USD989831S1 - Apparatus for evaluating semiconductor substrate - Google Patents
Apparatus for evaluating semiconductor substrate Download PDFInfo
- Publication number
- USD989831S1 USD989831S1 US29/789,677 US202129789677F USD989831S US D989831 S1 USD989831 S1 US D989831S1 US 202129789677 F US202129789677 F US 202129789677F US D989831 S USD989831 S US D989831S
- Authority
- US
- United States
- Prior art keywords
- semiconductor substrate
- evaluating semiconductor
- evaluating
- view
- design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines illustrate portions of the apparatus for evaluating semiconductor substrate that form no part of the claimed design. The hatching shown in FIG. 8 and FIG. 9 represents unclaimed subject matter and forms no part of the claimed design.
Claims (1)
- The ornamental design for an apparatus for evaluating semiconductor substrate, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20210023149 | 2021-05-14 | ||
KR30-2021-0023149 | 2021-05-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD989831S1 true USD989831S1 (en) | 2023-06-20 |
Family
ID=86733343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/789,677 Active USD989831S1 (en) | 2021-05-14 | 2021-10-13 | Apparatus for evaluating semiconductor substrate |
Country Status (1)
Country | Link |
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US (1) | USD989831S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1018613S1 (en) * | 2022-06-30 | 2024-03-19 | Hangzhou Sizone Electronic Technology Inc. | Polishing machine for metal |
Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5281320A (en) * | 1979-12-21 | 1994-01-25 | Varian Associates Inc. | Wafer coating system |
USD350490S (en) * | 1992-10-08 | 1994-09-13 | Tokyo Electron Kabushiki Kaisha | Semiconductor wafer testing apparatus |
USD352911S (en) * | 1992-11-27 | 1994-11-29 | Hitachi, Ltd. | Processing machine for electron beam lithography system |
USD365584S (en) * | 1993-12-15 | 1995-12-26 | Tokyo Electron Kabushiki Kaisha | Semiconductor manufacturing device |
USD415184S (en) * | 1998-01-30 | 1999-10-12 | Tokyo Electron Limited | Apparatus for manufacturing a semiconductor for a liquid crystal display |
USD415776S (en) * | 1998-01-30 | 1999-10-26 | Tokyo Electron Limited | Apparatus for manufacturing a semiconductor for a liquid crystal display |
USD426785S (en) * | 1999-07-09 | 2000-06-20 | Matsushita Electric Industrial Co., Ltd. | Wafer level burn-in tester |
USD427088S (en) * | 1999-07-09 | 2000-06-27 | Matsushita Electric Industrial Co., Ltd. | Wafer level burn-in tester |
USD447967S1 (en) * | 2000-11-08 | 2001-09-18 | Sysmex Corporation | Measuring apparatus for measuring a particle size distribution |
US6454472B1 (en) * | 1999-12-06 | 2002-09-24 | Dns Korea Co., Ltd. | Semiconductor manufacturing apparatus for photolithographic process |
US20020150449A1 (en) * | 1996-03-26 | 2002-10-17 | Semitool, Inc. | Automated semiconductor processing system |
US20030136513A1 (en) * | 2001-01-22 | 2003-07-24 | Lee Soon Ho | Semiconductor manufacturing apparatus |
US6942738B1 (en) * | 1996-07-15 | 2005-09-13 | Semitool, Inc. | Automated semiconductor processing system |
US20060057799A1 (en) * | 2002-09-24 | 2006-03-16 | Tokyo Electron Limited | Substrate processing apparatus |
USD546354S1 (en) * | 2005-07-15 | 2007-07-10 | Hitachi High-Technologies Corporation | Semiconductor manufacturing apparatus |
US20100189880A1 (en) * | 2007-04-10 | 2010-07-29 | Fas Holdings Group, Llc | Method and Apparatus for Extruding a Liquid Onto a Substrate and Inspecting the Same |
USD637098S1 (en) * | 2009-10-30 | 2011-05-03 | Hitachi High-Technologies Corporation | Semiconductor testing machine |
USD657068S1 (en) * | 2010-06-29 | 2012-04-03 | Sysmex Corporation | Specimen analyzer |
USD730894S1 (en) * | 2012-10-18 | 2015-06-02 | Hitachi, Ltd. | Magnetic disc storage unit for electronic computer |
USD733134S1 (en) * | 2013-03-21 | 2015-06-30 | Hitachi, Ltd. | Magnetic disk storage unit for electronic computer |
USD733135S1 (en) * | 2013-03-21 | 2015-06-30 | Hitachi, Ltd. | Magnetic disk storage unit for electronic computer |
USD858590S1 (en) * | 2017-02-28 | 2019-09-03 | Mitsubishi Heavy Industries Machine Tool Co., Ltd. | Machine tool |
USD905139S1 (en) * | 2019-02-13 | 2020-12-15 | Agie Charmilles Sa | Electrical discharge machine |
US20220254665A1 (en) * | 2021-02-05 | 2022-08-11 | Syskey Technology Co., Ltd. | Miniaturized semiconductor manufacturing system |
-
2021
- 2021-10-13 US US29/789,677 patent/USD989831S1/en active Active
Patent Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5281320A (en) * | 1979-12-21 | 1994-01-25 | Varian Associates Inc. | Wafer coating system |
USD350490S (en) * | 1992-10-08 | 1994-09-13 | Tokyo Electron Kabushiki Kaisha | Semiconductor wafer testing apparatus |
USD352911S (en) * | 1992-11-27 | 1994-11-29 | Hitachi, Ltd. | Processing machine for electron beam lithography system |
USD365584S (en) * | 1993-12-15 | 1995-12-26 | Tokyo Electron Kabushiki Kaisha | Semiconductor manufacturing device |
US20020150449A1 (en) * | 1996-03-26 | 2002-10-17 | Semitool, Inc. | Automated semiconductor processing system |
US6942738B1 (en) * | 1996-07-15 | 2005-09-13 | Semitool, Inc. | Automated semiconductor processing system |
USD415184S (en) * | 1998-01-30 | 1999-10-12 | Tokyo Electron Limited | Apparatus for manufacturing a semiconductor for a liquid crystal display |
USD415776S (en) * | 1998-01-30 | 1999-10-26 | Tokyo Electron Limited | Apparatus for manufacturing a semiconductor for a liquid crystal display |
USD426785S (en) * | 1999-07-09 | 2000-06-20 | Matsushita Electric Industrial Co., Ltd. | Wafer level burn-in tester |
USD427088S (en) * | 1999-07-09 | 2000-06-27 | Matsushita Electric Industrial Co., Ltd. | Wafer level burn-in tester |
US6454472B1 (en) * | 1999-12-06 | 2002-09-24 | Dns Korea Co., Ltd. | Semiconductor manufacturing apparatus for photolithographic process |
USD447967S1 (en) * | 2000-11-08 | 2001-09-18 | Sysmex Corporation | Measuring apparatus for measuring a particle size distribution |
US20030136513A1 (en) * | 2001-01-22 | 2003-07-24 | Lee Soon Ho | Semiconductor manufacturing apparatus |
US20060057799A1 (en) * | 2002-09-24 | 2006-03-16 | Tokyo Electron Limited | Substrate processing apparatus |
USD546354S1 (en) * | 2005-07-15 | 2007-07-10 | Hitachi High-Technologies Corporation | Semiconductor manufacturing apparatus |
US20100189880A1 (en) * | 2007-04-10 | 2010-07-29 | Fas Holdings Group, Llc | Method and Apparatus for Extruding a Liquid Onto a Substrate and Inspecting the Same |
USD637098S1 (en) * | 2009-10-30 | 2011-05-03 | Hitachi High-Technologies Corporation | Semiconductor testing machine |
USD657068S1 (en) * | 2010-06-29 | 2012-04-03 | Sysmex Corporation | Specimen analyzer |
USD730894S1 (en) * | 2012-10-18 | 2015-06-02 | Hitachi, Ltd. | Magnetic disc storage unit for electronic computer |
USD733134S1 (en) * | 2013-03-21 | 2015-06-30 | Hitachi, Ltd. | Magnetic disk storage unit for electronic computer |
USD733135S1 (en) * | 2013-03-21 | 2015-06-30 | Hitachi, Ltd. | Magnetic disk storage unit for electronic computer |
USD858590S1 (en) * | 2017-02-28 | 2019-09-03 | Mitsubishi Heavy Industries Machine Tool Co., Ltd. | Machine tool |
USD905139S1 (en) * | 2019-02-13 | 2020-12-15 | Agie Charmilles Sa | Electrical discharge machine |
US20220254665A1 (en) * | 2021-02-05 | 2022-08-11 | Syskey Technology Co., Ltd. | Miniaturized semiconductor manufacturing system |
Non-Patent Citations (4)
Title |
---|
U.S. Appl. No. 29/789,674, filed Oct. 13, 2021. |
U.S. Appl. No. 29/789,675, filed Oct. 13, 2021. |
United States Notice of Allowance issued in U.S. Appl. No. 29/789,674 dated Mar. 8, 2023 (nine (9) pages). |
United States Notice of Allowance issued in U.S. Appl. No. 29/789,675 dated Mar. 8, 2023 (nine (9) pages). |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1018613S1 (en) * | 2022-06-30 | 2024-03-19 | Hangzhou Sizone Electronic Technology Inc. | Polishing machine for metal |
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