TWM450049U - Semiconductor package heat carrying device having extended communication channel structure - Google Patents

Description

Semiconductor package heat carrying device with extended connecting channel structure

The present invention relates to the design of a heat carrying device for use in a semiconductor wafer packaging process, and more particularly to a semiconductor package heat carrying device having an extended communicating channel structure.

In a conventional semiconductor chip packaging process, a wafer of a suitable size must be first cut from a wafer and then adhered to a carrier (the carrier can be a substrate or can be a lead frame and the like can be used for carrying a wafer) Contact the carrier for external electronic signals). During the process of adhesion, many bubbles are generated in the adhesive material, which causes a cavity in the adhesive material after aging, which affects the reliability and quality of the product.

The traditional method utilizes the short-term high temperature and high pressure conditions in the molding process of the molding colloid to discharge the rubber layer bubbles of the adhesive material. Or by means of vacuum, the bubbles are excluded from the glue layer of the glue material. Or by adjusting the process parameters and the tool of the upper wafer machine to achieve no bubble between the wafer and the bonding material interface.

For example, the Republic of China Announcement No. 257314 discloses an industrial constant temperature pressure cooker device characterized in that an electric heating device fixed by a plurality of fixed columns is provided on the closed end of the pressure cooker for supplying heat energy in the pot; the central part of the electric heating device The fan is provided with a stirring device, and the driving shaft of the fan is coupled to the bearing housing of the outer edge of the pan, and is extended outside the body to be connected with the driving motor by a belt.

Driving the motor in the center of the electric heating device by the driving motor outside the pot to stir the heated high-pressure gas in the pot body to reach the high pressure in the pot body The gas temperature accuracy is within 3 °C. This industrial constant temperature pressure cooker device is a device for removing air bubbles during semiconductor chip packaging.

However, in the prior art, in order to make the heating effect uniform, a turbo fan is arranged in the pot body, and a driving shaft is coupled to the pot body, and a shaft sealing unit is coupled to the piercing portion for effectively blocking the pot body. The problem of high pressure difference between inside and outside.

The shaft sealing unit is exposed to the high temperature and high pressure environment inside the pot body at the same time, and at the same time contacts the environment of normal temperature and normal pressure outside, and the shaft sealing unit is easily damaged in the state of being subjected to a great temperature difference and a pressure difference for a long time. The problem needs to be updated in a short time. Such problems can cause disadvantages such as high cost of components, frequent manpower replacement, and reduced capacity due to downtime.

Accordingly, the main purpose of the present invention is to provide a semiconductor package heat carrying device having an extended communication channel structure, which is designed to avoid the use of the shaft seal by using the drive motor, so that there is no such disadvantage.

Another object of the present invention is to provide a heat carrying device that can be applied to uniform heating during semiconductor package processing. By connecting a pressurization control assembly, the heat carrying device can maintain a predetermined pressure and is installed in the heat carrying device. A turbo fan rotates and drives the turbo fan to rotate by the motor to flow the high temperature gas in the heat carrying device, so that the semiconductor material placed on the heat carrying device can be uniformly heated.

The technical means used in the present invention to solve the problems of the prior art is mainly in the design of a semiconductor package heat carrying device having an extended communication channel structure, the extended connecting channel junction end of the cavity is combined with a predetermined extension length and The reduced diameter is provided for the passage of the drive shaft through the extended communication passage.

At least one bearing unit for supporting the drive shaft is disposed in the extended communication passage, and a motor bearing chamber for accommodating the drive motor is coupled to the extended communication passage, and the motor receiving chamber is extended from the communication passage The chamber maintains an isostatic chamber pressure to place the drive motor in an equal pressure environment and avoids the use of a shaft seal unit.

Through the technical means adopted by the creation, the shaft sealing unit of the prior art can be prevented from being subjected to frequent replacement of components and manpower waste due to the high pressure and high temperature in the pot body for a long time, and the production capacity due to the shutdown can be avoided.

In addition, a cooling device is disposed on the annular surface outside the extended communication channel, so that the motor receiving chamber forms a temperature difference with the cavity to increase the working life of the motor.

Furthermore, the extended communication channel is coupled to the cavity by at least one flange unit and at least one fixing component, and the motor bearing cavity is coupled to the extended communication channel by at least one fixing component to enable the motor and the turbine The fan is easy to disassemble, reducing the working time and labor cost of the maintenance and replacement of the drive motor and turbofan.

The specific embodiments of the present invention will be further described by the following examples and accompanying drawings.

Referring to FIG. 1 and FIG. 2, FIG. 1 is a partially exploded perspective view showing the first embodiment of the present creation, and FIG. 2 is a schematic view showing the combination of the first embodiment of the present creation. As shown in the figure, the heat carrying device 100 of the present invention comprises a cavity 1, a door body 2, an extended communication channel 3 and a motor receiving chamber 4. The door body 2 is movably coupled to the front end of the cavity 1.

An accommodating space 10 is defined in the cavity 1 and an extended connecting channel connecting end 15 is defined. The accommodating space 10 is provided with a supporting frame 11 and at least one heating device 12. The tray 11 can be placed with a target to be heated, and the object to be heated can be a semiconductor wafer.

The heating device 12 includes a heating socket 121 and a heating tube 122. The heating socket 121 is located at a predetermined position in the accommodating space 10, and the heating tube 122 is disposed outside the heating socket 121 and has a receiving position. The heating in the space 10 acts to heat the accommodating space 10 and a predetermined heating rate.

In addition, a turbo fan 43 is disposed in the accommodating space 10 of the cavity 1, and a drive motor 41 is coupled via a drive shaft 42 extending from the cavity connecting end 15 of the protruding cavity 1. The turbo fan 43 is located inside the heating socket 121, and drives the turbo fan 43 to rotate through the drive motor 41 to flow the gas in the accommodation space 10 of the cavity 1.

The extended connecting passage coupling end 15 of the cavity 1 is combined with an extended connecting passage 3 having a predetermined extension length and a reduced diameter for receiving the transmission shaft 42, and at least one of the extending communication passages 3 is provided for supporting the transmission. The bearing unit 45 of the shaft 42 and the extended communication channel 3 are combined with a motor receiving chamber 4 for accommodating the driving motor 41. The motor receiving chamber 4 is formed with a motor housing. Space 40.

The extending communication channel 3 is coupled to the extended communication channel coupling end 15 of the cavity 1 by at least one flange unit 8 and at least one fixing element 9, and the motor receiving cavity 4 is supported by at least one fixing element 9a. The connection is extended to the communication channel 3.

The motor receiving chamber 4 maintains the communication space 10 of the cavity 1 , the accommodating space 30 extending the communication channel 3 , and the motor accommodating space 40 of the motor receiving chamber 4 via the extending communication channel 3 . And maintaining an equal pressure chamber pressure with the cavity 1. And outside the extended communication channel 3, the annular surface 31 is provided with a cooling device 32 for forming a temperature difference between the motor receiving chamber 4 and the cavity 1.

The drive motor 41 is coupled with a pair of wires 411 extending outside the motor receiving chamber 4 to connect a power source and provide the electrical energy required to drive the motor 41. A copper tube 412 is disposed around the outside of the drive motor 41 to cool the temperature of the drive motor 41 via a water supply source.

In addition, the accommodating space 10 of the cavity 1 is provided with a gate 44 adjacent to the extending communication channel 3 to block the influence of the high hot gas flow on the driving motor 41 when the accommodating space 10 of the cavity 1 is heated.

Referring to Figure 3, there is shown a schematic diagram of the operation of the first embodiment of the present creation. As shown in the figure, the accommodating space 10 inside the cavity 1 is further provided with a temperature sensing unit 13 and a pressure sensing unit 14, and is respectively connected to a controller 5.

The temperature sensing unit 13 can sense the temperature of the accommodating space 10 and send a temperature sensing signal S1 to the controller 5. The controller 5 can drive the heating device 12 through a heating driving signal S2, and according to the temperature sensing signal S1 The heat receiving space 10 reaches a predetermined temperature and a predetermined heating rate.

The pressure sensing unit 14 can sense the chamber pressure P1 of the cavity 1 and send a pressure sensing signal S3 to the controller 5. The accommodating space 10 of the cavity 1 is connected to a pressurization control unit 6 via a pressure inlet line 61. The pressurization control unit 6 is further connected to a pressure source 62 to input the pressure generated by the pressure source 62 to the chamber 1. In the accommodating space 10, the cavity 1 is maintained at a predetermined chamber pressure P1.

The pressure source 62 connected to the pressurization control unit 6 may be an external factory line 621 or an air compressor 622 integrated in the heat carrying device 100. The pressure feed line 61 is actuated to pressurize the drive signal S4 via one of the controllers 5 to drive the pressurization control assembly 6 and to maintain the chamber 1 at a predetermined chamber pressure P1 based on the pressure sensing signal S3.

The motor receiving chamber 4 maintains the communication space 10 of the cavity 1 , the accommodating space 30 extending the communication channel 3 , and the motor accommodating space 40 of the motor receiving chamber 4 via the extending communication channel 3 . The chamber pressure P2 of the motor receiving chamber 4 is maintained at an equal pressure chamber pressure (i.e., P2 = P1) with the chamber pressure P1 of the chamber 1.

In the first embodiment of the present invention, the chamber pressure P1 of the chamber 1 is maintained at more than 2 atmospheres, so the chamber pressure P2 of the motor receiving chamber 4 is also maintained at an equal pressure chamber pressure greater than 2 atmospheres. . The temperature of the accommodating space 10 of the cavity 1 is between 25 degrees Celsius and 1000 degrees Celsius, and the temperature of the motor receiving chamber 4 is between 25 degrees Celsius due to the extension of the communication channel 3 and the cooling device 32. Between 500 degrees and a temperature difference with the cavity 1.

In addition, the motor accommodating space 40 of the motor receiving chamber 4 further includes a motor temperature sensing unit 16 for sensing the temperature of the motor accommodating space 40. And sending a motor temperature sensing signal S5 to the controller 5 for the user to monitor the temperature of the driving motor 41 at any time.

The controller 5 is further connected with a control panel 7 for manually setting the predetermined temperature, the heating rate and the pressure to be reached in the accommodating space 10, so that the object to be heated is in a predetermined high temperature and high pressure environment, and is uniformly heated.

Please refer to FIG. 4 and FIG. 5, wherein FIG. 4 is a partial exploded view showing the second embodiment of the present creation, and FIG. 5 is a schematic view showing the combination of the second embodiment of the present creation. As shown, the motor receiving chamber 4 further includes a detaching end 46 and a cover plate 47.

The detaching end 46 is formed at a selected position of the motor receiving chamber 4, and the cover plate 47 is coupled to the motor receiving chamber 4 by at least one fixing member 9b, and forms a motor accommodating space together with the motor receiving chamber 4. 40.

It can be seen from the above embodiments that the semiconductor package heat carrying device with the extended connecting channel structure provided by the present invention has industrial utilization value, so the original operation has met the requirements of the patent.

The above-mentioned embodiments are only intended to illustrate the present invention and are not intended to limit the scope of the present invention. All other equivalent modifications or substitutions that have been made without departing from the spirit of the present invention should be included in the scope of the following claims. Inside.

100‧‧‧heating device

1‧‧‧ cavity

10‧‧‧ accommodating space

11‧‧‧Supporting Shelf

12‧‧‧ heating device

121‧‧‧heating seat

122‧‧‧heat pipe

13‧‧‧Temperature sensing unit

14‧‧‧ Pressure sensing unit

15‧‧‧ Extended connecting channel junction

16‧‧‧Motor temperature sensing unit

2‧‧‧

3‧‧‧Extension of the connecting channel

30‧‧‧ accommodating space

31‧‧‧Outer Ring

32‧‧‧Cooling device

4‧‧‧Motor bearing chamber

40‧‧‧Motor housing space

41‧‧‧Drive motor

411‧‧‧ wire

412‧‧‧Bronze tube

42‧‧‧ drive shaft

43‧‧‧ turbofan

44‧‧ ‧ gate

45‧‧‧ bearing unit

46‧‧‧Disassembly end

47‧‧‧ Cover

5‧‧‧ Controller

6‧‧‧Pressure control components

61‧‧‧Intake line

62‧‧‧Pressure source

621‧‧‧Factory pipeline

622‧‧‧Air compressor

7‧‧‧Control panel

8‧‧‧Flange unit

9, 9a, 9b‧‧‧ fixed components

S1‧‧‧ temperature sensing signal

S2‧‧‧heating drive signal

S3‧‧‧ pressure sensing signal

S4‧‧‧Pressure drive signal

S5‧‧‧ motor temperature sensing signal

P1, P2‧‧‧ chamber pressure

1 is a partial exploded view showing the first embodiment of the present creation; FIG. 2 is a schematic view showing the combination of the first embodiment of the present creation; FIG. 3 is a schematic view showing the operation of the first embodiment of the present creation; A partial exploded view showing the second embodiment of the present creation; Fig. 5 is a schematic view showing the combination of the second embodiment of the present creation.

100‧‧‧heating device

1‧‧‧ cavity

10‧‧‧ accommodating space

11‧‧‧Supporting Shelf

12‧‧‧ heating device

121‧‧‧heating seat

122‧‧‧heat pipe

13‧‧‧Temperature sensing unit

14‧‧‧ Pressure sensing unit

15‧‧‧ Extended connecting channel junction

16‧‧‧Motor temperature sensing unit

2‧‧‧

3‧‧‧Extension of the connecting channel

30‧‧‧ accommodating space

31‧‧‧ outer annulus

32‧‧‧Cooling device

4‧‧‧Motor bearing chamber

40‧‧‧Motor housing space

41‧‧‧Drive motor

411‧‧‧ wire

412‧‧‧Bronze tube

42‧‧‧ drive shaft

43‧‧‧ turbofan

44‧‧ ‧ gate

45‧‧‧ bearing unit

5‧‧‧ Controller

6‧‧‧Pressure control components

61‧‧‧Intake line

62‧‧‧Pressure source

621‧‧‧Factory pipeline

622‧‧‧Air compressor

7‧‧‧Control panel

8‧‧‧Flange unit

9, 9a‧‧‧Fixed components

S1‧‧‧ temperature sensing signal

S2‧‧‧heating drive signal

S3‧‧‧ pressure sensing signal

S4‧‧‧Pressure drive signal

S5‧‧‧ motor temperature sensing signal

P1, P2‧‧‧ chamber pressure

Claims (10)

A semiconductor package heat carrying device having an extended communication channel structure has a cavity, an internal cavity is formed therein, and an extended communication channel defining end is defined, and at least one heating device is disposed in the cavity In the space, the accommodating space is heated to reach a predetermined temperature and a predetermined heating rate, and the accommodating space is further connected to a pressure source through a pressure control component to maintain the accommodating space of the cavity for a predetermined time greater than 2 atmospheres. The chamber pressure is provided with a turbo fan in the accommodating space of the cavity, and a driving motor is coupled via a driving shaft protruding from the extending end of the cavity connecting the cavity, wherein the cavity extends The connecting end portion of the connecting tunnel is coupled with an extending connecting passage having a predetermined extending length and a reduced diameter for receiving the transmission shaft, and at least one bearing unit for supporting the transmission shaft is disposed in the extending connecting passage, and then The extended communication channel is coupled to a motor receiving chamber for accommodating the driving motor, and the receiving space device of the cavity has at least one pressure sensing unit and at least a temperature sensing unit, the motor receiving chamber and the cavity maintain an equal pressure chamber pressure greater than 2 atmospheres through the extended communication channel, and a cooling device is disposed on the annular surface outside the extended communication channel The motor receiving chamber forms a temperature difference with the cavity. The semiconductor package heat carrying device having an extended communication channel structure according to claim 1, wherein the temperature of the cavity of the cavity is between 25 degrees and 1000 degrees Celsius, and the motor is mounted. The temperature of the chamber is between 25 and 500 degrees Celsius. The semiconductor package heat carrying device with an extended communication channel structure according to claim 1, wherein the housing space of the cavity has a gate to block the gas temperature of the cavity of the cavity to drive the motor The impact. The semiconductor package heat carrying device having an extended communication channel structure according to claim 1, wherein the pressure source of the pressure control component is an air compressor. The semiconductor package heat carrying device with an extended communication channel structure according to claim 1, wherein the pressure source of the pressure control component is a factory pipeline. A semiconductor package heat carrying device having an extended communication channel structure according to claim 1, wherein a copper tube is wound around the driving motor to cool the temperature of the driving motor. The semiconductor package heat carrying device having an extended communication channel structure according to claim 1, wherein the motor housing chamber is formed with a motor housing space, and the motor housing space is further provided with at least one motor temperature. The sensing unit senses the temperature of the motor housing space. An extended communication channel structure as described in claim 1 of the patent application scope The semiconductor package heat carrying device, wherein the extended communication channel is coupled to the extended communication channel junction end of the cavity by at least one flange unit and at least one fixing component. A semiconductor package heat carrying device having an extended communication channel structure as described in claim 1, wherein the motor receiving chamber is coupled to the extended communication channel by at least one fixing member. The semiconductor package heat carrying device having an extended communication channel structure according to claim 1, wherein the motor receiving chamber further comprises a detaching end and a cover plate, and the detaching end is formed in the motor receiving cavity. A selected position of the chamber is coupled to the motor receiving chamber by at least one fixing member to form a motor housing space together with the motor receiving chamber.