WO2010147056A1 - インプリントシステム、インプリント方法及びコンピュータ記憶媒体 - Google Patents
インプリントシステム、インプリント方法及びコンピュータ記憶媒体 Download PDFInfo
- Publication number
- WO2010147056A1 WO2010147056A1 PCT/JP2010/059920 JP2010059920W WO2010147056A1 WO 2010147056 A1 WO2010147056 A1 WO 2010147056A1 JP 2010059920 W JP2010059920 W JP 2010059920W WO 2010147056 A1 WO2010147056 A1 WO 2010147056A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- template
- unit
- imprint
- substrate
- loading
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/58—Applying the releasing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Definitions
- the present invention provides an imprint including an imprint unit that uses a template having a transfer pattern formed on a surface thereof to transfer the transfer pattern to a coating film formed on a substrate and to form a predetermined pattern on the coating film.
- the present invention relates to a system, an imprint method using the imprint system, and a computer storage medium.
- a semiconductor wafer (hereinafter referred to as “wafer”) is subjected to a photolithography process to form a predetermined resist pattern on the wafer.
- the resist pattern When forming the above-described resist pattern, the resist pattern is required to be miniaturized in order to further increase the integration of the semiconductor device.
- the limit of miniaturization in the photolithography process is about the wavelength of light used for the exposure process. For this reason, it has been advancing to shorten the wavelength of exposure light.
- there are technical and cost limitations to shortening the wavelength of the exposure light source and it is difficult to form a fine resist pattern on the order of several nanometers, for example, only by the method of advancing the wavelength of light. is there.
- the imprint method described above is repeated, that is, if a resist pattern is formed on a plurality of wafers using a single template, the pattern cannot be transferred correctly from a certain point in time.
- a release agent having a liquid repellency with respect to the resist is usually formed on the surface of the template. This is because the release agent deteriorates. For this reason, it is necessary to exchange a template regularly.
- the present invention has been made in view of such points, and an object of the present invention is to efficiently exchange templates and continuously form a predetermined pattern on a plurality of substrates.
- the present invention uses a template having a transfer pattern formed on the surface to transfer the transfer pattern to a coating film formed on a substrate, and forms a predetermined pattern on the coating film.
- a substrate loading / unloading station connected to the imprint unit, capable of holding a plurality of the substrates, and loading / unloading the substrate to / from the imprint unit;
- a template loading / unloading station that can hold a plurality of the templates and that loads and unloads the templates at a predetermined timing on the imprint unit side.
- the predetermined timing for loading and unloading the template is set in consideration of, for example, deterioration of the template.
- the template is also carried in / out when different patterns are formed on the substrate.
- the imprint unit uses the one template to form a predetermined pattern on a predetermined number of substrates, and then This template can be continuously exchanged with another template.
- the template in the imprint unit can be exchanged continuously and efficiently even before the template deteriorates or when different patterns are formed on a plurality of substrates. Therefore, a predetermined pattern can be continuously formed on a plurality of substrates.
- an imprint unit that uses a template having a transfer pattern formed on a surface thereof to transfer the transfer pattern to a coating film formed on a substrate and to form a predetermined pattern on the coating film.
- Connected to the imprint unit capable of holding a plurality of substrates, and connected to the imprint unit, and capable of holding a plurality of templates, connected to the imprint unit, and a substrate loading / unloading station for loading / unloading the substrate to / from the imprint unit side.
- an imprint system having a template loading / unloading station for loading / unloading the template to / from the imprint unit, wherein the imprint unit uses a predetermined number of the templates.
- a readable computer storage medium storing a program that operates on a computer of a control unit that controls the imprint system.
- the template can be exchanged efficiently, and a predetermined pattern can be continuously formed on a plurality of substrates.
- FIG. 11 shows a mode that the resist liquid was apply
- FIG. 11C shows a state in which a resist pattern is formed on the wafer
- FIG. 11D shows a state in which the remaining film on the wafer has been removed. Show the state.
- It is a top view which shows the outline of a structure of the imprint system concerning other embodiment.
- It is a side view which shows the outline of a structure of the imprint system concerning other embodiment.
- FIG. 28 It is a cross-sectional view which shows the outline of a structure of a pre-cleaning unit. It is a longitudinal cross-sectional view which shows the outline of a structure of a heating unit. It is a longitudinal cross-sectional view which shows the outline of a structure of a post-cleaning unit. It is a cross-sectional view which shows the outline of a structure of a post-cleaning unit. It is the flowchart which showed each process of the imprint process. It is explanatory drawing which showed typically the state of the template and wafer in each process of an imprint process, (a) of FIG. 28 shows a mode that the surface of the template was wash
- FIG. 28 (c) shows the state where the release agent is applied to the surface
- FIG. 28 (c) shows the state where the release agent on the template is baked
- FIG. 28 (d) shows the case where the release agent is formed on the template.
- FIG. 28 (e) shows a state where a resist solution is applied on the wafer
- FIG. 28 (f) shows a state where a resist film on the wafer is photopolymerized
- FIG. (G) shows a state in which a resist pattern is formed on the wafer
- (h) in FIG. 28 shows a state in which the remaining film on the wafer is removed.
- It is a top view which shows the outline of a structure of the imprint system concerning other embodiment.
- FIG. 32 shows a mode that the resist liquid was apply
- FIG. 32C shows a state in which a resist pattern is formed on the wafer
- FIG. 32D shows a state in which the remaining film on the wafer has been removed. Show the state.
- FIG. 32D shows a top view which shows the outline of a structure of the imprint system concerning other embodiment.
- FIG. 38 shows a mode that the surface of the template was wash
- FIG. 38B shows a state in which the vaporized release agent is deposited on the surface of the template
- FIG. 38C shows a state in which the release agent on the template is baked.
- FIG. 1 is a plan view showing an outline of a configuration of an imprint system 1 according to the present embodiment.
- FIG. 2 is a side view illustrating the outline of the configuration of the imprint system 1.
- a template T having a rectangular parallelepiped shape and having a predetermined transfer pattern C formed on the surface is used as shown in FIG.
- the transfer pattern C means the side of the template T which is formed with the surface T 1, the surface T 1 opposite to the surface of the backside T 2.
- the release agent S along the shape of the transfer pattern C as shown in FIG. 4 is deposited.
- a transparent material that can transmit visible light, near ultraviolet light, ultraviolet light, or the like, such as glass is used.
- a material having liquid repellency with respect to a resist film on the wafer which will be described later, for example, a fluororesin is used.
- Imprint system 1 includes a plurality as shown in FIG. 1, for example, five of the template T or transferring, between the outside and the imprint system 1 in the cassette unit, carrying out a template T the template cassette C T A template loading / unloading station 2, an imprint unit 3 for forming a resist pattern on a wafer W as a substrate using the template T, and a plurality of, for example, 25 wafers W in the cassette unit and the imprint system 1. And a wafer loading / unloading station 4 serving as a substrate loading / unloading station for loading / unloading the wafer W to / from the wafer cassette CW .
- the template loading / unloading station 2 is provided with a cassette mounting table 10.
- the cassette mounting table 10 can mount a plurality of template cassettes CT in a line in the X direction (vertical direction in FIG. 1). That is, the template carry-in / out station 2 is configured to be capable of holding a plurality of templates T.
- the template carry-in / out station 2 is provided with a template carrier 12 that can move on a conveyance path 11 extending in the X direction.
- Template carrier 12 is also movable in the vertical direction and the vertical around (theta direction), can transfer the template T with the template cassette C T and the imprint unit 3.
- the template loading / unloading station 2 is further provided with a reversing unit 13 for reversing the front and back surfaces of the template T.
- the wafer loading / unloading station 4 is provided with a cassette mounting table 20.
- the cassette mounting table 20 can mount a plurality of wafer cassettes CW in a row in the X direction (vertical direction in FIG. 1). That is, the wafer carry-in / out station 4 is configured to be capable of holding a plurality of wafers W.
- the wafer carry-in / out station 4 is provided with a wafer carrier 22 that can move on a conveyance path 21 extending in the X direction.
- the wafer transfer body 22 is also movable in the vertical direction and around the vertical direction ( ⁇ direction), and can transfer the wafer W between the wafer cassette CW and the imprint unit 3.
- the wafer carry-in / out station 4 is further provided with an alignment unit 23 for adjusting the orientation of the wafer W.
- the orientation of the wafer W is adjusted based on the position of the notch portion of the wafer W, for example.
- the imprint unit 3 has a casing 30 in which a loading / unloading port (not shown) for the template T and a loading / unloading port (not shown) for the wafer W are formed on the side surfaces.
- a wafer holder 31 as a substrate holder on which the wafer W is placed and held is provided on the bottom surface of the casing 30.
- the wafer W is placed on the upper surface of the wafer holder 31 so that the surface to be processed faces upward.
- raising / lowering pins 32 for supporting the wafer W from below and raising / lowering it are provided in the wafer holding part 31, raising / lowering pins 32 for supporting the wafer W from below and raising / lowering it are provided.
- the raising / lowering pin 32 can be moved up and down by the raising / lowering drive part 33.
- a through hole 34 is formed on the upper surface of the wafer holding portion 31 so as to penetrate the upper surface in the thickness direction, and the elevating pins 32 are inserted through the through hole 34.
- the wafer holding unit 31 can be moved in the horizontal direction and can be rotated around the vertical by a moving mechanism 35 provided below the wafer holding unit 31.
- a rail 40 extending along the Y direction is provided on the X direction negative direction (downward direction in FIG. 6) side of the wafer holding unit 31.
- the rail 40 is formed, for example, from the outer side of the wafer holding unit 31 on the Y direction negative direction (left direction in FIG. 6) to the outer side on the Y direction positive direction (right direction in FIG. 6).
- An arm 41 is attached to the rail 40.
- the arm 41 supports a resist solution nozzle 42 as a coating solution supply unit that supplies a resist solution as a coating solution onto the wafer W.
- the resist solution nozzle 42 has, for example, an elongated shape along the X direction that is the same as or longer than the diameter dimension of the wafer W.
- an inkjet nozzle is used as the resist solution nozzle 42, and a plurality of supply ports (not shown) formed in a line along the longitudinal direction are formed below the resist solution nozzle 42.
- the resist solution nozzle 42 can strictly control resist solution supply timing, resist solution supply amount, and the like.
- the arm 41 is movable on the rail 40 by the nozzle drive unit 43.
- the resist solution nozzle 42 can move from the standby unit 44 installed outside the wafer holding unit 31 on the positive side in the Y direction to above the wafer W on the wafer holding unit 31.
- the top can be moved in the radial direction of the wafer W.
- the arm 41 can be moved up and down by a nozzle drive unit 43, and the height of the resist solution nozzle 42 can be adjusted.
- a template holding unit 50 that holds the template T as shown in FIG. 5 is provided on the ceiling surface in the casing 30 and above the wafer holding unit 31. That is, the wafer holding unit 31 and the template holding unit 50 are arranged so that the wafer W placed on the wafer holding unit 31 and the template T held on the template holding unit 50 face each other. Furthermore, the template holding portion 50 includes a chuck 51 for holding suction an outer peripheral portion of the rear surface T 2 of the template T. The chuck 51 is movable in the vertical direction and rotatable about the vertical by a moving mechanism 52 provided above the chuck 51. Accordingly, the template T can be rotated up and down in a predetermined direction with respect to the wafer W on the wafer holding unit 31.
- the template holding unit 50 has a light source 53 provided above the template T held by the chuck 51.
- the light source 53 emits light such as visible light, near-ultraviolet light, and ultraviolet light, and the light from the light source 53 passes through the template T and is irradiated downward.
- the reversing unit 13 has a casing 60 in which a loading / unloading port (not shown) for the template T is formed on the side surface.
- a reversing mechanism 70 for reversing the front and back surfaces of the template T is provided.
- the reversing mechanism 70 has a pair of holding portions 71 and 71 that can approach and separate from each other.
- the holding part 71 includes a frame part 72 configured to fit the outer shape of the template T, and an arm part 73 that supports the frame part 72.
- the frame part 72 and the arm part 73 are integrally formed. Yes.
- the frame portion 72 is provided with a holding portion 74 for holding the template T, and the holding portion 74 is formed with a tapered groove (not shown). Then, as shown in FIG. 8, when the pair of spaced holding parts 71, 71 approach each other, the outer peripheral part of the template T is inserted into the tapered groove of the holding part 74 and the template T is supported.
- the holding part 71 is supported by the rotation drive part 75 as shown in FIG.
- the rotation driving unit 75 By this rotation driving unit 75, the holding unit 71 can be rotated around the horizontal (around the Y axis) and can be expanded and contracted in the horizontal direction (Y direction). That is, the front and back surfaces of the template T held by the holding unit 71 are reversed.
- an elevating drive unit 77 is provided below the rotation drive unit 75 via a shaft 76. The lift drive unit 77 can move the rotation drive unit 75 and the holding unit 71 up and down.
- the imprint system 1 described above is provided with a control unit 100 as shown in FIG.
- the control unit 100 is, for example, a computer and has a program storage unit (not shown).
- the program storage unit includes a transfer of the template T between the template loading / unloading station 2 and the imprint unit 3, a transfer of the wafer W between the wafer loading / unloading station 4 and the imprint unit 3, and a drive system in the imprint unit 3.
- a program for controlling the operation and the like and executing an imprint process to be described later in the imprint system 1 is stored.
- This program is recorded in a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnetic optical desk (MO), memory card, or the like. Or installed in the control unit 100 from the storage medium.
- HD computer-readable hard disk
- FD flexible disk
- CD compact disk
- MO magnetic optical desk
- the imprint system 1 according to the present embodiment is configured as described above. Next, an imprint process performed in the imprint system 1 will be described.
- FIG. 10 shows the main processing flow of this imprint processing
- FIG. 11 shows the state of the template T and the wafer W in each step.
- the template carrier 12 the template T is taken from the template cassette C T on the cassette mounting table 10, it is transported to the reversing unit 13.
- the template cassette C T the template T, the surface T 1 of the transfer pattern C is formed is accommodated so as to face upward, the template T in this state is conveyed to the reversing unit 13.
- the template T carried into the reversing unit 13 is transferred to the reversing mechanism 70, and the front and back surfaces thereof are reversed. That is, the rear surface T 2 of the template T is directed upwards. Thereafter, the template T is transported to the imprint unit 3 by the template transport body 12 (step A1 in FIG. 10). The template T carried into the imprint unit 3 is sucked and held by the chuck 51 of the template holding unit 50.
- the wafer loading / unloading station 4 takes out the wafer W from the wafer cassette CW on the cassette mounting table 20 by the wafer transfer body 22. It is conveyed to the alignment unit 23. In the alignment unit 23, the orientation of the wafer W is adjusted based on the position of the notch portion of the wafer W. Thereafter, the wafer W is transferred to the imprint unit 3 by the wafer transfer body 22 (step A2 in FIG. 10). Note that, in the wafer carry-in / out station 4, the wafers W in the wafer cassette CW are accommodated so that their processing surfaces face upward, and in this state, the wafers W are transferred to the imprint unit 3.
- the wafer W carried into the imprint unit 3 is transferred to the lift pins 32 and is placed and held on the wafer holder 31. Subsequently, after aligning the wafer W held by the wafer holding unit 31 by moving it to a predetermined position in the horizontal direction, the resist solution nozzle 42 is moved in the radial direction of the wafer W, as shown in FIG. As shown, a resist solution is applied onto the wafer W to form a resist film R as a coating film (step A3 in FIG. 10). At this time, the control unit 100 controls the supply timing and supply amount of the resist solution supplied from the resist solution nozzle 42.
- the amount of the resist solution applied to the portion corresponding to the convex portion (the portion corresponding to the concave portion in the transfer pattern C of the template T) is large, and the portion corresponding to the concave portion ( The amount of the resist solution applied to the portion corresponding to the convex portion in the transfer pattern C is controlled to be small.
- the resist solution is applied on the wafer W in accordance with the aperture ratio of the transfer pattern C.
- the wafer W held by the wafer holding unit 31 is moved to a predetermined position in the horizontal direction for alignment, and the template T held by the template holding unit 50 is used. Is rotated in a predetermined direction. Then, the template T is lowered to the wafer W side as shown by the arrow in FIG. Template T is lowered to a predetermined position, the surface T 1 of the template T is pressed against the resist film R on the wafer W. The predetermined position is set based on the height of the resist pattern formed on the wafer W. Subsequently, light is emitted from the light source 53.
- the light from the light source 53 passes through the template T and is irradiated onto the resist film R on the wafer W as shown in FIG. 11B, whereby the resist film R is photopolymerized.
- the transfer pattern C of the template T is transferred to the resist film R on the wafer W to form the resist pattern P (step A4 in FIG. 10).
- the template T is raised as shown in FIG. 11C to form a resist pattern P on the wafer W.
- the wafer W is transferred to the wafer carrier 22 by the lift pins 32, transferred from the imprint unit 3 to the wafer carry-in / out station 4, and returned to the wafer cassette CW (step A5 in FIG. 10).
- a thin resist residual film L may remain in the concave portion of the resist pattern P formed on the wafer W.
- the residual film L remains outside the imprint system 1. The film L may be removed.
- steps A2 to A5 are repeated to form resist patterns P on the plurality of wafers W using one template T, respectively.
- the template T is replaced. That is, the template T in the imprint unit 3 is transferred to the template carrier 12 and conveyed from the imprint unit 400 to the template carry-in / out station 2 (step A6 in FIG. 10). Thereafter, the template T is conveyed to the reversing unit 13, after the front and back surfaces of the template T is inverted, that is, after the surface T 1 of the template T is directed upward, and returned to the template cassette C T.
- the next template T is conveyed from the template carry-in / out station 2 to the imprint unit 400.
- the timing for exchanging the template T is set in consideration of deterioration of the template T and the like.
- the template T is also replaced when a different pattern P is formed on the wafer W.
- the template T may be exchanged every time the template T is used once. Further, for example, the template T may be exchanged for each wafer W, or the template T may be exchanged for each lot, for example.
- a predetermined resist pattern P is continuously formed on the plurality of wafers W in the imprint system 1.
- the imprint unit 3 uses a single template T to form a predetermined number of wafers W on a predetermined number. After the resist pattern P is formed, the one template T can be continuously replaced with another template T. Thus, for example, even when the resist pattern P is formed on the plurality of wafers W before the template T deteriorates, the template T in the imprint unit 3 can be exchanged continuously and efficiently. Therefore, the predetermined resist pattern P can be continuously formed on the plurality of wafers W. This also enables mass production of semiconductor devices.
- the template loading / unloading station 2 is provided with a reversing unit 13 for inverting the front and back surfaces of the template T. Therefore, the template T between the template cassette CT and the imprint unit 3 in the template loading / unloading station 2 is provided. Can be transported smoothly. Further, since the template T is smaller than the wafer W, the front and back surfaces of the template T can be easily reversed.
- a processing station 200 including a plurality of processing units for performing predetermined processing on the template T between the template carry-in / out unit 2 and the imprint unit 3.
- an interface station 201 that is provided adjacent to the processing station 200 and transfers the template T between the processing station 200 and the imprint unit 3 may be disposed.
- the processing station 200 is provided with a transport unit 210 at the center thereof.
- a transport unit 210 for example, six processing blocks G1 to G6 in which various processing units are arranged in multiple stages are arranged.
- the first processing block G1 and the second processing block G2 are sequentially arranged from the template loading / unloading station 2 side.
- a third processing block G3 is disposed on the template loading / unloading station 2 side of the processing station 200, and a fourth processing block G4 is disposed on the imprint unit 3 side of the processing station 200.
- a fifth processing block G5 and a sixth processing block G6 are arranged in this order from the template loading / unloading station 2 side on the back side of the processing station 200 (X direction positive direction side in FIG. 12).
- the transport unit 210 can transport the template T to various processing units (described later) disposed in these processing blocks G1 to G6.
- the processing blocks G1 to G4 constitute a release agent processing block
- the processing blocks G5 and G6 constitute a template cleaning block.
- a plurality of liquid processing units for example, a release agent application unit 211 for applying a liquid release agent S to the template T, and a release agent S on the template T are provided.
- Rinse units 212 for rinsing are stacked in two stages in order from the bottom.
- the release agent application unit 213 and the rinse unit 214 are stacked in two stages in order from the bottom.
- chemical chambers 215 and 216 for supplying various processing liquids to the liquid processing unit are provided at the lowermost stages of the first processing block G1 and the second processing block G2, respectively.
- Third to processing block G3 is ultraviolet rays are irradiated to the template T as shown in FIG. 14, the pre-cleaning unit release agent S on the template T is to clean the surface T 1 of the before the deposition 220
- the temperature adjusting units 221 and 222 for adjusting the temperature of the template T, the transition unit 223 for transferring the template T, and the heating units 224 and 225 for heat-treating the template T are stacked in six stages in order from the bottom.
- the pre-cleaning unit 230, the temperature control units 231, 232, the transition unit 233, and the heating units 234, 235 are also stacked in the fourth processing block G4 in order from the bottom in six stages. Yes.
- the fifth processing block G5 the inspection unit 242 for inspecting the cleaning unit 240 and 241, the surface T 1 of the template T after washing after cleaning the surface T 1 of the template T after use, as shown in FIG. 15 Three layers are stacked in order from the bottom.
- post-cleaning units 250 and 251 and an inspection unit 252 are stacked in three stages in order from the bottom.
- post-cleaning unit 240,241,250,251 may be the rear surface T 2 also further washed template T
- the inspection unit 242 and 252 may be further examined also the rear surface T 2 of the template T.
- the interface station 201 is provided with a template transport body 261 that moves on a transport path 260 extending in the X direction as shown in FIG. Further, the reversing unit 13 for inverting the front and back surfaces of the template T is arranged on the positive direction side in the X direction of the transport path 260, and a plurality of templates T are temporarily stored on the negative direction side of the transport path 260 in the X direction.
- a buffer cassette 262 is disposed.
- the template transport body 261 is also movable in the vertical direction and the vertical direction ( ⁇ direction), and can transport the template T between the processing station 200, the reversing unit 13, the buffer cassette 262, and the imprint unit 3.
- the reversing unit 13 of the present embodiment is configured by moving the reversing unit 13 provided in the template loading / unloading station 2 shown in FIG. 1 to the interface station 201.
- the transport unit 210 has a plurality of, for example, two transport arms 270 that hold and transport the template T as shown in FIG.
- the transfer arm 270 is formed integrally with the arm portion 271 and supports the arm portion 271.
- the arm portion 271 is configured in a substantially 3/4 annular shape having a larger diameter than the template T. And a support portion 272.
- the arm portion 271 is provided with holding portions 273 that protrude inward and hold corner portions of the template T, for example, at four locations.
- the transfer arm 270 can hold the template T horizontally on the holding portion 273.
- an arm driving unit 274 is provided at the base end of the transfer arm 270.
- Each arm 270 can be independently moved in the horizontal direction by the arm driving unit 274.
- the transfer arm 270 and the arm driving unit 274 are supported by the base 275.
- a rotation drive unit 277 is provided on the lower surface of the base 275 via a shaft 276. By this rotation drive unit 277, the base 275 and the transport arm 270 can rotate about the shaft 276 as a central axis and can also move up and down.
- the release agent coating unit 211 has a casing 280 in which a loading / unloading port (not shown) for the template T is formed on the side surface.
- a holding member 281 that holds and rotates the template T is provided at the center of the casing 280.
- a central portion of the holding member 281 is recessed downward, and an accommodating portion 282 for accommodating the template T is formed.
- a groove portion 282 a smaller than the outer shape of the template T is formed in the lower portion of the housing portion 282. Therefore, in the accommodating portion 282, the inner peripheral portion of the lower surface of the template T is not in contact with the holding member 281 by the groove portion 282a, and only the outer peripheral portion of the lower surface of the template T is supported by the holding member 281.
- the accommodating portion 282 has a substantially rectangular planar shape that conforms to the outer shape of the template T.
- a plurality of projecting portions 283 projecting inward from the side surfaces are formed in the housing portion 282, and the template T housed in the housing portion 282 is positioned by the projecting portions 283.
- a notch 284 is provided on the outer periphery of the storage unit 282 in order to prevent the holding unit 273 of the transfer arm 270 from interfering with the storage unit 282. It is formed in four places.
- the holding member 281 is attached to the cover body 285 as shown in FIG. 18, and a rotation driving unit 287 is provided below the holding member 281 via a shaft 286.
- this rotation drive unit 287 By this rotation drive unit 287, the holding member 281 can rotate around the vertical at a predetermined speed and can move up and down.
- a cup 290 that receives and collects the release agent S scattered or dropped from the template T.
- a discharge pipe 291 for discharging the collected release agent S and an exhaust pipe 292 for exhausting the atmosphere in the cup 290 are connected to the lower surface of the cup 290.
- a rail 300 extending along the Y direction (left and right direction in FIG. 20) is formed on the negative side in the X direction (downward direction in FIG. 20) of the cup 290.
- the rail 300 is formed, for example, from the outer side of the cup 290 on the Y direction negative direction (left direction in FIG. 20) to the outer side on the Y direction positive direction (right direction in FIG. 20).
- An arm 301 is attached to the rail 300.
- a release agent nozzle 302 that supplies the release agent S onto the template T is supported on the arm 301.
- the arm 301 is movable on the rail 300 by a nozzle driving unit 303.
- the release agent nozzle 302 can move from the standby unit 304 installed on the outer side of the cup 290 on the positive side in the Y direction to above the center of the template T in the cup 290.
- the arm 301 can be moved up and down by a nozzle driving unit 303 and the height of the release agent nozzle 302 can be adjusted.
- a cleaning liquid nozzle that ejects a cleaning liquid, for example, an organic solvent, may be provided in the groove 282 a of the holding member 281.
- a cleaning liquid nozzle that ejects a cleaning liquid, for example, an organic solvent, may be provided in the groove 282 a of the holding member 281.
- the configuration of the release agent application unit 213 is the same as the configuration of the release agent application unit 211 described above, and a description thereof will be omitted.
- the rinse unit 212 has a casing 310 in which a loading / unloading port (not shown) for the template T is formed on the side surface.
- An immersion tank 311 in which the template T is immersed is provided on the bottom surface of the casing 310.
- an organic solvent for rinsing the release agent S on the template T is stored.
- a holding part 312 for holding the template T is provided on the ceiling surface in the casing 310 and above the immersion tank 311.
- Holding portion 312 the outer peripheral portion of the rear surface T 2 of the template T has a chuck 313 for holding suction.
- Template T has a surface T 1 is held by the chuck 313 to face upward.
- the chuck 313 can be moved up and down by a lifting mechanism 314. And the template T is immersed in the organic solvent stored in the immersion tank 311 in the state hold
- the holding unit 312 has a gas supply unit 315 provided above the template T held by the chuck 313.
- the gas supply unit 315 can spray an inert gas such as nitrogen or a gas gas such as dry air downward, that is, the surface T 1 of the template T held by the chuck 313.
- an inert gas such as nitrogen
- a gas gas such as dry air
- the configuration of the rinse unit 214 is the same as the configuration of the rinse unit 212 described above, and a description thereof will be omitted.
- the pre-cleaning unit 220 has a casing 320 in which a loading / unloading port (not shown) for the template T is formed on the side surface.
- a chuck 321 for attracting and holding the template T is provided in the casing 320.
- a chuck driving unit 322 is provided below the chuck 321.
- the chuck driving unit 322 is provided on a bottom surface in the casing 320 and attached to a rail 323 extending along the Y direction. The chuck 321 can be moved along the rail 323 by the chuck driving unit 322.
- An ultraviolet irradiation unit 324 that irradiates the template T held by the chuck 321 with ultraviolet rays is provided on the ceiling surface in the casing 320 and above the rail 323.
- the ultraviolet irradiation unit 324 extends in the X direction as shown in FIG. Then, while the template T is moving along the rail 323, the surface T 1 of the template T is irradiated with ultraviolet rays from the ultraviolet irradiation unit 324 so that the entire surface T 1 of the template T is irradiated with ultraviolet rays.
- the configuration of the pre-cleaning unit 230 is the same as the configuration of the pre-cleaning unit 220 described above, and a description thereof will be omitted.
- the heating unit 224 has a casing 330 in which a loading / unloading port (not shown) for the template T is formed on the side surface.
- a mounting table 331 on which the template T is mounted is provided on the bottom surface in the casing 330.
- Template T has a surface T 1 is placed on the top surface of the mounting table 331 to face upward.
- elevating pins 332 for supporting the template T from below and elevating it are provided in the mounting table 331.
- the raising / lowering pin 332 can be moved up and down by the raising / lowering drive part 333.
- a through hole 334 that penetrates the upper surface in the thickness direction is formed on the upper surface of the mounting table 331, and the elevating pin 332 is inserted through the through hole 334.
- a hot plate 335 for heating the template T is provided on the top surface of the mounting table 331.
- a heater that generates heat by power feeding is provided inside the hot plate 335, and the hot plate 335 can be adjusted to a predetermined set temperature.
- the hot plate 335 may be provided above the template T, for example, on the ceiling surface of a lid 340 described later. Further, a hot plate 335 may be provided above and below the template T.
- a lid body 340 that can move up and down is provided above the mounting table 331.
- the lid 340 has an open bottom surface and forms a processing chamber K together with the mounting table 331.
- An exhaust part 341 is provided at the center of the upper surface of the lid 340.
- the atmosphere in the processing chamber K is uniformly exhausted from the exhaust unit 341.
- the structure of the heating units 225, 234, and 235 is the same as that of the heating unit 224 described above, the description thereof is omitted.
- the temperature control units 221, 222, 231, and 232 have the same configuration as the heating unit 224 described above, and a temperature control plate is used instead of the hot plate 335.
- a cooling member such as a Peltier element is provided inside the temperature adjustment plate, and the temperature adjustment plate can be adjusted to a set temperature.
- the lid 340 in the heating unit 224 may be omitted.
- the post-cleaning unit 240 has a casing 350 having a loading / unloading port (not shown) for the template T formed on the side surface.
- a mounting table 351 on which the template T is mounted is provided on the bottom surface in the casing 350.
- Template T has a surface T 1 is placed on the top surface of the mounting table 351 to face upward.
- lifting pins 352 for supporting the template T from below and lifting it are provided in the mounting table 351.
- the elevating pin 352 can be moved up and down by the elevating drive unit 353.
- a through hole 354 that penetrates the upper surface in the thickness direction is formed on the upper surface of the mounting table 351, and the elevating pin 352 is inserted through the through hole 354.
- a rail 360 extending along the Y direction (left and right direction in FIG. 26) is provided on the negative side in the X direction (downward direction in FIG. 26) of the mounting table 351.
- the rail 360 is formed, for example, from the outside of the mounting table 351 on the Y direction negative direction (left direction in FIG. 26) to the outside on the Y direction positive direction (right direction in FIG. 6).
- An arm 361 is attached to the rail 360.
- the arm 361 supports a cleaning liquid nozzle 362 as a cleaning liquid supply unit that supplies a cleaning liquid onto the template T.
- the cleaning liquid nozzle 362 has, for example, an elongated shape along the X direction that is the same as or longer than one side dimension of the template T.
- an organic solvent or pure water is used as the cleaning liquid, and IPA (isopropyl alcohol), dibutyl ether, cyclohexane, or the like is used as the organic solvent.
- the arm 361 is movable on the rail 360 by the nozzle driving unit 363.
- the cleaning liquid nozzle 362 can move from the standby unit 364 installed on the outside in the Y direction positive direction side of the mounting table 351 to above the template T on the mounting table 351, and further on the surface T 1 of the template T. Can be moved in the side direction of the template T.
- the arm 361 can be moved up and down by a nozzle driving unit 363, and the height of the cleaning liquid nozzle 362 can be adjusted.
- An ultraviolet irradiation unit 365 that irradiates the template T with ultraviolet rays is provided on the ceiling surface in the casing 350 and above the mounting table 351.
- the ultraviolet irradiation unit 365 is disposed so as to face the surface T 1 of the template T placed on the mounting table 351, and can irradiate the entire surface T 1 of the template T with ultraviolet rays.
- the configuration of the post-cleaning units 241, 250, and 251 is the same as the configuration of the post-cleaning unit 240 described above, and a description thereof will be omitted.
- the imprint system 1 according to the present embodiment is configured as described above. Next, an imprint process performed in the imprint system 1 will be described.
- FIG. 27 shows the main processing flow of this imprint processing
- FIG. 28 shows the state of the template T and the wafer W in each step.
- the template carrier 12 takes out the template T from the template cassette CT on the cassette mounting table 10 and conveys it to the transition unit 223 in the third processing block G3 of the processing station 200 (step B1 in FIG. 27). ).
- the template T is transported to the pre-cleaning unit 220 by the transport unit 210 and sucked and held by the chuck 321. Subsequently, the template T is moved along the rail 323 by the chuck driving unit 322, and the template T is irradiated with ultraviolet rays from the ultraviolet irradiation unit 324. Thus, ultraviolet light is irradiated on the surface T 1 the entire surface of the template T, the surface T 1 of the template T is cleaned as shown in FIG. 28 (a) (step B2 in FIG. 27).
- the transport unit 210 transports the template T to the release agent application unit 211 and delivers it to the holding member 281.
- the release agent nozzle 302 is moved to above the center of the template T and the template T is rotated.
- the release agent S is supplied onto the rotating template T, and the release agent S is diffused on the template T by centrifugal force, so that the entire surface T 1 of the template T as shown in FIG. A release agent S is applied (step B3 in FIG. 27).
- the template T is transported to the heating unit 224 by the transport unit 210.
- the template T carried into the heating unit 224 is transferred to the lift pins 332 and placed on the placement table 331.
- the lid 340 is closed, and the template T is heated to, for example, 200 ° C. by the hot plate 335.
- the release agent S on the template T is baked as shown in FIG. 28 (c) (step B4 in FIG. 27).
- the template T is conveyed to the temperature adjustment unit 211 by the conveyance unit 210, and the template T is adjusted to a predetermined temperature.
- the template T is transported to the rinse unit 212 by the transport unit 210 and held by the holding unit 312. Subsequently, the holding unit 312 is lowered, and the template T is immersed in the organic solvent stored in the immersion tank 311. When a predetermined time elapses, only the unreacted portion of the release agent S is peeled off, and the release agent S along the transfer pattern C is formed on the template T as shown in FIG. Step B5). Then, raise the holding portion 312, blown from the gas supply unit 315 gas gas to the template T, drying the surface T 1.
- the unreacted part of the release agent S means a part other than the part where the release agent S chemically reacts with the surface T 1 of the template T and adsorbs to the surface T 1 .
- the transport unit 210 transports the template T to the transition unit 233 of the fourth processing block G4. Subsequently, the template T is transported to the reversing unit 13 by the template transport body 261 of the interface station 201, and the front and back surfaces of the template T are reversed. Thereafter, the template T is transported to the imprint unit 3 by the template transport body 261 and is sucked and held by the chuck 51 of the template holding unit 50.
- predetermined processing is performed on the template T in the processing station 200, and the wafer W is transferred from the wafer carry-in / out station 4 to the imprint unit 3 while the template T is being transferred to the imprint unit 3 (step B6 in FIG. 27).
- the process B6 is the same as the process A2 in the above-described embodiment, and detailed description thereof is omitted.
- step B7 in Fig. 27 a resist liquid is applied to on the wafer W as shown in FIG. 28 (e) (step B7 in Fig. 27), the surface T 1 of the template T as shown in FIG. 28 (f) the wafer
- the transfer pattern C of the template T is transferred to the resist film R on the wafer W to form a resist pattern P (step B8 in FIG. 27).
- the template T is raised, a resist pattern P is formed on the wafer W, and then returned to the wafer cassette CW (step B9 in FIG. 27). Since these steps B7 to B9 are the same as the steps A3 to A5 in the above embodiment, detailed description thereof is omitted. Further, after step B9 is performed, the remaining film L on the wafer W may be removed as shown in FIG.
- steps B6 to B9 are repeatedly performed to form resist patterns P on the plurality of wafers W using one template T, respectively.
- steps B1 ⁇ B5 mentioned above, the formation of the release agent S on the surface T 1 of the plurality of templates T.
- the template T on which the release agent S is formed is stored in the buffer cassette 262 of the interface station 201.
- steps B6 to B9 are performed on a predetermined number of wafers W, the used template T is unloaded from the imprint unit 3 by the template transfer body 261 and transferred to the reversing unit 13 (step of FIG. 27). B10).
- the used template T conveyed to the reversing unit 13 has its front and back surfaces reversed. Then, the template T is conveyed by the template conveyance body 261 to the transition unit 233 of the fourth processing block G4. Subsequently, the template transport body 261 transports the template T in the buffer cassette 262 to the imprint unit 3. Thus, the template T in the imprint unit 3 is exchanged.
- the template T transported to the transition unit 233 is then transported to the post-cleaning unit 240 by the transport unit 210.
- the template T conveyed to the post-cleaning unit 240 is transferred to the lifting pins 352 and placed on the placement table 351.
- ultraviolet rays are irradiated from the ultraviolet irradiation unit 365 to the entire surface T 1 of the template T.
- the release agent S on the template T is vaporized and most of it is removed.
- the irradiation of ultraviolet rays is stopped, and the cleaning liquid is supplied to the release agent S remaining on the template T while moving the cleaning liquid nozzle 362 in the side direction of the template T.
- the release agent S on the template T is removed, the surface T 1 is washed (step B11 in FIG. 27).
- the surface T 1 is washed (step B11 in FIG. 27).
- IPA is an organic solvent.
- the rear surface T 2 may also be washed well surface T 1 of the template T.
- the template T is transported to the inspection unit 242 by the transport unit 210. Then, in the inspection unit 242, for example, by observation or the like of the interference fringes, the surface T 1 of the template T is inspected (step B12 in FIG. 27). Note that the inspection unit 242 may inspect not only the front surface T 1 of the template T but also the back surface T 2 .
- the template T is carried to the transit unit 223 by the transport unit 210, and returned to the template cassette C T by the template carrier 12.
- the test result of the inspection unit 242 is good, for example, be surface T 1 it is properly cleaned of the template T, and if the surface T 1 is not deteriorated, the template T returned to the template cassette C T Are used again in the imprint unit 1.
- the inspection result of the inspection unit 242 is bad, for example if the surface T 1 of the template T is degraded, the template T is carried to the outside of the imprint unit 1.
- the predetermined resist pattern P is continuously formed on the plurality of wafers W while the template T is continuously replaced.
- the release agent S is placed on the template T in the imprint system 1.
- the template T can be continuously supplied to the imprint unit 3 while forming a film.
- the template T in the imprint unit 3 can be exchanged continuously and efficiently. Therefore, the predetermined resist pattern P can be continuously formed on the plurality of wafers W.
- processing blocks G5 and G6 constituting a template cleaning block are provided, that is, post-cleaning units 240, 241, 250, and 251 are provided. It is possible to clean the surface T 1 of the spent template T. As a result, the template T can be used again in the imprint unit 1.
- both the ultraviolet ray irradiated from the ultraviolet irradiation unit 365 and the cleaning liquid supplied from the cleaning liquid nozzle 362 are provided. in it is possible to clean the surface T 1 of the template T. That is, since both of the so-called dry cleaning and wet cleaning is performed on the template T, it is possible to reliably clean the surface T 1 of the template T.
- the ultraviolet irradiation unit 365 can be irradiated with ultraviolet rays on the surface T 1 the entire surface of the template T by one irradiation, it is possible to quickly perform dry cleaning with respect to the template T.
- the inspection unit 242, 252 since the inspection unit 242, 252 is provided, it is possible to inspect the surface T 1 of the template T after washing. Based on the inspection result, for example, the template T can be used again in the imprint unit 1 or can be determined to be carried out of the imprint unit 1. As a result, the template T can be used effectively, and a defective template T is not used in the imprint unit 1, so that a predetermined resist pattern P can be appropriately formed on the plurality of wafers W. .
- both the processing blocks G1 to G4 constituting the release agent processing block and the processing blocks G5 and G6 constituting the template cleaning block are provided.
- only the processing blocks G1 to G4, which are release agent processing blocks, may be provided in the processing station 200.
- step B11 of the embodiment, B12 is omitted, the cleaning of the surface T 1 of the used template T is performed outside the imprint system 1.
- processing blocks G5 and G6 which are template cleaning blocks are provided in the processing station 200, and transition units 370 and 371 for delivering the template T to the positions of the processing blocks G3 and G4 are provided. Each may be provided.
- the steps B2 to B5 of the above embodiment are omitted, and the film formation of the release agent S on the template T is performed outside the imprint system 1. That is, the template T on which the release agent S is formed is carried into the imprint system 1.
- the template T in the imprint unit 3 can be continuously replaced, and a predetermined resist pattern P can be continuously formed on the plurality of wafers W.
- the release agent S may be applied on the template T using a release agent nozzle that extends in the width direction of the template T and has a slit-like supply port formed on the lower surface.
- the release agent S is supplied from the supply port while moving the release agent nozzle in the side direction of the template T, and the release agent S is applied to the entire surface T 1 of the template T.
- the template T may be moved with the release agent nozzle fixed.
- the template T may be immersed in an immersion tank in which the release agent S is stored, and the release agent S may be applied onto the template T.
- the mold release agent S is rinsed by immersing the template T in the organic solvent stored in the immersion layer 311, but the release agent illustrated in FIGS. 18 and 20 is used.
- a rinse unit having the same configuration as the mold application units 211 and 214 may be used. In such a case, instead of the release agent nozzle 302 of the release agent application units 211 and 214, a rinse liquid nozzle that supplies an organic solvent as a rinse liquid of the release agent S onto the template T is used.
- an organic solvent is supplied onto the template T during rotation, to rinse the surface T 1 the entire surface of the template T.
- a predetermined time elapses, only the unreacted portion of the release agent S is peeled off, and the release agent S along the transfer pattern C is formed on the template T.
- it continues to further rotate the template T, drying finishing off the surface T 1. In this way, the release agent S on the template T is rinsed.
- both the ultraviolet irradiation unit 365 and the cleaning liquid nozzle 362 are provided in the post-cleaning units 240, 241, 250, and 251 in the above embodiments, only one of them may be provided. If for example, to clean the surface T 1 of the template T only irradiation with ultraviolet rays, in the cleaning unit 240 after that shown in FIGS. 25 and 26, only the ultraviolet irradiation unit 365 is provided, it may be omitted cleaning liquid nozzles 362 . On the other hand, when cleaning the surface T 1 of the template T by only the supply of the cleaning liquid in the cleaning unit 240 after that shown in FIGS. 25 and 26, only the cleaning liquid nozzles 362 provided, be omitted ultraviolet irradiation unit 365 Good.
- an organic solvent is used for the cleaning liquid.
- the mold release agent S can be removed only by the IPA.
- a unit that uses only the ultraviolet irradiation unit 365 described above and a unit that uses only the cleaning liquid nozzle 362 may be used in combination.
- the irradiation of the ultraviolet rays onto the template T and the supply of the cleaning liquid are performed in separate units.
- the unit using only the cleaning liquid nozzle 362 supplies the cleaning liquid from the position above the central portion of the template T during rotation as described later, by spreading the cleaning liquid to the surface T 1 entire template T The upper release agent S may be removed.
- release agent coating unit shown in FIGS. 18 and 20 Units having the same configuration as 211 and 214 may be used.
- a cleaning liquid nozzle 362 is provided instead of the release agent nozzle 302 of the release agent application units 211 and 214.
- the mold T is rotated, the cleaning liquid is supplied from above the central portion of the rotating template T, and the cleaning liquid is diffused over the entire surface T 1 , thereby releasing the mold release agent S on the template T. Is removed.
- a unit having an immersion tank in which a cleaning liquid is stored may be used instead of the post-cleaning units 240, 241, 250, and 251.
- the mold release agent S on the template T is removed by immersing the template T in the cleaning liquid in the immersion tank.
- the post-cleaning unit 240,241,250,251 had been irradiated with ultraviolet rays on the surface T 1 the entire surface of the template T by the ultraviolet irradiation unit 365, similar to the cleaning unit 220 before shown in FIGS. 22 and 23 While moving the template T using the unit having the configuration, the moving template T may be irradiated with ultraviolet rays.
- the surface T of the template T is used by using a unit having the same configuration as that of the post-cleaning unit 240 shown in FIGS.
- One surface may be irradiated with ultraviolet rays.
- the template T is rotated, it may be irradiated with ultraviolet rays on the surface T 1 entire template T in the rotary .
- the template holding unit 50 is provided above the wafer holding unit 31 in the imprint unit 3, but the template holding unit may be provided below the wafer holding unit.
- a template holding unit 402 is provided on the bottom surface of the casing 401 of the imprint unit 400 as shown in FIG.
- the template holding unit 402 has the same configuration as the template holding unit 50 shown in FIGS. 5 and 6 and is arranged by inverting the template holding unit 50 in the vertical direction. Therefore, the template T, the surface T 1 is held in the template holder 402 to face upward. In addition, light emitted from the light source 53 of the template holding unit 402 is irradiated upward.
- a wafer holding unit 403 is provided on the ceiling surface of the casing 401 and above the template holding unit 402.
- the wafer holding unit 403 sucks and holds the back surface of the wafer W so that the processing surface of the wafer W faces downward.
- the wafer holder 403 can be moved in the horizontal direction by a moving mechanism 404 provided above the wafer holder 403.
- the other configuration of the imprint unit 400 is the same as the configuration of the imprint unit 3 shown in FIGS.
- FIG. 32 shows the state of the template T and the wafer W in the main process.
- the template T and the wafer W are carried into the imprint unit 400 and are sucked and held by the template holding unit 402 and the wafer holding unit 403, respectively.
- the resist solution nozzle 42 is moved in the side direction of the template T, and the resist solution is applied onto the template T as shown in FIG.
- the amount of the resist solution applied to the portion corresponding to the concave portion in the transfer pattern C of the template T (the portion corresponding to the convex portion in the resist pattern P formed on the wafer W) is large and corresponds to the convex portion.
- the resist solution is applied onto the template T so that the amount of the resist solution applied to the portion (the portion corresponding to the recess in the resist pattern P) is reduced. In this way, a resist solution is applied on the template T in accordance with the aperture ratio of the transfer pattern C.
- the wafer W held by the wafer holding unit 403 is moved to a predetermined position in the horizontal direction for alignment, and the template T held by the template holding unit 402 is used. Is rotated in a predetermined direction. Then, the template T is raised to the wafer W side as shown by the arrow in FIG. The template T rises to a predetermined position, and the surface T 1 of the template T is pressed against the resist film R on the wafer W. Subsequently, light is emitted from the light source 53. The light from the light source 53 passes through the template T and is irradiated onto the resist film R on the wafer W as shown in FIG. 32B, whereby the resist film R is photopolymerized. In this way, the transfer pattern C of the template T is transferred to the resist film R on the wafer W, and a resist pattern P is formed.
- the template T is lowered as shown in FIG. 32C to form a resist pattern P on the wafer W.
- the remaining film L on the wafer W may be removed as shown in FIG.
- the resist solution is applied onto the template T, it is not necessary to perform alignment of the wafer W, which was performed when the resist solution was applied onto the wafer W in the above embodiment. . Therefore, the resist pattern P can be formed on the wafer W quickly and efficiently in the imprint unit 400.
- the imprint unit 400 having the above configuration is arranged in the implement system 1 in place of the imprint unit 3 shown in FIG.
- the wafer W is arranged in the imprint unit 400 so that the processing surface faces downward, it is necessary to invert the front and back surfaces of the wafer W before the wafer W is carried into and out of the imprint unit 400.
- the wafer carry-in / out station 4 of the imprint system 1 is provided with a reversing unit 410 that reverses the front and back surfaces of the wafer W.
- the template T is because the surface T 1 is is arranged to face upward, there is no need to invert the front and rear surfaces of the template T, can be omitted reversing unit 13 shown in FIG. 12.
- the reversing unit 410 has a reversing mechanism 411 as shown in FIG.
- the reversing mechanism 411 has a configuration in which the pair of holding portions 71 and 71 in the reversing mechanism 70 shown in FIGS. 7 and 9 is replaced with another pair of holding portions 412 and 412.
- the holding portion 412 includes a frame portion 413 configured in a substantially 3/4 annular shape, and an arm portion 414 that supports the frame portion 413.
- the frame portion 413 and the arm portion 414 are integrally formed.
- the frame part 413 is provided with a holding part 415 for holding the wafer W, and the holding part 415 is formed with a tapered groove (not shown).
- the other configuration of the reversing unit 410 is the same as the configuration of the reversing unit 13 shown in FIGS.
- steps B1 to B12 are performed as in the above embodiment.
- the predetermined resist pattern P can be continuously formed on the plurality of wafers W by continuously exchanging the template T.
- the front and back surfaces of the wafer W are reversed by the reversing unit 410 before the wafer W is loaded into the imprint unit 400 and after the wafer W is unloaded from the imprint unit 400.
- the template T is always processed toward the surface T 1 upward.
- the resist liquid coating operation on the template T which has been performed in the imprint unit 400 in the above embodiment, may be performed in the processing station 200.
- resist coating units 420 and 421 as coating units for coating a resist solution on the template T are arranged at the bottom of the fifth processing block G5 and the sixth processing block G6.
- the resist coating units 420 and 421 have a configuration in which the release agent nozzle 302 in the release agent application units 211 and 213 shown in FIGS. 18 and 20 is replaced with a resist solution nozzle that supplies a resist solution. In this case, it is not necessary to apply the resist solution on the template T in the imprint unit 400, and therefore the resist solution nozzle 42 in the imprint unit 400 can be omitted.
- the template T on which the resist film R is formed is carried into the imprint unit 400, when the resist pattern P is formed on one wafer W, the used template T is replaced. As a result, the processing steps in the imprint unit 400 are reduced, so that the resist pattern P can be quickly formed on the wafer W.
- resist coating units 420 and 421 can also be arranged in the imprint system 1 having the imprint unit 3 shown in FIG. Also in this case, the resist solution nozzle 42 in the imprint unit 3 can be omitted.
- the release agent coating units 211 and 213 of the processing station 200 supply the liquid release agent S onto the rotating template T, thereby releasing the mold onto the surface T 1 of the template T. agent had been applied to S, the release agent S by depositing vaporized release agent to the surface T 1 may be formed of templates T.
- the first processing block G1 of the imprint system 1 includes release agent application units 430 and 431 in place of the release agent application unit 211 and the rinse unit 212 shown in FIG. Is placed.
- release agent application units 432 and 433 are arranged in the second processing block G2 instead of the release agent application unit 213 and the rinse unit 214.
- the release agent coating unit 430 includes a casing 440 having a loading / unloading port (not shown) for the template T formed on the side surface as shown in FIG.
- An exhaust pipe 441 for exhausting the internal atmosphere is connected to the bottom surface of the casing 440.
- a mounting table 442 on which the template T is mounted is provided on the bottom surface in the casing 440.
- Template T has a surface T 1 is placed on the top surface of the mounting table 442 to face upward.
- a temperature control plate 443 for controlling the temperature of the template T is provided on the upper surface of the mounting table 442.
- the temperature control plate 443 includes, for example, a Peltier element and can set the template T to a predetermined temperature.
- lifting pins 444 for supporting the template T from below and lifting it are provided in the mounting table 442, lifting pins 444 for supporting the template T from below and lifting it are provided.
- the elevating pin 444 can be moved up and down by the elevating drive unit 445.
- a through hole 446 that penetrates the upper surface in the thickness direction is formed on the upper surface of the mounting table 442, and the elevating pin 444 is inserted through the through hole 446.
- a shower head 450 that supplies the release agent vaporized on the template T downward is provided on the ceiling surface in the casing 440 and above the mounting table 442.
- the shower head 450 is disposed to face the surface T 1 of the template T placed on the placing table 442.
- Inside the shower head 450 an internal space 451 into which the vaporized release agent supplied from a release agent supply source (not shown) is introduced is formed.
- a plurality of supply ports 452 for supplying the release agent introduced into the internal space 451 downward is provided on the lower surface of the shower head 450 in a state of being distributed over the entire lower surface of the shower head 450. That is, a plurality of supply ports 452 are formed so that the vaporized release agent is uniformly supplied from the shower head 450 in a horizontal plane.
- the release agent supplied from the shower head 450 is deposited along the transfer pattern C on the surface T 1 of the template T.
- release agent application units 431, 432, and 433 is the same as the configuration of the release agent application unit 430 described above, and a description thereof will be omitted.
- the template T is conveyed to the pre-cleaning unit 220, the surface T 1 of the template T is cleaned as shown in FIG. 38 (a). Thereafter, the template T is conveyed to the release agent coating unit 430, FIG. 38 (b) is the release agent S 0 vaporized on the surface T 1 of the template T as shown in the supply, is the release agent S 0 Deposited along the transfer pattern C.
- the template T is set to a predetermined temperature by the temperature control plate 443.
- the template T is conveyed to the heating unit 224, and the release agent S on the template T is baked as shown in FIG.
- the template T is conveyed to the temperature adjustment unit 211, and the template T is adjusted to a predetermined temperature. In this way, on the surface T 1 of the template T, the release agent S along the transfer pattern C is deposited.
- vaporized release agent S 0 is to deposit along the transfer pattern C of the template T, there is no need to rinse the release agent S. Therefore, in the processing station 200, the release agent S can be formed more smoothly on the template T, and thereby the imprint processing throughput in the imprint system 1 can be improved.
- the reversing unit 13 of the template T and the reversing unit 410 of the wafer W are provided outside the imprint units 3 and 400, respectively. May be provided inside the imprint units 3 and 400.
- the templates T are individually conveyed and processed in the template loading / unloading station 2 and the processing station 200.
- a plurality of, for example, nine templates T have one holder 460. May be held and processed.
- the holder 460 is formed with a receiving portion 461 that is recessed downward to receive each template T as shown in FIG.
- a plurality of suction ports are formed on the bottom surface of the housing portion 461, and each template T is sucked and held in the housing portion 461.
- a plurality of templates T held by the holder 460 can be conveyed to the imprint unit 3 side at a time.
- a predetermined process can be performed on a plurality of templates T at a time. Therefore, the template T in the imprint unit 4 can be exchanged more efficiently.
- the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.
- the present invention is not limited to this example and can take various forms.
- the present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.
- FPD flat panel display
- the present invention is useful when a template having a transfer pattern formed on the surface thereof is used to transfer the transfer pattern to a coating film formed on a substrate and form a predetermined pattern on the coating film.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
2 テンプレート搬入出ステーション
3 インプリントユニット
4 ウェハ搬入出ステーション
13 反転ユニット
31 ウェハ保持部
42 レジスト液ノズル
50 テンプレート保持部
52 移動機構
100 制御部
200 処理ステーション
201 インターフェイスステーション
211、213 離型剤塗布ユニット
240、241、250、251 後洗浄ユニット
242、252 検査ユニット
362 洗浄液ノズル
365 紫外線照射部
410 反転ユニット
420、421 レジスト塗布ユニット
460 ホルダー
C 転写パターン
G1~G6 処理ブロック
P レジストパターン
R レジスト膜
S 離型剤
T テンプレート
W ウェハ
Claims (31)
- 表面に転写パターンが形成されたテンプレートを用いて、前記転写パターンを基板上に形成される塗布膜に転写し、当該塗布膜に所定のパターンを形成するインプリントユニットを備えたインプリントシステムであって、
前記インプリントユニットに接続され、複数の前記基板を保有可能で、且つ前記インプリントユニット側に前記基板を搬入出する基板搬入出ステーションと、
前記インプリントユニットに接続され、複数の前記テンプレートを保有可能で、且つ前記インプリントユニット側に所定のタイミングで前記テンプレートを搬入出するテンプレート搬入出ステーションと、を有することを特徴とする、インプリントシステム。 - 請求項1に記載のインプリントシステムにおいて、
前記インプリントユニットと前記テンプレート搬入出ステーションとの間には、前記テンプレート上に離型剤を成膜する離型剤処理ブロックが配置されている。 - 請求項1に記載のインプリントシステムにおいて、
前記インプリントユニットと前記テンプレート搬入出ステーションとの間には、前記インプリントユニットから搬出されたテンプレートの表面を洗浄するテンプレート洗浄ブロックが配置されている。 - 請求項3に記載のインプリントシステムにおいて、
前記テンプレート洗浄ブロックは、前記テンプレートの表面に紫外線を照射する紫外線照射部を有する。 - 請求項3に記載のインプリントシステムにおいて、
前記テンプレート洗浄ブロックは、前記テンプレートの表面に洗浄液を供給する洗浄液供給部を有する。 - 請求項5に記載のインプリントシステムにおいて、
前記洗浄液は有機溶剤である。 - 請求項5に記載のインプリントシステムにおいて、
前記洗浄液は純水である。 - 請求項3に記載のインプリントシステムにおいて、
前記テンプレート洗浄ブロックは、前記洗浄後のテンプレートの表面を検査する検査ユニットを有する。 - 請求項1に記載のインプリントシステム前記インプリントユニットにおいて、
前記基板を保持する基板保持部と、
前記テンプレートを保持するテンプレート保持部と、
前記テンプレート保持部を昇降させる移動機構と、を有し、
前記基板保持部と前記テンプレート保持部は、当該基板保持部に保持された前記基板と、当該テンプレート保持部に保持された前記テンプレートが対向するように配置されている。 - 請求項9に記載のインプリントシステムにおいて、
前記インプリントユニットにおいて、前記テンプレート保持部は前記基板保持部の上方に配置され、
前記インプリントユニットに対して前記テンプレート搬入出ステーション側には、前記テンプレートの表裏面を反転させる反転ユニットが設けられている。 - 請求項10に記載のインプリントシステムにおいて、
前記インプリントユニットは、前記塗布膜を形成するために、前記基板保持部に保持された前記基板上に塗布液を供給する塗布液供給部を有する。 - 請求項9に記載のインプリトシステムにおいて、
前記インプリントユニットにおいて、前記テンプレート保持部は前記基板保持部の下方に配置され、
前記インプリントユニットに対して前記基板搬入出ステーション側には、前記基板の表裏面を反転させる反転ユニットが設けられている。 - 請求項12に記載のインプリントシステムにおいて、
前記インプリントユニットは、前記塗布膜を形成するために、前記テンプレート保持部に保持された前記テンプレート上に塗布液を供給する塗布液供給部を有する。 - 請求項10に記載のインプリントシステムにおいて、
前記インプリントユニットと前記テンプレート搬入出ステーションとの間には、前記塗布膜を形成するために、前記テンプレート上に塗布液を塗布する塗布ユニットが配置されている。 - 請求項2に記載のインプリントシステムにおいて、
少なくとも前記インプリントユニットと前記テンプレート搬入出ステーションの間において、複数の前記テンプレートは一のホルダーに保持されている。 - 表面に転写パターンが形成されたテンプレートを用いて、前記転写パターンを基板上に形成される塗布膜に転写し、当該塗布膜に所定のパターンを形成するインプリントユニットと、
前記インプリントユニットに接続され、複数の前記基板を保有可能で、且つ前記インプリントユニット側に前記基板を搬入出する基板搬入出ステーションと、
前記インプリントユニットに接続され、複数の前記テンプレートを保有可能で、且つ前記インプリントユニット側に前記テンプレートを搬入出するテンプレート搬入出ステーションと、
を有するインプリントシステムを用いたインプリント方法であって、
前記インプリントユニットにおいて、一の前記テンプレートを用いて、所定数の基板に所定のパターンを形成した後、
前記一のテンプレートを前記インプリントユニットから搬出すると共に、他の前記テンプレートを前記インプリントユニットに搬入して、前記インプリントユニット内のテンプレートを交換する。 - 請求項16に記載のインプリント方法において、
前記テンプレート搬入出ステーションから前記インプリントユニットに前記テンプレートを搬送する間に、当該テンプレート上に離型剤を成膜する。 - 請求項16に記載のインプリント方法において、
前記インプリントユニットから前記テンプレート搬入出ステーションに前記テンプレートを搬送する間に、当該テンプレートの表面を洗浄する。 - 請求項18に記載のインプリント方法において、
前記テンプレートの表面を洗浄する際に、当該表面に紫外線を照射する。 - 請求項19に記載のインプリント方法において、
前記テンプレートの表面を洗浄する際に、当該表面に洗浄液をさらに供給する。 - 請求項20に記載のインプリント方法において、
前記洗浄液は、有機溶剤又は純水である。 - 請求項18に記載のインプリント方法において、
前記テンプレートの表面を洗浄する際に、当該表面に洗浄液を供給する。 - 請求項22に記載のインプリント方法において、
前記洗浄液は、有機溶剤である。 - 請求項18に記載のインプリント方法において、
前記テンプレートの表面を洗浄後、当該テンプレートの表面を検査する。 - 請求項16に記載のインプリント方法において、
前記インプリントユニットにおいて、前記テンプレートが前記基板の上方に配置され、前記テンプレートを前記基板側に下降させて前記塗布膜に所定のパターンを形成する場合、
前記テンプレート搬入出ステーションから前記インプリントユニットに前記テンプレートを搬送する間に、当該テンプレートの表裏面を反転させる。 - 請求項25に記載のインプリント方法において、
前記インプリントユニットにおいて、前記基板上に塗布液を供給して、前記塗布膜を形成する。 - 請求項16に記載のインプリント方法において、
前記インプリントユニットにおいて、前記テンプレートが前記基板の下方に配置され、前記テンプレートを前記基板側に上昇させて前記塗布膜に所定のパターンを形成する場合、
前記基板搬入出ステーションから前記インプリントユニットに前記基板を搬送する間に、当該基板の表裏面を反転させる。 - 請求項27に記載のインプリント方法において、
前記インプリントユニットにおいて、前記テンプレート上に塗布液を供給して、前記塗布膜を形成する。 - 請求項25に記載のインプリント方法において、
前記テンプレート搬入出ステーションから前記インプリントユニットに前記テンプレートを搬送する間に、当該テンプレート上に塗布液を供給して、前記塗布膜を形成することを特徴とする。 - 請求項17に記載のインプリント方法において、
少なくとも前記インプリントユニットと前記テンプレート搬入出ステーションの間において、複数の前記テンプレートは一のホルダーに保持されている。 - インプリント方法をインプリントシステムによって実行させるために、当該インプリントシステムを制御する制御部のコンピュータ上で動作するプログラムを格納した読み取り可能なコンピュータ記憶媒体であって、
前記インプリント方法は、
表面に転写パターンが形成されたテンプレートを用いて、前記転写パターンを基板上に形成される塗布膜に転写し、当該塗布膜に所定のパターンを形成するインプリントユニットと、
前記インプリントユニットに接続され、複数の前記基板を保有可能で、且つ前記インプリントユニット側に前記基板を搬入出する基板搬入出ステーションと、
前記インプリントユニットに接続され、複数の前記テンプレートを保有可能で、且つ前記インプリントユニット側に前記テンプレートを搬入出するテンプレート搬入出ステーションと、
を有するインプリントシステムを用いたインプリント方法であり、
前記インプリントユニットにおいて、一の前記テンプレートを用いて、所定数の基板に所定のパターンを形成した後、
前記一のテンプレートを前記インプリントユニットから搬出すると共に、他の前記テンプレートを前記インプリントユニットに搬入して、前記インプリントユニット内のテンプレートを交換する。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/376,876 US8888920B2 (en) | 2009-06-19 | 2010-06-11 | Imprint system, imprint method, and non-transitory computer storage medium |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-146186 | 2009-06-19 | ||
JP2009146186A JP5443070B2 (ja) | 2009-06-19 | 2009-06-19 | インプリントシステム |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010147056A1 true WO2010147056A1 (ja) | 2010-12-23 |
Family
ID=43356374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/059920 WO2010147056A1 (ja) | 2009-06-19 | 2010-06-11 | インプリントシステム、インプリント方法及びコンピュータ記憶媒体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8888920B2 (ja) |
JP (1) | JP5443070B2 (ja) |
KR (1) | KR20120026497A (ja) |
TW (1) | TWI469864B (ja) |
WO (1) | WO2010147056A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011145607A1 (ja) * | 2010-05-21 | 2011-11-24 | 東京エレクトロン株式会社 | インプリントシステム、インプリント方法及びコンピュータ記憶媒体 |
WO2012147728A1 (ja) * | 2011-04-27 | 2012-11-01 | Hoya株式会社 | 離型層付きモールドの洗浄方法及び離型層付きモールドの製造方法 |
CN103092010A (zh) * | 2011-09-22 | 2013-05-08 | 株式会社东芝 | 再生模板的方法和再生设备 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP5160204B2 (ja) * | 2007-11-30 | 2013-03-13 | 株式会社Sokudo | 基板処理装置 |
JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
JP5001828B2 (ja) * | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
JP5060517B2 (ja) * | 2009-06-24 | 2012-10-31 | 東京エレクトロン株式会社 | インプリントシステム |
JP2011009362A (ja) * | 2009-06-24 | 2011-01-13 | Tokyo Electron Ltd | インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体 |
KR101161060B1 (ko) * | 2009-11-30 | 2012-06-29 | 서강대학교산학협력단 | 나노입자를 기둥형태로 조직화시키기 위한 배열장치 및 그 배열방법 |
JP2012114157A (ja) * | 2010-11-22 | 2012-06-14 | Toshiba Corp | ドロップレシピ作成方法およびデータベース作成方法 |
NL2008007A (en) * | 2011-01-20 | 2012-07-23 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
JP5769451B2 (ja) * | 2011-03-07 | 2015-08-26 | キヤノン株式会社 | インプリント装置および物品の製造方法 |
US8888086B2 (en) * | 2011-05-11 | 2014-11-18 | Sematech, Inc. | Apparatus with surface protector to inhibit contamination |
JP5630415B2 (ja) * | 2011-10-06 | 2014-11-26 | 東京エレクトロン株式会社 | 成膜装置、成膜方法及び記憶媒体 |
JP5584241B2 (ja) * | 2012-02-27 | 2014-09-03 | 株式会社東芝 | 半導体製造装置及び半導体デバイスの製造方法 |
JP2014120584A (ja) * | 2012-12-14 | 2014-06-30 | Toshiba Corp | インプリント用マスクの洗浄方法 |
JP6320183B2 (ja) * | 2014-06-10 | 2018-05-09 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品製造方法 |
WO2017073396A1 (ja) * | 2015-10-28 | 2017-05-04 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置、基板処理システム及び記憶媒体 |
BR112018074918A2 (pt) | 2016-06-01 | 2019-03-12 | Arizona Board Of Regents On Behalf Of Arizona State University | sistema e métodos para deposição por spray de revestimentos particulados |
KR101982418B1 (ko) * | 2017-12-12 | 2019-05-28 | (주)서영 | 멀티 카트리지 시스템을 적용한 연속생산 자동화 평면형 임프린트 장치 |
CN108845479B (zh) * | 2018-05-28 | 2024-11-05 | 苏州光舵微纳科技股份有限公司 | 一种软膜替换及纳米压印一体设备 |
CN109228141B (zh) * | 2018-10-23 | 2020-12-04 | 郑华 | 一种注塑模具清洁养护装置 |
US11618059B2 (en) * | 2019-05-21 | 2023-04-04 | Fermi Research Alliance, Llc | Vertical high-pressure rinse machine |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005153091A (ja) * | 2003-11-27 | 2005-06-16 | Hitachi Ltd | 転写方法及び転写装置 |
JP2009214323A (ja) * | 2008-03-07 | 2009-09-24 | Asahi Glass Co Ltd | 微細パターンを有する物品の製造装置および製造方法 |
JP2010040879A (ja) * | 2008-08-06 | 2010-02-18 | Canon Inc | インプリント装置及びインプリント方法 |
JP2010056286A (ja) * | 2008-08-28 | 2010-03-11 | Tokyo Ohka Kogyo Co Ltd | 基板処理システム |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2931820B2 (ja) * | 1991-11-05 | 1999-08-09 | 東京エレクトロン株式会社 | 板状体の処理装置及び搬送装置 |
JP3103440B2 (ja) * | 1992-07-23 | 2000-10-30 | 株式会社クラレ | スタンパの保管方法 |
US5934856A (en) * | 1994-05-23 | 1999-08-10 | Tokyo Electron Limited | Multi-chamber treatment system |
US5788868A (en) * | 1995-09-04 | 1998-08-04 | Dainippon Screen Mfg. Co., Ltd. | Substrate transfer method and interface apparatus |
US5772905A (en) * | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
JPH10134425A (ja) * | 1996-10-30 | 1998-05-22 | Mitsubishi Chem Corp | スタンパーの表面処理方法及び装置 |
US6926057B2 (en) * | 2001-09-25 | 2005-08-09 | Dainippon Screen Mfg. Co., Ltd. | Thin film forming apparatus and thin film forming method |
US7019819B2 (en) * | 2002-11-13 | 2006-03-28 | Molecular Imprints, Inc. | Chucking system for modulating shapes of substrates |
US8349241B2 (en) * | 2002-10-04 | 2013-01-08 | Molecular Imprints, Inc. | Method to arrange features on a substrate to replicate features having minimal dimensional variability |
US6805054B1 (en) * | 2003-05-14 | 2004-10-19 | Molecular Imprints, Inc. | Method, system and holder for transferring templates during imprint lithography processes |
US6829988B2 (en) * | 2003-05-16 | 2004-12-14 | Suss Microtec, Inc. | Nanoimprinting apparatus and method |
JP4478424B2 (ja) * | 2003-09-29 | 2010-06-09 | キヤノン株式会社 | 微細加工装置およびデバイスの製造方法 |
TWI276590B (en) * | 2003-10-31 | 2007-03-21 | Murata Machinery Ltd | Conveyance system |
JP4393244B2 (ja) * | 2004-03-29 | 2010-01-06 | キヤノン株式会社 | インプリント装置 |
EP1617293A1 (en) * | 2004-07-14 | 2006-01-18 | Universität Kassel | A method of aligning a first article relative to a second article and an apparatus for aligning a first article relative to a second article |
US8882914B2 (en) * | 2004-09-17 | 2014-11-11 | Intermolecular, Inc. | Processing substrates using site-isolated processing |
US8011916B2 (en) * | 2005-09-06 | 2011-09-06 | Canon Kabushiki Kaisha | Mold, imprint apparatus, and process for producing structure |
US20070267764A1 (en) * | 2005-10-25 | 2007-11-22 | Dai Nippon Printing Co., Ltd. | Mold for photocuring nano-imprint and its fabrication process |
US8011915B2 (en) * | 2005-11-04 | 2011-09-06 | Asml Netherlands B.V. | Imprint lithography |
JP4884871B2 (ja) * | 2006-07-27 | 2012-02-29 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
US7832416B2 (en) * | 2006-10-10 | 2010-11-16 | Hewlett-Packard Development Company, L.P. | Imprint lithography apparatus and methods |
JP5173311B2 (ja) | 2007-08-09 | 2013-04-03 | キヤノン株式会社 | インプリント方法、インプリント装置および半導体製造方法 |
JP5417754B2 (ja) * | 2008-07-11 | 2014-02-19 | 東京エレクトロン株式会社 | 成膜方法及び処理システム |
JP4679620B2 (ja) * | 2008-09-25 | 2011-04-27 | 株式会社東芝 | テンプレート検査方法および欠陥検査装置 |
US8470188B2 (en) * | 2008-10-02 | 2013-06-25 | Molecular Imprints, Inc. | Nano-imprint lithography templates |
US8394203B2 (en) * | 2008-10-02 | 2013-03-12 | Molecular Imprints, Inc. | In-situ cleaning of an imprint lithography tool |
JP5215833B2 (ja) * | 2008-12-11 | 2013-06-19 | 株式会社日立ハイテクノロジーズ | 微細パターン転写用スタンパ及びその製造方法 |
JP5060517B2 (ja) * | 2009-06-24 | 2012-10-31 | 東京エレクトロン株式会社 | インプリントシステム |
JP2011009362A (ja) * | 2009-06-24 | 2011-01-13 | Tokyo Electron Ltd | インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体 |
JP5296641B2 (ja) * | 2009-09-02 | 2013-09-25 | 東京エレクトロン株式会社 | インプリント方法、プログラム、コンピュータ記憶媒体及びインプリント装置 |
US8522712B2 (en) * | 2009-11-19 | 2013-09-03 | Tokyo Electron Limited | Template treatment method, program, computer storage medium, template treatment apparatus and imprint system |
TW201133482A (en) * | 2009-11-30 | 2011-10-01 | Applied Materials Inc | Chamber for processing hard disk drive substrates |
WO2011096265A1 (ja) * | 2010-02-04 | 2011-08-11 | シャープ株式会社 | 転写方法および半導体装置の製造方法並びに半導体装置 |
US8891080B2 (en) * | 2010-07-08 | 2014-11-18 | Canon Nanotechnologies, Inc. | Contaminate detection and substrate cleaning |
JP2012069701A (ja) * | 2010-09-22 | 2012-04-05 | Toshiba Corp | インプリント方法、半導体集積回路製造方法およびドロップレシピ作成方法 |
JP5754965B2 (ja) * | 2011-02-07 | 2015-07-29 | キヤノン株式会社 | インプリント装置、および、物品の製造方法 |
JP2013069902A (ja) * | 2011-09-22 | 2013-04-18 | Toshiba Corp | テンプレートの再生方法および再生装置 |
-
2009
- 2009-06-19 JP JP2009146186A patent/JP5443070B2/ja not_active Expired - Fee Related
-
2010
- 2010-06-11 US US13/376,876 patent/US8888920B2/en not_active Expired - Fee Related
- 2010-06-11 KR KR1020117027556A patent/KR20120026497A/ko not_active Application Discontinuation
- 2010-06-11 WO PCT/JP2010/059920 patent/WO2010147056A1/ja active Application Filing
- 2010-06-18 TW TW99119958A patent/TWI469864B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005153091A (ja) * | 2003-11-27 | 2005-06-16 | Hitachi Ltd | 転写方法及び転写装置 |
JP2009214323A (ja) * | 2008-03-07 | 2009-09-24 | Asahi Glass Co Ltd | 微細パターンを有する物品の製造装置および製造方法 |
JP2010040879A (ja) * | 2008-08-06 | 2010-02-18 | Canon Inc | インプリント装置及びインプリント方法 |
JP2010056286A (ja) * | 2008-08-28 | 2010-03-11 | Tokyo Ohka Kogyo Co Ltd | 基板処理システム |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011145607A1 (ja) * | 2010-05-21 | 2011-11-24 | 東京エレクトロン株式会社 | インプリントシステム、インプリント方法及びコンピュータ記憶媒体 |
WO2012147728A1 (ja) * | 2011-04-27 | 2012-11-01 | Hoya株式会社 | 離型層付きモールドの洗浄方法及び離型層付きモールドの製造方法 |
JPWO2012147728A1 (ja) * | 2011-04-27 | 2014-07-28 | Hoya株式会社 | 離型層付きモールドの洗浄方法及び離型層付きモールドの製造方法 |
CN103092010A (zh) * | 2011-09-22 | 2013-05-08 | 株式会社东芝 | 再生模板的方法和再生设备 |
Also Published As
Publication number | Publication date |
---|---|
JP5443070B2 (ja) | 2014-03-19 |
KR20120026497A (ko) | 2012-03-19 |
US8888920B2 (en) | 2014-11-18 |
US20120073461A1 (en) | 2012-03-29 |
JP2011000805A (ja) | 2011-01-06 |
TW201100242A (en) | 2011-01-01 |
TWI469864B (zh) | 2015-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5443070B2 (ja) | インプリントシステム | |
JP5060517B2 (ja) | インプリントシステム | |
WO2010150741A1 (ja) | インプリントシステム、インプリント方法及びコンピュータ記憶媒体 | |
WO2011145611A1 (ja) | インプリントシステム、インプリント方法及びコンピュータ記憶媒体 | |
JP5411201B2 (ja) | インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体 | |
WO2011114926A1 (ja) | テンプレート処理方法、コンピュータ記憶媒体及びテンプレート処理装置 | |
JP2011104910A (ja) | テンプレート処理方法、プログラム、コンピュータ記憶媒体、テンプレート処理装置及びインプリントシステム | |
JP5285515B2 (ja) | テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体 | |
JP5346049B2 (ja) | テンプレート処理方法、プログラム、コンピュータ記憶媒体、テンプレート処理装置及びインプリントシステム | |
JP5149244B2 (ja) | インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体 | |
JP5285514B2 (ja) | テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体 | |
JP5231366B2 (ja) | テンプレート処理方法、プログラム、コンピュータ記憶媒、テンプレート処理装置及びインプリントシステム | |
WO2010150740A1 (ja) | テンプレート処理装置、インプリントシステム、テンプレート処理方法及びコンピュータ記憶媒体 | |
JP2011035186A (ja) | 塗布処理装置、塗布処理方法、プログラム及びコンピュータ記憶媒体 | |
JP5108834B2 (ja) | テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体 | |
JP5355615B2 (ja) | 基板処理方法、プログラム、コンピュータ記憶媒体、基板処理装置及びインプリントシステム | |
JP5145397B2 (ja) | テンプレート処理方法、プログラム、コンピュータ記憶媒体及びテンプレート処理装置 | |
JP5487064B2 (ja) | テンプレート処理方法、プログラム、コンピュータ記憶媒体、テンプレート処理装置及びインプリントシステム | |
WO2011040466A1 (ja) | テンプレート処理装置、インプリントシステム、テンプレート処理方法、及びコンピュータ記憶媒体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10789431 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20117027556 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13376876 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10789431 Country of ref document: EP Kind code of ref document: A1 |