WO2015033402A1 - Screen printer - Google Patents
Screen printer Download PDFInfo
- Publication number
- WO2015033402A1 WO2015033402A1 PCT/JP2013/073802 JP2013073802W WO2015033402A1 WO 2015033402 A1 WO2015033402 A1 WO 2015033402A1 JP 2013073802 W JP2013073802 W JP 2013073802W WO 2015033402 A1 WO2015033402 A1 WO 2015033402A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- screen mask
- screen
- measuring device
- control device
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/26—Supports for workpieces for articles with flat surfaces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
Definitions
- This specification relates to a screen printer.
- Japanese Patent Laid-Open No. 2012-158129 discloses a screen mask, a circuit board lifting / lowering mechanism that holds the circuit board and lifts it toward the screen mask, and moves the squeegee along the screen mask while abutting on the upper surface of the screen mask.
- a screen printing machine having a squeegee drive mechanism is disclosed.
- the screen printing machine includes a circuit board measuring device that acquires shape data of the upper surface of the circuit board, and a control device that controls the operation of the circuit board lifting mechanism. In this screen printing machine, the holding position of the circuit board by the circuit board lifting mechanism is adjusted based on the shape data of the upper surface of the circuit board acquired by the circuit board measuring device.
- the circuit board in order to acquire shape data of the upper surface of the circuit board, the circuit board is moved below the circuit board measuring apparatus, and then the circuit board measuring apparatus is moved. Since the distance is measured by scanning the upper surface of the circuit board, the tact time of the screen printer is long. A technology that can further reduce the tact time of a screen printing machine is expected.
- This specification discloses a technique for solving the above problems.
- the present specification provides a technique capable of further reducing the tact time in a screen printing machine that controls the operation of a circuit board lifting mechanism and a squeegee driving mechanism based on shape data of the upper surface of a circuit board.
- the present specification includes a screen mask, a circuit board lifting mechanism that holds the circuit board and lifts the circuit board toward the screen mask, and a squeegee driving mechanism that moves the squeegee along the screen mask while abutting the upper surface of the screen mask.
- a screen printer Disclosed is a screen printer.
- the screen printing machine is movable in a horizontal plane, and is capable of moving integrally with the circuit board imaging device that images the recognition mark of the circuit board from above the circuit board, and the upper surface of the circuit board.
- a circuit board measuring device that acquires the shape data of the circuit board, and a control device that controls the operation of the circuit board lifting mechanism and the squeegee driving mechanism.
- the control device controls the operation of the circuit board lifting mechanism and / or the squeegee driving mechanism based on the shape data of the upper surface of the circuit board acquired by the circuit board measuring device.
- a screen printing machine includes a circuit board imaging device that images a recognition mark provided on a circuit board in order to align the screen mask and the circuit board.
- a circuit board imaging device that images a recognition mark on a circuit board from above the circuit board and a circuit board measurement device that acquires shape data of the upper surface of the circuit board are integrated in a horizontal direction. It is possible to move. With such a configuration, the shape data of the upper surface of the circuit board can be acquired in parallel with the operation of imaging the recognition mark on the circuit board. According to the screen printing machine, the tact time can be shortened.
- the above-described screen printing machine is movable in a horizontal plane, and can be moved integrally with the screen mask imaging device that images the recognition mark of the screen mask from below the screen mask.
- the apparatus further includes a screen mask measuring device that acquires the shape data of the lower surface, and the control device acquires the shape data of the upper surface of the circuit board acquired by the circuit board measuring device and the lower surface of the screen mask acquired by the screen mask measuring device.
- the operation of the circuit board lifting mechanism and / or the squeegee driving mechanism can be controlled.
- Many screen printing machines also include a screen mask imaging device for imaging the recognition mark of the screen mask in addition to the circuit board imaging device for imaging the recognition mark of the circuit board for alignment of the screen mask and the circuit board.
- a screen mask imaging device that captures a screen mask recognition mark from below the screen mask and a screen mask measurement device that acquires shape data of the lower surface of the screen mask are integrated in the horizontal direction. It is possible to move.
- the above-described screen printing machine can perform a printing operation in consideration of not only the flexure of the circuit board but also the flexure of the screen mask.
- the shape data of the lower surface of the screen mask can be acquired in parallel with the operation of imaging the recognition mark of the screen mask, and the tact time can be shortened.
- the above-described screen printing machine can be configured such that the circuit board imaging device, the circuit board measuring device, the screen mask imaging device, and the screen mask measuring device are held by the same moving mechanism.
- the moving mechanism for moving the circuit board imaging device and the circuit board measuring device in the horizontal plane, and the moving mechanism for moving the screen mask imaging device and the screen mask measuring device in the horizontal plane are provided. By making them common, it is possible to reduce the number of parts and save space.
- the control device moves up and down the circuit board based on the shape data of the upper surface of the circuit board acquired by the circuit board measuring device and the shape data of the lower surface of the screen mask acquired by the screen mask measuring device. It can comprise so that the raising amount of the circuit board by a mechanism may be adjusted.
- the screen printing machine is configured such that the control device sets the distance from the upper surface of the circuit board to the lower surface of the screen mask in the vicinity of the edge of the circuit board as the amount of the circuit board raised by the circuit board lifting mechanism. be able to.
- the control device sets the distance from the upper surface of the circuit board to the lower surface of the screen mask in the vicinity of the center portion of the circuit board as the amount of rise of the circuit board by the circuit board lifting mechanism.
- the screen printing machine can be configured such that the control device sets the minimum value of the distance from the upper surface of the circuit board to the lower surface of the screen mask as the amount of rise of the circuit board by the circuit board lifting mechanism.
- the screen printing machine described above can be configured such that the control device sets the maximum value of the distance from the upper surface of the circuit board to the lower surface of the screen mask to the rising amount of the circuit board by the circuit board lifting mechanism. .
- the side view which shows typically the structure of the screen printer 2 of an Example.
- the top view which shows typically the structure of the circuit board positioning device 24 in the screen printer 2 of an Example.
- the top view which shows typically the structure of the screen mask 28 and the squeegee apparatus 30 in the screen printer 2 of an Example.
- the side view which shows typically the structure of the modification of the screen printer 2 of an Example.
- the screen printing machine 2 mainly includes a control device 20, an interface device 22, a circuit board positioning device 24, an imaging measurement device 26, a screen mask 28, and a squeegee device 30. Yes.
- the screen printing machine 2 receives the circuit board C from the upstream side of the mounting line, screen-prints a desired pattern of solder on the circuit board C, and then sends the circuit board C to the downstream side of the mounting line.
- the transport direction of the circuit board C is the X direction
- the direction orthogonal to the X direction in the horizontal plane is the Y direction
- the direction orthogonal to the X direction and the Y direction is the Z direction.
- the control device 20 can communicate with a production management computer (not shown) that manages the overall operation of the mounting line.
- the control device 20 controls the operation of each component of the screen printing machine 2 in accordance with an instruction from the production management computer.
- the control device 20 transmits data indicating the state of solder printing work in the screen printer 2 to the production management computer.
- the interface device 22 presents the setting state and work state of the screen printing machine 2 to the worker via a monitor or the like, and accepts various inputs from the worker via a switch or the like.
- the circuit board positioning device 24 includes a Y direction moving mechanism 40, an X direction moving mechanism 42, a rotating mechanism 44, an elevating mechanism 46, an X direction transport mechanism 48, a clamp mechanism 50, and a support mechanism 52. .
- the Y-direction moving mechanism 40 is supported on the base of the screen printing machine 2.
- the Y-direction moving mechanism 40 can be moved relative to the base of the screen printing machine 2 in the Y direction by driving an actuator (not shown).
- the X direction moving mechanism 42 is supported by the Y direction moving mechanism 40.
- the X-direction moving mechanism 42 can be moved relative to the Y-direction moving mechanism 40 in the X direction by driving an actuator (not shown).
- the rotating mechanism 44 is supported by the X-direction moving mechanism 42.
- the rotation mechanism 44 can be rotated around the Z axis with respect to the X-direction movement mechanism 42 by driving a motor (not shown).
- the elevating mechanism 46 is supported by the rotating mechanism 44.
- the lifting mechanism 46 can be moved relative to the rotating mechanism 44 in the Z direction by driving an actuator (not shown).
- the X-direction transport mechanism 48, the clamp mechanism 50, and the support mechanism 52 are supported by the lifting mechanism 46.
- the X-direction transport mechanism 48 includes a pair of conveyor belts 54 arranged along the X direction and servo motors (not shown) that drive the respective conveyor belts 54. As shown in FIG. 2, the X-direction transport mechanism 48 places both ends of the circuit board C in the Y direction on a pair of conveyor belts 54, and drives the servo motor to move the circuit board C in the X direction. It can be transported. Depending on the size of the circuit board C, the distance between the pair of conveyor belts 54 can be adjusted.
- the clamp mechanism 50 can hold the circuit board C with a desired width by sandwiching the circuit board C from both ends in the Y direction.
- the support mechanism 52 can support the circuit board C from the lower surface side by bringing the tips of the support pins 56 into contact with the lower surface of the circuit board C held by the clamp mechanism 50.
- the screen mask 28 is a metal plate-like member formed in a rectangular shape, and is supported on four sides by a mask support frame 66 whose position is fixed with respect to the base of the screen printing machine 2.
- a mask support frame 66 whose position is fixed with respect to the base of the screen printing machine 2.
- an opening is formed corresponding to the solder pattern to be printed on the circuit board C.
- the opening formed in the screen mask 28 is also referred to as a print pattern 28a.
- a recognition mark F is formed on the upper surface of the circuit board C.
- a recognition mark 28 b is formed on the lower surface of the screen mask 28.
- the circuit board C and the screen mask 28 are aligned based on the recognition mark F on the circuit board C and the recognition mark 28 b on the screen mask 28.
- the imaging measuring device 26 includes an XY direction moving mechanism 60, a circuit board imaging device 62a, a screen mask imaging device 62b, a circuit board measuring device 64a, and a screen mask measuring device 64b.
- the XY direction moving mechanism 60 can be moved relative to the base of the screen printing machine 2 in the X direction and the Y direction by driving an actuator (not shown).
- the circuit board imaging device 62a, the screen mask imaging device 62b, the circuit board measuring device 64a, and the screen mask measuring device 64b are held by the XY direction moving mechanism 60.
- the circuit board imaging device 62a includes illumination and a camera for imaging the circuit board C, and can image the upper surface of the circuit board C.
- the control device 20 can process the image data picked up by the circuit board imaging device 62a and specify the position of the recognition mark F on the circuit board C.
- the screen mask imaging device 62b includes illumination and a camera for imaging the screen mask 28, and can image the lower surface of the screen mask 28.
- the control device 20 can process the image data captured by the screen mask imaging device 62b and specify the position of the recognition mark 28b of the screen mask 28.
- the circuit board measuring device 64a is a laser length measuring device that measures the distance in the Z direction from the imaging measuring device 26 to the circuit board C. By moving the XY direction moving mechanism 60 in the XY direction and measuring the distance in the Z direction from the imaging measurement device 26 to the circuit board C by the circuit board measurement device 64a, the control device 20 allows the upper surface of the circuit board C to be measured. Shape data can be acquired.
- the screen mask measuring device 64b is a laser length measuring device that measures the distance in the Z direction from the imaging measuring device 26 to the screen mask 28.
- the control device 20 By moving the XY direction moving mechanism 60 in the XY direction and measuring the distance in the Z direction from the imaging measuring device 26 to the screen mask 28 by the screen mask measuring device 64b, the control device 20 causes the lower surface of the screen mask 28 to move. Shape data can be acquired.
- the squeegee device 30 includes a Y-direction moving mechanism 72, a squeegee head 74, and squeegees 76a and 76b.
- the Y-direction moving mechanism 72 is supported on the base of the screen printing machine 2.
- the Y-direction moving mechanism 72 can be moved relative to the base of the screen printing machine 2 in the Y direction by driving an actuator (not shown).
- the squeegee head 74 is supported by the Y-direction moving mechanism 72.
- the squeegee head 74 can be moved relative to the Y-direction moving mechanism 72 in the Z direction by driving an actuator (not shown).
- the squeegees 76a and 76b are supported by the squeegee head 74.
- the squeegees 76a and 76b can be tilted with respect to the squeegee head 74 by driving a servo motor (not shown).
- the squeegees 76a and 76b squeeze the solder supplied to the upper surface of the screen mask 28 from a solder supply device (not shown) on the print pattern.
- the screen printing machine 2 further includes a receiving and conveying device 80 and a sending and conveying device 82.
- the receiving and conveying device 80 includes a pair of conveyor belts 84 arranged along the X direction, and servo motors (not shown) that drive the respective conveyor belts 84.
- the receiving and conveying device 80 receives the circuit board C sent from the substrate conveying device T1 on the upstream side of the screen printer 2, and sends the circuit board C to the X-direction conveying mechanism 48 of the circuit board positioning device 24.
- the delivery conveying device 82 includes a pair of conveyor belts 86 arranged along the X direction, and servo motors (not shown) that drive the respective conveyor belts 86.
- the sending / conveying device 82 receives the circuit board C sent from the X-direction carrying mechanism 48 of the circuit board positioning device 24, and sends it to the substrate carrying device T 2 on the downstream side of the screen printing machine 2. Similar to the pair of conveyor belts 54 of the X-direction transport mechanism 48, the distance between the pair of conveyor belts 84 of the receiving transport apparatus 80 and the distance between the pair of conveyor belts 86 of the delivery transport apparatus 82 are the size of the circuit board C to be transported. It can be adjusted according to.
- the control device 20 drives the receiving transfer device 80 to receive the circuit board C. Then, the control device 20 controls the Y-direction moving mechanism 40, the X-direction moving mechanism 42, the rotating mechanism 44, and the raising / lowering so that the X-direction conveying mechanism 48 is in a position where the circuit board C can be received from the receiving conveying device 80. The mechanism 46 is driven. Then, the control device 20 drives the receiving and conveying device 80 and the X-direction conveying mechanism 48 to deliver the circuit board C from the receiving and conveying device 80 to the X-direction conveying mechanism 48.
- the control device 20 drives the X-direction transport mechanism 48 to transport the circuit board C to the X-direction position corresponding to the print pattern 28a of the screen mask 28. . Then, the control device 20 drives the clamp mechanism 50 and the support mechanism 52 to hold the circuit board C. Then, the control device 20 moves the XY direction moving mechanism 60 of the imaging measurement device 26 in the XY direction, images the upper surface of the circuit board C by the circuit board imaging device 62a, and the circuit board C by the circuit board measurement device 64a. The acquisition of the shape data of the upper surface, the imaging of the lower surface of the screen mask 28 by the screen mask imaging device 62b, and the acquisition of the shape data of the lower surface of the screen mask 28 by the screen mask measuring device 64b are performed.
- the control device 20 processes the image data picked up by the circuit board image pickup device 62a to identify the position of the recognition mark F on the circuit board C, and also processes the image data picked up by the screen mask image pickup device 62b to obtain a screen.
- the position of the recognition mark 28b of the mask 28 is specified, and a positional deviation between the two is detected.
- the control device 20 drives the Y-direction moving mechanism 40, the X-direction moving mechanism 42, and the rotating mechanism 44 to finely adjust the position of the circuit board C.
- control device 20 uses the circuit board C based on the shape data of the upper surface of the circuit board C acquired by the circuit board measuring device 64a and the shape data of the lower surface of the screen mask 28 acquired by the screen mask measuring device 64b. Set the amount of increase.
- the control device 20 drives the elevating mechanism 46 to raise the circuit board C and bring the circuit board C into contact with the lower surface of the screen mask 28.
- the control device 20 connects the shape data of the upper surface of the circuit board C acquired by the circuit board measurement device 64a and the shape data of the lower surface of the screen mask 28 acquired by the screen mask measurement device 64b to the control device 20. May be sent to the production management computer.
- the circuit board C and the screen mask 28 cannot maintain an ideal planar shape and have a deflection in the Z direction.
- the screen mask 28 is bent into a downwardly convex shape as shown in FIGS.
- the circuit board C may be bent into a convex shape as shown in FIG. 5 or may be bent into a convex shape as shown in FIG.
- the control device 20 can detect the circuit board C from the lower surface of the screen mask 28 in the vicinity of the end of the circuit board C in the Y-axis direction.
- the distance L1 in the Z direction to the upper surface is calculated, and the calculated distance L1 is set as the rising amount of the circuit board C.
- squeezing can be performed in a state where the entire surface of the circuit board C is in close contact with the screen mask 28.
- the control device 20 is in the vicinity of the center of the circuit board C (in other words, at the position where the circuit board C is bent most downward). Then, the distance L2 in the Z direction from the lower surface of the screen mask 28 to the upper surface of the circuit board C is calculated, and the calculated distance L2 is set as the rising amount of the circuit board C. In such a case, the circuit board C can be brought into contact with the screen mask 28 while the screen mask 28 is loosened by raising the circuit board C by the distance L2. By pressing the screen mask 28 from above with the squeegees 76a and 76b, squeezing can be performed with the circuit board C in close contact with the screen mask 28.
- the rising amount of the circuit board C may be set regardless of whether the circuit board C is bent into a convex shape or bent downward.
- the minimum value of the distance in the Z direction from the lower surface of the screen mask 28 to the upper surface of the circuit board C may be set as the rising amount of the circuit board C.
- the adhesion degree of the entire circuit board C is lowered, and the circuit board C can be smoothly separated from the screen mask 28 after the solder printing.
- the maximum value of the distance in the Z direction from the lower surface of the screen mask 28 to the upper surface of the circuit board C may be set as the rising amount of the circuit board C. In such a case, the degree of adhesion of the entire circuit board C is increased, and high fillability in solder printing can be realized.
- a location where the difficulty of the solder printing operation is high that is, a location where defects are likely to occur in the solder printing operation is specified, and a screen mask at that location
- the distance in the Z direction from the lower surface of 28 to the upper surface of the circuit board C may be calculated, and the calculated distance may be set as the rising amount of the circuit board C.
- the degree of adhesion between the screen mask 28 and the circuit board C at a location where the difficulty level of the solder printing work is high increases, and the occurrence of defects in the solder printing work can be suppressed.
- the acquisition of the shape data of the upper surface of the circuit board C and the setting of the amount of increase of the circuit board C associated therewith may be performed for all the circuit boards C, or the production lot of the circuit board C is limited. It may be performed each time it changes, or may be performed every time the type of the circuit board C changes.
- the acquisition of the shape data of the lower surface of the screen mask 28 may be performed every time the screen mask 28 is replaced, or may be performed periodically (for example, every time a predetermined time elapses).
- the control device 20 supplies solder to the upper surface of the screen mask 28 by a solder supply device (not shown).
- a solder supply device (not shown).
- the control device 20 drives the squeegee head 74 so that one of the squeegees (for example, the squeegee 76a) is moved to the screen mask.
- the Y-direction moving mechanism 72 is driven to perform squeezing on the print pattern 28a of the screen mask 28.
- the solder is printed in a pattern corresponding to the print pattern 28 a on the circuit board C held in contact with the lower surface of the screen mask 28.
- the control device 20 drives the Y-direction moving mechanism 72 and the squeegee head 74 to return the squeegee device 30 to the standby position.
- the control device 20 drives the lifting mechanism 46, the clamp mechanism 50, and the support mechanism 52 to transfer the circuit board C to the X-direction transport mechanism 48 again.
- the control device 20 sets the Y-direction moving mechanism 40, the X-direction moving mechanism 42, and the rotating mechanism 44 so that the X-direction conveying mechanism 48 is at a position where the circuit board C can be delivered to the delivery conveying device 82. To drive.
- control device 20 drives the X-direction transport mechanism 48 and the send-out transport device 82 to deliver the circuit board C from the X-direction transport mechanism 48 to the send-out transport device 82. Thereafter, the control device 20 drives the delivery / conveyance device 82 to deliver the circuit board C to the downstream substrate conveyance device T2.
- the circuit board measuring device 64a is held by the XY direction moving mechanism 60 that holds the circuit board imaging device 62a.
- the shape data of the upper surface of the circuit board C can be acquired in parallel with the imaging operation of the recognition mark F of the circuit board C, and the tact time of the screen printing machine 2 can be shortened. it can.
- the screen mask measuring device 64b is held by the XY direction moving mechanism 60 that holds the screen mask imaging device 62b. With such a configuration, the shape data of the lower surface of the screen mask 28 can be acquired in parallel with the recognition operation of the recognition mark 28b of the screen mask 28, and the tact time of the screen printing machine 2 can be shortened. it can.
- the shape data of the upper surface of the circuit board C acquired by the circuit board measuring device 64a and / or the shape data of the lower surface of the screen mask 28 acquired by the screen mask measuring device 64b specify the rising amount of the circuit board C. It can also be used for other purposes. For example, as shown in FIG. 6, when the circuit board C is bent in a downwardly convex shape, the control device 20 automatically determines a position where the circuit board C is bent downward beyond a predetermined threshold value. Alternatively, the support pin 56 may be arranged and pushed upward. Alternatively, the control device 20 urges the operator via the interface device 22 to place the support pin 56 and push it upward in a place where the circuit board C is bent downward beyond a predetermined threshold value. May be. With such a configuration, it is possible to improve the productivity by suppressing the occurrence of defects in the solder printing operation.
- a measuring device 92 that is a single laser length measuring device is used to measure the imaging measuring device.
- the distance in the Z direction from the circuit board C to the circuit board C and the distance in the Z direction from the imaging measurement device 26 to the screen mask 28 may be measured.
- the measuring device 92 is held by the XY direction moving mechanism 60 via the rotating mechanism 90.
- the rotation mechanism 90 can be rotated around the Y axis with respect to the XY direction movement mechanism 60 by driving a motor (not shown).
- the control device 20 can measure the distance in the Z direction from the imaging measurement device 26 to the circuit board C by driving the rotation mechanism 90 and directing the measurement device 92 toward the circuit board C. By driving and directing the measuring device 92 toward the screen mask 28, the distance in the Z direction from the imaging measuring device 26 to the screen mask 28 can also be measured.
- the circuit board measuring device 64a the screen mask measuring device 64b, and the measuring device 92
- the circuit board measuring device 64a, the screen mask measuring device 64b, and the measuring device 92 are used.
- another length measuring device such as an ultrasonic length measuring device may be used.
- the imaging measuring device 26 may be further provided with a Z-direction moving mechanism to measure the distance to the circuit board C and the screen mask 28 by focusing the image.
- control device 20 images the circuit board C or the screen mask 28 with the circuit board imaging device 62a or the screen mask imaging device 62b while changing the position of the imaging measuring device 26 in the Z direction, and the imaging at the time when the focus is achieved. Based on the position of the measuring device 26 in the Z direction, the distance to the circuit board C or the screen mask 28 is calculated.
- the control device 20 drives the Y-direction moving mechanism 40, the X-direction moving mechanism 42, and the rotating mechanism 44, and the circuit board.
- the configuration for finely adjusting the position of C has been described, but instead of these mechanisms, a mechanism for adjusting the Y-direction position, the X-direction position, and the angle around the Z-axis of the screen mask 28 is provided.
- a configuration for finely adjusting the position may be employed.
- the distribution in the XY plane of the distance in the Z direction from the circuit board measuring device 64a to the upper surface of the circuit board C, obtained by the circuit board measuring device 64a, and the shape data of the upper surface of the circuit board C may be used as the shape data of the upper surface of the circuit board C as long as the control device 20 can recognize the shape of the upper surface of the circuit board C.
- the distribution in the XY plane of the distance in the Z direction from the screen mask measuring device 64b to the lower surface of the screen mask 28, which is obtained by the screen mask measuring device 64b is represented by the lower surface of the screen mask 28.
- the shape data of the lower surface of the screen mask 28 may be any data as long as the control device 20 can recognize the shape of the lower surface of the screen mask 28.
- the rising amount of the circuit board C may be set based only on the shape data of the upper surface of the circuit board C.
- the configuration is configured to control the operations of the lifting mechanism 46 of the circuit board positioning device 24, the Y-direction moving mechanism 72 of the squeegee device 30, and the squeegee head 74 in a different manner. May be.
- the circuit board is based on the shape data of the upper surface of the circuit board C acquired by the circuit board measuring device 64a and the shape data of the lower surface of the screen mask 28 acquired by the screen mask measuring device 64b.
- the number of stages of plate separation operation from the screen mask 28 of C, the descending distance or descending speed of the circuit board C at each stage of the plate separating operation, or the printing speed or printing pressure by the squeegee device 30 are adjusted. May be.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
This specification discloses a screen printer provided with the following: a screen mask; a circuit-board raising/lowering mechanism that holds a circuit board and moves said circuit board upwards toward the screen mask; and a stage-driving mechanism that makes a stage contact the top surface of the screen mask and move along said screen mask. This screen printer is also provided with the following: a circuit-board imaging device that is capable of moving within a horizontal plane and images a recognition mark on the circuit board from above said circuit board; a circuit-board measurement device that is capable of moving together with the circuit-board imaging device and acquires geometry data for the top surface of the circuit board; and a control device that controls the operation of the circuit-board raising/lowering mechanism and the stage-driving mechanism. The control device in this screen printer controls the operation of the circuit-board raising/lowering mechanism and/or the stage-driving mechanism on the basis of the circuit-board top-surface geometry data acquired by the circuit-board measurement device.
Description
本明細書は、スクリーン印刷機に関する。
This specification relates to a screen printer.
特開2012-158129号公報に、スクリーンマスクと、回路基板を保持してスクリーンマスクに向けて上昇させる回路基板昇降機構と、スキージをスクリーンマスクの上面に当接させてスクリーンマスクに沿って移動させるスキージ駆動機構を備えるスクリーン印刷機が開示されている。このスクリーン印刷機は、回路基板の上面の形状データを取得する回路基板測定装置と、回路基板昇降機構の動作を制御する制御装置を備えている。このスクリーン印刷機では、回路基板測定装置によって取得された回路基板の上面の形状データに基づいて、回路基板昇降機構による回路基板の保持位置を調整する。
Japanese Patent Laid-Open No. 2012-158129 discloses a screen mask, a circuit board lifting / lowering mechanism that holds the circuit board and lifts it toward the screen mask, and moves the squeegee along the screen mask while abutting on the upper surface of the screen mask. A screen printing machine having a squeegee drive mechanism is disclosed. The screen printing machine includes a circuit board measuring device that acquires shape data of the upper surface of the circuit board, and a control device that controls the operation of the circuit board lifting mechanism. In this screen printing machine, the holding position of the circuit board by the circuit board lifting mechanism is adjusted based on the shape data of the upper surface of the circuit board acquired by the circuit board measuring device.
特開2012-158129号公報に開示された技術では、回路基板の上面の形状データを取得するために、回路基板を回路基板測定装置の下方へ移動させた後、回路基板測定装置を移動させながら回路基板の上面を走査して距離の測定を行うため、スクリーン印刷機のタクトタイムが長いものとなっている。スクリーン印刷機のタクトタイムをより短縮することが可能な技術が期待されている。
In the technique disclosed in Japanese Patent Application Laid-Open No. 2012-158129, in order to acquire shape data of the upper surface of the circuit board, the circuit board is moved below the circuit board measuring apparatus, and then the circuit board measuring apparatus is moved. Since the distance is measured by scanning the upper surface of the circuit board, the tact time of the screen printer is long. A technology that can further reduce the tact time of a screen printing machine is expected.
本明細書は、上記の課題を解決する技術を開示する。本明細書では、回路基板の上面の形状データに基づいて回路基板昇降機構やスキージ駆動機構の動作を制御するスクリーン印刷機において、タクトタイムをより短縮することが可能な技術を提供する。
This specification discloses a technique for solving the above problems. The present specification provides a technique capable of further reducing the tact time in a screen printing machine that controls the operation of a circuit board lifting mechanism and a squeegee driving mechanism based on shape data of the upper surface of a circuit board.
本明細書は、スクリーンマスクと、回路基板を保持してスクリーンマスクに向けて上昇させる回路基板昇降機構と、スキージをスクリーンマスクの上面に当接させてスクリーンマスクに沿って移動させるスキージ駆動機構を備えるスクリーン印刷機を開示する。そのスクリーン印刷機は、水平面内で移動可能であり、回路基板の上方から回路基板の認識マークを撮像する回路基板撮像装置と、回路基板撮像装置と一体的に移動可能であり、回路基板の上面の形状データを取得する回路基板測定装置と、回路基板昇降機構およびスキージ駆動機構の動作を制御する制御装置を備えている。そのスクリーン印刷機において、制御装置は、回路基板測定装置によって取得された回路基板の上面の形状データに基づいて、回路基板昇降機構および/またはスキージ駆動機構の動作を制御する。
The present specification includes a screen mask, a circuit board lifting mechanism that holds the circuit board and lifts the circuit board toward the screen mask, and a squeegee driving mechanism that moves the squeegee along the screen mask while abutting the upper surface of the screen mask. Disclosed is a screen printer. The screen printing machine is movable in a horizontal plane, and is capable of moving integrally with the circuit board imaging device that images the recognition mark of the circuit board from above the circuit board, and the upper surface of the circuit board. A circuit board measuring device that acquires the shape data of the circuit board, and a control device that controls the operation of the circuit board lifting mechanism and the squeegee driving mechanism. In the screen printing machine, the control device controls the operation of the circuit board lifting mechanism and / or the squeegee driving mechanism based on the shape data of the upper surface of the circuit board acquired by the circuit board measuring device.
一般的に、スクリーン印刷機は、スクリーンマスクと回路基板の位置合わせのために、回路基板に設けられた認識マークを撮像する回路基板撮像装置を備えている。本明細書が開示するスクリーン印刷機では、回路基板の上方から回路基板の認識マークを撮像する回路基板撮像装置と、回路基板の上面の形状データを取得する回路基板測定装置が、水平方向に一体的に移動可能となっている。このような構成とすることによって、回路基板の認識マークを撮像する動作と並行して、回路基板の上面の形状データの取得を行うことができる。上記のスクリーン印刷機によれば、タクトタイムを短縮することができる。
Generally, a screen printing machine includes a circuit board imaging device that images a recognition mark provided on a circuit board in order to align the screen mask and the circuit board. In the screen printing machine disclosed in this specification, a circuit board imaging device that images a recognition mark on a circuit board from above the circuit board and a circuit board measurement device that acquires shape data of the upper surface of the circuit board are integrated in a horizontal direction. It is possible to move. With such a configuration, the shape data of the upper surface of the circuit board can be acquired in parallel with the operation of imaging the recognition mark on the circuit board. According to the screen printing machine, the tact time can be shortened.
上記のスクリーン印刷機は、水平面内で移動可能であり、スクリーンマスクの下方からスクリーンマスクの認識マークを撮像するスクリーンマスク撮像装置と、スクリーンマスク撮像装置と一体的に移動可能であり、スクリーンマスクの下面の形状データを取得するスクリーンマスク測定装置をさらに備えており、制御装置が、回路基板測定装置によって取得された回路基板の上面の形状データと、スクリーンマスク測定装置によって取得されたスクリーンマスクの下面の形状データに基づいて、回路基板昇降機構および/またはスキージ駆動機構の動作を制御するように構成することができる。
The above-described screen printing machine is movable in a horizontal plane, and can be moved integrally with the screen mask imaging device that images the recognition mark of the screen mask from below the screen mask. The apparatus further includes a screen mask measuring device that acquires the shape data of the lower surface, and the control device acquires the shape data of the upper surface of the circuit board acquired by the circuit board measuring device and the lower surface of the screen mask acquired by the screen mask measuring device. On the basis of the shape data, the operation of the circuit board lifting mechanism and / or the squeegee driving mechanism can be controlled.
多くのスクリーン印刷機は、スクリーンマスクと回路基板の位置合わせのために、回路基板の認識マークを撮像する回路基板撮像装置に加えて、スクリーンマスクの認識マークを撮像するスクリーンマスク撮像装置も備えている。本明細書が開示するスクリーン印刷機では、スクリーンマスクの下方からスクリーンマスクの認識マークを撮像するスクリーンマスク撮像装置と、スクリーンマスクの下面の形状データを取得するスクリーンマスク測定装置が、水平方向に一体的に移動可能となっている。このような構成とすることによって、上記のスクリーン印刷機では、回路基板の撓みだけでなくスクリーンマスクの撓みも考慮に入れて印刷動作を行うことができる。また、上記のスクリーン印刷機によれば、スクリーンマスクの認識マークを撮像する動作と並行して、スクリーンマスクの下面の形状データの取得を行うことができ、タクトタイムを短縮することができる。
Many screen printing machines also include a screen mask imaging device for imaging the recognition mark of the screen mask in addition to the circuit board imaging device for imaging the recognition mark of the circuit board for alignment of the screen mask and the circuit board. Yes. In the screen printing machine disclosed in this specification, a screen mask imaging device that captures a screen mask recognition mark from below the screen mask and a screen mask measurement device that acquires shape data of the lower surface of the screen mask are integrated in the horizontal direction. It is possible to move. With such a configuration, the above-described screen printing machine can perform a printing operation in consideration of not only the flexure of the circuit board but also the flexure of the screen mask. Further, according to the above-described screen printing machine, the shape data of the lower surface of the screen mask can be acquired in parallel with the operation of imaging the recognition mark of the screen mask, and the tact time can be shortened.
上記のスクリーン印刷機は、回路基板撮像装置と、回路基板測定装置と、スクリーンマスク撮像装置と、スクリーンマスク測定装置が、同一の移動機構によって保持されているように構成することができる。
The above-described screen printing machine can be configured such that the circuit board imaging device, the circuit board measuring device, the screen mask imaging device, and the screen mask measuring device are held by the same moving mechanism.
上記のスクリーン印刷機によれば、回路基板撮像装置と回路基板測定装置を水平面内で移動させるための移動機構と、スクリーンマスク撮像装置とスクリーンマスク測定装置を水平面内で移動させるための移動機構が、共通化されていることによって、部品点数の削減および省スペース化を実現することができる。
According to the screen printing machine, the moving mechanism for moving the circuit board imaging device and the circuit board measuring device in the horizontal plane, and the moving mechanism for moving the screen mask imaging device and the screen mask measuring device in the horizontal plane are provided. By making them common, it is possible to reduce the number of parts and save space.
上記のスクリーン印刷機は、制御装置が、回路基板測定装置によって取得された回路基板の上面の形状データと、スクリーンマスク測定装置によって取得されたスクリーンマスクの下面の形状データに基づいて、回路基板昇降機構による回路基板の上昇量を調整するように構成することができる。
In the screen printing machine, the control device moves up and down the circuit board based on the shape data of the upper surface of the circuit board acquired by the circuit board measuring device and the shape data of the lower surface of the screen mask acquired by the screen mask measuring device. It can comprise so that the raising amount of the circuit board by a mechanism may be adjusted.
上記のスクリーン印刷機によれば、回路基板の撓みとスクリーンマスクの撓みを考慮に入れて、回路基板とスクリーンマスクが適切に密着するように回路基板昇降機構の動作を制御することができる。
According to the above-described screen printing machine, it is possible to control the operation of the circuit board lifting mechanism so that the circuit board and the screen mask are in close contact with each other in consideration of the bending of the circuit board and the bending of the screen mask.
上記のスクリーン印刷機は、制御装置が、回路基板の端部近傍における、回路基板の上面からスクリーンマスクの下面までの距離を、回路基板昇降機構による回路基板の上昇量に設定するように構成することができる。あるいは、上記のスクリーン印刷機は、制御装置が、回路基板の中央部近傍における、回路基板の上面からスクリーンマスクの下面までの距離を、回路基板昇降機構による回路基板の上昇量に設定するように構成することができる。あるいは、上記のスクリーン印刷機は、制御装置が、回路基板の上面からスクリーンマスクの下面までの距離の最小値を、回路基板昇降機構による回路基板の上昇量に設定するように構成することができる。あるいは、上記のスクリーン印刷機は、制御装置が、回路基板の上面からスクリーンマスクの下面までの距離の最大値を、回路基板昇降機構による回路基板の上昇量に設定するように構成することができる。
The screen printing machine is configured such that the control device sets the distance from the upper surface of the circuit board to the lower surface of the screen mask in the vicinity of the edge of the circuit board as the amount of the circuit board raised by the circuit board lifting mechanism. be able to. Alternatively, in the screen printing machine, the control device sets the distance from the upper surface of the circuit board to the lower surface of the screen mask in the vicinity of the center portion of the circuit board as the amount of rise of the circuit board by the circuit board lifting mechanism. Can be configured. Alternatively, the screen printing machine can be configured such that the control device sets the minimum value of the distance from the upper surface of the circuit board to the lower surface of the screen mask as the amount of rise of the circuit board by the circuit board lifting mechanism. . Alternatively, the screen printing machine described above can be configured such that the control device sets the maximum value of the distance from the upper surface of the circuit board to the lower surface of the screen mask to the rising amount of the circuit board by the circuit board lifting mechanism. .
(実施例)
以下では図面を参照しながら実施例のスクリーン印刷機2について説明する。図1に示すように、スクリーン印刷機2は、主に、制御装置20と、インターフェース装置22と、回路基板位置決め装置24と、撮像測定装置26と、スクリーンマスク28と、スキージ装置30を備えている。スクリーン印刷機2は、実装ラインの上流側から回路基板Cを受入れ、回路基板Cに所望のパターンのはんだをスクリーン印刷した後、回路基板Cを実装ラインの下流側に送り出す。なお、以下の説明では、スクリーン印刷機2において、回路基板Cの搬送方向をX方向とし、水平面内でX方向に直交する方向をY方向とし、X方向およびY方向に直交する方向をZ方向とする。 (Example)
Hereinafter, thescreen printer 2 of the embodiment will be described with reference to the drawings. As shown in FIG. 1, the screen printing machine 2 mainly includes a control device 20, an interface device 22, a circuit board positioning device 24, an imaging measurement device 26, a screen mask 28, and a squeegee device 30. Yes. The screen printing machine 2 receives the circuit board C from the upstream side of the mounting line, screen-prints a desired pattern of solder on the circuit board C, and then sends the circuit board C to the downstream side of the mounting line. In the following description, in the screen printing machine 2, the transport direction of the circuit board C is the X direction, the direction orthogonal to the X direction in the horizontal plane is the Y direction, and the direction orthogonal to the X direction and the Y direction is the Z direction. And
以下では図面を参照しながら実施例のスクリーン印刷機2について説明する。図1に示すように、スクリーン印刷機2は、主に、制御装置20と、インターフェース装置22と、回路基板位置決め装置24と、撮像測定装置26と、スクリーンマスク28と、スキージ装置30を備えている。スクリーン印刷機2は、実装ラインの上流側から回路基板Cを受入れ、回路基板Cに所望のパターンのはんだをスクリーン印刷した後、回路基板Cを実装ラインの下流側に送り出す。なお、以下の説明では、スクリーン印刷機2において、回路基板Cの搬送方向をX方向とし、水平面内でX方向に直交する方向をY方向とし、X方向およびY方向に直交する方向をZ方向とする。 (Example)
Hereinafter, the
制御装置20は、実装ラインの全体の動作を管理する生産管理コンピュータ(図示せず)と通信可能である。制御装置20は、生産管理コンピュータからの指示に従って、スクリーン印刷機2の各構成要素の動作を制御する。また、制御装置20は、スクリーン印刷機2におけるはんだ印刷作業の状態を示すデータを生産管理コンピュータへ送信する。
The control device 20 can communicate with a production management computer (not shown) that manages the overall operation of the mounting line. The control device 20 controls the operation of each component of the screen printing machine 2 in accordance with an instruction from the production management computer. In addition, the control device 20 transmits data indicating the state of solder printing work in the screen printer 2 to the production management computer.
インターフェース装置22は、モニタ等を介して作業者に対してスクリーン印刷機2の設定状態や作業状態を提示するとともに、スイッチ等を介して作業者からの各種の入力を受け付ける。
The interface device 22 presents the setting state and work state of the screen printing machine 2 to the worker via a monitor or the like, and accepts various inputs from the worker via a switch or the like.
回路基板位置決め装置24は、Y方向移動機構40と、X方向移動機構42と、回転機構44と、昇降機構46と、X方向搬送機構48と、クランプ機構50と、サポート機構52を備えている。
The circuit board positioning device 24 includes a Y direction moving mechanism 40, an X direction moving mechanism 42, a rotating mechanism 44, an elevating mechanism 46, an X direction transport mechanism 48, a clamp mechanism 50, and a support mechanism 52. .
Y方向移動機構40は、スクリーン印刷機2の基台に支持されている。Y方向移動機構40は、図示しないアクチュエータの駆動によって、スクリーン印刷機2の基台に対してY方向に相対移動が可能となっている。
The Y-direction moving mechanism 40 is supported on the base of the screen printing machine 2. The Y-direction moving mechanism 40 can be moved relative to the base of the screen printing machine 2 in the Y direction by driving an actuator (not shown).
X方向移動機構42は、Y方向移動機構40に支持されている。X方向移動機構42は、図示しないアクチュエータの駆動によって、Y方向移動機構40に対してX方向に相対移動が可能となっている。
The X direction moving mechanism 42 is supported by the Y direction moving mechanism 40. The X-direction moving mechanism 42 can be moved relative to the Y-direction moving mechanism 40 in the X direction by driving an actuator (not shown).
回転機構44は、X方向移動機構42に支持されている。回転機構44は、図示しないモータの駆動によって、X方向移動機構42に対してZ軸周りに相対回転が可能となっている。
The rotating mechanism 44 is supported by the X-direction moving mechanism 42. The rotation mechanism 44 can be rotated around the Z axis with respect to the X-direction movement mechanism 42 by driving a motor (not shown).
昇降機構46は、回転機構44に支持されている。昇降機構46は、図示しないアクチュエータの駆動によって、回転機構44に対してZ方向に相対移動が可能となっている。
The elevating mechanism 46 is supported by the rotating mechanism 44. The lifting mechanism 46 can be moved relative to the rotating mechanism 44 in the Z direction by driving an actuator (not shown).
X方向搬送機構48と、クランプ機構50と、サポート機構52は、昇降機構46に支持されている。X方向搬送機構48は、X方向に沿って配置されている一対のコンベアベルト54と、それぞれのコンベアベルト54を駆動するサーボモータ(図示せず)を備えている。図2に示すように、X方向搬送機構48は、回路基板CのY方向の両端を一対のコンベアベルト54の上に載置し、サーボモータを駆動することで、回路基板CをX方向に搬送可能である。回路基板Cのサイズに応じて、一対のコンベアベルト54の間隔は調整可能となっている。
The X-direction transport mechanism 48, the clamp mechanism 50, and the support mechanism 52 are supported by the lifting mechanism 46. The X-direction transport mechanism 48 includes a pair of conveyor belts 54 arranged along the X direction and servo motors (not shown) that drive the respective conveyor belts 54. As shown in FIG. 2, the X-direction transport mechanism 48 places both ends of the circuit board C in the Y direction on a pair of conveyor belts 54, and drives the servo motor to move the circuit board C in the X direction. It can be transported. Depending on the size of the circuit board C, the distance between the pair of conveyor belts 54 can be adjusted.
図2に示すように、クランプ機構50は、回路基板CをY方向の両端から挟持して、所望の幅で回路基板Cを保持することができる。サポート機構52は、クランプ機構50によって保持された回路基板Cの下面に複数のサポートピン56の先端を当接させて、回路基板Cを下面側から支持することができる。
As shown in FIG. 2, the clamp mechanism 50 can hold the circuit board C with a desired width by sandwiching the circuit board C from both ends in the Y direction. The support mechanism 52 can support the circuit board C from the lower surface side by bringing the tips of the support pins 56 into contact with the lower surface of the circuit board C held by the clamp mechanism 50.
スクリーンマスク28は、矩形状に形成された金属製の板状部材であって、スクリーン印刷機2の基台に対して位置を固定されたマスク支持枠66によって4辺を支持されている。スクリーンマスク28の中央部には、回路基板Cに印刷すべきはんだのパターンに対応して開口が形成されている。以下ではスクリーンマスク28に形成された開口を印刷パターン28aともいう。
The screen mask 28 is a metal plate-like member formed in a rectangular shape, and is supported on four sides by a mask support frame 66 whose position is fixed with respect to the base of the screen printing machine 2. In the central portion of the screen mask 28, an opening is formed corresponding to the solder pattern to be printed on the circuit board C. Hereinafter, the opening formed in the screen mask 28 is also referred to as a print pattern 28a.
図2に示すように、回路基板Cの上面には、認識マークFが形成されている。また、図4に示すように、スクリーンマスク28の下面には、認識マーク28bが形成されている。スクリーン印刷機2では、回路基板Cの認識マークFとスクリーンマスク28の認識マーク28bに基づいて、回路基板Cとスクリーンマスク28の位置合わせを行う。
As shown in FIG. 2, a recognition mark F is formed on the upper surface of the circuit board C. As shown in FIG. 4, a recognition mark 28 b is formed on the lower surface of the screen mask 28. In the screen printing machine 2, the circuit board C and the screen mask 28 are aligned based on the recognition mark F on the circuit board C and the recognition mark 28 b on the screen mask 28.
撮像測定装置26は、XY方向移動機構60と、回路基板撮像装置62aと、スクリーンマスク撮像装置62bと、回路基板測定装置64aと、スクリーンマスク測定装置64bを備えている。XY方向移動機構60は、図示しないアクチュエータの駆動により、スクリーン印刷機2の基台に対して、X方向およびY方向に相対移動が可能となっている。回路基板撮像装置62aと、スクリーンマスク撮像装置62bと、回路基板測定装置64aと、スクリーンマスク測定装置64bは、XY方向移動機構60に保持されている。
The imaging measuring device 26 includes an XY direction moving mechanism 60, a circuit board imaging device 62a, a screen mask imaging device 62b, a circuit board measuring device 64a, and a screen mask measuring device 64b. The XY direction moving mechanism 60 can be moved relative to the base of the screen printing machine 2 in the X direction and the Y direction by driving an actuator (not shown). The circuit board imaging device 62a, the screen mask imaging device 62b, the circuit board measuring device 64a, and the screen mask measuring device 64b are held by the XY direction moving mechanism 60.
回路基板撮像装置62aは、回路基板Cを撮像するための照明とカメラを備えており、回路基板Cの上面を撮像することができる。制御装置20は、回路基板撮像装置62aが撮像した画像データを処理して、回路基板Cの認識マークFの位置を特定することができる。
The circuit board imaging device 62a includes illumination and a camera for imaging the circuit board C, and can image the upper surface of the circuit board C. The control device 20 can process the image data picked up by the circuit board imaging device 62a and specify the position of the recognition mark F on the circuit board C.
スクリーンマスク撮像装置62bは、スクリーンマスク28を撮像するための照明とカメラを備えており、スクリーンマスク28の下面を撮像することができる。制御装置20は、スクリーンマスク撮像装置62bが撮像した画像データを処理して、スクリーンマスク28の認識マーク28bの位置を特定することができる。
The screen mask imaging device 62b includes illumination and a camera for imaging the screen mask 28, and can image the lower surface of the screen mask 28. The control device 20 can process the image data captured by the screen mask imaging device 62b and specify the position of the recognition mark 28b of the screen mask 28.
回路基板測定装置64aは、撮像測定装置26から回路基板CまでのZ方向の距離を測定するレーザ測長器である。XY方向移動機構60をXY方向に移動させながら、回路基板測定装置64aによって撮像測定装置26から回路基板CまでのZ方向の距離を測定することによって、制御装置20は、回路基板Cの上面の形状データを取得することができる。
The circuit board measuring device 64a is a laser length measuring device that measures the distance in the Z direction from the imaging measuring device 26 to the circuit board C. By moving the XY direction moving mechanism 60 in the XY direction and measuring the distance in the Z direction from the imaging measurement device 26 to the circuit board C by the circuit board measurement device 64a, the control device 20 allows the upper surface of the circuit board C to be measured. Shape data can be acquired.
スクリーンマスク測定装置64bは、撮像測定装置26からスクリーンマスク28までのZ方向の距離を測定するレーザ測長器である。XY方向移動機構60をXY方向に移動させながら、スクリーンマスク測定装置64bによって撮像測定装置26からスクリーンマスク28までのZ方向の距離を測定することによって、制御装置20は、スクリーンマスク28の下面の形状データを取得することができる。
The screen mask measuring device 64b is a laser length measuring device that measures the distance in the Z direction from the imaging measuring device 26 to the screen mask 28. By moving the XY direction moving mechanism 60 in the XY direction and measuring the distance in the Z direction from the imaging measuring device 26 to the screen mask 28 by the screen mask measuring device 64b, the control device 20 causes the lower surface of the screen mask 28 to move. Shape data can be acquired.
図1および図3に示すように、スキージ装置30は、Y方向移動機構72と、スキージヘッド74と、スキージ76a、76bを備えている。
As shown in FIGS. 1 and 3, the squeegee device 30 includes a Y-direction moving mechanism 72, a squeegee head 74, and squeegees 76a and 76b.
Y方向移動機構72は、スクリーン印刷機2の基台に支持されている。Y方向移動機構72は、図示しないアクチュエータの駆動によって、スクリーン印刷機2の基台に対してY方向に相対移動が可能となっている。
The Y-direction moving mechanism 72 is supported on the base of the screen printing machine 2. The Y-direction moving mechanism 72 can be moved relative to the base of the screen printing machine 2 in the Y direction by driving an actuator (not shown).
スキージヘッド74は、Y方向移動機構72に支持されている。スキージヘッド74は、図示しないアクチュエータの駆動によって、Y方向移動機構72に対してZ方向に相対移動が可能となっている。
The squeegee head 74 is supported by the Y-direction moving mechanism 72. The squeegee head 74 can be moved relative to the Y-direction moving mechanism 72 in the Z direction by driving an actuator (not shown).
スキージ76a、76bは、スキージヘッド74に支持されている。スキージ76a、76bは、図示しないサーボモータの駆動によって、スキージヘッド74に対して傾動可能となっている。スキージ76a、76bは、図示しないはんだ供給装置からスクリーンマスク28の上面に供給されるはんだを印刷パターン上でスキージングする。
The squeegees 76a and 76b are supported by the squeegee head 74. The squeegees 76a and 76b can be tilted with respect to the squeegee head 74 by driving a servo motor (not shown). The squeegees 76a and 76b squeeze the solder supplied to the upper surface of the screen mask 28 from a solder supply device (not shown) on the print pattern.
図2に示すように、スクリーン印刷機2はさらに、受け入れ搬送装置80と、送り出し搬送装置82を備えている。受け入れ搬送装置80は、X方向に沿って配置されている一対のコンベアベルト84と、それぞれのコンベアベルト84を駆動するサーボモータ(図示せず)を備えている。受け入れ搬送装置80は、スクリーン印刷機2の上流側の基板搬送装置T1から送られてくる回路基板Cを受け取り、回路基板Cを回路基板位置決め装置24のX方向搬送機構48に送り出す。送り出し搬送装置82は、X方向に沿って配置されている一対のコンベアベルト86と、それぞれのコンベアベルト86を駆動するサーボモータ(図示せず)を備えている。送り出し搬送装置82は、回路基板位置決め装置24のX方向搬送機構48から送り出される回路基板Cを受け取り、スクリーン印刷機2の下流側の基板搬送装置T2に送り出す。X方向搬送機構48の一対のコンベアベルト54と同様に、受け入れ搬送装置80の一対のコンベアベルト84の間隔と、送り出し搬送装置82の一対のコンベアベルト86の間隔は、搬送する回路基板Cのサイズに応じて調整可能となっている。
As shown in FIG. 2, the screen printing machine 2 further includes a receiving and conveying device 80 and a sending and conveying device 82. The receiving and conveying device 80 includes a pair of conveyor belts 84 arranged along the X direction, and servo motors (not shown) that drive the respective conveyor belts 84. The receiving and conveying device 80 receives the circuit board C sent from the substrate conveying device T1 on the upstream side of the screen printer 2, and sends the circuit board C to the X-direction conveying mechanism 48 of the circuit board positioning device 24. The delivery conveying device 82 includes a pair of conveyor belts 86 arranged along the X direction, and servo motors (not shown) that drive the respective conveyor belts 86. The sending / conveying device 82 receives the circuit board C sent from the X-direction carrying mechanism 48 of the circuit board positioning device 24, and sends it to the substrate carrying device T 2 on the downstream side of the screen printing machine 2. Similar to the pair of conveyor belts 54 of the X-direction transport mechanism 48, the distance between the pair of conveyor belts 84 of the receiving transport apparatus 80 and the distance between the pair of conveyor belts 86 of the delivery transport apparatus 82 are the size of the circuit board C to be transported. It can be adjusted according to.
スクリーン印刷機2の動作を説明する。上流側の基板搬送装置T1から回路基板Cが送られてくると、制御装置20は受け入れ搬送装置80を駆動して回路基板Cを受け取る。そして、X方向搬送機構48が受け入れ搬送装置80から回路基板Cを受け取ることが可能な位置となるように、制御装置20は、Y方向移動機構40、X方向移動機構42、回転機構44、昇降機構46を駆動する。そして、制御装置20は受け入れ搬送装置80とX方向搬送機構48を駆動して、受け入れ搬送装置80からX方向搬送機構48へ回路基板Cを受け渡す。
The operation of the screen printer 2 will be described. When the circuit board C is sent from the upstream board transfer device T1, the control device 20 drives the receiving transfer device 80 to receive the circuit board C. Then, the control device 20 controls the Y-direction moving mechanism 40, the X-direction moving mechanism 42, the rotating mechanism 44, and the raising / lowering so that the X-direction conveying mechanism 48 is in a position where the circuit board C can be received from the receiving conveying device 80. The mechanism 46 is driven. Then, the control device 20 drives the receiving and conveying device 80 and the X-direction conveying mechanism 48 to deliver the circuit board C from the receiving and conveying device 80 to the X-direction conveying mechanism 48.
回路基板CがX方向搬送機構48に受け渡されると、制御装置20は、X方向搬送機構48を駆動して、スクリーンマスク28の印刷パターン28aに対応するX方向位置まで回路基板Cを搬送する。そして、制御装置20は、クランプ機構50とサポート機構52を駆動して、回路基板Cを保持する。そして、制御装置20は、撮像測定装置26のXY方向移動機構60をXY方向に移動させながら、回路基板撮像装置62aによる回路基板Cの上面の撮像と、回路基板測定装置64aによる回路基板Cの上面の形状データの取得と、スクリーンマスク撮像装置62bによるスクリーンマスク28の下面の撮像と、スクリーンマスク測定装置64bによるスクリーンマスク28の下面の形状データの取得を行う。
When the circuit board C is delivered to the X-direction transport mechanism 48, the control device 20 drives the X-direction transport mechanism 48 to transport the circuit board C to the X-direction position corresponding to the print pattern 28a of the screen mask 28. . Then, the control device 20 drives the clamp mechanism 50 and the support mechanism 52 to hold the circuit board C. Then, the control device 20 moves the XY direction moving mechanism 60 of the imaging measurement device 26 in the XY direction, images the upper surface of the circuit board C by the circuit board imaging device 62a, and the circuit board C by the circuit board measurement device 64a. The acquisition of the shape data of the upper surface, the imaging of the lower surface of the screen mask 28 by the screen mask imaging device 62b, and the acquisition of the shape data of the lower surface of the screen mask 28 by the screen mask measuring device 64b are performed.
制御装置20は、回路基板撮像装置62aによって撮像した画像データを処理して、回路基板Cの認識マークFの位置を特定するとともに、スクリーンマスク撮像装置62bによって撮像した画像データを処理して、スクリーンマスク28の認識マーク28bの位置を特定し、両者の間の位置ずれを検出する。位置ずれが検出されると、制御装置20は、Y方向移動機構40、X方向移動機構42、回転機構44を駆動して、回路基板Cの位置の微調整を行う。
The control device 20 processes the image data picked up by the circuit board image pickup device 62a to identify the position of the recognition mark F on the circuit board C, and also processes the image data picked up by the screen mask image pickup device 62b to obtain a screen. The position of the recognition mark 28b of the mask 28 is specified, and a positional deviation between the two is detected. When the positional deviation is detected, the control device 20 drives the Y-direction moving mechanism 40, the X-direction moving mechanism 42, and the rotating mechanism 44 to finely adjust the position of the circuit board C.
また、制御装置20は、回路基板測定装置64aによって取得された回路基板Cの上面の形状データと、スクリーンマスク測定装置64bによって取得されたスクリーンマスク28の下面の形状データに基づいて、回路基板Cの上昇量を設定する。回路基板Cの上昇量が設定されると、制御装置20は、昇降機構46を駆動して回路基板Cを上昇させて、回路基板Cをスクリーンマスク28の下面に当接させる。なお、制御装置20は、回路基板測定装置64aによって取得された回路基板Cの上面の形状データと、スクリーンマスク測定装置64bによって取得されたスクリーンマスク28の下面の形状データを、制御装置20に接続された生産管理コンピュータに送信してもよい。
Further, the control device 20 uses the circuit board C based on the shape data of the upper surface of the circuit board C acquired by the circuit board measuring device 64a and the shape data of the lower surface of the screen mask 28 acquired by the screen mask measuring device 64b. Set the amount of increase. When the rising amount of the circuit board C is set, the control device 20 drives the elevating mechanism 46 to raise the circuit board C and bring the circuit board C into contact with the lower surface of the screen mask 28. The control device 20 connects the shape data of the upper surface of the circuit board C acquired by the circuit board measurement device 64a and the shape data of the lower surface of the screen mask 28 acquired by the screen mask measurement device 64b to the control device 20. May be sent to the production management computer.
回路基板Cやスクリーンマスク28は、理想的な平面形状を維持することはできず、Z方向に撓みを有している。通常は、スクリーンマスク28は、図5や図6に示すように、下に凸な形状に撓んでいる。回路基板Cは、図5に示すように、上に凸な形状に撓むこともあるし、図6に示すように、下に凸な形状に撓むこともある。
The circuit board C and the screen mask 28 cannot maintain an ideal planar shape and have a deflection in the Z direction. Usually, the screen mask 28 is bent into a downwardly convex shape as shown in FIGS. The circuit board C may be bent into a convex shape as shown in FIG. 5 or may be bent into a convex shape as shown in FIG.
図5に示すように、回路基板Cが上に凸な形状に撓んでいる場合、制御装置20は、回路基板CのY軸方向の端部近傍における、スクリーンマスク28の下面から回路基板Cの上面までのZ方向の距離L1を算出し、算出された距離L1を回路基板Cの上昇量に設定する。このような場合、回路基板Cを距離L1だけ上昇させることで、回路基板Cの全面をスクリーンマスク28に密着させた状態で、スキージングを行うことができる。
As shown in FIG. 5, when the circuit board C is bent into an upwardly convex shape, the control device 20 can detect the circuit board C from the lower surface of the screen mask 28 in the vicinity of the end of the circuit board C in the Y-axis direction. The distance L1 in the Z direction to the upper surface is calculated, and the calculated distance L1 is set as the rising amount of the circuit board C. In such a case, by raising the circuit board C by the distance L1, squeezing can be performed in a state where the entire surface of the circuit board C is in close contact with the screen mask 28.
図6に示すように、回路基板Cが下に凸な形状に撓んでいる場合、制御装置20は、回路基板Cの中央近傍(言い換えると、回路基板Cにおいて最も下方に撓んでいる箇所)における、スクリーンマスク28の下面から回路基板Cの上面までのZ方向の距離L2を算出し、算出された距離L2を回路基板Cの上昇量に設定する。このような場合、回路基板Cを距離L2だけ上昇させることで、スクリーンマスク28にゆるみを持たせつつ、回路基板Cをスクリーンマスク28に当接させることができる。スキージ76a、76bによってスクリーンマスク28を上面から押圧することで、回路基板Cをスクリーンマスク28に密着させた状態で、スキージングを行うことができる。
As shown in FIG. 6, when the circuit board C is bent in a downwardly convex shape, the control device 20 is in the vicinity of the center of the circuit board C (in other words, at the position where the circuit board C is bent most downward). Then, the distance L2 in the Z direction from the lower surface of the screen mask 28 to the upper surface of the circuit board C is calculated, and the calculated distance L2 is set as the rising amount of the circuit board C. In such a case, the circuit board C can be brought into contact with the screen mask 28 while the screen mask 28 is loosened by raising the circuit board C by the distance L2. By pressing the screen mask 28 from above with the squeegees 76a and 76b, squeezing can be performed with the circuit board C in close contact with the screen mask 28.
あるいは、回路基板Cが上に凸な形状に撓んでいるか下に凸な形状に撓んでいるかに関わらずに、回路基板Cの上昇量を設定してもよい。例えば、スクリーンマスク28の下面から回路基板Cの上面までのZ方向の距離の最小値を、回路基板Cの上昇量に設定してもよい。このような場合、回路基板Cの全体での密着度が下がり、はんだ印刷後のスクリーンマスク28からの回路基板Cの版離れをスムーズに行うことができる。あるいは、スクリーンマスク28の下面から回路基板Cの上面までのZ方向の距離の最大値を、回路基板Cの上昇量に設定してもよい。このような場合、回路基板Cの全体での密着度が上がり、はんだ印刷における高い充填性を実現することができる。
Alternatively, the rising amount of the circuit board C may be set regardless of whether the circuit board C is bent into a convex shape or bent downward. For example, the minimum value of the distance in the Z direction from the lower surface of the screen mask 28 to the upper surface of the circuit board C may be set as the rising amount of the circuit board C. In such a case, the adhesion degree of the entire circuit board C is lowered, and the circuit board C can be smoothly separated from the screen mask 28 after the solder printing. Alternatively, the maximum value of the distance in the Z direction from the lower surface of the screen mask 28 to the upper surface of the circuit board C may be set as the rising amount of the circuit board C. In such a case, the degree of adhesion of the entire circuit board C is increased, and high fillability in solder printing can be realized.
あるいは、回路基板Cがうねりを有する形状に撓んでいる場合には、はんだ印刷作業の難易度が高い箇所、言い換えるとはんだ印刷作業において不良が発生しやすい箇所を特定して、その箇所におけるスクリーンマスク28の下面から回路基板Cの上面までのZ方向の距離を算出し、算出された距離を回路基板Cの上昇量に設定してもよい。このような場合、はんだ印刷作業の難易度が高い箇所でのスクリーンマスク28と回路基板Cの密着度が上がり、はんだ印刷作業における不良の発生を抑制することができる。
Alternatively, when the circuit board C is bent into a wavy shape, a location where the difficulty of the solder printing operation is high, that is, a location where defects are likely to occur in the solder printing operation is specified, and a screen mask at that location The distance in the Z direction from the lower surface of 28 to the upper surface of the circuit board C may be calculated, and the calculated distance may be set as the rising amount of the circuit board C. In such a case, the degree of adhesion between the screen mask 28 and the circuit board C at a location where the difficulty level of the solder printing work is high increases, and the occurrence of defects in the solder printing work can be suppressed.
上記のような、回路基板Cの上面の形状データの取得と、それに伴う回路基板Cの上昇量の設定は、全ての回路基板Cに対して行ってもよいし、回路基板Cの製造ロットが変わる毎に行ってもよいし、回路基板Cの種類が変わる毎に行ってもよい。また、スクリーンマスク28の下面の形状データの取得は、スクリーンマスク28を交換する度に行ってもよいし、定期的に(例えば所定時間が経過する毎に)行ってもよい。
The acquisition of the shape data of the upper surface of the circuit board C and the setting of the amount of increase of the circuit board C associated therewith may be performed for all the circuit boards C, or the production lot of the circuit board C is limited. It may be performed each time it changes, or may be performed every time the type of the circuit board C changes. The acquisition of the shape data of the lower surface of the screen mask 28 may be performed every time the screen mask 28 is replaced, or may be performed periodically (for example, every time a predetermined time elapses).
上記のような、回路基板Cの位置決めと並行して、制御装置20は、図示しないはんだ供給装置によりはんだをスクリーンマスク28の上面に供給する。回路基板Cがスクリーンマスク28の下面に当接し、スクリーンマスク28の上面へはんだが供給されると、制御装置20は、スキージヘッド74を駆動して、一方のスキージ(例えばスキージ76a)をスクリーンマスク28の上面に当接させた後、Y方向移動機構72を駆動して、スクリーンマスク28の印刷パターン28aに対するスキージングを行う。これによって、スクリーンマスク28の下面に当接して保持されている回路基板Cに、印刷パターン28aに対応するパターンで、はんだが印刷される。
In parallel with the positioning of the circuit board C as described above, the control device 20 supplies solder to the upper surface of the screen mask 28 by a solder supply device (not shown). When the circuit board C comes into contact with the lower surface of the screen mask 28 and solder is supplied to the upper surface of the screen mask 28, the control device 20 drives the squeegee head 74 so that one of the squeegees (for example, the squeegee 76a) is moved to the screen mask. After making contact with the upper surface of 28, the Y-direction moving mechanism 72 is driven to perform squeezing on the print pattern 28a of the screen mask 28. As a result, the solder is printed in a pattern corresponding to the print pattern 28 a on the circuit board C held in contact with the lower surface of the screen mask 28.
回路基板Cへのはんだ印刷が完了すると、制御装置20は、Y方向移動機構72、スキージヘッド74を駆動して、スキージ装置30を待機位置へ復帰させる。また、制御装置20は、昇降機構46、クランプ機構50、サポート機構52を駆動して、回路基板Cを再びX方向搬送機構48に受け渡す。さらに、制御装置20は、X方向搬送機構48が送り出し搬送装置82へ回路基板Cを受け渡すことが可能な位置となるように、Y方向移動機構40、X方向移動機構42、回転機構44を駆動する。
When the solder printing on the circuit board C is completed, the control device 20 drives the Y-direction moving mechanism 72 and the squeegee head 74 to return the squeegee device 30 to the standby position. In addition, the control device 20 drives the lifting mechanism 46, the clamp mechanism 50, and the support mechanism 52 to transfer the circuit board C to the X-direction transport mechanism 48 again. Further, the control device 20 sets the Y-direction moving mechanism 40, the X-direction moving mechanism 42, and the rotating mechanism 44 so that the X-direction conveying mechanism 48 is at a position where the circuit board C can be delivered to the delivery conveying device 82. To drive.
そして、制御装置20は、X方向搬送機構48と送り出し搬送装置82を駆動して、X方向搬送機構48から送り出し搬送装置82へ回路基板Cを受け渡す。その後、制御装置20は、送り出し搬送装置82を駆動して、下流側の基板搬送装置T2へ回路基板Cを送り出す。
Then, the control device 20 drives the X-direction transport mechanism 48 and the send-out transport device 82 to deliver the circuit board C from the X-direction transport mechanism 48 to the send-out transport device 82. Thereafter, the control device 20 drives the delivery / conveyance device 82 to deliver the circuit board C to the downstream substrate conveyance device T2.
以上のように、本実施例のスクリーン印刷機2では、回路基板撮像装置62aを保持するXY方向移動機構60に、回路基板測定装置64aが保持されている。このような構成とすることによって、回路基板Cの認識マークFの撮像動作と並行して回路基板Cの上面の形状データを取得することができ、スクリーン印刷機2のタクトタイムを短縮することができる。また、本実施例のスクリーン印刷機2では、スクリーンマスク撮像装置62bを保持するXY方向移動機構60に、スクリーンマスク測定装置64bが保持されている。このような構成とすることによって、スクリーンマスク28の認識マーク28bの認識動作と並行してスクリーンマスク28の下面の形状データを取得することができ、スクリーン印刷機2のタクトタイムを短縮することができる。
As described above, in the screen printing machine 2 of this embodiment, the circuit board measuring device 64a is held by the XY direction moving mechanism 60 that holds the circuit board imaging device 62a. By adopting such a configuration, the shape data of the upper surface of the circuit board C can be acquired in parallel with the imaging operation of the recognition mark F of the circuit board C, and the tact time of the screen printing machine 2 can be shortened. it can. In the screen printing machine 2 of the present embodiment, the screen mask measuring device 64b is held by the XY direction moving mechanism 60 that holds the screen mask imaging device 62b. With such a configuration, the shape data of the lower surface of the screen mask 28 can be acquired in parallel with the recognition operation of the recognition mark 28b of the screen mask 28, and the tact time of the screen printing machine 2 can be shortened. it can.
なお、回路基板測定装置64aにより取得される回路基板Cの上面の形状データおよび/またはスクリーンマスク測定装置64bにより取得されるスクリーンマスク28の下面の形状データは、回路基板Cの上昇量を特定する以外の用途に利用することもできる。例えば、図6に示すように、回路基板Cが下に凸な形状に撓んでいる場合、制御装置20は、回路基板Cにおいて所定のしきい値を超えて下方に撓んでいる箇所について、自動的にサポートピン56を配置して上方に押し上げるようにしてもよい。あるいは、制御装置20は、回路基板Cにおいて所定のしきい値を超えて下方に撓んでいる箇所について、サポートピン56を配置して上方へ押し上げるように、インターフェース装置22を介して作業者に促してもよい。このような構成とすることによって、はんだ印刷作業における不良の発生を抑制して、生産性を向上することができる。
Note that the shape data of the upper surface of the circuit board C acquired by the circuit board measuring device 64a and / or the shape data of the lower surface of the screen mask 28 acquired by the screen mask measuring device 64b specify the rising amount of the circuit board C. It can also be used for other purposes. For example, as shown in FIG. 6, when the circuit board C is bent in a downwardly convex shape, the control device 20 automatically determines a position where the circuit board C is bent downward beyond a predetermined threshold value. Alternatively, the support pin 56 may be arranged and pushed upward. Alternatively, the control device 20 urges the operator via the interface device 22 to place the support pin 56 and push it upward in a place where the circuit board C is bent downward beyond a predetermined threshold value. May be. With such a configuration, it is possible to improve the productivity by suppressing the occurrence of defects in the solder printing operation.
上記の実施例のように、回路基板測定装置64aとスクリーンマスク測定装置64bを別個に設ける代わりに、図7に示すように、単一のレーザ測長器である測定装置92によって、撮像測定装置26から回路基板CまでのZ方向の距離と、撮像測定装置26からスクリーンマスク28までのZ方向の距離を測定する構成としてもよい。図7に示す例では、測定装置92は回転機構90を介してXY方向移動機構60に保持されている。回転機構90は、図示しないモータの駆動によって、XY方向移動機構60に対してY軸周りに相対回転が可能となっている。制御装置20は、回転機構90を駆動して測定装置92を回路基板Cに向けることで、撮像測定装置26から回路基板CまでのZ方向の距離を測定することもできるし、回転機構90を駆動して測定装置92をスクリーンマスク28に向けることで、撮像測定装置26からスクリーンマスク28までのZ方向の距離を測定することもできる。
Instead of providing the circuit board measuring device 64a and the screen mask measuring device 64b separately as in the above embodiment, as shown in FIG. 7, a measuring device 92 that is a single laser length measuring device is used to measure the imaging measuring device. The distance in the Z direction from the circuit board C to the circuit board C and the distance in the Z direction from the imaging measurement device 26 to the screen mask 28 may be measured. In the example shown in FIG. 7, the measuring device 92 is held by the XY direction moving mechanism 60 via the rotating mechanism 90. The rotation mechanism 90 can be rotated around the Y axis with respect to the XY direction movement mechanism 60 by driving a motor (not shown). The control device 20 can measure the distance in the Z direction from the imaging measurement device 26 to the circuit board C by driving the rotation mechanism 90 and directing the measurement device 92 toward the circuit board C. By driving and directing the measuring device 92 toward the screen mask 28, the distance in the Z direction from the imaging measuring device 26 to the screen mask 28 can also be measured.
上記の実施例では、回路基板測定装置64a、スクリーンマスク測定装置64bおよび測定装置92として、レーザ測長器を用いる場合について説明したが、回路基板測定装置64a、スクリーンマスク測定装置64bおよび測定装置92は、対象物までの距離を測定することができれば、例えば超音波測長器等の他の測長器を用いてもよい。あるいは、撮像測定装置26に、Z方向移動機構をさらに設けて、画像のピント合わせによって、回路基板Cやスクリーンマスク28までの距離を測定してもよい。この場合、制御装置20は、撮像測定装置26のZ方向位置を変えながら回路基板撮像装置62aまたはスクリーンマスク撮像装置62bで回路基板Cまたはスクリーンマスク28を撮像し、ピントが合った時点での撮像測定装置26のZ方向位置に基づいて、回路基板Cまたはスクリーンマスク28までの距離を算出する。
In the above embodiment, the case where a laser length measuring device is used as the circuit board measuring device 64a, the screen mask measuring device 64b, and the measuring device 92 has been described. However, the circuit board measuring device 64a, the screen mask measuring device 64b, and the measuring device 92 are used. As long as the distance to the object can be measured, another length measuring device such as an ultrasonic length measuring device may be used. Alternatively, the imaging measuring device 26 may be further provided with a Z-direction moving mechanism to measure the distance to the circuit board C and the screen mask 28 by focusing the image. In this case, the control device 20 images the circuit board C or the screen mask 28 with the circuit board imaging device 62a or the screen mask imaging device 62b while changing the position of the imaging measuring device 26 in the Z direction, and the imaging at the time when the focus is achieved. Based on the position of the measuring device 26 in the Z direction, the distance to the circuit board C or the screen mask 28 is calculated.
上記の実施例では、回路基板Cとスクリーンマスク28の間に位置ずれが検出されると、制御装置20がY方向移動機構40、X方向移動機構42、回転機構44を駆動して、回路基板Cの位置の微調整を行う構成について説明したが、これらの機構の代わりに、スクリーンマスク28のY方向位置、X方向位置およびZ軸周りの角度を調整する機構を設けて、スクリーンマスク28の位置の微調整を行う構成としてもよい。
In the above embodiment, when a displacement is detected between the circuit board C and the screen mask 28, the control device 20 drives the Y-direction moving mechanism 40, the X-direction moving mechanism 42, and the rotating mechanism 44, and the circuit board. The configuration for finely adjusting the position of C has been described, but instead of these mechanisms, a mechanism for adjusting the Y-direction position, the X-direction position, and the angle around the Z-axis of the screen mask 28 is provided. A configuration for finely adjusting the position may be employed.
上記の実施例では、回路基板測定装置64aによって取得される、回路基板測定装置64aから回路基板Cの上面までのZ方向距離のXY面内での分布を、回路基板Cの上面の形状データとする構成について説明したが、回路基板Cの上面の形状データとしては、制御装置20が回路基板Cの上面の形状を認識可能であれば、どのようなデータであってもよい。同様に、上記の実施例では、スクリーンマスク測定装置64bによって取得される、スクリーンマスク測定装置64bからスクリーンマスク28の下面までのZ方向の距離のXY面内での分布を、スクリーンマスク28の下面の形状データとする構成について説明したが、スクリーンマスク28の下面の形状データとしては、制御装置20がスクリーンマスク28の下面の形状を認識可能であれば、どのようなデータであってもよい。
In the above-described embodiment, the distribution in the XY plane of the distance in the Z direction from the circuit board measuring device 64a to the upper surface of the circuit board C, obtained by the circuit board measuring device 64a, and the shape data of the upper surface of the circuit board C However, any data may be used as the shape data of the upper surface of the circuit board C as long as the control device 20 can recognize the shape of the upper surface of the circuit board C. Similarly, in the above-described embodiment, the distribution in the XY plane of the distance in the Z direction from the screen mask measuring device 64b to the lower surface of the screen mask 28, which is obtained by the screen mask measuring device 64b, is represented by the lower surface of the screen mask 28. However, the shape data of the lower surface of the screen mask 28 may be any data as long as the control device 20 can recognize the shape of the lower surface of the screen mask 28.
上記の実施例では、回路基板測定装置64aによって取得された回路基板Cの上面の形状データと、スクリーンマスク測定装置64bによって取得されたスクリーンマスク28の下面の形状データに基づいて、回路基板Cの上昇量を設定する構成について説明したが、スクリーンマスク28の撓みが無視できるほど小さい場合など、スクリーンマスク28の下面の形状データを取得する必要がない場合には、回路基板測定装置64aによって取得された回路基板Cの上面の形状データのみに基づいて、回路基板Cの上昇量を設定する構成としてもよい。
In the above embodiment, based on the shape data of the upper surface of the circuit board C acquired by the circuit board measuring device 64a and the shape data of the lower surface of the screen mask 28 acquired by the screen mask measuring device 64b, The configuration for setting the rising amount has been described. However, when it is not necessary to acquire the shape data of the lower surface of the screen mask 28, such as when the deflection of the screen mask 28 is negligibly small, it is acquired by the circuit board measuring device 64a. Alternatively, the rising amount of the circuit board C may be set based only on the shape data of the upper surface of the circuit board C.
上記の実施例では、回路基板測定装置64aによって取得された回路基板Cの上面の形状データと、スクリーンマスク測定装置64bによって取得されたスクリーンマスク28の下面の形状データに基づいて、回路基板Cの上昇量を設定する構成について説明したが、これとは異なる態様で、回路基板位置決め装置24の昇降機構46や、スキージ装置30のY方向移動機構72およびスキージヘッド74の動作を制御するように構成してもよい。例えば、上記の実施例において、回路基板測定装置64aによって取得された回路基板Cの上面の形状データと、スクリーンマスク測定装置64bによって取得されたスクリーンマスク28の下面の形状データに基づいて、回路基板Cのスクリーンマスク28からの版離れ動作の段階数や、版離れ動作の各段階における回路基板Cの下降距離または下降速度、あるいはスキージ装置30による印刷速度または印圧などを調整するように構成してもよい。
In the above embodiment, based on the shape data of the upper surface of the circuit board C acquired by the circuit board measuring device 64a and the shape data of the lower surface of the screen mask 28 acquired by the screen mask measuring device 64b, Although the configuration for setting the ascent amount has been described, the configuration is configured to control the operations of the lifting mechanism 46 of the circuit board positioning device 24, the Y-direction moving mechanism 72 of the squeegee device 30, and the squeegee head 74 in a different manner. May be. For example, in the above embodiment, the circuit board is based on the shape data of the upper surface of the circuit board C acquired by the circuit board measuring device 64a and the shape data of the lower surface of the screen mask 28 acquired by the screen mask measuring device 64b. The number of stages of plate separation operation from the screen mask 28 of C, the descending distance or descending speed of the circuit board C at each stage of the plate separating operation, or the printing speed or printing pressure by the squeegee device 30 are adjusted. May be.
本発明の代表的かつ非限定的な具体例について、図面を参照して詳細に説明した。この詳細な説明は、本発明の好ましい例を実施するための詳細を当業者に示すことを単純に意図しており、本発明の範囲を限定することを意図したものではない。また、開示された追加的な特徴ならびに発明は、さらに改善されたスクリーン印刷機を提供するために、他の特徴や発明とは別に、又は共に用いることができる。
Specific and non-limiting specific examples of the present invention have been described in detail with reference to the drawings. This detailed description is intended merely to present those skilled in the art with the details for practicing the preferred embodiments of the present invention and is not intended to limit the scope of the invention. Also, the disclosed additional features and inventions can be used separately from or together with other features and inventions to provide further improved screen printers.
また、上記の詳細な説明で開示された特徴や工程の組み合わせは、最も広い意味において本発明を実施する際に必須のものではなく、特に本発明の代表的な具体例を説明するためにのみ記載されるものである。さらに、上記の代表的な具体例の様々な特徴、ならびに、特許請求の範囲に記載されるものの様々な特徴は、本発明の追加的かつ有用な実施形態を提供するにあたって、ここに記載される具体例のとおりに、あるいは列挙された順番のとおりに組合せなければならないものではない。
Further, the combinations of features and steps disclosed in the above detailed description are not indispensable when practicing the present invention in the broadest sense, and are only for explaining representative specific examples of the present invention. It is described. Moreover, various features of the representative embodiments described above, as well as various features of what is recited in the claims, are described herein in providing additional and useful embodiments of the present invention. They do not have to be combined in the specific examples or in the order listed.
本明細書及び/又は特許請求の範囲に記載された全ての特徴は、実施例及び/又は特許請求の範囲に記載された特徴の構成とは別に、出願当初の開示ならびに特許請求の範囲に記載された特定事項に対する限定として、個別に、かつ互いに独立して開示されることを意図するものである。さらに、全ての数値範囲及びグループ又は集団に関する記載は、出願当初の開示ならびに特許請求の範囲に記載された特定事項に対する限定として、それらの中間の構成を開示する意図を持ってなされている。
All the features described in the specification and / or claims are described in the disclosure and the claims at the beginning of the application separately from the configuration of the features described in the embodiments and / or claims. It is intended that the specific details provided be disclosed separately and independently of one another. Further, all numerical ranges and descriptions regarding groups or groups are intended to disclose intermediate configurations thereof as a limitation to the specific matters described in the original disclosure and the claims.
以上、本発明の具体例を詳細に説明したが、これらは例示に過ぎず、特許請求の範囲を限定するものではない。特許請求の範囲に記載の技術には、以上に例示した具体例を様々に変形、変更したものが含まれる。本明細書または図面に説明した技術要素は、単独であるいは各種の組合せによって技術的有用性を発揮するものであり、出願時請求項記載の組合せに限定されるものではない。また、本明細書または図面に例示した技術は複数目的を同時に達成し得るものであり、そのうちの一つの目的を達成すること自体で技術的有用性を持つものである。
Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.
Claims (8)
- スクリーンマスクと、回路基板を保持して前記スクリーンマスクに向けて上昇させる回路基板昇降機構と、スキージを前記スクリーンマスクの上面に当接させて前記スクリーンマスクに沿って移動させるスキージ駆動機構を備えるスクリーン印刷機であって、
水平面内で移動可能であり、前記回路基板の上方から前記回路基板の認識マークを撮像する回路基板撮像装置と、
前記回路基板撮像装置と一体的に移動可能であり、前記回路基板の上面の形状データを取得する回路基板測定装置と、
前記回路基板昇降機構および前記スキージ駆動機構の動作を制御する制御装置を備えており、
前記制御装置が、前記回路基板測定装置によって取得された前記回路基板の上面の形状データに基づいて、前記回路基板昇降機構および/または前記スキージ駆動機構の動作を制御する、スクリーン印刷機。 A screen comprising a screen mask, a circuit board lifting mechanism for holding the circuit board and raising it toward the screen mask, and a squeegee driving mechanism for moving the squeegee along the screen mask while abutting the upper surface of the screen mask A printing press,
A circuit board imaging device which is movable in a horizontal plane and images a recognition mark of the circuit board from above the circuit board;
A circuit board measuring device that is movable integrally with the circuit board imaging device and acquires shape data of an upper surface of the circuit board;
A control device for controlling the operation of the circuit board lifting mechanism and the squeegee driving mechanism;
The screen printing machine, wherein the control device controls operations of the circuit board lifting mechanism and / or the squeegee driving mechanism based on shape data of the upper surface of the circuit board acquired by the circuit board measuring device. - 水平面内で移動可能であり、前記スクリーンマスクの下方から前記スクリーンマスクの認識マークを撮像するスクリーンマスク撮像装置と、
前記スクリーンマスク撮像装置と一体的に移動可能であり、前記スクリーンマスクの下面の形状データを取得するスクリーンマスク測定装置をさらに備えており、
前記制御装置が、前記回路基板測定装置によって取得された前記回路基板の上面の形状データと、前記スクリーンマスク測定装置によって取得された前記スクリーンマスクの下面の形状データに基づいて、前記回路基板昇降機構および/または前記スキージ駆動機構の動作を制御する、請求項1のスクリーン印刷機。 A screen mask imaging device which is movable in a horizontal plane and images a recognition mark of the screen mask from below the screen mask;
A screen mask measuring device that is movable integrally with the screen mask imaging device and that acquires shape data of a lower surface of the screen mask;
Based on the shape data of the upper surface of the circuit board acquired by the circuit board measuring device and the shape data of the lower surface of the screen mask acquired by the screen mask measuring device, the control device moves the circuit board lifting mechanism. The screen printing machine according to claim 1, wherein the operation of the squeegee driving mechanism is controlled. - 前記回路基板撮像装置と、前記回路基板測定装置と、前記スクリーンマスク撮像装置と、前記スクリーンマスク測定装置が、同一の移動機構によって保持されている、請求項2のスクリーン印刷機。 The screen printing machine according to claim 2, wherein the circuit board imaging device, the circuit board measuring device, the screen mask imaging device, and the screen mask measuring device are held by the same moving mechanism.
- 前記制御装置が、前記回路基板測定装置によって取得された前記回路基板の上面の形状データと、前記スクリーンマスク測定装置によって取得された前記スクリーンマスクの下面の形状データに基づいて、前記回路基板昇降機構による前記回路基板の上昇量を調整する、請求項3のスクリーン印刷機。 Based on the shape data of the upper surface of the circuit board acquired by the circuit board measuring device and the shape data of the lower surface of the screen mask acquired by the screen mask measuring device, the control device moves the circuit board lifting mechanism. The screen printing machine according to claim 3, wherein the amount of rise of the circuit board is adjusted.
- 前記制御装置が、前記回路基板の端部近傍における、前記回路基板の上面から前記スクリーンマスクの下面までの距離を、前記回路基板昇降機構による前記回路基板の上昇量に設定する、請求項4のスクリーン印刷機。 The control device sets the distance from the upper surface of the circuit board to the lower surface of the screen mask in the vicinity of the end of the circuit board as the amount of the circuit board raised by the circuit board lifting mechanism. Screen printing machine.
- 前記制御装置が、前記回路基板の中央部近傍における、前記回路基板の上面から前記スクリーンマスクの下面までの距離を、前記回路基板昇降機構による前記回路基板の上昇量に設定する、請求項4のスクリーン印刷機。 5. The control device according to claim 4, wherein the control device sets the distance from the upper surface of the circuit board to the lower surface of the screen mask in the vicinity of the center portion of the circuit board as the amount of rise of the circuit board by the circuit board lifting mechanism. Screen printing machine.
- 前記制御装置が、前記回路基板の上面から前記スクリーンマスクの下面までの距離の最小値を、前記回路基板昇降機構による前記回路基板の上昇量に設定する、請求項4のスクリーン印刷機。 The screen printing machine according to claim 4, wherein the control device sets a minimum value of a distance from an upper surface of the circuit board to a lower surface of the screen mask as an amount of the circuit board raised by the circuit board lifting mechanism.
- 前記制御装置が、前記回路基板の上面から前記スクリーンマスクの下面までの距離の最大値を、前記回路基板昇降機構による前記回路基板の上昇量に設定する、請求項4のスクリーン印刷機。 The screen printing machine according to claim 4, wherein the control device sets a maximum value of a distance from an upper surface of the circuit board to a lower surface of the screen mask to an amount of the circuit board raised by the circuit board lifting mechanism.
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CN107175892A (en) * | 2017-05-08 | 2017-09-19 | 长泰朗德机械设备有限公司 | A kind of intelligent screen printer of good cutting effect |
CN111093996A (en) * | 2017-09-07 | 2020-05-01 | 株式会社富士 | Screen printing machine |
JP2020138360A (en) * | 2019-02-27 | 2020-09-03 | 株式会社Fuji | Mask printer, viscous fluid printing method |
US20230060880A1 (en) * | 2021-08-24 | 2023-03-02 | Robert Bosch Gmbh | Flattening surface of pasted track in stencil printing process |
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JP2012158129A (en) * | 2011-02-02 | 2012-08-23 | Panasonic Corp | Apparatus and method for screen printing |
WO2013001815A1 (en) * | 2011-06-29 | 2013-01-03 | パナソニック株式会社 | Screen printing device and image recognition method for screen printing device |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107175892A (en) * | 2017-05-08 | 2017-09-19 | 长泰朗德机械设备有限公司 | A kind of intelligent screen printer of good cutting effect |
CN111093996A (en) * | 2017-09-07 | 2020-05-01 | 株式会社富士 | Screen printing machine |
EP3680105A4 (en) * | 2017-09-07 | 2020-09-23 | Fuji Corporation | Screen printing machine |
CN111093996B (en) * | 2017-09-07 | 2022-02-22 | 株式会社富士 | Screen printing machine |
JP2020138360A (en) * | 2019-02-27 | 2020-09-03 | 株式会社Fuji | Mask printer, viscous fluid printing method |
JP7291499B2 (en) | 2019-02-27 | 2023-06-15 | 株式会社Fuji | Mask printing machine, viscous fluid printing method |
US20230060880A1 (en) * | 2021-08-24 | 2023-03-02 | Robert Bosch Gmbh | Flattening surface of pasted track in stencil printing process |
Also Published As
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JPWO2015033402A1 (en) | 2017-03-02 |
JP6307086B2 (en) | 2018-04-04 |
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