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WO2017109882A1 - Substrat et procédé de fabrication du substrat - Google Patents

Substrat et procédé de fabrication du substrat Download PDF

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Publication number
WO2017109882A1
WO2017109882A1 PCT/JP2015/085970 JP2015085970W WO2017109882A1 WO 2017109882 A1 WO2017109882 A1 WO 2017109882A1 JP 2015085970 W JP2015085970 W JP 2015085970W WO 2017109882 A1 WO2017109882 A1 WO 2017109882A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
metal
layer
plating
core
Prior art date
Application number
PCT/JP2015/085970
Other languages
English (en)
Japanese (ja)
Inventor
保明 関
純平 高林
直之 牧野
Original Assignee
株式会社メイコー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社メイコー filed Critical 株式会社メイコー
Priority to JP2017557575A priority Critical patent/JP6311081B2/ja
Priority to CN201580084237.5A priority patent/CN108353498B/zh
Priority to PCT/JP2015/085970 priority patent/WO2017109882A1/fr
Publication of WO2017109882A1 publication Critical patent/WO2017109882A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a substrate, such as a printed wiring board, which has a metal piece inserted therein and has excellent large current and heat dissipation characteristics, and a method for manufacturing the substrate.
  • ⁇ Semiconductor elements in electric circuits tend to generate more heat due to higher density and higher current.
  • a semiconductor using Si causes malfunction and failure when the ambient temperature is 100 ° C. or higher.
  • Examples of such heat-generating components such as semiconductor elements include switching elements such as IGBT (Insulated Gate Bipolar Transistor) and IPM (Intelligent Power Module).
  • a heat dissipation path is formed so as to release the heat generated from the heat generating components toward the opposite side of the substrate. Specifically, cooling is performed by conducting heat generated from the heat-generating component to a heat sink or the like on the back side of the substrate (the side opposite to the component mounting surface (mounting surface)).
  • a metal piece made of a metal having high thermal conductivity (Cu, Al, etc.) is used.
  • This metal piece is fixed in a through hole formed in the substrate.
  • the metal piece is fixed to the through hole by adhesion by press-fitting or plastic deformation, joining by an adhesive or solder, etc. (see, for example, Patent Document 1).
  • heat generated from the heat generating component is radiated to the outside through the metal piece (for example, columnar copper).
  • the present invention has been made in consideration of the above-described conventional technology, and has an object to provide a substrate having a heat dissipation characteristic and sufficient electrical conduction and a method for manufacturing the substrate.
  • a laminated wiring board in which a plurality of conductive layers made of a conductive material are formed, a through hole formed through the laminated wiring board, and an inner wall of the through hole are provided. Covering, through-hole plating electrically connected to the conductive layer, and disposed inside the through-hole plating, covering the metal core portion and the entire surface of the core portion, the core portion A metal piece composed of a different metal film part, and the metal part arranged between the film part and the through-hole plating, and formed of each other metal forming the film part and the through-hole plating.
  • a substrate comprising an alloy film and a lid plating layer made of a metal material covering both surfaces of the laminated wiring board including the coating part.
  • the coating portion has a two-layer structure of an inner layer that directly covers the core portion and an outer layer disposed outside the inner layer, and the core portion, the inner layer, and the outer layer are all formed of different metals. .
  • the core portion is made of copper, silver, or aluminum
  • the outer layer is made of tin or gold
  • the inner layer is made of nickel.
  • the coating portion having a two-layer structure including an inner layer and an outer layer is formed by performing a two-layer plating process on the core portion, and the core portion, the inner layer, All outer layers are made of different metals.
  • the core portion is formed of copper, silver, or aluminum
  • the outer layer is formed of tin or gold
  • the inner layer is formed of nickel.
  • the core part forming the metal piece is joined to the through-hole plating through the alloy film. Therefore, as a result, the core portion can be electrically connected to the conductive layer. Since this connection is made by an alloy layer formed by chemically reacting the coating covering the core and the through-hole plating, it is possible to ensure a stable and reliable electrical connection (conductivity). it can. That is, it is possible to obtain a substrate that has heat dissipation characteristics and can achieve sufficient electrical conduction. Further, since conductivity can be ensured through the core portion in this way, there is no need to separately form through-hole plating for electrical conduction on the laminated wiring board.
  • the space for forming such a through hole becomes unnecessary, and it can contribute to the high density of the component mounting in the board
  • the core portion is covered with the coating portion on both sides of the through hole in the penetrating direction. For this reason, it can prevent that a core part will be exposed and can protect a core part.
  • both surfaces of the laminated wiring board may be covered with a lid plating layer together with the coating portion (metal piece). Thereby, the integration of the metal piece and the laminated wiring board is strengthened, and the metal piece is surely prevented from coming out of the through hole, and the integrity as the substrate can be secured.
  • the core portion and the coating portion can be formed from a metal having excellent electrical continuity and heat dissipation, and the coating portion can be formed from a metal that is easily alloyed.
  • the core portion and the coating portion it is possible to select an optimum metal while taking into consideration the electrical continuity and heat dissipation action according to the characteristics of each other.
  • the inner layer is interposed between the core portion and the outer layer, so that the core portion and the outer layer are prevented from being alloyed. Furthermore, even if the inner wall surface of the through-hole plating has an uneven shape, by using a soft metal as the outer layer (the coating part if the coating part is not a two-layer structure), the outer layer (the coating part) However, since it follows corresponding to this uneven
  • the core portion in the metal piece forming step, is plated so as to cover the entire surface with the coating portion, so that the metal piece is removed in the subsequent pressing step.
  • the core part can be protected when pressed.
  • a coating portion different from the core portion is formed in advance, and in the alloy film forming step, the coating portion and the through-hole plating are alloyed.
  • the alloy layer is formed by a chemical reaction. For this reason, stable and reliable electrical connection (conductivity) can be ensured.
  • the alloy film in which stable electrical connection is ensured in this way covers the core part, the core part is joined to the through-hole plating through the alloy film as a result. Thereby, the electrical connection between a core part and a conductive layer is securable. That is, it is possible to obtain a substrate that has heat dissipation characteristics and can achieve sufficient electrical conduction.
  • a lid plating layer forming step may be performed so that both surfaces of the laminated wiring board are covered with a lid plating layer together with the coating portion (metal piece).
  • the integration of the metal piece and the laminated wiring board is strengthened, and the metal piece is surely prevented from coming out of the through hole, and the integrity as the substrate can be secured.
  • the core part and the coating part are formed of different metals in the metal piece forming step, the core part is formed of a metal having excellent electrical continuity and heat dissipation, and the coating part is made of a metal that is easily alloyed. Can be formed.
  • the two-layer plating process is performed in the metal piece forming process, and the coating portion is formed as a two-layer structure (inner layer and outer layer) made of different metals, thereby preventing the core portion and the coating portion from being alloyed. it can.
  • the inner layer is interposed between the core portion and the outer layer, so that the core portion and the outer layer are prevented from being alloyed. Furthermore, even if the inner wall surface of the through-hole plating has an uneven shape, by using a soft metal as the outer layer (the coating part if the coating part is not a two-layer structure), the outer layer (the coating part) However, since it follows corresponding to this uneven
  • a substrate 1 according to the present invention has a laminated wiring board 3 called a multilayer board (including a double-sided board) in which a plurality of conductive layers 2 are formed as a main structure.
  • a so-called four-layer plate in which four conductive layers 2 are formed is shown.
  • the conductive layer 2 is formed in each layer as a conductor pattern.
  • An insulating layer 4 is disposed between the conductive layers 2.
  • the insulating layer 4 is made of an insulating material such as a prepreg.
  • the through-hole 6 is formed in the laminated wiring board 3.
  • the through hole 6 penetrates the laminated wiring board 3.
  • the through hole 6 has a substantially cylindrical shape.
  • the through hole 6 has a circular shape.
  • a through hole plating 7 is formed on the inner wall of the through hole 6. Since the through hole plating 7 is formed in contact with the inner wall of the through hole 6, the conductive layer 2 communicating with the inner wall of the through hole 6 and the through hole plating 7 are electrically connected. For this reason, copper is preferable as the plating material.
  • the through-hole plating 7 is formed on both surfaces of the laminated wiring board 3 and the inner wall surface of the through-hole 6.
  • a metal piece 10 is arranged in the through hole 6, a metal piece 10 is arranged.
  • the metal piece 10 is formed of a metal core portion 8 and a coating portion 9 that covers the entire surface of the core portion 8.
  • the film part 9 is made of a metal different from the core part 8.
  • the core part 8 is substantially cylindrical shape. Since the core portion 8 plays a role of heat dissipation and conduction of the substrate 1, a metal having excellent heat dissipation and conduction characteristics is used for the core portion 8.
  • the metal piece 10 is held in engagement with the through hole 6 with its diameter being expanded outward in the through hole 6. That is, the metal piece 10 is fitted in the through hole 6.
  • an alloy film 11 is disposed between the metal piece 10 and the through-hole plating 7.
  • the alloy film 11 is formed by alloying the metals forming the film portion 9 and the through-hole plating 7.
  • the lid plating layer 12 is arranged on both surfaces of the laminated wiring board 3.
  • the lid plating layer 12 covers both surfaces of the laminated wiring board 3. Since this lid plating layer 12 is formed by a plating process, metal is deposited on the surface of the laminated wiring board 3.
  • the lid plating layer 12 covers the laminated wiring board 3 including the surface of the coating 9 exposed on the surface of the laminated wiring board 3.
  • the core portion 8 forming the metal piece 10 is bonded to the through-hole plating 7 through the alloy film 11. Therefore, as a result, the core portion 8 is electrically connected to the conductive layer 2. Since this connection is made by the alloy layer 11 formed by the chemical reaction between the coating portion 9 covering the core portion 8 and the through-hole plating 7, a stable and reliable electrical connection (conductivity) is achieved. Can be secured. That is, it is possible to obtain the substrate 1 having heat dissipation characteristics and sufficient electrical conduction. In addition, since conductivity can be ensured through the core portion 8 in this way, it is not necessary to separately form through holes and through hole plating for electrical conduction in the laminated wiring board 3.
  • the space for forming such a through hole becomes unnecessary, and it can contribute to the high density of the component mounting in the board
  • the core portion 8 is covered with the coating portion 9 on both sides of the through hole 6 in the penetrating direction. For this reason, it can prevent that the core part 8 will be exposed and can protect the core part 8.
  • FIG. Moreover, both surfaces of the laminated wiring board 3 are covered with the cover plating layer 12 together with the coating portion 9 (metal piece 10). For this reason, the integration of the metal piece 10 and the laminated wiring board 3 is strengthened, and the metal piece 10 is reliably prevented from coming out of the through hole 6, and the integrity as the substrate 1 can be secured.
  • the core portion 8 and the coating portion 9 are formed with different metals, the core portion 8 is formed with a metal having excellent electrical conduction and heat dissipation, and the coating portion 9 is formed with a metal that is easily alloyed. be able to.
  • the core portion 8 and the coating portion 9 it is possible to select an optimum metal while taking into consideration the electrical continuity and heat dissipation action according to the characteristics of each other.
  • the coating portion 9 may be formed of a two-layer structure of an inner layer 13 that directly covers the core portion 9 and an outer layer 14 disposed outside the inner layer 13.
  • the core part 8, the inner layer 13, and the outer layer 14 are all formed of different metals.
  • the core portion 8 is formed of copper, silver, or aluminum
  • the outer layer 14 is formed of tin or gold
  • the inner layer 13 is formed of nickel.
  • the inner layer 13 is interposed between the core portion 8 and the outer layer 14, so that the core portion 8 and the outer layer 14 are alloyed. It is prevented. Furthermore, even if the inner wall surface of the through-hole plating 7 has an uneven shape, by using a soft metal as the outer layer 14 (or the coating portion 9 when the coating portion 9 is not a two-layer structure), the outer layer 14 (coating part 9) follows this uneven shape, so that the metal piece 10 can be reliably held in the through hole 6.
  • the core portion 8 is preferably made of any metal of copper, silver, or aluminum having high electrical conduction characteristics and heat dissipation characteristics.
  • the outer layer 14 is preferably made of any metal of tin or gold (or copper tin alloy) having high spreading characteristics.
  • the inner layer 13 is preferably formed of nickel having low reactivity.
  • the substrate 1 described above can be manufactured by the substrate manufacturing method according to the present invention.
  • This manufacturing method is represented in the flowchart shown in FIG.
  • a laminated wiring board forming step is first performed (step S1).
  • a laminated wiring board 3 as shown in FIG. 4 is obtained by stacking a plurality of insulating layers 4 and conductive layers 2 and pressing them in the laminating direction.
  • the insulating layer 4 is made of, for example, an insulating resin material
  • the conductive layer 2 is formed of a conductive material as a pattern.
  • a so-called single-sided board (a copper-clad laminate in which a copper foil is formed only on one side) in which the conductive layer 2 is formed only on one side of the insulating layer 4 is used.
  • Two sheets are sandwiched between so-called double-sided plates (copper-clad laminates with copper foils formed on both sides) in which the conductive layer 2 is formed on both sides of the insulating layer 4 and laminated.
  • the insulating layer 4 is made of, for example, a prepreg in which a sheet-like glass cloth 5 that is a cloth woven with glass fiber yarns is placed in an epoxy resin.
  • a through-hole plating forming process is performed (step S2).
  • a through hole 6 as shown in FIG. 5 penetrating the laminated wiring board 3 is formed.
  • the through hole 6 is formed by drilling the laminated wiring board 3 with a drill, punch press, laser, or the like.
  • the through hole 6 has a substantially cylindrical shape.
  • the through hole 6 has a circular shape.
  • the through hole 6 is plated.
  • a through-hole plating 7 as shown in FIG. 6 is formed on the inner wall of the through-hole 6. Since the through hole plating 7 is formed in contact with the inner wall of the through hole 6, the conductive layer 2 communicating with the inner wall of the through hole 6 and the through hole plating 7 are electrically connected. For this reason, copper is preferable as the plating material. Since this plating process is performed on the entire surface of the laminated wiring board 3, the through-hole plating 7 deposited by the plating process is formed on both surfaces of the laminated wiring board 3 and the inner wall surface of the through-hole 6.
  • a metal piece forming step is performed (step S3). You may perform this metal piece formation process before the laminated wiring board formation process and through-hole plating formation process which were mentioned above.
  • the metal core portion 8 is formed.
  • the core portion 8 has a substantially cylindrical shape.
  • the core portion 8 is formed, for example, by machining a metal plate or bar. Specifically, it is formed by punching a metal plate into a substantially cylindrical shape, or appropriately cutting a long, substantially cylindrical rod material into a predetermined length. Further, since the core portion 8 plays a role of heat dissipation and conduction of the substrate 1, a metal having excellent heat dissipation and conduction characteristics is used for the core portion 8.
  • the core portion 8 is plated. A metal different from the core portion 8 is used for the plating process. A film portion 9 is formed on the entire surface of the core portion 8 plated in this manner. Thus, the metal piece 10 is formed by covering the entire surface of the core portion 8 with the coating portion 9.
  • step S4 a pressing process is performed (step S4).
  • the metal piece 10 is inserted into the through hole 6 as shown in FIG. Therefore, the diameter of the metal piece 10 is smaller than the diameter of the through hole 6 (specifically, the through hole plating 7).
  • the metal piece 10 is pressed from the vertical direction (on both sides of the through hole through direction). Thereby, as shown in FIG. 8, the diameter of the metal piece 10 is expanded outward.
  • the film portion 9 comes into contact with the through-hole plating 7 by expanding the diameter of the metal piece 10.
  • the pressing may be performed by placing a plate for pressing on one surface of the metal piece 10 and pressing the pressing member only from the other side.
  • step S5 an alloy film forming step is performed (step S5).
  • the metals forming the coating portion 9 and the through-hole plating 7 are alloyed to form an alloy film 11 as shown in FIG.
  • the contact portion between the film portion 9 and the through-hole plating 7 is heated and alloyed.
  • This heating is naturally accelerated by heat treatment such as solder resist curing and reflow performed during the substrate manufacturing process. That is, the heat treatment not only means that the contact portion between the coating portion 9 and the through-hole plating 7 is heated, but also means the heat treatment for the entire laminated wiring board 3 including this contact portion. .
  • a lid plating layer forming step is performed (step S6).
  • the lid plating layer 12 is formed on both surfaces of the laminated wiring board 3.
  • the lid plating layer 12 is formed to form the substrate 1 as shown in FIG.
  • the film portions 9 of the metal pieces 10 are exposed on both surfaces that are both sides of the through hole 6 in the penetration direction.
  • the lid plating layer 12 is formed by plating including the coating portion 9. That is, the lid plating layer 12 is formed by performing plating on both surfaces of the laminated wiring board 3. This alloying step is actually performed at the same time as or before the alloy film forming step.
  • substrate 1 which concerns on this invention, since a metal-plating process is performed so that the whole surface may be covered with the film part 9 with respect to the core part 8 in a metal piece formation process, it is a subsequent press process.
  • the core portion 8 can be protected when the metal piece 10 is pressed. That is, since the entire surface of the core portion 8 is covered with the coating portion 9, the surface pressed in the pressing step is not exposed.
  • the reliable protection of the core part 8 is realizable by performing the metal piece formation process of covering the whole surface of the core part 8 which plays a role of heat dissipation and conduction.
  • the coating portion 9 different from the core portion 8 is formed in advance in the metal piece forming step, and this coating portion 9 and the through-hole plating 7 are alloyed in the alloy film forming step, this alloy is formed in the coating portion. 9 and the through-hole plating 7 become an alloy layer 11 formed by a chemical reaction. For this reason, stable and reliable electrical connection (conductivity) using the alloy layer 11 can be ensured. Such stable electrical continuity cannot be realized only when the same kind of metals (for example, copper) are in physical contact with each other. This is an effect obtained by bringing different metals into contact and alloying them.
  • the alloy film 11 in which stable electrical connection is ensured in this way covers the core portion 8, as a result, the core portion 8 is joined to the through-hole plating 7 through the alloy film 11. Thereby, the electrical connection between the core part 8 and the conductive layer 2 is securable. That is, it is possible to obtain the substrate 1 having heat dissipation characteristics and sufficient electrical conduction.
  • the through-hole plating forming step metal piece forming step, pressing step, and alloy film forming step, it is possible to ensure electrical continuity with the conductive layer 2 through the core portion 8, so that the laminated wiring board 3 is electrically connected separately.
  • the space for forming such a through hole becomes unnecessary, and it can contribute to the high density of the component mounting in the board
  • the lid plating layer forming step both surfaces of the laminated wiring board 3 are covered with the lid plating layer 12 together with the coating portion 9 (metal piece 10). For this reason, the integration of the metal piece 10 and the laminated wiring board 3 is strengthened, and the metal piece 10 is reliably prevented from coming out of the through-hole 6 (through-hole plating 7), and the integrity as the substrate 1 is ensured. it can.
  • the two-layered coating portion 9 composed of the inner layer 13 and the outer layer 14 may be formed by subjecting the core portion 8 to two-layer plating.
  • the core part 8, the inner layer 13, and the outer layer 14 are all formed of different metals.
  • the gold core portion 8 is preferably formed of copper, silver, or aluminum
  • the outer layer 14 is formed of tin or gold
  • the inner layer 13 is preferably formed of nickel.
  • the core part 8 and the film part 9 are formed of different metals in the metal piece forming step, so that the core part 8 is a metal having excellent electrical continuity and heat dissipation (for example, copper, silver, aluminum).
  • the coating portion 9 can be formed of a metal (for example, tin, gold) that is easily alloyed.
  • a metal for example, tin, gold
  • the core portion 8 and the coating portion are formed by performing two-layer plating in the metal piece forming step and forming the coating portion 9 as a two-layer structure (inner layer 13 and outer layer 14) made of different metals. 9 can be prevented from alloying. That is, by forming the inner layer 13 with a metal having relatively low reactivity, the inner layer 13 is interposed between the core portion 8 and the outer layer 14, so that the core portion 8 and the outer layer 14 are alloyed. It is prevented.
  • the outer layer 14 (coating part 9) follows this uneven shape, so that the metal piece 10 can be reliably held in the through hole 6.
  • the core portion 8 is preferably made of any metal of copper, silver, or aluminum having high electrical conduction characteristics and heat dissipation characteristics.
  • the outer layer 14 is preferably made of any metal of tin or gold (or copper tin alloy) having high spreading characteristics.
  • the inner layer 13 is preferably formed of nickel having low reactivity.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

L'invention concerne un substrat (1), comprenant : une carte de câblage en couches (3) sur laquelle une pluralité de couches conductrices (2) sont formées ; un trou de traversée (6) formé à travers la carte de câblage en couches (3) ; une métallisation de trou de traversée (7), qui recouvre la paroi intérieure du trou de traversée (6) et qui est reliée électriquement aux couches conductrices (2) ; une pièce métallique (10), qui est disposée sur le côté intérieur de la métallisation de trou de traversée (7) et qui est configurée à partir d'une section centrale (8), et une section de film (9) recouvrant toute la surface de la section centrale (8) ; et un film d'alliage (11), qui est disposé entre la section de film (9) et la métallisation de trou de traversée (7), et qui est formé de métaux dont la section (9) et la métallisation de trou de traversée (7) sont respectivement formées.
PCT/JP2015/085970 2015-12-24 2015-12-24 Substrat et procédé de fabrication du substrat WO2017109882A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017557575A JP6311081B2 (ja) 2015-12-24 2015-12-24 基板及び基板の製造方法
CN201580084237.5A CN108353498B (zh) 2015-12-24 2015-12-24 基板及基板的制造方法
PCT/JP2015/085970 WO2017109882A1 (fr) 2015-12-24 2015-12-24 Substrat et procédé de fabrication du substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/085970 WO2017109882A1 (fr) 2015-12-24 2015-12-24 Substrat et procédé de fabrication du substrat

Publications (1)

Publication Number Publication Date
WO2017109882A1 true WO2017109882A1 (fr) 2017-06-29

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CN (1) CN108353498B (fr)
WO (1) WO2017109882A1 (fr)

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Publication number Priority date Publication date Assignee Title
CN110730575A (zh) * 2019-10-18 2020-01-24 苏州浪潮智能科技有限公司 一种实心过孔制造方法
TWI848581B (zh) * 2023-02-22 2024-07-11 同欣電子工業股份有限公司 印刷電路板及其製造方法

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JP2002111159A (ja) * 2000-10-04 2002-04-12 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
JP2005294496A (ja) * 2004-03-31 2005-10-20 Matsushita Electric Ind Co Ltd 配線基板の連結構造体及びその製造方法
JP2011091116A (ja) * 2009-10-20 2011-05-06 Freesia Makurosu Kk 電子部品搭載用基板の製造方法及び電子部品搭載用基板
WO2013031815A1 (fr) * 2011-08-31 2013-03-07 株式会社フジクラ Procédé de fabrication d'une carte à circuits multicouche

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JP2003197835A (ja) * 2001-12-26 2003-07-11 Tdk Corp 電力増幅モジュール及び電力増幅モジュール用要素集合体
JP3922642B2 (ja) * 2003-07-30 2007-05-30 日本無線株式会社 熱伝導部材付きプリント基板及びその製造方法
JP4387269B2 (ja) * 2004-08-23 2009-12-16 株式会社テクニスコ ビアが形成されたガラス基板及びビアの形成方法
JP2007165756A (ja) * 2005-12-16 2007-06-28 Matsushita Electric Ind Co Ltd 層間接続シート及びその製造方法ならびにそれを用いた多層フレキシブルプリント配線板
JP5540737B2 (ja) * 2010-01-29 2014-07-02 トヨタ自動車株式会社 プリント基板
WO2014171004A1 (fr) * 2013-04-19 2014-10-23 株式会社メイコー Carte de circuits imprimes et son procede de fabrication, ainsi que corps thermo-conducteur
JP6169694B2 (ja) * 2013-06-25 2017-07-26 株式会社メイコー 放熱基板及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002111159A (ja) * 2000-10-04 2002-04-12 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
JP2005294496A (ja) * 2004-03-31 2005-10-20 Matsushita Electric Ind Co Ltd 配線基板の連結構造体及びその製造方法
JP2011091116A (ja) * 2009-10-20 2011-05-06 Freesia Makurosu Kk 電子部品搭載用基板の製造方法及び電子部品搭載用基板
WO2013031815A1 (fr) * 2011-08-31 2013-03-07 株式会社フジクラ Procédé de fabrication d'une carte à circuits multicouche

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CN108353498B (zh) 2020-10-09
JP6311081B2 (ja) 2018-04-11
CN108353498A (zh) 2018-07-31
JPWO2017109882A1 (ja) 2018-04-19

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