JP2011043724A - Electrooptical device, method of manufacturing the same, and electric apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an electrooptical device with a heat sink having a superior heat dissipation efficiency. <P>SOLUTION: The electrooptical device includes: an electrooptical panel 20 having a pair of substrate and a current drive type light-emitting device 17, which is sandwiched by the pair of substrate; a thin film 21 with through-holes 23, which exposes an opposite surface and is arranged on a surface opposite to a surface where the light-emitting device 17 emits light; an adhesive 26 which fills the through-holes 23; and the heat sink 22 bonded to the electrooptical panel 20 by the adhesive 26. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus.

  An organic EL device as an electro-optical device is a light-weight and thin display device, and its application to various electronic devices is progressing. One problem with such organic EL devices is heat generation during use. Since the organic EL device has a configuration in which organic EL elements as current drive elements are regularly arranged in the display region, the organic EL device itself is also heated during image formation, that is, when the organic EL element emits light. And this heat will degrade the organic EL layer etc. which comprise an organic EL element, and will reduce the reliability or lifetime of an organic EL apparatus. Therefore, in order to suppress the influence of such heat generation, a metal heat dissipating member is attached to the back surface of the organic EL device (the surface opposite to the light emission side of the organic EL element) to improve heat dissipation efficiency. A technique has been introduced (Patent Document 1).

JP 2002-343555 A

  However, in the above-described configuration, a plate-like heat sink having a smooth surface is pasted on the back surface of the organic EL panel. Therefore, it is necessary to form an adhesive layer entirely between the back surface and the heat dissipating member, which causes a problem of reducing heat dissipation efficiency.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electro-optical panel having a pair of substrates and a current-driven light-emitting element sandwiched between the pair of substrates, and a side of the electro-optical panel opposite to the side from which light is emitted. A thin film having a penetrating portion that is disposed on the surface and exposes the opposite surface, an adhesive filled in the penetrating portion, and a heat sink bonded to the electro-optical panel by the adhesive. An electro-optical device.

  With such a configuration, the heat radiating plate can be bonded without forming an adhesive layer entirely between the electro-optical panel and the heat radiating plate. Therefore, heat conduction efficiency can be improved, and display quality and durability can be improved.

  Application Example 2 In the above-described electro-optical device, the through portion is a through hole surrounded by the thin film, and the amount of the adhesive is smaller than the volume of the through hole. The electro-optical device is characterized in that the adhesive and the vacuum part coexist.

  With such a configuration, when the surroundings are at normal pressure, a force in a direction in which the heat radiating plate and the electro-optical panel are bonded to each other works, and the adhesive force is strengthened. Therefore, the reliability of the electro-optical device can be improved. Further, it is possible to increase a region where the heat radiating plate and the electro-optical panel are bonded via the thin film, that is, without passing through the through hole, and heat conduction efficiency can be improved.

  Application Example 3 In the above-described electro-optical device, at least one of the thin film and the heat dissipation plate includes a metal.

  Since metal has high heat conduction efficiency, such a configuration can further improve the display quality and durability of the electro-optical device.

  Application Example 4 In the electro-optical device described above, the light-emitting element is an organic EL element.

  With such a configuration, the display quality and durability of the electro-optical device can be improved.

  Application Example 5 An electro-optical panel having a pair of substrates and a current-driven light-emitting element disposed between the pair of substrates, and the side of the electro-optical panel opposite to the side from which the light-emitting elements emit light A heat sink disposed on the surface of the heat sink, a recess formed on a surface of the heat sink opposite to the electro-optical panel, and an adhesive disposed in the recess. Electro-optic device.

  With such a configuration, in the region where the concave portion of the heat radiating plate is not formed, the heat radiating plate and the electro-optical panel are in direct contact without an adhesive. Therefore, the heat radiating plate can be bonded to the electro-optical panel while suppressing a decrease in heat conduction efficiency, and deterioration due to heat when the electro-optical device is energized can be reduced.

  Application Example 6 In the electro-optical device described above, the amount of the adhesive is smaller than the volume of the concave portion, and the adhesive and the vacuum portion coexist in the concave portion. Electro-optic device.

  With such a configuration, when the surroundings are at normal pressure, a force in the direction of compressing the heat radiating plate and the electro-optical panel works, and the adhesive force is strengthened. Therefore, the reliability of the electro-optical device can be improved. Moreover, the area | region which the said recessed part occupies can be reduced in the board | substrate surface of the said heat sink, and heat conduction efficiency can be improved.

  Application Example 7 In the electro-optical device described above, the light-emitting element is an organic EL element.

  With such a configuration, deterioration due to overheating during use of the organic EL device can be reduced, and display quality and the like can be improved.

  Application Example 8 First Step of Forming an Electro-Optical Panel by Forming a Current-Driven Light-Emitting Element on One Surface of the First Substrate and Affixing the Second Substrate to Cover the Light-Emitting Element A second step of forming a thin film having a penetrating portion that exposes the opposite surface on the surface opposite to the light emitting side of the light emitting element of the electro-optical panel; and bonding to the penetrating portion A third step of disposing an agent, and a heat radiation plate disposed on the opposite surface via the thin film, and then pressurizing, whereby the electro-optical panel and the heat dissipation plate are coupled via the adhesive and the thin film. And a fourth step of bonding the electro-optical device.

  With such a manufacturing method, the heat radiating plate can be bonded without forming an adhesive layer entirely between the substrate and the heat radiating plate. Therefore, the heat dissipation plate can be arranged while suppressing a decrease in heat conduction efficiency, and an electro-optical device with improved display quality and durability can be obtained.

  Application Example 9 In the above electro-optical device manufacturing method, the thin film is a metal film, and the second step is a step of performing vacuum film formation through a mask having the shape of the through portion. A method for manufacturing an electro-optical device.

  With such a manufacturing method, the formation of the metal film and the formation of the through portion can be performed simultaneously, and the manufacturing cost can be reduced. “Vacuum film formation through a mask” refers to mask sputtering, mask vapor deposition, or the like.

  Application Example 10 In the method of manufacturing the electro-optical device described above, the thin film is a metal film, and the second step is surrounded by the metal film in plan view after the metal film is formed. A method of manufacturing an electro-optical device, which is a step of forming a through hole.

  With such a manufacturing method, it is easy to adjust the amount of adhesive for each penetrating portion, and it is possible to suppress the adhesive from flowing into a region other than the region where the penetrating portion is formed. Accordingly, it is possible to obtain an electro-optical device that can suppress a decrease in the adhesive force between the heat radiating plate and the electro-optical panel and has improved reliability. The through hole is formed by a photolithography method or the like.

  Application Example 11 In the above-described electro-optical device manufacturing method, the third step is a step of disposing the adhesive in an amount smaller than the volume of the through hole in the through hole. 4. The method of manufacturing an electro-optical device, wherein the step 4 is performed in a vacuum.

  With such a manufacturing method, a vacuum part is formed in the through hole after the electro-optical panel and the heat radiating plate are bonded together. Therefore, the adhesive force between the heat radiating plate and the electro-optical panel can be enhanced, and an electro-optical device with improved reliability can be obtained.

  Application Example 12 First Step of Forming an Electro-Optical Panel by Forming a Current-Driven Light-Emitting Element on One Surface of the First Substrate and Affixing the Second Substrate to Cover the Light-Emitting Element And a second step of forming a recess on one surface of the heat sink, a third step of disposing an amount of adhesive below the volume of the recess in the recess, and after the adhesive is disposed A fourth step of bonding the heat dissipation plate and the electro-optical panel so that the one surface faces the surface of the electro-optical panel opposite to the light emitting element. A method for manufacturing an electro-optical device.

  With such a manufacturing method, the heat sink can be bonded without forming an adhesive layer entirely between the electro-optical panel and the heat sink. Therefore, the heat dissipation plate can be arranged while suppressing a decrease in heat conduction efficiency, and an electro-optical device with improved display quality and durability can be obtained.

  Application Example 13 In the above-described method for manufacturing an electro-optical device, the third step is a step of disposing the adhesive in an amount smaller than the volume of the concave portion, and the fourth step is a vacuum. A method for manufacturing an electro-optical device, wherein the method is a step performed in the method.

  With such a manufacturing method, a vacuum part is formed in the recess after the electro-optical panel and the heat sink are bonded together. Therefore, the adhesive force between the heat radiating plate and the electro-optical panel can be enhanced, and an electro-optical device with improved reliability can be obtained.

  Application Example 14 Electronic equipment comprising the above-described electro-optical device or the electro-optical device manufactured by the above-described manufacturing method.

  With such a configuration, the reliability of the electronic device can be improved.

1 is a schematic cross-sectional view of a thin organic EL device as an electro-optical device. FIG. 3 is a perspective view showing the electro-optical device according to the first embodiment in an expanded state. Sectional drawing of a cavity part. The figure which shows the penetration part shape etc. which are formed in a metal film. FIG. 6 is a perspective view showing an electro-optical device according to a second embodiment in a developed state. Process sectional drawing which shows the manufacturing method of the organic electroluminescent apparatus concerning 3rd Embodiment. Process sectional drawing which shows the manufacturing method of the organic electroluminescent apparatus concerning 3rd Embodiment. Process sectional drawing which shows the manufacturing method of the organic electroluminescent apparatus concerning 4th Embodiment. Process sectional drawing which shows the manufacturing method of the organic EL apparatus concerning 5th Embodiment. The schematic block diagram of the portable information terminal as an example of an electronic device.

  Embodiments of an organic EL device manufacturing method according to the present invention will be described below with reference to the drawings. In the following drawings, the scale of each layer and each part is different from the actual scale so that each layer and each part can be recognized on the drawing.

(First embodiment)
FIG. 1 is a schematic cross-sectional view of a thin organic EL device (hereinafter referred to as “organic EL device”) 31 as an electro-optical device according to the present embodiment. In addition, as an actual organic EL device, a mode in which the illustrated organic EL device 31 is used by sealing it from above and below with a transparent thin film is generally used. The description is omitted.

  As shown in the figure, the organic EL device 31 includes an organic EL panel 20 as an electro-optical panel, and a heat radiating plate 22 disposed on the back side of the organic EL panel. In the present specification, the “surface (of the organic EL panel)” is a surface on the side from which light generated by the organic EL element 17 described later is emitted. The “back surface” is a surface on the side where the organic EL element 17 is formed. Hereinafter, the configuration of the organic EL panel 20 will be described.

  The organic EL panel 20 according to the present embodiment includes a pair of substrates of the element substrate 1 and the color filter substrate 16 and an organic light-emitting element formed in a region formed by the pair of substrates and the sealing material 15. It is composed of an EL element 17 and the like. The element substrate 1 and the color filter substrate 16 are made of a transparent inorganic glass or the like, and are arranged to face each other with a predetermined interval by a sealing material 15. In addition, since the organic EL device 31 of the present embodiment is a top emission type, transparency is not essential in the element substrate 1.

  Above the element substrate 1, a driving TFT (thin film transistor) 3 for actively driving each organic EL element 17 and a pixel circuit including a switching TFT and a storage capacitor (not shown) are formed. The pixel circuit is covered with an interlayer insulating layer 2. Note that “upward” means the direction on the color filter substrate 16 side. Although not shown, a scanning line driving circuit, a data line driving circuit, and the like are formed around a region where the organic EL elements 17 are regularly arranged.

  Above the pixel circuit, for example, a planarization layer 4 that is a layer made of an insulator such as acrylic resin is formed. In addition, an external wiring 46 is formed on the overhang portion 48 where one side of the element substrate 1 extends from the color filter substrate 16. The external wiring 46 is electrically connected to the above-described scanning line driving circuit or the like through a contact hole (not shown) formed in the planarization layer 4 and is also electrically connected to an external circuit via an IC chip or the like (not shown). is doing.

  On the flattening layer 4, the reflective layer 5 and the pixel electrode 6 are laminated in this order for each driving TFT 3. The reflective layer 5 is made of, for example, aluminum and reflects light traveling from the light emitting functional layer 8 toward the element substrate 1 to make light contributing to display. The pixel electrode 6 is made of a transparent electrode such as ITO (indium oxide alloy) or ZnO, and is electrically connected to the drain terminal of each driving TFT 3 through a contact hole penetrating the planarizing layer 4. ing. The partition wall 7 is made of a photocurable black resin or the like, and is formed so as to surround each pixel electrode 6 in a plan view. The pixel circuit including the driving TFT 3 is disposed so as to overlap the partition wall 7 in plan view in order to prevent malfunction due to light.

  A light emitting functional layer 8 and a common electrode 9 are formed above the pixel electrode 6 so as to cover the pixel electrode and the partition wall 7. Although the light emitting functional layer 8 is shown as a single layer structure in this drawing, it is actually composed of a hole injection layer, a hole transport layer, an organic EL layer, an electron injection layer, etc. Are stacked in this order. The hole transport layer is composed of a material having sublimation properties such as aromatic diamine (TPAB2Me-TPD, α-NPD). The organic EL layer is composed of an organic material thin film that emits white light when energized. The electron injection layer is made of LiF (lithium fluoride) or the like.

  The common electrode 9 is a metal thin film layer in which a metal such as MgAg is formed very thin so that light can be transmitted. The organic EL element 17 includes a pair of electrodes of the pixel electrode 6 and the common electrode 9 and a light emitting functional layer 8 formed between the pair of electrodes. When a voltage is applied between the pixel electrode 6 and the common electrode 9, the holes supplied from the hole injection layer and the electrons supplied from the electron injection layer are combined in the organic EL layer, and the white color described above. As light is generated, heat accompanying energization is radiated to the surroundings. And as above-mentioned, this heat degrades the light emission characteristic etc. of an organic electroluminescent apparatus, and impairs reliability. Therefore, in the organic EL device 31 of the present embodiment, the heat radiating plate 22 is disposed on the back surface of the element substrate 1 while suppressing a decrease in the heat conduction efficiency, and the heat generated during the light emission described above is effective outside the organic EL device. Is dissipated.

  On the light emitting functional layer 8 side of the color filter substrate 16, a color filter layer 14 having a red color filter 14r, a green color filter 14g, and a blue color filter 14b is formed. Each color filter 14 (r, g, b) is arranged for each pixel region in a plan view, that is, for each region partitioned by the partition walls 7. White light generated when the light emitting functional layer 8 is energized in each organic EL element 17 is transmitted through the color filter layer 14 so that light in a predetermined wavelength region is extracted, and red light, green light, blue light, It becomes one of the three primary colors. Then, the three primary color lights are emitted from the pixel area 29, whereby a color image is formed in a display area, which is an area where the plurality of pixel areas 29 are regularly arranged. Note that the pixel region 29 is a planar concept and is a region surrounded by a light shielding layer (black matrix) 14bm described later in plan view. The light shielding layer 14bm is formed in a lattice shape so as to overlap the partition wall 7 in a plan view, and suppresses color mixing between the pixel regions 29.

Between the organic EL element 17 and the color filter layer 14, the electrode protective layer 10, the buffer layer 11, the gas barrier layer 12, and the filler 13 are formed in order. The electrode protective layer 10 is made of a transparent material such as SiO ₂ or Si ₃ N ₄ and having a function of blocking moisture. The buffer layer 11 is a transparent organic buffer layer such as a thermosetting epoxy resin. The gas barrier layer 12 is a sealing layer that is transparent and has a function of blocking moisture, such as SiO ₂ and Si ₃ N ₄ , and has a function of preventing moisture from entering the light emitting functional layer 8. Yes. The filler 13 is a transparent adhesive layer made of, for example, a thermosetting epoxy resin, and is filled in the uneven surface between the gas barrier layer 12 and the color filter layer 14 and adheres both. Further, it also functions to prevent moisture from entering the light emitting functional layer 8 from the outside.

  In this figure, the scale of each layer sandwiched between the element substrate 1 and the color filter substrate 16 is enlarged as compared with the above-described pair of substrates in order to clarify the lamination relationship of each component. . However, in practice, the distance between the pair of substrates described above is smaller than the thickness of the substrate. Specifically, the above-mentioned distance is about several μm to 10 μm. Among these, the buffer layer 11 occupies more than half the thickness. Incidentally, the thickness of the light emitting functional layer 8 composed of a plurality of thin films (such as organic EL layers) having a thickness of the order of nm is less than 1 μm. On the other hand, the thicknesses of the element substrate 1 and the color filter substrate 16 are approximately 40 μm, respectively. Therefore, the total thickness of the organic EL device 31 is about 90 μm. By forming to such a thickness, the organic EL device 31 has flexibility without losing strength.

  In addition, the element substrate 1 and the color filter substrate 16 are thinned by polishing or etching each having a thickness of about 0.3 to 0.7 mm in the initial stage. Such thinning is preferably performed by etching using hydrofluoric acid (hydrofluoric acid) as an etching solution (aqueous solution) after forming the organic EL device 31 with the front and back glass substrates being thick.

  FIG. 2 is a perspective view showing the organic EL device 31 developed on the organic EL panel 20, the metal film 21 as a thin film, and the heat radiating plate 22. Illustration of an adhesive 26 (see FIG. 3) to be described later is omitted. Hereinafter, in conjunction with FIG. 1, the arrangement of the heat sink 22 will be described.

  As shown in the figure, the heat radiating plate 22 is disposed on the back surface of the element substrate 1 with the metal film 21 interposed therebetween. The metal film 21 is regularly formed with a plurality of through holes 23 as through parts, and an adhesive 26 is disposed in the through holes. Therefore, the element substrate 1 and the heat dissipation plate 22 are connected to each other through the adhesive 26 in the through hole.

  As will be described later, the metal film 21 is formed (formed) on the back surface of the element substrate 1 by a method such as sputtering. The material of the metal film 21 of this embodiment is Al (aluminum), and the film thickness is 50 to 100 μm. On the other hand, the heat radiating plate 22 is an independent plate-like member, and is disposed (adhered) on the metal film after the metal film 21 is formed on the back surface of the element substrate 1. The material is Al like the metal film 21, and the plate thickness is 0.1 to 0.2 mm (100 to 200 μm). The material described above is not limited to Al, and other metals can be used. Similarly, the plate thickness and the like are not limited to the above values.

  The organic EL device 31 of this embodiment is characterized in that the amount (volume) of the adhesive 26 is smaller than the volume of the through hole 23. In addition, the adhesive 26 is disposed only in the through hole 23 and is not disposed in a region other than the region where the through hole 23 is formed in a plan view. As described above, the metal film 21 is directly formed on the back surface of the element substrate 1. Therefore, as a result of such characteristics, in the region other than the region where the through hole 23 is formed, the element substrate 1 and the heat radiating plate 22 are surface-bonded only through the metal film 21 without using the adhesive 26. Yes. That is, it is fixed in a surface contact state.

  In addition, since the amount of the adhesive 26 is smaller than the volume of the through hole 23 as described above, the adhesive is not formed in the through hole 23, that is, in the space formed by the through hole 23, the element substrate 1, and the heat sink 22. A cavity 28 (see FIG. 3) is formed together with 26. In the organic EL device 31, the cavity is in a vacuum. Such a vacuum is obtained by performing the process of bonding the organic EL panel 20 and the heat sink 22 in a vacuum, as will be described later (third embodiment).

  FIG. 3 is a cross-sectional view of the cavity 28. As shown in the figure, the adhesive 26 only occupies a part of the through hole 23 (a space formed by the through hole 23, the element substrate 1, and the heat sink 22), and the remaining part becomes the cavity 28. Yes. As described above, the cavity 28 is vacuum. On the other hand, the outside of the heat sink 22 and the outside of the organic EL panel 20 (see FIG. 2) including the element substrate 1 are at normal pressure at least during normal use. Therefore, a force in the direction of the arrow shown in the drawing acts on the organic EL device 31.

  The adhesive 26 has a lower heat conduction efficiency than at least a metal film, and may function as a heat insulating material (heat insulating layer) when metal materials are bonded together with an adhesive. On the other hand, when the metal materials are brought into surface contact with each other, the adhesiveness is inferior to that in the case where an adhesive is used, so that the interface may function as a heat insulating layer. The organic EL device 31 according to the present embodiment disposes the element substrate 1 and the heat radiating plate 22 only in a local place in the through hole 23 so that the element substrate 1 and the heat radiating plate 22 are heated when the through hole 23 forming region is removed. Surface bonding is performed only through the metal film 21 having high conduction efficiency.

  And about the fall of adhesive force by using the adhesive agent 26 only locally, it is a vacuum cavity part (henceforth a "vacuum part") in the aggregate | assembly which consists of the element substrate 1, the metal film 21, and the heat sink 22. This is supplemented by forming 28). As a result, it is possible to arrange the heat radiating plate 22 so as to have a higher heat conduction efficiency than when the heat radiating plate 22 is bonded via an adhesive layer formed on the entire back surface of the element substrate 1. Further, it is possible to further reduce the deterioration of the light emitting functional layer and the like due to heat generation during image formation, thereby further improving the reliability.

FIG. 4 is a diagram showing the shape and the like of the through portion (through hole) 23 formed in the metal film 21.
FIG. 4A shows the through hole 23 in the organic EL device 31 described above. As shown in the figure, the through hole 23 is substantially circular in plan view. The through holes 23 have a relatively small area and are formed so as to be distributed substantially uniformly in the metal film 21. If it is such a shape, the area | region where the back surface of the element substrate 1 and the heat sink 22 are surface-joined only through the metal film 21, the area | region in which the cavity part 28 is formed, the back surface of the element substrate 1, and heat dissipation. Three types of regions, that is, the region where the plate 22 is bonded via the adhesive 26 can be distributed substantially uniformly. Therefore, it is possible to suppress the organic EL device 31 from being locally heated, and it is also possible to suppress a portion having a low adhesive force from being locally generated. Therefore, the temperature rise during use can be effectively reduced and the reliability can be improved. However, the metal film 21 having the shape shown in this figure is difficult to apply to the mask film formation (mask sputtering or mask vapor deposition) described later.

  FIG. 4B is a view showing a through hole 23 having a larger area than the through hole 23 shown in FIG. With the through hole 23 having such a shape, since the area occupied by the cavity 28 can be made relatively large, the adhesion between the element substrate 1 and the heat radiating plate 22 can be improved. Further, when the adhesive 26 is supplied in the vicinity of the center of the through hole 23, there is little possibility that the adhesive protrudes to the outside of the through hole 23, and the element substrate 1 and the heat radiating plate 22 are directly connected (without using the adhesive 26). ) It is possible to suppress the adhesive 26 from entering the area to be contacted. Note that the application of mask film formation is difficult, as is the case with the through-hole 23 having the shape shown in FIG.

  FIG. 4C is a view showing a mode in which the penetrating portion surrounds the island-shaped metal film 21. Therefore, it cannot be expressed as a through “hole”. Hereinafter, a reference numeral “25” is given to the penetrating portion having such a shape. When the penetrating portion 25 has such a shape, the cavity 28 cannot be formed when the adhesive is supplied in a spot shape. However, if the adhesive 26 is supplied in an annular shape, the inside of the annular shape can be made a cavity 28. And the cavity part can be made into a vacuum part by implementing the process which adhere | attaches the element substrate 1 and the heat sink 22 in a vacuum.

  The advantage of the penetrating portion 25 having such a shape is that the metal film 21 can be formed by mask deposition (mask sputtering or mask vapor deposition). That is, the metal film 21 is formed without using a photolithography process by using a film formation mask having a base material (mask member) having a shape overlapping with the penetrating part 25 in plan view, with the formation region of the metal film 21 as a punched portion. Can be formed. As a result, the organic EL device 31 including the heat dissipation plate 22 with improved heat dissipation efficiency can be obtained without increasing the manufacturing cost.

(Second Embodiment)
FIG. 5 is a perspective view showing the organic EL device 32 according to the second embodiment expanded on the organic EL panel 20 and the heat radiating plate 22. As in FIG. 2 showing the organic EL device 31 described above, the adhesive 26 (see FIG. 3) is not shown. Note that the configuration of the element substrate 1 included in the organic EL device 32 is the same as the configuration of the element substrate 1 included in the organic EL device 31 according to the first embodiment.

  As illustrated, the organic EL device 32 according to this embodiment does not include the metal film 21. Therefore, the element substrate 1 and the heat radiating plate 22 are face-to-face bonded without the metal film 21 (see FIG. 2). A recess 24 is formed in the heat radiating plate 22, and the adhesive 26 is supplied into the recess. The element substrate 1 and the heat sink 22 are bonded together with the adhesive. The supply amount of the adhesive 26 is characterized by being smaller than the volume of the recess.

  Since the amount of the adhesive 26 is smaller than the volume of the recess 24, the adhesive is prevented from protruding outside the formation region of the recess 24. Therefore, the element substrate 1 and the heat radiating plate 22 are face-to-face bonded without using the adhesive 26 except in the formation region. Therefore, when the element substrate 1 is heated, the heat is transferred to the heat radiating plate 22 with high conduction efficiency.

  Further, since the amount of the adhesive 26 is small, a cavity 28 is formed in the recess 24 together with the adhesive 26 in a state where the element substrate 1 and the heat radiating plate 22 are bonded together. And the cavity part can be made into a vacuum part by implementing the process of bonding the element substrate 1 and the heat sink 22 in a vacuum. Therefore, like the organic EL device 31 according to the first embodiment, the adhesion between the element substrate 1 and the heat radiating plate 22 can be increased by the force acting on the vacuum portion, and the heat conduction efficiency can be improved. As a result, it is possible to arrange the heat radiating plate 22 so as to have a higher heat conduction efficiency compared to the case where the heat radiating plate 22 is bonded through an adhesive layer formed on the entire surface, and the deterioration due to heat generation during image formation is further enhanced. The reliability can be further improved.

(Third embodiment)
Next, a method for manufacturing an organic EL device according to the third embodiment will be described. 6 and 7 are process cross-sectional views illustrating a method for manufacturing the organic EL device according to the present embodiment (specifically, the organic EL device 31 of the first embodiment).

  FIG. 6A shows a stage where the organic EL panel 20 is formed. The element substrate 1 on which the organic EL element 17 (see FIG. 1) and the like are formed on the upper surface and the color filter substrate 16 on which the color filter layer 14 (see FIG. 1) is formed are bonded to each other through a sealant 15. Is formed. The illustration of the organic EL element 17 and the like is omitted. Further, illustration of the external wiring 46 (see FIG. 1) and the like is also omitted.

  Next, as shown in FIG. 6B, the element substrate 1 and the color filter substrate 16 are thinned by etching or the like, and the organic EL panel 20 is thinned. Specifically, the element substrate 1 and the color filter substrate 16 having a thickness of about 0.3 to 0.7 mm using hydrofluoric acid (hydrofluoric acid) as described above are approximately 40 μm in thickness. Etch.

  Next, as shown in FIG. 6C, a metal film 21 is formed on the back surface of the element substrate 1 by sputtering or vapor deposition. Hereinafter, up to FIG. 7G, the vertical direction of the organic EL panel 20 is reversed. As described above, the metal film 21 is preferably aluminum having a thickness of about 50 to 100 μm.

  Next, as shown in FIG. 6D, the metal film 21 is patterned to form a through hole 23. Patterning is performed by a photolithography method. In this drawing, as shown in FIG. 4A, the through holes 23 are shown to be evenly distributed on the back surface of the element substrate 1. However, you may form the through-hole 23 of the aspect shown in FIG.4 (b). Then, the organic EL panel 20 after the through holes 23 are formed is transferred into a vacuum chamber (not shown). The following steps are all performed in the vacuum chamber.

  Next, as illustrated in FIG. 7E, the adhesive 26 is supplied into the through hole 23 of the organic EL panel 20 placed in the vacuum chamber using the dispenser 52. As described above, the amount of the adhesive 26 supplied to each through hole 23 is smaller (smaller) than the volume of the through hole 23.

  Next, as shown in FIG. 7 (f), the heat radiating plate 22 is placed on the organic EL panel 20.

  Next, as shown in FIG. 7G, a pressure is applied to the heat radiating plate 22 to bring the metal film 21 and the heat radiating plate 22 into close contact with each other. Since the amount of the adhesive 26 is smaller than the volume of the through hole 23, the adhesive 26 does not protrude from the through hole 23 even when such pressing force is applied. And the adhesive agent 26 is hardened, maintaining the state which applied this pressing force. Through the above steps, the organic EL device 31 having the heat sink 22 bonded to the back surface through the metal film 21 can be obtained.

  Since the amount of the adhesive 26 is smaller than the volume of the through hole 23, a portion that is not filled with the adhesive 26, that is, a cavity portion 28 is generated in the through hole 23. Since the process from supplying the adhesive 26 into the through hole 23 to the process of curing the adhesive 26 while applying pressure to the heat radiating plate 22 is performed in vacuum, the cavity 28 is in a vacuum state. It is sealed and kept in a vacuum part.

  With such a vacuum part, as shown in FIG. 3 and the like described above, a force for increasing the adhesion between the element substrate 1 (and the organic EL panel 20) and the heat radiating plate 22 works. And the improvement of this contact | adhesion power improves the heat conduction efficiency between the element substrate 1 and the heat sink 22. Therefore, the organic EL device 31 obtained by such a manufacturing method can efficiently dissipate heat generated during image formation to the outside, and the reliability is improved. And the energy required for heat dissipation can also be reduced.

(Fourth embodiment)
Next, a method for manufacturing an organic EL device according to the fourth embodiment will be described. FIG. 8 is a process cross-sectional view illustrating the method for manufacturing the organic EL device according to this embodiment. Note that the organic EL device that is the subject of the present embodiment is an organic EL device that has a continuous through portion 25 instead of the through hole 23 as shown in FIG. The constituent elements other than the penetrating portion 25 are the same as the constituent elements in the organic EL device according to the third embodiment described above. Therefore, description of each component is omitted. Hereinafter, it will be described in the order of steps.

  First, as shown in FIG. 8A, a film formation mask 50 is placed on the element substrate 1 side of the organic EL panel 20 after the thinning process is completed. Then, the metal particles 51 are caused to fly over the film formation mask, and the metal particles 51 are deposited on the punched portion of the film formation mask. As a result, a metal film 21 having a penetrating portion 25 as shown in FIG. 8B is formed.

  Next, as illustrated in FIG. 8C, the adhesive 26 is supplied into the through portion 25 using the dispenser 52. Unlike the through-hole 23, the through-portion 25 cannot define the volume, but the supply amount of the adhesive 26 is such that the adhesive 26 does not protrude outside the formation area of the through-hole 25 when the heat sink 22 described later is bonded. It is necessary to suppress the supply amount.

  Next, as shown in FIG. 8D, the organic EL panel 20 and the heat radiating plate 22 are bonded to each other by applying a pressing force to the organic EL panel 20 with a heat radiating plate 22. As described above, since the supply amount of the adhesive 26 is limited to such an extent that it does not protrude from the penetrating portion 25, a hollow portion 28 that is not filled with the adhesive 26 is generated in the penetrating portion 25. The element substrate 1 and the heat radiating plate 22 are bonded to each other only through the metal film 21 without using the adhesive 26 except in the region where the through portion 25 is formed. Therefore, the organic EL device 31 having the heat sink 22 bonded to the back surface through the metal film 21 can be obtained through the above steps.

  Unlike the manufacturing method of the third embodiment described above, the manufacturing method of the present embodiment does not always create a vacuum part in the cavity 28. However, by forming the metal film 21 using the film formation mask 50, the patterning step by the photolithography method can be omitted. Therefore, according to the manufacturing method of the present embodiment, an organic EL device that has high heat dissipation efficiency and can efficiently dissipate heat generated during image formation to the outside can be obtained while suppressing manufacturing costs.

(Fifth embodiment)
Next, a method for manufacturing an organic EL device according to the fifth embodiment will be described. FIG. 9 is a process cross-sectional view illustrating the method for manufacturing the organic EL device according to this embodiment. Note that the organic EL device targeted in this embodiment is the organic EL device 32 described in the second embodiment. Therefore, a part of description of each component is omitted. Hereinafter, it will be described in the order of steps.

  First, as shown in FIG. 9A, a metal plate (reference numeral 22) that will become the heat radiating plate 22 in the future is pressed using a die 55 having a plurality of convex portions, and FIG. As shown in (b), a plurality of recesses 24 are formed on one surface.

  Next, the heat radiating plate 22 is transferred into a vacuum chamber (not shown). Then, the adhesive 26 is supplied into the recess 24 from a dispenser (not shown). The supply amount of the adhesive 26 is adjusted so as to be smaller than the volume of the recess 24. Then, as shown in FIG. 9C, the organic EL panel 20 subjected to the thinning process is covered.

  Next, as shown in FIG. 9 (d), a pressure is applied to the organic EL panel 20 to adhere to the heat radiating plate 22, thereby completing the organic EL device 32. As described above, since the supply amount of the adhesive 26 is smaller than the volume of the recess 24, the cavity 28 is formed in the recess 24 after the organic EL panel 20 and the heat sink 22 are bonded together. . Since the above-described bonding process is performed in a vacuum chamber, the cavity 28 is a vacuum part.

  With such a vacuum part, as shown in FIG. 3 and the like described above, a force for increasing the adhesion between the element substrate 1 (and the organic EL panel 20) and the heat radiating plate 22 works. And the improvement of this contact | adhesion power improves the heat conduction efficiency between the element substrate 1 and the heat sink 22. Therefore, the organic EL device 32 obtained by the manufacturing method of the present embodiment can efficiently dissipate heat generated during image formation to the outside, and the reliability is improved. And the energy required for heat dissipation can also be reduced.

(Electronics)
FIG. 10 is a schematic configuration diagram of a personal digital assistant (PDA) as an example of an electronic device. The portable information terminal 2000 includes a plurality of operation buttons 2001, a power switch 2002, and a display unit 2003. In the portable information terminal 2000, when the power switch 2002 is turned on and a plurality of operation buttons 2001 are operated, various types of information such as an address book and a schedule book are displayed on the display unit 2003. The display unit 2003 includes the organic EL device manufactured by any one of the above-described embodiments or the manufacturing method according to each of the above-described embodiments.

  Since the organic EL device according to the above-described embodiment has improved heat dissipation efficiency, the portable information terminal 2000 does not need to separately prepare a heat dissipation means, and can be used for a long time only by natural heat dissipation. Therefore, the energy accompanying use can be reduced. Moreover, since deterioration due to heat is reduced, long-term reliability is also improved.

  The organic EL device according to any one of the above-described embodiments or the organic EL device manufactured by any of the manufacturing methods according to each of the above-described embodiments is not limited to the above-described portable information terminal, and is mounted on various electronic devices. can do. Electronic devices include, for example, personal computers, digital still cameras, viewfinder type or monitor direct view type digital video cameras, car navigation systems, in-vehicle displays, pagers, calculators, word processors, workstations, videophones, POS terminals, touch panels. Equipment provided.

  DESCRIPTION OF SYMBOLS 1 ... Element board | substrate, 2 ... Interlayer insulating layer, 3 ... Driving TFT (thin film transistor), 4 ... Flattening layer, 5 ... Reflective layer, 6 ... Pixel electrode, 7 ... Partition, 8 ... Light emitting functional layer, 9 ... Common Electrode, 10 ... Electrode protective layer, 11 ... Buffer layer, 12 ... Gas barrier layer, 13 ... Filler, 14 ... Color filter layer, 14b ... Blue color filter, 14bm ... Light shielding layer, 14g ... Green color filter, 14r ... Red color Filter, 15 ... Sealing material, 16 ... Color filter substrate, 17 ... Organic EL element, 20 ... Organic EL panel, 21 ... Metal film as thin film, 22 ... Heat sink, 23 ... Through hole, 24 ... Recess, 25 ... Through 26: Adhesive, 28 ... Cavity, 29 ... Pixel region, 31 ... Organic EL device, 32 ... Organic EL device, 46 ... External wiring, 48 ... Overhang, 50 ... Film formation mask, 51 ... Metal particles, 2 ... dispenser, 55 ... mold, 2000 ... portable information terminal, 2001 ... operation button, 2002 ... power switch, 2003 ... the display unit.

Claims (14)

An electro-optical panel having a pair of substrates and a current-driven light-emitting element sandwiched between the pair of substrates;
A thin film having a penetrating portion that is disposed on the surface opposite to the light emitting side of the electro-optic panel and exposes the surface on the opposite side;
An adhesive filled in the penetrating part;
A heat sink bonded to the electro-optic panel by the adhesive;
An electro-optical device comprising:   The electro-optical device according to claim 1, wherein the through portion is a through hole surrounded by the thin film, and the amount of the adhesive is less than the volume of the through hole, The electro-optical device is characterized in that the adhesive and the vacuum part coexist.   3. The electro-optical device according to claim 1, wherein at least one of the thin film and the heat radiating plate includes a metal.   4. The electro-optical device according to claim 1, wherein the light-emitting element is an organic EL element. 5. An electro-optical panel having a pair of substrates and a current-driven light-emitting element disposed between the pair of substrates;
A heat radiating plate disposed on a surface of the electro-optical panel opposite to a side where the light emitting element emits light; and
A recess formed on a surface of the heat radiating plate facing the electro-optical panel;
An adhesive disposed in the recess;
An electro-optical device comprising:   6. The electro-optical device according to claim 5, wherein an amount of the adhesive is smaller than a volume of the concave portion, and the adhesive and a vacuum portion coexist in the concave portion. Optical device.   The electro-optical device according to claim 5, wherein the light emitting element is an organic EL element. A first step of forming an electro-optical panel by forming a current-driven light-emitting element on one surface of the first substrate and then bonding the second substrate so as to cover the light-emitting element;
A second step of forming a thin film having a penetrating portion exposing the opposite surface on the opposite surface of the electro-optical panel from which the light emitting element emits light;
A third step of disposing an adhesive in the penetrating portion;
A fourth step of applying pressure after disposing a heat sink via the thin film on the opposite surface, and bonding the electro-optical panel and the heat sink via the adhesive and the thin film;
A method for manufacturing an electro-optical device. A method for manufacturing an electro-optical device according to claim 8,
The thin film is a metal film;
The method of manufacturing an electro-optical device, wherein the second step is a step of performing vacuum film formation through a mask having the shape of the penetrating portion. A method for manufacturing an electro-optical device according to claim 8,
The thin film is a metal film;
The second step is a step of forming a through hole surrounded by the metal film in a plan view after forming the metal film.
A method of manufacturing an electro-optical device. The method of manufacturing an electro-optical device according to claim 10,
The third step is a step of disposing the adhesive in an amount smaller than the volume of the through hole in the through hole,
The fourth step is a step performed in a vacuum.
A method of manufacturing an electro-optical device. A first step of forming an electro-optical panel by forming a current-driven light-emitting element on one surface of the first substrate and then bonding the second substrate so as to cover the light-emitting element;
A second step of forming a recess on one surface of the heat sink;
A third step of disposing an adhesive in an amount equal to or less than the volume of the recess in the recess;
The heat radiating plate after the adhesive is disposed and the electro-optical panel are bonded so that the one surface faces the surface on the opposite side of the electro-optical panel from which the light emitting element emits light. A fourth step of combining,
A method for manufacturing an electro-optical device. A method of manufacturing an electro-optical device according to claim 12,
The third step is a step of disposing the adhesive in an amount smaller than the volume of the recess,
The fourth step is a step performed in a vacuum.
A method of manufacturing an electro-optical device.   An electro-optical device according to any one of claims 1 to 7, or an electro-optical device manufactured by the manufacturing method according to any one of claims 8 to 13. machine.

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