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WO2009066507A1 - 積層セラミック電子部品 - Google Patents

積層セラミック電子部品 Download PDF

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Publication number
WO2009066507A1
WO2009066507A1 PCT/JP2008/067205 JP2008067205W WO2009066507A1 WO 2009066507 A1 WO2009066507 A1 WO 2009066507A1 JP 2008067205 W JP2008067205 W JP 2008067205W WO 2009066507 A1 WO2009066507 A1 WO 2009066507A1
Authority
WO
WIPO (PCT)
Prior art keywords
face
electronic part
internal
ceramic electronic
laminated ceramic
Prior art date
Application number
PCT/JP2008/067205
Other languages
English (en)
French (fr)
Inventor
Naoki Shimizu
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to DE112008003104.5T priority Critical patent/DE112008003104B4/de
Priority to JP2009542501A priority patent/JP4929487B2/ja
Priority to KR1020107010837A priority patent/KR101102184B1/ko
Priority to CN2008801165273A priority patent/CN101868838B/zh
Publication of WO2009066507A1 publication Critical patent/WO2009066507A1/ja
Priority to US12/784,553 priority patent/US7859821B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

　外部の温度変化による熱応力や外部からの撓み応力等によるクラックによって短絡不良が生じ難い積層セラミック電子部品を提供する。 　セラミック素体２の第１の端面２ａに引き出す第１の内部電極３が引き出されており、第２の端面２ｂに複数の第２の内部電極４が引き出されており、フロート型内部電極７が、第１，第２の内部電極３，４とセラミック層を介して重なり合うように配置されており、それによって第１，第２の有効領域８，９が形成されており、第１の内部導体１０が第１の端面２ａから第１の有効領域８と積層方向において重なり合う領域を越えて延ばされており、第１，第２の端面２ａ，２ｂを結ぶ長さ方向の寸法をＬ、第１の内部電極の長さ方向寸法Ｘ１、第１の端面２ａと第１の内部導体の端部との間の距離Ｙ１、第２の端面２ｂから第２の回り込み部６ｂの端部までの距離をＥとしたときに、Ｘ１＜Ｙ１＜（Ｌ－Ｅ）とされている、積層セラミック電子部品１。
PCT/JP2008/067205 2007-11-22 2008-09-24 積層セラミック電子部品 WO2009066507A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE112008003104.5T DE112008003104B4 (de) 2007-11-22 2008-09-24 Keramische Mehrschichtkomponente
JP2009542501A JP4929487B2 (ja) 2007-11-22 2008-09-24 積層セラミック電子部品
KR1020107010837A KR101102184B1 (ko) 2007-11-22 2008-09-24 적층 세라믹 전자부품
CN2008801165273A CN101868838B (zh) 2007-11-22 2008-09-24 层叠陶瓷电子元件
US12/784,553 US7859821B2 (en) 2007-11-22 2010-05-21 Multilayer ceramic electronic component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007303280 2007-11-22
JP2007-303280 2007-11-22

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/784,553 Continuation US7859821B2 (en) 2007-11-22 2010-05-21 Multilayer ceramic electronic component

Publications (1)

Publication Number Publication Date
WO2009066507A1 true WO2009066507A1 (ja) 2009-05-28

Family

ID=40667335

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067205 WO2009066507A1 (ja) 2007-11-22 2008-09-24 積層セラミック電子部品

Country Status (6)

Country Link
US (1) US7859821B2 (ja)
JP (1) JP4929487B2 (ja)
KR (1) KR101102184B1 (ja)
CN (1) CN101868838B (ja)
DE (1) DE112008003104B4 (ja)
WO (1) WO2009066507A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151224A (ja) * 2010-01-22 2011-08-04 Murata Mfg Co Ltd 積層セラミックコンデンサおよびその製造方法
EP2449569A2 (en) * 2009-07-01 2012-05-09 Kemet Electronics Corporation High capacitance multilayer with high voltage capability
JP2013191833A (ja) * 2012-03-13 2013-09-26 Samsung Electro-Mechanics Co Ltd 積層セラミック電子部品
JP2014022722A (ja) * 2012-07-20 2014-02-03 Samsung Electro-Mechanics Co Ltd 積層チップ電子部品、その実装基板及び包装体
US9685271B2 (en) 2014-10-06 2017-06-20 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and board having the same
JP2018088534A (ja) * 2012-07-20 2018-06-07 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層チップ電子部品、その実装基板及び包装体
US10283267B2 (en) 2015-02-13 2019-05-07 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and board having the same
JP2020057747A (ja) * 2018-10-04 2020-04-09 Tdk株式会社 積層コンデンサ、及び積層コンデンサの実装構造

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US8194391B2 (en) * 2007-12-21 2012-06-05 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and manufacturing method thereof
JP5605053B2 (ja) * 2010-07-26 2014-10-15 株式会社村田製作所 積層セラミック電子部品の製造方法
JP5218545B2 (ja) * 2010-12-24 2013-06-26 Ｔｄｋ株式会社 積層コンデンサ
FR2970594B1 (fr) * 2011-01-13 2013-01-18 Batscap Sa Ensemble de stockage d'energie electrique a element empile en accordeon
JP2012160586A (ja) * 2011-02-01 2012-08-23 Murata Mfg Co Ltd 積層セラミック電子部品およびその製造方法
DE102011014965B4 (de) * 2011-03-24 2014-11-13 Epcos Ag Elektrisches Vielschichtbauelement
KR101823149B1 (ko) * 2011-04-19 2018-01-29 삼성전기주식회사 적층형 세라믹 커패시터
KR20130012716A (ko) * 2011-07-26 2013-02-05 삼성전기주식회사 적층 세라믹 전자부품
KR101548773B1 (ko) * 2011-08-22 2015-08-31 삼성전기주식회사 적층 세라믹 커패시터의 회로 기판 실장 구조
KR20130042924A (ko) 2011-10-19 2013-04-29 삼성전기주식회사 적층 세라믹 전자 부품
US9490055B2 (en) * 2011-10-31 2016-11-08 Murata Manufacturing Co., Ltd. Ceramic electronic component and manufacturing method thereof
KR101753420B1 (ko) * 2012-03-13 2017-07-03 삼성전기주식회사 적층 세라믹 전자 부품
JP5664597B2 (ja) * 2012-06-12 2015-02-04 株式会社村田製作所 実装構造及び実装方法
DE102012111023A1 (de) * 2012-11-15 2014-05-15 Epcos Ag Vielschichtkondensator und Verfahren zur Herstellung eines Vielschichtkondensators
KR102122935B1 (ko) 2013-03-29 2020-06-26 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조 방법
KR101532141B1 (ko) 2013-09-17 2015-06-26 삼성전기주식회사 적층 세라믹 전자부품 및 적층 세라믹 전자부품 실장 기판
KR102076147B1 (ko) 2013-12-16 2020-02-11 삼성전기주식회사 적층 세라믹 커패시터
KR20150121567A (ko) * 2014-04-21 2015-10-29 삼성전기주식회사 적층 세라믹 커패시터 및 그의 제조 방법
US10204737B2 (en) 2014-06-11 2019-02-12 Avx Corporation Low noise capacitors
KR102163046B1 (ko) 2014-10-15 2020-10-08 삼성전기주식회사 칩 부품
KR102149790B1 (ko) * 2015-02-13 2020-08-31 삼성전기주식회사 적층 세라믹 전자부품 및 그 실장 기판
DE102015117203A1 (de) * 2015-10-08 2017-04-13 Epcos Ag Drucksensor
KR101740825B1 (ko) 2015-12-04 2017-05-26 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
DE202016102203U1 (de) * 2016-04-26 2016-06-29 Epcos Ag Vielschichtbauelement
JP6522549B2 (ja) 2016-06-07 2019-05-29 太陽誘電株式会社 積層セラミックコンデンサ
JP2018006627A (ja) * 2016-07-05 2018-01-11 太陽誘電株式会社 積層セラミックコンデンサ
JP7128628B2 (ja) * 2018-01-30 2022-08-31 太陽誘電株式会社 積層圧電セラミック部品及び圧電デバイス
CN111801754B (zh) 2018-03-06 2022-04-12 京瓷Avx元器件公司 具有超宽带性能的多层陶瓷电容器
US11031183B2 (en) 2018-03-06 2021-06-08 Avx Corporation Multilayer ceramic capacitor having ultra-broadband performance
KR102101703B1 (ko) 2018-08-01 2020-04-20 삼성전기주식회사 적층형 커패시터
KR102109637B1 (ko) * 2018-08-21 2020-05-12 삼성전기주식회사 적층형 커패시터
KR102701218B1 (ko) 2019-01-28 2024-08-30 교세라 에이브이엑스 컴포넌츠 코포레이션 초광대역 성능을 갖는 적층 세라믹 커패시터
US11270842B2 (en) 2019-01-28 2022-03-08 KYOCERA AVX Components Corporation Multilayer ceramic capacitor having ultra-broadband performance
WO2020159811A1 (en) 2019-01-28 2020-08-06 Avx Corporation Multilayer ceramic capacitor having ultra-broadband performance
WO2020159810A1 (en) 2019-01-28 2020-08-06 Avx Corporation Multilayer ceramic capacitor having ultra-broadband performance
US11495406B2 (en) 2019-01-28 2022-11-08 KYOCERA AVX Components Corporation Multilayer ceramic capacitor having ultra-broadband performance
US11705280B2 (en) 2019-04-25 2023-07-18 KYOCERA AVX Components Corporation Multilayer capacitor having open mode electrode configuration and flexible terminations
JP7192996B2 (ja) * 2019-08-06 2022-12-20 株式会社村田製作所 蓄電デバイス
JP7188345B2 (ja) * 2019-09-30 2022-12-13 株式会社村田製作所 積層セラミック電子部品の製造方法
JP2022114628A (ja) * 2021-01-27 2022-08-08 Tdk株式会社 積層コンデンサ

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2449569A2 (en) * 2009-07-01 2012-05-09 Kemet Electronics Corporation High capacitance multilayer with high voltage capability
EP2449569A4 (en) * 2009-07-01 2013-01-23 Kemet Electronics Corp MULTILAYER WITH HIGH CAPACITY WITH HIGH VOLTAGE CAPACITY
JP2011151224A (ja) * 2010-01-22 2011-08-04 Murata Mfg Co Ltd 積層セラミックコンデンサおよびその製造方法
JP2013191833A (ja) * 2012-03-13 2013-09-26 Samsung Electro-Mechanics Co Ltd 積層セラミック電子部品
JP2018067720A (ja) * 2012-03-13 2018-04-26 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層セラミック電子部品
JP2014022722A (ja) * 2012-07-20 2014-02-03 Samsung Electro-Mechanics Co Ltd 積層チップ電子部品、その実装基板及び包装体
CN103578758A (zh) * 2012-07-20 2014-02-12 三星电机株式会社 片式层压电子元件、用于安装该元件的板件及其封装单元
JP2018088534A (ja) * 2012-07-20 2018-06-07 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層チップ電子部品、その実装基板及び包装体
US9685271B2 (en) 2014-10-06 2017-06-20 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and board having the same
US10283267B2 (en) 2015-02-13 2019-05-07 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and board having the same
JP2020057747A (ja) * 2018-10-04 2020-04-09 Tdk株式会社 積層コンデンサ、及び積層コンデンサの実装構造
JP7283045B2 (ja) 2018-10-04 2023-05-30 Tdk株式会社 積層コンデンサ、及び積層コンデンサの実装構造

Also Published As

Publication number Publication date
JPWO2009066507A1 (ja) 2011-04-07
CN101868838B (zh) 2011-11-09
CN101868838A (zh) 2010-10-20
JP4929487B2 (ja) 2012-05-09
KR101102184B1 (ko) 2012-01-02
US7859821B2 (en) 2010-12-28
DE112008003104T5 (de) 2010-09-09
US20100220426A1 (en) 2010-09-02
KR20100077030A (ko) 2010-07-06
DE112008003104B4 (de) 2014-09-25

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