连接；
    所述第二控制电路用于根据所述第二控制信号控制所述第一发光元件的 工作状态；
    所述第三数据接口连接所述第二处理器，接收所述第二处理器发送的用于控制所述第二发光元件的工作状态的第三控制信号。
  8. 一种终端设备，包括盖板及如权利要求1至7中任一项所述的封装模组，所述封装模组位于所述盖板的内侧，且所述盖板设置有透光结构，所述封装模组的第一槽型结构在所述封装模组中的位置与所述透光结构在所述盖板上的位置相对应。
  9. 根据权利要求8所述的终端设备，其中，所述透光结构为设置于所述盖板上的开孔。
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