USD851613S1 - Target profile for a physical vapor deposition chamber target - Google Patents
Target profile for a physical vapor deposition chamber target Download PDFInfo
- Publication number
- USD851613S1 USD851613S1 US29/621,221 US201729621221F USD851613S US D851613 S1 USD851613 S1 US D851613S1 US 201729621221 F US201729621221 F US 201729621221F US D851613 S USD851613 S US D851613S
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- US
- United States
- Prior art keywords
- target
- vapor deposition
- physical vapor
- deposition chamber
- profile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The dashed lines of the cut line showing the plane upon which FIG. 9 is taken in FIG. 4 forms no part of the claimed design.
Claims (1)
- The ornamental design for a target profile for a physical vapor deposition chamber target, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/621,221 USD851613S1 (en) | 2017-10-05 | 2017-10-05 | Target profile for a physical vapor deposition chamber target |
US29/690,617 USD894137S1 (en) | 2017-10-05 | 2019-05-09 | Target profile for a physical vapor deposition chamber target |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/621,221 USD851613S1 (en) | 2017-10-05 | 2017-10-05 | Target profile for a physical vapor deposition chamber target |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US29/690,617 Division USD894137S1 (en) | 2017-10-05 | 2019-05-09 | Target profile for a physical vapor deposition chamber target |
Publications (1)
Publication Number | Publication Date |
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USD851613S1 true USD851613S1 (en) | 2019-06-18 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/621,221 Active USD851613S1 (en) | 2017-10-05 | 2017-10-05 | Target profile for a physical vapor deposition chamber target |
US29/690,617 Active USD894137S1 (en) | 2017-10-05 | 2019-05-09 | Target profile for a physical vapor deposition chamber target |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US29/690,617 Active USD894137S1 (en) | 2017-10-05 | 2019-05-09 | Target profile for a physical vapor deposition chamber target |
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US (2) | USD851613S1 (en) |
Cited By (17)
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USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
USD894137S1 (en) * | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD902165S1 (en) | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD917003S1 (en) * | 2018-06-06 | 2021-04-20 | JMA Outdoors, Inc. | Simulating target |
USD931372S1 (en) * | 2020-12-15 | 2021-09-21 | Shenzhen Lingtuowan Technology Co., Ltd. | Target toy set |
USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US11415396B2 (en) | 2017-11-06 | 2022-08-16 | JMA Outdoors, Inc. | Apparatus for generating a vitals target |
US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1010415S1 (en) * | 2021-10-27 | 2024-01-09 | Mirka Ltd | Backing pad for sander |
USD1029602S1 (en) * | 2022-01-04 | 2024-06-04 | Noritake Co., Limited | Polishing pad dresser |
USD1037778S1 (en) * | 2022-07-19 | 2024-08-06 | Applied Materials, Inc. | Gas distribution plate |
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Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD363464S (en) * | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
USD411516S (en) * | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
US6659850B2 (en) | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US20040149567A1 (en) | 2002-12-16 | 2004-08-05 | Alexander Kosyachkov | Composite sputter target and phosphor deposition method |
US20050152089A1 (en) | 2003-12-26 | 2005-07-14 | Ngk Insulators, Ltd. | Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same |
US20050193952A1 (en) | 2004-02-13 | 2005-09-08 | Goodman Matt G. | Substrate support system for reduced autodoping and backside deposition |
US20070076345A1 (en) * | 2005-09-20 | 2007-04-05 | Bang Won B | Substrate placement determination using substrate backside pressure measurement |
USD557226S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD559993S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD614593S1 (en) | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
USD616390S1 (en) | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Quartz cover for manufacturing semiconductor wafers |
USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD649126S1 (en) | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
TWD146490S (en) | 2011-01-12 | 2012-04-21 | 荏原製作所股份有限公司 | Elastic film for semiconductor wafer polishing |
USD691974S1 (en) | 2011-12-22 | 2013-10-22 | Tokyo Electron Limited | Holding pad for transferring a wafer |
US20140261180A1 (en) | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Pvd target for self-centering process shield |
USD716742S1 (en) | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD724553S1 (en) | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD732145S1 (en) * | 2014-02-04 | 2015-06-16 | Asm Ip Holding B.V. | Shower plate |
US20150170888A1 (en) | 2013-12-18 | 2015-06-18 | Applied Materials, Inc. | Physical vapor deposition (pvd) target having low friction pads |
USD733843S1 (en) * | 2014-02-04 | 2015-07-07 | ASM IP Holding, B.V. | Shower plate |
USD741823S1 (en) | 2013-07-10 | 2015-10-27 | Hitachi Kokusai Electric Inc. | Vaporizer for substrate processing apparatus |
US20160002776A1 (en) | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapor deposition device |
US20160002788A1 (en) | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapour deposition device |
USD767234S1 (en) | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
USD769200S1 (en) | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD790041S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Gas dispersing plate for semiconductor manufacturing apparatus |
USD793572S1 (en) * | 2015-06-10 | 2017-08-01 | Tokyo Electron Limited | Electrode plate for plasma processing apparatus |
USD795208S1 (en) | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD797067S1 (en) | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD797691S1 (en) | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
USD798248S1 (en) | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
CN206573738U (en) | 2017-03-16 | 2017-10-20 | 江苏亨通光导新材料有限公司 | Low loss fiber |
USD801942S1 (en) | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD810705S1 (en) | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD836572S1 (en) | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Family Cites Families (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5320728A (en) | 1990-03-30 | 1994-06-14 | Applied Materials, Inc. | Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity |
USD351450S (en) | 1993-05-19 | 1994-10-11 | Riteflite Pty. Limited | Target for shooting |
USD376744S (en) | 1994-08-03 | 1996-12-24 | Gerd Eisenblatter Gmbh | Support plate |
USD381030S (en) | 1995-11-21 | 1997-07-15 | Avi Tepman | Sputtering target |
US6114216A (en) | 1996-11-13 | 2000-09-05 | Applied Materials, Inc. | Methods for shallow trench isolation |
USD423026S (en) | 1997-08-20 | 2000-04-18 | Tokyo Electron Limited | Quartz cover |
US6086725A (en) | 1998-04-02 | 2000-07-11 | Applied Materials, Inc. | Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life |
JP3551867B2 (en) | 1999-11-09 | 2004-08-11 | 信越化学工業株式会社 | Silicon focus ring and manufacturing method thereof |
USD446231S1 (en) | 2000-08-21 | 2001-08-07 | Komatsu Industries Corporation | Nozzle for a plasma arc torch |
USD487254S1 (en) | 2002-05-24 | 2004-03-02 | Nichia Corporation | Light emitting diode |
USD496951S1 (en) | 2003-01-30 | 2004-10-05 | Thermal Dynamics Corporation | Mechanized cap for a plasma arc torch |
USD503729S1 (en) | 2003-10-31 | 2005-04-05 | Nordson Corporation | Nozzle for dispensing adhesives and sealants |
USD553104S1 (en) | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
USD559066S1 (en) | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad |
USD571383S1 (en) | 2005-07-29 | 2008-06-17 | Tokyo Electron Limited | Top panel for microwave introduction window of a plasma processing apparatus |
USD571833S1 (en) | 2005-07-29 | 2008-06-24 | Tokyo Electron Limited | Top panel for microwave introduction window of plasma processing apparatus |
TWD125340S1 (en) | 2005-07-29 | 2008-10-11 | 東京威力科創股份有限公司 | Top panel for microwave introduction window of plasma processing apparatus |
USD571831S1 (en) | 2005-07-29 | 2008-06-24 | Tokyo Electron Limited | Top panel for microwave introduction window of a plasma processing apparatus |
USD545853S1 (en) | 2006-03-30 | 2007-07-03 | Dave Hawley | Plasma gun nozzle retention ring |
USD570310S1 (en) | 2006-08-01 | 2008-06-03 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
US7402098B2 (en) | 2006-10-27 | 2008-07-22 | Novellus Systems, Inc. | Carrier head for workpiece planarization/polishing |
USD582949S1 (en) | 2006-12-15 | 2008-12-16 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
US20080173541A1 (en) | 2007-01-22 | 2008-07-24 | Eal Lee | Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling |
US8968536B2 (en) | 2007-06-18 | 2015-03-03 | Applied Materials, Inc. | Sputtering target having increased life and sputtering uniformity |
USD600660S1 (en) | 2008-03-28 | 2009-09-22 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
WO2009154853A2 (en) | 2008-04-16 | 2009-12-23 | Applied Materials, Inc. | Wafer processing deposition shielding components |
WO2009151767A2 (en) | 2008-04-21 | 2009-12-17 | Honeywell International Inc. | Design and use of dc magnetron sputtering systems |
US8371904B2 (en) | 2008-08-08 | 2013-02-12 | Globalfoundries Singapore Pte. Ltd. | Polishing with enhanced uniformity |
US8070925B2 (en) | 2008-10-17 | 2011-12-06 | Applied Materials, Inc. | Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target |
USD616389S1 (en) | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
US8133368B2 (en) | 2008-10-31 | 2012-03-13 | Applied Materials, Inc. | Encapsulated sputtering target |
TWI397600B (en) | 2009-01-07 | 2013-06-01 | Solar Applied Mat Tech Corp | Recycled sputtering target and its making method |
JP6195519B2 (en) | 2010-08-06 | 2017-09-13 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Electrostatic chuck and method of using the same |
USD678745S1 (en) | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
JP1438319S (en) | 2011-09-20 | 2015-04-06 | ||
USD669509S1 (en) | 2011-10-19 | 2012-10-23 | Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts | Nozzle for torch |
USD683806S1 (en) | 2012-01-12 | 2013-06-04 | Surefire, Llc | Front plate for a firearm sound suppressor |
USD687790S1 (en) | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Keyed wafer carrier |
USD687791S1 (en) | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Multi-keyed wafer carrier |
KR20130131120A (en) | 2012-05-23 | 2013-12-03 | 삼성전자주식회사 | A flexible membrane for polishing head |
JP5875950B2 (en) | 2012-06-29 | 2016-03-02 | 株式会社荏原製作所 | Substrate holding device and polishing device |
USD732094S1 (en) | 2012-07-20 | 2015-06-16 | Ivoclar Vivadent Ag | Firing plate for a dental furnace |
US9475996B2 (en) * | 2012-10-17 | 2016-10-25 | Richard Max Mandle | Centrifugal fluid ring plasma reactor |
USD703162S1 (en) | 2012-10-17 | 2014-04-22 | Sumitomo Electric Industries, Ltd. | Wafer holder for stepper |
WO2014107558A1 (en) | 2013-01-04 | 2014-07-10 | Tosoh Smd, Inc. | Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same |
USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD741921S1 (en) | 2014-04-15 | 2015-10-27 | Q-Linea Ab | Positive mold for manufacturing a sample holding disc |
WO2016018505A1 (en) | 2014-07-29 | 2016-02-04 | Applied Materials, Inc. | Magnetron assembly for physical vapor deposition chamber |
USD750728S1 (en) | 2014-12-02 | 2016-03-01 | John K. Kremer | Laser target |
USD830434S1 (en) | 2015-12-28 | 2018-10-09 | Ntn Corporation | Inner ring for tapered roller bearing |
USD813181S1 (en) | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
USD839224S1 (en) | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD830981S1 (en) | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD851613S1 (en) * | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) * | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD846514S1 (en) | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
-
2017
- 2017-10-05 US US29/621,221 patent/USD851613S1/en active Active
-
2019
- 2019-05-09 US US29/690,617 patent/USD894137S1/en active Active
Patent Citations (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD363464S (en) * | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
USD411516S (en) * | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
US6659850B2 (en) | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US20040149567A1 (en) | 2002-12-16 | 2004-08-05 | Alexander Kosyachkov | Composite sputter target and phosphor deposition method |
US20050152089A1 (en) | 2003-12-26 | 2005-07-14 | Ngk Insulators, Ltd. | Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same |
US20050193952A1 (en) | 2004-02-13 | 2005-09-08 | Goodman Matt G. | Substrate support system for reduced autodoping and backside deposition |
USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD559993S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD557226S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
US20070076345A1 (en) * | 2005-09-20 | 2007-04-05 | Bang Won B | Substrate placement determination using substrate backside pressure measurement |
USD614593S1 (en) | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
USD649126S1 (en) | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
USD616390S1 (en) | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Quartz cover for manufacturing semiconductor wafers |
USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
TWD146490S (en) | 2011-01-12 | 2012-04-21 | 荏原製作所股份有限公司 | Elastic film for semiconductor wafer polishing |
USD691974S1 (en) | 2011-12-22 | 2013-10-22 | Tokyo Electron Limited | Holding pad for transferring a wafer |
US20160002776A1 (en) | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapor deposition device |
US20160002788A1 (en) | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapour deposition device |
US20140261180A1 (en) | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Pvd target for self-centering process shield |
USD769200S1 (en) | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD741823S1 (en) | 2013-07-10 | 2015-10-27 | Hitachi Kokusai Electric Inc. | Vaporizer for substrate processing apparatus |
USD716742S1 (en) | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD724553S1 (en) | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
US20150170888A1 (en) | 2013-12-18 | 2015-06-18 | Applied Materials, Inc. | Physical vapor deposition (pvd) target having low friction pads |
USD733843S1 (en) * | 2014-02-04 | 2015-07-07 | ASM IP Holding, B.V. | Shower plate |
USD732145S1 (en) * | 2014-02-04 | 2015-06-16 | Asm Ip Holding B.V. | Shower plate |
USD767234S1 (en) | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
USD801942S1 (en) | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD797067S1 (en) | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD825504S1 (en) * | 2015-04-21 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD793572S1 (en) * | 2015-06-10 | 2017-08-01 | Tokyo Electron Limited | Electrode plate for plasma processing apparatus |
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD825505S1 (en) * | 2015-06-18 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD798248S1 (en) | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD795208S1 (en) | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD790041S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Gas dispersing plate for semiconductor manufacturing apparatus |
USD810705S1 (en) | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD797691S1 (en) | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
USD836572S1 (en) | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
CN206573738U (en) | 2017-03-16 | 2017-10-20 | 江苏亨通光导新材料有限公司 | Low loss fiber |
Non-Patent Citations (2)
Title |
---|
Search Report for Taiwan Design Application No. 106301373 dated Jun. 20, 2017. |
Search Report for Taiwan Design Application No. 107305358 dated Feb. 21, 2019. |
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US11415396B2 (en) | 2017-11-06 | 2022-08-16 | JMA Outdoors, Inc. | Apparatus for generating a vitals target |
US11867484B2 (en) | 2017-11-06 | 2024-01-09 | JMA Outdoors, Inc. | Apparatus for generating a vitals target |
USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD946638S1 (en) | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD902165S1 (en) | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD917003S1 (en) * | 2018-06-06 | 2021-04-20 | JMA Outdoors, Inc. | Simulating target |
USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD970566S1 (en) | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
USD966357S1 (en) | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD931372S1 (en) * | 2020-12-15 | 2021-09-21 | Shenzhen Lingtuowan Technology Co., Ltd. | Target toy set |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1010415S1 (en) * | 2021-10-27 | 2024-01-09 | Mirka Ltd | Backing pad for sander |
USD1029602S1 (en) * | 2022-01-04 | 2024-06-04 | Noritake Co., Limited | Polishing pad dresser |
USD1037778S1 (en) * | 2022-07-19 | 2024-08-06 | Applied Materials, Inc. | Gas distribution plate |
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USD851613S1 (en) | Target profile for a physical vapor deposition chamber target | |
USD868124S1 (en) | Target profile for a physical vapor deposition chamber target | |
USD869409S1 (en) | Target profile for a physical vapor deposition chamber target | |
USD877101S1 (en) | Target profile for a physical vapor deposition chamber target | |
USD825505S1 (en) | Target profile for a physical vapor deposition chamber target | |
USD837755S1 (en) | Target profile for a physical vapor deposition chamber target | |
USD825504S1 (en) | Target profile for a physical vapor deposition chamber target | |
USD888903S1 (en) | Deposition ring for physical vapor deposition chamber | |
USD911194S1 (en) | Spectrometer | |
USD792189S1 (en) | Oven knob | |
USD833223S1 (en) | Server | |
USD801468S1 (en) | Firearm sight | |
USD858468S1 (en) | Collimator for a physical vapor deposition chamber | |
USD859333S1 (en) | Collimator for a physical vapor deposition chamber | |
USD867662S1 (en) | Beard trimmer | |
USD794103S1 (en) | Cutting insert | |
USD784787S1 (en) | Three-arm knob | |
USD820631S1 (en) | Cooker | |
USD843747S1 (en) | Armchair | |
USD883573S1 (en) | Beard trimmer | |
USD810527S1 (en) | Spade | |
USD802857S1 (en) | Dishwasher | |
USD776114S1 (en) | Keyboard | |
USD803836S1 (en) | Keyboard | |
USD991462S1 (en) | Vacuum pump |
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