JP2017033975A - Transport device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To clamp a warped substrate in corrected state.SOLUTION: In a transport device, a circuit board 52 warped downward is lifted to a position lower than a set height by a set distance. Next, the circuit board is clamped by clamp members 56, 58, and pressed downward by a pressing tool 88 at the edge. After pressing by means of the pressing tool is released, the circuit board is moved upward by a set distance. Consequently, a board warped downward can be clamped in corrected state. A circuit board warped upward is lifted to a set height. Next, that circuit board is pressed downward by the pressing tool in the central part, and deformed into a state warped downward. After the circuit board pressed by the pressing tool is clamped by the clamp member, pressing by the pressing tool is released. Consequently, the board warped upward can be clamped in corrected state.SELECTED DRAWING: Figure 15

Description

  The present invention relates to a conveyor device that includes a conveyor device that transports a substrate, a clamp device that clamps the substrate by clamping both edges of the substrate, and a support member that supports the substrate from below.

  In the transport device, the substrate is transported to a predetermined position by the conveyor device. Then, the substrate is lifted from the conveyor device by the support member, and the lifted substrate is clamped by the clamp device. Some substrates to be clamped are warped, and when the substrate is clamped in a state where the warp has occurred, there is a risk that the working accuracy for the substrate may be lowered. For this reason, as described in the following patent documents, a technique for clamping a warped substrate in a corrected state has been developed.

JP 2003-086997 A

  According to the technique described in the above patent document, it is possible to clamp the warped substrate in a corrected state. However, since the transport device described in the above-mentioned patent document has a structure for sandwiching the substrate in the vertical direction, the transport device having a structure for clamping the substrate by sandwiching both edges of the substrate in the left-right direction is described in the above-mentioned patent document. The technology cannot be applied. The present invention has been made in view of such circumstances, and an object of the present invention is to correct a warped substrate in a transport device having a structure in which both edges of the substrate are clamped by clamping in the left-right direction. It is to clamp in the state.

  In order to solve the above problems, a transport device described in the present application includes a conveyor device that transports a substrate and a pair of sandwiching members, and at least one of the pair of sandwiching members is brought close to both edges of the substrate. Is provided between the pair of clamping members and a support member that supports the substrate from below, and is conveyed to a predetermined position by the conveyor device. A transport device that lifts a substrate from the conveyor device by the support member and clamps the lifted substrate by the clamp device, the transport device being disposed above the conveyor device, A first member that controls the operation of the transport device in order to clamp the pressing member that is pressed from above and the substrate in a warped state in which the central portion of the substrate protrudes from the edge portion. A control device having a ramp unit, wherein the first clamp unit lifts the substrate transported to a predetermined position by the conveyor device up to a preset set height by the support member. And a first pressing member operation control unit that deforms the substrate into the warped state by pressing the central portion of the substrate lifted by the support member downward by the pressing member, and the pressing member It has a 1st clamping member operation | movement control part which clamps the board | substrate currently pressed by said pair of clamping members, and a 2nd pressing member operation | movement control part which cancels | releases the press by the said pressing member.

  In order to solve the above problems, a transport device described in the present application includes a conveyor device that transports a substrate and a pair of sandwiching members, and at least one of the pair of sandwiching members is brought close to both edges of the substrate. Is provided between the pair of clamping members and a support member that supports the substrate from below, and is conveyed to a predetermined position by the conveyor device. A transport device that lifts a substrate from the conveyor device by the support member and clamps the lifted substrate by the clamp device, the transport device being disposed above the conveyor device, A second member that controls the operation of the transporting device to clamp the pressing member that presses the substrate and the substrate in the downward warped state in which the edge of the substrate protrudes from the center portion. A control device having a ramp portion, wherein the second clamp portion lifts the substrate transported to a predetermined position by the conveyor device by the support member to a position lower than a preset set height by a set distance. 2 support member operation control unit; a second clamping member operation control unit that clamps the substrate lifted by the support member by the pair of clamping members; and an edge of the substrate sandwiched by the pair of clamping members A third pressing member operation control unit that presses downward by the pressing member, and a substrate held by the pair of holding members after the pressing by the pressing member is released, by the support member, And a third support member operation control unit that moves the set distance upward.

  In the transport device described in the present application, the substrate in the warped state is transported to a predetermined position by the conveyor device, and the substrate is lifted by the support member to a preset height. Next, the substrate lifted by the support member is pressed downward by the pressing member at the central portion, so that the substrate is deformed into a downward warped state. And after the board | substrate currently pressed by the press member is clamped by the clamp member, the press by a press member is cancelled | released. Thereby, it becomes possible to clamp by the clamping member in the state which corrected the board | substrate of the curvature state.

  Further, in the transport device described in the present application, the substrate in the downward warp state is transported to a predetermined position by the conveyor device, and the substrate is lifted by the support member to a position lower than the preset set height by a set distance. Next, the substrate lifted by the support member is sandwiched by the sandwiching member, and the sandwiched substrate is pressed downward by the pressing member at the edge. Then, after the pressing by the pressing member is released, the substrate held by the holding member is moved upward by a set distance by the supporting member. Thereby, it becomes possible to clamp by the clamping member in the state which corrected the board | substrate of the downward curvature state.

It is a top view which shows a solder printer. It is a side view which shows a conveying apparatus. It is a block diagram which shows a control apparatus. It is an action | operation figure of the conveying apparatus at the time of clamping a flat circuit board. It is an action | operation figure of the conveying apparatus at the time of clamping a flat circuit board. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a warp state. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a warp state. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a warp state. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a warp state. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a warp state. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a warp state. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a downward curvature state. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a downward curvature state. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a downward curvature state. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a downward curvature state. It is an action | operation figure of the conveying apparatus at the time of clamping the circuit board of a downward curvature state. It is a side view which shows the conveying apparatus of 2nd Example. It is an action | operation figure of the conveying apparatus of 2nd Example at the time of clamping the circuit board of a curvature state. It is an action | operation figure of the conveying apparatus of 2nd Example at the time of clamping the circuit board of a curvature state.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

[First embodiment]
<Configuration of solder printer>
FIG. 1 shows a solder printer 10 according to an embodiment of the present invention. The solder printer 10 is an apparatus for printing cream solder on a circuit board. The solder printer 10 includes a transport device 20, a moving device 22, a squeegee device 24, a solder supply device 26, a mask moving device (see FIG. 2) 27, and a pressing device (see FIG. 2) 28. Yes.

  As shown in FIG. 2, the transport device 20 includes a conveyor device 30, a clamp device 32, and a support device 34. The conveyor device 30 includes a pair of transport rails 36 and 38, a pair of conveyor belts 40 and 42, and an electromagnetic motor (see FIG. 3) 44. The pair of transport rails 36 and 38 are erected on the base 46 of the solder printer 10 so as to extend in the X-axis direction and face each other. The transport rail 36 is fixedly provided on the base 46 in the Y-axis direction, and the transport rail 38 is moved in a direction approaching and separating from the transport rail 36 by a ball screw mechanism (not shown), that is, the Y-axis. It is provided on the base 46 so as to be slidable in the direction. The pair of conveyor belts 40 and 42 are provided corresponding to the pair of transport rails 36 and 38, and each conveyor belt 40 and 42 is attached to the corresponding transport rails 36 and 38 with brackets 48 and 50. And is held so as to extend in the X-axis direction. The pair of conveyor belts 40 and 42 support the circuit board 52 on the upper surface, and the circuit board 52 is conveyed in the X-axis direction by driving the electromagnetic motor 44.

  The clamp device 32 includes a pair of clamping members 56 and 58 and an electromagnetic motor (see FIG. 3) 60. The clamping member 56 is fixed to the upper end of the transport rail 36. On the other hand, the clamping member 58 is disposed on the upper end of the transport rail 38 via an air cylinder (see FIG. 3) 61 so as to be slidable in the direction approaching and separating from the clamping member 56, that is, in the Y-axis direction. . The air pressure of the air cylinder 61 can be arbitrarily changed. The electromagnetic motor 60 operates a ball screw mechanism that slides the conveyance rail 38, and the conveyance rail 38 approaches and separates from the conveyance rail 36 by driving the electromagnetic motor 60. Thereby, the clamping member 58 approaches / separates the clamping member 56, and the distance between the pair of clamping members 56, 58 is arbitrarily adjusted. The clamp device 32 has an encoder (see FIG. 3) 62. The encoder 62 detects a rotation angle of a ball screw mechanism that slides the conveyance rail 38, and based on a detection value of the encoder 62, a distance between the pair of conveyance rails 36, 38, that is, a pair of pairs. The distance between the clamping members 56 and 58 is detected.

  The support device 34 includes a support base 64, an elevating device (see FIG. 3) 66, and a plurality of support pins (three are shown in the drawing) 68. The support base 64 is disposed between the pair of transport rails 36 and 38 and can be moved up and down. And the support stand 64 raises / lowers to arbitrary height by the action | operation of the raising / lowering apparatus 66. FIG. Further, the plurality of support pins 68 are erected on the support base 64 in a state of being arranged in 3 × 3 rows, that is, in a state of being arranged in 3 rows in the X direction and 3 rows in the Y direction, for example. ing. The support pins 68 can be attached to and detached from the support base 64.

  Further, as shown in FIG. 1, the moving device 22 includes a Y-axis direction slide mechanism 70 and an X-axis direction slide mechanism 72. The Y-axis direction slide mechanism 70 has a Y-axis slider 76 provided on the base 46 so as to be movable in the Y-axis direction. The Y-axis slider 76 is moved to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 3) 78. The X-axis direction slide mechanism 72 has an X-axis slider 80 provided on the side surface of the Y-axis slider 76 so as to be movable in the X-axis direction. The X-axis slider 80 is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 3) 82.

  The squeegee device 24 is attached to the lower surface side of the Y-axis slider 76 above the transport device 20. The squeegee device 24 has a squeegee (not shown), and the squeegee is held by the squeegee device 24 so as to be movable in the Y-axis direction and the vertical direction while extending downward. The squeegee moves in the Y-axis direction by driving an electromagnetic motor (see FIG. 3) 84 and moves up and down by driving an electromagnetic motor (see FIG. 3) 86.

  The solder supply device 26 is a device for supplying cream solder, and an outlet for discharging cream solder is formed on the lower surface of the solder supply device 26. The solder supply device 26 is detachably attached to the X-axis slider 80.

  The mask moving device 27 is disposed between the transport device 20 and the squeegee device 24, and moves the metal mask to an arbitrary position. Pattern holes are formed in the metal mask in accordance with the pattern of the pads of the circuit board 52.

  The pressing device 28 is disposed between the metal mask and the transport device 20. The pressing device 28 includes a moving device (see FIG. 3) 87, a pressing tool (see FIG. 2) 88, and an electromagnetic motor (see FIG. 3) 90. The moving device 87 moves the pressing tool 88 to an arbitrary position in the XY direction. As shown in FIG. 2, the pressing tool 88 has a generally block shape and is held by a moving device 87 so as to be movable in the vertical direction. The pressing tool 88 moves up and down by driving the electromagnetic motor 90.

  Furthermore, the solder printer 10 is provided with the control apparatus 100, as shown in FIG. The control device 100 includes a controller 102 and a plurality of drive circuits 104. The plurality of drive circuits 104 are connected to the electromagnetic motors 44, 60, 78, 82, 84, 86, 90, the air cylinder 61, the lifting device 66, and the moving device 87. The controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 104. As a result, the operations of the transport device 20, the moving device 22, the squeegee device 24, the solder supply device 26, the mask moving device 27, and the pressing device 28 are controlled by the controller 102. The controller 102 is connected to the encoder 62. As a result, the controller 102 acquires the detection value of the encoder 62 and calculates the distance between the pair of clamping members 56 and 58.

<Cream solder printing on circuit board>
In the solder printer 10, cream solder is printed on the circuit board 52 with the above-described configuration. Specifically, the circuit board 52 is conveyed to a predetermined work position by the conveyor device 30. Next, the support base 64 of the support device 34 is raised, and the circuit board 52 is lifted from the conveyor belts 40 and 42 by a plurality of support pins 68 as shown in FIG. At this time, the support base 64 is raised to a preset height H set in advance. The set height H is set so that the upper surface of the circuit board 52 and the upper surfaces of the clamping members 56 and 58 of the clamping device 32 are the same height, that is, flush with each other. When the circuit board 52 is lifted, the transport rail 38 is moved in a direction away from the transport rail 36 by the electromagnetic motor 60.

  Next, when the circuit board 52 is lifted, the transport rail 38 is moved in a direction approaching the transport rail 36 by the electromagnetic motor 60 as shown in FIG. Thereby, the clamping member 58 moves in a direction approaching the clamping member 56, and the circuit board 52 is clamped and clamped by the clamping members 56 and 58. The metal mask 110 is placed on the circuit board 52 by the operation of the mask moving device 27. Before the metal mask 110 is placed on the circuit board 52, the mark marked on the metal mask 110 and the mark marked on the circuit board 52 are imaged by an imaging device (not shown). Based on the imaging data, the circuit board 52 and the metal mask 110 are aligned. Further, since the size of the metal mask 110 is larger than the size of the circuit board 52, the metal mask 110 also extends over the clamping members 56 and 58. However, the upper surface of the circuit board 52 and the upper surfaces of the clamping members 56 and 58 are flush with each other. Therefore, the circuit board 52 and the metal mask 110 are in close contact with each other, and there is almost no gap between them.

  When the circuit board 52 is clamped by the holding members 56 and 58, the solder supply device 26 is moved above a predetermined position of the metal mask 110 placed on the circuit board 52 by the operation of the moving device 22. To do. Then, the solder supply device 26 supplies cream solder onto the metal mask 110. When the supply of the cream solder by the solder supply device 26 is completed, the squeegee device 24 moves above the supplied cream solder by the operation of the moving device 22. The squeegee device 24 moves the squeegee in the Y-axis direction after moving it downward. As a result, cream solder is applied to the upper surface of the metal mask 110, and the cream solder enters the pattern holes. At this time, since the circuit board 52 and the metal mask 110 are in close contact with each other and there is no gap between them, it is possible to appropriately print the cream solder on the circuit board 52.

  However, some of the circuit boards 52 are warped, and a gap is generated between the circuit board 52 and the metal mask 110 in the warped circuit board 52. For this reason, cream solder cannot be appropriately printed on the circuit board 52, and there is a possibility that the printing accuracy is lowered. Specifically, for example, the circuit board 52 in a state in which the central portion of the circuit board 52 protrudes from the edge (hereinafter sometimes referred to as “upward warped state”) is conveyed by the conveyor device 30 and is shown in FIG. Thus, the circuit board 52 is lifted by the support device 34. In this state, when the circuit board 52 is clamped by the clamping members 56 and 58, a gap is generated between the circuit board 52 and the metal mask 110 at the edge located below the center of the circuit board 52. In that part, there is a possibility that the cream solder is not properly printed. Further, the upper warping state of the circuit board 52 is promoted by the clamps of the holding members 56 and 58.

  For this reason, for example, it is conceivable to correct the warping state of the circuit board 52 using the pressing device 28. Specifically, when the circuit board 52 in the warped state is lifted by the support device 34, as shown in FIG. 7, the central portion of the circuit board 52 is pressed by the pressing tool 88 of the pressing device 28. Thereby, the circuit board 52 is corrected to be warped. However, when the pressing by the pressing tool 88 is released, the circuit board 52 is restored to a warped state. Therefore, for example, if a support pin having a suction function is employed as the support pin 68 that supports the circuit board 52, the circuit board 52 can be sucked downward. As a result, it is possible to prevent the circuit board 52 from being restored to the warped state and maintain the correction of the circuit board 52. However, when a support pin having a suction function is employed, it is not preferable because a cost increase occurs.

  In view of the above, in the solder printer 10, the circuit board 52 in the warped state is clamped in a state in which the warped state is corrected, using only the current components. Specifically, first, as shown in FIG. 8, the support pins 68 for supporting the center portion of the circuit board 52, that is, the support pins 68 arranged at the center in the Y-axis direction are removed from the support base 64. Then, after the circuit board 52 is conveyed to the work position by the conveyor device 30, the support base 64 of the support device 34 is raised. As a result, the circuit board 52 is lifted from the conveyor belts 40 and 42 by the plurality of support pins 68. At this time, the support base 64 is raised to the set height H, and the upper surface of the edge of the circuit board 52 is positioned slightly below the upper surfaces of the holding members 56 and 58 due to the warp of the circuit board 52.

  Next, as shown in FIG. 9, the central portion of the circuit board 52 is pressed by the pressing tool 88 of the pressing device 28. At this time, the central portion of the circuit board 52 is pressed by the pressing tool 88 so that the edge portion of the circuit board 52 protrudes from the central portion (hereinafter sometimes referred to as a “lower warped state”). . As a result, the upper warping state of the circuit board 52 is corrected, and the upper surface of the edge of the circuit board 52 and the upper surfaces of the holding members 56 and 58 almost coincide with each other. Subsequently, in a state where the circuit board 52 is pressed by the pressing tool 88, the transport rail 38 is moved in a direction approaching the transport rail 36 by the electromagnetic motor 60 as shown in FIG. 10. As a result, the clamping member 58 moves in a direction approaching the clamping member 56, and the circuit board 52 is clamped by the clamping members 56 and 58. At this time, the operation of the electromagnetic motor 60 is controlled so that the distance between the pair of clamping members 56 and 58 becomes (X-A). Note that X is a length dimension in the Y-axis direction of the circuit board 52 in a state where no warpage occurs, and A is a set value set to a relatively small value (for example, about 1 mm). Thereby, the circuit board 52 is clamped by the pair of clamping members 56 and 58 in the downward warped state. Then, the pressing of the circuit board 52 by the pressing tool 88 is released.

  Subsequently, the clamping member 58 is moved in a direction away from the clamping member 56 by the electromagnetic motor 60. At this time, as shown in FIG. 11, the operation of the electromagnetic motor 60 is controlled so that the distance between the pair of sandwiching members 56 and 58 becomes (X−B). B is a set value set to a value smaller than A (for example, about 0.3 to 0.5 mm). Thereby, the circuit board 52 is maintained in the downward warped state, but is clamped by the pair of clamping members 56 and 58 in a state where the downward warped state is relaxed. At this time, the circuit board 52 is in a downward warped state but is almost flat and is clamped by the pair of clamping members 56 and 58. In this way, by clamping the circuit board 52 according to the above-described procedure, it is possible to correct the warped circuit board 52 and clamp it in an almost flat state. In addition, the upper surface of the circuit board 52 and the upper surfaces of the clamping members 56 and 58 can be matched. Thereby, it becomes possible to ensure the printing accuracy of the cream solder on the circuit board 52.

  In addition, if the circuit board 52 in the warped state is to be clamped according to the conventional technique, the clamp may not be possible. Specifically, in order to clamp the circuit board 52 with a pair of clamping members 56 and 58, when the support base 64 is raised to a set height H as shown in FIG. If the thickness of the substrate 52 is exceeded, the edge of the circuit substrate 52 is positioned above the upper surface of the clamping member 56. In such a case, the circuit board 52 cannot be clamped by the clamping members 56 and 58 even if the transport rail 38 is brought close to the transport rail 36.

  In view of the above, in the solder printer 10, the support base 64 is moved from the set height H to the set distance C to clamp the circuit board 52 by the pair of clamping members 56 and 58, as shown in FIG. Is raised to the height (HC) subtracted. The set distance C is an allowable value of the warp amount of the circuit board 52 determined by the solder printer 10. Accordingly, the edge of the circuit board 52 supported by the support device 34 is positioned below the upper surfaces of the sandwiching members 56 and 58. When clamping the circuit board 52 in the downward warped state, all the support pins 68 are set on the support base 64.

  Next, as shown in FIG. 14, the transport rail 38 is moved in a direction approaching the transport rail 36 by the electromagnetic motor 60. Thereby, the circuit board 52 is clamped by the clamping members 56 and 58. However, the air pressure of the air cylinder 61 is adjusted so that the clamping member 58 slides when a predetermined force is applied from the circuit board 52 to the clamping member 58. That is, the air pressure of the air cylinder 61 is adjusted so that the clamping force of the circuit board 52 by the clamping members 56 and 58 is lower than a predetermined force. The predetermined force is set to a pressing force by the pressing tool 88 of the pressing device 28.

  Next, both edge portions of the circuit board 52 are pressed by the pressing tool 88 of the pressing device 28 as shown in FIG. Thereby, the downward warping state of the circuit board 52 is corrected, and the circuit board 52 becomes flat. At this time, the pressing force of the pressing tool 88 is transmitted to the clamping member 58 via the circuit board 52. And the clamping member 58 is pressed in the direction away from the clamping member 56 by the force, and slides in that direction. Thereby, the expansion in the width direction of the circuit board 52 accompanying the correction of the circuit board 52 is absorbed by the slide of the holding member 58. However, since the clamping force of the clamping members 56 and 58 is generated, the circuit board 52 is clamped by the clamping members 56 and 58 in a flat state.

  Subsequently, the support base 64 is raised by a set distance C. That is, the support base 64 is raised to the set height H as shown in FIG. 16 by being raised by the set distance C from the initial height (HC). At this time, the circuit board 52 is lifted with the edges of the circuit board 52 held between the holding members 56 and 58 sliding on the holding members 56 and 58. Thereby, the upper surface of the circuit board 52 and the upper surfaces of the clamping members 56 and 58 are flush with each other. In this way, by clamping the circuit board 52 according to the above-described procedure, the circuit board 52 in the downward warped state can be corrected and clamped in a flat state. In addition, the upper surface of the circuit board 52 and the upper surfaces of the clamping members 56 and 58 can be matched. Thereby, it becomes possible to ensure the printing accuracy of the cream solder on the circuit board 52.

  In the solder printing machine 10 according to the first embodiment, depending on the type of the circuit board 52, a clamping method corresponding to the circuit board 52 in the upward warped state and a clamping method corresponding to the circuit board 52 in the downward warping state are provided. Either one is adopted. Specifically, the circuit board 52 is generally in either an upper warped state or a lower warped state depending on the type. That is, for example, the A-type circuit board 52 is almost in a warped state, and the B-type circuit board 52 is almost in a warped state. For this reason, when a solder printing operation is performed on the A-type circuit board 52, a clamping method corresponding to the circuit board 52 in the warped state is employed, and the solder printing operation is performed on the B-type circuit board 52. In this case, a clamping method corresponding to the circuit board 52 in the warped state is employed. When the solder printing operation is performed on the B type circuit board 52, the support pins 68 that support the central portion of the circuit board 52 among the plurality of support pins 68 are removed from the support base 64.

[Second Embodiment]
In the solder printer 10 according to the first embodiment, as described above, according to the type of the circuit board 52, the clamping method corresponding to the circuit board 52 in the warped state and the clamp corresponding to the circuit board 52 in the downward warp state. One of the methods is adopted. This is because the circuit board 52 is generally in either the upper warped state or the lower warped state depending on the type. However, rarely, even with the same type of circuit board 52, there may be a mixture of an upper warped circuit board and a lower warped circuit board. That is, the A-type circuit board 52 is almost in a warped state, but the A-type circuit board is rarely in an upward-warped state. In view of the above, in the solder printing machine according to the second embodiment, the warping state of the circuit board is detected, and according to the detection result, the clamping method corresponding to the circuit board 52 in the upper warping state, and the lower warping state Any one of the clamping methods corresponding to the circuit board 52 is employed.

  Specifically, in the solder printing machine of the second embodiment, as shown in FIG. 17, the same support pins 68 and extendable support pins 120 as in the above embodiment are placed on the support base 64. A distance sensor 122 is attached to the pressing tool 88. The solder printer of the second embodiment has substantially the same configuration as the solder printer 10 of the first embodiment, except for the expansion / contraction support pins 120 and the distance sensor 122. For this reason, in the second embodiment, description will be made centering on the telescopic support pin 120 and the distance sensor 122, and the same functional components will be described using the same reference numerals as those of the solder printer 10 of the first embodiment. Omitted.

  The telescopic support pin 120 includes a cylindrical portion 124, a pin portion 126, and a compression spring 128. The cylindrical portion 124 has a generally bottomed cylindrical shape. The pin portion 126 is held inside the cylindrical portion 124 so as to be able to advance and retreat with the upper end portion protruding. The compression spring 128 is disposed in a compressed state between the bottom surface of the cylindrical portion 124 and the bottom surface of the pin portion 126. Thereby, the expansion-contraction support pin 120 can be expanded and contracted. Further, the telescopic support pin 120 is provided with a stopper (not shown), and the protruding amount of the pin portion 126 is limited. The height dimension of the telescopic support pin 120 is the same as the height dimension of the support pin 68 in the most extended state.

  A plurality of expansion / contraction support pins 120 are arranged on the upper surface of the support base 64 side by side in the X-axis direction at the center in the Y-axis direction. On the other hand, a plurality of support pins 68 are arranged side by side in the X-axis direction at both ends in the Y-axis direction on the upper surface of the support base 64. As a result, the circuit board 52 is supported by the expansion / contraction support pins 120 at the center, and supported by the support pins 68 at both edges in the Y-axis direction.

  The distance sensor 122 is disposed on the side surface of the pressing tool 88. The distance sensor 122 irradiates laser light or the like downward, and receives the light reflected by the object. Then, the distance between the distance sensor 122 and the object is detected based on the time from the irradiation of the laser light to the reception of the reflected light. Based on this principle, the distance sensor 122 detects the distance between the circuit board 52 conveyed by the conveyor device 30 and the distance sensor 122.

In the solder printer of the second embodiment, when the circuit board 52 is transported to the work position, the distance sensor 122 causes the distance L ₁ between the center of the circuit board 52 and the distance sensor 122 to be A distance L ₂ between the edge of the substrate 52 and the distance sensor 122 is detected. Based on the detected value, the warpage amount ΔL (= | L ₁ −L ₂ |) of the circuit board 52 is calculated. Further, it is determined whether the circuit board 52 is in a downward warped state or an upward warped state. Specifically, if the distance L ₁ is longer than the distance L _2, it is determined that the anhedral state, the distance L ₂ is longer than the distance L _1, is determined to be a cambered state.

  When the calculation and determination based on the detection value is completed, the circuit board 52 is clamped according to a clamping method according to the determination. Since the clamping method in the case where the circuit board 52 is warped is the same as the clamping method in the first embodiment, the description is omitted. However, also in the second embodiment, as shown in FIG. 13, when the circuit board 52 is lifted by the support device 34, the support base 64 has a height (HC) obtained by subtracting the set distance C from the set height H. However, the calculated warping amount ΔL of the circuit board 52 is used as the set distance C in the second embodiment.

  As a result, even the circuit board 52 warped beyond the allowable value can be clamped by the clamping members 56 and 58. Specifically, in the first embodiment, the set distance C is an allowable value of the warp amount of the circuit board 52 determined by the solder printer 10. That is, when the allowable value of the warp amount is 2 mm, for example, the set distance C is set to 2. For this reason, the circuit board 52 warped by more than 2 mm has been determined to be a circuit board that cannot be clamped. On the other hand, in the second embodiment, the set distance C is set to the calculated warpage amount ΔL of the circuit board 52. For this reason, for example, even the circuit board 52 that warps beyond 2 mm can be clamped.

  In addition, the clamping method when the circuit board 52 is warped is almost the same as the clamping method in the first embodiment, and therefore, different points will be mainly described. First, in the first embodiment, when the circuit board to be clamped is warped, the support pins 68 that support the central portion of the circuit board 52 are removed from the support base 64. On the other hand, in the second embodiment, the telescopic support pins 120 that support the central portion of the circuit board 52 are not removed from the support base 64. This is because, unlike the support pin 68, the expansion / contraction support pin 120 expands and contracts.

  Specifically, when the circuit board 52 to be clamped is warped, the support base 64 is raised to the set height H after the circuit board 52 is transported to the working position, and the circuit board 52 is supported by the support pins 68. And lifted by the telescopic support pin 120. And as shown in FIG. 18, the center part of the circuit board 52 is pressed by the pressing tool 88, and the circuit board 52 is made into the downward warping state. At this time, since the central portion of the circuit board 52 is supported by the expansion / contraction support pins 120, the expansion / contraction support pins 120 contract as the pressing tool 88 is pressed. As described above, in the second embodiment, the expansion / contraction support pin 120 is employed as the support pin for supporting the center portion of the circuit board 52, and therefore, it is necessary to remove the support pin for supporting the center portion of the circuit board 52. There is no. As a result, the expansion / contraction support pins 120 can be always set on the support base 64, and it is possible to cope with both the circuit board 52 in the downward warped state and the circuit board 52 in the upward warped state. Become.

In the first embodiment, when the circuit board 52 is clamped, the operation of the electromagnetic motor 60 is controlled using the detection value of the encoder 62, that is, the distance between the pair of clamping members 56 and 58. However, in the second embodiment, the operation of the electromagnetic motor 60 is controlled using the detection value of the distance sensor 122, that is, the distance between the distance sensor 122 and the circuit board 52. Specifically, when the operation of the electromagnetic motor 60 is controlled, the distance sensor 122 detects the distance L ₁ between the center portion of the circuit board 52 and the distance sensor 122. Then, the operation of the electromagnetic motor 60 is controlled so that the distance L ₁ becomes a distance (L ₂ + D) obtained by adding the set distance D to the distance L ₂ between the edge of the circuit board 52 and the distance sensor 122. Is done. As a result, the circuit board 52 can be clamped by the holding members 56 and 58 while maintaining the warped state. The set distance D is a distance set so that the circuit board 52 clamped by the holding members 56 and 58 is slightly warped. Specifically, for example, in the first embodiment, the circuit is approximately the same as the warpage amount of the circuit board 52 clamped in a state where the distance between the pair of sandwiching members 56 and 58 is (XB). The set distance D is set so that the substrate 52 is warped.

  As described above, in the solder printing machine according to the second embodiment, it is determined whether the circuit board 52 is warped or warped according to the detection result of the distance sensor 122, and the determined circuit board is determined. A clamping method corresponding to the warping state of 52 is employed. As a result, even when the same type of circuit board 52 includes both a warped circuit board and a lower warped circuit board, the circuit board can be appropriately clamped.

  In addition, the controller 102 of the control apparatus 100 has the 1st clamp part 130, the 2nd clamp part 132, and the determination part 134, as shown in FIG. The first clamp part 130 is a functional part for clamping the circuit board 52 in the warped state. The second clamp part 132 is a functional part for clamping the circuit board 52 in the downward warped state. The determination unit 134 is a functional unit for determining whether the circuit board 52 is in the downward warped state or the upward warped state based on the detection value of the distance sensor 122.

  The first clamp unit 130 includes a first support member operation control unit 140, a first pressing member operation control unit 142, a first holding member operation control unit 144, a second pressing member operation control unit 146, A third holding member operation control unit 148. The first support member operation control unit 140 is a functional unit for lifting the support base 64 that supports the circuit board 52 in the warped state to the set height H by the support device 34. The first pressing member operation control unit 142 is a functional unit for pressing the central portion of the circuit board 52 lifted by the control of the first support member operation control unit 140 with the pressing tool 88. The first holding member operation control unit 144 is a functional unit for holding the circuit board 52 pressed by the control of the first pressing member operation control unit 142 between the holding members 56 and 58. The second pressing member operation control unit 146 is a functional unit for releasing the pressing of the pressing tool 88 under the control of the first pressing member operation control unit 142. The third holding member operation control unit 148 is a functional unit for operating the transport rail 38 after the second pressing member operation control unit 146 releases the press.

  The second clamp part 132 includes a second support member operation control unit 150, a second holding member operation control unit 152, a third pressing member operation control unit 154, and a third support member operation control unit 156. Including. The second support member operation control unit 150 is a functional unit for lifting the support base 64 that supports the circuit board 52 in the warped state to the height (HC) by the support device 34. The second holding member operation control unit 152 is a functional unit for holding the circuit board 52 lifted by the control of the second support member operation control unit 150 between the holding members 56 and 58. The third pressing member operation control unit 154 is a functional unit for pressing both edges of the circuit board 52 sandwiched by the control of the second holding member operation control unit 152 with the pressing tool 88. The third support member operation control unit 156 is a functional unit for increasing the set distance C after the pressing of the pressing tool 88 under the control of the third pressing member operation control unit 154 is released.

  Incidentally, in the above-described embodiment, the transport device 20 is an example of a transport device. The conveyor device 30 is an example of a conveyor device. The clamp device 32 is an example of a clamp device. The clamping members 56 and 58 are an example of a clamping member. The encoder 62 is an example of a first detection sensor. The support pin 68 is an example of a support member and a support pin. The pressing tool 88 is an example of a pressing member. The control device 100 is an example of a control device. The telescopic support pin 120 is an example of a support member and a support pin. The distance sensor 122 is an example of a detection sensor and a second detection sensor. The first clamp part 130 is an example of a first clamp part. The second clamp part 132 is an example of a second clamp part. The determination unit 134 is an example of a determination unit. The first support member operation control unit 140 is an example of a first support member operation control unit. The first pressing member operation control unit 142 is an example of a first pressing member operation control unit. The first holding member operation control unit 144 is an example of a first holding member operation control unit. The second pressing member operation control unit 146 is an example of a second pressing member operation control unit. The third holding member operation control unit 148 is an example of a third holding member operation control unit. The second support member operation control unit 150 is an example of a second support member operation control unit. The second holding member operation control unit 152 is an example of a second holding member operation control unit. The third pressing member operation control unit 154 is an example of a third pressing member operation control unit. The third support member operation control unit 156 is an example of a third support member operation control unit.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the present invention is applied to the transfer device of the solder printer, but the present invention is applied to the transfer device of various anti-substrate work machines such as a mounting work machine. It is possible.

  In the above embodiment, the distance between the pair of clamping members 56 and 58 is calculated based on the detection value of the encoder 62 and indirectly detected. The distance between them may be detected directly. That is, instead of the encoder 62, a distance sensor that detects the distance between the pair of clamping members 56 and 58 may be provided.

  Moreover, in the said Example, although the pressing tool 88 moves to an up-down direction by the drive of the electromagnetic motor 90, you may move to an up-down direction by the drive of another drive source, for example, an air cylinder.

  20: Conveying device 30: Conveyor device 32: Clamp device 56: Clamping member 58: Clamping member 62: Encoder (first detection sensor) 68: Support pin (support member) 88: Pressing tool (pressing member) 100: Control device 120 : Telescopic support pin (support pin) (support member) 122: distance sensor (detection sensor) (second detection sensor) 130: first clamp unit 132: second clamp unit 134: determination unit 140: first support member operation control Unit 142: first pressing member operation control unit 144: first holding member operation control unit 146: second pressing member operation control unit 148: third holding member operation control unit 150: second support member operation control unit 152: Second holding member operation control unit 154: Third pressing member operation control unit 156: Third support member operation control unit

Claims (10)

A conveyor device for transporting the substrate;
A clamping device having a pair of clamping members, clamping at least one of the pair of clamping members, and clamping both edges of the substrate to clamp the substrate;
A support member disposed between the pair of sandwiching members and supporting the substrate from below;
The substrate transported to a predetermined position by the conveyor device is lifted from the conveyor device by the support member, and the transported device clamps the lifted substrate by the clamp device,
The transfer device
A pressing member disposed above the conveyor device and pressing the substrate from above;
A control device having a first clamp portion for controlling the operation of the transfer device in order to clamp the warped substrate in which the central portion of the substrate protrudes from the edge portion,
The first clamp part is
A first support member operation control unit that lifts the substrate transported to a predetermined position by the conveyor device to a preset height by the support member;
A first pressing member operation control unit that deforms the substrate into the downward warped state by pressing a center portion of the substrate lifted by the support member downward by the pressing member;
A first clamping member operation control unit for clamping the substrate pressed by the pressing member by the pair of clamping members;
And a second pressing member operation control unit for releasing the pressing by the pressing member. A conveyor device for transporting the substrate;
A clamping device having a pair of clamping members, clamping at least one of the pair of clamping members, and clamping both edges of the substrate to clamp the substrate;
A support member disposed between the pair of clamping members and supporting the substrate from below;
The substrate transported to a predetermined position by the conveyor device is lifted from the conveyor device by the support member, and the transported device clamps the lifted substrate by the clamp device,
The transfer device
A pressing member disposed above the conveyor device and pressing the substrate from above;
A control device having a second clamp portion for controlling the operation of the transfer device in order to clamp the substrate in a downward warped state in which the edge portion of the substrate protrudes from the central portion;
The second clamp part is
A second support member operation control unit that lifts the substrate transported to a predetermined position by the conveyor device by the support member to a position lower than a preset set height by a set distance;
A second clamping member operation control unit for clamping the substrate lifted by the support member by the pair of clamping members;
A third pressing member operation control unit that presses the edge of the substrate held by the pair of holding members downward by the pressing member;
A third support member operation control unit configured to move the substrate sandwiched by the pair of sandwiching members upward by the set distance by the support member after the pressing by the pressing member is released; A transport device. The transfer device includes a detection sensor that detects the amount of warpage of the substrate,
The transport apparatus according to claim 2, wherein the set distance is set to a distance corresponding to a warp amount of the substrate detected by the detection sensor. The transfer device includes a detection sensor that detects the amount of warpage of the substrate,
The control device is
A determination unit that determines whether the substrate to be clamped is in the downward warping state based on the amount of warpage of the substrate detected by the detection sensor;
The second clamp part is
The operation of the transfer device is controlled to clamp the substrate in the downward warped state when the determination unit determines that the substrate to be clamped is in the downward warped state. Or the conveying apparatus of Claim 3. The second clamping member operation control unit is
The substrate lifted by the support member is clamped by the pair of clamping members with a force lower than the force with which the pressing member presses the substrate by the third pressing member operation control unit,
5. The transport device according to claim 2, wherein at least one of the pair of clamping members is moved by the pressing of the pressing member of the third pressing member operation control unit. . The transfer device includes a detection sensor that detects the amount of warpage of the substrate,
The control device is
A determination unit that determines whether or not a substrate to be clamped is in the warped state based on the amount of warpage of the substrate detected by the detection sensor;
The first clamp part is
The operation of the transfer device is controlled to clamp the warped substrate when the determination unit determines that the substrate to be clamped is in the warped state. The conveying apparatus as described in. The first clamp part is
After the pressing of the pressing member by the second pressing member operation control unit is released, at least one of the pair of sandwiching members is maintained so that the downward warping state is relaxed while maintaining the downward warping state of the substrate. The conveying apparatus according to claim 1, further comprising a third clamping member operation control unit that moves one of the members. The transport device includes a first detection sensor for detecting a distance between the pair of clamping members,
The third clamping member operation control unit is
The transport apparatus according to claim 7, wherein at least one of the pair of holding members is moved so that a distance detected by the first detection sensor is shorter than a width of the substrate. The transport device is provided above the conveyor device, and includes a second detection sensor for detecting a distance from the substrate,
The third clamping member operation control unit is
At least one of the pair of clamping members is arranged such that a detection distance at the center of the substrate detected by the second detection sensor is longer than a detection distance at an edge of the substrate detected by the second detection sensor. The transport device according to claim 7, wherein the transport device is moved. The support member is a plurality of support pins for supporting the substrate from below;
The transport apparatus according to claim 1, wherein one or more support pins that support a central portion of the substrate among the plurality of support pins are extendable and contractible.

Images