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USD851613S1 - Target profile for a physical vapor deposition chamber target - Google Patents

Target profile for a physical vapor deposition chamber target Download PDF

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Publication number
USD851613S1
USD851613S1 US29/621,221 US201729621221F USD851613S US D851613 S1 USD851613 S1 US D851613S1 US 201729621221 F US201729621221 F US 201729621221F US D851613 S USD851613 S US D851613S
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United States
Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
profile
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US29/621,221
Inventor
William Johanson
Kirankumar Savandaiah
Anthony Chih-Tang Chan
Siew Kit Hoi
Prashant Prabhakar Prabhu
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Applied Materials Inc
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Applied Materials Inc
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Priority to US29/621,221 priority Critical patent/USD851613S1/en
Assigned to APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. reassignment APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HOI, SIEW KIT
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHAN, ANTHONY CHIH-TANG, JOHANSON, WILLIAM, PRABHU, PRASHANT PRABHAKAR, SAVANDAIAH, KIRANKUMAR
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Priority to US29/690,617 priority patent/USD894137S1/en
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Publication of USD851613S1 publication Critical patent/USD851613S1/en
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FIG. 1 is a top perspective view of a target profile for a physical vapor deposition chamber target, showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a front elevational view thereof;
FIG. 8 is a back elevational view thereof; and,
FIG. 9 is an enlarged cross sectional view taken along line 9-9 in FIG. 4.
The dashed lines of the cut line showing the plane upon which FIG. 9 is taken in FIG. 4 forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a target profile for a physical vapor deposition chamber target, as shown and described.
US29/621,221 2017-10-05 2017-10-05 Target profile for a physical vapor deposition chamber target Active USD851613S1 (en)

Priority Applications (2)

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US29/621,221 USD851613S1 (en) 2017-10-05 2017-10-05 Target profile for a physical vapor deposition chamber target
US29/690,617 USD894137S1 (en) 2017-10-05 2019-05-09 Target profile for a physical vapor deposition chamber target

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US29/621,221 USD851613S1 (en) 2017-10-05 2017-10-05 Target profile for a physical vapor deposition chamber target

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US29/690,617 Division USD894137S1 (en) 2017-10-05 2019-05-09 Target profile for a physical vapor deposition chamber target

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Publication number Priority date Publication date Assignee Title
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD894137S1 (en) * 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD917003S1 (en) * 2018-06-06 2021-04-20 JMA Outdoors, Inc. Simulating target
USD931372S1 (en) * 2020-12-15 2021-09-21 Shenzhen Lingtuowan Technology Co., Ltd. Target toy set
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US11415396B2 (en) 2017-11-06 2022-08-16 JMA Outdoors, Inc. Apparatus for generating a vitals target
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1010415S1 (en) * 2021-10-27 2024-01-09 Mirka Ltd Backing pad for sander
USD1029602S1 (en) * 2022-01-04 2024-06-04 Noritake Co., Limited Polishing pad dresser
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1655453S (en) * 2019-06-17 2020-03-23
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication

Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD411516S (en) * 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US6659850B2 (en) 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US20040149567A1 (en) 2002-12-16 2004-08-05 Alexander Kosyachkov Composite sputter target and phosphor deposition method
US20050152089A1 (en) 2003-12-26 2005-07-14 Ngk Insulators, Ltd. Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same
US20050193952A1 (en) 2004-02-13 2005-09-08 Goodman Matt G. Substrate support system for reduced autodoping and backside deposition
US20070076345A1 (en) * 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
TWD146490S (en) 2011-01-12 2012-04-21 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
USD691974S1 (en) 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
US20140261180A1 (en) 2013-03-15 2014-09-18 Applied Materials, Inc. Pvd target for self-centering process shield
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD732145S1 (en) * 2014-02-04 2015-06-16 Asm Ip Holding B.V. Shower plate
US20150170888A1 (en) 2013-12-18 2015-06-18 Applied Materials, Inc. Physical vapor deposition (pvd) target having low friction pads
USD733843S1 (en) * 2014-02-04 2015-07-07 ASM IP Holding, B.V. Shower plate
USD741823S1 (en) 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
US20160002776A1 (en) 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapor deposition device
US20160002788A1 (en) 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapour deposition device
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD790041S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Gas dispersing plate for semiconductor manufacturing apparatus
USD793572S1 (en) * 2015-06-10 2017-08-01 Tokyo Electron Limited Electrode plate for plasma processing apparatus
USD795208S1 (en) 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD798248S1 (en) 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
CN206573738U (en) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 Low loss fiber
USD801942S1 (en) 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD836572S1 (en) 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD351450S (en) 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD376744S (en) 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
USD381030S (en) 1995-11-21 1997-07-15 Avi Tepman Sputtering target
US6114216A (en) 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
USD423026S (en) 1997-08-20 2000-04-18 Tokyo Electron Limited Quartz cover
US6086725A (en) 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
JP3551867B2 (en) 1999-11-09 2004-08-11 信越化学工業株式会社 Silicon focus ring and manufacturing method thereof
USD446231S1 (en) 2000-08-21 2001-08-07 Komatsu Industries Corporation Nozzle for a plasma arc torch
USD487254S1 (en) 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
USD496951S1 (en) 2003-01-30 2004-10-05 Thermal Dynamics Corporation Mechanized cap for a plasma arc torch
USD503729S1 (en) 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD559066S1 (en) 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
USD571383S1 (en) 2005-07-29 2008-06-17 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571833S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of plasma processing apparatus
TWD125340S1 (en) 2005-07-29 2008-10-11 東京威力科創股份有限公司 Top panel for microwave introduction window of plasma processing apparatus
USD571831S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD545853S1 (en) 2006-03-30 2007-07-03 Dave Hawley Plasma gun nozzle retention ring
USD570310S1 (en) 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
USD582949S1 (en) 2006-12-15 2008-12-16 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20080173541A1 (en) 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
USD600660S1 (en) 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
WO2009154853A2 (en) 2008-04-16 2009-12-23 Applied Materials, Inc. Wafer processing deposition shielding components
WO2009151767A2 (en) 2008-04-21 2009-12-17 Honeywell International Inc. Design and use of dc magnetron sputtering systems
US8371904B2 (en) 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
US8070925B2 (en) 2008-10-17 2011-12-06 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target
USD616389S1 (en) 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
US8133368B2 (en) 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
TWI397600B (en) 2009-01-07 2013-06-01 Solar Applied Mat Tech Corp Recycled sputtering target and its making method
JP6195519B2 (en) 2010-08-06 2017-09-13 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Electrostatic chuck and method of using the same
USD678745S1 (en) 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
JP1438319S (en) 2011-09-20 2015-04-06
USD669509S1 (en) 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
USD683806S1 (en) 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
KR20130131120A (en) 2012-05-23 2013-12-03 삼성전자주식회사 A flexible membrane for polishing head
JP5875950B2 (en) 2012-06-29 2016-03-02 株式会社荏原製作所 Substrate holding device and polishing device
USD732094S1 (en) 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US9475996B2 (en) * 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
WO2014107558A1 (en) 2013-01-04 2014-07-10 Tosoh Smd, Inc. Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD741921S1 (en) 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
WO2016018505A1 (en) 2014-07-29 2016-02-04 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en) 2014-12-02 2016-03-01 John K. Kremer Laser target
USD830434S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD813181S1 (en) 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD839224S1 (en) 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD851613S1 (en) * 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD846514S1 (en) 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus

Patent Citations (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD411516S (en) * 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US6659850B2 (en) 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US20040149567A1 (en) 2002-12-16 2004-08-05 Alexander Kosyachkov Composite sputter target and phosphor deposition method
US20050152089A1 (en) 2003-12-26 2005-07-14 Ngk Insulators, Ltd. Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same
US20050193952A1 (en) 2004-02-13 2005-09-08 Goodman Matt G. Substrate support system for reduced autodoping and backside deposition
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070076345A1 (en) * 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD146490S (en) 2011-01-12 2012-04-21 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
USD691974S1 (en) 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
US20160002776A1 (en) 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapor deposition device
US20160002788A1 (en) 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapour deposition device
US20140261180A1 (en) 2013-03-15 2014-09-18 Applied Materials, Inc. Pvd target for self-centering process shield
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD741823S1 (en) 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US20150170888A1 (en) 2013-12-18 2015-06-18 Applied Materials, Inc. Physical vapor deposition (pvd) target having low friction pads
USD733843S1 (en) * 2014-02-04 2015-07-07 ASM IP Holding, B.V. Shower plate
USD732145S1 (en) * 2014-02-04 2015-06-16 Asm Ip Holding B.V. Shower plate
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD801942S1 (en) 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825504S1 (en) * 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD793572S1 (en) * 2015-06-10 2017-08-01 Tokyo Electron Limited Electrode plate for plasma processing apparatus
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD825505S1 (en) * 2015-06-18 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD798248S1 (en) 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD795208S1 (en) 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD790041S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Gas dispersing plate for semiconductor manufacturing apparatus
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD836572S1 (en) 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
CN206573738U (en) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 Low loss fiber

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Search Report for Taiwan Design Application No. 106301373 dated Jun. 20, 2017.
Search Report for Taiwan Design Application No. 107305358 dated Feb. 21, 2019.

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USD894137S1 (en) * 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US11415396B2 (en) 2017-11-06 2022-08-16 JMA Outdoors, Inc. Apparatus for generating a vitals target
US11867484B2 (en) 2017-11-06 2024-01-09 JMA Outdoors, Inc. Apparatus for generating a vitals target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD917003S1 (en) * 2018-06-06 2021-04-20 JMA Outdoors, Inc. Simulating target
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD931372S1 (en) * 2020-12-15 2021-09-21 Shenzhen Lingtuowan Technology Co., Ltd. Target toy set
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1010415S1 (en) * 2021-10-27 2024-01-09 Mirka Ltd Backing pad for sander
USD1029602S1 (en) * 2022-01-04 2024-06-04 Noritake Co., Limited Polishing pad dresser
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate

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