WO2007119426A1 - インダクタンス部品 - Google Patents
インダクタンス部品 Download PDFInfo
- Publication number
- WO2007119426A1 WO2007119426A1 PCT/JP2007/055535 JP2007055535W WO2007119426A1 WO 2007119426 A1 WO2007119426 A1 WO 2007119426A1 JP 2007055535 W JP2007055535 W JP 2007055535W WO 2007119426 A1 WO2007119426 A1 WO 2007119426A1
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- WO
- WIPO (PCT)
- Prior art keywords
- coil
- magnetic
- magnetic layer
- slit
- inductance component
- Prior art date
Links
- 238000004804 winding Methods 0.000 claims abstract description 17
- 239000000696 magnetic material Substances 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 230000008602 contraction Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 170
- 230000004907 flux Effects 0.000 description 50
- 239000000843 powder Substances 0.000 description 17
- 230000035699 permeability Effects 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 13
- 239000006247 magnetic powder Substances 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 229910000640 Fe alloy Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 3
- 229940081974 saccharin Drugs 0.000 description 3
- 235000019204 saccharin Nutrition 0.000 description 3
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 3
- 229910017061 Fe Co Inorganic materials 0.000 description 2
- 229910002546 FeCo Inorganic materials 0.000 description 2
- 229910002555 FeNi Inorganic materials 0.000 description 2
- -1 FeNiCo Inorganic materials 0.000 description 2
- 229910017318 Mo—Ni Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017060 Fe Cr Inorganic materials 0.000 description 1
- 229910002544 Fe-Cr Inorganic materials 0.000 description 1
- 229910017086 Fe-M Inorganic materials 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910017706 MgZn Inorganic materials 0.000 description 1
- 229910003962 NiZn Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910008423 Si—B Inorganic materials 0.000 description 1
- 206010041235 Snoring Diseases 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
- H01F27/366—Electric or magnetic shields or screens made of ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/008—Electric or magnetic shielding of printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/002—Arrangements provided on the transformer facilitating its transport
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
Definitions
- the present invention relates to an inductance component used in, for example, a power supply circuit of a mobile phone.
- this type of inductance component has a coil 2 formed in a sheet-like element 1, and a terminal 3 is electrically connected to the coil 2.
- a magnetic layer 4 was formed on the upper and lower surfaces of the element body 1 to form a chip coil.
- Patent Document 1 is known as prior art document information relating to this application.
- Patent Document 1 Japanese Patent Laid-Open No. 2006-32587
- the present invention improves the reliability of an inductance component having a magnetic layer.
- the present invention includes an element body, a coil formed in the element body, and a terminal electrically connected to the coil, and the element body substantially includes a winding plane of the coil.
- a plurality of magnetic layers arranged in parallel are formed into an inductance component.
- the inductance component of the present invention has a structure in which the magnetic layer is formed in the element body, the entire magnetic layer is covered with a material having a uniform thermal expansion and contraction rate. Even under conditions where heat is applied to the entire component, high reliability can be realized without stress being applied locally to the magnetic material.
- Another aspect of the present invention is an inductance component in which a plurality of magnetic layers are provided, and a part of the element body is interposed between the plurality of magnetic layers. According to the present invention, the saturation magnetic flux can be increased, and the magnetic layer can be peeled off from the element body even if the thermal expansion coefficient between the element bodies and the magnetic substance layers is different as well as the magnetic layers. Can achieve high reliability
- Still another embodiment of the present invention is an inductance component in which at least a part of a terminal is formed of a magnetic material.
- Still another embodiment of the present invention is an inductance component in which a slit is formed in a magnetic layer and a part of the element body is filled in the slit. This makes it possible to achieve high reliability without stress being applied locally to the magnetic material even when heat is applied to the entire component, such as during solder mounting.
- Still another aspect of the present invention is an inductance component in which a plurality of substantially V-shaped slits extending from the bent portion to the outer peripheral direction of the magnetic layer are run in parallel on the magnetic layer.
- Still another aspect of the present invention is that at least the inner portion of the magnetic layer has a bending portion force.
- a plurality of substantially V-shaped slits extending in the outer peripheral direction of the magnetic layer are allowed to run side by side.
- an inductance component is formed with radial slits extending toward the outer periphery in the center direction force of the magnetic layer.
- a through-hole portion is provided in the element body in the inner circumferential direction of the coil, a middle leg magnetic body layer is provided inside the through-hole portion, and the middle leg magnetic body layer is provided.
- FIG. 1 is a cross-sectional view of an inductance component according to Embodiment 1 of the present invention.
- FIG. 2 is a top view of the inductance component according to the first embodiment of the present invention.
- FIG. 3 is an exploded perspective view of the inductance component in the first embodiment of the present invention.
- FIG. 4 is a cross-sectional view showing an example in which the number of magnetic layers is increased in Embodiment 1 of the present invention.
- FIG. 5 is a cross-sectional view of an inductance component according to Embodiment 2 of the present invention.
- FIG. 6 is a top view of the inductance component in the second embodiment of the present invention.
- FIG. 7 is a cross-sectional view of an inductance component according to Embodiment 3 of the present invention.
- FIG. 8 is a cross-sectional view of an inductance component according to Embodiment 4 of the present invention.
- FIG. 9 is an exploded perspective view of the inductance component according to Embodiment 4 of the present invention.
- FIG. 10 is a plan view showing the shape of a slit formed in the magnetic layer in the fifth embodiment of the present invention.
- FIG. 11 is a plan view showing another shape of the slit formed in the magnetic layer in the fifth embodiment of the present invention.
- FIG. 12 is a plan view showing still another shape of the slit formed in the magnetic layer in the fifth embodiment of the present invention.
- FIG. 13 is a plan view showing the shape of a slit formed in a magnetic layer in Embodiment 6 of the present invention.
- FIG. 14 is a cross-sectional view of an inductance component according to Embodiment 7 of the present invention.
- FIG. 15 is a top view of another inductance component according to Embodiment 7 of the present invention.
- FIG. 16 is a top view of still another inductance component according to Embodiment 7 of the present invention.
- FIG. 17 is a top view of still another inductance component according to Embodiment 7 of the present invention.
- FIG. 18 is a top view of still another inductance component according to the seventh embodiment of the present invention.
- FIG. 18 is a top view of still another inductance component according to the seventh embodiment of the present invention.
- FIG. 19 is a top view of still another inductance component according to Embodiment 7 of the present invention.
- FIG. 20 is a top view of still another inductance component according to Embodiment 7 of the present invention.
- FIG. 21 is a top view of still another inductance component according to Embodiment 7 of the present invention.
- FIG. 22 is a top view of still another inductance component according to Embodiment 7 of the present invention.
- FIG. 23 is a cross-sectional view of a conventional inductance component.
- FIG. 1 is a cross-sectional view of the inductance component according to the first embodiment of the present invention
- FIG. 2 is a top view of the inductance component
- an exploded perspective view of the inductance component This will be described with reference to FIG.
- a coil 6 is formed in a sheet-like element body 5, and terminals 7 and 8 are formed outside the coil 6 as shown in FIG.
- a via 6D is formed in the element body 5 between the planar coils 6A and 6B constituting the coil 6, and a magnetic layer 9A is formed above the coil 6 and the coil 6
- a magnetic layer 9B is formed in the element body 5 below.
- the magnetic layers 9 A and 9 B are arranged substantially in parallel with the winding plane of the coil 6. This is because the magnetic layers 9A and 9B having high permeability are arranged in the path of the magnetic flux generated from the coil 6.
- the coil 6 may be a single layer, but in the present embodiment, it is composed of two layers of planar coils 6A and 6B.
- the upper planar coil 6A is spirally wound from the terminal 7 in the inner circumferential direction, and the innermost circumferential portion of the planar coil 6A and the innermost circumferential portion of the lower planar coil 6B are connected by vias 6D.
- Coil 6 is formed by winding 6B in a spiral shape in the direction of force toward terminal 8 (peripheral direction).
- planar coils 6A and 6B are preferably wound in the same direction. This is to realize a large inductance value without canceling out the magnetic flux generated in the flat coil 6A and the magnetic flux generated in the flat coil 6B.
- the thickness of each of the magnetic layers 9A and 9B is set to be less than twice the skin depth (skin effect thickness) in order to suppress the generation of eddy currents.
- an outer leg 11 made of a magnetic material is provided outside the coil 6, and the upper magnetic material layer 9A and the lower magnetic material layer 9B are separated from each other. The magnetic coupling between them is close.
- each magnetic layer By configuring the body layers 9A and 9B to cover the entire body 5 with a uniform thermal expansion / shrinkage rate, even under conditions where heat is applied to the entire part, such as during solder mounting, It is possible to obtain high reliability without applying stress locally to the magnetic layers 9A and 9B.
- an inductance component having a high inductance value can be realized.
- the saturation magnetic flux can be obtained by configuring the magnetic layer 9A, 9B above and below the coil 6 with a force greater than the number of layers.
- the density can be improved and a high inductance value can be obtained.
- the number of magnetic layers formed above and below the coil 6 may be different. However, if there is a part where it is difficult for magnetic flux to flow on either the upper or lower side of the coil 6, the inductance value will decrease, so if the same magnetic layer is used, the upper and lower sides of the coil 6 will have the same number of layers. If magnetic layers of different thicknesses are used, it is desirable that the total force of the thicknesses be arranged so that the upper and lower sides of the S coil 6 are equal.
- the cross section of the coil 6 is not square but can be round, but it is desirable that the square be able to reduce the copper loss because the coil cutting area can be increased.
- planar coils 6A and 6B have a thickness of 10 ⁇ m or more because it can cope with a large current.
- the magnetic layers 9A and 9B are preferably made of a metal magnetic material having a composition such as Fe or an Fe alloy, in terms of magnetic flux density and magnetic loss.
- Fe alloy is used for the magnetic layers 9A and 9B
- the Fe composition ratio is desirably 30% by mass or more. This is because the magnetic properties of high saturation magnetic flux density and low coercive force can be realized by setting the Fe content in the magnetic layers 9A and 9B to 30% by mass or more. It is. Also, when the nickel content is around 80%, the magnetic permeability becomes high and a large inductance value can be obtained.
- an Fe alloy used for the magnetic layers 9A and 9B is a metal magnetic material having a composition containing at least one of FeNi, FeNiCo, and FeCo a viewpoint of high magnetic flux density and low magnetic loss? Are more preferable.
- an electroplating method can be used for the production of the magnetic layers 9A and 9B.
- the plating bath used in the electroplating step contains Fe ions or other metal ions.
- a stress relaxation agent a pit inhibitor and a complexing agent as various additives in the plating bath.
- the stress relaxation agent include saccharin. Since saccharin is a substance containing a sulfonate, it can exert its effect. By including such a stress relaxation agent, even if the magnetic layers 9A and 9B are formed thick, it is possible to form the magnetic layers 9A and 9B having excellent uniformity without generating cracks. For example, when saccharin is used as a stress relieving agent, the effect can be seen by adding 0.1 to 5 gZL in the plating bath, but the amount that exerts the stress relaxation action depending on the plating conditions such as current density is Since it changes, it can be controlled by appropriately setting conditions.
- an organic molecule or an inorganic molecule such as amino acid, monocarboxylic acid, dicarboxylic acid, or tricarboxylic acid is included, so that metal ions and A stable complex can be formed.
- An iron alloy film is formed by an ordinary electroplating method using such a plating bath, but the magnetic properties can be improved by devising a plating apparatus with the anode separated and plating in a magnetic field. An excellent iron alloy film can be formed.
- FIG. 4 An example in which the number of magnetic layers is increased is shown as a cross-sectional view in FIG. The same constituent elements as those in FIG. In FIG. 4, a plurality of magnetic layers 9 A and 9 B are formed in the element body 5 above the coil 6, and a plurality of magnetic layers 9 C and 9 D are formed below the coil 6. A part of the element body 5 is interposed between the magnetic layers 9A, 9B, 9C, and 9D in the plurality of magnetic layers.
- the plurality of magnetic layers 9A, 9B, 9C, 9D are arranged substantially parallel to the winding plane of the coil 6. This is because the magnetic layers 9A, 9B, 9C, and 9D having high permeability are arranged in the path of the magnetic flux.
- the thickness of each of the magnetic layers 9A, 9B, 9C, and 9D is set to less than twice the thickness of the skin depth to suppress the generation of eddy currents.
- the plurality of magnetic layers 9A, 9B, 9C, and 9D are formed in the element body 5 respectively.
- the magnetic body layers 9A, 9B, 9C, and 9D are entirely covered with the element body 5, each magnetic substance layer 9A, 9B, 9C, and 9D, or between the element body 5 and the magnetic body Even if the thermal expansion / shrinkage rates between the layers 9A, 9B, 9C, and 9D are different, the magnetic layer 9A, 9B, 9C, and 9D can be separated from the element body 5 and high reliability can be obtained. it can.
- the magnetic element layers 9A, 9B, 9C, and 9D are made of a material having a uniform thermal expansion and contraction rate by forming the element body 5 in contact with each of the magnetic substance layers 9A, 9B, 9C, and 9D. Thermal expansion with the element 5 'Pressure force generated due to the difference in contraction rate
- the magnetic layers 9A, 9B, 9C, 9D are uniformly applied to the entire magnetic layer 9A, 9B, 9C, 9D. It is possible to prevent a decrease in reliability due to a local force applied to the body 5.
- the saturation magnetic flux increases in proportion to the number of layers, realizing a good DC superposition characteristic and a high inductance value. Can be realized.
- the force is such that two magnetic layers 9A and 9B and magnetic layers 9C and 9D are disposed above and below the coil 6, respectively.
- the number of magnetic layers to be formed may be different between the upper and lower sides of the coil 6. However, if there is a portion where the magnetic flux does not easily flow on one of the upper and lower sides, the inductance value is reduced. Therefore, if a magnetic layer with the same thickness is used, the total thickness of the coil 6 is the same as the number of layers above and below the coil 6. It is desirable to arrange them so that they are equal above and below.
- FIG. 5 is a cross-sectional view of the inductance component according to Embodiment 2 of the present invention.
- a coil 6 is formed in a sheet-like element body 5
- terminals 7 and 8 are formed outside the coil 6, and the planar coils 6 A and 6 B constituting the coil 6 are formed. Is the via 6D in the body 5 Forming. Then, a part of the terminals 7 and 8 are constituted by magnetic terminals 7A and 8A having a magnetic force.
- a metal magnetic material having a composition such as iron or an iron alloy as the material of the magnetic terminals 7A and 8A from the viewpoint of magnetic flux density and magnetic loss.
- the composition ratio of iron is preferably 30% by mass or more. This is because the magnetic properties of high saturation magnetic flux density and low coercive force can be realized by setting the iron content in the magnetic terminals 7A and 8A to 30% by mass or more. Also, if the nickel content is around 80%, a high magnetic permeability can be obtained, and a large inductance value can be obtained.
- the iron alloy used for the magnetic terminals 7A and 8A it is possible to use a metal magnetic material having a composition containing any one of FeNi, FeNiCo, and FeCo so that a high magnetic flux density and a low magnetic The viewpoint power of energy loss is also preferable.
- the coil 6 may be a single layer, but in the second embodiment, the coil 6 is constituted by two layers of planar coils 6A and 6B.
- the upper layer planar coil 6A is spirally wound from the terminal 7 in the inner circumferential direction, and the innermost circumferential part of the planar coil 6A and the innermost circumferential part of the lower planar coil 6B are connected by vias 6D.
- Coil 6B is formed by spirally winding the coil 6B toward the terminal 8 (peripheral direction).
- the magnetic permeability can be increased, and as a result, the inductance value can be improved.
- the magnetic terminals 7A and 8A are provided within the area originally occupied by the terminals 7 and 8, it is necessary to increase the area of the inductance component itself or reduce the area occupied by the coil 6. Absent.
- a magnetic middle leg (center core) having a magnetic force is provided inside the coil 6 of the element body 5.
- FIG. 6 is a top view of the inductance component in the second embodiment of the present invention.
- Figure 6 As shown in the figure, by further forming a magnetic outer leg 11 made of a magnetic body outside the coil 6 in the element body 5, a higher inductance value can be obtained. In this way, it is possible to cope with a larger current, U.
- the magnetic middle leg portion 10 is composed of at least a mixture of magnetic powder and greaves.
- magnétique powder ferrite powder or metal magnetic powder mainly composed of Fe, Ni, or Co can be used.
- the magnetic middle leg 10 may be configured using a metal magnetic material, an acidic magnetic material, or the like. However, if the magnetic intermediate leg portion 10 is configured using a mixture of magnetic powder and resin, Since the resistance value in the leg 10 can be increased, the generation of eddy current can be suppressed, which is desirable.
- it is more desirable to use a magnetic powder having a high saturation magnetic flux density such as Fe-M alloy powder, Fe-Co alloy powder, Fe-Mo-Ni alloy powder.
- the particle size is preferably 0.5 ⁇ m or more and 100 ⁇ m or less, more preferably 2 ⁇ m or more and 30 ⁇ m or less. If the particle size is too large, eddy current loss at high frequencies will increase, and conversely if the particle size becomes too small, the amount of resin required will increase and the permeability will decrease. Because.
- the resin used for the magnetic middle leg 10 can be used as long as it has a binding force. From the viewpoint of strength after binding and heat resistance during use, epoxy resin, phenol resin. It is desirable to use thermosetting resin such as oil, silicone resin, and polyimide resin. Further, in order to improve the dispersibility with the magnetic powder and the resin performance, a small amount of a dispersant, a plasticizer or the like may be added. Furthermore, it is desirable to add a third component in order to adjust the viscosity of the paste before curing or to improve the insulation when using a metal magnetic powder. Such water, glass, boron nitride, talc, mica, barium sulfate, tetrafluoroethylene, etc. Can be mentioned.
- FIG. 7 is a cross-sectional view of the inductance component according to Embodiment 3 of the present invention.
- a coil 27 is formed in a sheet-like element body 26, terminals 28 and 29 are formed on the outermost periphery of the coil 27, and between the planar coils 27 A and 27 B constituting the coil 27. No via
- the magnetic layers 30A, 3 are provided above and below the coil 27 in the element body 26, respectively.
- a part of the terminals 28 and 29 is formed by magnetic terminals 28A and 29A made of a magnetic material.
- the magnetic terminals 28A, 29 in the terminals 28, 29 are used.
- A is also formed on the upper and lower surfaces of the element body 26.
- a magnetic middle leg portion 31 made of a magnetic material is formed inside the coil 27 of the element body 26.
- the magnetic permeability can be increased, and as a result, the inductance value can be improved.
- the magnetic flux emitted from the magnetic middle leg 31 is again magnetic. Since most of the path until the light enters the leg 31 can be made of only a high magnetic permeability material, the inductance value can be further improved.
- the magnetic layers 28A and 29A are provided within the area originally occupied by the terminals 28 and 29, it is necessary to increase the area of the inductance component itself or reduce the area occupied by the coil 27. Gana,.
- FIG. 8 shows a cross-sectional view of an inductance component according to Embodiment 4 of the present invention.
- Figure 9 shows an exploded perspective view of the same inductance component.
- the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted.
- the magnetic layers 9A and 9B have slits 12A and 12B as shown in FIG. 9, and the slits 12A and 12B are filled with a part of the element body 5 shown in FIG. is doing.
- the magnetic layers 9A and 9B be arranged substantially in parallel with the winding plane of the coil 6. This is because the magnetic layers 9A and 9B having high permeability are arranged in the path of the magnetic flux generated from the coil 6.
- the magnetic layers 9A and 9B are formed in the element body 6 and the slits 12A and 12B provided in the magnetic layers 9A and 9B are filled with a part of the element body 5. Therefore, the entire magnetic layer 9A, 9B can be configured to be covered with an element body 5 having a uniform thermal expansion and shrinkage rate, and even under conditions where heat is applied to the entire part, such as during solder mounting, It is possible to obtain high reliability without applying stress locally to the magnetic layers 9A and 9B.
- Examples of the shape of the slits 12A and 12B include a cross shape as shown in Fig. 9 and a shape that spreads radially from the center. If the slits 12A and 12B are shaped so as to spread radially from the center, the most magnetic flux passes through them, that is, the eddy current is generated most. In the central part of the screen, the slits 12A and 12B in the magnetic layers 9A and 9B Since the ratio of the area to be increased increases, eddy currents can be efficiently prevented, which is desirable.
- slits 12A and 12B are provided, and the slits 12A and 12B are partially filled with the element body 5, thereby increasing the contact area between the magnetic layers 9A and 9B and the element body 5. Can be improved.
- 10 to 12 are plan views illustrating the shape of the slit formed in the magnetic layer in the fifth embodiment.
- the cross-sectional view and exploded perspective view are substantially the same as those in the first embodiment, and will be omitted.
- the magnetic layers 9A and 9B are formed by running a plurality of substantially V-shaped slits 12A that extend in the outer circumferential direction of the magnetic layers 9A and 9B as shown in FIG. is doing.
- the interval between the substantially V-shaped slits 12A shown in FIG. 10 is less than twice the thickness of the skin depth in order to prevent generation of eddy currents in the direction of the formation plane of the magnetic layers 9A and 9B. ⁇ .
- a plurality of substantially V-shaped slits 12A extending from the bent portion toward the outer circumference of the magnetic layers 9A and 9B as shown in FIG. 10 are run in parallel on the magnetic layers 9A and 9B. Therefore, the slit 12A spacing can be made uniform at the center and outer periphery of the magnetic layers 9A and 9B, and eddy currents are greatly generated near the outer periphery of the magnetic layers 9A and 9B. Can be suppressed.
- the substantially V-shaped slit 12A has a configuration in which the bending force of the slit 12A expands in the outer circumferential direction, so that the magnetic flux force generated from the central portion of the coil 6 passes through the magnetic layers 9A and 9B. Therefore, the presence of the slit 12A shown in FIG. 10 can hardly prevent the bending portion force from being diverged in the outer peripheral direction, and a high inductance value can be obtained.
- a configuration as shown in FIG. 12 that is, a plurality of substantially V-shaped slits 12A run in parallel with a substantially cross-shaped slit 12B, and the plurality of substantially V-shaped slits 12A are bent.
- a slit 12C that crosses the section, the eddy current in the central portion (V-shaped bent portion) of the magnetic layer 9A formed between the plurality of substantially V-shaped slits 12A is further exposed. Can be reduced.
- the magnetic layers 9A and 9B may be formed on the upper surface or the lower surface of the element body 5, but the magnetic layers 9A and 9B may be formed in the element body 5,
- the slits 12A and 12B provided in the magnetic layers 9A and 9B are filled with a part of the element body 5, so that each of the magnetic layers 9A and 9B has a uniform coefficient of thermal expansion and contraction.
- the structure can be covered with the body 5. As a result, even when heat is applied to the entire coil component, such as during solder mounting, high reliability can be obtained without stress being applied locally to the magnetic layers 9A and 9B. Can do.
- FIG. 13 is a plan view illustrating the shapes of the slits 12A and 12B formed in the magnetic layer 9.
- FIG. The cross-sectional view is the same as FIG.
- the inner portion 13A of the magnetic layer 9 is formed by running a plurality of substantially V-shaped slits 12A extending from the bent portion 12AA to the outer peripheral direction of the magnetic layer 9 in parallel. is doing.
- one end of the substantially V-shaped slit 12 A is connected to the outer leg portion 11. It is desirable to form the outer leg portion 11 in the direction of Coil 6 is generated from the center This is because the substantially V-shaped slit 12A does not hinder the magnetic flux flowing from the inner portion 13A of the magnetic layer 9 toward the outer leg portion 11. As a result, a high inductance value can be obtained.
- Radial slits 12B are formed in the outer portion 13B of the magnetic layer 9 so that the force in the center direction of the magnetic layer 9 also extends in the outer peripheral direction.
- the inner portion 13A in the magnetic layer 9 refers to a region where the magnetic flux is particularly concentrated, and is a region including at least the inner side of the innermost circumference of the coil 6.
- the outer part 13B in the magnetic layer 9 indicates the outer side of the inner part.
- the magnetic layer 9 may be magnetically forceful.
- the outer body portion 13B since the amount of magnetic flux flowing per unit area is small, the need to consider eddy current is less than in the inner portion 13A. Therefore, it is desirable to form radial slits 12B extending toward the outer periphery of the magnetic layer 9 in the outer portion 13B instead of the substantially V-shaped slits 12A. This is because by deliberately reducing the slit interval of the outer portion 13B of the magnetic layer 9, the inductance value can be improved without hindering the flow of magnetic flux.
- At least the inner portion 13A of the magnetic layer 9 has a substantially V-shaped slit 12A extending from the bent portion 12AA toward the outer peripheral direction of the magnetic layer 9 as shown in FIG.
- the slit spacing in the inner part 13A of the magnetic layer 9 where the magnetic flux flows in most can be made uniform, and as a result, the generation of eddy currents is greatly suppressed. can do.
- the magnetic force generated from the central portion of the coil 6 shown in FIG. 13 is obtained by forming the substantially V-shaped slit 12A in a wide-force configuration from the bent portion 12AA toward the outer circumferential direction. It is possible to obtain a high inductance value that is less obstructed by the presence of the slit 12A shown in FIG. 13 from diverging from the bent portion 12AA through the layer 9 in the outer peripheral direction.
- the interval between the substantially V-shaped slits 12A shown in FIG. 13 may be less than twice the thickness of the skin depth in order to prevent the generation of eddy currents in the plane of formation of the magnetic layer 9. desirable.
- the magnetic layer 9 may be formed on the upper surface or the lower surface of the element body 5, the magnetic layer 9 may be formed in the element body 5 as shown in FIG.
- FIG. 14 is a cross-sectional view
- FIGS. 15 to 22 are top views. .
- a through-hole portion 14 is provided substantially at the center of the sheet-like element body 5, a coil 6 is provided outside the through-hole portion 14, and a coil lead-out portion is provided on the outermost peripheral portion of the coil 6.
- 6 AA, 6BB, via 6D between the planar coils 6A, 6B constituting the coil 6 are formed in the element 5, and the middle leg magnetic layer 16 is formed in the through hole portion 14. Yes.
- the coil lead portions 6AA and 6BB are electrically connected to terminals 7 and 8 provided on the outer surface of the element body 5, respectively.
- a plurality of insulating walls 15 substantially perpendicular to the winding plane of the coil 6 are provided in the middle leg magnetic layer 16.
- the walls 15 are arranged so as to be parallel to each other when viewed from the direction perpendicular to the winding plane of the coil 6 as shown in FIG.
- the generation of eddy current is efficiently reduced by the insulating wall 15 that is substantially perpendicular to the winding plane of the coil 6 (that is, substantially perpendicular to the eddy current generation plane). Since it is not necessary to lower the magnetic permeability of the middle leg magnetic layer 16 itself by adding a low permeability material such as an oxide or the like, it passes through the through hole portion 14 as shown in FIG. As a result, an inductance component (chip coil) having a high inductance value can be realized.
- the insulating wall 15 is arranged as shown in FIG. 16, that is, the middle leg magnetic layer 16 is formed only on the inner peripheral surface of the through-hole portion 14, and insulation is further provided on the inner side.
- the magnetic permeability of the middle leg magnetic layer 16 itself may be configured such that a plurality of insulating walls 15 that are substantially perpendicular to the winding plane of the coil 6 are provided in the middle leg magnetic layer 16. The generation of eddy currents can be reduced without lowering.
- not only the inner peripheral surface of the through hole portion 14 but also the inner leg magnetic layer 16 is formed so as to fill the inner side thereof, thereby The effective area can be increased, and as a result, the saturation magnetic flux density can be increased.
- the inner force of the through-hole portion 14 is also released radially.
- the eddy current generated by the magnetic flux can be reduced with respect to the magnetic flux that enters the through-hole portion 14 from four directions. That is, for the magnetic flux that enters (emits) the wall 15 in the configuration of FIG. 15 from the oblique direction, the distance between the adjacent wall 15 and the other wall 15 in the plane perpendicular to the magnetic flux is oblique. Because it becomes longer as it enters (emits) the eddy current, it tends to generate eddy currents.
- the wall 15 since the wall 15 is provided in a lattice shape, the wall 15 can be applied to a magnetic flux that is incident (emitted) from a perpendicular oblique direction to the wall 15. Because there are two walls 15 perpendicular to the magnetic flux parallel to both sides of the magnetic flux, the distance between the adjacent wall 15 and the other wall 15 in the plane perpendicular to the magnetic flux can be applied regardless of the angular force. The probability of eddy currents Can be reduced. As a result, the generation of eddy current can be further reduced.
- a plurality of substantially V-shaped walls 15 run in parallel with the substantially cross-shaped magnetic layer 16A as shown in FIG.
- the inductance value can be increased compared to the configuration of FIG. That is, in the configuration as shown in FIG. 15, of the magnetic flux emitted (incident) from the through-hole portion 14 toward the upper surface (lower surface) of the element body 5, the magnetic flux in the direction parallel to the wall 15 Although the flow is not obstructed by the presence of 15, the flow is obstructed by the wall 15 for the magnetic flux in the other direction.
- the configuration shown in FIG. 18 can improve the inductance value that the wall 15 does not obstruct the flow with respect to the magnetic flux emitted (incident) in all directions. .
- a configuration as shown in FIG. 20 that is, a plurality of substantially V-shaped walls 15B run in parallel with a substantially cross-shaped wall 15A, and between the plurality of substantially V-shaped walls 15B, and A substantially V-shaped magnetic layer 16 is provided between a plurality of substantially V-shaped walls 15B and a substantially cross-shaped wall 15A, and the center of the plurality of substantially V-shaped walls 15B is traversed.
- the wall 15C it is possible to reduce the eddy current in the central portion of the substantially V-shaped magnetic layer 16 shown in FIG.
- the configuration shown in FIGS. 21 and 22 that is, the configuration in which the magnetic layer 16 is formed so as to fill not only the inner peripheral surface of the through-hole portion 14 but also the inside thereof.
- the configuration shown in FIGS. 15 and 17 it is possible to reduce the generation of eddy current in one layer without lowering the magnetic permeability of the magnetic layer 16 itself, and to improve the effectiveness of the magnetic layer 16.
- the cross-sectional area can be increased and the saturation magnetic flux density can be increased.
- the wall 15 is centered when viewed from the direction perpendicular to the winding plane of the coil 6. If the arrangement is such that it diverges from the outside, the distance between the wall 15 and the other wall 15 increases at the outer peripheral portion, and eddy currents are likely to occur at that portion. Therefore, as shown in FIGS. 15 and 17 to 21, it is desirable that the distance between the wall 15 and the other wall 15 be substantially constant because eddy current generation can be more efficiently reduced. For example, in the frequency range of 1 to 10 MHz, the effect is improved if the interval is 20 m or less.
- the through hole portion 14 is embedded in the element body 5 and the through hole portion 14 is filled with the magnetic layer 16. It was. However, if the through hole portion 14 is used as a through hole and the magnetic layer 16 is formed continuously from the upper surface and the lower surface of the element body 5, leakage magnetic flux can be reduced.
- the inductance component of the present invention is characterized by high reliability and a high inductance value, and is useful for various electric devices such as mobile phones.
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Abstract
Description
Claims
Priority Applications (2)
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US11/909,756 US8248200B2 (en) | 2006-03-24 | 2007-03-19 | Inductance component |
CN2007800005291A CN101326597B (zh) | 2006-03-24 | 2007-03-19 | 感应器件 |
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JP2006082278A JP5082271B2 (ja) | 2006-03-24 | 2006-03-24 | チップコイルとその製造方法 |
JP2006-082278 | 2006-03-24 | ||
JP2006-113152 | 2006-04-17 | ||
JP2006113152A JP5082282B2 (ja) | 2006-04-17 | 2006-04-17 | インダクタンス部品とその製造方法 |
JP2006-113151 | 2006-04-17 | ||
JP2006113151A JP5286645B2 (ja) | 2006-04-17 | 2006-04-17 | インダクタンス部品とその製造方法 |
JP2006-131329 | 2006-05-10 | ||
JP2006131329A JP2007305717A (ja) | 2006-05-10 | 2006-05-10 | インダクタンス部品とその製造方法 |
JP2006133305A JP5082293B2 (ja) | 2006-05-12 | 2006-05-12 | インダクタンス部品とその製造方法 |
JP2006-133305 | 2006-05-12 | ||
JP2006180663A JP2008010697A (ja) | 2006-06-30 | 2006-06-30 | インダクタンス部品 |
JP2006-180663 | 2006-06-30 | ||
JP2006180661A JP2008010695A (ja) | 2006-06-30 | 2006-06-30 | インダクタンス部品 |
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Cited By (8)
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Publication number | Priority date | Publication date | Assignee | Title |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0488608A (ja) * | 1990-07-31 | 1992-03-23 | Tdk Corp | 電子部品及びその製造方法 |
JPH04101403A (ja) * | 1990-08-21 | 1992-04-02 | Tdk Corp | 電子部品及びその製造方法 |
JPH0955316A (ja) * | 1995-08-17 | 1997-02-25 | Toshiba Corp | 平面型磁気素子およびその製造方法 |
JP2003158017A (ja) * | 2001-11-21 | 2003-05-30 | Jhc Osaka:Kk | トランス |
JP2004128506A (ja) * | 2002-10-01 | 2004-04-22 | Ceratec Co Ltd | 積層型コイル部品及びその製造方法 |
JP2005340586A (ja) * | 2004-05-28 | 2005-12-08 | Murata Mfg Co Ltd | 積層型電子部品 |
JP2007123352A (ja) * | 2005-10-25 | 2007-05-17 | Tdk Corp | コモンモードフィルタ |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4295112A (en) * | 1978-08-30 | 1981-10-13 | Mitsubishi Denki Kabushiki Kaisha | Residual current transformer |
DE4117878C2 (de) * | 1990-05-31 | 1996-09-26 | Toshiba Kawasaki Kk | Planares magnetisches Element |
CA2072277A1 (en) * | 1991-07-03 | 1993-01-04 | Nobuo Shiga | Inductance element |
US6529720B1 (en) * | 1998-12-29 | 2003-03-04 | Koninklijke Philips Electronics N.V. | Integrated circuit of inductive elements |
JP4101403B2 (ja) | 1999-06-22 | 2008-06-18 | 株式会社荏原製作所 | ウェーハ研磨装置及びウェーハ製造方法 |
JP3776281B2 (ja) * | 1999-04-13 | 2006-05-17 | アルプス電気株式会社 | インダクティブ素子 |
JP2001155923A (ja) | 1999-11-26 | 2001-06-08 | Kyocera Corp | インダクタ素子 |
US6600208B2 (en) * | 2000-09-11 | 2003-07-29 | Texas Instruments Incorporated | Versatile system for integrated circuit containing shielded inductor |
US6593838B2 (en) * | 2000-12-19 | 2003-07-15 | Atheros Communications Inc. | Planar inductor with segmented conductive plane |
US6768409B2 (en) * | 2001-08-29 | 2004-07-27 | Matsushita Electric Industrial Co., Ltd. | Magnetic device, method for manufacturing the same, and power supply module equipped with the same |
JP2003203813A (ja) | 2001-08-29 | 2003-07-18 | Matsushita Electric Ind Co Ltd | 磁性素子およびその製造方法、並びにそれを備えた電源モジュール |
JP3865636B2 (ja) | 2002-01-09 | 2007-01-10 | 松下電器産業株式会社 | 半導体装置および半導体チップ |
JP3932933B2 (ja) | 2002-03-01 | 2007-06-20 | 松下電器産業株式会社 | 磁性素子の製造方法 |
US7212094B2 (en) * | 2002-10-31 | 2007-05-01 | Matsushita Electric Industrial Co., Ltd. | Inductive components and electronic devices using the same |
WO2004055841A1 (ja) * | 2002-12-13 | 2004-07-01 | Matsushita Electric Industrial Co., Ltd. | 多連チョークコイルおよびそれを用いた電子機器 |
JP4088608B2 (ja) | 2003-06-25 | 2008-05-21 | 京セラミタ株式会社 | 画像処理装置の支持構造 |
JP2005317604A (ja) | 2004-04-27 | 2005-11-10 | Matsushita Electric Ind Co Ltd | インダクタンス部品とそれを用いた電子機器 |
JP2006032587A (ja) | 2004-07-15 | 2006-02-02 | Matsushita Electric Ind Co Ltd | インダクタンス部品およびその製造方法 |
US7247922B2 (en) * | 2004-09-24 | 2007-07-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Inductor energy loss reduction techniques |
US7091816B1 (en) * | 2005-03-18 | 2006-08-15 | Tdk Corporation | Common-mode choke coil |
-
2007
- 2007-03-19 WO PCT/JP2007/055535 patent/WO2007119426A1/ja active Application Filing
- 2007-03-19 US US11/909,756 patent/US8248200B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0488608A (ja) * | 1990-07-31 | 1992-03-23 | Tdk Corp | 電子部品及びその製造方法 |
JPH04101403A (ja) * | 1990-08-21 | 1992-04-02 | Tdk Corp | 電子部品及びその製造方法 |
JPH0955316A (ja) * | 1995-08-17 | 1997-02-25 | Toshiba Corp | 平面型磁気素子およびその製造方法 |
JP2003158017A (ja) * | 2001-11-21 | 2003-05-30 | Jhc Osaka:Kk | トランス |
JP2004128506A (ja) * | 2002-10-01 | 2004-04-22 | Ceratec Co Ltd | 積層型コイル部品及びその製造方法 |
JP2005340586A (ja) * | 2004-05-28 | 2005-12-08 | Murata Mfg Co Ltd | 積層型電子部品 |
JP2007123352A (ja) * | 2005-10-25 | 2007-05-17 | Tdk Corp | コモンモードフィルタ |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009117479A (ja) * | 2007-11-02 | 2009-05-28 | Sumida Corporation | コイル部品 |
JP2013102127A (ja) * | 2011-11-07 | 2013-05-23 | Samsung Electro-Mechanics Co Ltd | 積層型インダクタ及びその製造方法 |
JP2014199944A (ja) * | 2014-06-24 | 2014-10-23 | 新光電気工業株式会社 | インダクタ内蔵部品 |
JP2016195245A (ja) * | 2015-04-01 | 2016-11-17 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | コイル電子部品及びその製造方法 |
JP7177190B2 (ja) | 2015-10-16 | 2022-11-22 | モダ-イノチップス シーオー エルティディー | パワーインダクター |
CN108140468A (zh) * | 2015-10-16 | 2018-06-08 | 摩达伊诺琴股份有限公司 | 功率电感器 |
JP2018534773A (ja) * | 2015-10-16 | 2018-11-22 | モダ−イノチップス シーオー エルティディー | パワーインダクター |
US10943722B2 (en) | 2015-10-16 | 2021-03-09 | Moda-Innochips Co., Ltd. | Power inductor |
JP2021073710A (ja) * | 2015-10-16 | 2021-05-13 | モダ−イノチップス シーオー エルティディー | パワーインダクター |
JP2017224714A (ja) * | 2016-06-15 | 2017-12-21 | パナソニックIpマネジメント株式会社 | コモンモードノイズフィルタ |
JP2018056505A (ja) * | 2016-09-30 | 2018-04-05 | 太陽誘電株式会社 | 表面実装型のコイル部品 |
US10672555B2 (en) | 2016-09-30 | 2020-06-02 | Taiyo Yuden Co., Ltd. | Surface-mountable coil element |
WO2020105704A1 (ja) * | 2018-11-22 | 2020-05-28 | 味の素株式会社 | 磁性ペースト |
KR20210093260A (ko) * | 2018-11-22 | 2021-07-27 | 아지노모토 가부시키가이샤 | 자성 페이스트 |
JPWO2020105704A1 (ja) * | 2018-11-22 | 2021-09-02 | 味の素株式会社 | 磁性ペースト |
CN113165063A (zh) * | 2018-11-22 | 2021-07-23 | 味之素株式会社 | 磁性糊料 |
KR102667485B1 (ko) * | 2018-11-22 | 2024-05-22 | 아지노모토 가부시키가이샤 | 자성 페이스트 |
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US20100182116A1 (en) | 2010-07-22 |
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