WO2018151026A1 - Light emission device - Google Patents
Light emission device Download PDFInfo
- Publication number
- WO2018151026A1 WO2018151026A1 PCT/JP2018/004521 JP2018004521W WO2018151026A1 WO 2018151026 A1 WO2018151026 A1 WO 2018151026A1 JP 2018004521 W JP2018004521 W JP 2018004521W WO 2018151026 A1 WO2018151026 A1 WO 2018151026A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- light emitting
- emitting device
- region
- electrode
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 157
- 239000012044 organic layer Substances 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 description 24
- 238000007789 sealing Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000002274 desiccant Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 229910001182 Mo alloy Inorganic materials 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- -1 polyethylene naphthalate Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- BSUHXFDAHXCSQL-UHFFFAOYSA-N [Zn+2].[W+4].[O-2].[In+3] Chemical compound [Zn+2].[W+4].[O-2].[In+3] BSUHXFDAHXCSQL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
Definitions
- the present invention relates to a light emitting device.
- This light-emitting device is used as a lighting device or a display device, and has a configuration in which an organic layer is sandwiched between a first electrode and a second electrode.
- organic EL a flexible light-emitting device can be given.
- Patent Document 1 describes that an island-shaped electroluminescence layer is formed into a ring shape in a lighting device. Further, it is described that a perforation for cutting is provided on a substrate or the like.
- An example of a problem to be solved by the present invention is to provide a light emitting device that can be mounted with a good appearance regardless of the shape of the mounting surface.
- the invention described in claim 1 A substrate, A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer, and a second electrode;
- the maximum distance between the first ends facing each other through the first region among the ends of the substrate is the first distance, and the second ends facing each other via the second region among the ends of the substrate.
- the distance between the parts is a second distance smaller than the first distance.
- the invention described in claim 2 A substrate, A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer, and a second electrode; In the light emitting device, the substrate surrounds a first region, and the substrate is interrupted in a second region connected to the first region.
- the invention according to claim 12 A substrate, A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer and a second electrode; With The substrate is One end, An end facing the one end through the first region; An end opposite to the one end of the substrate, The one end and the opposite end are light emitting devices that are continuous along the edge of the substrate.
- FIG. 3 is a cross-sectional view illustrating the configuration of a light emitting device according to Example 1.
- FIG. 3 is a plan view illustrating the configuration of a light emitting device according to Example 1.
- FIG. 3 is a plan view illustrating the configuration of a light emitting device according to Example 1.
- FIG. 3 is a plan view illustrating the configuration of a light emitting device according to Example 1.
- FIG. 3 is a plan view illustrating the configuration of a light emitting device according to Example 1.
- FIG. 3 is a plan view illustrating the configuration of a light emitting device according to Example 1.
- FIG. (A) And (b) is a top view which illustrates the composition of the light-emitting device concerning Example 2.
- FIG. 1 to (c) are plan views illustrating the configuration of the light emitting device according to the second embodiment. It is a figure which shows the example used combining multiple light-emitting devices. It is a figure which shows the example used combining multiple light-emitting devices. It is sectional drawing which shows the modification of the structure of a light-emitting device.
- FIG. 1 is a plan view illustrating the configuration of a light emitting device 10 according to the embodiment.
- FIG. 1 illustrates the relationship between the substrate 100 and the light emitting unit 140, and shows a state viewed from a direction perpendicular to the first surface of the substrate 100.
- the light emitting device 10 includes a substrate 100 and a light emitting unit 140.
- the light emitting unit 140 is located on the first surface side of the substrate 100.
- the light emitting unit 140 includes a first electrode, an organic layer, and a second electrode.
- the light emitting device 10 is a lighting device or a display device such as a display.
- the light emitting device 10 may be attached to a vehicle and used as a brake lamp or the like.
- the maximum distance between the first end portion 103 opposed to each other via the first region 106 of the end portion of the substrate 100 is a first distance d 1.
- the distance between the second end 104 facing each other with the second region 107 of the end portion of the substrate 100 is the second distance d 2.
- the second distance d 2 smaller than the first distance d 1. This will be described in detail below.
- the substrate 100 surrounds the first region 106.
- the substrate 100 is interrupted in the second region 107 connected to the first region 106.
- the second region 107 connects the first region 106 and the external region 108 located outside the substrate 100.
- the first region 106 is a hollow portion of the substrate 100
- the second region 107 is a notch portion of the substrate 100.
- the substrate 100 has a frame shape with a part cut off.
- the first area 106 is an area inside the frame
- the external area 108 is an area outside the frame.
- the external region 108 is a region different from the substrate 100, the first region 106, and the second region 107, and is a region that surrounds the region where the substrate 100, the first region 106, and the second region 107 are combined. .
- the substrate 100 has a first end 103a, a first end 103b, and a third end 105a, and the first end 103a and the third end 105a are at the edge of the substrate 100. It is continuous along.
- the first end portion 103 a is one end portion of the substrate 100
- the first end portion 103 b is an end portion that faces the first end portion 103 a via the first region 106.
- the third end portion 105 a is an end portion on the side opposite to the first end portion 103 a of the substrate 100.
- the substrate 100 surrounding the first region 106 is interrupted in the second region 107. Therefore, even when the substrate 100 is arranged along, for example, a curved surface, the second region 107 absorbs the excess or deficiency of dimensions, so that the light emitting device 10 is less likely to be twisted or wrinkled. Moreover, the light-emitting device 10 excellent in design can be obtained.
- the substrate 100 as a whole has a heart shape with a hollow inside.
- the hollowed out portion is the first region 106.
- the shapes of the substrate 100 and the light emitting unit 140 are not limited to this example, and may be a circle, a rectangle, a polygon, a star, or the like. However, it is preferable that at least a part of the edge of the light emitting unit 140 is along the edge of the substrate 100. Further, the substrate 100 is not closed in an annular shape, and is interrupted in the second region 107 as described above.
- the light emitting unit 140 has a stacked structure including a first electrode, an organic layer, and a second electrode.
- a plurality of light emitting portions 140 are provided on the first surface of the substrate 100.
- the light emitting device 10 has two light emitting unit 140 segments.
- the plurality of light emitting units 140 have the same shape as the substrate 100 as a whole.
- the light emitting part 140 may be provided in the 1st surface of the board
- the light emitting device 10 may be flat or curved. In addition, the light emitting device 10 may have flexibility. That is, the substrate 100 may be planar or curved. Further, the substrate 100 may have flexibility.
- the light emitting device 10 according to the present embodiment is configured such that the second end portion 104 faces the substrate 100 when the substrate 100 is along a plane. In addition, the light emitting device 10 according to the present embodiment is configured such that the first end portion 103 faces the substrate 100 when the substrate 100 is along a plane.
- the substrate 100 when the substrate 100 is set along a plane, at least a part of the end of the substrate 100 is curved as viewed from the direction perpendicular to the first surface. Specifically, among the end portions of the substrate 100, the first end portion 103 and the third end portion 105 are on a curve. Moreover, in the example of this figure, when the board
- the substrate 100 has one or more sets of first ends 103 facing each other. That is, the first end portion 103 includes a first end portion 103a and a first end portion 103b that face each other.
- the first end 103 is an inner peripheral edge of the substrate 100.
- the first end 103a and the first end 103b are connected to each other directly or via another end. When viewed from the direction perpendicular to the first surface of the substrate 100, the first end 103a and the first end 103b may be parallel to each other or non-parallel. Further, the first end 103a and the first end 103b may each be a straight line or a curved line. Both the first end portion 103 a and the first end portion 103 b face the first region 106.
- the substrate 100 has a third end 105.
- the third end portion 105 is an outer peripheral edge of the substrate 100.
- the third end portion 105 includes a third end portion 105a and a third end portion 105b.
- the third end 105a is the end opposite to the first end 103a of the substrate 100
- the third end 105b is the end opposite to the first end 103b of the substrate 100.
- the third end portion 105a and the third end portion 105b are connected to each other directly or via another end portion.
- the third end portion 105a and the third end portion 105b may be parallel to each other or non-parallel.
- the third end portion 105a and the third end portion 105b may each be a straight line or a curved line. Both the third end portion 105 a and the third end portion 105 b face the external region 108.
- the first end portion 103 and the third end portion 105 are substantially similar to each other, but the first end portion 103 and the third end portion 105 may have different shapes.
- the substrate 100 has one or more sets of second ends 104 facing each other. That is, the second end 104 includes a second end 104a and a second end 104b that face each other.
- the second end 104 connects the first end 103 and the third end 105.
- the second end 104a connects the first end 103a and the third end 105a
- the second end 104b connects the first end 103b and the third end 105b.
- one end of the second end 104a and one end of the second end 104b are connected via at least the first end 103a and the first end 103b, and the second end 104a and the second end 104a are connected to the second end 104a.
- the other end of the end 104b is connected via at least the third end 105a and the third end 105b.
- the first end portion 103, the second end portion 104, and the third end portion 105 together form one closed region, and this region coincides with the region where the substrate 100 exists.
- the second end 104a and the second end 104b may be parallel to each other or non-parallel.
- each of the second end portion 104 a and the second end portion 104 b may be a straight line, a curved line, or the apex of the substrate 100. Both the second end portion 104 a and the second end portion 104 b face the second region 107.
- FIG. 2 is a diagram illustrating an example of a usage state of the light emitting device 10.
- a plurality of light emitting devices 10 are used in combination.
- the first distance d 1 is the maximum distance between the first ends 103 of the substrates 100 facing each other with the first region 106 interposed therebetween.
- the second distance d 2 is a distance between the second end portions 104 of the substrates 100 facing each other with the second region 107 interposed therebetween.
- the first distance d 1 is greater than the second distance d 2.
- the substrate 100 of one light emitting device 10 can be connected through the first region 106 of another light emitting device 10. By doing so, it is possible to further improve the overall design using a plurality of light emitting devices 10.
- the first width w 1 that is the width of the second end 104 is preferably larger than the second distance d 2 .
- the second width w 2 is preferably larger than the second distance d 2 .
- the second width w 2 is the smallest width of the widths of the substrate 100 having the first end 103 as one end and the third end 105 opposite to the first end 103 as the other end. .
- the substrate 100 of one light emitting device 10 When a plurality of light emitting devices 10 are used in combination, it is not always necessary to pass the substrate 100 of one light emitting device 10 through the first region 106 of another light emitting device 10. For example, at least a part of the adjacent light emitting devices 10 may be arranged so as to overlap each other.
- the second distance d 2 of the substrate 100 is less than the first distance d 1.
- the substrate 100 surrounds the first region 106.
- the substrate 100 is interrupted in the second region 107 connected to the first region 106. Therefore, twisting and wrinkling are unlikely to occur regardless of the shape of the mounting surface, and the light emitting device 10 can be mounted with good appearance.
- FIG. 3 is a cross-sectional view illustrating the configuration of the light emitting device 10 according to the first embodiment. This figure corresponds to the AA cross section of FIG. This cross section is a cross section in the width direction having the first end 103 as one end and the third end 105 as the other end.
- the light emitting device 10 according to this example has the same configuration as the light emitting device 10 according to the embodiment.
- the light emitting unit 140 is provided on the first surface 101 of the substrate 100 and has a stacked structure including the first electrode 110, the organic layer 120, and the second electrode 130.
- the substrate 100 is a light-transmitting substrate such as a glass substrate or a resin substrate.
- the substrate 100 may have flexibility. In the case of flexibility, the thickness of the substrate 100 is, for example, not less than 10 ⁇ m and not more than 1000 ⁇ m.
- the substrate 100 is formed using, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide.
- an inorganic barrier film such as SiN x or SiON is formed on at least one surface (preferably both surfaces) of the substrate 100 in order to prevent moisture from permeating the substrate 100. It is preferable.
- a light emitting unit 140 is formed on the first surface 101 of the substrate 100.
- the light emitting unit 140 has a laminated structure in which a translucent first electrode 110, an organic layer 120, and a light-shielding second electrode 130 are laminated in this order.
- the first electrode 110 is located between the substrate 100 and the second electrode 130. Therefore, of the light emitted from the light emitting unit 140, the light output to the first electrode 110 side has higher intensity than the light output to the second electrode 130 side. That is, the second surface 102 opposite to the first surface 101 of the substrate 100 is a light output surface.
- the first electrode 110 is a transparent electrode having optical transparency.
- the material of the transparent electrode is a metal-containing material, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide).
- the thickness of the first electrode 110 is, for example, not less than 10 nm and not more than 500 nm.
- the first electrode 110 is formed using, for example, a sputtering method or a vapor deposition method.
- the first electrode 110 may be a carbon nanotube or a conductive organic material such as PEDOT / PSS.
- the organic layer 120 has a light emitting layer.
- the organic layer 120 has a configuration in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order.
- a hole transport layer may be formed between the hole injection layer and the light emitting layer.
- an electron transport layer may be formed between the light emitting layer and the electron injection layer.
- the organic layer 120 may be formed by a vapor deposition method.
- at least one layer of the organic layer 120 for example, a layer in contact with the first electrode 110, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 120 may be formed by an evaporation method, or all the layers of the organic layer 120 may be formed by a coating method.
- the second electrode 130 is, for example, a metal layer made of a metal selected from the group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of a metal selected from this group. Contains. In this case, the second electrode 130 has a light shielding property.
- the thickness of the second electrode 130 is, for example, not less than 10 nm and not more than 500 nm.
- the second electrode 130 is formed using, for example, a sputtering method or a vapor deposition method. In the example shown in the drawing, the second electrode 130 is wider than the first electrode 110.
- the entire first electrode 110 in the width direction with the first end 103 as one end and the third end 105 as the other end is It overlaps with the two electrodes 130 and is covered with the second electrode 130.
- the first electrode 110 is wider than the second electrode 130, and the entire second electrode 130 overlaps the first electrode 110 in the width direction when viewed from the direction perpendicular to the first surface 101 of the substrate 100. It may be.
- the first electrode 110 is divided into a plurality of regions, but the first electrode 110 may be integrated on the first surface 101. In that case, one light emitting unit 140 may be formed on the first surface 101. Moreover, in the example of this figure, although the 1st electrode 110 is formed for every light emission part 140, the 1st electrode 110 may be continuously formed over the several light emission part 140. FIG. In the example of this figure, the organic layer 120 and the second electrode 130 are continuously formed over the plurality of light emitting portions 140. However, it is not limited to the example of this figure, At least one of the organic layer 120 and the 2nd electrode 130 may be formed for every light emission part 140. FIG.
- the edge of the first electrode 110 is at least partially covered with the insulating film 150.
- the insulating film 150 is made of, for example, a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that becomes the light emitting portion 140.
- a part of the insulating film 150 protrudes from the second electrode 130.
- the second electrode 130 is also formed on the insulating film 150.
- a part of the organic layer 120 overlaps with the insulating film 150.
- the organic layer 120 is also formed on the insulating film 150.
- the light emitting device 10 further includes a sealing film 180.
- the sealing film 180 is formed so as to cover the entire light emitting unit 140.
- the light emitting unit 140 is located between the sealing film 180 and the substrate 100.
- an inorganic barrier film such as SiN x , SiON, Al 2 O 3 , TiO 2 , SiO 2 , or SiOC, a barrier laminated film including them, or a mixed film thereof can be used. .
- These can be formed by, for example, a vacuum film forming method such as a sputtering method, a CVD method, an ALD method, or an EB vapor deposition method.
- a part of the sealing film 180 is in contact with the first surface 101.
- the light emitting device 10 may be sealed using a plate-shaped sealing member instead of or in addition to the sealing film 180.
- FIG. 12 is a cross-sectional view showing a modified example of the structure of the light emitting device 10.
- the light emitting device 10 includes a sealing member 200, an adhesive layer 210, and a desiccant 220 instead of the sealing film 180.
- the sealing member 200 is made of metal, resin, or glass and has a recess.
- the desiccant 220 contains, for example, CaO or BaO.
- the sealing member 200 covers the light emitting unit 140, and a desiccant 220 is formed on at least a part of the surface of the sealing member 200.
- the sealing member 200 is fixed to the substrate 100 via the adhesive layer 210.
- the sealing member 200 provided with the desiccant 220 is stacked on the light emitting unit 140 via the adhesive layer 210, and the light emitting unit 140 is sealed by pressing the edge of the sealing member 200 toward the substrate 100. It can be sealed with the member 200 or the like.
- the light emitting device 10 further includes a conductive portion 170 on the first surface 101 side of the substrate 100.
- the conductive part 170 is located between the light emitting part 140 and the end of the substrate 100. Specifically, when viewed from a direction perpendicular to the first surface 101 of the substrate 100, the outer periphery of the light emitting unit 140 is separated from the outer periphery of the substrate 100.
- the conductive portion 170 is located between the outer periphery of the light emitting portion 140 and the outer periphery of the substrate 100, and extends along the outer periphery of the light emitting portion 140 and the outer periphery of the substrate 100.
- the conductive part 170 is electrically connected to the first electrode 110.
- the conductive portion 170 is between the third end portion 105 and the portion of the outer periphery of the plurality of light emitting portions 140 that is closest to the third end portion 105 along the third end portion 105. To position. Further, the conductive portion 170 is located between the first end portion 103 and the portion of the outer periphery of the plurality of light emitting portions 140 that is closest to the first end portion 103 and along the first end portion 103. When the light emitting device 10 has only one light emitting unit 140, the conductive unit 170 may be provided so as to surround the light emitting unit 140 along the outer periphery of the light emitting unit 140.
- the conductive part 170 includes a material having a higher conductivity than the material of the first electrode 110.
- the electrical resistivity of the conductive part 170 is lower than the electrical resistivity of the first electrode 110.
- Conductive portion 170 includes, for example, a metal selected from the group consisting of Al, Ag, Mo, and alloys containing these. Specifically, the conductive part 170 may be APC (AgPdCu) or the like.
- the conductive portion 170 has a configuration in which, for example, a first metal layer such as Mo or Mo alloy, a second metal layer such as Al or Al alloy, and a third metal layer such as Mo or Mo alloy are laminated in this order. It may be. In the example of this figure, the conductive portion 170 is located between the substrate 100 and the first electrode 110, but the conductive portion 170 is located on the opposite side of the substrate 100 with respect to the first electrode 110. Also good.
- FIG. 4 to 7 are plan views illustrating the configuration of the light emitting device 10 according to this embodiment.
- 4 to 7 show the light emitting device 10 as viewed from the first surface 101 side of the substrate 100, that is, from the side opposite to the light output surface.
- the sealing film 180 is indicated by a broken line.
- FIG. 5 is a diagram in which the sealing film 180 and the second electrode 130 are removed from FIG. 4, and the outer periphery of the organic layer 120 is indicated by a broken line.
- FIG. 6 is a view obtained by removing the organic layer 120 and the insulating film 150 from FIG.
- FIG. 7 is a diagram in which the first electrode 110 is removed from FIG. 6, and the outer periphery of the light emitting unit 140 is indicated by a broken line.
- the light emitting device 10 further includes a first terminal 112 and a second terminal 132.
- the first terminal 112 and the second terminal 132 will be described in detail with reference to FIG. Both the first terminal 112 and the second terminal 132 are formed on the same side of the substrate 100 as the light emitting unit 140. At least a part of the first terminal 112 and the second terminal 132 is located outside the sealing film 180.
- the first terminal 112 is electrically connected to the first electrode 110.
- the first terminal 112 is connected to the conductive portion 170.
- the first terminal 112 includes the first terminal 112a to the first terminal 112d.
- the first terminals 112a are located at both ends in the extending direction of the conductive portion 170a.
- the conductive portion 170 a is a conductive portion 170 located between the third end portion 105 and the portion of the outer periphery of the plurality of light emitting portions 140 that is closest to the third end portion 105 and along the third end portion 105. is there.
- the first terminals 112b are located at both ends in the extending direction of the conductive portion 170b.
- the conductive portion 170 b is located between the first end portion 103 and the portion of the outer periphery of the plurality of light emitting portions 140 that is closest to the first end portion 103 and along the first end portion 103. It is.
- the first terminal 112 a and the first terminal 112 b are disposed at the second end 104.
- the two first terminals 112a face each other, and the two first terminals 112b face each other.
- the first terminal 112 c is connected to a middle portion of the conductive portion 170 a and is located between the conductive portion 170 a and the third end portion 105.
- the first terminal 112 d is connected to a middle portion of the conductive portion 170 b and is located between the conductive portion 170 b and the first end portion 103. Note that the light emitting device 10 may not include at least one of the first terminal 112a to the first terminal 112d, and may further include another first terminal 112.
- the second terminal 132 is electrically connected to the second electrode 130.
- the second terminal 132 includes the second terminal 132a to the second terminal 132c.
- the second terminal 132a is disposed at the second end 104, and the two second terminals 132a face each other.
- the second terminal 132 b is located between the conductive portion 170 a and the third end portion 105.
- the second terminal 132 c is located between the conductive portion 170 b and the first end portion 103.
- the second terminal 132b is aligned with the first terminal 112c, and the second terminal 132c is aligned with the first terminal 112d.
- the second terminal 132a is located between the first terminal 112a and the first terminal 112b.
- the light emitting device 10 may not include at least one of the second terminals 132a to 132c, and may further include another second terminal 132.
- the first terminal 112 and the second terminal 132 have, for example, at least one of a layer formed of the same material as the conductive portion 170 and a layer formed of the same material as the first electrode 110. .
- a layer formed of the same material as the conductive portion 170 can be formed in the same process as the conductive portion 170. For this reason, the conductive portion 170 may be integrated with at least a part of the first terminal 112.
- one conductive portion 170 is formed for each light emitting portion 140.
- the present invention is not limited to this example, and a plurality of conductive portions 170 may be formed for one light emitting portion 140.
- a positive terminal of a control circuit is connected to the first terminal 112 via a conductive member such as a flexible cable, a bonding wire, or a lead terminal, and a conductive member such as a flexible cable, a bonding wire, or a lead terminal is connected to the second terminal 132. Is connected to the negative terminal of the control circuit.
- the conductive portion 170 is formed on the substrate 100 by performing film formation by sputtering or the like and patterning by etching or the like. At this time, the first terminal 112 and the second terminal 132 can be formed simultaneously.
- the first electrode 110 is formed using, for example, a sputtering method. Then, the first electrode 110 is formed into a predetermined pattern using, for example, a photolithography method.
- the insulating film 150 is formed on the edge of the first electrode 110. For example, when the insulating film 150 is formed of a photosensitive resin, the insulating film 150 is formed in a predetermined pattern through an exposure and development process.
- the organic layer 120 and the second electrode 130 are formed in this order.
- this layer is formed in a predetermined pattern using, for example, a mask.
- the second electrode 130 is also formed in a predetermined pattern using, for example, a mask.
- a sealing film 180 is formed to seal the light emitting unit 140.
- a support portion for fixing a portion corresponding to the first region 106 of the mask to the vapor deposition apparatus is provided in the second region 107. It can be overlapped. Therefore, the light emitting device 10 can be manufactured by patterning easily.
- the example of the bottom emission type light-emitting device 10 was shown in the present Example, it is not limited to it.
- the light emitting device 10 may be a top emission type.
- the second distance d 2 of the substrate 100 is smaller than the first distance d 1 as in the embodiment.
- the substrate 100 surrounds the first region 106.
- the substrate 100 is interrupted in the second region 107 connected to the first region 106. Therefore, twisting and wrinkling are unlikely to occur regardless of the shape of the mounting surface, and the light emitting device 10 can be mounted with good appearance.
- FIGS. 8A and 8B and FIGS. 9A to 9C are plan views illustrating the configuration of the light emitting device 10 according to this example.
- the light emitting device 10 according to the present example has the configuration of the light emitting device 10 according to at least one of the embodiment and the first example.
- FIGS. 8A and 8B and FIGS. 9A to 9C all show a state in which the substrate 100 is along a plane.
- the light-emitting device 10 can have various shapes and can improve design.
- the region where the substrate 100, the first region 106, and the second region 107 are combined a region (hereinafter referred to as “the region where the substrate 100, the first region 106, and the second region 107 are combined”).
- the first region 106 is located at the center of the entire region. Further, the outer shape of the entire region and the outer shape of the first region 106 are substantially similar, and the center of the entire region and the center of the first region 106 coincide.
- the center of the entire region does not coincide with the center of the first region 106 when viewed from the direction perpendicular to the first surface 101 of the substrate 100. Further, in the example of FIGS. 9A and 9B, the first region 106 is not located at the center of the entire region.
- the outer shape of the entire region and the outer shape of the first region 106 are substantially similar in the examples of FIGS. 9A and 9B, and are not similar in the example of FIG. 9C.
- the second end portion 104 is a straight line parallel to each other when viewed from the direction perpendicular to the first surface 101 of the substrate 100. It is.
- the second end portions 104 are the apexes of the substrate 100 when viewed from the direction perpendicular to the first surface 101 of the substrate 100.
- the entire area is circular as a whole. Further, at least a part of the end portion of the substrate 100 is curved. On the other hand, in the example of FIG. 8B, the entire area has a star shape when viewed from the direction perpendicular to the first surface 101. Further, the end portions of the substrate 100 are all linear. Note that the shape of the entire region is not limited to these examples, and may be a rectangle, a polygon, or the like.
- the light emitting device 10 has a corner portion when viewed from the direction perpendicular to the first surface 101.
- FIG. 8B Furthermore, in the example of FIG. 8B, the entire region has corners.
- FIG. 10 and FIG. 11 are diagrams showing examples in which a plurality of light emitting devices 10 illustrated in FIG. 8A are used in combination.
- five light emitting devices 10 are connected. Specifically, the substrate 100 of one light emitting device 10 is passed through the first region 106 of one or more other light emitting devices 10. In the example of FIG. 11, three light emitting devices 10 are combined. Specifically, at least a part of the adjacent light emitting devices 10 are overlapped with each other. As described above, various designs can be given depending on how the plurality of light emitting devices 10 are combined.
- the number of light emitting devices 10 to be combined is not particularly limited. 10 and 11 show examples of combining light emitting devices 10 having the same shape, a plurality of light emitting devices 10 including one or more light emitting devices 10 having different shapes may be combined. Further, the plurality of combined light emitting devices 10 may be controlled to emit light at the same timing, or may be controlled to emit light at different timings.
- the second distance d 2 of the substrate 100 is smaller than the first distance d 1 as in the embodiment.
- the substrate 100 surrounds the first region 106.
- the substrate 100 is interrupted in the second region 107 connected to the first region 106. Therefore, twisting and wrinkling are unlikely to occur regardless of the shape of the mounting surface, and the light emitting device 10 can be mounted with good appearance.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
This light emission device (10) is provided with a substrate (100) and a light emission unit (140). The light emission unit (140) is positioned on a first surface side of the substrate (100). Furthermore, the light emission unit (140) includes a first electrode, an organic layer, and a second electrode. The maximum distance between first ends (103) which face each other with a first area (106) therebetween, among the ends of the substrate (100), is referred to as a first distance d1. The distance between second ends (104) which face each other with a second area (107) therebetween, among the ends of the substrate (100), is referred to as a second distance d2. The second distance d2 is smaller than the first distance d1.
Description
本発明は、発光装置に関する。
The present invention relates to a light emitting device.
近年は有機ELを利用した発光装置の開発が進んでいる。この発光装置は、照明装置や表示装置として使用されており、第1電極と第2電極の間に有機層を挟んだ構成を有している。有機ELの応用例として、フレキシブルな発光装置が挙げられる。
In recent years, the development of light-emitting devices using organic EL has progressed. This light-emitting device is used as a lighting device or a display device, and has a configuration in which an organic layer is sandwiched between a first electrode and a second electrode. As an application example of organic EL, a flexible light-emitting device can be given.
特許文献1には、照明装置において島状エレクトロルミネッセンス層を環状にすることが記載されている。また、基板等に切り取り用のミシン目を設けることが記載されている。
Patent Document 1 describes that an island-shaped electroluminescence layer is formed into a ring shape in a lighting device. Further, it is described that a perforation for cutting is provided on a substrate or the like.
しかし、特許文献1に記載の照明装置では、基板が閉じた環状であることから、照明装置を曲面に設置しようとしたときにヨレやシワが生じるおそれがある。
However, in the illuminating device described in Patent Document 1, since the substrate is in a closed ring shape, there is a possibility that twisting and wrinkling may occur when attempting to install the illuminating device on a curved surface.
本発明が解決しようとする課題としては、取り付け面の形状によらず、見た目良く取り付けが可能な発光装置を提供することが一例として挙げられる。
An example of a problem to be solved by the present invention is to provide a light emitting device that can be mounted with a good appearance regardless of the shape of the mounting surface.
請求項1に記載の発明は、
基板と、
前記基板の第1面側に位置し、第1電極、有機層、及び第2電極を含む発光部とを備え、
前記基板の端部のうち第1領域を介して互いに対向する第1端部間の最大距離は第1距離であり、前記基板の端部のうち第2領域を介して互いに対向する第2端部間の距離は前記第1距離よりも小さな第2距離である発光装置である。 The invention described inclaim 1
A substrate,
A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer, and a second electrode;
The maximum distance between the first ends facing each other through the first region among the ends of the substrate is the first distance, and the second ends facing each other via the second region among the ends of the substrate. In the light emitting device, the distance between the parts is a second distance smaller than the first distance.
基板と、
前記基板の第1面側に位置し、第1電極、有機層、及び第2電極を含む発光部とを備え、
前記基板の端部のうち第1領域を介して互いに対向する第1端部間の最大距離は第1距離であり、前記基板の端部のうち第2領域を介して互いに対向する第2端部間の距離は前記第1距離よりも小さな第2距離である発光装置である。 The invention described in
A substrate,
A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer, and a second electrode;
The maximum distance between the first ends facing each other through the first region among the ends of the substrate is the first distance, and the second ends facing each other via the second region among the ends of the substrate. In the light emitting device, the distance between the parts is a second distance smaller than the first distance.
請求項2に記載の発明は、
基板と、
前記基板の第1面側に位置し、第1電極、有機層、及び第2電極を含む発光部とを備え、
前記基板は第1領域を囲っており、前記第1領域に繋がる第2領域において、前記基板が途切れている発光装置である。 The invention described in claim 2
A substrate,
A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer, and a second electrode;
In the light emitting device, the substrate surrounds a first region, and the substrate is interrupted in a second region connected to the first region.
基板と、
前記基板の第1面側に位置し、第1電極、有機層、及び第2電極を含む発光部とを備え、
前記基板は第1領域を囲っており、前記第1領域に繋がる第2領域において、前記基板が途切れている発光装置である。 The invention described in claim 2
A substrate,
A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer, and a second electrode;
In the light emitting device, the substrate surrounds a first region, and the substrate is interrupted in a second region connected to the first region.
請求項12に記載の発明は、
基板と、
前記基板の第1面側に位置し、第1電極、有機層及び第2電極を含む発光部と、
を備え、
前記基板は、
一の端部と、
前記一の端部と第1領域を介して対向する端部と、
前記基板の前記一の端部とは反対側の端部と、を有し、
前記一の端部と前記反対側の端部とは、前記基板の縁に沿って連続している発光装置である。 The invention according to claim 12
A substrate,
A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer and a second electrode;
With
The substrate is
One end,
An end facing the one end through the first region;
An end opposite to the one end of the substrate,
The one end and the opposite end are light emitting devices that are continuous along the edge of the substrate.
基板と、
前記基板の第1面側に位置し、第1電極、有機層及び第2電極を含む発光部と、
を備え、
前記基板は、
一の端部と、
前記一の端部と第1領域を介して対向する端部と、
前記基板の前記一の端部とは反対側の端部と、を有し、
前記一の端部と前記反対側の端部とは、前記基板の縁に沿って連続している発光装置である。 The invention according to claim 12
A substrate,
A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer and a second electrode;
With
The substrate is
One end,
An end facing the one end through the first region;
An end opposite to the one end of the substrate,
The one end and the opposite end are light emitting devices that are continuous along the edge of the substrate.
上述した目的、およびその他の目的、特徴および利点は、以下に述べる好適な実施の形態、およびそれに付随する以下の図面によってさらに明らかになる。
The above-described object and other objects, features, and advantages will be further clarified by a preferred embodiment described below and the following drawings attached thereto.
以下、本発明の実施の形態について、図面を用いて説明する。尚、すべての図面において、同様な構成要素には同様の符号を付し、適宜説明を省略する。
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.
図1は、実施形態に係る発光装置10の構成を例示する平面図である。図1では、基板100および発光部140の関係が例示されており、基板100の第1面に垂直な方向から見た状態が示されている。
FIG. 1 is a plan view illustrating the configuration of a light emitting device 10 according to the embodiment. FIG. 1 illustrates the relationship between the substrate 100 and the light emitting unit 140, and shows a state viewed from a direction perpendicular to the first surface of the substrate 100.
本実施形態において発光装置10は基板100および発光部140を備える。発光部140は、基板100の第1面側に位置する。また、発光部140は、第1電極、有機層、及び第2電極を含む。発光装置10は照明装置、またはディスプレイ等の表示装置である。また、発光装置10は、車両に取り付けられ、ブレーキランプ等として用いられてもよい。
In the present embodiment, the light emitting device 10 includes a substrate 100 and a light emitting unit 140. The light emitting unit 140 is located on the first surface side of the substrate 100. The light emitting unit 140 includes a first electrode, an organic layer, and a second electrode. The light emitting device 10 is a lighting device or a display device such as a display. The light emitting device 10 may be attached to a vehicle and used as a brake lamp or the like.
また、本実施形態において、基板100の端部のうち第1領域106を介して互いに対向する第1端部103間の最大距離は第1距離d1である。基板100の端部のうち第2領域107を介して互いに対向する第2端部104間の距離は第2距離d2である。そして、第2距離d2は第1距離d1よりも小さい。以下に詳しく説明する。
Further, in the present embodiment, the maximum distance between the first end portion 103 opposed to each other via the first region 106 of the end portion of the substrate 100 is a first distance d 1. The distance between the second end 104 facing each other with the second region 107 of the end portion of the substrate 100 is the second distance d 2. Then, the second distance d 2 smaller than the first distance d 1. This will be described in detail below.
本実施形態において、基板100は第1領域106を囲っている。そして、第1領域106に繋がる第2領域107において、基板100が途切れている。
In the present embodiment, the substrate 100 surrounds the first region 106. The substrate 100 is interrupted in the second region 107 connected to the first region 106.
言い換えると、第2領域107は、第1領域106と、基板100の外側に位置する外部領域108とを繋いでいる。さらに言い換えると、第1領域106は基板100の中空部であり、第2領域107は基板100の切り欠き部である。基板100は一部が途切れた枠状であると言え、第1領域106はその枠の内側の領域であり、外部領域108はその枠の外側の領域である。また、外部領域108は、基板100、第1領域106、および第2領域107とは別の領域であり、基板100、第1領域106、および第2領域107を合わせた領域を囲う領域である。
In other words, the second region 107 connects the first region 106 and the external region 108 located outside the substrate 100. In other words, the first region 106 is a hollow portion of the substrate 100, and the second region 107 is a notch portion of the substrate 100. It can be said that the substrate 100 has a frame shape with a part cut off. The first area 106 is an area inside the frame, and the external area 108 is an area outside the frame. The external region 108 is a region different from the substrate 100, the first region 106, and the second region 107, and is a region that surrounds the region where the substrate 100, the first region 106, and the second region 107 are combined. .
また、本実施形態において、基板100は、第1端部103a、第1端部103bおよび第3端部105aを有し、第1端部103aと第3端部105aとが基板100の縁に沿って連続している。ここで、第1端部103aは基板100の一の端部であり、第1端部103bは、第1端部103aと第1領域106を介して対向する端部である。そして、第3端部105aは、基板100の第1端部103aとは反対側の端部である。
In the present embodiment, the substrate 100 has a first end 103a, a first end 103b, and a third end 105a, and the first end 103a and the third end 105a are at the edge of the substrate 100. It is continuous along. Here, the first end portion 103 a is one end portion of the substrate 100, and the first end portion 103 b is an end portion that faces the first end portion 103 a via the first region 106. The third end portion 105 a is an end portion on the side opposite to the first end portion 103 a of the substrate 100.
このように本実施形態に係る発光装置10は、第1領域106を囲う基板100が第2領域107で途切れている。したがって、基板100をたとえば曲面に沿うように配置した場合であっても、寸法の過不足を第2領域107が吸収することにより、発光装置10にヨレやシワが生じにくくなる。また、デザイン性に優れる発光装置10を得られる。
As described above, in the light emitting device 10 according to this embodiment, the substrate 100 surrounding the first region 106 is interrupted in the second region 107. Therefore, even when the substrate 100 is arranged along, for example, a curved surface, the second region 107 absorbs the excess or deficiency of dimensions, so that the light emitting device 10 is less likely to be twisted or wrinkled. Moreover, the light-emitting device 10 excellent in design can be obtained.
本図の例において、基板100は全体として、中がくり抜かれたハート型をしている。くり抜かれた部分が第1領域106である。ただし、基板100および発光部140の形状は本例に限定されず、円形、矩形、多角形、星形等であっても良い。ただし、発光部140の縁の少なくとも一部は基板100の縁に沿っていることが好ましい。また、基板100は環状に閉じてはおらず、上記した通り第2領域107で途切れている。
In the example of this figure, the substrate 100 as a whole has a heart shape with a hollow inside. The hollowed out portion is the first region 106. However, the shapes of the substrate 100 and the light emitting unit 140 are not limited to this example, and may be a circle, a rectangle, a polygon, a star, or the like. However, it is preferable that at least a part of the edge of the light emitting unit 140 is along the edge of the substrate 100. Further, the substrate 100 is not closed in an annular shape, and is interrupted in the second region 107 as described above.
発光部140は、第1電極、有機層、及び第2電極を含む積層構造を有する。本図の例において、基板100の第1面には複数の発光部140が設けられている。具体的には、発光装置10は、二つの発光部140のセグメントを有している。複数の発光部140は全体として基板100と同様の形状を有している。ただし、本図の例に限定されず、基板100の第1面には発光部140が一つのみ設けられていても良い。また、発光部140の形状は第1面に垂直な方向から見て基板100の形状とは異なっていても良い。
The light emitting unit 140 has a stacked structure including a first electrode, an organic layer, and a second electrode. In the example of this figure, a plurality of light emitting portions 140 are provided on the first surface of the substrate 100. Specifically, the light emitting device 10 has two light emitting unit 140 segments. The plurality of light emitting units 140 have the same shape as the substrate 100 as a whole. However, it is not limited to the example of this figure, The light emitting part 140 may be provided in the 1st surface of the board | substrate 100 only. Further, the shape of the light emitting unit 140 may be different from the shape of the substrate 100 when viewed from the direction perpendicular to the first surface.
発光装置10は平面状であっても良いし、曲面状であっても良い。また、発光装置10は可撓性を有していてもよい。すなわち、基板100は平面状であっても良いし、曲面状であっても良い。また、基板100は可撓性を有していてもよい。本実施形態に係る発光装置10は、基板100を平面に沿わせたとき、第2端部104が対向するよう構成されている。また、本実施形態に係る発光装置10は、基板100を平面に沿わせたとき、第1端部103が対向するよう構成されている。
The light emitting device 10 may be flat or curved. In addition, the light emitting device 10 may have flexibility. That is, the substrate 100 may be planar or curved. Further, the substrate 100 may have flexibility. The light emitting device 10 according to the present embodiment is configured such that the second end portion 104 faces the substrate 100 when the substrate 100 is along a plane. In addition, the light emitting device 10 according to the present embodiment is configured such that the first end portion 103 faces the substrate 100 when the substrate 100 is along a plane.
本図の例において、基板100を平面に沿わせたとき、第1面に垂直な方向から見て、基板100の端部の少なくとも一部は曲線状である。具体的には、基板100の端部の内、第1端部103および第3端部105は曲線上である。また、本図の例において、基板100を平面に沿わせたとき、基板100は第1面に垂直な方向から見て角部を有する。
In the example of this figure, when the substrate 100 is set along a plane, at least a part of the end of the substrate 100 is curved as viewed from the direction perpendicular to the first surface. Specifically, among the end portions of the substrate 100, the first end portion 103 and the third end portion 105 are on a curve. Moreover, in the example of this figure, when the board | substrate 100 is made to follow a plane, the board | substrate 100 has a corner | angular part seeing from a direction perpendicular | vertical to a 1st surface.
基板100は、互いに対向する一組以上の第1端部103を有している。すなわち第1端部103は、互いに対向する第1端部103aと第1端部103bとを含む。第1端部103は基板100の内周の縁である。第1端部103aと第1端部103bは直接、または他の端部を介して互いに繋がっている。基板100の第1面に垂直な方向から見て、第1端部103aと第1端部103bとは、互いに平行であっても良いし、非平行であっても良い。また、第1端部103aおよび第1端部103bはそれぞれ直線であっても良いし曲線であっても良い。第1端部103aおよび第1端部103bは、いずれも第1領域106に面している。
The substrate 100 has one or more sets of first ends 103 facing each other. That is, the first end portion 103 includes a first end portion 103a and a first end portion 103b that face each other. The first end 103 is an inner peripheral edge of the substrate 100. The first end 103a and the first end 103b are connected to each other directly or via another end. When viewed from the direction perpendicular to the first surface of the substrate 100, the first end 103a and the first end 103b may be parallel to each other or non-parallel. Further, the first end 103a and the first end 103b may each be a straight line or a curved line. Both the first end portion 103 a and the first end portion 103 b face the first region 106.
基板100は、第3端部105を有している。第3端部105は基板100の外周の縁である。本図の例において、第3端部105は第3端部105aと第3端部105bとを含む。第3端部105aは基板100の第1端部103aとは反対側の端部であり、第3端部105bは、基板100の第1端部103bとは反対側の端部である。第3端部105aと第3端部105bは直接、または他の端部を介して互いに繋がっている。基板100の第1面に垂直な方向から見て、第3端部105aと第3端部105bとは、互いに平行であっても良いし、非平行であっても良い。また、第3端部105aおよび第3端部105bはそれぞれ直線であっても良いし曲線であっても良い。第3端部105aおよび第3端部105bは、いずれも外部領域108に面している。本図の例において、第1端部103と第3端部105とは互いに略相似であるが、第1端部103と第3端部105とは互いに異なる形状であっても良い。
The substrate 100 has a third end 105. The third end portion 105 is an outer peripheral edge of the substrate 100. In the example of the figure, the third end portion 105 includes a third end portion 105a and a third end portion 105b. The third end 105a is the end opposite to the first end 103a of the substrate 100, and the third end 105b is the end opposite to the first end 103b of the substrate 100. The third end portion 105a and the third end portion 105b are connected to each other directly or via another end portion. When viewed from the direction perpendicular to the first surface of the substrate 100, the third end portion 105a and the third end portion 105b may be parallel to each other or non-parallel. Further, the third end portion 105a and the third end portion 105b may each be a straight line or a curved line. Both the third end portion 105 a and the third end portion 105 b face the external region 108. In the example of this figure, the first end portion 103 and the third end portion 105 are substantially similar to each other, but the first end portion 103 and the third end portion 105 may have different shapes.
基板100は、互いに対向する一組以上の第2端部104を有している。すなわち第2端部104は、互いに対向する第2端部104aと第2端部104bとを含む。本図の例において第2端部104は第1端部103と第3端部105とを繋いでいる。具体的には、第2端部104aは第1端部103aと第3端部105aとを繋いでおり、第2端部104bは第1端部103bと第3端部105bとを繋いでいる。また、第2端部104aの一端と第2端部104bの一端とは、少なくとも第1端部103aおよび第1端部103bを介して繋がっており、第2端部104aの他端と第2端部104bの他端とは、少なくとも第3端部105aおよび第3端部105bを介して繋がっている。そして、第1端部103、第2端部104、および第3端部105は合わせて、一つの閉じた領域を形成しており、この領域は基板100が存在する領域に一致する。基板100の第1面に垂直な方向から見て、第2端部104aと第2端部104bとは、互いに平行であっても良いし、非平行であっても良い。また、第2端部104aおよび第2端部104bはそれぞれ直線であっても良いし、曲線であっても良いし、基板100の頂点であっても良い。第2端部104aおよび第2端部104bは、いずれも第2領域107に面している。
The substrate 100 has one or more sets of second ends 104 facing each other. That is, the second end 104 includes a second end 104a and a second end 104b that face each other. In the example shown in the figure, the second end 104 connects the first end 103 and the third end 105. Specifically, the second end 104a connects the first end 103a and the third end 105a, and the second end 104b connects the first end 103b and the third end 105b. . In addition, one end of the second end 104a and one end of the second end 104b are connected via at least the first end 103a and the first end 103b, and the second end 104a and the second end 104a are connected to the second end 104a. The other end of the end 104b is connected via at least the third end 105a and the third end 105b. The first end portion 103, the second end portion 104, and the third end portion 105 together form one closed region, and this region coincides with the region where the substrate 100 exists. When viewed from the direction perpendicular to the first surface of the substrate 100, the second end 104a and the second end 104b may be parallel to each other or non-parallel. Further, each of the second end portion 104 a and the second end portion 104 b may be a straight line, a curved line, or the apex of the substrate 100. Both the second end portion 104 a and the second end portion 104 b face the second region 107.
図2は、発光装置10の使用状態の例を示す図である。本図の例では、複数の発光装置10が組み合わせて使用されている。
FIG. 2 is a diagram illustrating an example of a usage state of the light emitting device 10. In the example of this figure, a plurality of light emitting devices 10 are used in combination.
上記した通り、本実施形態において第1距離d1は、第1領域106を介して互いに対向する基板100の第1端部103間の最大距離である。第2距離d2は、第2領域107を介して互いに対向する基板100の第2端部104間の距離である。そして、第1距離d1は第2距離d2よりも大きい。
As described above, in the present embodiment, the first distance d 1 is the maximum distance between the first ends 103 of the substrates 100 facing each other with the first region 106 interposed therebetween. The second distance d 2 is a distance between the second end portions 104 of the substrates 100 facing each other with the second region 107 interposed therebetween. The first distance d 1 is greater than the second distance d 2.
このような形状を有することにより、一の発光装置10の基板100を他の発光装置10の第1領域106に通して連結させることができる。そうすることで、複数の発光装置10を用いて全体のデザイン性をさらに高めることができる。
By having such a shape, the substrate 100 of one light emitting device 10 can be connected through the first region 106 of another light emitting device 10. By doing so, it is possible to further improve the overall design using a plurality of light emitting devices 10.
複数の発光装置10を連結させたときに外れにくくする観点から、第2端部104の幅である第1幅w1は、第2距離d2よりも大きいことが好ましい。また、同様の観点から、第2幅w2は、第2距離d2よりも大きいことが好ましい。ここで第2幅w2は、第1端部103を一端とし、第1端部103とは反対側の第3端部105を他端とする基板100の幅のうち、最小の幅である。
From the viewpoint of making it difficult for the plurality of light emitting devices 10 to come off, the first width w 1 that is the width of the second end 104 is preferably larger than the second distance d 2 . From the same viewpoint, the second width w 2 is preferably larger than the second distance d 2 . Here, the second width w 2 is the smallest width of the widths of the substrate 100 having the first end 103 as one end and the third end 105 opposite to the first end 103 as the other end. .
なお、複数の発光装置10を組み合わせて用いる場合、必ずしも一の発光装置10の基板100を他の発光装置10の第1領域106に通す必要はない。たとえば、隣り合う発光装置10の少なくとも一部分を互いに重ね合わせて並べても良い。
When a plurality of light emitting devices 10 are used in combination, it is not always necessary to pass the substrate 100 of one light emitting device 10 through the first region 106 of another light emitting device 10. For example, at least a part of the adjacent light emitting devices 10 may be arranged so as to overlap each other.
以上、本実施形態によれば、基板100の第2距離d2は第1距離d1よりも小さい。言い換えると、基板100は第1領域106を囲っている。そして、第1領域106に繋がる第2領域107において、基板100が途切れている。したがって、取り付け面の形状によらずヨレやシワが生じにくく、発光装置10を見た目良く取り付けが可能である。
As described above, according to this embodiment, the second distance d 2 of the substrate 100 is less than the first distance d 1. In other words, the substrate 100 surrounds the first region 106. The substrate 100 is interrupted in the second region 107 connected to the first region 106. Therefore, twisting and wrinkling are unlikely to occur regardless of the shape of the mounting surface, and the light emitting device 10 can be mounted with good appearance.
(実施例1)
図3は、実施例1に係る発光装置10の構成を例示する断面図である。本図は、図1のA-A断面に相当する。本断面は、第1端部103を一端とし、第3端部105を他端とする幅方向の断面である。本実施例に係る発光装置10は、実施形態に係る発光装置10と同じ構成を有している。 Example 1
FIG. 3 is a cross-sectional view illustrating the configuration of thelight emitting device 10 according to the first embodiment. This figure corresponds to the AA cross section of FIG. This cross section is a cross section in the width direction having the first end 103 as one end and the third end 105 as the other end. The light emitting device 10 according to this example has the same configuration as the light emitting device 10 according to the embodiment.
図3は、実施例1に係る発光装置10の構成を例示する断面図である。本図は、図1のA-A断面に相当する。本断面は、第1端部103を一端とし、第3端部105を他端とする幅方向の断面である。本実施例に係る発光装置10は、実施形態に係る発光装置10と同じ構成を有している。 Example 1
FIG. 3 is a cross-sectional view illustrating the configuration of the
発光部140は、基板100の第1面101に設けられており、第1電極110、有機層120、及び第2電極130を含む積層構造を有する。
The light emitting unit 140 is provided on the first surface 101 of the substrate 100 and has a stacked structure including the first electrode 110, the organic layer 120, and the second electrode 130.
基板100の形状や材料は特に限定されないが、基板100は例えばガラス基板や樹脂基板などの透光性を有する基板である。基板100は可撓性を有していてもよい。可撓性を有している場合、基板100の厚さは、例えば10μm以上1000μm以下である。基板100が樹脂基板である場合、基板100は、例えばPEN(ポリエチレンナフタレート)、PES(ポリエーテルサルホン)、PET(ポリエチレンテレフタラート)、又はポリイミドを用いて形成されている。また、基板100が樹脂基板である場合、水分が基板100を透過することを抑制するために、基板100の少なくとも一面(好ましくは両面)に、SiNxやSiONなどの無機バリア膜が形成されているのが好ましい。
Although the shape and material of the substrate 100 are not particularly limited, the substrate 100 is a light-transmitting substrate such as a glass substrate or a resin substrate. The substrate 100 may have flexibility. In the case of flexibility, the thickness of the substrate 100 is, for example, not less than 10 μm and not more than 1000 μm. When the substrate 100 is a resin substrate, the substrate 100 is formed using, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. When the substrate 100 is a resin substrate, an inorganic barrier film such as SiN x or SiON is formed on at least one surface (preferably both surfaces) of the substrate 100 in order to prevent moisture from permeating the substrate 100. It is preferable.
基板100の第1面101には発光部140が形成されている。発光部140は、透光性の第1電極110、有機層120、および遮光性の第2電極130がこの順に積層された積層構造からなる。そして、第1電極110は、基板100と第2電極130との間に位置する。したがって、発光部140が発光する光のうち、第1電極110側に出力される光は、第2電極130側に出力される光よりも高強度になる。すなわち、基板100の第1面101とは反対側の第2面102が光の出力面となる。
A light emitting unit 140 is formed on the first surface 101 of the substrate 100. The light emitting unit 140 has a laminated structure in which a translucent first electrode 110, an organic layer 120, and a light-shielding second electrode 130 are laminated in this order. The first electrode 110 is located between the substrate 100 and the second electrode 130. Therefore, of the light emitted from the light emitting unit 140, the light output to the first electrode 110 side has higher intensity than the light output to the second electrode 130 side. That is, the second surface 102 opposite to the first surface 101 of the substrate 100 is a light output surface.
第1電極110は、光透過性を有する透明電極である。透明電極の材料は、金属を含む材料、例えば、ITO(Indium Tin Oxide)、IZO(Indium Zinc Oxide)、IWZO(Indium Tungsten Zinc Oxide)、ZnO(Zinc Oxide)等の金属酸化物である。第1電極110の厚さは、例えば10nm以上500nm以下である。第1電極110は、例えばスパッタリング法又は蒸着法を用いて形成される。なお、第1電極110は、カーボンナノチューブ、又はPEDOT/PSSなどの導電性有機材料であってもよい。
The first electrode 110 is a transparent electrode having optical transparency. The material of the transparent electrode is a metal-containing material, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide). The thickness of the first electrode 110 is, for example, not less than 10 nm and not more than 500 nm. The first electrode 110 is formed using, for example, a sputtering method or a vapor deposition method. The first electrode 110 may be a carbon nanotube or a conductive organic material such as PEDOT / PSS.
有機層120は発光層を有している。有機層120は、例えば、正孔注入層、発光層、及び電子注入層をこの順に積層させた構成を有している。正孔注入層と発光層との間には正孔輸送層が形成されていてもよい。また、発光層と電子注入層との間には電子輸送層が形成されていてもよい。有機層120は蒸着法で形成されてもよい。また、有機層120のうち少なくとも一つの層、例えば第1電極110と接触する層は、インクジェット法、印刷法、又はスプレー法などの塗布法によって形成されてもよい。なお、この場合、有機層120の残りの層は、蒸着法によって形成されていてもよく、また、有機層120のすべての層が、塗布法を用いて形成されていてもよい。
The organic layer 120 has a light emitting layer. The organic layer 120 has a configuration in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 120 may be formed by a vapor deposition method. In addition, at least one layer of the organic layer 120, for example, a layer in contact with the first electrode 110, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 120 may be formed by an evaporation method, or all the layers of the organic layer 120 may be formed by a coating method.
第2電極130は、例えば、Al、Au、Ag、Pt、Mg、Sn、Zn、及びInからなる群の中から選択される金属、又はこの群から選択される金属の合金からなる金属層を含んでいる。この場合、第2電極130は遮光性を有している。第2電極130の厚さは、例えば10nm以上500nm以下である。第2電極130は、例えばスパッタリング法又は蒸着法を用いて形成される。本図に示す例において、第2電極130は、第1電極110よりも広くなっている。このため、基板100の第1面101に垂直な方向から見た場合において、第1端部103を一端とし、第3端部105を他端とする幅方向において第1電極110の全体が第2電極130と重なっており、また第2電極130に覆われている。なお、第1電極110は、第2電極130よりも幅が広く、基板100の第1面101に垂直な方向から見た場合の幅方向において第2電極130の全体が第1電極110に重なっていてもよい。
The second electrode 130 is, for example, a metal layer made of a metal selected from the group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of a metal selected from this group. Contains. In this case, the second electrode 130 has a light shielding property. The thickness of the second electrode 130 is, for example, not less than 10 nm and not more than 500 nm. The second electrode 130 is formed using, for example, a sputtering method or a vapor deposition method. In the example shown in the drawing, the second electrode 130 is wider than the first electrode 110. For this reason, when viewed from the direction perpendicular to the first surface 101 of the substrate 100, the entire first electrode 110 in the width direction with the first end 103 as one end and the third end 105 as the other end is It overlaps with the two electrodes 130 and is covered with the second electrode 130. The first electrode 110 is wider than the second electrode 130, and the entire second electrode 130 overlaps the first electrode 110 in the width direction when viewed from the direction perpendicular to the first surface 101 of the substrate 100. It may be.
本図の例において、第1電極110は複数の領域に分かれているが、第1電極110は第1面101上で一体であっても良い。その場合、第1面101には一つの発光部140が形成されていても良い。また、本図の例において、第1電極110は発光部140毎に形成されているが、第1電極110は複数の発光部140にわたって連続して形成されていても良い。本図の例において、有機層120および第2電極130は複数の発光部140にわたって連続して形成されている。ただし、本図の例に限定されず、有機層120および第2電極130の少なくとも一方は、発光部140毎に形成されていても良い。
In the example of this figure, the first electrode 110 is divided into a plurality of regions, but the first electrode 110 may be integrated on the first surface 101. In that case, one light emitting unit 140 may be formed on the first surface 101. Moreover, in the example of this figure, although the 1st electrode 110 is formed for every light emission part 140, the 1st electrode 110 may be continuously formed over the several light emission part 140. FIG. In the example of this figure, the organic layer 120 and the second electrode 130 are continuously formed over the plurality of light emitting portions 140. However, it is not limited to the example of this figure, At least one of the organic layer 120 and the 2nd electrode 130 may be formed for every light emission part 140. FIG.
第1電極110の縁は、少なくとも一部が絶縁膜150によって覆われている。絶縁膜150は例えばポリイミドなどの感光性の樹脂材料によって形成されており、第1電極110のうち発光部140となる部分を囲っている。本図の例では、基板100の第1面101に垂直な方向から見た場合において、絶縁膜150の一部は第2電極130からはみ出ている。そして、本図に示す例において、第2電極130は絶縁膜150の上にも形成されている。また、基板100の第1面101に垂直な方向から見た場合において、有機層120の一部は絶縁膜150と重なっている。そして、本図に示す例において、有機層120は絶縁膜150の上にも形成されている。
The edge of the first electrode 110 is at least partially covered with the insulating film 150. The insulating film 150 is made of, for example, a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that becomes the light emitting portion 140. In the example of this figure, when viewed from a direction perpendicular to the first surface 101 of the substrate 100, a part of the insulating film 150 protrudes from the second electrode 130. In the example shown in this drawing, the second electrode 130 is also formed on the insulating film 150. In addition, when viewed from a direction perpendicular to the first surface 101 of the substrate 100, a part of the organic layer 120 overlaps with the insulating film 150. In the example shown in this figure, the organic layer 120 is also formed on the insulating film 150.
本実施例に係る発光装置10は、封止膜180をさらに備える。封止膜180は、発光部140の全体を覆うよう形成されている。発光部140は封止膜180と基板100との間に位置する。封止膜180としては、例えば、SiNx、SiON、Al2O3、TiO2、SiO2、SiOCなどの無機バリア膜や、それらを含むバリア積層膜、またはそれらの混合膜を用いることができる。これらは、例えば、スパッタリング法、CVD法、ALD法、EB蒸着法などの真空成膜法で形成することができる。本図の例において、封止膜180の一部は第1面101に接している。なお、発光装置10は、封止膜180の代わりにまたは、封止膜180に加えて、板状の封止部材を用いて封止されていても良い。
The light emitting device 10 according to this example further includes a sealing film 180. The sealing film 180 is formed so as to cover the entire light emitting unit 140. The light emitting unit 140 is located between the sealing film 180 and the substrate 100. As the sealing film 180, for example, an inorganic barrier film such as SiN x , SiON, Al 2 O 3 , TiO 2 , SiO 2 , or SiOC, a barrier laminated film including them, or a mixed film thereof can be used. . These can be formed by, for example, a vacuum film forming method such as a sputtering method, a CVD method, an ALD method, or an EB vapor deposition method. In the example of this figure, a part of the sealing film 180 is in contact with the first surface 101. The light emitting device 10 may be sealed using a plate-shaped sealing member instead of or in addition to the sealing film 180.
図12は、発光装置10の構造の変形例を示す断面図である。本変形例において発光装置10は封止膜180の代わりに封止部材200、接着層210、および乾燥剤220を備える。封止部材200は金属、樹脂またはガラスであり、凹部を有する。乾燥剤220はたとえばCaOまたはBaOを含む。封止部材200は発光部140を覆っており、封止部材200の面の少なくとも一部には乾燥剤220が形成されている。封止部材200は、接着層210を介して基板100に固定されている。乾燥剤220を設けた封止部材200を、接着層210を介して発光部140上に積層し、封止部材200の縁部を基板100に向けて押圧することにより、発光部140を封止部材200等で封止することができる。
FIG. 12 is a cross-sectional view showing a modified example of the structure of the light emitting device 10. In this modification, the light emitting device 10 includes a sealing member 200, an adhesive layer 210, and a desiccant 220 instead of the sealing film 180. The sealing member 200 is made of metal, resin, or glass and has a recess. The desiccant 220 contains, for example, CaO or BaO. The sealing member 200 covers the light emitting unit 140, and a desiccant 220 is formed on at least a part of the surface of the sealing member 200. The sealing member 200 is fixed to the substrate 100 via the adhesive layer 210. The sealing member 200 provided with the desiccant 220 is stacked on the light emitting unit 140 via the adhesive layer 210, and the light emitting unit 140 is sealed by pressing the edge of the sealing member 200 toward the substrate 100. It can be sealed with the member 200 or the like.
図3に戻り、発光装置10は、基板100の第1面101側に、導電部170をさらに備える。導電部170は発光部140と基板100の端部との間に位置する。具体的には、基板100の第1面101に垂直な方向から見て、発光部140の外周と基板100の外周とは離れている。そして、導電部170は、発光部140の外周と基板100の外周との間に位置し、発光部140の外周および基板100の外周に沿って延在している。導電部170は、第1電極110と電気的に接続されている。本図の例において詳しくは、導電部170は、複数の発光部140の外周のうち最も第3端部105側で第3端部105に沿っている部分と第3端部105との間に位置する。また、導電部170は、複数の発光部140の外周のうち最も第1端部103側で第1端部103に沿っている部分と第1端部103との間に位置する。なお、発光装置10が発光部140を一つのみ有する場合、導電部170は、発光部140の外周に沿って発光部140を囲うように設けられればよい。
3, the light emitting device 10 further includes a conductive portion 170 on the first surface 101 side of the substrate 100. The conductive part 170 is located between the light emitting part 140 and the end of the substrate 100. Specifically, when viewed from a direction perpendicular to the first surface 101 of the substrate 100, the outer periphery of the light emitting unit 140 is separated from the outer periphery of the substrate 100. The conductive portion 170 is located between the outer periphery of the light emitting portion 140 and the outer periphery of the substrate 100, and extends along the outer periphery of the light emitting portion 140 and the outer periphery of the substrate 100. The conductive part 170 is electrically connected to the first electrode 110. Specifically, in the example of this figure, the conductive portion 170 is between the third end portion 105 and the portion of the outer periphery of the plurality of light emitting portions 140 that is closest to the third end portion 105 along the third end portion 105. To position. Further, the conductive portion 170 is located between the first end portion 103 and the portion of the outer periphery of the plurality of light emitting portions 140 that is closest to the first end portion 103 and along the first end portion 103. When the light emitting device 10 has only one light emitting unit 140, the conductive unit 170 may be provided so as to surround the light emitting unit 140 along the outer periphery of the light emitting unit 140.
導電部170は第1電極110の材料より導電率の高い材料を含む。そして、導電部170の電気抵抗率は、第1電極110の電気抵抗率よりも低い。導電部170はたとえば、Al、Ag、Moおよびこれらを含む合金から成る群から選択される金属を含む。具体的には、導電部170はAPC(AgPdCu)等であり得る。また導電部170は、例えばMo又はMo合金などの第1金属層、Al又はAl合金などの第2金属層、及びMo又はMo合金などの第3金属層をこの順に積層させた構成を有していてもよい。本図の例において、導電部170は基板100と第1電極110との間に位置しているが、導電部170は、第1電極110を基準に基板100とは反対側に位置していてもよい。
The conductive part 170 includes a material having a higher conductivity than the material of the first electrode 110. In addition, the electrical resistivity of the conductive part 170 is lower than the electrical resistivity of the first electrode 110. Conductive portion 170 includes, for example, a metal selected from the group consisting of Al, Ag, Mo, and alloys containing these. Specifically, the conductive part 170 may be APC (AgPdCu) or the like. The conductive portion 170 has a configuration in which, for example, a first metal layer such as Mo or Mo alloy, a second metal layer such as Al or Al alloy, and a third metal layer such as Mo or Mo alloy are laminated in this order. It may be. In the example of this figure, the conductive portion 170 is located between the substrate 100 and the first electrode 110, but the conductive portion 170 is located on the opposite side of the substrate 100 with respect to the first electrode 110. Also good.
図4~図7は、本実施例に係る発光装置10の構成を例示する平面図である。図4~図7は発光装置10を基板100の第1面101側、すなわち光の出力面とは逆側から見た状態を示している。図4において、封止膜180は破線で示されている。図5は、図4から封止膜180および第2電極130を除いた図であり、有機層120の外周が破線で示されている。図6は、図5から有機層120および絶縁膜150を除いた図である。図7は、図6から第1電極110を除いた図であり、発光部140の外周が破線で示されている。
4 to 7 are plan views illustrating the configuration of the light emitting device 10 according to this embodiment. 4 to 7 show the light emitting device 10 as viewed from the first surface 101 side of the substrate 100, that is, from the side opposite to the light output surface. In FIG. 4, the sealing film 180 is indicated by a broken line. FIG. 5 is a diagram in which the sealing film 180 and the second electrode 130 are removed from FIG. 4, and the outer periphery of the organic layer 120 is indicated by a broken line. FIG. 6 is a view obtained by removing the organic layer 120 and the insulating film 150 from FIG. FIG. 7 is a diagram in which the first electrode 110 is removed from FIG. 6, and the outer periphery of the light emitting unit 140 is indicated by a broken line.
発光装置10は、第1端子112、および第2端子132さらに備える。図7を参照して第1端子112および第2端子132について詳しく説明する。第1端子112および第2端子132はいずれも基板100のうち発光部140と同一面側に形成されている。第1端子112及び第2端子132は少なくとも一部が封止膜180の外部に位置している。
The light emitting device 10 further includes a first terminal 112 and a second terminal 132. The first terminal 112 and the second terminal 132 will be described in detail with reference to FIG. Both the first terminal 112 and the second terminal 132 are formed on the same side of the substrate 100 as the light emitting unit 140. At least a part of the first terminal 112 and the second terminal 132 is located outside the sealing film 180.
第1端子112は、第1電極110と電気的に接続されている。本図に示す例において、第1端子112は導電部170と繋がっている。第1端子112は第1端子112aから第1端子112dを含む。また、第1端子112aは、導電部170aの延在方向の両端に位置する。ここで導電部170aは、複数の発光部140の外周のうち最も第3端部105側で第3端部105に沿っている部分と第3端部105との間に位置する導電部170である。第1端子112bは、導電部170bの延在方向の両端に位置する。ここで、導電部170bは、複数の発光部140の外周のうち最も第1端部103側で第1端部103に沿っている部分と第1端部103との間に位置する導電部170である。第1端子112aおよび第1端子112bは第2端部104に配置されている。二つの第1端子112aは互いに対向しており、二つの第1端子112bは互いに対向している。第1端子112cは、導電部170aの途中の部分に接続されており、導電部170aと第3端部105との間に位置する。第1端子112dは、導電部170bの途中の部分に接続されており、導電部170bと第1端部103との間に位置する。なお、発光装置10は、第1端子112aから第1端子112dのうち少なくともいずれかを含まなくても良いし、さらに他の第1端子112を備えていても良い。
The first terminal 112 is electrically connected to the first electrode 110. In the example shown in this drawing, the first terminal 112 is connected to the conductive portion 170. The first terminal 112 includes the first terminal 112a to the first terminal 112d. The first terminals 112a are located at both ends in the extending direction of the conductive portion 170a. Here, the conductive portion 170 a is a conductive portion 170 located between the third end portion 105 and the portion of the outer periphery of the plurality of light emitting portions 140 that is closest to the third end portion 105 and along the third end portion 105. is there. The first terminals 112b are located at both ends in the extending direction of the conductive portion 170b. Here, the conductive portion 170 b is located between the first end portion 103 and the portion of the outer periphery of the plurality of light emitting portions 140 that is closest to the first end portion 103 and along the first end portion 103. It is. The first terminal 112 a and the first terminal 112 b are disposed at the second end 104. The two first terminals 112a face each other, and the two first terminals 112b face each other. The first terminal 112 c is connected to a middle portion of the conductive portion 170 a and is located between the conductive portion 170 a and the third end portion 105. The first terminal 112 d is connected to a middle portion of the conductive portion 170 b and is located between the conductive portion 170 b and the first end portion 103. Note that the light emitting device 10 may not include at least one of the first terminal 112a to the first terminal 112d, and may further include another first terminal 112.
第2端子132は、第2電極130と電気的に接続されている。本図に示す例において、第2電極130の少なくとも一部は絶縁膜150を乗り越えて第2端子132に接続されている。第2端子132は第2端子132aから第2端子132cを含む。第2端子132aは、第2端部104に配置されており、二つの第2端子132aは互いに対向している。第2端子132bは、導電部170aと第3端部105との間に位置する。第2端子132cは、導電部170bと第1端部103との間に位置する。第2端子132bは第1端子112cと並んでおり、第2端子132cは第1端子112dと並んでいる。第2端子132aは、第1端子112aと第1端子112bとの間に位置する。なお、発光装置10は、第2端子132aから第2端子132cのうち少なくともいずれかを含まなくても良いし、さらに他の第2端子132を備えていても良い。
The second terminal 132 is electrically connected to the second electrode 130. In the example shown in this figure, at least a part of the second electrode 130 is connected to the second terminal 132 over the insulating film 150. The second terminal 132 includes the second terminal 132a to the second terminal 132c. The second terminal 132a is disposed at the second end 104, and the two second terminals 132a face each other. The second terminal 132 b is located between the conductive portion 170 a and the third end portion 105. The second terminal 132 c is located between the conductive portion 170 b and the first end portion 103. The second terminal 132b is aligned with the first terminal 112c, and the second terminal 132c is aligned with the first terminal 112d. The second terminal 132a is located between the first terminal 112a and the first terminal 112b. Note that the light emitting device 10 may not include at least one of the second terminals 132a to 132c, and may further include another second terminal 132.
第1端子112、および第2端子132は、たとえば、導電部170と同一の材料で形成された層、および、第1電極110と同一の材料で形成された層の少なくとも一方を有している。第1端子112および第2端子132のうち導電部170と同一の材料で形成された層は、導電部170と同一工程で形成することができる。このため、導電部170は、第1端子112の少なくとも一部の層と一体になっていてもよい。
The first terminal 112 and the second terminal 132 have, for example, at least one of a layer formed of the same material as the conductive portion 170 and a layer formed of the same material as the first electrode 110. . Of the first terminal 112 and the second terminal 132, a layer formed of the same material as the conductive portion 170 can be formed in the same process as the conductive portion 170. For this reason, the conductive portion 170 may be integrated with at least a part of the first terminal 112.
本図に示す例において、導電部170は、一つの発光部140について一つずつ形成されている。ただし、本例に限定されず、導電部170は一つの発光部140について複数形成されていても良い。
In the example shown in the figure, one conductive portion 170 is formed for each light emitting portion 140. However, the present invention is not limited to this example, and a plurality of conductive portions 170 may be formed for one light emitting portion 140.
第1端子112には、フレキシブルケーブル、ボンディングワイヤ又はリード端子などの導電部材を介して制御回路の正極端子が接続され、第2端子132には、フレキシブルケーブル、ボンディングワイヤ又はリード端子などの導電部材を介して制御回路の負極端子が接続される。
A positive terminal of a control circuit is connected to the first terminal 112 via a conductive member such as a flexible cable, a bonding wire, or a lead terminal, and a conductive member such as a flexible cable, a bonding wire, or a lead terminal is connected to the second terminal 132. Is connected to the negative terminal of the control circuit.
次に、発光装置10の製造方法について説明する。まず、基板100に導電部170を、例えばスパッタリング法などによる成膜およびエッチング等によるパターニングを行って形成する。このとき、第1端子112や第2端子132を同時に形成することができる。次いで、第1電極110を、例えばスパッタリング法を用いて形成する。そして、第1電極110を例えばフォトリソグラフィー法を利用して所定のパターンにする。次いで、第1電極110の縁の上に絶縁膜150を形成する。例えば絶縁膜150が感光性の樹脂で形成されている場合、絶縁膜150は、露光及び現像工程を経ることにより、所定のパターンに形成される。次いで、有機層120及び第2電極130をこの順に形成する。有機層120が蒸着法で形成される層を含む場合、この層は、例えばマスクを用いるなどして所定のパターンに形成される。第2電極130も、例えばマスクを用いるなどして所定のパターンに形成される。次いで、封止膜180を形成して発光部140を封止する。
Next, a method for manufacturing the light emitting device 10 will be described. First, the conductive portion 170 is formed on the substrate 100 by performing film formation by sputtering or the like and patterning by etching or the like. At this time, the first terminal 112 and the second terminal 132 can be formed simultaneously. Next, the first electrode 110 is formed using, for example, a sputtering method. Then, the first electrode 110 is formed into a predetermined pattern using, for example, a photolithography method. Next, the insulating film 150 is formed on the edge of the first electrode 110. For example, when the insulating film 150 is formed of a photosensitive resin, the insulating film 150 is formed in a predetermined pattern through an exposure and development process. Next, the organic layer 120 and the second electrode 130 are formed in this order. When the organic layer 120 includes a layer formed by an evaporation method, this layer is formed in a predetermined pattern using, for example, a mask. The second electrode 130 is also formed in a predetermined pattern using, for example, a mask. Next, a sealing film 180 is formed to seal the light emitting unit 140.
有機層120や第2電極130を所定のパターンに形成するためにマスクを用いる場合、マスクのうち第1領域106に対応する部分を蒸着装置に固定するための支持部が、第2領域107に重なるようにすることができる。したがって、容易にパターニングをして発光装置10を製造することができる。
When a mask is used to form the organic layer 120 and the second electrode 130 in a predetermined pattern, a support portion for fixing a portion corresponding to the first region 106 of the mask to the vapor deposition apparatus is provided in the second region 107. It can be overlapped. Therefore, the light emitting device 10 can be manufactured by patterning easily.
なお、本実施例ではボトムエミッション型の発光装置10の例を示したが、それに限定されない。たとえば発光装置10はトップエミッション型でもよい。
In addition, although the example of the bottom emission type light-emitting device 10 was shown in the present Example, it is not limited to it. For example, the light emitting device 10 may be a top emission type.
以上、本実施例によれば、実施形態と同様、基板100の第2距離d2は第1距離d1よりも小さい。言い換えると、基板100は第1領域106を囲っている。そして、第1領域106に繋がる第2領域107において、基板100が途切れている。したがって、取り付け面の形状によらずヨレやシワが生じにくく、発光装置10を見た目良く取り付けが可能である。
As described above, according to this example, the second distance d 2 of the substrate 100 is smaller than the first distance d 1 as in the embodiment. In other words, the substrate 100 surrounds the first region 106. The substrate 100 is interrupted in the second region 107 connected to the first region 106. Therefore, twisting and wrinkling are unlikely to occur regardless of the shape of the mounting surface, and the light emitting device 10 can be mounted with good appearance.
(実施例2)
図8(a)、(b)、および図9(a)から(c)は、本実施例に係る発光装置10の構成を例示する平面図である。本実施例に係る発光装置10は、実施形態および実施例1の少なくともいずれかに係る発光装置10の構成を有する。図8(a)、(b)、および図9(a)から(c)は、いずれも基板100を平面に沿わせた状態を示している。これらの図に例示するように、発光装置10は多様な形状とすることができ、デザイン性を高めることができる。 (Example 2)
FIGS. 8A and 8B and FIGS. 9A to 9C are plan views illustrating the configuration of thelight emitting device 10 according to this example. The light emitting device 10 according to the present example has the configuration of the light emitting device 10 according to at least one of the embodiment and the first example. FIGS. 8A and 8B and FIGS. 9A to 9C all show a state in which the substrate 100 is along a plane. As illustrated in these drawings, the light-emitting device 10 can have various shapes and can improve design.
図8(a)、(b)、および図9(a)から(c)は、本実施例に係る発光装置10の構成を例示する平面図である。本実施例に係る発光装置10は、実施形態および実施例1の少なくともいずれかに係る発光装置10の構成を有する。図8(a)、(b)、および図9(a)から(c)は、いずれも基板100を平面に沿わせた状態を示している。これらの図に例示するように、発光装置10は多様な形状とすることができ、デザイン性を高めることができる。 (Example 2)
FIGS. 8A and 8B and FIGS. 9A to 9C are plan views illustrating the configuration of the
図8(a)および(b)に示す例では、基板100に第1面101に垂直な方向から見て、基板100と第1領域106と第2領域107とを合わせた領域(以下、「全体領域」と呼ぶ。)の中心に第1領域106が位置する。また、全体領域の外形と第1領域106の外形とは略相似であり、全体領域の中心と第1領域106の中心とは一致する。
In the example shown in FIGS. 8A and 8B, when the substrate 100 is viewed from a direction perpendicular to the first surface 101, a region (hereinafter referred to as “the region where the substrate 100, the first region 106, and the second region 107 are combined”). The first region 106 is located at the center of the entire region. Further, the outer shape of the entire region and the outer shape of the first region 106 are substantially similar, and the center of the entire region and the center of the first region 106 coincide.
図9(a)から(c)に示す例では、基板100に第1面101に垂直な方向から見て、全体領域の中心と第1領域106の中心とは一致しない。また、図9(a)および(b)の例において全体領域の中心に第1領域106が位置しない。そして、全体領域の外形と第1領域106の外形とは、図9(a)および(b)の例において略相似であり、図9(c)の例において非相似である。
In the example shown in FIGS. 9A to 9C, the center of the entire region does not coincide with the center of the first region 106 when viewed from the direction perpendicular to the first surface 101 of the substrate 100. Further, in the example of FIGS. 9A and 9B, the first region 106 is not located at the center of the entire region. The outer shape of the entire region and the outer shape of the first region 106 are substantially similar in the examples of FIGS. 9A and 9B, and are not similar in the example of FIG. 9C.
図8(a)、(b)、図9(a)、および(c)の例において、基板100の第1面101に垂直な方向から見て、第2端部104は互いに平行な直線状である。一方、図9(b)の例において、基板100の第1面101に垂直な方向から見て、第2端部104はそれぞれ基板100の頂点である。
In the example of FIGS. 8A, 8B, 9A, and 9C, the second end portion 104 is a straight line parallel to each other when viewed from the direction perpendicular to the first surface 101 of the substrate 100. It is. On the other hand, in the example of FIG. 9B, the second end portions 104 are the apexes of the substrate 100 when viewed from the direction perpendicular to the first surface 101 of the substrate 100.
図8(a)、および図9(a)から(c)の例において、第1面101に垂直な方向から見て、基板100と第1領域106と第2領域107とを合わせた領域、すなわち全体領域は、全体として円形をしている。また、基板100の端部の少なくとも一部は曲線状である。一方、図8(b)の例において、第1面101に垂直な方向から見て、全体領域は星形をしている。また、基板100の端部は全て直線状である。なお、全体領域の形状はこれらの例に限定されず、矩形や多角形等であってもよい。
8A and 9A to 9C, a region where the substrate 100, the first region 106, and the second region 107 are combined when viewed from the direction perpendicular to the first surface 101. That is, the entire area is circular as a whole. Further, at least a part of the end portion of the substrate 100 is curved. On the other hand, in the example of FIG. 8B, the entire area has a star shape when viewed from the direction perpendicular to the first surface 101. Further, the end portions of the substrate 100 are all linear. Note that the shape of the entire region is not limited to these examples, and may be a rectangle, a polygon, or the like.
図8(a)、(b)、図9(a)から(c)の例において、発光装置10は、第1面101に垂直な方向から見て角部を有する。さらに、図8(b)の例において、全体領域は角部を有する。
8A, 8B, 9A to 9C, the light emitting device 10 has a corner portion when viewed from the direction perpendicular to the first surface 101. FIG. Furthermore, in the example of FIG. 8B, the entire region has corners.
図10および図11はそれぞれ、図8(a)に例示した発光装置10を複数組み合わせて用いる例を示す図である。
FIG. 10 and FIG. 11 are diagrams showing examples in which a plurality of light emitting devices 10 illustrated in FIG. 8A are used in combination.
図10の例では、五つの発光装置10を連結させている。具体的には、一の発光装置10の基板100を他の一以上の発光装置10の第1領域106に通している。図11の例では、三つの発光装置10を組み合わせている。具体的には、隣り合う発光装置10の少なくとも一部分を互いに重ね合わせて並べている。このように、複数の発光装置10の組み合わせ方によっても多様なデザインを付与することができる。なお、組み合わせる発光装置10の数は特に限定されない。また、図10および図11では同じ形状の発光装置10を組み合わせる例を示したが、一つ以上の異なる形状の発光装置10を含む複数の発光装置10を組み合わせてもよい。さらに、組み合わされた複数の発光装置10は互いに同じタイミングで発光するよう制御されてもよいし、互いに異なるタイミングで発光するよう制御されてもよい。
In the example of FIG. 10, five light emitting devices 10 are connected. Specifically, the substrate 100 of one light emitting device 10 is passed through the first region 106 of one or more other light emitting devices 10. In the example of FIG. 11, three light emitting devices 10 are combined. Specifically, at least a part of the adjacent light emitting devices 10 are overlapped with each other. As described above, various designs can be given depending on how the plurality of light emitting devices 10 are combined. The number of light emitting devices 10 to be combined is not particularly limited. 10 and 11 show examples of combining light emitting devices 10 having the same shape, a plurality of light emitting devices 10 including one or more light emitting devices 10 having different shapes may be combined. Further, the plurality of combined light emitting devices 10 may be controlled to emit light at the same timing, or may be controlled to emit light at different timings.
以上、本実施例によれば、実施形態と同様、基板100の第2距離d2は第1距離d1よりも小さい。言い換えると、基板100は第1領域106を囲っている。そして、第1領域106に繋がる第2領域107において、基板100が途切れている。したがって、取り付け面の形状によらずヨレやシワが生じにくく、発光装置10を見た目良く取り付けが可能である。
As described above, according to this example, the second distance d 2 of the substrate 100 is smaller than the first distance d 1 as in the embodiment. In other words, the substrate 100 surrounds the first region 106. The substrate 100 is interrupted in the second region 107 connected to the first region 106. Therefore, twisting and wrinkling are unlikely to occur regardless of the shape of the mounting surface, and the light emitting device 10 can be mounted with good appearance.
以上、図面を参照して実施形態及び実施例について述べたが、これらは本発明の例示であり、上記以外の様々な構成を採用することもできる。
As mentioned above, although embodiment and the Example were described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.
この出願は、2017年2月17日に出願された日本出願特願2017-027599号を基礎とする優先権を主張し、その開示の全てをここに取り込む。
This application claims priority based on Japanese Patent Application No. 2017-027599 filed on Feb. 17, 2017, the entire disclosure of which is incorporated herein.
Claims (12)
- 基板と、
前記基板の第1面側に位置し、第1電極、有機層、及び第2電極を含む発光部とを備え、
前記基板の端部のうち第1領域を介して互いに対向する第1端部間の最大距離は第1距離であり、前記基板の端部のうち第2領域を介して互いに対向する第2端部間の距離は前記第1距離よりも小さな第2距離である発光装置。 A substrate,
A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer, and a second electrode;
The maximum distance between the first ends facing each other through the first region among the ends of the substrate is the first distance, and the second ends facing each other via the second region among the ends of the substrate. The light emitting device wherein the distance between the parts is a second distance smaller than the first distance. - 基板と、
前記基板の第1面側に位置し、第1電極、有機層、及び第2電極を含む発光部とを備え、
前記基板は第1領域を囲っており、前記第1領域に繋がる第2領域において、前記基板が途切れている発光装置。 A substrate,
A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer, and a second electrode;
The light emitting device, wherein the substrate surrounds a first region, and the substrate is interrupted in a second region connected to the first region. - 請求項1に記載の発光装置において、
前記基板は前記第1領域を囲っており、前記第1領域に繋がる前記第2領域において、前記基板が途切れている発光装置。 The light-emitting device according to claim 1.
The light emitting device, wherein the substrate surrounds the first region, and the substrate is interrupted in the second region connected to the first region. - 請求項3に記載の発光装置において、
前記第2領域は、前記第1領域と、前記基板の外側に位置する外部領域とを繋いでいる発光装置。 The light emitting device according to claim 3.
The second region is a light-emitting device that connects the first region and an external region located outside the substrate. - 請求項3または4に記載の発光装置において、
前記第2端部の幅である第1幅は、前記第2距離よりも大きい発光装置。 The light-emitting device according to claim 3 or 4,
A light emitting device having a first width, which is a width of the second end portion, larger than the second distance. - 請求項3から5のいずれか一項に記載の発光装置において、
前記第1端部を一端とし、前記第1端部とは反対側の第3端部を他端とする前記基板の幅のうち、最小の幅である第2幅は、前記第2距離よりも大きい発光装置。 The light emitting device according to any one of claims 3 to 5,
Of the widths of the substrate having the first end as one end and the third end opposite to the first end as the other end, the second width, which is the smallest width, is based on the second distance. Larger light emitting device. - 請求項3から6のいずれか一項に記載の発光装置において、
前記基板を平面に沿わせたとき、前記第2端部が対向する発光装置。 The light emitting device according to any one of claims 3 to 6,
A light emitting device in which the second end portion faces when the substrate is placed along a plane. - 請求項3から7のいずれか一項に記載の発光装置において、
前記基板の前記第1面側に、前記発光部と前記基板の端部との間に位置する導電部をさらに備える発光装置。 The light emitting device according to any one of claims 3 to 7,
A light emitting device further comprising a conductive portion positioned between the light emitting portion and an end portion of the substrate on the first surface side of the substrate. - 請求項3から8のいずれか一項に記載の発光装置において、
前記基板を平面に沿わせたとき、前記第1面に垂直な方向から見て、前記基板の端部の少なくとも一部は曲線状である発光装置。 The light emitting device according to any one of claims 3 to 8,
A light-emitting device in which at least a part of an end portion of the substrate is curved when viewed from a direction perpendicular to the first surface when the substrate is along a plane. - 請求項3から9のいずれか一項に記載の発光装置において、
前記基板を平面に沿わせたとき、前記第1面に垂直な方向から見て、前記基板と、前記第1領域と、前記第2領域とを合わせた領域は、全体として円形をしている発光装置。 The light emitting device according to any one of claims 3 to 9,
When the substrate is placed along a plane, the region including the substrate, the first region, and the second region is circular as a whole when viewed from a direction perpendicular to the first surface. Light emitting device. - 請求項3から10のいずれか一項に記載の発光装置において、
前記基板を平面に沿わせたとき、前記基板は前記第1面に垂直な方向から見て角部を有する発光装置。 The light emitting device according to any one of claims 3 to 10,
The light emitting device according to claim 1, wherein the substrate has a corner portion when viewed from a direction perpendicular to the first surface when the substrate is along a plane. - 基板と、
前記基板の第1面側に位置し、第1電極、有機層及び第2電極を含む発光部と、
を備え、
前記基板は、
一の端部と、
前記一の端部と第1領域を介して対向する端部と、
前記基板の前記一の端部とは反対側の端部と、を有し、
前記一の端部と前記反対側の端部とは、前記基板の縁に沿って連続している発光装置。 A substrate,
A light emitting part located on the first surface side of the substrate and including a first electrode, an organic layer and a second electrode;
With
The substrate is
One end,
An end facing the one end through the first region;
An end opposite to the one end of the substrate,
The light emitting device in which the one end and the opposite end are continuous along an edge of the substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017027599 | 2017-02-17 | ||
JP2017-027599 | 2017-02-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018151026A1 true WO2018151026A1 (en) | 2018-08-23 |
Family
ID=63170575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2018/004521 WO2018151026A1 (en) | 2017-02-17 | 2018-02-09 | Light emission device |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2018151026A1 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09161971A (en) * | 1995-11-30 | 1997-06-20 | Seikosha Co Ltd | El display device |
JPH11102166A (en) * | 1997-02-25 | 1999-04-13 | Kozo Oshio | Ornamental unit body of el |
WO2012133716A1 (en) * | 2011-03-29 | 2012-10-04 | Necライティング株式会社 | Organic el light emitting device, manufacturing method therefor, and organic el illumination device |
JP2013201105A (en) * | 2012-03-26 | 2013-10-03 | Shoji Katsume | Three-dimensional light-emitting structure using electroluminescent laminated sheet |
WO2014065169A1 (en) * | 2012-10-24 | 2014-05-01 | コニカミノルタ株式会社 | Light-emitting apparatus and method for manufacturing same |
JP2016085797A (en) * | 2014-10-23 | 2016-05-19 | コニカミノルタ株式会社 | Surface light emitting module |
-
2018
- 2018-02-09 WO PCT/JP2018/004521 patent/WO2018151026A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09161971A (en) * | 1995-11-30 | 1997-06-20 | Seikosha Co Ltd | El display device |
JPH11102166A (en) * | 1997-02-25 | 1999-04-13 | Kozo Oshio | Ornamental unit body of el |
WO2012133716A1 (en) * | 2011-03-29 | 2012-10-04 | Necライティング株式会社 | Organic el light emitting device, manufacturing method therefor, and organic el illumination device |
JP2013201105A (en) * | 2012-03-26 | 2013-10-03 | Shoji Katsume | Three-dimensional light-emitting structure using electroluminescent laminated sheet |
WO2014065169A1 (en) * | 2012-10-24 | 2014-05-01 | コニカミノルタ株式会社 | Light-emitting apparatus and method for manufacturing same |
JP2016085797A (en) * | 2014-10-23 | 2016-05-19 | コニカミノルタ株式会社 | Surface light emitting module |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2016042638A1 (en) | Light emitting device | |
JP2024023850A (en) | Light-emitting device | |
JP2016062767A (en) | Light-emitting device | |
WO2018151026A1 (en) | Light emission device | |
WO2016157321A1 (en) | Light emitting device | |
WO2018163937A1 (en) | Light-emitting device | |
JP7198882B2 (en) | light emitting device | |
JP6124058B2 (en) | Organic EL panel | |
WO2018151027A1 (en) | Light emission device | |
WO2017163331A1 (en) | Light emitting device, electronic device, and manufacturing method for light emitting device | |
JP2018037202A (en) | Light-emitting device | |
WO2022154009A1 (en) | Light-emitting device | |
JP2019036758A (en) | Light-emitting device | |
JP6450124B2 (en) | Light emitting device | |
JP6644486B2 (en) | Light emitting device | |
JP6700013B2 (en) | Light emitting device | |
JP6700309B2 (en) | Light emitting device | |
JP2016062766A (en) | Light emitting device | |
JP2017216203A (en) | Light-emitting device | |
JP2016186911A (en) | Light emission device | |
JP6640450B2 (en) | Light emitting device | |
JP2016072283A (en) | Light emission device | |
WO2017183118A1 (en) | Light-emitting device | |
JP2018152257A (en) | Light-emitting device, light-emitting system, and manufacturing method of light-emitting device | |
JP2020053409A (en) | Light-emitting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18754388 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18754388 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: JP |