WO2016152268A1

WO2016152268A1 - Light emitting device

Info

Publication number: WO2016152268A1
Application number: PCT/JP2016/053313
Authority: WO
Inventors: 鈴木　薫; 昌希村形; 俊彦青木
Original assignee: パイオニア株式会社
Priority date: 2015-03-26
Filing date: 2016-02-04
Publication date: 2016-09-29
Also published as: JP2016184538A

Abstract

A planar light emitting member (100) has a light emitting unit (110). A substrate (200) overlaps the planar light emitting member (100) surface on the reverse side of the light irradiation surface. Furthermore, the substrate (200) has a first conductor pattern (230) and terminals (210, 212). The first conductor pattern (230) is provided for the purpose of dissipating heat to the outside, said heat having been generated by the light emitting unit (110), and overlaps 50 % or more of the light emitting unit (110). The terminals (210, 212) are electrically connected to the light emitting unit (110). The first conductor pattern (230) and the terminals (210, 212) are separated from each other by a fixed distance or more.

Description

Light emitting device

The present invention relates to a light emitting device.

In recent years, development of a light emitting device having an organic EL (Organic Electroluminescence) element as a light emitting element is in progress. The organic EL element has a configuration in which an organic layer is sandwiched between a first electrode and a second electrode. In the case where an organic EL element is used as a light-emitting element of a light-emitting device, the light-emitting element can be a surface light source, and thus the light-emitting device can have a panel shape.

On the other hand, the light emitting device is generally used in a state of being accommodated in a case or the like. For example, Patent Document 1 describes that an organic EL element is sandwiched between a pair of resin substrates and the side surfaces of these resin substrates are fixed with an adhesive tape. Patent Document 2 describes that a wiring board is disposed on the non-light emitting surface side of a light emitting panel, and the light emitting panel is mounted on a housing that houses a circuit board.

JP 2013-219184 A JP 2012-186006 A

When the light emitting element is driven, heat is generated from the light emitting element. For this reason, in order to dissipate the heat from the light emitting element, it is necessary to attach a heat radiating member to the light emitting element. However, if a member for heat dissipation (for example, a metal heat sink) is provided, the panel-like light emitting device becomes thick. Further, since the heat radiating member is generally formed of a conductive material, it is necessary to prevent the heat radiating member from being short-circuited to the wiring connected to the light emitting element.

As a problem to be solved by the present invention, in a light emitting device having a surface light emitting member, it is easy to dissipate heat from the light emitting portion, the light emitting device is prevented from becoming thick, and the heat radiating member is a light emitting element. One example is to prevent short-circuiting to the wiring connected to.

The invention according to claim 1 is a surface light emitting member having a light emitting portion;
A substrate overlapping the surface opposite to the light emitting surface of the surface emitting member;
With
The substrate is
A first conductor pattern provided in a region overlapping the light emitting unit;
A first terminal or a first wiring provided on the same surface as the first conductor pattern and electrically connected to the light emitting unit;
Have
The first conductor pattern overlaps 50% or more of the light emitting part,
In the light emitting device, the first conductor pattern and the first terminal or the first wiring are separated by a certain distance or more.

The above-described object and other objects, features, and advantages will be further clarified by a preferred embodiment described below and the following drawings attached thereto.

It is a perspective view of the light-emitting device concerning an embodiment. It is a disassembled perspective view of a light-emitting device. It is a top view of a surface emitting member. It is a top view of a board | substrate. FIG. 5 is a cross-sectional view taken along the line AA in FIG. 4. It is sectional drawing which shows the modification of FIG. It is a top view of a frame member. It is an enlarged view of a groove part. It is a figure which shows an example of the usage method of a light-emitting device. It is a top view of the frame member concerning a modification. FIG. 11 is a sectional view taken along line BB in FIG. 10. It is a figure which shows an example of the usage method of the light-emitting device which concerns on a modification. It is a perspective view of the light-emitting device which concerns on an Example. It is a disassembled perspective view of a light-emitting device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

FIG. 1 is a perspective view of a light emitting device 10 according to an embodiment. FIG. 2 is an exploded perspective view of the light emitting device 10. The light emitting device 10 includes a surface light emitting member 100 and a substrate 200. The surface light emitting member 100 has a light emitting unit 110. The substrate 200 overlaps the surface of the surface light emitting member 100 opposite to the light emitting surface. The substrate 200 includes a first conductor pattern 230 and terminals 210 and 212 (first terminals). The first conductor pattern 230 is provided to dissipate heat generated by the light emitting unit 110 to the outside, and overlaps 50% or more of the light emitting unit 110. The

terminals

210 and 212 are electrically connected to the light emitting unit 110. The first conductor pattern 230 and the

terminals

210 and 212 are separated by a certain distance or more. Here, the fixed distance is, for example, 6 mm or more.

The light emitting device 10 further includes

external terminals

220 and 222 and a frame member 300. The

external terminals

220 and 222 are provided on the substrate 200 and are electrically connected to the light emitting unit 110 of the surface light emitting member 100. A wiring (wiring 500 described later) is connected to the

external terminals

220 and 222. The frame member 300 overlaps the surface of the surface light emitting member 100 opposite to the light emitting surface. In the example shown in the drawing, the frame member 300 overlaps the surface light emitting member 100 with the substrate 200 interposed therebetween. The frame member 300 is provided with a groove 330. The groove part 330 is provided in order to pull out the wiring 500 to the outside of the frame member 300. The frame member 300 is provided with a restriction portion (

restriction portions

334, 336, and 338 described later). This restriction unit is provided to restrict the movement of the wiring 500. The surface light emitting member 100 and the substrate 200 can also be regarded as one surface light emitting member. In this case, the frame member 300 is attached to the surface light emitting member.

Hereinafter, the light emitting device 10 will be described in detail.

The light emitting device 10 has a configuration in which a substrate 200 and a frame member 300 are stacked in this order on the non-light emitting surface side of the surface light emitting member 100. The substrate 200 is fixed to the surface light emitting member 100 using a double-sided tape 410, and the frame member 300 is fixed to the substrate 200 using a double-sided tape 420. Note that an adhesive may be used instead of the double-

sided tapes

410 and 420.

FIG. 3 is a plan view of the surface light emitting member 100. As shown in FIG. 1, FIG. 1, and FIG. 2, the surface light emitting member 100 is formed using a substrate 130, and includes a light emitting unit 110 and

conductive members

120 and 122.

In the case of the bottom emission type, the substrate 130 is formed of a material that transmits visible light, such as glass or a light-transmitting resin. However, when the light emitting device 10 is a top emission type, the substrate 130 may be formed of a material that does not have translucency. The substrate 130 has a polygonal shape such as a rectangle. The substrate 130 may have flexibility. When the substrate 130 is flexible, the thickness of the substrate 130 is, for example, 10 μm or more and 1000 μm or less. In particular, when the substrate 130 is glass, the thickness of the substrate 130 is, for example, 200 μm or less. When the substrate 130 is a resin, the substrate 130 is formed using, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. When the substrate 130 is a resin, an inorganic barrier film such as SiN _x or SiON is formed on at least one surface (preferably both surfaces) of the substrate 130 in order to suppress moisture from permeating through the substrate 130. . The substrate 130 is a polygon, for example, a rectangle.

The light emitting unit 110 has an organic EL element. The organic EL element is formed on almost the entire surface of the substrate 130 except for the edge, and has a configuration in which a first electrode, an organic layer, and a second electrode are stacked in this order.

The first electrode is a transparent electrode that transmits visible light. The transparent conductive material constituting the transparent electrode is a metal-containing material, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), ZnO (Zinc Oxide), and the like. is there. The thickness of the first electrode is, for example, not less than 10 nm and not more than 500 nm. The first electrode is formed using, for example, a sputtering method or a vapor deposition method. The first electrode may be a carbon nanotube or a conductive organic material such as PEDOT / PSS.

The organic layer has a light emitting layer. The organic layer has a structure in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer may be formed by a vapor deposition method. In addition, at least one of the organic layers, for example, a layer in contact with the first electrode may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer are formed by vapor deposition. Further, all layers of the organic layer may be formed using a coating method.

The second electrode is made of, for example, a metal selected from the first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of a metal selected from the first group. Contains a metal layer. In this case, the second electrode does not transmit visible light. The thickness of the second electrode is, for example, not less than 10 nm and not more than 500 nm. However, the second electrode may be formed using the material exemplified as the material of the first electrode. The second electrode is formed using, for example, a sputtering method or a vapor deposition method.

However, the second electrode may be formed using a transparent conductive material. This transparent conductive material is selected from the materials exemplified as the material of the first electrode, for example. In this case, the second electrode transmits visible light.

Also, the substrate 130 is formed with a first terminal and a second terminal. The first terminal is electrically connected to the first electrode, and the second terminal is electrically connected to the second electrode. One end of a conductive member 120 (for example, a lead member) is attached to the first terminal, and one end of a conductive member 122 (for example, a lead member) is attached to the second terminal. The other end 120 a of the conductive member 120 is connected to the terminal 210 of the substrate 200, and the other end 122 a of the conductive member 122 is connected to the terminal 212 of the substrate 200. The other ends 120 a and 122 a are both floating from the substrate 130.

In the example shown in the figure, the substrate 130 is rectangular. The first terminal and the conductive member 120 are disposed along two opposite sides of the substrate 130, and the second terminal and the conductive member 122 are disposed along the remaining two sides of the substrate 130. Yes.

FIG. 4 is a plan view of the substrate 200. FIG. 5 is a cross-sectional view taken along the line AA in FIG. As shown in FIGS. 1, 2, 4, and 5, the substrate 200 is, for example, a printed circuit board, and includes

terminals

210 and 212,

external terminals

220 and 222, and wiring 238. ing. The other end 120a of the conductive member 120 shown in FIG. 3 is connected to the terminal 210, and the other end 122a of the conductive member 122 shown in FIG. The terminal 210 is electrically connected to the external terminal 220 via a wiring (not shown) in the substrate 200, and the terminal 212 is externally connected via another wiring (not shown) in the substrate 200. The terminal 222 is electrically connected. The

terminals

210 and 212 and the

external terminals

220 and 222 are provided on the surface of the substrate 200 opposite to the surface light emitting member 100.

The substrate 200 is, for example, a polygon similar to the substrate 130, for example, a rectangle. The terminal 210 is provided on the side of the substrate 200 that overlaps the conductive member 120, and the terminal 212 is provided on the side of the substrate 200 that overlaps the conductive member 122. An opening 202 is provided on the side of the substrate 200 where the terminal 210 is provided, and an opening 204 is provided on the side of the substrate 200 where the terminal 212 is provided. The

openings

202 and 204 are provided to draw out the

conductive members

120 and 122 to the surface side of the substrate 200 where the

terminals

210 and 212 are provided. In the example shown in the figure, the

openings

202 and 204 are notched because they are connected to the edge of the substrate 200.

The first conductor pattern 230 is provided on the surface of the substrate 200 opposite to the surface light emitting member 100, and the second conductor pattern 232 is provided on the surface facing the surface light emitting member 100. . Since both the first conductor pattern 230 and the second conductor pattern 232 are formed in the same process as the wiring and terminals of the substrate 200, they are formed of the same material (for example, metal such as copper) as these wirings and terminals. Yes. Since both the first conductor pattern 230 and the second conductor pattern 232 overlap with at least 50% or more (preferably 80% or more, more preferably 100%) of the light emitting unit 110 of the surface light emitting member 100, the light emitting unit 110 is overlapped. Has the function of radiating the heat generated by the outside. Further, at least a part of the second conductor pattern 232 overlaps the first conductor pattern 230.

The first conductor pattern 230 and the second conductor pattern 232 are thermally coupled. In the example shown in this figure, the substrate 200 has a through hole 235 and a connection member 234. The through hole 235 is provided in a portion where the first conductor pattern 230 and the second conductor pattern 232 overlap each other. The connection member 234 is located in the through hole 235 and connects the first conductor pattern 230 and the second conductor pattern 232. For this reason, the first conductor pattern 230 and the second conductor pattern 232 are thermally coupled via the connection member 234.

When the first conductor pattern 230 and the second conductor pattern 232 are formed using a plating method, the connection member 234 is also formed simultaneously with at least one of the first conductor pattern 230 and the second conductor pattern 232.

The first conductor pattern 230 is one that is electrically connected to the light emitting unit 110 and formed on the same surface as the first conductor pattern 230 (the first wiring or the first wiring). 1 terminal), for example, the

terminals

210 and 212, the

external terminals

220 and 222, and the wiring 238. This distance L is, for example, 6 mm or more. In addition, the second conductor pattern 232 is also a wiring or terminal of the substrate 200 that is electrically connected to the light emitting unit 110 and formed on the same surface as the second conductor pattern 232 (second terminal or second terminal). 2 wires) away from a certain distance L.

In the example shown in FIG. 5, the connection member 234 fills the entire through hole 235. However, as shown in FIG. 6, the connection member 234 may be formed only on the side surface of the through hole 235.

FIG. 7 is a plan view of the frame member 300. As shown in FIGS. 1, 2, and 7, the frame member 300 is, for example, a polygon similar to the substrate 200, for example, a rectangle. The frame member 300 is slightly larger than the surface light emitting member 100 and the substrate 200. The frame member 300 is provided to mechanically support the surface light emitting member 100. Specifically, the frame member 300 includes a plate-like base member 310 and a convex portion 320. The base member 310 and the convex part 320 may be integrally formed, or may be formed separately.

The base member 310 is a polygon similar to the substrate 200, for example, a rectangle. The base member 310 has an opening 312 in a region overlapping the first conductor pattern 230 of the substrate 200. The opening 312 is provided to expose the first conductor pattern 230. By providing the opening 312, the heat dissipation efficiency from the first conductor pattern 230 is increased.

In addition, the base member 310 has an opening 314 in a region overlapping with the

external terminals

220 and 222 of the substrate 200. By providing the opening 314, a wiring 500 to be described later can be connected to the

external terminals

220 and 222.

The convex portion 320 is provided on the surface of the base member 310 opposite to the substrate 200 along the edge of the base member 310. However, in the example shown in this drawing, the convex portion 320 is not provided in a portion overlapping the opening 314. When a groove 330 described later is provided on the protrusion 320, the groove 330 is physically connected to the external terminal 220 (or the external terminal 222) through the opening 314 when the protrusion 320 is an external installation surface. The terminal portion soldered to the external terminal 220 (or the external terminal 222) through the opening 314, and the escape of the wiring 500 to be described later. It also contributes to increasing the strength of the frame member 300.

Further, the convex portion 320 is provided with a groove portion 330. The groove part 330 is provided in order to pull out a wiring 500 described later to the outside of the light emitting device 10. In the example shown in this figure, the frame member 300 is rectangular, and the opening 314 is provided near a side where the frame member 300 is located. The groove 330 is provided at the center of each of the remaining sides (three sides) where the opening 314 is not provided in the frame member 300. In addition, the depth of the groove part 330 may be smaller than the height of the convex part 320, and may be the same as the height of the convex part 320. In the former case, the bottom of the groove 330 is higher than the upper surface of the base member 310. In the latter case, the bottom surface of the groove 330 is flush with the top surface of the base member 310.

8 is an enlarged view of the groove portion 330. FIG. As described above, the wiring 500 described later is passed through the groove 330. Further, a restricting portion 334 (or restricting portions 336 and 338) is provided on the side surface 332 of the groove portion 330 or the inner side surface of the convex portion 320. The restricting unit 334 (or restricting units 336 and 338) restricts the movement of the wiring 500, thereby suppressing the movement of the wiring 500 and applying a force to the connection portion between the wiring 500 and the external terminal 220 (or the external terminal 222). Is provided to do.

In the example shown in FIGS. 8A to 8D, the restricting portion 334 is a convex portion provided on the side surface 332. The limiting portion 334 is provided on each of the three side surfaces 332 of the groove portion 330. In the example shown in FIG. 8A, the two limiting portions 334 are both provided in the center portion in the width direction of the side surface 332. In the example shown in FIGS. 8B and 8C, one restricting portion 334 is located on the outer surface side (right side in the drawing) of the convex portion 320 with respect to the center of the side surface 332, and the other restricting portion 334. Is located closer to the inner side surface (left side in the figure) of the convex portion 320 than the center of the side surface 332. In particular, in the example shown in FIG. 8C, all of the limiting portions 334 are located at the end of the side surface 332 in the width direction. Further, in the example shown in FIG. 8D, the two limiting portions 334 are both positioned at the outer surface side (right side in the drawing) of the convex portion 320 of the side surface 332. Note that the limiting portion 334 shown in FIGS. 8A to 8D is hemispherical, but the shape of the limiting portion 334 is not limited to this.

In the example shown in FIG. 8E, the groove 330 extends obliquely with respect to one side of the frame member 300. In other words, the groove part 330 extends obliquely with respect to the convex part 320. The limiting portion 336 is a portion that forms an acute angle between the side surface 332 of the groove portion 330 and the side surface of the convex portion 320.

Further, in the example shown in FIG. 8F, the frame member 300 has two groove portions 330 adjacent to each other. The limiting portion 338 is a portion located between the two groove portions 330 in the convex portion 320. In this example, the wiring 500 is wound around the limiting portion 338 while passing through these two groove portions 330. Each restricting portion is covered with a protective film made of resin, for example, to prevent the wires from being disconnected by the restricting portions 334 (or restricting portions 336 and 338) and as a role of anti-slip to increase the friction of the wires. Also good.

FIG. 9 is a diagram illustrating an example of how to use the light emitting device 10. Since the surface light emitting member 100 is panel-shaped, the light-emitting device 10 is also panel-shaped. The plurality of light emitting devices 10 are attached to a surface such as a wall without any gap. The plurality of light emitting devices 10 are electrically connected in series using the wiring 500.

Specifically, one end of the first wiring 500 is attached to the external terminal 220 of the first light emitting device 10, and the other end of the first wiring 500 is attached to the external terminal 222 of the other light emitting device 10. At this time, the wiring 500 passes through the groove 330 of the frame member 300. When passing through the groove portion 330, a portion of the wiring 500 that overlaps the groove portion 330 is in contact with the restriction portion 334 (or the restriction portions 336 and 338) of the groove portion 330. For this reason, after the end of the wiring 500 is attached to the

external terminals

220 and 222 of the light emitting device 10, the wiring 500 becomes difficult to move. Therefore, it becomes difficult to apply a load to the connection portion between the wiring 500 and the

external terminals

220 and 222 of the light emitting device 10.

As described above, according to the present embodiment, the light emitting device 10 has the substrate 200. The substrate 200 is provided with

external terminals

220 and 222 and a first conductor pattern 230. At least a part of the first conductor pattern 230 overlaps the light emitting unit 110 of the surface light emitting member 100. For this reason, the 1st conductor pattern 230 functions as a thermal radiation part of the light emission part 110, As a result, the heat | fever from the light emission part 110 becomes easy to thermally radiate. Further, since the substrate 200 is a substrate for providing the

external terminals

220 and 222, it is necessary to be incorporated in the light emitting device 10. On the other hand, even if the first conductor pattern 230 is provided on the substrate 200, the substrate 200 does not become thick. Therefore, it can suppress that the light-emitting device 10 becomes thick. Further, the first conductor pattern 230 is separated from the wiring and terminals in the substrate 200 by a certain distance. Therefore, it is possible to suppress the first conductor pattern 230 from being short-circuited with the wiring and terminals in the substrate 200.

Also, a second conductor pattern 232 is provided on the surface of the substrate 200 that faces the surface light emitting member 100. The second conductor pattern 232 is thermally coupled to the first conductor pattern 230 via the connection member 234. For this reason, the heat generated in the light emitting unit 110 is transmitted to the first conductor pattern 230 via the second conductor pattern 232 and the connection member 234 and is radiated to the outside from the first conductor pattern 230. Therefore, the heat from the light emitting unit 110 is further easily radiated to the outside. The second conductor pattern 232 is also separated from the wiring and terminals in the substrate 200 by a certain distance. Therefore, it is possible to suppress the second conductor pattern 232 from being short-circuited with the wiring and terminals in the substrate 200.

Also, the frame member 300 is provided with a groove 330. The groove part 330 is provided to draw the wiring 500 out of the light emitting device 10. The frame member 300 is provided with a restriction unit 334, a restriction unit 336, or a restriction unit 338 that restricts the movement of the wiring 500. Therefore, it becomes difficult to apply a load to the connection portion between the wiring 500 and the

external terminals

220 and 222 of the light emitting device 10.

(Modification)
FIG. 10 is a plan view of a frame member 300 used in the light emitting device 10 according to the modification. 11 is a cross-sectional view taken along the line BB in FIG. The light emitting device 10 according to this modification has the same configuration as that of the light emitting device 10 according to the embodiment, except that the frame member 300 has a recess 340.

The light emitting device 10 is provided on the edge of the frame member 300. Specifically, in the embodiment, the convex portion 320 is provided along the edge of the base member 310, but in the present modification, the convex portion 320 is located slightly inside the edge of the base member 310. A portion of the base member 310 positioned outside the convex portion 320 is a concave portion 340. The recess 340 is connected to the groove 330. The groove 330 and the recess 340 are open on the surface of the frame member 300 opposite to the substrate 200. For this reason, a person who attaches the light emitting device 10 to a wall or the like can route the wiring 500 via the recess 340. Accordingly, the work load when the wiring 500 is routed in the recess 340 is reduced. In addition, the recessed part 340 is provided in the whole each edge | side in which the groove part 330 is located among the frame members 300. FIG.

FIG. 12 is a diagram illustrating an example of a method of using the light emitting device 10, and corresponds to FIG. 9 in the embodiment. Also in the example shown in the figure, the plurality of light emitting devices 10 are attached to a surface such as a wall without any gap. And the recessed part 340 of the adjacent light-emitting device 10 is mutually connected, and the space for routing the wiring 500 is formed. For this reason, the work load when routing the wiring 500 is reduced. In addition, the wiring 500 can be connected to the light emitting device 10 and the light emitting device 10 remote from the light emitting device 10. In other words, the degree of freedom in routing the wiring 500 is improved.

As described above, according to the present modification, the heat from the light emitting unit 110 is easily radiated as in the embodiment. Moreover, it can suppress that the 1st conductor pattern 230 and the 2nd conductor pattern 232 short-circuit with the wiring and terminal in the board | substrate 200. FIG. In addition, since the recess 340 is provided in the frame member 300, the degree of freedom in routing the wiring 500 is improved.

(Example)
FIG. 13 is a perspective view of the light emitting device 10 according to the example. FIG. 14 is an exploded perspective view of the light emitting device 10 with the attachment member 600 and the double-sided tape 430 removed from the other portions of the light emitting device 10. In the present example, the surface light emitting member 100, the substrate 200, and the frame member 300 have the structure shown in the embodiment or its modification. The attachment member 600 is attached to the portion of the first conductor pattern 230 of the substrate 200 that is exposed from the opening 312 of the frame member 300 using the double-sided tape 430.

The attachment member 600 is a metal plate (for example, a stainless steel plate), and a part of the end portion is bent in a direction away from the surface light emitting member 100 to form an attachment portion 610. The end of the attachment portion 610 is further bent so as to be parallel to the attachment member 600. A through hole 612 for passing a screw, a bolt, or the like is provided in the parallel portion. In the example shown in the figure, the attachment member 600 is rectangular, and attachment portions 610 are provided at each of the four corners.

According to the present embodiment, since the light emitting device 10 has the mounting member 600, the light emitting device 10 can be easily attached to a wall or the like. Moreover, since the attachment member 600 is a metal, even if the attachment member 600 is provided, the heat dissipation capability of the first conductor pattern 230 is unlikely to decrease.

As mentioned above, although embodiment and the Example were described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

This application claims priority based on Japanese Patent Application No. 2015-065067 filed on March 26, 2015, the entire disclosure of which is incorporated herein.

Claims

A surface emitting member having a light emitting portion;
A substrate overlapping the surface opposite to the light emitting surface of the surface emitting member;
With
The substrate is
A first conductor pattern provided in a region overlapping the light emitting unit;
A first terminal or a first wiring provided on the same surface as the first conductor pattern and electrically connected to the light emitting unit;
Have
The first conductor pattern overlaps 50% or more of the light emitting part,
The light emitting device, wherein the first conductor pattern and the first terminal or the first wiring are separated by a certain distance or more.
The light-emitting device according to claim 1.
The said fixed distance is 6 mm or more of light-emitting devices.
The light-emitting device according to claim 2.
The first conductor pattern is formed on the surface of the substrate opposite to the surface light emitting member,
The substrate further has a second conductor pattern on a surface facing the surface light emitting member,
The light emitting device, wherein at least a part of the second conductor pattern overlaps the first conductor pattern.
The light emitting device according to claim 3.
The light emitting device in which the first conductor pattern and the second conductor pattern are thermally coupled.
The light emitting device according to claim 3.
A through hole provided in a region of the substrate overlapping the first conductor pattern and the second conductor pattern;
A connecting member provided in the through hole and connecting the first conductor pattern and the second conductor pattern;
A light emitting device comprising:
The light emitting device according to claim 3.
A second terminal or a second wiring provided on the same surface as the second conductor pattern and electrically connected to the light emitting unit;
The light emitting device, wherein the second terminal or the second wiring is separated from the second conductor pattern by the predetermined distance or more.