WO2006101174A1 - 発光素子収納用パッケージおよび発光装置ならびに照明装置 - Google Patents
発光素子収納用パッケージおよび発光装置ならびに照明装置 Download PDFInfo
- Publication number
- WO2006101174A1 WO2006101174A1 PCT/JP2006/305846 JP2006305846W WO2006101174A1 WO 2006101174 A1 WO2006101174 A1 WO 2006101174A1 JP 2006305846 W JP2006305846 W JP 2006305846W WO 2006101174 A1 WO2006101174 A1 WO 2006101174A1
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- WO
- WIPO (PCT)
- Prior art keywords
- light
- light emitting
- reflecting member
- emitting element
- reflecting
- Prior art date
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 58
- 239000000758 substrate Substances 0.000 claims description 42
- 230000002093 peripheral effect Effects 0.000 claims description 35
- 238000003860 storage Methods 0.000 claims description 28
- 239000000919 ceramic Substances 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 238000009429 electrical wiring Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 abstract description 30
- 230000035882 stress Effects 0.000 description 22
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 239000004020 conductor Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 12
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- 230000006870 function Effects 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 8
- 238000005286 illumination Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 238000002310 reflectometry Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000007774 longterm Effects 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 5
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- -1 gallium nitride compound Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000010944 silver (metal) Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
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- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
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- 239000002904 solvent Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
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- 239000010935 stainless steel Substances 0.000 description 1
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- 238000004383 yellowing Methods 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Definitions
- Light emitting element storage package Light emitting element storage package, light emitting device, and lighting device
- the present invention relates to a light-emitting element housing package that converts the wavelength of light emitted from a light-emitting element with a phosphor and radiates the light to the outside, and a light-emitting device and an illumination device using the same.
- a conventional light emitting device includes a light emitting element storage package (hereinafter simply referred to as a package! /).
- the light emitting device is mainly configured by including a light transmissive member.
- Package is
- the reflecting member is formed in a frame shape, and the inner peripheral surface is a reflecting surface that reflects the light emitted from the light emitting element.
- This light emitting device can cause the light emitting element 14 to emit light by a drive current supplied from an external electric circuit.
- these light-emitting devices have come to be used as light sources for illumination, and those with good light distribution and good heat dissipation during operation of the light-emitting devices are required. Further, when this light-emitting device is used as a light source for illumination, the life of the light-emitting device becomes an important problem, and thus a light-emitting device with high brightness and long life is required.
- JP-A-10-107325 As a related technique, there is JP-A-10-107325.
- the light emitting device when a large volume reflecting member having an integral reflecting surface having desired reflection characteristics is joined, the light emitting device is used during handling in the package manufacturing process. If the stress and bending moment due to the difference in thermal expansion coefficient are generated in the base 11 and the reflecting member 12 during the operation, etc., or if the sealing of the knocker is not sufficient! I was invited.
- the present invention has been devised in view of the conventional problems that are intensive, and its purpose is to suppress fluctuations in the light distribution of the light emitting device caused by differences in thermal expansion coefficients. And providing a light-emitting device with good sealing performance.
- the present invention comprises a substrate having a light emitting element mounting portion on the upper surface;
- a frame-shaped first reflecting member attached to an upper surface of the base so as to surround the mounting portion, and having an inner peripheral surface as a first light reflecting surface;
- the first reflecting member has a height Yl of the first reflecting member, a height to the lower end of the second light reflecting surface ⁇ 2, and a height of the second reflecting member.
- ⁇ 3 is set, ⁇ 2 ⁇ 1 ⁇ 3.
- the substrate and the first reflecting member also have a ceramic force.
- the base body and the first reflecting member have a white ceramic power.
- the second reflecting member also has an aluminum force.
- the present invention provides a package for housing a light emitting element of the present invention
- a light emitting element mounted on the mounting portion
- a translucent member provided so as to cover the light emitting element inside the first reflecting member.
- the present invention provides a light emitting element storage package of the present invention
- a light emitting element mounted on the mounting portion
- a phosphor layer that is attached to the second reflecting member so as to close the opening of the second reflecting member and converts a part or all of the light from the light emitting element.
- a light emitting device characterized by the above.
- the light-emitting element is a light-emitting element that emits light in at least an ultraviolet region to a blue region.
- the present invention includes the light-emitting device of the present invention, a drive unit on which the light-emitting device is mounted and having an electrical wiring that drives the light-emitting device, and a light reflecting unit that reflects light emitted from the light-emitting device. This is a lighting device.
- FIG. 1 is a cross-sectional view showing a light emitting element storage package and a light emitting device using the same according to the first embodiment of the present invention.
- FIG. 2 is a cross-sectional view showing a light emitting element storage package and a light emitting device using the same according to the second embodiment of the present invention.
- FIG. 3 is a cross-sectional view showing a light emitting element storage package and a light emitting device using the same according to a third embodiment of the present invention.
- FIG. 4 is a cross-sectional view showing a light emitting element storage package and a light emitting device using the same according to a fourth embodiment of the present invention.
- FIG. 5A and FIG. 5B are a sectional view showing a fifth light emitting element storage package and a light emitting device using the same according to the present invention, and a perspective view showing a part thereof in cross section.
- FIG. 6 is a cross-sectional view showing a light emitting element storage package and a light emitting device using the same according to a sixth embodiment of the present invention.
- FIG. 7 is a plan view showing a lighting apparatus according to a seventh embodiment of the present invention.
- FIG. 8 is a cross-sectional view of the lighting device of FIG.
- FIG. 9 is a plan view showing an illumination apparatus according to an eighth embodiment of the present invention.
- FIG. 10 is a cross-sectional view of the lighting device of FIG.
- FIG. 11 is a cross-sectional view showing an example of a conventional light emitting device.
- FIG. 1 is a cross-sectional view showing a light emitting device according to a first embodiment of the present invention.
- the substrate 1, the first reflecting member 2, and the second reflecting member 3 mainly constitutes a light emitting element storage package.
- the light emitting element 4 is mainly provided by the light emitting element 4 and the translucent member 5 provided inside the first reflecting member 2 so as to cover the light emitting element 4 so that the light emitting element 4 is provided.
- the light emitting device to be stored is configured.
- the substrate 1 is made of an acid-aluminum sintered body (alumina ceramics), an aluminum nitride sintered body, ceramics such as glass ceramics, or the like, and a light-emitting element 4 is mounted at the center of the upper surface of the substrate 1.
- Part la is formed.
- one end of a wiring conductor lb led out to the outside of the light emitting element storage package is formed in the vicinity of the mounting portion la.
- the mounting portion la may be provided on the upper surface of the protruding portion provided in the central portion of the upper surface of the base 1.
- the wiring conductor lb is formed of, for example, a metallized layer such as W, Mo, Mn, or Cu.
- a metal paste obtained by adding a solvent and a plasticizer to a powder such as W is mixed with a predetermined pattern. It is formed on the substrate 1 by printing, coating and baking at a high temperature.
- the surface of the wiring conductor lb has a Ni layer thickness of 0.5 to 9 ⁇ m or a thickness for the purpose of preventing oxidation and firmly connecting a bonding wire (not shown) and the conductive member 6.
- a metal layer such as an Au layer of 0.5 to 5 ⁇ m is preferably deposited by a plating method.
- the other end of the wiring conductor lb is led to the outer surface of the light emitting device through a wiring layer formed inside the base body 1 and connected to the external electric circuit, so that the light emitting element 4 and the external electric circuit are connected. And have a function of electrically connecting the two.
- the substrate 1 functions as a support member for supporting and mounting the light emitting element 4.
- the upper surface of the substrate 1 is provided with a mounting portion la for the light emitting element 4, and the light emitting element 4 is a resin adhesive, or a low melting point brazing material such as tin (Sn) -lead (Pb) solder or Au-Sn solder. It is attached via etc.
- the first reflecting member 2 on the upper surface of the substrate 1 is made of a soldering material such as solder or Ag brazing, or a resin adhesive such as epoxy resin, acrylic resin or silicone resin.
- the first reflective member 2 is attached to the outer peripheral surface 2b of the first reflective member 2 through the gap 7 so as to surround the mounting portion la on which the light emitting element 4 is mounted via the bonding material.
- the second reflecting member 3 is surrounded by solder, soldering material such as Ag brazing, epoxy resin, acrylic It is attached via a bonding material such as a resin adhesive such as a resin or a silicone resin.
- the first reflecting member 2 has an inner peripheral surface facing the light emitting element 4 as a first light reflecting surface 2a, and a recess formed by the base body 1 and the first reflecting member 2 inside the first reflecting member 2 includes A translucent member 5 containing a phosphor (not shown) that is excited by the light of the light emitting element 4 to emit light is injected so as to cover the light emitting element 4.
- the inner peripheral surface of the first reflecting member 2 is an inclined surface with the upper end spreading outward rather than the lower end, and the first light reflecting surface 2a is formed on this inclined surface.
- the shape of the outer peripheral surface 2b and the inner peripheral surface of the first reflecting member 2 in plan view is not particularly limited, but is formed in a polygonal shape, a circular shape, an elliptical shape, or the like.
- the second reflecting member 3 of the present invention includes an inner peripheral surface 3a of the second reflecting member 3 surrounding the outer peripheral surface 2b of the first reflecting member 2 via the gap 7, and an upper side of the inner peripheral surface 3a.
- the second reflecting surface 3b for controlling the light distribution from the translucent member 5 or the light emitting element 4 is formed at least above the upper end of the first reflecting member 2. Further, the second reflecting surface 3b is formed on an inclined surface whose upper end spreads outward rather than its lower end.
- the shape of the outer peripheral surface and the inner peripheral surface of the second reflecting member 3 in plan view is not particularly limited, but is formed in a polygonal shape, a circular shape, an elliptical shape, or the like.
- the inner peripheral surface 3a does not necessarily correspond to the outer peripheral surface 2b of the first reflecting member 2 coaxially, but is usually formed in a corresponding polygonal shape, circular shape, elliptical shape, or the like.
- the second reflecting member 3 is attached by providing a gap 7 between the outer peripheral surface 2b of the first reflecting member 2 and the inner peripheral surface 3a of the second reflecting member 3 on the upper surface of the base 1.
- the substrate 1, the first reflecting member 2 and The thermal stress generated by the thermal expansion and contraction of the second reflecting member 3 can be relaxed. That is, since the reflecting members 2 and 3 are divided into two parts and the respective volumes of the first reflecting member 2 and the second reflecting member 3 are reduced, the respective thermal expansion amounts or thermal contraction amounts are reduced.
- the gaps 7 absorb the stresses inside the reflecting members 2 and 3 and the deformation caused by these stresses caused by the members 2 and the second reflecting member 3 acting against each other. These can alleviate the force acting on the substrate 1.
- the first reflecting member 2 and the second reflecting member 3 are divided as shown in FIG. 11, and the outer peripheral surface of the first reflecting member 2 and the inner peripheral surface of the second reflecting member 3 are brought into contact with each other.
- a package for housing the light emitting element can be considered. This also causes the first reflecting member 2 and the second reflecting member to be heated and cooled in the manufacturing process of the knocker, or by thermal expansion and contraction caused by heat generated when the light emitting device is operated. It is possible to solve to some extent the problem that the light distribution of the light emitting device fluctuates due to the mutual stress applied to the reflecting member 3 and the change in shape.
- the horizontal stress due to the difference in thermal expansion coefficient generated between the base 1 and the first reflecting member 2 and the second reflecting member 3 is further increased.
- the bending moment to the substrate 1 generated by the action of the first reflecting member 2 and the second reflecting member 3 is reduced.
- the stress concentrated on the central portion of the base 1 is reduced, the occurrence of cracks in the base 1 is suppressed, and the base 1 is peeled off from the first reflecting member 2 and the second reflecting member 3. Can also be suppressed.
- the wiring conductor lb formed on the substrate 1 is not damaged such as disconnection, and the light-emitting device can maintain a stable power supply to the light-emitting element 4, and the first and second reflections can be maintained. Since peeling between the members 2 and 3 and the substrate 1 does not occur, the airtightness as the light emitting element storage package can be maintained, and the long-term reliability is excellent. Also, the surface of the translucent member 5 filled inside the first reflecting member 2 is deformed, or the inclination angle between the first light reflecting surface 2a and the second light reflecting surface 3ba is changed. Therefore, a light emitting device that can emit light with a desired light distribution can be obtained.
- the reflecting members 2 and 3 are divided into the first reflecting member 2 and the second reflecting member 3, the light from the translucent member 5 and the light emitting element 4 containing the phosphor is distributed.
- the light control function can be performed independently by the first reflecting member 2 and the second reflecting member 3, and the heat generated by the light emitting element 4 and the heat due to the ambient temperature are loaded on the light emitting device.
- the influence of deformations that interact with each other due to thermal expansion can be reduced. Variations in optical characteristics can be suppressed.
- the first reflective member 2 filled with the translucent member 5 that is adjacent to and surrounds the light-emitting element 4 is, for example, a light-emitting portion, and is spaced apart from the light-emitting element 4 and the first reflective member 2
- the second reflecting member 3 arranged so as to surround the outer peripheral surface 2b as a light distribution control unit and arranging the first and second reflecting members 2, 3 so as to make each function independent The second reflecting member 3 having a light distribution control function is difficult to conduct the heat of the light emitting element 4 through the first reflecting member 2, and further, the second reflecting member 3 attached to the outer peripheral portion of the base 1 is used. Therefore, the heat of the light emitting element 4 becomes difficult to be transmitted to the reflecting member 3.
- the light-emitting device of the present invention is stable with little change in light distribution characteristics, color variation, and light-emitting characteristics of the light-emitting device during operation.
- the present invention can provide stable optical characteristics even when a metal such as A or Ag is used as a reflecting member, although it has a high reflectivity but has a low Vickers hardness and is susceptible to fluctuations in the light distribution. I'll do it.
- the gap 7 is filled with an elastic member having good thermal conductivity, for example, so that the heat generated by the light emitting element 4 can be dissipated through the first reflecting member 2 and the second reflecting member 3. Needless to say, it is good. In this way, the light emitting device can be cooled better, the light emission efficiency and life of the light emitting element 4 are not impaired, and the transition of the emission wavelength to the longer wavelength side can be suppressed.
- FIG. 1 shows that the light emitting device can be cooled better, the light emission efficiency and life of the light emitting element 4 are not impaired, and the transition of the emission wavelength to the longer wavelength side can be suppressed.
- the outer peripheral height of the first reflecting member 2 is Yl
- the height to the lower end of the second light reflecting surface 3b is Y2
- the height of the second reflecting member 3 is ⁇ 3
- the light emitted from the phosphors in the light emitting element 4 and the translucent member 5 and emitted to the side of the first reflecting member 2 is always the second on the second reflecting member 3. Since the light reflecting surface 3b is irradiated, the light distribution can be controlled by the second reflecting member 3, and a desired light distribution of the light emitting device can be obtained.
- the second The second light reflecting surface 3b of the reflecting member 3 is not irradiated with light at all, and the light emitting device cannot emit light having sufficient directivity.
- the light reflectance of the first light reflecting surface 2a is preferably 90% or more.
- the light reflected by the first light reflecting surface 2a to excite the phosphor is increased, and the light generated by the phosphor force in the translucent member 5 can be increased.
- the light from the light emitting element 4 can be efficiently reflected upward, and the light emission efficiency of the light emitting device is improved.
- the first light reflecting surface 2a is formed by mirroring the inner peripheral surface with a polishing process such as chemical polishing or electrolytic polishing when the first reflecting member 2 is also made of metal such as A or Ag. As a result, the light reflectance can be increased to 90% or more.
- the first reflecting member 2 is made of stainless steel (SUS), iron (Fe) —Ni—cobalt (Co) alloy, Fe—Ni alloy, ceramics or resin, and has a relatively low reflectivity even on the mirror surface.
- a mirror surface of a metal thin film such as Al, Ag, gold (Au), platinum (Pt), titanium (Ti), chromium (Cr) or copper (Cu) is formed on the inner peripheral surface by a plating method or vapor deposition method. May be formed.
- a Ni plating layer having a thickness of about 1 to 10 ⁇ m and an Au plating layer having a thickness of about 0.1 to 3 ⁇ m are sequentially deposited by an electrolytic plating method or an electroless plating method. May be. This improves the corrosion resistance of the first light reflecting surface 2a and suppresses the deterioration of the reflectance.
- the first reflecting member 2 when the first reflecting member 2 is made of a resin, it has a high reflectivity such as a resin material in which a filler having a titanium oxide (titer) force is dispersed or a fluorine-based Teflon (registered trademark) resin. It is also possible to form by performing cutting or molding using a material.
- the second reflecting member 3 reflects the scattered light from the translucent member 5 by the second light reflecting surface 3b to control the light distribution.
- Metals such as Al, Ag, Au, Pt, Ti, Cr or Cu, sintered aluminum oxide, zirconium oxide It is formed by cutting or molding a resin such as ceramics such as a sintered compact, epoxy resin, and liquid crystal polymer (LCP). May be used.
- the second light reflecting surface 3b is preferably a reflecting surface having a higher regular reflectance than the diffuse reflectance, and the second light reflecting surface 3b is made of a metal rather than formed of resin or ceramics. It is preferable to form with.
- the second light reflecting surface 3b is formed by subjecting the second reflecting member 3 formed by cutting or molding to a mirror surface by polishing such as chemical polishing or electrolytic polishing. .
- a metal such as Al, Ag, Au, Pt, Ti, Cr or Cu is formed on the second light reflecting surface 3b by plating or vapor deposition.
- a thin mirror surface may be formed.
- a Ni plating layer having a thickness of 1 to about LO / zm and an Au plating layer having a thickness of about 0.1 to 3 ⁇ m are sequentially deposited on the surface by an electrolytic plating method or an electroless plating method. May be.
- the corrosion resistance of the inner peripheral surface 3a is improved, and the deterioration of the reflectance on the second light reflecting surface 3b is suppressed.
- the first reflecting member 2 and the second reflecting member 3 are preferably made of a metal material having high thermal conductivity such as Al, Ag, Au, or Cu. This improves the heat dissipation of the entire light emitting device and makes it difficult for heat to accumulate in the light emitting element 4. Therefore, the light emitting element 4 can maintain the light emission efficiency and long-term reliability, and can suppress the transition of the central wavelength of light emission due to the temperature rise of the light emitting element 4.
- the first reflecting member 2 may be made of a material different from that of the second reflecting member 3. That is, the substrate 1 also has a ceramic force with a thermal expansion coefficient of 6 ⁇ 10 — 6 Z ° C., and the first reflective member 2 or the second reflective member 3 is a metal member or In the case of a resin, the difference in thermal expansion coefficient between the substrate 1 and the first reflecting member 2 or the second reflecting member 3 becomes large, and heating and cooling in the manufacturing process of the light emitting element storage package, or the light emitting device Due to the heat generated by the light-emitting element 4 during operation and the ambient temperature of the light-emitting device, the stress generated in the base 1 and the first reflecting member 2 or the second reflecting member 3 increases, and the base 1 and base 1 And a crack or peeling occurs at the joint between the first reflecting member 2 and the second reflecting member 3.
- the first reflecting member 2 or the second reflecting member 3 is made of a material that approximates the thermal expansion coefficient of the base 1, such as Cr (thermal expansion coefficient 6.8 X 10 "V ° O, silicon carbide ( SiC, thermal expansion coefficient 6.6 X 10 _b Z ° C) or other materials with high Young's modulus, such as Fe (192.2GPa), Ti (104.3GPa), or high Young's modulus and high reflection
- Cr thermal expansion coefficient 6.8 X 10 "V ° O
- SiC thermal expansion coefficient 6.6 X 10 _b Z ° C
- other materials with high Young's modulus such as Fe (192.2GPa), Ti (104.3GPa), or high Young's modulus and high reflection
- the coefficient of thermal expansion between the base 1 and the first reflecting member 2 or the second reflecting member 3 by using Al, Ag, or the like of the ratio as the first reflecting member 2 or the second reflecting member 3.
- the generation of stress in each part due to the difference can be suppressed, the warpage of the substrate 1 can be reduced, and the fluctuations in the reflection angles of the first and second light reflecting surfaces 2a and 3b can be reduced.
- the substrate 1 and the first reflecting member 2 of the present invention have a ceramic force.
- the substrate 1 is made of ceramics, the difference in thermal expansion coefficient between the substrate 1 and the light emitting element 4 is reduced, and the heat generated from the light emitting element 4 and the heat of the external environment are generated between the substrate 1 and the light emitting element 4. The stress between them is suppressed.
- the base 1 and the first reflecting member 2 have a ceramic force, the base 1 and the first reflecting member 2 are caused by a difference in thermal expansion coefficient between the base 1 and the first reflecting member 2.
- the stress at the joint and the deformation of the first light reflecting surface 2a due to these stresses are suppressed.
- deterioration of water resistance can be suppressed.
- the light emitting device can stably operate the light emitting element 4 while suppressing a decrease in light output over a long period of time.
- the light emitting element 4 is a gallium nitride compound semiconductor
- a sapphire substrate having a thermal expansion coefficient of about 5 ⁇ 10 — 6 Z ° C. is used as the substrate on which the light emitting layer is formed.
- the thermal expansion coefficient of the gallium arsenide compound semiconductor is approximately 6 ⁇ 10 — 6 Z ° C.
- aluminum oxide as the substrate 1 and the first reflection member 2 - When using a ⁇ beam sintered body, the thermal expansion coefficient of the sintered aluminum oxide is about 6 X 10_ 6 Z ° C, the light emitting Difference in thermal expansion coefficient from element 4 can be reduced.
- the thermal expansion coefficient is about 20 X 10 _6 Z ° C, and the difference in thermal expansion coefficient from the light emitting element 4 is increased.
- the stress generated at the junction between the substrate 1 and the light-emitting element 4 is concentrated on the light-emitting layer of the light-emitting element 4, the light-emitting element 4 has an optical wavelength shift that is presumed to be caused by the piezoelectric effect.
- the color of light emitted from the light emitting device changes, the intensity is reduced, or light unevenness occurs, making it difficult to obtain good illumination light as a light source used in the illumination device.
- ceramics is a stable material, it is possible to suppress a decrease in the reflectance of the first light reflecting surface 2a due to the temperature and moisture of the operating environment, and the light emitting element storage package and the light emitting device can be used for a long time. While suppressing a decrease in output, the light emitting element 4 can be stably operated, and light with stable color characteristics can be emitted.
- the substrate 1 and the first reflecting member 2 are made of white ceramics, such as an aluminum oxide-sintered sintered body, an acid-zirconium-based sintered body (zirco-ceramics), and an yttrium oxide-based sintered body. More preferably, it also has the strength of a sintered body (yttria ceramics) or a titanium oxide sintered body (titania ceramics).
- the white system has a reflection characteristic in which the difference between the maximum value and the minimum value of the reflectance from at least the ultraviolet region to the visible light region is within 10%.
- the manufacturing process is performed. Even if the working environment changes, and the elapsed time of the manufacturing process increases, cracks occur due to stress concentrated on the joint between the base 1 and the first reflecting member 2, or the base 1 and the first reflection Separation from the member 2 and deformation of the base 1 and the first reflecting member 2 can be suppressed, and fluctuations in reflectance of the base 1 and the first reflecting member 2 can be suppressed. Furthermore, since this ceramic is white, light can be reflected with less influence from wavelength dependence on efficiency from the ultraviolet region to the visible light region. As a result, the light emitting device can operate normally and stably over a long period of time, and can emit light with suppressed light output and color variation.
- the second reflecting member 3 preferably has an aluminum force.
- the second reflecting member 3 can accommodate light from the light emitting element whose change in reflectance is small due to the passive film caused by the acid, and can efficiently reduce the reflectance due to the operating environment.
- a package can be produced.
- Aluminum also has a reflectivity from the ultraviolet region to the visible light region. Less wavelength dependence, so there is little decrease in reflectivity for light in the ultraviolet, near-ultraviolet, or blue regions.Also, the decrease in reflectivity due to corrosion by moisture and oxygen in the operating environment can be suppressed, and light emission It is possible to suppress degradation of the optical output and long-term reliability of the device.
- the second reflecting member 3 having an aluminum force for example, when the first reflecting member 2 having translucency made of an oxide-aluminum sintered body or the like is used, the first reflecting member 2 is used.
- the light that passes through the side surface of the light and leaks to the outside of the light emitting device can be blocked.
- the contrast between the light-emitting surface and the non-light-emitting surface of the light-emitting device becomes clearer, and a light-emitting device with excellent visibility as a light source for display is manufactured. it can.
- the light-emitting element 4 is made of a wire material (not shown) on the wiring conductor lb formed on the substrate 1, or a solder material such as Au—Sn solder or Pb—Sn solder with the electrode part of the light-emitting element 4 facing down. Alternatively, they are electrically connected using a flip chip bonding method in which they are connected by a conductive member 6 made of conductive grease such as Ag paste.
- the wiring conductor lb can be provided immediately below the light emitting element 4 by connecting by a flip chip bonding method. Therefore, the wiring conductor lb is provided on the upper surface of the base 1 around the light emitting element 4. It is not necessary to provide a space for providing. As a result, it is possible to suppress the light emitted from the light emitting element 4 from being absorbed by the wiring conductor lb of the base 1 and the intensity of the emitted light from being lowered. Furthermore, the heat from the light emitting element 4 is efficiently conducted to the substrate 1 through the wiring conductor lb, so that the temperature rise of the light emitting element 4 during the operation of the light emitting device can be effectively suppressed, and the light emission efficiency. It is possible to suppress the decrease in light emission and the fluctuation of the emission wavelength.
- the wiring conductor lb is formed by forming a metallized layer of a metal powder such as W, Mo, Cu or Ag on the surface and inside of the substrate 1 when the substrate 1 is made of ceramics.
- a metal powder such as W, Mo, Cu or Ag
- the substrate 1 is made of a resin such as epoxy or LCP
- it is formed by embedding a lead terminal such as Fe—Ni—Co alloy and exposing one end to the mounting portion la.
- An input / output terminal made of an insulator in which the wiring conductor lb is formed is provided by being fitted and joined to a through hole provided in the base 1.
- an Ni plating layer having a thickness of about 1 to about LO / zm and an Au plating layer having a thickness of about 0.1 to 3 ⁇ m are formed by an electrolytic plating method. Sequentially deposited by the electroless plating method is more preferred.
- the translucent member 5 is made of a transparent resin such as epoxy resin or silicone resin, or a transparent glass force.
- An uncured transparent member containing a phosphor is placed inside the first reflective member 2 with a dispenser, etc. It is formed by injecting so as to cover the light emitting element 4 with an injector and heating and curing.
- the light-emitting element 4 also has a GaN force with a refractive index of 2.5, and the light-emitting element 4 is formed on a sapphire substrate with a refractive index of 1.7, a transparent resin with a refractive index of 1 to 1.7 is transparent.
- the refractive index difference S between the light emitting element 4 and the substrate is reduced, and more light can be extracted from the light emitting element 4.
- the light emission intensity can be improved, the emitted light intensity and brightness can be remarkably improved, and a light emitting device capable of emitting light having an arbitrary wavelength vector using the light of the phosphor can be manufactured. it can.
- the translucent member 5 is arranged such that the translucent member 5 not containing a phosphor is disposed inside the first reflecting member 2 as in the fourth embodiment of the present invention shown in FIG.
- a configuration may be adopted in which a sheet-like phosphor layer 8 made of a transparent member containing a phosphor is disposed so as to close the upper surface thereof.
- the light emitting device includes the light emitting element storage package and the mounting portion la as shown in the cross-sectional view of FIG. 5A and the perspective view of a part of FIG. And the second reflective member 4 so as to block the opening of the second reflective member 3 It is preferable to include a phosphor layer 8 attached to the member 3 for converting the wavelength of part or all of the light from the light emitting element 4. As a result, the deterioration of the characteristics of the phosphor layer 8 due to the heat generated from the light emitting element 4 can be suppressed.
- the light emitting element is compared with the case where the phosphor layer 8 is disposed so as to close the inside or the opening of the first reflecting member 2.
- the heat radiation path from 4 to the phosphor layer 8 via the second reflecting member 3 becomes long, and it becomes difficult for heat to be transmitted to the phosphor layer 8.
- the light emitted downward from the outer peripheral portion of the lower surface of the phosphor layer 8 and the light emitted laterally from the side surface of the phosphor layer 8 are the upper end surface of the first reflecting member 2 and the second surface.
- the light reflecting surface 3b By being reflected by the light reflecting surface 3b, the light emitted upward from the phosphor layer 8 is increased, and the light output and luminance of the light emitting device are improved.
- the phosphor layer 8 is It is attached to the second reflecting member 3 so as to close the opening of the reflecting member 3 and can be attached without contacting the surface of the translucent member 5 of the first reflecting member 2. Therefore, for example, when the phosphor layer 8 formed into a force plate (sheet shape) is disposed in the opening of the second reflecting member 3, the surface shape of the translucent member 5 is not affected. Can be arranged. As a result, the light emission from the light emitting element 4 becomes uniform, and a light emitting device in which color unevenness hardly occurs can be obtained.
- the second light reflecting surface 3b is formed on an inclined surface whose upper end spreads outward rather than the lower end in order to arbitrarily control the light distribution from the light emitting element 4 and the phosphor layer 8. It may be done. As a result, at least part of the light emitted from the phosphor layer 8 is applied to the second light reflecting surface 3b, so that the light distribution is controlled by the second reflecting member 3 and the desired light emitting device is obtained. Can be obtained. Further, the phosphor layer 8 is made of a transparent member such as silicone resin, epoxy resin, or acrylic resin on the light reflecting surface 3b of the second reflecting member 3 so as to block the opening of the second reflecting member 3.
- a transparent member such as silicone resin, epoxy resin, or acrylic resin
- the air layer is not formed between the phosphor layer 8 and the second reflecting member 3 by being attached via the light source, reflection loss caused by the refractive index difference of the air layer can be suppressed. As a result, the light reflected from the phosphor layer 8 by the second light reflecting surface 3b increases, and the light output of the light emitting device is improved.
- the height of the outer surface of the second reflecting member 3 is set to the inner circumference as shown in the sectional view of the light emitting device according to the sixth embodiment of the present invention shown in FIG.
- the height of the surface 3a may be the same as or lower than the inner peripheral surface 3a, and the second light reflecting surface may be above the upper end of the first reflecting member 2 on the inner peripheral surface 3a.
- the light distribution from the phosphor layer 8 cannot be controlled by the inclined surface of the second light reflecting surface 3b in FIGS. 5A and 5B, but can be diffused and emitted outside the light emitting device. The goal can be fully achieved.
- the light-emitting element 4 is more preferably a light-emitting element 4 that emits light in at least the ultraviolet region and the blue region. That is, when the phosphor layer 8 that converts the wavelength of light from the light-emitting element 4 contains a phosphor that is excited by the light of the light-emitting element 4 to generate fluorescence, at least in the ultraviolet region and the short wavelength of the blue region.
- the light of the light emitting element 4 having high energy has a longer wavelength than that of the light of the light emitting element 4, and the wavelength conversion efficiency of the phosphor that converts to fluorescent light is improved, and the light output of the light emitting device is increased.
- the ultraviolet region of light generated from the light-emitting element 4 is the upper limit of the short wavelength end of 360 to 400 nm of visible light, and the lower limit is an electromagnetic wave in the wavelength range up to about lnm. Z Iwanami Shoten). Also, the blue region is the lower wavelength range of 360 to 400 nm of visible light, and the upper limit is the wavelength range up to about 495 nm (chromaticity coordinates of JIS Z8701 XYZ color system)
- FIG. 7 is a plan view showing a lighting device according to a seventh embodiment of the present invention
- FIG. 8 is a cross-sectional view of FIG.
- FIG. 9 is a plan view showing an illuminating device according to an eighth embodiment of the present invention
- the lighting device includes the light emitting device 101 of the present invention, a drive unit 102 having electric wiring for driving the light emitting device 101, and light reflecting means 103.
- a reflecting plate is shown in the figure.
- the reflection plate is formed of, for example, a metal plate that has a function of reflecting light emitted from the light emitting device 101 and adjusting the light distribution to a predetermined distribution.
- the illumination device of the present invention includes the light emitting device 101 of the present invention as a light source.
- the light emitting device 101 of the present invention is mounted on the drive unit 102 in a predetermined arrangement (see FIGS. 7 and 9).
- the light reflecting means 103 and the like are installed around it.
- the drive unit 102 can drive the light-emitting device 101 and include a circuit having a function of controlling the power to the light-emitting device 101, whereby the light amount of the light-emitting device 101 can be changed.
- the drive unit 102 by providing the drive unit 102 with a circuit having a pulse control function, it is possible to have the function of blinking the light-emitting element 4 in a short time, and the total light emission time of the light-emitting element 4 can be reduced by the pulse control. The power consumption of the lighting device can be reduced, and the life of the light emitting element 4 can be extended. Furthermore, by providing the driver 102 with an overvoltage protection function, it is possible to prevent the light emitting element 4 from being deteriorated or broken down, and to provide a long-life and highly reliable lighting device.
- the lighting device of the present invention may include a plurality of light emitting devices 101 as light sources. At this time, in order to avoid the intensity of light from each of the light emitting devices 101, the second reflecting member 2 is used. The light distribution is widened, and light is diffused uniformly by joining an optical lens or a flat transparent lid to the top with solder or adhesive. be able to. In addition, an illumination device having a desired light distribution with little color unevenness can be obtained.
- a third reflecting member 3 that covers all of the plurality of light emitting devices 101 is provided, and an optical lens for condensing or diffusing light or a flat transparent cover body is soldered thereon. Or you may join with an adhesive agent etc.
- a lighting device that can extract light at a desired radiation angle with little color unevenness and has improved long-term reliability with improved water resistance to the inside of the light-emitting device 101.
- a lens or a translucent lid may be provided in the opening of the reflector 103 of the lighting device.
- light having a high directivity can be emitted by controlling the light distribution of the light emitted from the light emitting device with the first light reflecting surface 2a and Z or the second light reflecting surface 3b as a curved surface. it can.
- the outer peripheral surface 2b of the first reflecting member 2 and the inner peripheral surface 3a of the second reflecting member 3 be circular in shape in plan view, so that the stress generated on the respective surfaces 2b and 3a The bending moment can be evenly distributed, and the stress and the deformation of the first and second reflecting members 2 and 3 can be easily suppressed by dispersing the stress.
- the light emitted from the translucent member 5 on the upper surfaces of the first reflecting member 2 and the second reflecting member 3 and the light reflected by the second light reflecting surface 3b are diffused or diffused.
- the light emitting device can extract light at a desired radiation angle, and the inside of the light emitting device. Since the water resistance is improved, the light-emitting device has improved long-term reliability.
- the top / bottom / left / right expressions used in the description of the above embodiments merely describe the positional relationship in the drawings, and do not prescribe the arrangement in actual use.
- the present invention can be implemented in various other forms without departing from the spirit or main characteristic power thereof.
- the reflecting member is divided into two parts, and the second reflecting member is formed on the upper surface of the base with a gap from the outer peripheral surface of the first reflecting member. It is attached so as to surround the first reflecting member.
- the package manufacturing process Even when heating or cooling in the apparatus or heat generated when operating the light emitting device is added, the thermal expansion of the first and second reflecting members is reduced, and the respective thermal expansion is caused by the intervening gap.
- the deformation caused by does not cause mutual stress. Therefore, the generation of stress and bending moment due to the difference in thermal expansion coefficient generated between them and the substrate can be mitigated.
- deformation due to the interaction between the first and second reflecting members is absorbed by the intervening gap, and fluctuations in the light distribution of the light emitting device can be suppressed.
- the second light reflecting surface is provided above the first light reflecting surface, the light reflecting surface can be widened together with the first light reflecting surface and the orientation can be controlled in cooperation with each other. Therefore, the light from the light emitting element can be efficiently guided outside the light emitting device above with a desired light distribution.
- the height of the first reflecting member is Yl
- the height to the lower end of the light reflecting surface of the second reflecting member is ⁇ 2
- the height of the second reflecting member is ⁇ 3, ⁇ 2 If ⁇ ⁇ 1 ⁇ 3, the light distribution can be controlled by the second reflecting member, and the desired light distribution of the light emitting device can be obtained, so that variations in the light distribution can be suppressed.
- the substrate and the first reflecting member also have a ceramic force, the difference in thermal expansion coefficient between the substrate and the light emitting element is reduced, and the substrate is generated by the heat generated by the light emitting element force and the heat of the external environment. And the stress between the light emitting elements is suppressed. Further, since the base and the first reflecting member generate a ceramic force, the stress at the joint between the base and the first reflecting member, which is generated due to the difference in thermal expansion coefficient between the base and the first reflecting member. In addition, the deformation of the first light reflecting surface due to these stresses is suppressed.
- the reflectance and water resistance of the substrate and the first light reflecting surface are deteriorated due to moisture and heat in the operating environment or heat and light from the light emitting element as compared to the base made of resin and the first reflecting member. Etc. can be suppressed. As a result, the light-emitting device can stably operate the light-emitting element while suppressing a decrease in light output over a long period of time.
- the base and the first reflecting member are made of white ceramic power
- the reflecting member can be efficiently reflected from the ultraviolet region to the visible light region and has little wavelength dependency.
- the light emitting device can emit light with less light output and color variation.
- the second reflecting member is made of aluminum, the light of the light emitting element force with less change in reflectivity by the passivating film due to the acid is efficiently and the reflectivity is lowered due to the operating environment.
- a light emitting element storage package with a small amount can be manufactured.
- the ultraviolet region force has less wavelength dependency of the reflectance in the visible light region, there is little decrease in reflectance from light in the ultraviolet region to the near ultraviolet region or in the blue region. It is possible to suppress a decrease in reflectance caused by corrosion due to corrosion, and to suppress a decrease in light output and long-term reliability of the light emitting device.
- the second reflecting member having an aluminum force for example, when the first reflecting member having translucency made of, for example, an acid aluminum sintered body is used, the first reflecting member is used. Light that passes through the side surface of the member and leaks to the outside of the light emitting device can be blocked. As a result, when the light emitting device is used as a light source for display, the contrast between the light emitting surface and the non-light emitting surface of the light emitting device becomes clearer, and a light emitting device with excellent visibility as a light source for display is manufactured. it can. Furthermore, when the light emitting element emits light in the blue region to the ultraviolet region, high energy light transmitted through the first reflecting member can be shielded, and the environment resistance that does not deteriorate the surrounding light deterioration member is excellent. Light emitting device.
- the light emitting device is mounted with the light emitting element on the mounting portion of the light emitting element storage package of the present invention, and the translucent member is provided so as to cover the light emitting element. Optical characteristics can be obtained.
- a light emitting device is mounted on the second reflective member so as to close the light emitting element storage package of the present invention, the light emitting element mounted on the mounting portion, and the opening of the second reflective member. Since the phosphor layer that converts the wavelength of a part or all of the light having the light emitting element power is provided, deterioration of characteristics of the phosphor layer due to heat generated from the light emitting element can be suppressed. That is, when the phosphor layer is disposed in the opening of the second reflecting member, the phosphor layer is separated from the light emitting element as compared with the case where the phosphor layer is disposed so as to close the inside or the opening of the first reflecting member.
- the heat dissipation path becomes longer, the thermal resistance increases, and the heat path propagating from the light emitting element to the phosphor layer via the first reflecting member is also blocked by the gap. Therefore, heat from the light emitting element to the phosphor layer is difficult to be transmitted.
- an epoxy resin or acrylic resin is used as a transparent member containing the phosphor, the transparent resin is heated. It is possible to suppress yellowing and deterioration of transmittance, and to suppress deterioration of light output due to heat accelerated chemical reactions such as oxidation-reduction reactions of the phosphors filled in the phosphor layer. .
- the light emitting element is a light emitting element that emits light in at least the ultraviolet region to the blue region. Therefore, when the phosphor layer that converts the wavelength of light from the light emitting element contains a phosphor that is excited by the light of the light emitting element to generate fluorescence, at least the ultraviolet region force has a high energy at a short wavelength in the blue region, The light of the light emitting element power can be converted into fluorescence having a longer wavelength and lower energy than the light of the light emitting element, thereby improving the wavelength conversion efficiency of the phosphor and increasing the light output of the light emitting device.
- an illuminating device includes the above-described light-emitting device of the present invention, a drive unit that includes the light-emitting device and includes electrical wiring that drives the light-emitting device, and a light reflecting unit that reflects light emitted from the light-emitting device Therefore, it is possible to provide a lighting device having an arbitrary light distribution and stable optical characteristics with little color unevenness.
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Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/909,592 US8029152B2 (en) | 2005-03-24 | 2006-03-23 | Package for light-emitting device, light-emitting apparatus, and illuminating apparatus |
CN200680009702XA CN101147270B (zh) | 2005-03-24 | 2006-03-23 | 发光装置 |
JP2007509332A JP5065888B2 (ja) | 2005-03-24 | 2006-03-23 | 発光装置ならびに照明装置 |
DE112006000694T DE112006000694B4 (de) | 2005-03-24 | 2006-03-23 | Gehäuse für Lichtemissionsvorrichtung, lichtemittierende Vorrichtung und Beleuchtungsvorrichtung |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2005-085367 | 2005-03-24 | ||
JP2005085367 | 2005-03-24 | ||
JP2005-312710 | 2005-10-27 | ||
JP2005312710 | 2005-10-27 |
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WO2006101174A1 true WO2006101174A1 (ja) | 2006-09-28 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/JP2006/305846 WO2006101174A1 (ja) | 2005-03-24 | 2006-03-23 | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
Country Status (7)
Country | Link |
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US (1) | US8029152B2 (ja) |
JP (2) | JP5065888B2 (ja) |
KR (1) | KR100924474B1 (ja) |
CN (1) | CN101147270B (ja) |
DE (1) | DE112006000694B4 (ja) |
TW (1) | TW200644190A (ja) |
WO (1) | WO2006101174A1 (ja) |
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JP2012528302A (ja) * | 2009-05-26 | 2012-11-12 | インストゥルメント・システムズ・オプティシェ・メステクニーク・ゲーエムベーハー | 校正用光源 |
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Also Published As
Publication number | Publication date |
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CN101147270B (zh) | 2010-05-26 |
JP5065888B2 (ja) | 2012-11-07 |
KR20070117684A (ko) | 2007-12-12 |
TW200644190A (en) | 2006-12-16 |
CN101147270A (zh) | 2008-03-19 |
US8029152B2 (en) | 2011-10-04 |
TWI311803B (ja) | 2009-07-01 |
DE112006000694T5 (de) | 2008-02-07 |
JPWO2006101174A1 (ja) | 2008-09-04 |
US20090296367A1 (en) | 2009-12-03 |
KR100924474B1 (ko) | 2009-11-03 |
JP5437420B2 (ja) | 2014-03-12 |
JP2012114468A (ja) | 2012-06-14 |
DE112006000694B4 (de) | 2013-10-17 |
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