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WO2016152220A1 - 赤外線温度センサ、回路基板及び赤外線温度センサを用いた装置 - Google Patents

赤外線温度センサ、回路基板及び赤外線温度センサを用いた装置 Download PDF

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Publication number
WO2016152220A1
WO2016152220A1 PCT/JP2016/051663 JP2016051663W WO2016152220A1 WO 2016152220 A1 WO2016152220 A1 WO 2016152220A1 JP 2016051663 W JP2016051663 W JP 2016051663W WO 2016152220 A1 WO2016152220 A1 WO 2016152220A1
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WO
WIPO (PCT)
Prior art keywords
infrared
temperature sensor
substrate
infrared temperature
main body
Prior art date
Application number
PCT/JP2016/051663
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English (en)
French (fr)
Japanese (ja)
Inventor
野尻　俊幸
武士 布施
正幸 碓井
亮 細水
Original Assignee
Ｓｅｍｉｔｅｃ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｓｅｍｉｔｅｃ株式会社 filed Critical Ｓｅｍｉｔｅｃ株式会社
Priority to JP2016538806A priority Critical patent/JP6076549B1/ja
Priority to KR1020177026408A priority patent/KR102610063B1/ko
Priority to CN201680016650.2A priority patent/CN107407602B/zh
Publication of WO2016152220A1 publication Critical patent/WO2016152220A1/ja

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0215—Compact construction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point

Definitions

  • the present invention relates to a surface-mounted infrared temperature sensor that detects infrared rays from a detection object and measures the temperature of the detection object, a circuit board on which the infrared temperature sensor is mounted, and a device using the infrared temperature sensor. .
  • infrared temperature from the object to be detected is detected in a non-contact manner, and the temperature of the object to be detected is measured.
  • An infrared temperature sensor is used.
  • Such an infrared temperature sensor is provided with a temperature compensating thermal element in addition to the infrared detecting thermal element in order to compensate for a change in ambient temperature. Further, the infrared temperature sensor has a lead wire connected to the infrared detection thermal element and the temperature compensation thermal element and led out to the outside, and is arranged to face the detection target (for example, see Patent Document 1). Since the infrared temperature sensor disclosed in Patent Document 1 is not a structure suitable for surface mounting, there is a problem that it cannot meet the needs of surface mounting. On the other hand, surface mount type infrared temperature sensors have been proposed to meet the needs of surface mounting (see Patent Document 2 and Patent Document 3).
  • the housing (case) is made of resin and is made of a material having low thermal conductivity. Therefore, due to disturbances such as ambient air, the temperature of the housing is less likely to be uniform and temperature unevenness occurs.
  • Cheap Since an infrared absorption film and an infrared reflection film are used facing the thermosensitive element, their functions are easily deteriorated against dirt, and the reliability is lowered.
  • This is a configuration in which the mounting terminals are drawn out and led out from the outer side surface of the resin casing to the bottom surface side, and the configuration may be complicated.
  • the present invention has been made in view of the above-mentioned problems, and can be used to effectively specify a measurement part of a detection target and to be able to be downsized. And it aims at providing the apparatus using an infrared temperature sensor.
  • the infrared temperature sensor according to claim 1 is a surface-mount type infrared temperature sensor having an opening on one surface side, a light guide portion formed to guide infrared light, and a shielding wall on one surface side.
  • a heat conductive main body having a shielding portion formed to shield infrared rays, a substrate disposed on the other surface side of the main body, and the light guide disposed on the substrate.
  • An infrared detecting thermal element disposed at a position corresponding to the portion, and a temperature compensating element disposed on the substrate, spaced apart from the infrared detecting thermal element, and disposed at a position corresponding to the shielding portion.
  • a heat sensitive element, a wiring pattern formed on the substrate, connected to the infrared detecting heat sensitive element and the temperature compensating heat sensitive element, and connected to the wiring pattern and formed on the end side on the substrate A mounting terminal.
  • the material of the main body is not particularly limited as long as it has thermal conductivity.
  • a resin containing a metal material or a thermally conductive filler can be used.
  • a flexible wiring board and a rigid wiring board can be used for a board
  • the wiring board is not limited to a specific type.
  • the substrate can be disposed on the main body by pressing, welding, brazing, adhesion, adhesion, or the like.
  • the arrangement means is not particularly limited.
  • a chip thermistor made of a ceramic semiconductor is preferably used as the infrared detecting thermal element and the temperature compensating thermal element, but not limited to this, a thermocouple, a resistance temperature detector, or the like can be used.
  • the pattern form of the wiring pattern is not particularly limited, and can be appropriately adopted according to the design, for example, a straight line shape or a meander shape.
  • the end side on the substrate on which the mounting terminals are formed means not only the endmost part but also includes a certain range around the endmost part.
  • the infrared temperature sensor according to claim 2 is the infrared temperature sensor according to claim 1, wherein an accommodation space is formed inside the other surface of the main body, and the substrate is formed of the accommodation space. It is arrange
  • the infrared temperature sensor according to claim 3 is the infrared temperature sensor according to claim 1, wherein the other surface side of the main body is a planar planar portion, and the substrate is disposed on the planar portion. It is characterized by being arranged along.
  • the infrared temperature sensor according to claim 4 is the infrared temperature sensor according to any one of claims 1 to 3, wherein the substrate is disposed on the main body by pressing. .
  • the infrared temperature sensor according to claim 5 is the infrared temperature sensor according to any one of claims 1 to 3, wherein the substrate is disposed on the main body by welding.
  • the infrared temperature sensor according to claim 6 is the infrared temperature sensor according to any one of claims 1 to 3, wherein the substrate is disposed on the main body by brazing, adhesion, or adhesion.
  • the infrared temperature sensor according to claim 7 is the infrared temperature sensor according to any one of claims 1 to 6, wherein the substrate is formed of a material that can be thermally welded to the main body. To do.
  • the infrared temperature sensor according to claim 8 is the infrared temperature sensor according to any one of claims 1 to 7, wherein a lid member is disposed on the other surface side so as to face the substrate. To do.
  • the infrared temperature sensor according to claim 9 is the infrared temperature sensor according to claim 8, wherein at least a part of the inner surface of the lid member facing the substrate is a reflective surface. .
  • the infrared temperature sensor according to claim 10 is the infrared temperature sensor according to any one of claims 1 to 9, wherein the main body is made of a metal material, and an oxide film is formed by an oxidation process.
  • the light guide is blackened.
  • An infrared temperature sensor is the infrared temperature sensor according to any one of the first to tenth aspects, wherein a sealed space portion is formed in the shielding portion, and the space portion. And a ventilation section that allows ventilation between the outside and the outside.
  • the infrared temperature sensor according to claim 12 is the infrared temperature sensor according to any one of claims 1 to 11, wherein the light guide portion and the shielding portion define a boundary between the light guide portion and the shielding portion. It is characterized by being formed in a substantially symmetrical form as a center.
  • An infrared temperature sensor is the infrared temperature sensor according to any one of claims 1 to 12, wherein the partition wall in the main body excluding the openings on the other surface side of the light guide portion and the shielding portion. Are continuously or partially in contact with the substrate.
  • the infrared temperature sensor according to claim 14 is the infrared temperature sensor according to any one of claims 1 to 13, wherein the opening of the main body does not protrude from the surface, and at least the light guide portion is provided. It is blackened and has a thermal conductivity of 10 W / m ⁇ K or more.
  • An infrared temperature sensor is the infrared temperature sensor according to any one of claims 1 to 14, wherein the wiring pattern for connecting the infrared detecting thermal element and the temperature compensating thermal element is provided. Are arranged in parallel to each other.
  • the infrared temperature sensor according to claim 16 is the infrared temperature sensor according to any one of claims 1 to 15, wherein the infrared detecting thermal element and the temperature compensating thermal element are a metal oxide or a metal nitride.
  • the circuit board according to claim 17 is a mounting board having a connection terminal to which the mounting terminal is connected, and the infrared temperature sensor according to any one of claims 1 to 16 mounted on the mounting board. It is characterized by comprising.
  • the circuit board according to claim 18 is the circuit board according to claim 17, characterized in that the mounting board has a cavity structure.
  • a glass epoxy substrate or the like is generally used, but a metal substrate having good thermal conductivity such as aluminum or copper is desirable.
  • the circuit board according to claim 19 is the circuit board according to claim 17 or 18, wherein the mounting board has an infrared reflecting surface formed on at least a part of the surface facing the board.
  • the infrared reflecting surface may be formed by using an aluminum surface when the substrate is an aluminum substrate, or by forming an infrared reflecting film such as nickel or gold plating when the substrate is a copper substrate.
  • an infra-red reflecting film such as nickel or gold plating may be formed on an inlay material made of copper or iron, and the opposing surface may be formed as an infrared reflecting surface.
  • An apparatus using the infrared temperature sensor according to claim 20 is provided with the infrared temperature sensor according to any one of claims 1 to 16.
  • the infrared temperature sensor can be provided and applied to various devices for detecting the temperature of, for example, a fixing device of a copying machine, a battery unit, a capacitor, an IH cooking heater, and an article in a refrigerator.
  • the specially applied device is not limited.
  • a surface-mount type infrared temperature sensor capable of effectively specifying a measurement part of a detection target and capable of being downsized, a circuit board on which the infrared temperature sensor is mounted, and an apparatus using the infrared temperature sensor Can be provided.
  • FIG. 3 is a cross-sectional view taken along line AA in FIG.
  • FIG. 3 is a cross-sectional view taken along line BB in FIG.
  • FIG. 3 is a cross-sectional view taken along the line CC in FIG.
  • FIG. 7 is a cross-sectional view of the main body along the line XX in FIG. 6.
  • FIG. 8A is a cross-sectional view corresponding to FIG. 5 in which a lid member is provided on the back side of the main body, and FIG.
  • FIG. 8B is a perspective view showing the lid member (Modification 1).
  • FIG. 7 is a cross-sectional view corresponding to FIG. 6, provided with a ventilation portion that allows ventilation with the outside (Modification 2). It is a top view which shows a wiring pattern (modification 3). It is a perspective view which decomposes
  • FIG. 7 is a cross-sectional view showing the infrared temperature sensor and corresponding to FIG. 6.
  • FIG. 15 is a cross-sectional view of the main body along the line XX in FIG. 14. It is a top view which shows an adhesive sheet. It is sectional drawing which shows the example from which the infrared temperature sensor differs.
  • FIGS. 1 is a perspective view showing an infrared temperature sensor
  • FIG. 2 is a plan view showing the infrared temperature sensor
  • FIG. 3 is a rear view showing the infrared temperature sensor.
  • 4 is a sectional view taken along line AA in FIG. 2
  • FIG. 5 is a sectional view taken along line BB in FIG. 2
  • FIG. 6 is a sectional view taken along line CC in FIG. 7 is a cross-sectional view of the main body taken along line XX in FIG.
  • FIGS. 8 to 10 show modifications.
  • symbol is attached
  • the infrared temperature sensor 1 includes a main body 2, a substrate 3, an infrared detecting thermal element 4 and a temperature compensating thermal element 5 disposed on the substrate 3.
  • a wiring pattern 31 formed on the substrate 3 and a mounting terminal 32 are provided.
  • the infrared temperature sensor 1 is a surface mount type and is configured to be suitable for surface mount.
  • the main body 2 is formed in a substantially rectangular parallelepiped shape with a metal material having thermal conductivity, for example, iron, and includes a light guide portion 21, a shielding portion 22, and an accommodation space portion 23.
  • the main body 2 has a miniaturized size in which the length in the vertical direction and the length in the horizontal direction are 8 mm to 13 mm and the height is 2 mm to 5 mm.
  • the main body 2 is entirely oxidized and blackened by heat treatment. Specifically, the main body 2 is heat-treated at a high temperature of about 400 ° C. to 1000 ° C., whereby an oxide film is formed on the surface of the main body 2 and blackened.
  • the thickness of the oxide film is preferably 10 ⁇ m or less, and specifically 3 ⁇ m.
  • the emissivity is preferably 0.8 or more, and an emissivity of 0.8 to 0.95 can be obtained by the blackening treatment.
  • the material forming the main body 2 is not particularly limited as long as it has a thermal conductivity of at least 10 W / m ⁇ K.
  • materials containing carbon, metal, ceramic and other fillers in resin, metal materials such as iron, nickel, chromium, cobalt, manganese, copper, titanium and molybdenum, alloys containing these metals, and black paint on metal materials The material which gave, ceramic, etc. can be used.
  • the emissivity of the resin itself is high, the surface of the resin becomes black.
  • the main body 2 is formed with a light guide portion 21 and a shielding portion 22.
  • the light guide portion 21 has an opening 21 a on one surface side (front side) of the main body 2 and is formed so as to guide infrared rays.
  • the shielding part 22 has a shielding wall 22a on one side (front side) and is formed so as to shield infrared rays.
  • the light guide 21 is formed as a cylindrical through-hole through which the opening 21a penetrates from the front side to the back side, and the back side is opened.
  • the inner peripheral surface of the light guide 21 is as described above. It is oxidized to black body.
  • the opening 21 a is formed so as not to protrude from the surface of the main body 2, is horizontally long and has a substantially rectangular shape with rounded corners, and has a longitudinal dimension of 3 mm to 6 mm, specifically 6 mm.
  • the length in the short direction is 1 mm to 2.5 mm, specifically 2 mm. Therefore, the dimension of the opening 21a is in the range of 1 mm to 6 mm, and the maximum dimension is set to 6 mm or less.
  • the shape of the opening 21a is not particularly limited. You may form in circular shape, elliptical shape, polygonal shape, etc. It can be appropriately selected depending on the form of the measurement part of the detection object. Further, when the main body 2 is not blackened by oxidation, the infrared absorption layer may be formed on the inner peripheral surface of the light guide portion 21 by performing, for example, black coating or alumite treatment as necessary. Good.
  • the shield part 22 is disposed adjacent to the light guide part 21 and is formed in a substantially symmetrical form with the boundary between the light guide part 21 and the shield part 22 as the central axis.
  • the shielding part 22 has a shielding wall 22a on the front side, and extends to the back side in the same shape as the light guide part 21, that is, in a substantially rectangular shape with rounded corners having the same shape as the opening part 21a. Forming.
  • the space 22b is a concave cavity, and the back side facing the shielding wall 22a is opened.
  • the cross-sectional shape of the portion of the shielding portion 22 that does not include the shielding wall 22 a has the boundary between the light guide portion 21 and the shielding portion 22 as the central axis C. It has a substantially symmetrical form. In other words, except for the opening 21a of the light guide 21 and the shielding wall 22a of the shield 22, the light guide 21 side and the shield 22 side are formed in substantially the same shape.
  • the light guide portion 21 and the shielding portion 22 have a certain space area formed by the surrounding partition walls 24.
  • the partition wall 24 at the boundary between the light guide portion 21 and the shielding portion 22 is referred to as a central wall 24a, and the other partition wall 24 is referred to as a peripheral wall 24b.
  • the accommodating space 23 is formed on the back side inside the main body 2. Specifically, the accommodation space portion 23 is formed in a substantially rectangular parallelepiped concave shape, and communicates with the openings on the back side of the light guide portion 21 and the shielding portion 22.
  • the substrate 3 is an insulating film that absorbs infrared rays formed in a substantially rectangular shape, and is a flexible wiring substrate (FPC) having flexibility.
  • the substrate 3 is disposed on the other surface side (back surface side) of the main body 2.
  • substrate 3 is bend
  • the substrate 3 may be formed into a shape along the inner wall of the accommodation space 23.
  • the substrate 3 is provided with an infrared detecting thermal element 4 and a temperature compensating thermal element 5 on one surface (back side in FIGS. 4 to 6) of the insulating base material. Similarly, on one surface, a conductor wiring pattern 31 and a mounting terminal 32 that is electrically connected to the wiring pattern 31 and located on the end side are formed.
  • a resin made of a polymer material such as polyimide, polyethylene, liquid crystal polymer, fluorine, silicon, polyester, polycarbonate, PPS (polyphenylene sulfide) can be used.
  • carbon black or an inorganic pigment one or more of chrome yellow, petal, titanium white, and ultramarine may be mixed and dispersed in these resins to use a material that can absorb infrared rays of almost all wavelengths.
  • the substrate 3 since the substrate 3 is bent along the inner wall of the housing space 23 and disposed by thermal welding, the substrate 3 is made of a material such as polyimide, polyethylene, or liquid crystal polymer that can be thermally welded. It has been.
  • the wiring pattern 31 has a rectangular electrode terminal 31a on one end side, a narrow pattern extends from the electrode terminal 31a in a meander shape, and is formed at a terminal portion on the other end side.
  • a rectangular mounting terminal 32 specifically, a land for soldering is formed.
  • a pair of wiring patterns 31 having the same pattern is arranged so that the electrode terminals 31a face each other, and the infrared detecting thermal element 4 or the temperature compensating thermal element 5 is arranged and connected.
  • the two pairs of wiring patterns 31 are arranged substantially parallel to each other.
  • the wiring pattern 31dt to which the infrared detection thermal element 4 is connected and the wiring pattern 31cp to which the temperature compensation thermal element 5 is connected are in the same pattern, and are not connected to each other.
  • the element 4 and the temperature compensating thermal element 5 are individually connected.
  • a cover layer 33 which is an insulating layer made of a resin film typified by a polyimide film, resist ink, or the like is formed on the wiring pattern 31.
  • the cover layer 33 is formed so as to cover the wiring pattern 31, but the electrode terminal 31 a and the mounting terminal 32 are exposed portions that are not covered by the cover layer 33.
  • the cover layer 33 can absorb infrared rays of almost all wavelengths by mixing and dispersing carbon black or inorganic pigment (one or more of chrome yellow, petal, titanium white, ultramarine) in polyimide film and resist ink. Materials may be used.
  • carbon black or inorganic pigment one or more of chrome yellow, petal, titanium white, ultramarine
  • the cover layer 33 By using an infrared absorbing material for the cover layer 33, the received light energy is increased and the sensitivity can be improved.
  • the wiring pattern 31 is clearly shown in a state where it can be seen through the substrate 3 in FIG. 2 and through the cover layer 33 in FIG.
  • Such a wiring pattern 31 is formed by patterning with rolled copper foil, electrolytic copper foil or the like, and the mounting terminals 32 are provided with nickel plating, gold plating or solder in order to reduce connection resistance and prevent corrosion. Plating treatment such as plating is performed.
  • the infrared detecting thermal element 4 detects infrared rays from the detection target and measures the temperature of the detection target.
  • the temperature-compensating thermal element 5 detects the ambient temperature and measures the ambient temperature.
  • the infrared detecting thermal element 4 and the temperature compensating thermal element 5 are composed of thermal elements having at least substantially equal temperature characteristics, connected between the opposing electrode terminals 31a of the wiring pattern 31, and spaced apart from each other. Mounting is arranged.
  • the infrared detecting thermal element 4 and the temperature compensating thermal element 5 are chip thermistors in which terminal electrodes are formed at both ends.
  • this thermistor there are thermistors of the NTC type, the PTC type, the CTR type, etc. In this embodiment, for example, an NTC type thermistor is adopted.
  • the infrared detecting thermal element 4 and the temperature compensating thermal element 5 ceramic semiconductors containing metal oxides or metal nitrides of Mn, Co, Ni, and Fe, that is, Mn—Co—Ni. -A thin film thermistor element made of an Fe-based material is used. Since this ceramic semiconductor has a high B constant which is a temperature coefficient, it is possible to detect a temperature change of the substrate 3 that absorbs infrared rays with high sensitivity.
  • the ceramic semiconductor desirably has a crystal structure having a cubic spinel phase as the main phase.
  • the ceramic semiconductor since there is no anisotropy and no impurity layer, the electrical characteristics within the ceramic sintered body. Variation is small, and highly accurate measurement is possible when using a plurality of infrared temperature sensors.
  • the environment resistance is high.
  • a single-phase crystal structure composed of a cubic spinel phase is most desirable.
  • the infrared detecting thermal element 4 and the temperature compensating thermal element 5 are selected from thermistor elements and thin film thermistors obtained from the same wafer formed of ceramics semiconductors by resistance values within a predetermined tolerance. It is preferable that
  • the relative error of the B constant is small between the pair of infrared detecting thermal element 4 and temperature compensating thermal element 5, and at the same time, the temperature difference between the two detecting the temperature can be detected with high accuracy.
  • the B constant selection operation and the resistance value adjusting step are not required, and the productivity can be improved.
  • the thermistor elements used in the infrared detecting thermal element 4 and the temperature compensating thermal element 5 may be any of a bulk thermistor, a laminated thermistor, a thick film thermistor, and a thin film thermistor, for example.
  • the infrared detection thermal element 4 is disposed at a position corresponding to the light guide 21, and the temperature compensation thermal element 5. Is disposed at a position corresponding to the shielding portion 22.
  • the central wall 24a and the peripheral wall 24b as the partition walls 24 in the main body 2 are arranged in contact with each other so as to be thermally coupled to the surface of the substrate 3. That is, the central wall 24 a and the peripheral wall 24 b as the partition walls 24 in the main body 2 excluding the openings on the back side of the light guide part 21 and the shielding part 22 are arranged in contact with the surface of the substrate 3. Specifically, the central wall 24 a faces and contacts the boundary portion between the infrared detecting thermal element 4 and the temperature compensating thermal element 5 on the surface of the substrate 3, and the peripheral wall 24 b is the surface of the substrate 3. The infrared detecting thermal element 4 and the temperature compensating thermal element 5 are in contact with each other so as to face each other. Further, the mounting terminals 32 formed on the end side on the substrate 3 are disposed on the back side end of the peripheral wall of the main body 2.
  • the contact of the partition wall 24 on the surface of the substrate 3 may be such that the partition wall 24 continuously contacts the surface of the substrate 3 across the central wall 24a and the peripheral wall 24b. You may make it contact, for example, intermittently.
  • the central wall 24a and the peripheral wall 24b on one side (longitudinal direction) of the light guide part 21 and the shielding part 22 are brought into contact with the surface of the substrate 3, and the light guide part 21 and A configuration can be adopted in which the peripheral wall 24b on the other side (short direction) of the shielding portion 22 is not in contact.
  • this non-contact portion is suitably used for forming the ventilation portion 9 described later. It becomes possible.
  • the opening 21a does not protrude from the surface, and at least the light guide 21 is blackened.
  • the material of the main body is made of aluminum, aluminum alloy, zinc alloy or the like having a thermal conductivity of 96 W / m ⁇ K or more. . This is because if there is a protrusion, a temperature difference occurs in the main body, so that a material with poor heat conduction cannot be used.
  • the infrared temperature sensor is installed at a very short distance of about 5 mm with respect to the heat roller of the heat source.
  • the infrared temperature sensor having a structure in which the opening protrudes has a problem that the infrared temperature sensor cannot function correctly unless it is an expensive material with good heat conduction.
  • the opening 21a does not protrude from the surface and does not have a protrusion, so that the main body 2 can be used even when the thermal conductivity is 10 W / m ⁇ K or more. It is possible to use materials such as iron, stainless steel, and resin having good thermal conductivity containing filler.
  • the wiring pattern 31dt to which the infrared detecting thermal element 4 is connected and the wiring pattern 31cp to which the temperature compensating thermal element 5 is connected are arranged substantially in parallel.
  • the light guide portion 21 and the shielding portion 22 are arranged in parallel corresponding to the wiring patterns 31dt and 31cp.
  • the infrared temperature sensor 1 is mounted on a mounting board as the circuit board 10.
  • a predetermined wiring pattern is formed on the surface side of the mounting substrate, and the connection terminal 11 to which the mounting terminal 32 of the infrared temperature sensor 1 is connected is formed. Therefore, the mounting terminal 32 of the infrared temperature sensor 1 is electrically connected to the connection terminal 11 of the mounting substrate by soldering or the like.
  • this connection means is not limited to a particular one. For example, a conductive adhesive or the like may be used, and any means may be used as long as electrical connection is possible.
  • an infrared reflecting portion 12 is provided on the surface side of the mounting substrate and facing the substrate 3.
  • the infrared reflecting portion 12 is formed, for example, as a reflecting surface by mirroring a metal plate, and has a high reflectance of 80% or more, preferably 85% or more. Therefore, the reflection part 12 has a low emissivity, can suppress the thermal influence on the thermal element 4 for infrared detection and the thermal element 5 for temperature compensation, and can improve the sensitivity. In this case, a predetermined effect can be exhibited if at least a part of the surface facing the substrate is an infrared reflecting surface.
  • the infrared rays that have reached the substrate 3 are absorbed by the substrate 3 and converted into thermal energy.
  • the converted thermal energy is transmitted to the infrared detecting thermal element 4 directly below the substrate 3 to increase the temperature of the infrared detecting thermal element 4.
  • the infrared detection thermal element 4 and the temperature compensation thermal element 5 are ceramic semiconductors having at least substantially equal temperature characteristics, and the resistance value of the infrared detection thermal element 4 changes due to infrared rays from the detection target.
  • infrared rays are shielded by the shielding wall 22a of the shielding part 22, but the temperature of the main body 2 rises due to the radiant heat from the object to be detected and the ambient atmosphere temperature.
  • the resistance value changes corresponding to the rise.
  • the main body 2 is formed of a material having thermal conductivity such as metal, the temperature change of the infrared temperature sensor 1 can be made uniform as a whole following the temperature change of the surroundings.
  • the light guide 21 and the shielding part 22 are substantially symmetrical with the boundary between the light guiding part 23 and the shielding part 22 as the central axis C, and are formed in substantially the same shape.
  • the wiring pattern 31dt to which the infrared detecting thermal element 4 is connected and the wiring pattern 31cp to which the temperature compensating thermal element 5 is connected are formed in the same pattern.
  • the central wall 24 a and the peripheral wall 24 b in the main body 2 are in contact with the surface of the substrate 3.
  • the infrared detecting thermal element 4 and the temperature compensating thermal element 5 change in the same way with respect to the surrounding temperature change, have good followability and can suppress the influence on thermal disturbance, It becomes possible to accurately detect a temperature change due to infrared rays from the object.
  • the wiring pattern 31dt and the wiring pattern 31cp respectively connect the infrared detecting thermal element 4 and the temperature compensating thermal element 5 individually. Therefore, the mutual thermal influence between the wiring pattern 31dt and the wiring pattern 31cp can be reduced, and the sensitivity can be improved.
  • the central wall 24a of the main body 2 is in contact with the boundary portion between the infrared detecting thermal element 4 and the temperature compensating thermal element 5 at least on the surface of the substrate 3, the heat of the substrate 3 is transferred to the central wall. Conducted to 24a. For this reason, the temperature gradient in the boundary portion can be suppressed, the heat of the substrate 3 on the infrared detecting thermal element 4 side is reduced from being conducted to the substrate 3 on the temperature compensating thermal element 5 side, and mutual interference is prevented. Can be reduced. Therefore, it is possible to obtain a high temperature difference between the infrared detecting thermal element 4 and the temperature compensating thermal element 5, and an improvement in sensitivity can be realized.
  • the infrared detecting thermal element 4 and the temperature compensating thermal element 5 are arranged close to each other. Can contribute to the overall size reduction.
  • a surface-mount type infrared temperature sensor that can effectively specify a measurement part of a detection target and can be downsized, and a circuit board on which the infrared temperature sensor is mounted. be able to.
  • FIG. 8A is a cross-sectional view corresponding to FIG. 5 in which a lid member is provided on the back side of the main body
  • FIG. 8B is a perspective view showing the lid member (Modification 1).
  • FIG. 9 is a cross-sectional view corresponding to FIG. 6 in which a ventilation portion for reducing deformation of the substrate is provided (Modification 2).
  • FIG. 10 is a plan view showing a wiring pattern (Modification 3).
  • the lid member 8 has a substantially rectangular parallelepiped box shape and is made of a metal material such as aluminum.
  • the lid member 8 is disposed on the back side so as to face the substrate 3.
  • At least a part of the inner surface of the lid member 8 facing the substrate 3 is a reflective surface, and is, for example, mirror-finished to have a high reflectance, which is 80% or more, preferably 85% or more. Yes.
  • the lid member 8 is fitted and attached to the accommodation space 23. For this reason, the lid member 8 also has a function of fixing the substrate 3 to the accommodation space 23.
  • the inner surface of the lid member 8 is a reflective surface, the emissivity is low, the thermal influence on the infrared detecting thermal element 4 and the temperature compensating thermal element 5 can be suppressed, and the sensitivity is improved. Can be achieved.
  • the light guide portion 21 side and the shielding portion 22 side are formed in substantially the same shape, but the lid member 8 is also formed to have substantially the same shape with respect to the central axis C. ing.
  • the space 22 b in the shield 2 is a hermetically sealed space with the back side opening being closed by the substrate 3.
  • the ventilation part 9 which permits the air permeability of the space part 22b and the exterior is provided.
  • the ventilation portion 9 is a through hole and is not particularly limited, but is preferably formed to have a diameter of about 0.1 mm to 0.5 mm. Further, for example, when a ventilation gap is formed between the substrate 3 and the main body 2 as the ventilation portion, this gap may be a gap through which air passes, and if there is a gap of 1 ⁇ m or more, the air is sufficiently circulated. be able to. The important thing is not to have a sealed structure.
  • the same effect can be obtained even if a hole of about ⁇ 0.1 mm to ⁇ 0.5 mm is formed in the portion of the substrate 3 corresponding to the space 22b. Further, it is preferable to form a through hole 9 ′ similar to the ventilation part 9 on the light guide part 21 side, and to form the light guide part 21 side and the shielding part 22 side in substantially the same shape which is substantially symmetrical.
  • the infrared temperature sensor when the ambient temperature of the infrared temperature sensor becomes high, the air in the sealed space portion expands, the internal pressure rises, and the substrate swells and deforms. Further, when the air in the space portion is excessively expanded, there may be a problem that the wiring pattern wired on the substrate is cut due to deformation of the substrate. Furthermore, the deformation of the substrate causes a change in the amount of incident infrared rays and the amount of heat released from the substrate, causing a problem that the output of the infrared temperature sensor varies.
  • the ventilation portion 9 ensures air permeability from the outside, suppresses the increase in internal pressure, and reduces deformation of the substrate 3. Is possible. Therefore, it is possible to provide the infrared temperature sensor 1 that can reduce deformation of the substrate 3, enable high accuracy, and ensure reliability.
  • gas_flowing part 9 may be not only a through-hole but a groove shape. The ventilation part 9 should just be formed so that a sealed space part and the exterior may communicate, and a formation position, a shape, a number, etc. are not specifically limited.
  • a wiring pattern 31dt and a wiring pattern 31cp are individually connected to the infrared detecting thermal element 4 and the temperature compensating thermal element 5, respectively.
  • the wiring pattern 31 has a rectangular electrode terminal 31a at one end, and a meandering shape is formed around the electrode terminal 31a so that a narrow pattern surrounds the infrared detecting thermal element 4 (temperature compensating thermal element 5). Further, a narrow pattern is formed so as to extend in a meander shape toward the rectangular mounting terminal 32.
  • the substrate 3 is attached by being thermally welded to the inner wall of the accommodation space 23 on the main body 2 side.
  • the substrate 3 is disposed on the main body 2 by pressing. May be.
  • the main body 2 can be pressed against the substrate 3 so as to be plastically deformed and bonded to the substrate 3 side.
  • an adhesive layer or an adhesive layer for example, an adhesive sheet or an adhesive sheet is provided on the inner wall of the accommodation space 23 and the substrate 3 is attached with the sheet interposed therebetween.
  • a flexible wiring board is used as the board 3
  • a rigid wiring board may be used.
  • the wiring board is not limited to a specific type.
  • the mounting substrate as the circuit substrate 10 may be a metal substrate such as aluminum or copper having an insulating layer on the surface.
  • the mounting substrate since the mounting substrate has high thermal conductivity, the infrared detecting thermal element 4 and the temperature compensating thermal element 5 have better followability with respect to ambient temperature changes and suppress the influence on thermal disturbance. be able to.
  • At least a part of the surface of the range may be formed as an infrared reflecting surface having a high reflectance, for example, a mirror surface portion.
  • the lid member 8 can be omitted, and the mirror surface portion can perform the same function as the reflecting surface of the lid member 8, and the sensitivity can be improved.
  • FIGS. 11 is an exploded perspective view of the infrared temperature sensor
  • FIG. 12 is an exploded perspective view of the infrared temperature sensor as viewed from the back side
  • FIG. 13 is a plan view of the infrared temperature sensor.
  • FIG. 14 shows an infrared temperature sensor, which is a cross-sectional view corresponding to FIG. 6, and
  • FIG. 15 is a cross-sectional view of the main body taken along line XX in FIG.
  • FIG. 16 is a plan view showing the adhesive sheet.
  • symbol is attached
  • the main body 2 is formed in a substantially rectangular parallelepiped shape by a metal material having thermal conductivity. And the whole main body 2 is oxidized and blackened by heat processing, and has the light guide part 21 and the shielding part 22, but the accommodation space part is not formed. Therefore, the other surface side (rear surface side) of the main body 2 is a planar planar portion in which the light guide portion 21 and the shielding portion 22 are opened.
  • the substrate 3 is a flat rigid wiring board formed in a rectangular shape with a thickness dimension of 0.05 mm to 0.2 mm.
  • the substrate 3 has substantially the same outer shape as that of the other surface side (back side) of the main body 2, and is disposed along a planar portion on the back side of the main body 2.
  • the substrate 3 is attached to the back side of the main body 2 by means such as heat welding, brazing, adhesion, or adhesion.
  • the substrate 3 is disposed on the back side of the main body 2 by attaching the adhesive sheet 34 to the back side of the main body 2 and attaching the substrate 3 to the adhesive sheet 34. Is called. That is, the substrate 3 is attached with the adhesive sheet 34 interposed between the back side of the main body 2 and the substrate 3.
  • the adhesive sheet 34 has substantially the same outer shape as the back side of the main body 2, and the center part corresponds to the back side opening of the light guide part 21 and the shielding part 22. It is cut out. Note that an adhesive sheet may be used instead of the adhesive sheet.
  • the substrate 3 is provided with an infrared detecting thermal element 4 and a temperature compensating thermal element 5 on one surface of an insulating base material. Similarly, on one surface, a conductor wiring pattern 31 and a mounting terminal 32 which is electrically connected to the wiring pattern 31 and located on the end side are formed.
  • the main body 2 is not formed with an accommodating space.
  • the back side of the main body 2 has a planar shape, and the light guide portion 21 and the shielding portion 22 are opened in the planar portion (see FIG. 12). Accordingly, the flat substrate 3 is disposed on the planar portion on the back side of the main body 2.
  • the substrate 3 is a flat rigid wiring substrate.
  • an insulating base material made of glass epoxy resin, polyphenylene ether (PPE resin), silicone resin material, etc., and a conductor formed on the surface of the insulating base material Wiring pattern 31.
  • a resist layer 33 that is an insulating layer is stacked on the wiring pattern 31. Further, the resist layer 33 is not laminated at both ends of the wiring pattern 31, that is, exposed electrode terminals 31 a and mounting terminals 32 that are not covered with the resist layer 33 are formed. In the electrode terminal 31a, only a part to which the terminal electrode of the infrared detecting thermal element 4 or the temperature compensating thermal element 5 is connected is an exposed part not covered with the resist layer 33.
  • the wiring pattern 31 has a substantially rectangular electrode terminal 31a on one end side, a narrow pattern extends linearly from the electrode terminal 31a, and a rectangular mounting terminal 32 is provided at the terminal end on the other end side. Formed and configured.
  • a pair of wiring patterns 31 of the same pattern are arranged so that the electrode terminals 31a face each other, and the infrared detecting thermal element 4 or the temperature compensating thermal element 5 is arranged and connected.
  • two pairs of wiring patterns 31 are arranged substantially in parallel.
  • the wiring pattern 31dt to which the infrared detection thermal element 4 is connected and the wiring pattern 31cp to which the temperature compensation thermal element 5 is connected are in the same pattern, and are not connected to each other.
  • the element 4 and the temperature compensating thermal element 5 are individually connected.
  • the wiring pattern 31 is shown clearly in a state where it can be seen through the insulating base material in FIG. 11 and through the resist layer 33 in FIG.
  • the infrared temperature sensor 1 is mounted on a mounting board as the circuit board 10.
  • This mounting substrate is a metal substrate, and is formed, for example, by laminating an insulating base material 14 made of a glass epoxy resin, a glass composite material or the like on a metal base material 13 made of an aluminum material.
  • a hole is formed in a portion of the insulating base material 14 facing the substrate 3, and a cavity 15 is formed between the hole and the metal base material 13 by the hole.
  • the surface of the metal base 13 facing the substrate 3 is formed as a reflective surface 16.
  • the reflecting surface 16 has a high reflectance, and has a reflectance of 80% or more, preferably 85% or more.
  • a copper inlay substrate having a cavity structure is used, although not shown. Note that this does not prevent the above-described lid member 8 from being disposed in the cavity 15.
  • the space portion 22b in the shielding portion 2 is a hermetically sealed space portion with the opening on the back side closed by the substrate 3.
  • the ventilation part 9 which allows the air permeability between the space part 22b and the outside.
  • a gap is formed as a ventilation portion 9 between the central wall 24 a of the partition wall 24 at the boundary portion between the light guide portion 21 and the shielding portion 22 and the substrate 3. If this gap is 1 ⁇ m or more, sufficient air can be circulated.
  • the infrared temperature sensor 1 may be mounted on a shielded substrate 3.
  • the infrared detecting thermal element 4 and the temperature compensating thermal element 5 are arranged on the front side of the substrate 3, and the infrared detecting thermal element 4 is the light guide 21.
  • the temperature compensating thermal element 5 is disposed at a position corresponding to the shielding portion 22.
  • the substrate 3 is a flat rigid wiring substrate, and is electrically connected to the insulating base material, the conductor wiring pattern 31 formed on the surface of the insulating base material, and the end portion of the wiring pattern 31. And a mounting terminal 32 located on the side. Further, a resist layer 33 such as a resist ink which is an insulating layer is laminated on the wiring pattern 31. The mounting terminal 32 is an exposed portion that is not covered with the resist layer 33.
  • a shield ring 17 is provided on the back side of the substrate 3, and the outer periphery of the shield ring 17 including the substrate 3 is plated to form a plated portion 18.
  • the infrared detecting thermal element 4 and the temperature compensating thermal element 5 are shielded.
  • the plating portion 18 is connected to the mounting terminal 32 and led out to the back side of the shield ring 17 so that the mounting terminal 32 can be electrically connected to a connection terminal of a circuit board (not shown).
  • the shield property can be further improved by electrically connecting the shield ring 17 and the conductive main body 2. According to such a configuration, it is possible to provide the infrared temperature sensor 1 that can suppress the influence of noise and can perform a function strong against noise.
  • the same operation as that of the first embodiment can be realized, and a surface-mount type infrared ray capable of effectively specifying the measurement part of the detection target and being miniaturized.
  • the temperature sensor 1 and the circuit board 10 on which the infrared temperature sensor 1 is mounted can be provided.
  • the structure of the main body 2 is simplified and the infrared temperature sensor 1 is mounted on the circuit board 10, there is an effect that the protruding height dimension of the infrared sensor 1 can be reduced.
  • the substrate 3 is described as using a rigid wiring substrate, but a flexible wiring substrate may be used.
  • the wiring board is not limited to a specific type.
  • the infrared temperature sensor 1 in each of the embodiments described above can be provided and applied to various devices for detecting the temperature of a fixing device of a copying machine, a battery unit, a capacitor, an IH cooking heater, an article in a refrigerator.
  • the specially applied device is not limited.
  • a chip thermistor formed of a ceramic semiconductor is preferably used as the infrared detection thermal element and the temperature compensation thermal element, but not limited thereto, a thermocouple, a resistance temperature detector, or the like can be used.
  • the pattern form of the wiring pattern is not particularly limited, and can be appropriately adopted according to the design, such as a straight line shape or a meander shape.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Radiation Pyrometers (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
PCT/JP2016/051663 2015-03-25 2016-01-21 赤外線温度センサ、回路基板及び赤外線温度センサを用いた装置 WO2016152220A1 (ja)

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KR1020177026408A KR102610063B1 (ko) 2015-03-25 2016-01-21 적외선 온도 센서, 회로 기판 및 상기 센서를 이용한 장치
CN201680016650.2A CN107407602B (zh) 2015-03-25 2016-01-21 红外线温度传感器、电路基板以及使用所述传感器的装置

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CN109073468A (zh) * 2016-12-20 2018-12-21 株式会社芝浦电子 红外线温度传感器
CN109416283A (zh) * 2017-06-06 2019-03-01 株式会社芝浦电子 红外线温度传感器及其制造方法
WO2019053759A1 (ja) * 2017-09-12 2019-03-21 株式会社芝浦電子 赤外線温度センサ
TWI841861B (zh) * 2021-07-29 2024-05-11 原相科技股份有限公司 高穩定度溫度計結構及使用該溫度計結構的系統

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CN113447132A (zh) * 2020-03-27 2021-09-28 维沃移动通信有限公司 电子设备
CN115767881B (zh) * 2022-12-29 2024-02-13 安徽光智科技有限公司 红外焦平面成像系统的emc整改方法、红外焦平面成像系统

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CN107407602B (zh) 2020-10-23
CN107407602A (zh) 2017-11-28

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